2. Deposition
Applying a thin film on a surface ranges from nano
meters to micro meters is called deposition.
Different techniques used for deposition are as
follows
Physical Vapour Deposition
Chemical Vapour Deposition
J.Hemwani, G.P.C. Betul (M.P.) 46001
3. Physical Vapor deposition
PVD is formation of film at atomic and molecular level and
thus it is used for high melting point & low vapor pressure
materials.
Physical Vapour Deposition is a collective set of processes
used to deposit thin layers of material typically in the range of
few microns to some micrometers.few microns to some micrometers.
Physical coating (deposition) process involve, vaporization,
transportation & condensation of the material to be
deposited.
Vaporization of the material is done from a solid source
assisted by high temperature and vacuum.
J.Hemwani, G.P.C. Betul (M.P.) 46001
4. Physical Vapor deposition
Transportation of the vapour is carried out in the vacuum
towards the substrate surface. For this vacuum of different
ranges is used which depends on the mean free path required
in the system.
Condensation of the vapours is done onto the substrate to
generate thin films. The chemical composition of the deposited
film depends on the type of source material.
Some times film is obtained by multiple sources or
introducing a reactive gas during transportation of vapours, or
post deposition modifications through thermal or mechanical
processing.
Different PVD techniques utilize the same three fundamental
steps but differ in the method used to vaporize and deposit the
material.
J.Hemwani, G.P.C. Betul (M.P.) 46001
5. Physical Vapor deposition
The two most common PVD processes are thermal
evaporation and Sputtering.
The third type Ion-plating is mix of the two processes
thermal evaporation & sputtering.
In thermal evaporation Resistive heating method is
used. The deposition is performed at high temperature & low
vacuum. Vacuum decreases the content of Contamination.
Voltage & current are manually controlled.
J.Hemwani, G.P.C. Betul (M.P.) 46001
7. Physical Vapor deposition
Sputtering is a plasma assisted technique that creates a
vapour from the source through bombardment with the
accelerated gaseous ions (Plasma). The gas used is generally
Argon.
Sputtering works on the basis of momentum principle,
formed by the collision of the atoms and molecules. Plasmaformed by the collision of the atoms and molecules. Plasma
glow, ion accelerator or radio active emitting is used to
evaporate material.
J.Hemwani, G.P.C. Betul (M.P.) 46001
9. Advantages PVD
High film deposition rates can be achieved in PVD.
PVD gives high strength and Durability.
PVD provides high adhesion and Hardness.
As the film is formed in PVD, there is less substrate surface As the film is formed in PVD, there is less substrate surface
damage from the impinging atoms.
Because of the high vacuum condition PVD has excellent
quality of film.
PVD has less tendency for unintentional heating of the
substrate surface.
J.Hemwani, G.P.C. Betul (M.P.) 46001
10. Disadvantages PVD
Control of the film composition is very difficult in PVD.
Cleaning of the subtract surface is not possible.
Electron Beam evaporation in PVD may cause X-Ray
damage.
J.Hemwani, G.P.C. Betul (M.P.) 46001
11. Applications PVD
Thin decorative coatings on plastics and metals may be
done by PVD.
PVD is used to apply anti-reflection coatings of
magnesium fluoride.
PVD is applied in fabrication of electronic devices like
integrated circuits.integrated circuits.
PVD is used to coat titanium nitride on the cutting tools
and injection moulds for wear resistance.
J.Hemwani, G.P.C. Betul (M.P.) 46001
12. https://www.youtube.com/watch?v=I_RnlLafVt0
2:29 M PVD principle
https://www.youtube.com/watch?v=Cvytnxc4g6w
3:54 m PVD of small metallic parts
https://www.youtube.com/watch?v=nigB-2al0S4
5:25 m PVD of small tools
J.Hemwani, G.P.C. Betul (M.P.) 46001
https://www.youtube.com/watch?v=l7ClYSOp2ig
12:40 m PVD of metal sheets
3:54 m PVD of small metallic parts
https://www.youtube.com/watch?v=YAMM3kmx9uk
2:32 Various applications of PVD