Detailed analysis of HTC's smart approach to the VR experience
The Virtual Reality (VR) market has raised expectations extremely high. It is already worth several billion US dollars per year and growing rapidly, with millions of headsets due to be sold in coming years.
Three main companies lead thiHTC CMOS Image Sensor Die System Plus Consultings new market: HTC Corporation, Oculus VR, which was bought by Facebook in 2014 for $2 billion, and Sony Playstation.
They think this market has enough potential to invest billions of dollars to get ahead of their competitors. Most other major manufacturers also want good market shares, including Microsoft, Intel, Google, AMD, Samsung, Huawei, Archos and Alcatel.
Winning in this market is now HTC’s all-or-nothing strategy. The HTC Vive VR Head-Mounted Display (HMD) is aimed at saving HTC from collapse. Vive VR can be used in different sectors, including gaming, entertainment, health, automotive, retail and education. It promises a premium VR experience.
For more information please visit our website: http://www.i-micronews.com/reports.html
This document discusses blockchain technology, including what blockchain is, how it works, types of blockchain networks, applications of blockchain, advantages and disadvantages. Blockchain is a distributed digital ledger that records transactions in blocks that are linked using cryptography. It allows for transactions to be recorded and distributed without a central authority. Consensus algorithms like proof of work are used to validate transactions and add new blocks to the blockchain. Blockchain has applications in financial transactions, asset tracking, data storage and decentralized applications. Its advantages include transparency, security and cost reduction. However, it also faces challenges related to speed and implementation costs.
Implementing Blockchain applications in healthcarePistoia Alliance
Blockchain technology can revolutionise the way information is exchanged between parties by bringing an unprecedented level of security and trust to these transactions. The technology is finding its way into multiple use cases but we are yet to see full adoption and real-world business implementation in the Healthcare industry.
In this webinar we will explore the main challenges and considerations for the implementation of Blockchain technology in Healthcare use cases. This is the third webinar in our Blockchain Education series.
The document summarizes research on developing efficient convolutional neural network architectures called MobileNets that are well-suited for mobile and embedded vision applications. The key ideas are using depthwise separable convolutions to factorize standard convolutions and using a width multiplier and resolution multiplier to control model size. Experiments show MobileNets achieve higher accuracy and speed than prior mobile networks on image classification and object detection tasks while having a smaller memory footprint.
The document discusses HyperLedger Fabric, a permissioned blockchain framework. It provides an overview of key Fabric concepts including its architecture, components, transaction flow, and how it differs from other blockchain platforms like Ethereum. The summary is as follows:
[1] HyperLedger Fabric is a permissioned blockchain framework that uses channels and smart contracts called chaincode to allow for private and confidential transactions between specific network members.
[2] It has a modular architecture consisting of peers that host the ledger and chaincode, an ordering service to sequence transactions into blocks, and a certificate authority for identity management.
[3] Transactions in Fabric are validated by endorsing peers running chaincode, ordered into blocks by
Webinar: How AT&T is Using Tin Can to Enhance Compliance Training 8/27/14Rustici Software
Companies are using the Tin Can API and Watershed LRS to do things that were never possible with older e-learning standards. We'd like to share the story of AT&T with you, as an example of a company that's doing some very innovative things with Tin Can.
Hear the details of AT&T’s pilot project, and how they’re using the Tin Can API and the Watershed LRS to try new approaches to their learning program.
If you can’t make the webinar but would like to view it later, go ahead and register. We’ll send you the recording shortly after the webinar.
Presenters:
Mike Rustici, President - Rustici Software
Larla Bogle, Lead Training Manager - AT&T
James Merrill - Operations Learning Architect - AT&T
This document discusses blockchain technology, including what blockchain is, how it works, types of blockchain networks, applications of blockchain, advantages and disadvantages. Blockchain is a distributed digital ledger that records transactions in blocks that are linked using cryptography. It allows for transactions to be recorded and distributed without a central authority. Consensus algorithms like proof of work are used to validate transactions and add new blocks to the blockchain. Blockchain has applications in financial transactions, asset tracking, data storage and decentralized applications. Its advantages include transparency, security and cost reduction. However, it also faces challenges related to speed and implementation costs.
Implementing Blockchain applications in healthcarePistoia Alliance
Blockchain technology can revolutionise the way information is exchanged between parties by bringing an unprecedented level of security and trust to these transactions. The technology is finding its way into multiple use cases but we are yet to see full adoption and real-world business implementation in the Healthcare industry.
In this webinar we will explore the main challenges and considerations for the implementation of Blockchain technology in Healthcare use cases. This is the third webinar in our Blockchain Education series.
The document summarizes research on developing efficient convolutional neural network architectures called MobileNets that are well-suited for mobile and embedded vision applications. The key ideas are using depthwise separable convolutions to factorize standard convolutions and using a width multiplier and resolution multiplier to control model size. Experiments show MobileNets achieve higher accuracy and speed than prior mobile networks on image classification and object detection tasks while having a smaller memory footprint.
The document discusses HyperLedger Fabric, a permissioned blockchain framework. It provides an overview of key Fabric concepts including its architecture, components, transaction flow, and how it differs from other blockchain platforms like Ethereum. The summary is as follows:
[1] HyperLedger Fabric is a permissioned blockchain framework that uses channels and smart contracts called chaincode to allow for private and confidential transactions between specific network members.
[2] It has a modular architecture consisting of peers that host the ledger and chaincode, an ordering service to sequence transactions into blocks, and a certificate authority for identity management.
[3] Transactions in Fabric are validated by endorsing peers running chaincode, ordered into blocks by
Webinar: How AT&T is Using Tin Can to Enhance Compliance Training 8/27/14Rustici Software
Companies are using the Tin Can API and Watershed LRS to do things that were never possible with older e-learning standards. We'd like to share the story of AT&T with you, as an example of a company that's doing some very innovative things with Tin Can.
Hear the details of AT&T’s pilot project, and how they’re using the Tin Can API and the Watershed LRS to try new approaches to their learning program.
If you can’t make the webinar but would like to view it later, go ahead and register. We’ll send you the recording shortly after the webinar.
Presenters:
Mike Rustici, President - Rustici Software
Larla Bogle, Lead Training Manager - AT&T
James Merrill - Operations Learning Architect - AT&T
Automatski - RSA-2048 Cryptography Cracked using Shor's Algorithm on a Quantu...Aditya Yadav
Cracking RSA-2048 Cryptography using Shor's Algorithm on a Quantum Computer
We demonstrate live a Pure/Undiluted Implementation of Shor's Algorithm on a 100,000+ Qubit Quantum Computer Simulator by Automatski.
We have hence cracked RSA-2048 and all Existing Cryptography in The World
Blockchain Scalability - Architectures and AlgorithmsGokul Alex
My presentation on 'Blockchain Scalability - Architectures and Algorithms' for the TechAthena Digital Community Webinar.
Blockchain Scalability is one of the most significant concern for Minimum Viable Blockchain Implementation. It is one of the key aspects determining the relevance and feasibility of Blockchain Technology for a particular use case.This session will cover the fundamental aspects of distributed computing that determine the contours of scalability.
Subsequently, the session will outline the parameters and metrics related to Blockchain Scalability in detail. In this context, the session will deep dive into architectural and algorithmic techniques that enables a scalable Blockchain.Architectural techniques such as vertical scaling and horizontal scaling will be explained in detail. Design techniques such as State Channels, Sharding, SideChains, Off chain computations, Block Size and Time Optimization etc. will be explained.
In summary, this session will conclude with the implications and trade-off between Blockchain Scalability, Security, Simplicity and Interoperability. Looking forward to your views and thoughts !
This paper proposes a secured healthcare system using blockchain technology. The system uses a smart contract-based blockchain architecture with Hyperledger Fabric to increase the accuracy of electronic healthcare records in a decentralized and patient-centric manner. The paper outlines existing blockchain models in healthcare, then presents the proposed methodology and an implementation of the model using smart contracts to securely store medical records in a decentralized way. This aims to address vulnerabilities in current healthcare blockchain research and provide a direction for further improving electronic health records.
Quantum Algorithms @ work - Short introduction to Quantum Annealing and opera...Fujitsu Central Europe
This document provides an overview of quantum annealing and its applications. Quantum annealing can be used to find the optimal solution to complex optimization problems much faster than classical computers. It does this by acting on problems simultaneously rather than sequentially. The Digital Annealer, a quantum-inspired annealing machine, can currently solve certain problems faster than traditional simulated annealing on classical hardware. Potential applications discussed include logistics routing, portfolio optimization, molecular modeling, and acoustic design optimization.
This document discusses medical wearable devices and related topics. It covers the key technologies that enable medical wearables like sensors, computing, and connectivity. It also addresses regulatory considerations regarding whether a device is classified as a medical device or general wellness product based on its intended use and claims. Finally, it provides examples of medical wearables already on the market, including devices that monitor bio-data, glucose levels, and provide pain relief through electrotherapy.
RISC-V NOEL-V - A new high performance RISC-V Processor FamilyRISC-V International
This document summarizes the NOEL-V processor family from Cobham Gaisler. It describes the NOEL-V as a RISC-V compliant 64-bit processor with fault tolerance features. It provides details on the processor architecture, peripherals, software ecosystem, verification process, and commercial and open source availability. Examples of projects adopting the NOEL-V include the European H2020 funded De-RISC and SELENE projects for safety-critical computing.
CNNs are a type of deep learning algorithm used for computer vision tasks. They use convolutional and pooling layers to extract features from image data. CNNs apply multiple filters to input images to generate feature maps, which are then passed through activation functions to introduce nonlinearity. The features are then pooled and fed into fully connected layers for classification. Common CNN architectures include LeNet-5, AlexNet, VGG16, GoogLeNet, and ResNet, with more recent models featuring deeper networks and improved training techniques.
SCiO Molecular Sensor from Consumer Physics: Mobile Spectrometer Dongle - tea...Yole Developpement
The world’s first pocket-sized molecular sensor that can be integrated into consumer smartphones
For a long time, spectral analysis of materials has been limited to academic research. Everyday application of this type of analysis could bring new interactions in areas including food, fitness and medication. Starting with a crowdfunding campaign, and following the path of companies like FLIR, Consumer Physics, which was formerly Verifood Ltd., has created the first dongle molecular sensor, the SCiO Spectrometer. Thanks to big data and cloud technology, the dongle spectrometer claims to take the spectral fingerprint of any substance and quantify or identify any compound.
Consumer Physics is the first to bring spectrometry to consumers. Unlike other spectrometers, Consumer Physics produces a very simple package based on a tiny spectrometer head, with an area of 13 mm x 19 mm.
The SCiO Spectrometer integrates a 1.2 M pixel monochromatic CMOS image sensor from ON Semiconductor, a white LED from OSRAM and a bespoke filter/lens array. The LED is coupled to a reflector in the illumination module, which shines light on the analyzed substance, whose molecules absorb specific wavelengths. The received light in the spectrometer module is filtered and broken up into different wavelengths by the various lenses. Finally, the image sensor gives an instant response from the analyzed substance.
For more information please visit our website: http://www.i-micronews.com/reports.html
RF Front End modules and components for cellphones 2017 - Report by Yole Deve...Yole Developpement
A dynamic market with high responsivity to technical innovation, the RF front end industry is set to grow at 14% CAGR to reach $22.7B in 2022.
A market that will more than double in six years!
The radio-frequency (RF) front end and components market for cellphones is highly dynamic. From being worth $10.1B last year, it is expected to reach $22.7B in 2022. Such high growth is definitely something that players in other semiconductor markets would envy. However, the growth is not evenly distributed.
Filters represent the biggest business in the RF front end industry, and the value of this business will more than triple from 2016 to 2022. Most of this growth will derive from additional filtering needs from new antennas as well as the need for more filtering functionality due to multiple carrier aggregation (CA).
Power amplifiers (PAs) and low noise amplifiers (LNAs), the second biggest business, will be almost flat over the same period. High-end LTE PA market growth will be balanced by a shrinking 2G/3G market. The LNA market will grow steadily, especially thanks to the addition of new antennas.
Switches, the third biggest business, will double. This market will mainly be driven by antenna switches.
Lastly, antenna tuners, a small business today with an estimated $36M market value, will expand 7.5-fold to reach $272M in 2022. This growth is mainly due to tuning being added to both the main and the diversity antennas.
For more discussion, please visit our website: http://www.i-micronews.com/reports.html
From almost zero to a multi-billion dollar market in three years!
Apple introduced the iPhone 5s in 2013, after acquiring Authentec a year earlier. Since then, fingerprint sensors have been massively adopted, and the volumes of sensors shipped into the consumer market have grown incredibly. At first, the sensors were a convenience and protection feature for unlocking phones. However, they are now shifting into a security feature for online identification and mobile payment in an increasing number of smartphones.
From 23 million units in 2013, 689 million fingerprint sensors for smartphones were sold in 2016. This is an incredible 210% compound annual growth rate (CAGR) between 2013 and 2016! The 2016-2022 timeframe will see a more reasonable, but still impressive, 19% CAGR.
Fingerprint sensing is becoming a mandatory feature on every smartphone, adding a lot of value. However such an increase in volume is always followed by strong cost pressure, and this is what has happened over the last three years. The average cost of a fingerprint sensor has decreased from around $5 in 2013 to $3 in 2016, and even less for low-end technologies. And the pressure hasn’t gone away. Current technologies have now reached maturity, and are threatened by new technologies, which need lower cost to gain momentum. This is the case for ultrasonic detection, for instance.
For more information please visit our website: http://www.i-micronews.com/reports.html
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Imaging Technologies for Automotive 2016 Report by Yole Developpement Yole Developpement
Imaging technology, which is currently mainly cameras, is exploding into the automotive space, and is set to grow at 20% CAGR to reach $7.3B in 2021
INFOTAINMENT AND ADVANCED DRIVER ASSISTANCE SYSTEMS (ADAS) PROPEL AUTOMOTIVE IMAGING
Since 2008, when a recession acted as a wakeup call to the whole industry, the automotive market has undergone obvious structural change. Capitalizing on technologies initially developed for smartphones, electronics have invaded, and imaging technology is now taking center stage. From less than one camera per car on average in 2015, there will be more than three cameras per car by 2021, which means 371 million automotive imaging devices.
Cameras were initially mounted for ADAS purposes on high-end vehicles, with deep learning image analysis techniques promoting early adoption. The Israeli company Mobileye has been instrumental in bringing this technology to market, along with On Semiconductor, which provided the CMOS image sensor. Copycat competition will probably pick up as the market now justifies initial investment in design and technology. It is now a well-established fact that vision-based autonomous emergency braking (AEB) is possible and saves life. Adoption of forward ADAS cameras will therefore accelerate.
Growth of imaging for automotive is also being fueled by the park assist application, and 360° surround view camera volume is skyrocketing. While it’s becoming mandatory in the US to have a rearview camera, that uptake is dwarfed by 360° surround view cameras, which enable a “bird’s eye view” perspective. This trend is most beneficial to companies like Omnivision at sensor level and Panasonic and Valeo, which have become the main manufacturers of automotive cameras.
Mirror replacement cameras are currently the big unknown and take-off will primarily depend on its appeal and car design regulation. Europe and Japan are at the forefront of this trend, which should become slightly significant by 2021.
Solid state lidar is well talked about and will start to be found in high end cars by 2021. Cost reduction will be a key driver as the push for semi-autonomous driving will be felt more strongly by car manufacturers. The report will analyse the impact of lidar for automotive vision in detail.
Night vision cameras using Long Wave Infrared (LWIR) technology were initially perceived as a status symbol. However, they’re increasingly appreciated for their ability to automatically detect pedestrians and wildlife. LWIR will therefore become integrated into ADAS systems in future.
3D cameras will be limited to in-cabin infotainment and driver monitoring. This technology will be key for luxury cars and therefore is of limited use today.
If any significant semi-autonomous trend picks up, the technology will probably become mandatory, due to safety issues.
More information on that report at http://www.i-micronews.com/reports.html
Equipment and Materials for 3D TSV Applications - 2017 Report by Yole Develop...Yole Developpement
Driven today mostly by BSI CIS, the 3D TSV equipment & materials business will be supported by 3D stacked memory’s expansion
Technology and application drivers will change over the years, but TSV integration will continue growing
Currently supported mostly by 3D stacked BSI CIS, TSV integration growth will be led mainly by 3D memory applications and new products integrating TSV interconnects in the imaging segment.
Indeed, 3D stacked BSI has been the TSV market’s real driver for a couple of years now. However, with the entrance of 3D hybrid technology (which does not require any TSV interconnects), we expect a decrease of 3D stacked BSI in the TSV market by 2019.
This potential TSV decrease within BSI CIS could be hastened by the 3D single-photon avalanche diodes (SPAD) developed by STMicroelectronics. This is a new approach in time-of-flight that will benefit from 3D hybrid technology by moving the digital pixel into the secondary chip.
While Sony is the current CIS leader and the pioneer of the hybrid stacking method (which was adopted for the first time in the Samsung Galaxy S7 rear camera module), it is too early to fully describe the strategy of other key actors like TSMC/Omnivision and ON Semiconductor, and whether their path will lead to 3D stacked BSI or 3D hybrid stacked.
Another scenario could happen in the next few years and impact the TSV market in a different way. With more complex structures in the BSI CIS field being considered today, some CIS manufacturers might remain on 3D stacked BSI by combining this technology with 3D hybrid stacked for the next generation of products based on multi-stack structure. In this case, 3D hybrid stacked will not compete with 3D stacked BSI, leading to a continuous increase of 3D stacked BSI and 3D hybrid stacked.
For more information please visit our website: http://www.i-micronews.com/reports.html
The 1st generation 1200V SiC MOSFET device from STMicroelectronics has good current density at a very competitive cost
The STC30N120 is the first generation 1200V SiC MOSFET device from STMicroelectronics. The device has a planar structure and a design that allows good electrical performance, such as high current density. Moreover, the supply chain and manufacturing choices lead to a very competitive cost.
The device is suitable for high power applications like motor drives, inverters, DC-DC converters and power supplies.
The STC30N120 integrates first generation high-voltage SiC power MOSFET dies in a dedicated discrete package.
The device is assumed to operate at very high temperature, up to 200°C, and to have an on-resistance of 90mΩ, with generally standard SiC manufacturing technology.
The report goes into depth in its analysis of the packaging and the components, with images of the complex planar SiC structure.
It also includes production cost analysis and detailed comparison with Rohm and Wolfspeed’s SiC MOSFETs and with 1200V silicon IGBTs. The comparison highlights differences in the electrical parameters, supply chain and production cost.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse ...Yole Developpement
INNOVATIVE 3D CAMERA FOR FACIAL ANALYSIS AND HAND/FINGER TRACKING, BASED ON RESONANT MICRO-MIRROR, IR LASER, VISIBLE AND NEAR INFRARED IMAGE SENSORS.
Intel RealSense is an intelligent 3D camera equipped with a system of three components: a conventional camera, a near infrared image sensor and an infrared laser projector. Infrared parts are used to calculate the distance between objects, but also to separate objects on different planes. They serve for facial recognition as well as gestures tracking.
The Intel 3D camera can scan the environment from 0.2m to 1.2m. The fixed-focal length camera will support up to 1080p @30FPS capture in RGB with a 77° FOV. Its lens has a built in IR cut filter. The 640x480 pixel VGA camera has a frame rate up to 60fps with a 90° FOV, moreover its lens has an IR Band Pass filter.
More information on that report at http://www.i-micronews.com/reports.html
The ARS4-A is a 77 GHz radar sensor offering simultaneous long and short range detection
The Continental ARS4-A Radar is designed for forward collision warning, emergency brake assist, collision mitigation system or Adaptive Cruise Control (ACC). A special feature of the device is the simultaneous measurement of long distances, up to 250m with +/-0.2m accuracy, and short range, up to 70m, relative velocity and angle between two objects. It is thus able to detect stationary objects without any camera support.
The system integrates two electronic boards including an NXP Semiconductor microcontroller and Broadcom Ethernet transceiver. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.
The NXP Semiconductor multi-channel 77 GHz radar transceiver chipset, composed of four receivers, two transmitters and an associated voltage controlled oscillator (VCO), is used as high-frequency transmitter and receiver. The RF dies are packaged in redistributed chip package (RCP) fan-out wafer level packages initially developed and manufactured by Freescale.
Based on a complete teardown analysis of the Continental radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor.
A complete physical analysis and manufacturing cost estimation of the NXP semiconductor monolithic microwave integrated circuits (MMICs) is available in a separate report.
More information on that report at http://www.i-micronews.com/reports.html
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...Yole Developpement
Complete reports and comparison of the latest generation products for smartphones from the leading optical image stabilization gyro players.
2-Axis Gyroscopes for Optical Image Stabilization (OIS) constitute a market where 123 million units were shipped in 2015, according to Yole Développement. This market originates only from high-end smartphones and two players share most of it: InvenSense, with 49%, and STMicroelectronics, with 39%.
The 2-axis gyroscopes are located inside the camera module of high-end smartphones. The main constraints are a small footprint and, more importantly, thinness.
Previously, thickness was the same as standard land grid array (LGA) or quad flat no-leads (QFN) package, close to 1mm. Now the standard is 0.65mm, which products from both InvenSense and STMicroelectronics attain.
InvenSense was first, with the IDG-2030, a 2.3x2.3x0.65mm gyroscope, which is still the smallest on the market. Since its introduction we found it in several smartphones from various manufacturers. The IDG-2030 uses the same Nasiri platform as other InvenSense inertial devices, with wafer-level integration of the MEMS sensor on top of the application specific integrated circuit (ASIC), thus providing only one die in the final LGA package.
Months later, STMicroelectronics released the L2G2IS, which shares the same dimensions. The device is manufactured using the same THELMA process as all STMicroelectronics inertial devices. The THELMA platform involves a two-die approach that is challenging for very thin package integration. However, both players now offer very low-cost gyros thanks to die size reduction and process optimization.
Both gyroscopes analyzed are 2-axis X, Y (Pitch, Roll). The two reports can be purchased separately or together in order to compare the technology and pricing of the main smartphone OIS gyro players, including previous generation products.
More information on that report at http://www.i-micronews.com/reports.html
Tiny MEMS digital barometer for smartphones and wearables
The first barometric sensor from Infineon for the consumer market is targeting altitude, GPS, indoor and weather forecasting applications in portable devices. This MEMS sensor positions Infineon to compete with STMicroelectronics and Bosch Sensortec.
Infineon’s DPS310 pressure-sensing device is manufactured using a proprietary MEMS technology developed for and already sold for several years in the automotive market. The sensing element in the DPS310 is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. Moreover, Infineon has developed a capacitive sensor to be more accurate and less sensitive to temperature change compared to piezoresistive solutions.
For the DPS310, Infineon has introduced two important innovations. The first is a two-die solution more scalable than the monolithic solution used for some automotive pressure sensors.
The second innovation is a plastic metallized lid to replace the classic metal lid. The device comes in a tiny 2x2.5x0.9mm HLGA molded package.
The report presents a detailed analysis of the sensor’s structure and cost. Comparison with the characteristics of the STMicroelectronics pressure sensor LPS22HB and the Bosch Sensortec BMP280 highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Automatski - RSA-2048 Cryptography Cracked using Shor's Algorithm on a Quantu...Aditya Yadav
Cracking RSA-2048 Cryptography using Shor's Algorithm on a Quantum Computer
We demonstrate live a Pure/Undiluted Implementation of Shor's Algorithm on a 100,000+ Qubit Quantum Computer Simulator by Automatski.
We have hence cracked RSA-2048 and all Existing Cryptography in The World
Blockchain Scalability - Architectures and AlgorithmsGokul Alex
My presentation on 'Blockchain Scalability - Architectures and Algorithms' for the TechAthena Digital Community Webinar.
Blockchain Scalability is one of the most significant concern for Minimum Viable Blockchain Implementation. It is one of the key aspects determining the relevance and feasibility of Blockchain Technology for a particular use case.This session will cover the fundamental aspects of distributed computing that determine the contours of scalability.
Subsequently, the session will outline the parameters and metrics related to Blockchain Scalability in detail. In this context, the session will deep dive into architectural and algorithmic techniques that enables a scalable Blockchain.Architectural techniques such as vertical scaling and horizontal scaling will be explained in detail. Design techniques such as State Channels, Sharding, SideChains, Off chain computations, Block Size and Time Optimization etc. will be explained.
In summary, this session will conclude with the implications and trade-off between Blockchain Scalability, Security, Simplicity and Interoperability. Looking forward to your views and thoughts !
This paper proposes a secured healthcare system using blockchain technology. The system uses a smart contract-based blockchain architecture with Hyperledger Fabric to increase the accuracy of electronic healthcare records in a decentralized and patient-centric manner. The paper outlines existing blockchain models in healthcare, then presents the proposed methodology and an implementation of the model using smart contracts to securely store medical records in a decentralized way. This aims to address vulnerabilities in current healthcare blockchain research and provide a direction for further improving electronic health records.
Quantum Algorithms @ work - Short introduction to Quantum Annealing and opera...Fujitsu Central Europe
This document provides an overview of quantum annealing and its applications. Quantum annealing can be used to find the optimal solution to complex optimization problems much faster than classical computers. It does this by acting on problems simultaneously rather than sequentially. The Digital Annealer, a quantum-inspired annealing machine, can currently solve certain problems faster than traditional simulated annealing on classical hardware. Potential applications discussed include logistics routing, portfolio optimization, molecular modeling, and acoustic design optimization.
This document discusses medical wearable devices and related topics. It covers the key technologies that enable medical wearables like sensors, computing, and connectivity. It also addresses regulatory considerations regarding whether a device is classified as a medical device or general wellness product based on its intended use and claims. Finally, it provides examples of medical wearables already on the market, including devices that monitor bio-data, glucose levels, and provide pain relief through electrotherapy.
RISC-V NOEL-V - A new high performance RISC-V Processor FamilyRISC-V International
This document summarizes the NOEL-V processor family from Cobham Gaisler. It describes the NOEL-V as a RISC-V compliant 64-bit processor with fault tolerance features. It provides details on the processor architecture, peripherals, software ecosystem, verification process, and commercial and open source availability. Examples of projects adopting the NOEL-V include the European H2020 funded De-RISC and SELENE projects for safety-critical computing.
CNNs are a type of deep learning algorithm used for computer vision tasks. They use convolutional and pooling layers to extract features from image data. CNNs apply multiple filters to input images to generate feature maps, which are then passed through activation functions to introduce nonlinearity. The features are then pooled and fed into fully connected layers for classification. Common CNN architectures include LeNet-5, AlexNet, VGG16, GoogLeNet, and ResNet, with more recent models featuring deeper networks and improved training techniques.
SCiO Molecular Sensor from Consumer Physics: Mobile Spectrometer Dongle - tea...Yole Developpement
The world’s first pocket-sized molecular sensor that can be integrated into consumer smartphones
For a long time, spectral analysis of materials has been limited to academic research. Everyday application of this type of analysis could bring new interactions in areas including food, fitness and medication. Starting with a crowdfunding campaign, and following the path of companies like FLIR, Consumer Physics, which was formerly Verifood Ltd., has created the first dongle molecular sensor, the SCiO Spectrometer. Thanks to big data and cloud technology, the dongle spectrometer claims to take the spectral fingerprint of any substance and quantify or identify any compound.
Consumer Physics is the first to bring spectrometry to consumers. Unlike other spectrometers, Consumer Physics produces a very simple package based on a tiny spectrometer head, with an area of 13 mm x 19 mm.
The SCiO Spectrometer integrates a 1.2 M pixel monochromatic CMOS image sensor from ON Semiconductor, a white LED from OSRAM and a bespoke filter/lens array. The LED is coupled to a reflector in the illumination module, which shines light on the analyzed substance, whose molecules absorb specific wavelengths. The received light in the spectrometer module is filtered and broken up into different wavelengths by the various lenses. Finally, the image sensor gives an instant response from the analyzed substance.
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RF Front End modules and components for cellphones 2017 - Report by Yole Deve...Yole Developpement
A dynamic market with high responsivity to technical innovation, the RF front end industry is set to grow at 14% CAGR to reach $22.7B in 2022.
A market that will more than double in six years!
The radio-frequency (RF) front end and components market for cellphones is highly dynamic. From being worth $10.1B last year, it is expected to reach $22.7B in 2022. Such high growth is definitely something that players in other semiconductor markets would envy. However, the growth is not evenly distributed.
Filters represent the biggest business in the RF front end industry, and the value of this business will more than triple from 2016 to 2022. Most of this growth will derive from additional filtering needs from new antennas as well as the need for more filtering functionality due to multiple carrier aggregation (CA).
Power amplifiers (PAs) and low noise amplifiers (LNAs), the second biggest business, will be almost flat over the same period. High-end LTE PA market growth will be balanced by a shrinking 2G/3G market. The LNA market will grow steadily, especially thanks to the addition of new antennas.
Switches, the third biggest business, will double. This market will mainly be driven by antenna switches.
Lastly, antenna tuners, a small business today with an estimated $36M market value, will expand 7.5-fold to reach $272M in 2022. This growth is mainly due to tuning being added to both the main and the diversity antennas.
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From almost zero to a multi-billion dollar market in three years!
Apple introduced the iPhone 5s in 2013, after acquiring Authentec a year earlier. Since then, fingerprint sensors have been massively adopted, and the volumes of sensors shipped into the consumer market have grown incredibly. At first, the sensors were a convenience and protection feature for unlocking phones. However, they are now shifting into a security feature for online identification and mobile payment in an increasing number of smartphones.
From 23 million units in 2013, 689 million fingerprint sensors for smartphones were sold in 2016. This is an incredible 210% compound annual growth rate (CAGR) between 2013 and 2016! The 2016-2022 timeframe will see a more reasonable, but still impressive, 19% CAGR.
Fingerprint sensing is becoming a mandatory feature on every smartphone, adding a lot of value. However such an increase in volume is always followed by strong cost pressure, and this is what has happened over the last three years. The average cost of a fingerprint sensor has decreased from around $5 in 2013 to $3 in 2016, and even less for low-end technologies. And the pressure hasn’t gone away. Current technologies have now reached maturity, and are threatened by new technologies, which need lower cost to gain momentum. This is the case for ultrasonic detection, for instance.
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Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
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Imaging Technologies for Automotive 2016 Report by Yole Developpement Yole Developpement
Imaging technology, which is currently mainly cameras, is exploding into the automotive space, and is set to grow at 20% CAGR to reach $7.3B in 2021
INFOTAINMENT AND ADVANCED DRIVER ASSISTANCE SYSTEMS (ADAS) PROPEL AUTOMOTIVE IMAGING
Since 2008, when a recession acted as a wakeup call to the whole industry, the automotive market has undergone obvious structural change. Capitalizing on technologies initially developed for smartphones, electronics have invaded, and imaging technology is now taking center stage. From less than one camera per car on average in 2015, there will be more than three cameras per car by 2021, which means 371 million automotive imaging devices.
Cameras were initially mounted for ADAS purposes on high-end vehicles, with deep learning image analysis techniques promoting early adoption. The Israeli company Mobileye has been instrumental in bringing this technology to market, along with On Semiconductor, which provided the CMOS image sensor. Copycat competition will probably pick up as the market now justifies initial investment in design and technology. It is now a well-established fact that vision-based autonomous emergency braking (AEB) is possible and saves life. Adoption of forward ADAS cameras will therefore accelerate.
Growth of imaging for automotive is also being fueled by the park assist application, and 360° surround view camera volume is skyrocketing. While it’s becoming mandatory in the US to have a rearview camera, that uptake is dwarfed by 360° surround view cameras, which enable a “bird’s eye view” perspective. This trend is most beneficial to companies like Omnivision at sensor level and Panasonic and Valeo, which have become the main manufacturers of automotive cameras.
Mirror replacement cameras are currently the big unknown and take-off will primarily depend on its appeal and car design regulation. Europe and Japan are at the forefront of this trend, which should become slightly significant by 2021.
Solid state lidar is well talked about and will start to be found in high end cars by 2021. Cost reduction will be a key driver as the push for semi-autonomous driving will be felt more strongly by car manufacturers. The report will analyse the impact of lidar for automotive vision in detail.
Night vision cameras using Long Wave Infrared (LWIR) technology were initially perceived as a status symbol. However, they’re increasingly appreciated for their ability to automatically detect pedestrians and wildlife. LWIR will therefore become integrated into ADAS systems in future.
3D cameras will be limited to in-cabin infotainment and driver monitoring. This technology will be key for luxury cars and therefore is of limited use today.
If any significant semi-autonomous trend picks up, the technology will probably become mandatory, due to safety issues.
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Equipment and Materials for 3D TSV Applications - 2017 Report by Yole Develop...Yole Developpement
Driven today mostly by BSI CIS, the 3D TSV equipment & materials business will be supported by 3D stacked memory’s expansion
Technology and application drivers will change over the years, but TSV integration will continue growing
Currently supported mostly by 3D stacked BSI CIS, TSV integration growth will be led mainly by 3D memory applications and new products integrating TSV interconnects in the imaging segment.
Indeed, 3D stacked BSI has been the TSV market’s real driver for a couple of years now. However, with the entrance of 3D hybrid technology (which does not require any TSV interconnects), we expect a decrease of 3D stacked BSI in the TSV market by 2019.
This potential TSV decrease within BSI CIS could be hastened by the 3D single-photon avalanche diodes (SPAD) developed by STMicroelectronics. This is a new approach in time-of-flight that will benefit from 3D hybrid technology by moving the digital pixel into the secondary chip.
While Sony is the current CIS leader and the pioneer of the hybrid stacking method (which was adopted for the first time in the Samsung Galaxy S7 rear camera module), it is too early to fully describe the strategy of other key actors like TSMC/Omnivision and ON Semiconductor, and whether their path will lead to 3D stacked BSI or 3D hybrid stacked.
Another scenario could happen in the next few years and impact the TSV market in a different way. With more complex structures in the BSI CIS field being considered today, some CIS manufacturers might remain on 3D stacked BSI by combining this technology with 3D hybrid stacked for the next generation of products based on multi-stack structure. In this case, 3D hybrid stacked will not compete with 3D stacked BSI, leading to a continuous increase of 3D stacked BSI and 3D hybrid stacked.
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The 1st generation 1200V SiC MOSFET device from STMicroelectronics has good current density at a very competitive cost
The STC30N120 is the first generation 1200V SiC MOSFET device from STMicroelectronics. The device has a planar structure and a design that allows good electrical performance, such as high current density. Moreover, the supply chain and manufacturing choices lead to a very competitive cost.
The device is suitable for high power applications like motor drives, inverters, DC-DC converters and power supplies.
The STC30N120 integrates first generation high-voltage SiC power MOSFET dies in a dedicated discrete package.
The device is assumed to operate at very high temperature, up to 200°C, and to have an on-resistance of 90mΩ, with generally standard SiC manufacturing technology.
The report goes into depth in its analysis of the packaging and the components, with images of the complex planar SiC structure.
It also includes production cost analysis and detailed comparison with Rohm and Wolfspeed’s SiC MOSFETs and with 1200V silicon IGBTs. The comparison highlights differences in the electrical parameters, supply chain and production cost.
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Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse ...Yole Developpement
INNOVATIVE 3D CAMERA FOR FACIAL ANALYSIS AND HAND/FINGER TRACKING, BASED ON RESONANT MICRO-MIRROR, IR LASER, VISIBLE AND NEAR INFRARED IMAGE SENSORS.
Intel RealSense is an intelligent 3D camera equipped with a system of three components: a conventional camera, a near infrared image sensor and an infrared laser projector. Infrared parts are used to calculate the distance between objects, but also to separate objects on different planes. They serve for facial recognition as well as gestures tracking.
The Intel 3D camera can scan the environment from 0.2m to 1.2m. The fixed-focal length camera will support up to 1080p @30FPS capture in RGB with a 77° FOV. Its lens has a built in IR cut filter. The 640x480 pixel VGA camera has a frame rate up to 60fps with a 90° FOV, moreover its lens has an IR Band Pass filter.
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The ARS4-A is a 77 GHz radar sensor offering simultaneous long and short range detection
The Continental ARS4-A Radar is designed for forward collision warning, emergency brake assist, collision mitigation system or Adaptive Cruise Control (ACC). A special feature of the device is the simultaneous measurement of long distances, up to 250m with +/-0.2m accuracy, and short range, up to 70m, relative velocity and angle between two objects. It is thus able to detect stationary objects without any camera support.
The system integrates two electronic boards including an NXP Semiconductor microcontroller and Broadcom Ethernet transceiver. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.
The NXP Semiconductor multi-channel 77 GHz radar transceiver chipset, composed of four receivers, two transmitters and an associated voltage controlled oscillator (VCO), is used as high-frequency transmitter and receiver. The RF dies are packaged in redistributed chip package (RCP) fan-out wafer level packages initially developed and manufactured by Freescale.
Based on a complete teardown analysis of the Continental radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor.
A complete physical analysis and manufacturing cost estimation of the NXP semiconductor monolithic microwave integrated circuits (MMICs) is available in a separate report.
More information on that report at http://www.i-micronews.com/reports.html
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...Yole Developpement
Complete reports and comparison of the latest generation products for smartphones from the leading optical image stabilization gyro players.
2-Axis Gyroscopes for Optical Image Stabilization (OIS) constitute a market where 123 million units were shipped in 2015, according to Yole Développement. This market originates only from high-end smartphones and two players share most of it: InvenSense, with 49%, and STMicroelectronics, with 39%.
The 2-axis gyroscopes are located inside the camera module of high-end smartphones. The main constraints are a small footprint and, more importantly, thinness.
Previously, thickness was the same as standard land grid array (LGA) or quad flat no-leads (QFN) package, close to 1mm. Now the standard is 0.65mm, which products from both InvenSense and STMicroelectronics attain.
InvenSense was first, with the IDG-2030, a 2.3x2.3x0.65mm gyroscope, which is still the smallest on the market. Since its introduction we found it in several smartphones from various manufacturers. The IDG-2030 uses the same Nasiri platform as other InvenSense inertial devices, with wafer-level integration of the MEMS sensor on top of the application specific integrated circuit (ASIC), thus providing only one die in the final LGA package.
Months later, STMicroelectronics released the L2G2IS, which shares the same dimensions. The device is manufactured using the same THELMA process as all STMicroelectronics inertial devices. The THELMA platform involves a two-die approach that is challenging for very thin package integration. However, both players now offer very low-cost gyros thanks to die size reduction and process optimization.
Both gyroscopes analyzed are 2-axis X, Y (Pitch, Roll). The two reports can be purchased separately or together in order to compare the technology and pricing of the main smartphone OIS gyro players, including previous generation products.
More information on that report at http://www.i-micronews.com/reports.html
Tiny MEMS digital barometer for smartphones and wearables
The first barometric sensor from Infineon for the consumer market is targeting altitude, GPS, indoor and weather forecasting applications in portable devices. This MEMS sensor positions Infineon to compete with STMicroelectronics and Bosch Sensortec.
Infineon’s DPS310 pressure-sensing device is manufactured using a proprietary MEMS technology developed for and already sold for several years in the automotive market. The sensing element in the DPS310 is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. Moreover, Infineon has developed a capacitive sensor to be more accurate and less sensitive to temperature change compared to piezoresistive solutions.
For the DPS310, Infineon has introduced two important innovations. The first is a two-die solution more scalable than the monolithic solution used for some automotive pressure sensors.
The second innovation is a plastic metallized lid to replace the classic metal lid. The device comes in a tiny 2x2.5x0.9mm HLGA molded package.
The report presents a detailed analysis of the sensor’s structure and cost. Comparison with the characteristics of the STMicroelectronics pressure sensor LPS22HB and the Bosch Sensortec BMP280 highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Sensors for Biometry and Recognition - 2016 Report by Yole DeveloppementYole Developpement
In a global biometric hardware market worth over $4B, traditional fingerprint/palm sensors still monopolize 95% of the market, but face and iris sensors lie in wait.
Fingerprint technology impressively dominates the market - but changes are expected
Due to historical reasons, like the criminal fingerprint database established by the FBI with ink-based techniques, fingerprint sensing is the most common biometric technology currently used, by far. We estimate that the annual revenues generated by fingerprint-based solutions are currently $4.25B, representing 95% of the hardware market. Fingerprint sensing dominates technologies like iris, face, palm or voice recognition, because it meets almost all the requirements of a “perfect” biometric recognition technology. It is robust, stable and repeatable, time-invariant, difficult to spoof, has a distinctive meaning, is "unique" amongst a population, accessible, easy to use and acceptably non-intrusive. All other biometric technologies do not yet fulfill those requirements as specifically as fingerprint technology. Hardware revenues generated by the other biometric technologies are relatively low, estimated at $250M, mostly from iris and face recognition. This report identifies the players in the biometric hardware market, and provides technology, market and trend evolution insights. The fingerprint market has experienced an incredible volume increase in the consumer market with the adoption of the active capacitance detection on an increasing number of smartphones to answer the demand of online identification, mobile payment and unlocking applications. Diverse technologies, such as optical, thermal, and Piezoelectric Micromachined Ultrasonic Transducers (PMUT), are also trying to penetrate the consumer market, but are still very limited. The industrial and homeland/security markets are still widely using optical technology. Other biometric solutions like iris, face or voice recognition have been introduced but with a limited impact. Their performance hasn’t yet reached the requirements with regards to cost, reliability, false rejection rate and false acceptance rate to significantly penetrate either the consumer, industrial or homeland/security markets....
More information on that report: http://www.i-micronews.com/report/product/sensors-for-biometry-and-recognition.html
Point-of-Need Testing: Application of Microfluidic Technologies - 2016 Report...Yole Developpement
Decentralized testing for both human and non-human in-vitro diagnostics is increasingly taking advantage of innovative microfluidic technologies
PLENTY OF APPLICATIONS HAVE STARTED TO BENEFIT FROM MICROFLUIDICS FOR DECENTRALIZED TESTING, BUT HAVE NOT REALIZED THEIR FULL POTENTIAL – YET
Point-of-Care (PoC) testing is not a new concept - the first applications arose in the 1990s. Since then, microfluidic technologies have been increasingly used to solve technical problems and bring economic benefits to the healthcare industry. In the past few years, other applications have benefited from recent technological improvements: veterinary testing, environmental testing, agro-food and industrial testing are also part of the scope of the report. Decentralized testing brings significant operational benefits to various players across these applications.
Microfluidics is part of the diagnostics revolution, with an explosion in the number of products on the market. However, with many applications but few solutions existing today, these markets have not yet reached their full potential.
In the report, Yole Développement (Yole)’s analysts explain why the human healthcare market still looks much more attractive to technology developers. However, in the near future the greatest opportunities will be in all the other markets. The report also explores which barriers still need to be taken down for decentralized, or “point-of-need” (PoN), testing to flourish.
Microfluidics-based point-of-need testing will grow from a $2.6B market in 2015 to $10.3B in 2021, which is a 26% compound annual growth rate (CAGR). This value represents more than 500 million tests in 2021, but only 61 million will be outside human diagnostics. In the report, Yole’s analysts detail the evolution of each application in terms of microfluidic technology’s use.
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...Yole Developpement
Panasonic’s first 600V GaN HEMT has an innovative structure designed to integrate a normally-off transistor in a standard package, without a cascade structure
System Plus Consulting unveils Panasonic’s first GaN HEMT, assembled in a standard TO220 package. Thanks to its specific die design, the component is normally-off without using a cascade structure or special packaging.
Panasonic’s PGA26C09DV features a medium-voltage breakdown of 600V for a current of 15A (25°C), with very low RdsOn compared to its competitors. The transistor is optimized for AC-DC power supply, photovoltaic, and motor inverters.
The GaN and AlGaN layers are deposited by epitaxy on a silicon substrate. A complex buffer and template layer structure is used to reduce stress and dislocation. This is complemented by a thick superlattice structure clearly visible in the TEM analysis.
Based on a complete teardown analysis, this report also provides a production cost estimate for the epitaxy, HEMT, and package.
Moreover, this report offers a comparison with GaN Systems’ GS66504B and Transphorm’s GaN HEMT, highlighting the huge differences in design and manufacturing process and their impact on device size and production cost.
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El HTC Vive es un casco de realidad virtual desarrollado por HTC y Valve que permite al usuario caminar y moverse libremente en un área de 4.6x4.6 metros mientras interactúa con objetos virtuales a través de controladores. Utiliza pantallas de alta resolución, sensores precisos y un sistema de seguimiento con láseres para brindar una inmersión completa en mundos virtuales.
Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...Yole Developpement
A look into Texas Instruments’ system-on-chip, including Sony/Softkinetic’s time-of-flight pixel technology, for industrial applications
Today, Time-of-Flight (ToF) systems are among the most innovative technologies offering imaging companies an opportunity to lead the market. Every major player wants to integrate these devices to provide functions such as 3D imaging, proximity sensing, ambient light sensing and gesture recognition.
Sony/Softkinetic has been investigating this technology deeply, providing a unique pixel technology to several image sensor manufacturers in three application areas: consumer, automotive and industrial. For industrial applications, Sony/Softkinetic has licensed its technology to Texas Instruments, which is providing ToF imagers for human detection or robot-human interaction.
The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG) technology. The device comprises a system-on-chip (SoC) and glass filter in the same component in thin, 0.7 mm-thick, packaging.
This report analyzes the complete component, from the glass near-infrared band-pass filter to the collector based on ToF pixel licenses developed by Sony/Softkinetic and adapted by Texas Instruments. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF imager.
It also features a complete ToF pixel technology comparison with the Infineon/pmd, STMicroelectronics and Melexis automotive ToF imagers, which are all also based on Sony/Softkinetic technology, with details on the companies’ design choices.
More information on that report at http://www.i-micronews.com/reports.html
Apple iPhone X – Infrared Dot Projector 2017 teardown reverse costing report ...system_plus
The world’s most advanced dot projector for 3D sensing
with four innovative parts:
Its package; a dedicated VCSEL; a folded optic; and the active DOE.
Apple has made a great technology choice with its 3D facial identification for the iPhone X. The new technology is presented as being 20 times more accurate than the older fingerprint approach with a one-in-a million probability of a random person unlocking your iPhone.
Thermo Fisher Ion 520 DNA Sequencing Chip 2017 teardown reverse costing repor...Yole Developpement
Next generation of silicon/polymer microfluidic technology for fast throughput DNA sequencing from Thermo Fisher Ion Torrent®
Today a main challenge in life science research is to reduce the price of genomic analysis, and the time taken to do it. Back in 2003, the cost of sequencing the human genome was almost $3B. That decreased to $10,000 in 2011, and is headed towards $1,000 in the next few years.
Thermo Fisher, with 8% of the microfluidic product market, is one of the companies most involved in sequencing applications, along with its rival Illumina. However, the two companies have different objectives.
Thermo Fisher intends to reduce analysis time with fast throughput and short single-end reads. Illumina has high throughput with short paired reads. To deliver fast reading, Thermo Fisher uses Ion Torrent® technology, which relies on technology similar to an image sensor.
The innovative Ion 520 DNA sequencing chip uses this Ion Torrent technology. It includes a multiwell array, which captures the sphere particles that have DNA attached. The particles react with a solution of nucleotides, which changes the charge in the wells, which in turn is detected by the circuit and allows the DNA sequencing.
More information on that report at http://www.i-micronews.com/reports.html
Fingerprint Cards’ FPC1268 in the Huawei Mate 9 Pro & P10 series 2017 teardow...Yole Developpement
This report analyzes FPC's FPC1268 fingerprint sensor used in the Huawei Mate 9 Pro and P10 smartphones. It provides a teardown of the sensor package, including photos of the sensor and ASIC dies. The report details the manufacturing processes for the sensor and ASIC, from wafer fabrication to packaging. It estimates the costs for materials and manufacturing steps. Comparisons are made to FPC's previous FPC1025 sensor and Qualcomm's ultrasonic fingerprint sensor. This is the first capacitive fingerprint sensor successfully integrated under a glass cover, in a collaboration between FPC and TPK.
An ultrasonic sensor in a compact housing, with 20-450cm detection range.
Ultrasonic transducers are used in vehicles as parking assistance. The ultrasonic transducer sends out short ultrasonic impulses which are reflected by barriers. The echo signals are registered by the sensor and are evaluated by a central control unit.
This ultrasonic parking sensor from Bosch is very compact with its very few components meaning it is manufactured at low cost. The sensor is made with one electronic board, including a Bosch transceiver integrated circuit (IC) that drives the output of the Epcos/TDK transformer and evaluates the reflected signal. The transducer itself is made of a lead zirconate titanate (PZT) membrane and silver electrodes.
More information on that report at http://www.i-micronews.com/reports.html
SiGe based millimeter-wave chipset commercially available for
backhaul applications with beamforming capability.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/peraso-x710-chipset-60ghz-outdoor-wireless-broadband-solution/
Melexis Time of Flight Imager for Automotive Applications 2017 teardown rever...Yole Developpement
This document provides a reverse costing analysis of the Melexis MLX75023 3D time-of-flight image sensor. It includes a physical analysis of the glass ball grid array package and die, a comparison to other ToF technologies, a breakdown of the manufacturing process, and a cost analysis. Key findings include that the sensor uses a cutting-edge time-of-flight pixel design licensed from Softkinetic and packaged using a thin glass BGA. The report estimates production costs and sells price based on detailed analysis of materials, fabrication steps, and supply chain.
Orbbec’s Front 3D Depth Sensing System in the Oppo Find Xsystem_plus
The first introduction of Orbbec’s 3D front depth sensing system in a mobile application featuring a global shutter, a dot projector and a custom system-on-chip.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/orbbecs-front-3d-depth-sensing-system-in-the-oppo-find-x/
Discover Axis’s high-end product integrating its latest ARTPEC-7 in-house system-on-chip dedicated to network video and machine learning capabilities.
More information : https://www.systemplus.fr/reverse-costing-reports/axis-p1375-e-network-camera/
STMicroelectronics Proximity & Flood Illuminator in the Apple iPhone X - reve...system_plus
A unique combination of STMicroelectronics’ latest proximity sensor, based on single-photon avalanche diode (SPAD) technology and a VCSEL illuminator, all in Apple’s most advanced handset.
More information on that report at http://www.i-micronews.com/reports.html
STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...system_plus
The document provides a detailed analysis of the near infrared (NIR) camera sensor used in the Apple iPhone X for facial recognition. It includes a teardown of the true depth camera module containing the NIR sensor from STMicroelectronics. Physical analysis of the module reveals a lens module, filter, and ceramic substrate. Analysis of the ST NIR sensor die shows it has small pixels below 4 μm, a resolution of 2 megapixels, and was manufactured using ST's 140nm process on an Imager-SOI substrate from Soitec. The report also provides a cost analysis of manufacturing the sensor die and module, estimating the manufacturer price to be around $15. The document compares the ST sensor to other NIR sensors
Deep analysis of the latest generation of under-display optical fingerprint sensors using micro-optics.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/goodixs-ultra-thin-optical-in-display-fingerprint/
LG Display Medianav ECU Available in the Dacia Dustersystem_plus
A competitive high resolution, high luminance and wide viewing angle automotive display.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/lg-display-medianav-ecu-available-in-the-dacia-duster/
InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sens...Yole Developpement
World’s first ‘7-Axis’ motion tracking device targeting drone application
Having supplied Apple for many years, InvenSense (TDK) is a leader in the inertial measurement unit (IMU) market. It has a large market share, competing with Bosch and others. This year, with the acquisition of Sensirion’s barometric pressure sensor division, InvenSense has entered a new market area. It has now released of its first ‘7-axis’ motion tracking combo, bringing together a 6-axis IMU and a pressure sensor, moving it into drone applications.
The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axis device, incorporating a 3-axis gyroscope and a 3-axis accelerometer, and a barometric pressure sensor previously developed by Sensirion in the same package. Compared with the stand-alone sensor hub, this approach eliminates a package and minimizes board area requirements.
More information on that report at http://www.i-micronews.com/reports.html
Denso’s Monocular Forward ADAS Camera in the Toyota Alphardsystem_plus
Denso has developed a new monocular forward camera for improved night vision, using Sony’s high-sensitivity 1.27M-pixel image sensor and Toshiba’s new advanced image recognition processor.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/densos-monocular-forward-adas-camera-in-the-toyota-alphard/
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...Yole Developpement
A closer look at the impressive, industry-first, tri-layer stacked CIS.
Sony leads the global CMOS Image Sensor (CIS) market, commanding more than a third share of the industry’s total revenue. And over the years, Sony has maintained its leadership by providing innovative CIS products for original equipment manufacturers like Samsung or Apple. In 2017, Sony as a smartphone designer decided to release in its flagship the latest and potentially the greatest innovation in the past decade of CIS manufacturing.
Inside the Sony Xperia™ XZs and the XZ Premium, the latest Motion Eye™ can be found, with the new IMX400 CIS. This three-layer stacked CIS is made with the traditional pixel array and logic circuit on the same die, but also a 1Gb DRAM memory allowing slow motion at almost 960 frames per second.
This innovative CIS is Sony’s next generation technology. The CIS includes a 22 Mpixel array, a 1Gb DRAM die and a digital signal processor (DSP) on the same die footprint. This is the first tri-layer stacked CIS on the market. In this configuration, Sony can provide a fast readout image sensor with no distortion when shooting fast-moving objects thanks to the high capacity DRAM between the pixel array circuit and the DSP circuit.
Using Sony’s Exmor-RS and Xperi’s Zibond technologies, Sony has managed to integrate the three dies in a single thin, small and cost-effective sensor die. Surprisingly, the die sensor uses a unique sort of TSV at different levels to interconnect the dies.
This report includes a complete analysis of the camera module from the Sony Xperia™ XZs, featuring camera module disassembly and die analyses, processes and cross-sections. It also includes a comparison with the Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level, it compares the IMX400 with the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, it contains a complete cost analysis and a selling price estimation of the CIS die.
More information on that report at http://www.i-micronews.com/reports.html
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...system_plus
Fourth generation of the S-Cam family from the leading ADAS camera player.
Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/zf-s-cam-4-forward-automotive-mono-and-tri-camera-for-adas/
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...Yole Developpement
An infrared camera with a powerful vision processor in a small package, using a new 12μm microbolometer.
Based on a high definition ISC1406L micro-bolometer, the FLIR Boson thermal camera aims at a wide range of markets: military, drones, automotive, security and firefighting. Thanks to sound technological and economic choices, the microbolometer offers very good performance in definition and frame rate at low cost. The camera core’s economical approach involves new lens technology and sophisticated vision processing from Intel/Movidius to power its infrared vision.
The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320x256 pixel microbolometer and an advanced processor. The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time.
More information on that report at http://www.i-micronews.com/reports.html
LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module f...Yole Developpement
LeddarTech’s new LiDAR has no moving parts, giving it the smallest form factor while integrating the latest innovations in LiDAR technology
The light detection and ranging principle and technology, also known as LiDAR, is used in a wide spectrum of applications. With upcoming autonomous or “self-driving” cars, LiDAR technology is being considered for one option for the “eyes” of such vehicles. However, existing systems do not match the challenging reliability, compactness and cost-efficiency specifications of the automotive world.
Based on “LeddarCore” components, Leddartech has developed LeddarVu8, a compact solid-state LiDAR without mechanical movement that provides highly accurate multi-target detection over eight independent segments. It detects targets at up to 215 m range despite its tiny size of 70 mm x 35 mm x 46 mm and weighing only 75 grams. The LeddarVu8 delivers nearly twice the range for half the volume compared to the previous version.
These qualities qualify the LeddarVu8 as a candidate for advanced driver assistance, replacing the radar. With its adjustable and interchangeable optics module, the LeddarVu8 can also be interesting for other applications, such as traffic management, speed enforcement, heavy-duty equipment collision warning, navigation, liquid level sensing and bulk volume measurements.
The light is emitted by Excelitas’ tri-stacked emitting edge laser diode of 75W and received by a photodiode array. The two components are designed for large volume markets and some innovations reduce their usually high cost. This first automotive version of the LeddarVu8 shows the full potential of this technology to go under the $100 barrier.
This report presents the full system manufacturing and packaging processes for the LeddarVu8 as well as the physical analysis of the two main optical components, the laser diode and the photodiode. An estimation of the manufacturing cost and selling price is included.
More information on that report at http://www.i-micronews.com/reports.html
Similar to HTC Vive Virtual Reality Head-Mounted Display - teardown reverse costing report published by Yole Developpement (20)
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
This report from Yole Développement analyzes the high-end performance packaging market. It defines high-end performance packaging as technologies that provide high IO density (≥16/mm2) and fine IO pitch (≤130μm). The report aims to identify relevant technologies, analyze market drivers and challenges, describe technology trends and roadmaps, examine the supply chain landscape, and provide market forecasts. It evaluates the market by technology, end application, and region. The report also profiles key players' technology roadmaps and analyzes intellectual property in the 3D SoC hybrid bonding space.
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
The report provides a market analysis of the GaAs wafer and epiwafer markets from 2019 to 2025. It forecasts that the GaAs wafer market will increase from $200 million in 2019 to $348 million in 2025, with the largest application segments being RF, photonics, and LED. The open epiwafer market is also analyzed, with IQE and VPEC together comprising almost 80% of the $262 million total market in 2019. Key drivers of growth are discussed for various applications such as 5G adoption for RF and increasing use of VCSELs for 3D sensing and LiDAR.
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Full-RAG: A modern architecture for hyper-personalizationZilliz
Mike Del Balso, CEO & Co-Founder at Tecton, presents "Full RAG," a novel approach to AI recommendation systems, aiming to push beyond the limitations of traditional models through a deep integration of contextual insights and real-time data, leveraging the Retrieval-Augmented Generation architecture. This talk will outline Full RAG's potential to significantly enhance personalization, address engineering challenges such as data management and model training, and introduce data enrichment with reranking as a key solution. Attendees will gain crucial insights into the importance of hyperpersonalization in AI, the capabilities of Full RAG for advanced personalization, and strategies for managing complex data integrations for deploying cutting-edge AI solutions.
GraphSummit Singapore | The Art of the Possible with Graph - Q2 2024Neo4j
Neha Bajwa, Vice President of Product Marketing, Neo4j
Join us as we explore breakthrough innovations enabled by interconnected data and AI. Discover firsthand how organizations use relationships in data to uncover contextual insights and solve our most pressing challenges – from optimizing supply chains, detecting fraud, and improving customer experiences to accelerating drug discoveries.
Alt. GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using ...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
Introducing Milvus Lite: Easy-to-Install, Easy-to-Use vector database for you...Zilliz
Join us to introduce Milvus Lite, a vector database that can run on notebooks and laptops, share the same API with Milvus, and integrate with every popular GenAI framework. This webinar is perfect for developers seeking easy-to-use, well-integrated vector databases for their GenAI apps.
Goodbye Windows 11: Make Way for Nitrux Linux 3.5.0!SOFTTECHHUB
As the digital landscape continually evolves, operating systems play a critical role in shaping user experiences and productivity. The launch of Nitrux Linux 3.5.0 marks a significant milestone, offering a robust alternative to traditional systems such as Windows 11. This article delves into the essence of Nitrux Linux 3.5.0, exploring its unique features, advantages, and how it stands as a compelling choice for both casual users and tech enthusiasts.
Pushing the limits of ePRTC: 100ns holdover for 100 daysAdtran
At WSTS 2024, Alon Stern explored the topic of parametric holdover and explained how recent research findings can be implemented in real-world PNT networks to achieve 100 nanoseconds of accuracy for up to 100 days.
Maruthi Prithivirajan, Head of ASEAN & IN Solution Architecture, Neo4j
Get an inside look at the latest Neo4j innovations that enable relationship-driven intelligence at scale. Learn more about the newest cloud integrations and product enhancements that make Neo4j an essential choice for developers building apps with interconnected data and generative AI.
Climate Impact of Software Testing at Nordic Testing DaysKari Kakkonen
My slides at Nordic Testing Days 6.6.2024
Climate impact / sustainability of software testing discussed on the talk. ICT and testing must carry their part of global responsibility to help with the climat warming. We can minimize the carbon footprint but we can also have a carbon handprint, a positive impact on the climate. Quality characteristics can be added with sustainability, and then measured continuously. Test environments can be used less, and in smaller scale and on demand. Test techniques can be used in optimizing or minimizing number of tests. Test automation can be used to speed up testing.
Building RAG with self-deployed Milvus vector database and Snowpark Container...Zilliz
This talk will give hands-on advice on building RAG applications with an open-source Milvus database deployed as a docker container. We will also introduce the integration of Milvus with Snowpark Container Services.
Encryption in Microsoft 365 - ExpertsLive Netherlands 2024Albert Hoitingh
In this session I delve into the encryption technology used in Microsoft 365 and Microsoft Purview. Including the concepts of Customer Key and Double Key Encryption.
UiPath Test Automation using UiPath Test Suite series, part 6DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 6. In this session, we will cover Test Automation with generative AI and Open AI.
UiPath Test Automation with generative AI and Open AI webinar offers an in-depth exploration of leveraging cutting-edge technologies for test automation within the UiPath platform. Attendees will delve into the integration of generative AI, a test automation solution, with Open AI advanced natural language processing capabilities.
Throughout the session, participants will discover how this synergy empowers testers to automate repetitive tasks, enhance testing accuracy, and expedite the software testing life cycle. Topics covered include the seamless integration process, practical use cases, and the benefits of harnessing AI-driven automation for UiPath testing initiatives. By attending this webinar, testers, and automation professionals can gain valuable insights into harnessing the power of AI to optimize their test automation workflows within the UiPath ecosystem, ultimately driving efficiency and quality in software development processes.
What will you get from this session?
1. Insights into integrating generative AI.
2. Understanding how this integration enhances test automation within the UiPath platform
3. Practical demonstrations
4. Exploration of real-world use cases illustrating the benefits of AI-driven test automation for UiPath
Topics covered:
What is generative AI
Test Automation with generative AI and Open AI.
UiPath integration with generative AI
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Dr. Sean Tan, Head of Data Science, Changi Airport Group
Discover how Changi Airport Group (CAG) leverages graph technologies and generative AI to revolutionize their search capabilities. This session delves into the unique search needs of CAG’s diverse passengers and customers, showcasing how graph data structures enhance the accuracy and relevance of AI-generated search results, mitigating the risk of “hallucinations” and improving the overall customer journey.
Enchancing adoption of Open Source Libraries. A case study on Albumentations.AIVladimir Iglovikov, Ph.D.
Presented by Vladimir Iglovikov:
- https://www.linkedin.com/in/iglovikov/
- https://x.com/viglovikov
- https://www.instagram.com/ternaus/
This presentation delves into the journey of Albumentations.ai, a highly successful open-source library for data augmentation.
Created out of a necessity for superior performance in Kaggle competitions, Albumentations has grown to become a widely used tool among data scientists and machine learning practitioners.
This case study covers various aspects, including:
People: The contributors and community that have supported Albumentations.
Metrics: The success indicators such as downloads, daily active users, GitHub stars, and financial contributions.
Challenges: The hurdles in monetizing open-source projects and measuring user engagement.
Development Practices: Best practices for creating, maintaining, and scaling open-source libraries, including code hygiene, CI/CD, and fast iteration.
Community Building: Strategies for making adoption easy, iterating quickly, and fostering a vibrant, engaged community.
Marketing: Both online and offline marketing tactics, focusing on real, impactful interactions and collaborations.
Mental Health: Maintaining balance and not feeling pressured by user demands.
Key insights include the importance of automation, making the adoption process seamless, and leveraging offline interactions for marketing. The presentation also emphasizes the need for continuous small improvements and building a friendly, inclusive community that contributes to the project's growth.
Vladimir Iglovikov brings his extensive experience as a Kaggle Grandmaster, ex-Staff ML Engineer at Lyft, sharing valuable lessons and practical advice for anyone looking to enhance the adoption of their open-source projects.
Explore more about Albumentations and join the community at:
GitHub: https://github.com/albumentations-team/albumentations
Website: https://albumentations.ai/
LinkedIn: https://www.linkedin.com/company/100504475
Twitter: https://x.com/albumentations
TrustArc Webinar - 2024 Global Privacy SurveyTrustArc
How does your privacy program stack up against your peers? What challenges are privacy teams tackling and prioritizing in 2024?
In the fifth annual Global Privacy Benchmarks Survey, we asked over 1,800 global privacy professionals and business executives to share their perspectives on the current state of privacy inside and outside of their organizations. This year’s report focused on emerging areas of importance for privacy and compliance professionals, including considerations and implications of Artificial Intelligence (AI) technologies, building brand trust, and different approaches for achieving higher privacy competence scores.
See how organizational priorities and strategic approaches to data security and privacy are evolving around the globe.
This webinar will review:
- The top 10 privacy insights from the fifth annual Global Privacy Benchmarks Survey
- The top challenges for privacy leaders, practitioners, and organizations in 2024
- Key themes to consider in developing and maintaining your privacy program
“An Outlook of the Ongoing and Future Relationship between Blockchain Technologies and Process-aware Information Systems.” Invited talk at the joint workshop on Blockchain for Information Systems (BC4IS) and Blockchain for Trusted Data Sharing (B4TDS), co-located with with the 36th International Conference on Advanced Information Systems Engineering (CAiSE), 3 June 2024, Limassol, Cyprus.
31. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
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33. COMPLETE TEARDOWN
WITH:
• Detailed photos
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bill-of-materials for the
headset
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flow of the electronic
board and rigid-flex
PCBs of the headset
• Manufacturing cost
analysis
• Selling price estimate
HTC Vive Virtual Reality Head-Mounted Display
Title: HTC Vive VR Head-
Mounted Display
Pages: 131
Date: February 2017
Format: PDF & Excel file
Price: Full report:
EUR 3,490
Detailed analysis of HTC’s smart approach to the VR experience
They think this market has enough potential to invest billions of dollars to
get ahead of their competitors. Most other major manufacturers also want
good market shares, including Microsoft, Intel, Google, AMD, Samsung,
Huawei, Archos and Alcatel.
Winning in this market is now HTC’s all-or-nothing strategy. The HTC Vive VR
Head-Mounted Display (HMD) is aimed at saving HTC from collapse. Vive VR
can be used in different sectors, including gaming, entertainment, health,
automotive, retail and education. It promises a premium VR experience.
This very well-designed system uses established components, including two
1200x1080 pixel AMOLED displays manufactured by Samsung, for a total
resolution of 2160x1200 pixels. These are the main parts of the over 2850
electronic and mechanical components System Plus Consulting has identified
in the headset. There are also several MCUs, FPGAs, processors, interface ICs,
MEMS sensors, photodiodes, and a camera module including an Omnivision
Global Shutter Motion Detector.
Based on a complete teardown of the HTC Vive VR Headset, this report is a
detailed physical, technology and cost analysis.
The Virtual Reality (VR) market has
raised expectations extremely high. It is
already worth several billion US dollars
per year and growing rapidly, with
millions of headsets due to be sold in
coming years.
Three main companies lead this new
market: HTC Corporation, Oculus VR,
which was bought by Facebook in 2014
for $2 billion, and Sony Playstation.
34. AUTHOR:
TABLE OF CONTENTS
Overview / Introduction
• Executive Summary
• Main Chipset
• Block Diagram
• Reverse Costing Methodology
Company Profile
• HTC Corporation
Physical Analysis
• Content of the Box
• Views and Dimensions of the Headset
• Headset Opening
• Fresnel Lens Details
• Display Details
• Main Electronic Board
Top side – overview
Top side – high definition photo
Top side – PCB markings
Top side – main component
markings
Top side – main component
identification
Top side – other component
markings
Top side – other component
identification
Bottom side – high definition photo
Bottom side – component
identification
• IR Photodiode Flex
• Front Camera Flex
System Plus Consulting offers
powerful costing tools to
evaluate the production cost and
selling price from single chip to
complex structures.
SYSCost+
It provides all component costs
estimation including PCB,
housing and connectors, and a
simulation of the assembly cost
and test process at the board
and system level.
IC Price+
This tool performs the necessary
cost simulation of any Integrated
Circuit: ASICs, microcontrollers,
memories, DSP, smartpower…
Display Price+
It allows simulating the cost of
most displays (LCD & OLED).
ANALYSIS PERFORMED WITH OUR COSTING TOOLS SYSCOST+ IC PRICE+ AND DISPLAYS
PRICE+
IC Price+
SYSCost+
Wilfried
Théron
Wilfried is Senior Project
Manager for reverse costing
analyses at System Plus
Consulting.
Since 1998, he has been in
charge of costing analyses of
electronic systems and
integrated circuits. He has
significant experience in
modeling the manufacturing
costs of electronics systems and
components.
Wilfried holds a master's degree
in microelectronics from the
University of Nantes, France.
• Microphone Flex
• Proximity Sensor Flex
• Display Flex 1 & 2
Cost Analysis
• Estimating the BOM
• PCB Cost
• BOM Cost – Main Electronic Board
• BOM Cost – IR Photodiode Flex
• BOM Cost – Front Camera Flex
• BOM Cost – Microphone Flex
• BOM Cost – Proximity Sensor Flex
• BOM Cost – Display Flex 1 & 2
• Housing Parts – Estimation
• BOM Cost - Housing
• Material Cost Breakdown by Sub-
Assembly
• Material Cost Breakdown by
Component Category
• Estimating Added Value (AV) cost
• Electronic Board Manufacturing Flow
• Details of the Main Electronic Board
AV Cost
• Details of the System Assembly AV
Cost
• Added-Value Cost Breakdown
• Manufacturing Cost Breakdown
Estimated Price Analysis
• Estimation of the Manufacturing
Price
• Estimation of the Selling Price
Display Price+
35. Lenovo Phab2Pro 3D
Time of Flight (ToF) Camera
Google Tango Ready
Intel RealSense 3D Camera
& STMicroelectronics
IR Laser Projector
Apple iPhone 6s Plus
Teardown & Physical
Analyses of Key Components
World’s first 3D tri-camera
bundle including Infineon/pmd
REAL3TM ToF image sensor
integrated into a consumer
smartphone.
Innovative 3D camera for facial
analysis and hand/finger tracking,
based on resonant micro-mirror, IR
laser, visible and near infrared
image sensors.
Discover and understand Apple’s
technical choices and main
suppliers. The report also includes
a technological comparison with
the Samsung Galaxy S6.
Pages: 170
Date: January 2017
Full report: EUR 3,990*
Pages: 65 & 78
Date: September 2015
Full reports: EUR 3,290*
Pages: 120
Date: November 2015
Full report: EUR 3,490*
RELATED REPORTS
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• MEMS & Sensors:
Accelerometer - Compass - Display /
Optics - Environment - Fingerprint -
Gyroscope - IMU/Combo - Light -
Microphone - Oscillator - Pressure sensor
• Power:
GaN - IGBT - MOSFET - Si Diode - SiC
• Systems:
Automotive - Consumer - Energy -
Medical - Telecom
Each year System Plus Consulting releases a comprehensive collection of new reverse engineering &
costing analyses in various domains.
• Imaging:
Infrared - Visible
• Integrated Circuits & RF:
Integrated Circuit (IC) - RF IC
• LEDs:
LED Lamp - UV LED - White/blue LED
• Packaging:
3D Packaging - Embedded - SIP - WLP
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Please process my order for “HTC Vive VR Head-Mounted Display” Reverse Costing Report
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VAT ID Number for EU members:
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Tel:
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Signature:
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First Name: .................................................................. Last Name: ............................................................................
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology
and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using
silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50
collaborators worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics,
Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy
Management.
The “More than Moore” company Yole, along with its partners System Plus Consulting, Blumorpho and KnowMade,
support industrial companies, investors and R&D organizations worldwide to help them understand markets and
follow technology trends to grow their business.
CUSTOM STUDIES
• Market data & research, marketing
analysis
• Technology analysis
• Reverse engineering & costing
services
• Strategy consulting
• Patent analysis
More information on www.yole.fr
MEDIA
• i-Micronews.com, online disruptive
technologies website and its weekly e-
newsletter, @Micronews
• Communication & webcasts services
• Events: Yole Seminars, Market Briefings
More information on
http://www.i-micronews.com/media-kit.html
TECHNOLOGY & MARKET REPORTS
• Collection of technology & market
reports
• Manufacturing cost simulation tools
• Component reverse engineering &
costing analysis
• Patent investigation
More information on
http://www.i-
micronews.com/reports.html
37. Performed by
TERMS AND CONDITIONS OF SALES
. Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of sale in their entirety. It is done by signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of
Sale”.
“Buyer”: Any business user (i.e. any person acting in the course of its business activities, for its business needs) entering into the following general conditions to the exclusion of consumers acting in their personal
interests.
“Contracting Parties” or “Parties”: The Seller on the one hand and the Buyer on the other hand.
“Intellectual Property Rights” (“IPR”) means any rights held by the Seller in its Products, including any patents, trademarks, registered models, designs, copyrights, inventions, commercial secrets and know-how, technical
information, company or trading names and any other intellectual property rights or similar in any part of the world, notwithstanding the fact that they have been registered or not and including any pending registration of
one of the above mentioned rights.
“License”: For the reports and databases, 3 different licenses are proposed. The buyer has to choose one license:
• One user license: one person at the company can use the report.
• Multi-user license: the report can be used by unlimited users within the company. Subsidiaries and Joint-Ventures are not included.
• Corporate license: purchased under “Annual Subscription” program, the report can be used by unlimited users within the company. Joint-Ventures are not included.
“Products”: Depending on the purchase order, reports or database on MEMS, CSC, Optics/MOEMS, Nano, bio… to be bought either on a unit basis or as an annual subscription. (i.e. subscription for a period of 12
calendar months). The annual subscription to a package (i.e. a global discount based on the number of reports that the Buyer orders or accesses via the service, a global search service on line on I-micronews and a
consulting approach), is defined in the order. Reports are established in PowerPoint and delivered on a PDF format and the database may include Excel files.
“Seller”: Based in Lyon (France headquarters), Yole Développement is a market research and business development consultancy company, facilitating market access for advanced technology industrial projects. With
more than 20 market analysts, Yole works worldwide with the key industrial companies, R&D institutes and investors to help them understand the markets and technology trends.
1. Scope
1.1 The Contracting Parties undertake to observe the following general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN ANY
OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE
BINDING IN ANY WAY ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorized person representing the Buyer. For these purposes, the Buyer accepts
these conditions of sales when signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. This results in acceptance by the Buyer.
1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence of any
confirmation in writing, orders shall be deemed to have been accepted.
2. Mailing of the Products
2.1 Products are sent by email to the Buyer:
- within [1] month from the order for Products already released; or
- within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in
progress.
2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer
The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to
compute or compare the data in order to enable the Seller to deliver a high quality Products.
2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3.
2.4. The mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to
replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product.
2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in
writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under
article 2.5 shall remain at the Buyer’s risk.
3. Price, invoicing and payment
3.1 Prices are given in the orders corresponding to each Product sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time
to time. The effective price is deemed to be the one applicable at the time of the order.
3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange
to this uncertainty, the company will get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account:
HSBC, 1 place de la Bourse 69002 Lyon France
Bank code: 30056
Branch code: 00170
Account n°: 0170 200 1565 87
BIC or SWIFT code: CCFRFRPP
IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order.
3.4 Payment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be
entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered
only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.
4. Liabilities
4.1 The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and
interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of
the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot
be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the
liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of
any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in
article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the
orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down
payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take
reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that
any Product will be free from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties,
equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. Protection of the Seller’s IPR
6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the
Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:
- Information storage and retrieval systems;
- Recordings and re-transmittals over any network (including any local area network);
- Use in any timesharing, service bureau, bulletin board or similar arrangement or public display;
- Posting any Product to any other online service (including bulletin boards or the Internet);
- Licensing, leasing, selling, offering for sale or assigning the Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall
personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the
copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a
maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company,
the joint venture done with a third party etc..cannot access the report and should pay a full license price.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such
delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without
solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due
time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which
shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
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