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IGBT 
Insulated Gate Bipolar Transistor 
N.H.D.J De Silva 
ENG/13/034
Introduction 
*Lower conduction losses 
*Larger blocking voltage 
*Small turn Off time 
*Small turn on time 
- Circuit symbol - 
A three-terminal power semiconductor device primarily used as an electronic 
switch which, as it was developed, came to combine high efficiency and fast 
switching.
Basic Structure 
• Cell structure similar to power MOSFET cell. 
• P-region at collector end unique feature of IGBT compared to MOSFET. 
• Punch-through (PT) IGBT - N+ buffer layer present. 
• Non-punch-through (NPT) IGBT - N+ buffer layer absent.
Operations of 
IGBT 
1. Off State Operation 
•Vgs < Vth : No inversion layer created 
• Depletion layer is created along J2 ,which expands asVgs increases. 
• In ‘NONPUNCHTHROUGH’ no buffer layer is present so large reverse voltage 
blocking capacity. 
• In ‘PUNCHTHROUGH ’ buffer layer is present shorter drift region, which 
lower on-state losses. But reverse voltage blocking capacity will be low.
Operations of 
IGBT 
2. On State Operation 
•Vgs > Vth , Channel is shorting Body-Drain-Drift regions. 
• P+ inject holes, in to N+ region 
• Holesmoves towards body region along a random path . 
• Many holes will attracted by emitter metallization. 
• Some holes recombines with electrons.
Applications 
• Current rating of single IGBT can be up to 1200 
volts,400Amps. 
• Frequency of operation:20Khz. 
• It is useful for mediumpower applications 
•Ac and DC motor drives. 
•Solid state relays 
• High frequency signal choppers
Thank You

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Igbt for KDU students by dasith

  • 1. IGBT Insulated Gate Bipolar Transistor N.H.D.J De Silva ENG/13/034
  • 2. Introduction *Lower conduction losses *Larger blocking voltage *Small turn Off time *Small turn on time - Circuit symbol - A three-terminal power semiconductor device primarily used as an electronic switch which, as it was developed, came to combine high efficiency and fast switching.
  • 3. Basic Structure • Cell structure similar to power MOSFET cell. • P-region at collector end unique feature of IGBT compared to MOSFET. • Punch-through (PT) IGBT - N+ buffer layer present. • Non-punch-through (NPT) IGBT - N+ buffer layer absent.
  • 4. Operations of IGBT 1. Off State Operation •Vgs < Vth : No inversion layer created • Depletion layer is created along J2 ,which expands asVgs increases. • In ‘NONPUNCHTHROUGH’ no buffer layer is present so large reverse voltage blocking capacity. • In ‘PUNCHTHROUGH ’ buffer layer is present shorter drift region, which lower on-state losses. But reverse voltage blocking capacity will be low.
  • 5. Operations of IGBT 2. On State Operation •Vgs > Vth , Channel is shorting Body-Drain-Drift regions. • P+ inject holes, in to N+ region • Holesmoves towards body region along a random path . • Many holes will attracted by emitter metallization. • Some holes recombines with electrons.
  • 6. Applications • Current rating of single IGBT can be up to 1200 volts,400Amps. • Frequency of operation:20Khz. • It is useful for mediumpower applications •Ac and DC motor drives. •Solid state relays • High frequency signal choppers

Editor's Notes

  1. An IGBT is a hybrid device with qualities of both BJT and MOSFET. It has the input characteristics of a MOSFET which is high impedance and the output characteristics of a BJT which is low saturation voltage.
  2. This is a cross section of an IGBT. Some IGBTs, some manufactured without the N+ buffer layer, they are called non-punch through (NPT) IGBTs whereas those with this layer are called punch-through (PT) IGBTs.
  3. There are two main operations of an IGBT. They are off state operation and on state operation.
  4. It is simply a switch that is used in order to allow power flow in the On state and, to stop power flow when it is in the Off state. IGBT can change its properties to block or create an electrical path.
  5. It is very important to decide the correct IGBT for the correct application. IGBTs are playing a major role in semiconductor as well as electronic Industry.