This document provides an overview of microelectromechanical systems (MEMS) and microsystems. It defines MEMS as engineering systems that perform electrical and mechanical functions with components measured in micrometers. Examples of MEMS products include microsensors, microactuators, and components in computer storage, printers, and miniaturized devices. The document outlines the multi-disciplinary nature of microsystems engineering and discusses some commercial applications of MEMS in automotive, aerospace, biomedical, consumer products, and telecommunications industries. Miniaturization is presented as a key enabling technology and trend for the 21st century.
Micromachined Electro-Mechanical Systems, also called microfabricated Systems, have evoked great interest in the scientific and engineering communities. This is primarily due to several substantive advantages that MEMS offer: orders of magnitude smaller size, better performance than other solutions, possibilities for batch fabrication and cost-effective integration with electronics, virtually zero dc power consumption and potentially large reduction in power consumption, etc.
This Seminar would give an introduction to these exciting developments and the technology and design approaches for the realization of these integrated systems. It would be followed with an introduction to the design of microsensors, such as the pressure sensor and the accelerometer, which began the MEMS revolution.
A systematic approach is developed to select manufacturing Process Chains for the generic elements of a MEMS device. A database of MEMS Process Chains and their attendant process attributes is developed from the existing literature, and used to construct Process Attribute charts. The performance requirements of MEMS beams and trenches are translated into the same set of Process Attributes. This allows for a screening of the Process Chains to obtain a list of candidate manufacturing methods.
I begin with a quick introduction to MEMS technology, micron scale and show that silicon is eminently suited for micromechanical devices and therefore the possibility of integrating MEMS with VLSI electronics. Smart cell phones and wireless enabled devices are poised to become commercial engines for the next generation of MEMS, since MEMS provide not only better functionality with smaller chip area, but also alternative transceiver architectures for improved functionality, performance and reliability.
The application domains cover microsensors and actuators for physical quantities, of which MEMS for automobile & consumer electronics forms a large segment; microfabricated subsystems for communications and computer systems.
Micro-Electro-Mechanical Systems, or MEMS, is a technology that in its most general form can be defined as miniaturized mechanical and electro-mechanical elements (i.e., devices and structures) that are made using the techniques of microfabrication. The critical physical dimensions of MEMS devices can vary from well below one micron on the lower end of the dimensional spectrum, all the way to several millimeters. Likewise, the types of MEMS devices can vary from relatively simple structures having no moving elements, to extremely complex electromechanical systems with multiple moving elements under the control of integrated microelectronics. The one main criterion of MEMS is that there are at least some elements having some sort of mechanical functionality whether or not these elements can move. The term used to define MEMS varies in different parts of the world. In the United States they are predominantly called MEMS, while in some other parts of the world they are called “Microsystems Technology” or “micromachined devices”.
Micro-electro-mechanical systems (MEMS) have been identified as one of the most promising technologies and will continue to revolutionize the industry as well as the industrial and consumer products by combining silicon-based microelectronics with micro-machining technology. All the spheres of industrial application including robots conception and development will be impacted by this new technology. If semiconductor microfabrication was contemplated to be the first micro-manufacturing revolution, MEMS is the second revolution. The paper reflects the results of a study about the state of the art of this technology and its future influence in the development of the construction industry. The interdisciplinary nature of MEMS utilizes design, engineering and manufacturing expertise from a wide and diverse range of technical areas including integrated circuit fabrication technology, mechanical engineering, materials science, electrical engineering, chemistry and chemical engineering, as well as fluid engineering, optics, instrumentation and packaging.
Micromachined Electro-Mechanical Systems, also called microfabricated Systems, have evoked great interest in the scientific and engineering communities. This is primarily due to several substantive advantages that MEMS offer: orders of magnitude smaller size, better performance than other solutions, possibilities for batch fabrication and cost-effective integration with electronics, virtually zero dc power consumption and potentially large reduction in power consumption, etc.
This Seminar would give an introduction to these exciting developments and the technology and design approaches for the realization of these integrated systems. It would be followed with an introduction to the design of microsensors, such as the pressure sensor and the accelerometer, which began the MEMS revolution.
A systematic approach is developed to select manufacturing Process Chains for the generic elements of a MEMS device. A database of MEMS Process Chains and their attendant process attributes is developed from the existing literature, and used to construct Process Attribute charts. The performance requirements of MEMS beams and trenches are translated into the same set of Process Attributes. This allows for a screening of the Process Chains to obtain a list of candidate manufacturing methods.
I begin with a quick introduction to MEMS technology, micron scale and show that silicon is eminently suited for micromechanical devices and therefore the possibility of integrating MEMS with VLSI electronics. Smart cell phones and wireless enabled devices are poised to become commercial engines for the next generation of MEMS, since MEMS provide not only better functionality with smaller chip area, but also alternative transceiver architectures for improved functionality, performance and reliability.
The application domains cover microsensors and actuators for physical quantities, of which MEMS for automobile & consumer electronics forms a large segment; microfabricated subsystems for communications and computer systems.
Micro-Electro-Mechanical Systems, or MEMS, is a technology that in its most general form can be defined as miniaturized mechanical and electro-mechanical elements (i.e., devices and structures) that are made using the techniques of microfabrication. The critical physical dimensions of MEMS devices can vary from well below one micron on the lower end of the dimensional spectrum, all the way to several millimeters. Likewise, the types of MEMS devices can vary from relatively simple structures having no moving elements, to extremely complex electromechanical systems with multiple moving elements under the control of integrated microelectronics. The one main criterion of MEMS is that there are at least some elements having some sort of mechanical functionality whether or not these elements can move. The term used to define MEMS varies in different parts of the world. In the United States they are predominantly called MEMS, while in some other parts of the world they are called “Microsystems Technology” or “micromachined devices”.
Micro-electro-mechanical systems (MEMS) have been identified as one of the most promising technologies and will continue to revolutionize the industry as well as the industrial and consumer products by combining silicon-based microelectronics with micro-machining technology. All the spheres of industrial application including robots conception and development will be impacted by this new technology. If semiconductor microfabrication was contemplated to be the first micro-manufacturing revolution, MEMS is the second revolution. The paper reflects the results of a study about the state of the art of this technology and its future influence in the development of the construction industry. The interdisciplinary nature of MEMS utilizes design, engineering and manufacturing expertise from a wide and diverse range of technical areas including integrated circuit fabrication technology, mechanical engineering, materials science, electrical engineering, chemistry and chemical engineering, as well as fluid engineering, optics, instrumentation and packaging.
Micromachining technologies for future productsvivatechijri
: Miniaturization is proceeding in various types of industrial products. Micromachining is the
foundation of the technology to realize such miniaturized products. A review of the literature, mostly of last
10years, that is enhancing our understanding of the mechanics of the rapidly growing field of micromachining
has been provided. The paper focuses only on methods of micromachining process along with applications of
major methods of micromachining.this paper gives you idea of current scenario of micromachining market of
world along with its benefits and challenges
This article discusses MEMS, i.e. Micro-Electro Mechanical Systems.
It gives a rudimentry idea of MEMS technology, its block diagram, applications, advantages and disadvantages. It also gives a brief idea on the working principle of MEMS devices.
Micro-Electro-Mechanical Systems, or MEMS, is a technology that in its most general form can be defined as miniaturized mechanical and electro-mechanical elements (i.e., devices and structures) that are made using the techniques of microfabrication. The critical physical dimensions of MEMS devices can vary from well below one micron on the lower end of the dimensional spectrum, all the way to several millimeters. Likewise, the types of MEMS devices can vary from relatively simple structures having no moving elements, to extremely complex electromechanical systems with multiple moving elements under the control of integrated microelectronics. The one main criterion of MEMS is that there are at least some elements having some sort of mechanical functionality whether or not these elements can move. In other words Microsystems are miniaturized integrated systems in a small package or more specifically, micro-sized components working together as a system and assembled into a package that fits on a pinhead. In the United States, these devices are referred to as microelectromechanical systems or MEMS. European countries referred to such devices as microsystems or MST. These two terms – MEMS and MST – are often used interchangeably. Microsystems are microscopic, integrated, self-aware, stand-alone products that can sense, think, communicate and act. Some systems can do all of these things, plus scavenge for power.
These are the slides I made for the Micro Systems and Nano technology course that I gave for Mikro centrum for some years, a little old but not outdated i think. Already the current converge of hardware technology, software technology and biology becomes visible.
Micromachining technologies for future productsvivatechijri
: Miniaturization is proceeding in various types of industrial products. Micromachining is the
foundation of the technology to realize such miniaturized products. A review of the literature, mostly of last
10years, that is enhancing our understanding of the mechanics of the rapidly growing field of micromachining
has been provided. The paper focuses only on methods of micromachining process along with applications of
major methods of micromachining.this paper gives you idea of current scenario of micromachining market of
world along with its benefits and challenges
This article discusses MEMS, i.e. Micro-Electro Mechanical Systems.
It gives a rudimentry idea of MEMS technology, its block diagram, applications, advantages and disadvantages. It also gives a brief idea on the working principle of MEMS devices.
Micro-Electro-Mechanical Systems, or MEMS, is a technology that in its most general form can be defined as miniaturized mechanical and electro-mechanical elements (i.e., devices and structures) that are made using the techniques of microfabrication. The critical physical dimensions of MEMS devices can vary from well below one micron on the lower end of the dimensional spectrum, all the way to several millimeters. Likewise, the types of MEMS devices can vary from relatively simple structures having no moving elements, to extremely complex electromechanical systems with multiple moving elements under the control of integrated microelectronics. The one main criterion of MEMS is that there are at least some elements having some sort of mechanical functionality whether or not these elements can move. In other words Microsystems are miniaturized integrated systems in a small package or more specifically, micro-sized components working together as a system and assembled into a package that fits on a pinhead. In the United States, these devices are referred to as microelectromechanical systems or MEMS. European countries referred to such devices as microsystems or MST. These two terms – MEMS and MST – are often used interchangeably. Microsystems are microscopic, integrated, self-aware, stand-alone products that can sense, think, communicate and act. Some systems can do all of these things, plus scavenge for power.
These are the slides I made for the Micro Systems and Nano technology course that I gave for Mikro centrum for some years, a little old but not outdated i think. Already the current converge of hardware technology, software technology and biology becomes visible.
V A Kamble5.coping of stres5.coping of stres5.coping of stress5.coping of str...VijayKamble86
5.coping of stress5.coping of stress5.coping of stress5.coping of stress5.coping of stress5.coping of stress5.coping of stress5.coping of stress5.coping of stress5.coping of stress
Va kamble
stress introduction by Dr V A Kamblestress introduction by Dr V A Kamblestres...VijayKamble86
stress introduction by Dr V A Kamblestress introduction by Dr V A Kamblestress introduction by Dr V A Kamblestress introduction by Dr V A Kamblestress introduction by Dr V A Kamblestress introduction by Dr V A Kamble
lecture slides for the topic "Definition and Importance of Entrepreneurship."
Slide 1: Title Slide
Slide title: Definition and Importance of Entrepreneurship
Your name and designation
Date
Slide 2: Introduction
Definition of Entrepreneurship: Entrepreneurship is the process of identifying opportunities, taking risks, and creating new ventures or innovations to deliver value in the marketplace.
Importance of Entrepreneurship: Entrepreneurs play a vital role in economic development, job creation, and driving innovation in various industries, including mechanical engineering.
Slide 3: Characteristics of Entrepreneurs
Creativity and Innovation: Entrepreneurs come up with new ideas and solutions to address existing problems or needs.
Risk-taking: They are willing to take calculated risks to pursue their ventures.
Vision and Passion: Entrepreneurs have a clear vision for their business and are passionate about their ideas.
Persistence: They exhibit determination and perseverance in the face of challenges.
Slide 4: Role of Entrepreneurship in Mechanical Engineering
Application of Innovation: Entrepreneurs in mechanical engineering drive technological advancements through innovative product and process development.
Job Creation: Startups and new ventures create job opportunities for skilled professionals in the engineering field.
Industry Growth: Entrepreneurial ventures contribute to the overall growth and competitiveness of the mechanical engineering industry.
Slide 5: Entrepreneurship vs. Employment
Entrepreneurship: Owning and running a business, taking risks, and enjoying potential rewards of success.
Employment: Working for someone else's business, providing specialized skills, and receiving a fixed salary or wage.
Slide 6: Benefits of Entrepreneurship
Financial Independence: Entrepreneurs have the potential to generate substantial wealth and financial freedom.
Flexibility: They can set their own schedules and make decisions independently.
Impact and Legacy: Successful entrepreneurs leave a lasting impact on society through their innovations and contributions.
Slide 7: Contribution to Society
Social Impact: Entrepreneurs can address societal challenges by developing sustainable and socially responsible solutions.
Technological Advancements: Entrepreneurial ventures drive advancements that improve the quality of life and enhance industry practices.
Slide 8: Examples of Successful Engineering Entrepreneurs
Highlight notable entrepreneurs in the mechanical engineering domain who have achieved significant success and made a positive impact.
Slide 9: Case Study
Present a case study of a successful mechanical engineering startup, discussing their journey, challenges, and achievements.
Slide 10: Summary
Recap the key points covered in the lecture, emphasizing the importance of entrepreneurship in mechanical engineering.
Slide 11: Q&A
Encourage students to ask questions or seek clarification on the topic.
Slide 12: References
List the sources
Sachpazis:Terzaghi Bearing Capacity Estimation in simple terms with Calculati...Dr.Costas Sachpazis
Terzaghi's soil bearing capacity theory, developed by Karl Terzaghi, is a fundamental principle in geotechnical engineering used to determine the bearing capacity of shallow foundations. This theory provides a method to calculate the ultimate bearing capacity of soil, which is the maximum load per unit area that the soil can support without undergoing shear failure. The Calculation HTML Code included.
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Overview of the fundamental roles in Hydropower generation and the components involved in wider Electrical Engineering.
This paper presents the design and construction of hydroelectric dams from the hydrologist’s survey of the valley before construction, all aspects and involved disciplines, fluid dynamics, structural engineering, generation and mains frequency regulation to the very transmission of power through the network in the United Kingdom.
Author: Robbie Edward Sayers
Collaborators and co editors: Charlie Sims and Connor Healey.
(C) 2024 Robbie E. Sayers
Immunizing Image Classifiers Against Localized Adversary Attacksgerogepatton
This paper addresses the vulnerability of deep learning models, particularly convolutional neural networks
(CNN)s, to adversarial attacks and presents a proactive training technique designed to counter them. We
introduce a novel volumization algorithm, which transforms 2D images into 3D volumetric representations.
When combined with 3D convolution and deep curriculum learning optimization (CLO), itsignificantly improves
the immunity of models against localized universal attacks by up to 40%. We evaluate our proposed approach
using contemporary CNN architectures and the modified Canadian Institute for Advanced Research (CIFAR-10
and CIFAR-100) and ImageNet Large Scale Visual Recognition Challenge (ILSVRC12) datasets, showcasing
accuracy improvements over previous techniques. The results indicate that the combination of the volumetric
input and curriculum learning holds significant promise for mitigating adversarial attacks without necessitating
adversary training.
Explore the innovative world of trenchless pipe repair with our comprehensive guide, "The Benefits and Techniques of Trenchless Pipe Repair." This document delves into the modern methods of repairing underground pipes without the need for extensive excavation, highlighting the numerous advantages and the latest techniques used in the industry.
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Ideal for homeowners, contractors, engineers, and anyone interested in modern plumbing solutions, this guide provides valuable insights into why trenchless pipe repair is becoming the preferred choice for pipe rehabilitation. Stay informed about the latest advancements and best practices in the field.
Fundamentals of Electric Drives and its applications.pptx
ME189_Chapter 1.pdf
1. Lectures on
MEMS and MICROSYSTEMS DESIGN
AND MANUFACTURE
Tai-Ran Hsu, ASME Fellow, Professor
Microsystems Design and Packaging Laboratory
Department of Mechanical and Aerospace Engineering
San Jose State University
San Jose, California, USA
E-mail: Tai-Ran.Hsu@sjsu.edu
2. CONTENT
Chapter 1 Overview of MEMS and Microsystems
Chapter 2 Working Principles of Microsystems
Chapter 3 Engineering Science for Microsystems Design and Fabrications
Chapter 4 Engineering Mechanics for Microsystems Design
Chapter 5 Thermofluid Engineering and Microsystems Design
Chapter 6 Scaling Laws in Miniaturization
Chapter 7 Materials for MEMS and Microsystems
Textbook: “MEMS and Microsystems: design , manufacture, and nanoscale engineering,”
2nd Edition, by Tai-Ran Hsu, John Wiley & Sons, Inc., Hoboken, New Jersey, 2008
(ISBN 978-0-470-08301-7)
3. Chapter 8 Microsystems Fabrication Processes
Chapter 9 Overview of Micromanufacturing
Chapter 10 Microsystems Design
Chapter 11 Assembly, Packaging, and Testing of Microsystems
Chapter 12 Introduction to Nanoscale Engineering
CONTENT –Cont’d
5. WHAT IS MEMS?
MEMS = MicroElectroMechanical System
Any engineering system that performs electrical and mechanical functions
with components in micrometers is a MEMS. (1 µm = 1/10 of human hair)
Available MEMS products include:
● Micro sensors (acoustic wave, biomedical, chemical, inertia, optical,
pressure, radiation, thermal, etc.)
● Micro actuators (valves, pumps and microfluidics;
electrical and optical relays and switches;
grippers, tweezers and tongs;
linear and rotary motors, etc.)
● Read/write heads in computer storage systems.
● Inkjet printer heads.
● Micro device components (e.g., palm-top reconnaissance aircrafts, mini
robots and toys, micro surgical and mobile telecom equipment, etc.)
6. HOW SMALL ARE MEMS DEVICES?
in plain English please!
They can be of the size of a rice grain, or smaller!
Two examples:
- Inertia sensors for air bag deployment systems
in automobiles
- Microcars
7. Inertia Sensor for Automobile “Air Bag” Deployment System
Micro inertia sensor (accelerometer) in place:
(Courtesy of Analog Devices, Inc)
Sensor-on-a-chip:
(the size of a
rice grain)
8. Micro Cars
(Courtesy of Denso Research Laboratories, Denso Corporation, Aichi, Japan)
Rice grains
9. MEMS = a pioneer technology for
Miniaturization –
A leading technology for the 21st Century, and
an inevitable trend in industrial products and
systems development
10. Miniaturization of Digital Computers
- A remarkable case of miniaturization!
The ENIAC Computer in 1946
A “Lap-top” Computer in 1996
A “Palm-top” Computer in 2001
Size: 106 down
Power: 106 up
Size: 108 down
Power: 108 up
This spectacular miniaturization took place in 50 years!!
11. MINIATURIAZATION – The Principal Driving Force
for the 21st Century Industrial Technology
There has been increasing strong market demand for:
“Intelligent,”
“Robust,”
“Multi-functional,” and
“Low-cost” industrial products.
Miniaturization is the only viable solution to satisfy such
market demand
12. Market Demand for Intelligent, Robusting, Smaller,
Multi-Functional Products - the evolution of cellular phones
Mobil phones 10 Years Ago:
Current State-of-the Art:
Transceive voice only
Transceive voice+ multi-media +
others (Video-camera, e-mails, calendar,
and access to Internet, GPS and a PC with
key pad input)
Size reduction
Palm-top Wireless PC
The only solution is to pack many miniature function components into the device
13. Miniaturization Makes Engineering Sense!!!
• Small systems tend to move or stop more quickly due to low mechanical inertia.
It is thus ideal for precision movements and for rapid actuation.
• Miniaturized systems encounter less thermal distortion and mechanical vibration
due to low mass.
• Miniaturized devices are particularly suited for biomedical and aerospace
applications due to their minute sizes and weight.
• Small systems have higher dimensional stability at high temperature due to
low thermal expansion.
• Smaller size of the systems means less space requirements.
This allows the packaging of more functional components in a single device.
• Less material requirements mean low cost of production and transportation.
• Ready mass production in batches.
14. Enabling Technologies for Miniaturization
Miniature devices
(1 nm - 1 mm)
** 1 nm = 10-9 m ≈ span of 10 H2 atoms
Microsystems Technology
(MST)
(1 µm - 1 mm)* Initiated in 1947 with the invention of
transistors, but the term “Micromachining”
was coined in 1982
* 1 µm = 10-6 m ≈ one-tenth of human hair
Nanotechnology (NT)
(0.1 nm – 0. 1 µm)**
Inspired by Richard Feynman in 1959, with active
R&D began in around 1995
There is a long way to building nano devices!
A top-down approach
A bottom-up approach
15. The Lucrative Revenue Prospects for
Miniaturized Industrial Products
Microsystems technology:
$43 billion - $132 billion* by Year 2005
( *High revenue projection is based on different definitions
used for MST products)
Source: NEXUS http://www.smalltimes.com/document_display.cfm?document_id=3424
16. Nanotechnology:
$50 million in Year 2001
$26.5 billion in Year 2003
(if include products involving parts produced by nanotechnology)
$1 trillion by Year 2015 (US National Science Foundation)
An enormous opportunity for manufacturing industry!!
● There has been colossal amount of research funding to NT by
governments of industrialized countries around the world b/c
of this enormous potential.
The Lucrative Revenue Prospects for
Miniaturized Industrial Products – Cont’d
22. Inertia Sensor for “Air Bag” Deployment System
(Courtesy of Analog Devices, Inc.)
23. Inertia Sensor for Automobile “Air Bag” Deployment System
Micro inertia sensor (accelerometer) in place:
(Courtesy of Analog Devices, Inc)
Sensor-on-a-chip:
(the size of a
rice grain)
Collision
24. Unique Features of MEMS and Microsystems
- A great challenge to engineers
• Components are in micrometers with complex geometry
using silicon, si-compounds and polymers:
25 µm
25 µm
A micro gear-train by
Sandia National Laboratories
25. Capillary Electrophoresis (CE) Network Systems for Biomedic Analysis
A simple capillary tubular network with cross-sectional area of 20x30 µm is illustrated below:
Analyte
Reservoir,A
Analyte Waste
Reservoir,A’
Buffer
Reservoir,B
Waste
Reservoir,B’
Injection Channel
Separation
Channel
Silicon Substrate
“Plug”
Work on the principle of driving capillary fluid flow by applying electric voltages at the
terminals at the reservoirs.
26. Commercial MEMS and Microsystems Products
Micro Sensors:
Acoustic wave sensors
Biomedical and biosensors
Chemical sensors
Optical sensors
Pressure sensors
Stress sensors
Thermal sensors
Micro Actuators:
Grippers, tweezers and tongs
Motors - linear and rotary
Relays and switches
Valves and pumps
Optical equipment (switches, lenses &
mirrors, shutters, phase modulators,
filters, waveguide splitters, latching &
fiber alignment mechanisms)
Microsystems = sensors + actuators
+ signal transduction:
• Microfluidics, e.g. Capillary Electrophoresis (CE)
• Microaccelerometers (inertia sensors)
28. Evolution of Microfabrication
● There is no machine tool with today’s technology can produce any device or MEMS
component of the size in the micrometer scale (or in mm sizes).
● The complex geometry of these minute MEMS components can only be produced
by various physical-chemical processes – the microfabrication techniques originally
developed for producing integrated circuit (IC) components.
29. Significant technological development towards miniaturization was
initiated with the invention of transistors by three Nobel Laureates, W.
Schockley, J. Bardeen and W.H. Brattain of Bell Laboratories in 1947.
This crucial invention led to the development of the concept of
integrated circuits (IC) in 1955, and the production of the first IC three
years later by Jack Kilby of Texas Instruments.
ICs have made possible for miniaturization of many devices and
engineering systems in the last 50 years.
The invention of transistors is thus regarded as the beginning of
the 3rd Industrial Revolution in human civilization.
30. Comparison of Microelectronics and Microsystems
Microelectronics Microsystems(silicon based)
Primarily2-dimensional structures Complex 3-dimensional structure
Stationarystructures Mayinvolve moving components
Transmit electricityfor specific electrical functions Performa great varietyof specific biological, chemical,
electromechanical and optical functions
ICdie is protected fromcontactingmedia Delicate components are interfaced with working media
Use single crystal silicondies, silicon compounds,
ceramics and plastic materials
Use single crystal silicondies and fewother materials,
e.g. GaAs, quartz, polymers, ceramics and metals
Fewer components tobe assembled Manymore components to be assembled
Mature ICdesign methodologies Lack of engineeringdesign methodologyand standards
Complex patterns with high densityof electrical
circuitryover substrates
Simpler patterns over substrates with simpler electrical
circuitry
Large number of electrical feed-through and leads Fewer electrical feed-through and leads
Industrial standards available No industrial standard to follow in design, material
selections, fabrication processes and packaging
Mass production Batch production, or on customer-need basis
Fabrication techniques are proven and well
documented
Manymicrofabrication techniques areused for
production, but withno standard procedures
Manufacturingtechniques are proven and well
documented
Distinct manufacturingtechniques
Packagingtechnologyis relativelywell established Packagingtechnologyis at the infant stage
Primarilyinvolves electrical and chemical
engineering
Involves all disciplines of science and engineering
31. Natural Science:
Physics & Biochemistry
Mechanical Engineering
• Machine components design
• Precision machine design
• Mechanisms & linkages
• Thermomechanicas:
(solid & fluid mechanics, heat
transfer, fracture mechanics)
• Intelligent control
• Micro process equipment
design and manufacturing
• Packaging and assembly design
Quantum physics
Solid-state physics
Scaling laws
Electrical Engineering
• Power supply
• Electric systems for
electrohydro-
dynamics and
signal transduction
• Electric circuit
design
•Integration of MEMS
and CMOS
Materials Engineering
• Materials for substrates
& package
• Materials for signal
mapping and transduction
• Materials for fabrication
processes
Chemical Engineering
• Micro fabrication
processes
• Thin film technology
Industrial Engineering
• Process design
• Production control
• Micro assembly
Electrochemical
Processes
Material
Science
The Multi-disciplinary Nature of Microsystems Engineering
32. Commercialization of MEMS and Microsystems
Major commercial success:
Pressure sensors and inertia sensors (accelerometers) with
worldwide market of:
• Airbag inertia sensors at 2 billion units per year.
• Manifold absolute pressure sensors at 40 million units per year.
• Disposable blood pressure sensors at 20 million units per year.
Recent Market Dynamics
Old MEMS New MEMS
Pressure sensors
Accelerometers
Other MEMS
BioMEMS
IT MEMS for Telecommunication:
(OptoMEMS and RF MEMS)
33. Application of MEMS and Microsystems
in
Automotive Industry
52 million vehicles produced worldwide in 1996
There will be 65 million vehicle produced in 2005
Principal areas of application of MEMS and microsystems:
• Safety
• Engine and power train
• Comfort and convenience
• Vehicle diagnostics and health monitoring
• Telematics, e.g. GPS, etc.
36. Application of MEMS and Microsystems
in
Aerospace Industry
• Cockpit instrumentation. • Sensors and actuators for safety - e.g. seat ejection
• Wind tunnel instrumentation • Sensors for fuel efficiency and safety
• Microsattellites
• Command and control systems with MEMtronics
• Inertial guidance systems with microgyroscopes, accelerometers and fiber optic gyroscope.
• Attitude determination and control systems with micro sun and Earth sensors.
• Power systems with MEMtronic switches for active solar cell array reconfiguration, and
electric generators
• Propulsion systems with micro pressure sensors, chemical sensors for leak detection, arrays
of single-shot thrustors, continuous microthrusters and pulsed microthrousters
• Thermal control systems with micro heat pipes, radiators and thermal switches
• Communications and radar systems with very high bandwidth, low-resistance radio-frequency
switches, micromirrors and optics for laser communications, and micro variable capacitors,
inductors and oscillators.
37. Application of MEMS and Microsystems
in
Biomedical Industry
Disposable blood pressure transducers:
Lifetime 24 to 72 hours; annual production 20 million units/year, unit price $10
Catheter tip pressure sensors
Sphygmomanometers
Respirators
Lung capacity meters
Barometric correction instrumentation
Medical process monitoring
Kidney dialysis equipment
Micro bio-analytic systems: bio-chips, capillary electrophoresis, etc.
38. Application of MEMS and Microsystems
in
Consumer Products
Scuba diving watches and computers
Bicycle computers
Sensors for fitness gears
Washers with water level controls
Sport shoes with automatic cushioning control
Digital tire pressure gages
Vacuum cleaning with automatic adjustment of brush beaters
Smart toys
39. Application of MEMS and Microsystems
in the
Telecommunication Industry
• Optical switching and fiber optic couplings
• RF relays and switches
• Tunable resonators
Microlenses: Microswitches:
42. Concluding Remarks
1. Miniaturization of machines and devices is an inevitable trend
in technological development in the new century.
2. There is a clear trend that microsystems technology will be further
scaled down to the nano level.
(1 nm = 10-3 µm = 10 shoulder-to-shoulder H2 atoms).
3. Despite the fact that many microelectronics technologies can be
used to fabricate silicon-based MEMS components, microsystems
engineering requires the application of principles involving multi-
disciplines in science and engineering.
4. Team effort involving multi-discipline of science and engineering is
the key to success for any MEMS industry.
