This document provides information about electromagnetic interference (EMI) measurements and standards. It discusses EMI test facilities like shielded chambers, open area test sites, and EMI receivers and spectrum analyzers used for testing. It also covers various EMI standards from organizations like CISPR, FCC, IEC, EN, and MIL for both civilian and military applications. Measurement methods for radiated and conducted emissions are described.
This document provides an overview of electromagnetic interference (EMI) test methods and instrumentation. It defines electromagnetic compatibility (EMC) and describes the electromagnetic environment. Common EMI sources and victims are identified. Key EMI test methods are outlined, including radiated emission (RE) testing, conducted emission (CE) testing, radiated susceptibility (RS) testing, and conducted susceptibility (CS) testing. Critical EMI testing facilities and instrumentation are discussed, such as anechoic chambers, shield rooms, open area test sites (OATS), EMI test receivers, spectrum analyzers, and EMI test signal generators. EMC regulations and standards around the world are also briefly summarized.
The document discusses electromagnetic compatibility (EMC) design considerations for circuits and printed circuit boards (PCBs). It covers topics like noise from relays and switches, nonlinearities in circuits, cross talk control, component selection and mounting, PCB trace impedance, routing, power distribution, decoupling, zoning, grounding, vias and terminations. It provides details on controlled impedance PCB trace design, factors that determine trace impedance, guidelines for board-level decoupling including capacitor placement based on plane spacing.
MicroStrip Antenna
Introduction .
Micro-Strip Antennas Types .
Micro-Strip Antennas Shapes .
Types of Substrates (Dielectric Media) .
Comparison of various types of flat profile printed antennas .
Advantages & DisAdvantages of MSAs .
Applications of MSAs .
Radiation patterns of MSAs .
How to Optimizing the Substrate Properties for Increased Bandwidth ?
Comparing the different feed techniques .
Introduction To Electromagnetic CompatibilityJim Jenkins
Here are a few key points about ground in the context of electromagnetic compatibility (EMC):
- Ground is a common reference point in an electrical system that all other voltages are measured against. It establishes a baseline voltage level.
- In EMC, ground plays an important role in providing a return path for electromagnetic interference (EMI) currents. These currents, known as common mode currents, flow on cables and are looking for a way to complete their circuit back to the source.
- An ideal ground would have zero impedance and instantly drain away any EMI currents. In reality, all grounds have some finite impedance that can allow currents to couple into other circuits.
- Different grounding schemes are used, such
- Antennas convert electric currents into radio waves and vice versa. They are used in various technologies including radio, television, mobile phones, WiFi, and radar.
- The first antennas were built in 1888 by Heinrich Hertz to transmit and receive electromagnetic waves. Modern antennas come in different types for applications like broadcasting, communications, and space exploration.
- Antennas work by using an oscillating current to generate oscillating electric and magnetic fields that propagate as radio waves. During reception, the antenna intercepts some power from incoming radio waves to produce a voltage for the receiver.
By completing this presentation will be have a clear idea about Antenna's working principles, Antenna's Types & Antenna's Parameters. At the end to this document you'll have a brief idea about Antenna's Tilt vs Distance Calculation & Cluster wise optimum Antenna Selection procedure. Impact of antenna PIM & VSWR have been described elaborately in this document as well.
A POWER POINT PRESENTATION ON EMI (ELECTROMAGNETIC Interference) AND ELECTROMAGNETIC COMPATIBILITY (EMC).
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Mode Field Diameter (MFD) is a measure of light intensity in the core of a single mode fiber. It is traditionally defined as the width where intensity falls to 1/e of its peak value, but standards now define it via the Petermann II integral of the far-field intensity distribution. MFD represents the effective area of light propagation in both the core and cladding. It provides important information about a cable's performance and impacts from bending or improper source-fiber coupling that could lead to excessive loss. MFD is tested using an optical time domain reflectometer to obtain the far-field profile and calculate the Petermann II integral to determine the MFD value.
This document provides an overview of electromagnetic interference (EMI) test methods and instrumentation. It defines electromagnetic compatibility (EMC) and describes the electromagnetic environment. Common EMI sources and victims are identified. Key EMI test methods are outlined, including radiated emission (RE) testing, conducted emission (CE) testing, radiated susceptibility (RS) testing, and conducted susceptibility (CS) testing. Critical EMI testing facilities and instrumentation are discussed, such as anechoic chambers, shield rooms, open area test sites (OATS), EMI test receivers, spectrum analyzers, and EMI test signal generators. EMC regulations and standards around the world are also briefly summarized.
The document discusses electromagnetic compatibility (EMC) design considerations for circuits and printed circuit boards (PCBs). It covers topics like noise from relays and switches, nonlinearities in circuits, cross talk control, component selection and mounting, PCB trace impedance, routing, power distribution, decoupling, zoning, grounding, vias and terminations. It provides details on controlled impedance PCB trace design, factors that determine trace impedance, guidelines for board-level decoupling including capacitor placement based on plane spacing.
MicroStrip Antenna
Introduction .
Micro-Strip Antennas Types .
Micro-Strip Antennas Shapes .
Types of Substrates (Dielectric Media) .
Comparison of various types of flat profile printed antennas .
Advantages & DisAdvantages of MSAs .
Applications of MSAs .
Radiation patterns of MSAs .
How to Optimizing the Substrate Properties for Increased Bandwidth ?
Comparing the different feed techniques .
Introduction To Electromagnetic CompatibilityJim Jenkins
Here are a few key points about ground in the context of electromagnetic compatibility (EMC):
- Ground is a common reference point in an electrical system that all other voltages are measured against. It establishes a baseline voltage level.
- In EMC, ground plays an important role in providing a return path for electromagnetic interference (EMI) currents. These currents, known as common mode currents, flow on cables and are looking for a way to complete their circuit back to the source.
- An ideal ground would have zero impedance and instantly drain away any EMI currents. In reality, all grounds have some finite impedance that can allow currents to couple into other circuits.
- Different grounding schemes are used, such
- Antennas convert electric currents into radio waves and vice versa. They are used in various technologies including radio, television, mobile phones, WiFi, and radar.
- The first antennas were built in 1888 by Heinrich Hertz to transmit and receive electromagnetic waves. Modern antennas come in different types for applications like broadcasting, communications, and space exploration.
- Antennas work by using an oscillating current to generate oscillating electric and magnetic fields that propagate as radio waves. During reception, the antenna intercepts some power from incoming radio waves to produce a voltage for the receiver.
By completing this presentation will be have a clear idea about Antenna's working principles, Antenna's Types & Antenna's Parameters. At the end to this document you'll have a brief idea about Antenna's Tilt vs Distance Calculation & Cluster wise optimum Antenna Selection procedure. Impact of antenna PIM & VSWR have been described elaborately in this document as well.
A POWER POINT PRESENTATION ON EMI (ELECTROMAGNETIC Interference) AND ELECTROMAGNETIC COMPATIBILITY (EMC).
Web link https://sah786.wordpress.com
http://www.Facebook.com/Sah92786
https://www.linkedin.com/in/arshad-hussain-8b0a2613b
https://www.slideshare.net/SaHussain1
Mode Field Diameter (MFD) is a measure of light intensity in the core of a single mode fiber. It is traditionally defined as the width where intensity falls to 1/e of its peak value, but standards now define it via the Petermann II integral of the far-field intensity distribution. MFD represents the effective area of light propagation in both the core and cladding. It provides important information about a cable's performance and impacts from bending or improper source-fiber coupling that could lead to excessive loss. MFD is tested using an optical time domain reflectometer to obtain the far-field profile and calculate the Petermann II integral to determine the MFD value.
The document provides an overview of electromagnetic interference (EMI) and electromagnetic compatibility (EMC). It defines EMI and EMC, discusses sources of EMI including natural and man-made sources. Case studies of accidents caused by EMI are presented. Techniques for controlling EMI such as grounding, shielding and filtering are described. Military and civilian EMC standards are also discussed. The document concludes that EMC means that equipment operates correctly in the presence of EMI without itself causing intolerable interference.
1. The document discusses the course Electromagnetic Interference and Compatibility (EIE 521). It outlines sources of electromagnetic interference (EMI) such as lightning, electrostatic discharge, and radio frequency emitters.
2. Standards governing electromagnetic compatibility refer to electromagnetic interference/radio frequency interference caused by stray voltages between electronic systems creating undesirable effects ranging from minor to serious.
3. With increased use of electronics, electromagnetic interference/radio frequency interference is a growing concern that can damage electronics or cause malfunctions impacting critical systems.
Microstrip antenna (also known as a printed antenna) usually means an antenna fabricated using microstrip techniques on a printed circuit board (PCB). They are mostly used at microwave frequencies.
The document discusses recent trends in photonic devices. It begins by defining optics and photonics, and describes some applications of photonics including information technology, healthcare, sensing, lighting and displays. It then explains that photonic devices manipulate or detect light, providing examples like lasers, LEDs and solar cells. The document goes on to discuss latest trends like nanophotonics using graphene, carbon nanotubes and photonic crystals. It also covers silicon photonic devices using silicon-germanium transistors and germanium-tin phototransistors. In conclusion, it predicts future applications of photonics in areas like e-paper, solar panels and light-emitting fabrics.
This document provides an overview of optical fibers, including their evolution, structure, working principles, classification, communication systems, advantages and applications. It discusses how optical fibers guide light using total internal reflection. Fibers are classified based on mode (single or multi-mode) and refractive index profile (step or graded). Key advantages are high bandwidth, low attenuation, immunity to EMI, and security. Applications include telecommunications, broadband, medicine, military and more. Optical fibers have become the backbone of long-distance networks since the 1980s due to refinements in manufacturing.
This document summarizes a project on designing a dual band microstrip antenna. It provides an overview of microstrip antennas, including their basic principles and operation, common shapes and feeding techniques. It then describes the design of a circular dual band microstrip antenna with a T-shaped slot to achieve resonance at 2.3 GHz and 5.8 GHz. Simulation results showing return loss, VSWR, and radiation patterns are presented. Potential applications of dual band microstrip antennas in mobile satellite communication systems, wireless LANs, and GPS are also discussed.
This document provides an overview of electromagnetic interference (EMI) and electromagnetic compatibility (EMC). It defines EMI as an electromagnetic disturbance that can degrade equipment performance or cause malfunctions. EMC is described as a state where equipment functions satisfactorily in a common electromagnetic environment without intolerably disturbing other equipment. The document outlines common sources and effects of EMI and techniques to control EMI at its source, including proper grounding, shielding, filtering, and printed circuit board layout. It also discusses important EMI/EMC standards and standards bodies.
Design & Study of Microstrip Patch Antenna.The project here provides a detailed study of how to design a probe-fed Square Micro-strip Patch Antenna using HFSS, v11.0 software and study the effect of antenna dimensions Length (L), and substrate parameters relative Dielectric constant (εr), substrate thickness (t) on the Radiation parameters of Bandwidth and Beam-width.
Optical fiber communication involves transmitting light through thin glass or plastic fibers to carry information. Light is modulated to encode information and travels through the fiber's core via total internal reflection. At the receiver, the light is converted back to an electrical signal. Optical fibers allow much higher bandwidth than traditional copper cables and are immune to electromagnetic interference. Their small size and weight make them useful for long-distance telecommunications and high-speed networking.
A comprehensive study on wearable textile antenna.
textile antennas are those which uses textile materials as substrate. It is flexible and widely used for wireless body area network applications.
Electromagnetic Interference and Electromagnetic Compatibility (EMI/EMCAishwary Singh
• Characterizing the threat
• Setting standards for emission and susceptibility levels
• Testing of Equipment on heavy Vibrations
• Testing for standards compliance
For queries,
Aishwarya
palsinghaishwarya@gmail.com
The document discusses concepts of antenna arrays and their applications. It provides an overview of antenna arrays, including their need, types, parameters that influence their radiation patterns, and applications. The key points are:
1) An antenna array consists of multiple antenna elements arranged to form a single antenna with controllable radiation patterns. This allows for increased directivity, narrower beams, and electronic beam steering.
2) Common array types include linear, circular, and planar arrays. Parameters like element spacing, excitation amplitudes and phases shape the overall radiation pattern.
3) Applications of antenna arrays include radar systems, wireless communications, and radio astronomy due to their ability to focus signals in desired directions without mechanical movement.
The document discusses different types of antennas and their properties. It describes how antennas convert radio frequency energy into electromagnetic waves and how their physical size relates to wavelength. It then summarizes the main types of antennas including directional antennas like Yagi, panel and parabolic, and omni-directional antennas. It provides examples of common antenna radiation patterns and discusses concepts like polarization, reflector optics, aperture efficiency, and Cassegrain feeds.
This document provides an overview of electromagnetic compatibility (EMC) testing, including conducted emission (CE), radiated emission (RE), conducted susceptibility (CS), and radiated susceptibility (RS) tests. It discusses the relevant standards for different types of equipment under test (EUT) and applications. Key aspects covered include test setup requirements, equipment used like EMI receivers, antennas, anechoic chambers, line impedance stabilization networks (LISNs), and turntables. The document also provides examples of EMC test equipment like antennas and absorber materials. Overall, it introduces the basic concepts and requirements for pre-compliance EMC testing.
This document provides an overview of microstrip patch antennas, also known as patch antennas. It defines patch antennas as consisting of a metal patch on top of a grounded dielectric substrate, which are useful at microwave frequencies above 1 GHz. The document discusses the geometry, advantages, disadvantages, feeding techniques, basic properties including resonance frequency and bandwidth, radiation pattern, and applications of microstrip patch antennas. The main applications mentioned are in mobiles, satellites, GPS, WiMAX, medical devices, and radar.
Underwater optical communication is a promising alternative to acoustic methods for underwater wireless communication. Radio waves do not propagate well underwater, so optical methods using lasers and LEDs can provide line-of-sight transmission of data, video and signals for vehicle control. Several factors influence the performance of underwater optical links, including absorption and scattering by water constituents like phytoplankton and dissolved organic matter, as well as scattering from suspended particles.
Wireless communication transmits voice and data using electromagnetic waves without physical connections like wires. It provides freedom of movement and flexibility to connect multiple devices. Common wireless technologies include radio, TV, Bluetooth, WiFi, and cellular networks. Wireless communication faces challenges like security issues, infrastructure costs, and signal interference, but enables connectivity anywhere through standards like LTE and 5G.
This document discusses various types of antennas and antenna arrays. It begins by describing common antenna types including helical antennas, horn antennas, and parabolic reflector antennas. It then discusses how antenna arrays work, noting that they are composed of multiple similar radiating elements whose spacing and excitation determine the array's properties. Examples of linear and 2D arrays are provided. The document also summarizes different array configurations and beamforming techniques as well as applications such as smart antennas and adaptive arrays. Key benefits of arrays like controlling radiation patterns electronically are highlighted.
Optical fibers experience various intrinsic and extrinsic losses that limit signal strength over long distances. Intrinsic losses include material absorption and scattering due to fiber imperfections. Absorption is caused by molecular vibrations and impurities, while scattering results from refractive index fluctuations. Extrinsic losses include bending, launching, and connector losses. Bending losses occur from macroscopic or microscopic bends, launching losses are from imperfect coupling into the fiber, and connector losses are due to core misalignments between joined fibers. Together these losses contribute to the overall attenuation of signals transmitted through optical fibers.
The document discusses EMC compliance rules and regulations for electronic products. It covers various safety, energy efficiency, environmental and EMI/EMC standards that products must comply with for different regions. It emphasizes the importance of considering compliance early in the design process to incorporate necessary design features and allow for testing and modifications before final release. Regulations are constantly changing so keeping updated is important.
Design of Low Cost Line Impedance Stabilization Network Using RLC Components ...IRJET Journal
This document describes the design of a low-cost line impedance stabilization network (LISN) using RLC components to test information technology equipment according to CISPR-22 standards. It first provides background on electromagnetic compatibility standards and the purpose of a LISN. It then details the design process, including using low-pass and band-pass filters with specific cutoff frequencies to stabilize input impedance and filter noise. Simulation results using ADS software show the designed LISN provides good impedance matching at low cost.
The document provides an overview of electromagnetic interference (EMI) and electromagnetic compatibility (EMC). It defines EMI and EMC, discusses sources of EMI including natural and man-made sources. Case studies of accidents caused by EMI are presented. Techniques for controlling EMI such as grounding, shielding and filtering are described. Military and civilian EMC standards are also discussed. The document concludes that EMC means that equipment operates correctly in the presence of EMI without itself causing intolerable interference.
1. The document discusses the course Electromagnetic Interference and Compatibility (EIE 521). It outlines sources of electromagnetic interference (EMI) such as lightning, electrostatic discharge, and radio frequency emitters.
2. Standards governing electromagnetic compatibility refer to electromagnetic interference/radio frequency interference caused by stray voltages between electronic systems creating undesirable effects ranging from minor to serious.
3. With increased use of electronics, electromagnetic interference/radio frequency interference is a growing concern that can damage electronics or cause malfunctions impacting critical systems.
Microstrip antenna (also known as a printed antenna) usually means an antenna fabricated using microstrip techniques on a printed circuit board (PCB). They are mostly used at microwave frequencies.
The document discusses recent trends in photonic devices. It begins by defining optics and photonics, and describes some applications of photonics including information technology, healthcare, sensing, lighting and displays. It then explains that photonic devices manipulate or detect light, providing examples like lasers, LEDs and solar cells. The document goes on to discuss latest trends like nanophotonics using graphene, carbon nanotubes and photonic crystals. It also covers silicon photonic devices using silicon-germanium transistors and germanium-tin phototransistors. In conclusion, it predicts future applications of photonics in areas like e-paper, solar panels and light-emitting fabrics.
This document provides an overview of optical fibers, including their evolution, structure, working principles, classification, communication systems, advantages and applications. It discusses how optical fibers guide light using total internal reflection. Fibers are classified based on mode (single or multi-mode) and refractive index profile (step or graded). Key advantages are high bandwidth, low attenuation, immunity to EMI, and security. Applications include telecommunications, broadband, medicine, military and more. Optical fibers have become the backbone of long-distance networks since the 1980s due to refinements in manufacturing.
This document summarizes a project on designing a dual band microstrip antenna. It provides an overview of microstrip antennas, including their basic principles and operation, common shapes and feeding techniques. It then describes the design of a circular dual band microstrip antenna with a T-shaped slot to achieve resonance at 2.3 GHz and 5.8 GHz. Simulation results showing return loss, VSWR, and radiation patterns are presented. Potential applications of dual band microstrip antennas in mobile satellite communication systems, wireless LANs, and GPS are also discussed.
This document provides an overview of electromagnetic interference (EMI) and electromagnetic compatibility (EMC). It defines EMI as an electromagnetic disturbance that can degrade equipment performance or cause malfunctions. EMC is described as a state where equipment functions satisfactorily in a common electromagnetic environment without intolerably disturbing other equipment. The document outlines common sources and effects of EMI and techniques to control EMI at its source, including proper grounding, shielding, filtering, and printed circuit board layout. It also discusses important EMI/EMC standards and standards bodies.
Design & Study of Microstrip Patch Antenna.The project here provides a detailed study of how to design a probe-fed Square Micro-strip Patch Antenna using HFSS, v11.0 software and study the effect of antenna dimensions Length (L), and substrate parameters relative Dielectric constant (εr), substrate thickness (t) on the Radiation parameters of Bandwidth and Beam-width.
Optical fiber communication involves transmitting light through thin glass or plastic fibers to carry information. Light is modulated to encode information and travels through the fiber's core via total internal reflection. At the receiver, the light is converted back to an electrical signal. Optical fibers allow much higher bandwidth than traditional copper cables and are immune to electromagnetic interference. Their small size and weight make them useful for long-distance telecommunications and high-speed networking.
A comprehensive study on wearable textile antenna.
textile antennas are those which uses textile materials as substrate. It is flexible and widely used for wireless body area network applications.
Electromagnetic Interference and Electromagnetic Compatibility (EMI/EMCAishwary Singh
• Characterizing the threat
• Setting standards for emission and susceptibility levels
• Testing of Equipment on heavy Vibrations
• Testing for standards compliance
For queries,
Aishwarya
palsinghaishwarya@gmail.com
The document discusses concepts of antenna arrays and their applications. It provides an overview of antenna arrays, including their need, types, parameters that influence their radiation patterns, and applications. The key points are:
1) An antenna array consists of multiple antenna elements arranged to form a single antenna with controllable radiation patterns. This allows for increased directivity, narrower beams, and electronic beam steering.
2) Common array types include linear, circular, and planar arrays. Parameters like element spacing, excitation amplitudes and phases shape the overall radiation pattern.
3) Applications of antenna arrays include radar systems, wireless communications, and radio astronomy due to their ability to focus signals in desired directions without mechanical movement.
The document discusses different types of antennas and their properties. It describes how antennas convert radio frequency energy into electromagnetic waves and how their physical size relates to wavelength. It then summarizes the main types of antennas including directional antennas like Yagi, panel and parabolic, and omni-directional antennas. It provides examples of common antenna radiation patterns and discusses concepts like polarization, reflector optics, aperture efficiency, and Cassegrain feeds.
This document provides an overview of electromagnetic compatibility (EMC) testing, including conducted emission (CE), radiated emission (RE), conducted susceptibility (CS), and radiated susceptibility (RS) tests. It discusses the relevant standards for different types of equipment under test (EUT) and applications. Key aspects covered include test setup requirements, equipment used like EMI receivers, antennas, anechoic chambers, line impedance stabilization networks (LISNs), and turntables. The document also provides examples of EMC test equipment like antennas and absorber materials. Overall, it introduces the basic concepts and requirements for pre-compliance EMC testing.
This document provides an overview of microstrip patch antennas, also known as patch antennas. It defines patch antennas as consisting of a metal patch on top of a grounded dielectric substrate, which are useful at microwave frequencies above 1 GHz. The document discusses the geometry, advantages, disadvantages, feeding techniques, basic properties including resonance frequency and bandwidth, radiation pattern, and applications of microstrip patch antennas. The main applications mentioned are in mobiles, satellites, GPS, WiMAX, medical devices, and radar.
Underwater optical communication is a promising alternative to acoustic methods for underwater wireless communication. Radio waves do not propagate well underwater, so optical methods using lasers and LEDs can provide line-of-sight transmission of data, video and signals for vehicle control. Several factors influence the performance of underwater optical links, including absorption and scattering by water constituents like phytoplankton and dissolved organic matter, as well as scattering from suspended particles.
Wireless communication transmits voice and data using electromagnetic waves without physical connections like wires. It provides freedom of movement and flexibility to connect multiple devices. Common wireless technologies include radio, TV, Bluetooth, WiFi, and cellular networks. Wireless communication faces challenges like security issues, infrastructure costs, and signal interference, but enables connectivity anywhere through standards like LTE and 5G.
This document discusses various types of antennas and antenna arrays. It begins by describing common antenna types including helical antennas, horn antennas, and parabolic reflector antennas. It then discusses how antenna arrays work, noting that they are composed of multiple similar radiating elements whose spacing and excitation determine the array's properties. Examples of linear and 2D arrays are provided. The document also summarizes different array configurations and beamforming techniques as well as applications such as smart antennas and adaptive arrays. Key benefits of arrays like controlling radiation patterns electronically are highlighted.
Optical fibers experience various intrinsic and extrinsic losses that limit signal strength over long distances. Intrinsic losses include material absorption and scattering due to fiber imperfections. Absorption is caused by molecular vibrations and impurities, while scattering results from refractive index fluctuations. Extrinsic losses include bending, launching, and connector losses. Bending losses occur from macroscopic or microscopic bends, launching losses are from imperfect coupling into the fiber, and connector losses are due to core misalignments between joined fibers. Together these losses contribute to the overall attenuation of signals transmitted through optical fibers.
The document discusses EMC compliance rules and regulations for electronic products. It covers various safety, energy efficiency, environmental and EMI/EMC standards that products must comply with for different regions. It emphasizes the importance of considering compliance early in the design process to incorporate necessary design features and allow for testing and modifications before final release. Regulations are constantly changing so keeping updated is important.
Design of Low Cost Line Impedance Stabilization Network Using RLC Components ...IRJET Journal
This document describes the design of a low-cost line impedance stabilization network (LISN) using RLC components to test information technology equipment according to CISPR-22 standards. It first provides background on electromagnetic compatibility standards and the purpose of a LISN. It then details the design process, including using low-pass and band-pass filters with specific cutoff frequencies to stabilize input impedance and filter noise. Simulation results using ADS software show the designed LISN provides good impedance matching at low cost.
Vernon Govender is a senior EMC engineer with 20 years experience in radio frequency interference testing. He is currently studying for a Master's degree in radio frequency interference. The presentation discusses electromagnetic compatibility (EMC) testing and standards, methods for EMC testing including radiated and conducted emissions tests, and examples of commercial and military vehicle testing. It also covers topics like human exposure to radio frequencies, effects on nature, identifying sources of measurement uncertainty, and reducing measurement instrument uncertainty.
The document is an accreditation certificate from A2LA (American Association for Laboratory Accreditation) that:
1) Accredits ETS Product Service (HK) Co., Ltd. in Kowloon, Hong Kong for technical competence in electrical testing according to the ISO/IEC 17025 standard.
2) Lists the specific electromagnetic compatibility, radio equipment, digital cellular telecommunications, and electrical safety tests that the laboratory is accredited to perform.
3) States the accreditation is valid until September 30, 2008.
This document discusses and compares international and North American electrical standards. It provides an overview of standards organizations like IEC, UL, and ANSI and their respective standards. Key points covered include test sequences defined in standards like IEC 947-2, UL 489, and ANSI C37-50. The document also outlines requirements for circuit breakers, like short circuit and overload testing, and notes both standards ensure safety while allowing for different cultural and historical approaches.
This document discusses and compares international and North American electrical standards. It provides an overview of standards organizations like IEC, UL, and ANSI and their respective standards. Key points covered include test sequences defined in standards like IEC 947-2, UL 489, and ANSI C37-50. The document also outlines requirements for circuit breakers, like short circuit and overload testing, and notes both standards ensure safety while allowing for different cultural and historical approaches.
The document describes the testing and certification services provided by KONČAR Institute for accredited testing and laboratory services. It summarizes the various EU directives and standards they can test for, including electromagnetic compatibility, low voltage, environmental, radio equipment, gas appliances, and more. The institute aims to provide high quality, cost-effective services with short response times and turnarounds utilizing their expertise and single test location.
BACL is an independent testing laboratory established in 1996 in California with over 2000 employees operating 10 laboratories worldwide. It is accredited to ISO 17025 and ISO 17065 standards and designated by various government bodies to test for compliance with standards. BACL provides testing services for telecom, wireless, EMC, safety, lighting, medical and various other products. It has expertise in testing for standards in North America, Europe, Asia and can help clients achieve global certifications and approvals.
This engineering project proposal outlines the design of an advanced signal disrupting device with LCD display. The device aims to block wireless signals like radio frequencies and GSM signals within its range, displaying its status on an LCD screen. It will consist of RF, IF, and power supply circuits along with an integrated antenna. The objectives are to integrate an LCD and construct a circuit that can block modulated signals by creating interference. This device could be used for security in places requiring wireless signal blocking like meetings. The proposal describes the methodology, justification, expected outcomes, safety considerations, and planned timeline for the project.
This document provides an overview of EMC design fundamentals. It discusses the importance of EMC compliance and problems with non-compliance. Key concepts such as electromagnetic interference, electromagnetic compatibility, and coupling paths are defined. Common EMC standards from organizations like the FCC, military, and EU are summarized. The document outlines EMC design methodology, including topics like shielding, layout and partitioning, power distribution, and signal distribution. It also briefly discusses the EMC design process and provides references.
EV CHARGING CABLE – STANDARDS, TESTING, AND CERTIFICATIONiQHub
The presentation discusses electric vehicle charging cables, including an overview of standards, testing, certification and market drivers. It covers common cable failures, types of cable testing in areas like fire, chemicals and electricity, and the cable supply chain and certification process. It provides a case study of a certified electric vehicle charging cable from Doncaster Cables. The presentation aims to provide guidance on ensuring high quality, compliant cables for electric vehicle charging infrastructure.
Practical EMC and EMI Control for Engineers and TechniciansLiving Online
This workshop focuses on the issues of interest to you if you are working in design, operation or maintenance of analog or digital systems involving sensors, data acquisition, process control, cables, signal processing, programmable logic controllers, power distribution, high speed logic etc. The circuit board layout section concentrates on design and layout of circuits and components on a printed circuit board. The overall focus is on useful design and systems issues; not about regulations and standards. The idea is that you will take this material back with you to your work and apply the key principles immediately to your design and troubleshooting challenges.
WHO SHOULD ATTEND?
Electrical and electronic engineers and technicians
Engineers and technicians involved in the design and manufacture of electrical and electronic equipment which produce electromagnetic disturbances and may be susceptible to electromagnetic interference
Engineers and technicians involved with the maintenance and service of electrical and electronic equipment
Instrumentation and control engineers and technicians
Those that need to ensure that goods conform to the required standards
Those involved in the marketing and sale of goods that need to comply with the required standards
MORE INFORMATION: http://www.idc-online.com/content/practical-emc-and-emi-control-engineers-and-technicians-2
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CE Certification and EMC Requirements
The document summarizes various aspects of electric vehicle charging standards and methodologies. It provides tables that classify electric vehicle charging systems based on location of use, mounting structure, protection against electric shock, and environmental condition. It also lists existing charging guns and their specifications, international standards and their applications, Indian standards from BIS, and major charging methodologies including CCS, CHAdeMO, GB/T, and BEVC.
The document discusses product liability and safety factors that manufacturers must consider. It notes that manufacturers are responsible for any damages or injuries caused by their products. Documentation of product safety testing is important for insurance. Standards organizations like the British Standards Institution and European Committee for Standardization provide safety standards for manufacturers. The CE marking is required for products sold in the European Union and signifies the product meets EU health, safety, and environmental standards. The Recreational Craft Directive establishes design and construction standards for boats and watercraft sold in the EU.
This document discusses ESD protection technology for power ICs. It begins with an introduction to ESD and ESD failure models. It then covers ESD protection design considerations for power ICs, including high voltage ESD device solutions, ESD circuit solutions, whole chip ESD protection circuit design, and low voltage ESD device solutions. The document also discusses ESD protection design flow and analysis methods like TLP testing. It concludes by addressing emerging ESD protection technology issues related to shrinking design windows, high voltage and low voltage ICs, and system-level ESD stresses.
This document provides an overview of electromagnetic compatibility (EMC) regulatory requirements in major regions around the world. It discusses how EMC compliance has evolved over time and identifies the authorities with jurisdiction over EMC in countries in the Americas, Europe, and Asia. For each region, it summarizes the applicable EMC standards, approval procedures, testing requirements, and any mutual recognition agreements. The document is intended to help engineers understand the challenges of achieving EMC regulatory compliance in global markets.
This document contains summaries of chapters from the book "Computer Networks" by Andrew Tanenbaum and David Wetherall. It discusses topics related to computer networks and the application layer, including the Domain Name System (DNS), electronic mail, the World Wide Web, streaming audio and video. For each topic, it provides brief explanations and examples to illustrate key concepts from the text.
The document discusses Transcutaneous Electrical Nerve Stimulation (TENS). TENS uses electrical impulses from a battery-powered pulse generator attached to electrode-tipped wires placed on the skin over painful areas. This electrical stimulation blocks pain signals from reaching the brain through the Gate Control Theory and by stimulating the release of natural pain-blocking endorphins. TENS machines have adjustable settings to control intensity, pulse duration and frequency in order to effectively relieve pain through electrical stimulation of nerve pathways.
The document discusses Transcutaneous Electrical Nerve Stimulation (TENS). TENS uses electrical impulses from a battery-powered device called a TENS unit to relieve pain. Electrodes attached to the skin deliver mild electric pulses that interfere with pain signals traveling to the brain. The TENS unit can be adjusted to control pulse intensity, duration and frequency. TENS is a non-invasive way to reduce pain without side effects of medications.
The document discusses Transcutaneous Electrical Nerve Stimulation (TENS). TENS uses electrical impulses from a battery-powered device called a TENS unit to relieve pain. Electrodes attached to the skin deliver mild electric pulses that interfere with pain signals traveling to the brain. The TENS unit can be adjusted to control pulse intensity, duration and frequency. TENS is a non-invasive way to reduce pain without side effects of medications.
The review meeting covered responsibilities in the hostel since February 2016 along with the hostel superintendent. Key responsibilities included facility creation and maintenance, handling disciplinary issues, sanctioning leaves, collecting fees, and holding meetings. Facilities created included Wi-Fi, a system with printer, and a television. Two major disciplinary issues involved possession of mobile phones and using laptops without permission. Fees were collected from students in different years. Hostel day was held in March 2016 and April 2017 with chief guests from local hospitals and the college. Areas for improvement included water facilities and managing electronic gadget usage.
The review meeting covered responsibilities in the hostel since February 2016 along with the hostel superintendent. Key responsibilities included facility creation and maintenance, handling disciplinary issues, sanctioning leaves, collecting fees, and holding meetings. Facilities created included Wi-Fi, a system with printer, and a television. Two major disciplinary issues addressed were possession of mobile phones and using laptops without permission. Fees collected were detailed by academic year. Hostel day was held in March 2016 and April 2017 with notable chief guests. Areas for improvement included water facilities and regulating electronic gadget usage.
The document proposes a real-time smart epilepsy detection and alert system using IoT. It aims to help epilepsy patients avoid unpredictable violent seizures caused by sudden falling. The proposed system uses a heart rate sensor and MEMS accelerometer sensor to detect epileptic conditions. When a seizure is detected, an alarm is sounded and alerts are sent via messages to caregivers and doctors with the patient's location and details. The low-cost wearable device is designed to allow epilepsy patients to lead safer, more independent lives and receive quick help during seizures.
This document provides an overview of radiation health and safety concepts for dental assistants. It discusses the discovery of x-rays, atomic structure, how dental x-rays are produced, and the components and operation of dental x-ray machines. The key points are that radiation has the potential to damage living tissues, dental assistants must understand radiation fundamentals to minimize patient and operator exposure, and dental x-rays are produced via the acceleration of electrons in an x-ray tube.
This document provides information on a presentation for the subject "Electromagnetic Interference and Compatibility" including the course syllabus, outcomes, assessment plan, and details on additional content beyond the syllabus. The syllabus is divided into 5 units covering EMI/EMC concepts, coupling principles, control methods, design for circuits and PCBs, and measurements and standards. The course outcomes are to identify interference types and mechanisms, propose mitigation techniques, and describe EMC standards and measurement methods. Assessment includes exams, assignments, projects, and a practical exam. Additional content involves a case study on health effects of electromagnetic radiation from mobile towers.
1) Optical fiber detectors include PIN photodiodes, avalanche photodiodes (APDs), and metal-semiconductor-metal (MSM) detectors.
2) PIN photodiodes have high bandwidth but lower sensitivity compared to APDs. APDs have higher sensitivity due to internal gain but lower bandwidth.
3) Key detector characteristics include responsivity, quantum efficiency, bandwidth, dark current, and signal-to-noise ratio (SNR). These characteristics involve tradeoffs and are optimized depending on the application requirements.
This document provides information on a course titled "Electromagnetic Interference and Compatibility". It includes 5 units that will be covered: EMI/EMC concepts; EMI coupling principles; EMI control; EMC design for circuits and PCBs; and EMI measurements and standards. Students will learn to identify types and mechanisms of electromagnetic interference, propose EMI mitigation techniques, and describe EMC standards and measurement methods. Assessment methods include exams, assignments, projects, and a presentation on the effects of electromagnetic radiation on human health and the environment. The target pass percentages for this course are 94% for 2021-2022 and 95% for 2022-2023.
This document provides information on mapping course outcomes (COs), program outcomes (POs) and program specific outcomes (PSOs) for the subject Digital Electronics.
It begins with listing the 12 POs that engineering graduates are expected to achieve. It then provides the 3 PEOs and 3 PSOs for the Electronics and Communication Engineering program.
The document maps the 5 COs of the Digital Electronics course to the 12 POs and 3 PSOs, showing the level of contribution of each CO to achieving the outcomes. It also provides a course-PO matrix and course-PSO matrix to summarize this mapping.
The document further provides details of the assessment plan, including the assessment tools to be
Bio potential electrodes are transducers that convert ionic currents in the body into electronic currents that can be measured by electronic equipment. They provide an interface between the body and measuring devices. At the electrode-electrolyte interface, ions carry current in the body while electrons carry current in the electrode. Electrodes change ionic current into electronic current to allow for measurement. Motion artifacts can occur when electrodes are disturbed, but can be reduced by using non-polarizable electrodes like silver-silver chloride electrodes.
Common ground impedance coupling occurs when currents from two different circuits flow through a shared impedance such as a ground wire. Currents also flow in common mode through cables with all currents moving in the same direction on each wire, and these common mode currents are often unrelated to the signal currents. Common mode and ground loop coupling can introduce electromagnetic interference.
This document discusses electromagnetic interference (EMI) and electromagnetic compatibility (EMC). It defines EMI as an electromagnetic disturbance that can degrade or cause malfunctions in electronic equipment. EMC is described as a state where devices function satisfactorily in a common electromagnetic environment without introducing intolerable interference to other systems. The primary mechanisms of EMI transmission are radiation and conduction from the source to the receptor. The document also outlines different types of EMI based on causes, duration, and bandwidth, and lists some effects of radiation on the human body.
This document discusses electromagnetic interference (EMI) and compatibility standards. It explains that EMI standards are needed to ensure trouble-free coexistence between electrical systems and compatibility between different systems. There are two types of standards: military standards, which ensure compatibility in real-time military environments and are more stringent than civilian standards, and civilian standards, which apply to commercial, industrial, and domestic equipment and specify emission limits to protect broadcast services from interference. The document outlines some advantages of EMI standards, including increased compatibility, reliability, and product life.
This document discusses electromagnetic compatibility (EMC) issues in semiconductor manufacturing facilities. It addresses electromagnetic interference (EMI) sources like electrostatic discharge events and mobile phones. It also covers EMI propagation through radiation, conduction, and grounding systems. Maintaining EMC requires managing EMI sources, propagation paths, and equipment susceptibility through comprehensive facility design. The SEMI E33 standard provides guidelines for equipment EMC in semiconductor fabs.
This document discusses biopotential amplifiers used in medical instrumentation to measure weak bioelectric signals such as electrocardiograms (ECGs). It includes figures illustrating cardiac vector loops, lead connections, sources of noise and interference, circuit diagrams for amplifier designs, and applications like fetal monitoring. Protection circuits and filtering techniques are presented to improve signal quality and reduce noise from sources like power lines and muscle activity.
The document discusses biopotential electrodes and how they are used to detect electrical signals in the body. It explains that electrodes must form an interface with body tissues or fluids to detect signals, but this interface can cause issues if ions or electrons cannot freely cross. It also discusses different types of electrodes like surface electrodes, depth electrodes, and needle electrodes and how they interface with the body. The half-cell potential, polarization, equivalent circuit models, and sources of noise are also summarized.
Biopotential electrodes function by allowing ion exchange between a metal electrode and electrolyte solution, without actual electron flow across the interface. When a current flows, the electrode's half-cell voltage changes due to overpotentials from activation, concentration changes in the double layer, and ohmic voltage drops. Perfectly polarizable electrodes like platinum allow only displacement current, while perfectly nonpolarizable electrodes like silver/silver chloride allow free current flow with no overpotential. The electrical behavior of electrode-electrolyte interfaces can be modeled using equivalent circuits.
Introduction- e - waste – definition - sources of e-waste– hazardous substances in e-waste - effects of e-waste on environment and human health- need for e-waste management– e-waste handling rules - waste minimization techniques for managing e-waste – recycling of e-waste - disposal treatment methods of e- waste – mechanism of extraction of precious metal from leaching solution-global Scenario of E-waste – E-waste in India- case studies.
CHINA’S GEO-ECONOMIC OUTREACH IN CENTRAL ASIAN COUNTRIES AND FUTURE PROSPECTjpsjournal1
The rivalry between prominent international actors for dominance over Central Asia's hydrocarbon
reserves and the ancient silk trade route, along with China's diplomatic endeavours in the area, has been
referred to as the "New Great Game." This research centres on the power struggle, considering
geopolitical, geostrategic, and geoeconomic variables. Topics including trade, political hegemony, oil
politics, and conventional and nontraditional security are all explored and explained by the researcher.
Using Mackinder's Heartland, Spykman Rimland, and Hegemonic Stability theories, examines China's role
in Central Asia. This study adheres to the empirical epistemological method and has taken care of
objectivity. This study analyze primary and secondary research documents critically to elaborate role of
china’s geo economic outreach in central Asian countries and its future prospect. China is thriving in trade,
pipeline politics, and winning states, according to this study, thanks to important instruments like the
Shanghai Cooperation Organisation and the Belt and Road Economic Initiative. According to this study,
China is seeing significant success in commerce, pipeline politics, and gaining influence on other
governments. This success may be attributed to the effective utilisation of key tools such as the Shanghai
Cooperation Organisation and the Belt and Road Economic Initiative.
We have compiled the most important slides from each speaker's presentation. This year’s compilation, available for free, captures the key insights and contributions shared during the DfMAy 2024 conference.
Low power architecture of logic gates using adiabatic techniquesnooriasukmaningtyas
The growing significance of portable systems to limit power consumption in ultra-large-scale-integration chips of very high density, has recently led to rapid and inventive progresses in low-power design. The most effective technique is adiabatic logic circuit design in energy-efficient hardware. This paper presents two adiabatic approaches for the design of low power circuits, modified positive feedback adiabatic logic (modified PFAL) and the other is direct current diode based positive feedback adiabatic logic (DC-DB PFAL). Logic gates are the preliminary components in any digital circuit design. By improving the performance of basic gates, one can improvise the whole system performance. In this paper proposed circuit design of the low power architecture of OR/NOR, AND/NAND, and XOR/XNOR gates are presented using the said approaches and their results are analyzed for powerdissipation, delay, power-delay-product and rise time and compared with the other adiabatic techniques along with the conventional complementary metal oxide semiconductor (CMOS) designs reported in the literature. It has been found that the designs with DC-DB PFAL technique outperform with the percentage improvement of 65% for NOR gate and 7% for NAND gate and 34% for XNOR gate over the modified PFAL techniques at 10 MHz respectively.
A review on techniques and modelling methodologies used for checking electrom...nooriasukmaningtyas
The proper function of the integrated circuit (IC) in an inhibiting electromagnetic environment has always been a serious concern throughout the decades of revolution in the world of electronics, from disjunct devices to today’s integrated circuit technology, where billions of transistors are combined on a single chip. The automotive industry and smart vehicles in particular, are confronting design issues such as being prone to electromagnetic interference (EMI). Electronic control devices calculate incorrect outputs because of EMI and sensors give misleading values which can prove fatal in case of automotives. In this paper, the authors have non exhaustively tried to review research work concerned with the investigation of EMI in ICs and prediction of this EMI using various modelling methodologies and measurement setups.
Presentation of IEEE Slovenia CIS (Computational Intelligence Society) Chapte...University of Maribor
Slides from talk presenting:
Aleš Zamuda: Presentation of IEEE Slovenia CIS (Computational Intelligence Society) Chapter and Networking.
Presentation at IcETRAN 2024 session:
"Inter-Society Networking Panel GRSS/MTT-S/CIS
Panel Session: Promoting Connection and Cooperation"
IEEE Slovenia GRSS
IEEE Serbia and Montenegro MTT-S
IEEE Slovenia CIS
11TH INTERNATIONAL CONFERENCE ON ELECTRICAL, ELECTRONIC AND COMPUTING ENGINEERING
3-6 June 2024, Niš, Serbia
Harnessing WebAssembly for Real-time Stateless Streaming PipelinesChristina Lin
Traditionally, dealing with real-time data pipelines has involved significant overhead, even for straightforward tasks like data transformation or masking. However, in this talk, we’ll venture into the dynamic realm of WebAssembly (WASM) and discover how it can revolutionize the creation of stateless streaming pipelines within a Kafka (Redpanda) broker. These pipelines are adept at managing low-latency, high-data-volume scenarios.
Advanced control scheme of doubly fed induction generator for wind turbine us...IJECEIAES
This paper describes a speed control device for generating electrical energy on an electricity network based on the doubly fed induction generator (DFIG) used for wind power conversion systems. At first, a double-fed induction generator model was constructed. A control law is formulated to govern the flow of energy between the stator of a DFIG and the energy network using three types of controllers: proportional integral (PI), sliding mode controller (SMC) and second order sliding mode controller (SOSMC). Their different results in terms of power reference tracking, reaction to unexpected speed fluctuations, sensitivity to perturbations, and resilience against machine parameter alterations are compared. MATLAB/Simulink was used to conduct the simulations for the preceding study. Multiple simulations have shown very satisfying results, and the investigations demonstrate the efficacy and power-enhancing capabilities of the suggested control system.
1. ST.JOSEPH’S COLLEGE OF
ENGINEERING & TECHNOLOGY
Thanjavur
Course Code: EC8072
NBA Course No: C409-PEIV 1
Course Name: ELECTROMAGNETIC INTERFERENCE &
COMPATIBILITY
Year / Sem / Branch / Sec: IV/ VIII/ ECE
Regulation: R2017
UNIT V
EMIC MEASUREMENTS & STANDARDS
Prepared by,
N.Srividhya, AP / ECE
2. SYLLABUS
UNIT V
EMI MEASUREMENTS AND STANDARDS 9
Open area test site; TEM cell; EMI test shielded chamber and
shielded ferrite lined anechoic chamber; Line impedance
stabilization networks; EMI Rx and spectrum analyzer; Civilian
standards - CISPR, FCC, IEC, EN; Military standards-
MIL461E/462.
UNIT V-EMIC MEASUREMENTS &
STANDARDS
2
13 November 2022
3. UNIT V
EMI MEASUREMENTS AND STANDARDS
OBJECTIVE:
To explain the existing
standards for
Electromagnetic
Compatibility.
OUTCOME:
Describe the various EMC
Standards and methods to
measure them.
13 November 2022
UNIT V-EMIC MEASUREMENTS &
STANDARDS
3
4. Framing of COs
COs CO STATEMENTS LEVELS
C409-PEIV1.5
To relate the methods to measure the electromagnetic
interference.
Analyze
Level 4
C409-PEIV1.6 To recognize the various EMC standards.
Knowledge
Level 1
UNIT V-EMIC MEASUREMENTS &
STANDARDS
4
13 November 2022
6. 2
EMC Definition
EMC : EMC is defined as the ability of electronic and communication equipment
to be able to operate satisfactorily in the presence of interference and not be a
source of interference to nearby equipment.
13 November 2022
UNIT V-EMIC MEASUREMENTS &
STANDARDS
8. The Changes of EM Environment
4
ICT convergence : High speed/quality/definition, wireless
Smart grid technology, new and renewable energy development
Electric vehicles
Energy efficiency, mobility, portability
Automatic, social safety and security, intelligent public transportation
infrastructure
Aerospace & avionics, ships advance
Technology
Innovation
Changes of
EM Environment
To be required the development of new EMC (testing) technologies in
electromagnetic environment
13 November 2022
UNIT V-EMIC MEASUREMENTS &
STANDARDS
9. EMC Problems
5
Brazil rocket explosion
Alcantara launch center
killing 21 people,
injuring 20 more
2003
Aircraft carrier explosion
USS Forrestal Disaster, Vietnam
July 29, 1967
13 November 2022
UNIT V-EMIC MEASUREMENTS &
STANDARDS
10. EMC Controls
• The control of electromagnetic interference (EMI) and
assurance of EMC comprises a series of related disciplines:
– Characterizing the threat.
– Setting standards for emission and susceptibility levels.
– Design for standards compliance.
– Testing for standards compliance.
• Characterization of the problem requires understanding of:
– The interference source and signal.
– The coupling path to the victim.
– The nature of the victim both electrically and in terms of the
significance of malfunction.
6
13 November 2022
UNIT V-EMIC MEASUREMENTS &
STANDARDS
11. EMC Tests for the Compliance
7
Needs testing about
1) Intra-system EMC for stable operation, performance & quality
2) inter-system EMC for the protection of radio service (Radio law) and the
safety from danger regulation & certificate
EMC
Electromagnetic Compatibility
EMI
Electromagnetic Interference
CE (IEC/CISPR)
Conducted Emission
∙ Voltage
∙ Current
RS (IEC/TC77, ISO)
Radiated Susceptibility
∙ Magnetic Fields
∙ Electric Fields
CE (IEC/TC77, ISO)
Conducted Susceptibility
∙ HF/LF
∙ Surge, EFT Burst
∙ ESD
RE (IEC/CISPR)
Radiated Emission
∙ Magnetic Fields
∙ Electric Fields
∙ Conducted Power
Disturbance
EMS
Electromagnetic Susceptibility
13 November 2022
UNIT V-EMIC MEASUREMENTS &
STANDARDS
12. Technical Standards for EMC(1)
8
Basic Standard
- Basic standards for the measurement of radio disturbance in the frequency range
9kHz - 18GHz
ex: CISPR 16 Series, IEC/EN/K 61000-4 Series for ESD, RS/CS, Surge, EFT burst tests
Generic Standard
- Generic standards – Immunity(EMS) and emission(EMI)
for residential, commercial and light-industrial environments
ex: IEC/EN/K 61000-6-1 & IEC/EN/K 61000-6-2 for EMS
IEC/EN/K 61000-6-3 & IEC/EN/K 61000-6-4 for EMI
13 November 2022
UNIT V-EMIC MEASUREMENTS &
STANDARDS
13. Technical Standards for EMC(2)
9
Product Family Standard
ex: CISPR 11(ISM), CISPR 12(vehicles, boats, combustion engine), CISPR 13(EMI for broadcasting
receiver), CISPR 14-1(EMI for home appliances), CISPR 14-2(EMS for home appliances),
CISPR 15(lightening equipment), CISPR 2013(EMS for broadcasting receiver), CISPR 22(EMI for
ITE), CISPR 24(EMS for ITE), CISPR 25(vehicles, boats, combustion engine),
CISPR 32 and CISPR 35(multimedia), etc.
Product Standard
ex: IEC 60945(Maritime Navigation and Radiocommunication Equipment and Systems) ,
IEC 60533(Electrical and electronics installation in ships),
IEC 61326(Electrical equipment for measurement, control and laboratory use),
IEC 61131-2(Programmable controllers ), IEC 61204-3(Low voltage power supplies), etc.
13 November 2022
UNIT V-EMIC MEASUREMENTS &
STANDARDS
15. EMC Regulation in the World
• US
– The body responsible for regulation of EMC emissions in the USA is the
Federal Communications Commission (FCC). The specific regulations are
Part 15 (Radio Frequency Devices) and Part 18 (Industrial, Scientific and
Medical Equipment) for the FCC marking.
• EU
– For the majority of electrical and electronic products, EMC requirements
in the European Union are covered by the EMC Directive (2004/108/EC)
for the CE marking
• Japan
– The body responsible for EMC emissions in Japan is the VCCI. Products
must comply with CISPR 22. Equipment intended for the domestic
environment must comply with the Class B requirements, while other
equipment should satisfy the Class A requirements
– These requirements are not mandatory regulations.
11
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UNIT V-EMIC MEASUREMENTS &
STANDARDS
16. Korea Standard Development System for EMC
12
Standard
Draft Version
Contribute
KCS
Establishing KCS
TTA Standard
(TTAS)
Establishing KS
KS Standards
Sale Requesting
KS
Standards
EMC Technical Regulation Body
RRA is the National
Committee in EMC
Field for CISPR
13 November 2022
UNIT V-EMIC MEASUREMENTS &
STANDARDS
17. Korea Conformity Assessment System
13
Conformity Certification (Radio Waves Act Article 58-2.2)
Conformity Registration(Radio Waves Act Article 58-2.3)
Technical Regulation : Radio and Telecommunication, SAR, EMC (Low voltage damage)
Technical Regulation : EMC (Low voltage damage)
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UNIT V-EMIC MEASUREMENTS &
STANDARDS
18. EMC Regulation in Korea
• Products Covered
– In accordance with the regulations of the South Korean KCC, the following products are
covered by the requirements for EMC certification:
• High Frequency equipment for industrial, scientific and medical use
• Automobiles and equipment powered by spark ignition engines
• Radio receiver equipment
• Domestic electrical appliances and electrical power tools
• Fluorescent lighting equipment
• High voltage equipment and accessories
• Information technology equipment
• Any other equipment
• Test Standards
– Products must comply with the appropriate South Korean standards, which are based on,
but not necessarily identical to, the appropriate CISPR standards.
14
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UNIT V-EMIC MEASUREMENTS &
STANDARDS
23. Semi Anechoic Chamber Information
19
General Information
Dimension : 20m(L) x 12m(W) x 8.5m(H)
Frequency Range : 30MHz ~ 18GHz
Site Attenuation (ANSI C63.4), NSA less than ±4dB
Site Attenuation (CISPR 13), CSA less than ±3dB
Site Validation (CISPR 16-1-4), SVSWR less than 6dB
Test Distance : 3m & 10m
Test Items
Radiated Emission
Conducted Emission
Standards
ANSI C63.4
CISPR 13
CISPR 16-1-4
Cost
USD 1.7 million(about)
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UNIT V-EMIC MEASUREMENTS &
STANDARDS
24. Typical EMC test facilities layout(Top view)
20
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UNIT V-EMIC MEASUREMENTS &
STANDARDS
25. EMC test facilities construction procedure(1)
21
1. Installation of steel structure 2. Installation of shield panel[Floor] 3. Installation of scaffold
4. Installation of shield panel
[Wall & Ceiling]
5. Installation of Door, Filter 6. Performance [SE Test]
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UNIT V-EMIC MEASUREMENTS &
STANDARDS
26. EMC test facilities construction procedure(2)
22
7. Installation of Ferrite Tile 8. Installation of Absorbers 9. Installation of Raised floor
10. Installation of Groundplane 11. Finishing; Floor, interior 12. Performance [NSA Test]
13 November 2022
UNIT V-EMIC MEASUREMENTS &
STANDARDS
27. Typical EMS RS Chamber
23
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UNIT V-EMIC MEASUREMENTS &
STANDARDS
28. EMS RS Chamber General Information
24
Cost
USD 430 thousand(about)
General Information
Test Items Standards
Dimension : 9m(L) x 6m(W) x 6m(H)
Frequency Range : 26MHz ~ 18GHz
Field Uniformity (IEC 61000-4-3)
: (0 ~ 6)dB, over 75% of a surface
Polarization : Vertical & Horizontal
Uniformity Plane : 1.5m x 1.5m
Height of the antenna : 1.55m
Test Distance : 3m
Radiated Susceptibility IEC 61000-4-3
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UNIT V-EMIC MEASUREMENTS &
STANDARDS
30. Typical Shield Rooms Information
26
Cost
USD 260 thousand(about)
General Information
Test Items Standards
Dimension : 10m(L) x 7.5m(W) x 3m(H)
Frequency Range : 14kHz ~ 18GHz
Shielding Effectiveness (IEEE 299)
: more than (60 ~ 100)dB
Measurement Point : Door, Filter, Ceiling, walls, and ventilator
Conducted Emission
Disturbance Power
ESD/EFT/Surge etc.
CISPR 14-1/13/22 etc.
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UNIT V-EMIC MEASUREMENTS &
STANDARDS
31. Typical Open-Area Test Sites(OATS)
27
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UNIT V-EMIC MEASUREMENTS &
STANDARDS
33. OATS Information
29
General Information
Frequency Range : 30MHz ~ 1GHz
Site Attenuation (ANSI C63.4), NSA less than ±4dB
Test Distance : 3m, 10m & 30m
Test Items
Radiated Emission
Standards
ANSI C63.4
Cost
USD 86 thousand(about)
13 November 2022
UNIT V-EMIC MEASUREMENTS &
STANDARDS
34. EMC Testing Instruments
30
EMI test Receiver
Oscilloscope
Spectrum Analyzer
Signal Generator
Network Analyzer
ESD Generator
EFT/Surge Generator
Above equipments are the most commonly used available for performing EMC measurements.
LISN
Antenna
13 November 2022
UNIT V-EMIC MEASUREMENTS &
STANDARDS
36. Test for Radiated Emission(RE)
• RE Test for EUT
• Frequency Range : 30MHz to 1GHz(Up to
18GHz)
• Standard : CISPR 11, 12, 13, 25, 22… (EN
550XX)
EEC 95/54, SAE J 1113-41
• Major Testing System (Refer to CISPR 16)
–Test Facility : OATS, ALSE, FAR, SAR
Open area test site or
alternate test (anechoic chamber)
32
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UNIT V-EMIC MEASUREMENTS &
STANDARDS
37. Limit of RE
33
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UNIT V-EMIC MEASUREMENTS &
STANDARDS
38. Test for Conducted Emission(CE)
• CE Measurement emitting from cable of EUT
• Frequency Range : 150kHz to 30MHz
• Standards : CISPR 11, 13, 14, 15, 25, 22.. (EN 550XX)
• Testing System (Refer to CISPR 16)
– Test Facility : Shielded Room or adequate ground planes
– Test Equipment : EMI Receiver, Spectrum Analyzer(Quasi-peak Average
detector available)
– Other : LISN, etc.
* LISN (Line Impedance Stabilization Network) :
to create a known impedance on power lines of electrical equipment
during electromagnetic interference testing. A LISN is typically designed to
allow for measurements of the electromagnetic interference existing on
the power line.
34
13 November 2022
UNIT V-EMIC MEASUREMENTS &
STANDARDS
39. Limit of CE
35
Conducted Disturbance
at the Mains Ports
* Decreasing Linearly with the Logarithm of the Frequency
- The lower limit shall apply at the transition frequencies.
- Telecommunication Ports 에 대한 Limit 는 고려중임.
0.15 ~ 0.5
0.5 ~ 5
5 ~ 30
79
73
73
66
60
60
Frequency
Range
MHz
Class A
Limits dB (uV)
Q.P Average
Class B
Limits dB (uV)
Q.P Average
66 ~ 56 *
56
60
56 ~ 46
46
50
Table 1 , 2
44
48
52
56
60
64
68
72
76
80
0.1 1 10 100
Disturbance Voltage Injected
into the Mains
Calss A (Q.P)
30
0.5 5
Calss A (Average)
Calss B (Q.P)
Calss B (Average)
79
73
66
46
50
dBuV
MHz
13 November 2022
UNIT V-EMIC MEASUREMENTS &
STANDARDS
40. Test for Radiated Susceptibility(RS)
• Radiated field susceptibility testing typically involves a high-
powered source of RF or EM pulse energy and a radiating
antenna to direct the energy at the potential victim or
device under test (DUT).
• Frequency Range : 80 MHz to 1000 MHz
• Test condition : 1-30 V/m (1 kHz CW, 80% AM) , 100 V/m
• Standards : IEC 61000-4-3 (EN 61000-4-3), ISO 11452-2
• Test Facility : FAR
– Test Equipment : Power Amplifier system, Antenna, Field Probe
Sensor, Signal Generator, Directional Coupler, power meter,
– Other : Test software, etc
36
13 November 2022
UNIT V-EMIC MEASUREMENTS &
STANDARDS
41. Test for Conducted Susceptibility(CS)
• Conducted voltage and current susceptibility testing typically
involves a high-powered signal or pulse generator, and a current
clamp or other type of transformer to inject the test signal
• Frequency Range : 150kHz to 80MHz
• Test Condition : 1-10V (1kHz CW, 80% AM)
• Standards : IEC 61000-4-6 (EN 61000-4-6), ISO 7637
• Test System
– Test Facility : Shield Room
– Test Equipment : Power Amplifier system, Signal Generator,
Directional Coupler, power meter, CDN, Current Clamp
– Other : Test software, etc
37
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UNIT V-EMIC MEASUREMENTS &
STANDARDS
42. Test for Electrostatic Discharge(ESD)
• ESD is a serious issue in solid state electronics, such as integrated
circuits. Integrated circuits are made from semiconductor materials
such as silicon and insulating materials such as silicon dioxide.
Either of these materials can suffer permanent damage when
subjected to high voltages; as a result, there are now a number of
antistatic devices that help prevent static build up.
• Test Condition(input voltage) : 8kV(Air Discharge), 4kV(Contact
Discharge), Max 25kV
• Standard : IEC 61000-4-2 (EN 61000-4-2), ISO 10605
• Test System
– Test Facility : Shield Room
– Test Equipment : ESD Simulator, Coupling Plane
– Other : Capacitors, Resistors, etc
38
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UNIT V-EMIC MEASUREMENTS &
STANDARDS
43. What i s a Spectrum Analyzer?
A spectrum analyzer measures the magnitude of an
input signal versus frequency within the full
frequency range of the instrument.
13 November 2022 UNIT V-EMIC MEASUREMENTS & STANDARDS 43
46. Analysis Domains
Time Domain (Oscilloscope)
• See what changes in time.
• If signal has many frequencies ,analysis
become difficult.
Frequency Domain (Spectrum analyzer)
• Each element of a complex signal can be
separated easily.
• Low-level distortion signals can be
detected.
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47. Analysis Domains
Modulation Domain (Modulation analyzer)
• See how frequency changes.
• Measures modulation accuracy
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51. Fourier Analyzer
• The Fourier analyzer basically takes a
time-domain signal, digitizes it using digital
sampling, and then performs the
mathematics required to convert it to the
frequency domain, and display the
resulting spectrum.
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52. Fourier Analyzer
• It is as if the analyzer is looking at the
entire frequency range at the same time
using parallel filters measuring
simultaneously.
• The Fourier analyzer is able to capture
periodic as well as random and transient
events.
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53. Fourier Analyzer
• However it does have its limitations,
particularly in the areas of frequency
range, sensitivity, and dynamic range.
• Fourier analyzers are becoming more
prevalent, as ADC converters and DSP
technologies advance.
• These analyzers can offer significant
performance improvements over
conventional spectrum analyzers, but
often with a price premium.
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54. A
f
f1
f2
Filter 'sweeps' over range
of interest
CRT shows full
spectral display
Swept Analyzer
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55. Swept Analyzer
• The most common type of spectrum
analyzer is the swept-tuned receiver,
displaying all the frequency components
present.
• The swept-tuned analyzer works just like
the AM radio in your home except that on
your radio, the dial controls the tuning and
instead of a display, your radio has a
speaker.
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57. Mixer
• The output frequencies that will be produced by the
mixer are the original input signals, plus the sum and
difference
frequencies of these two signals.
• It is the difference frequency that is of interest in the
spectrum analyzer.
• We call this signal the IF signal, or Intermediate
Frequency signal.
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58. IF F i l t e r
• The IF filter is a band pass filter which is used as
the "window" for detecting signals. It's bandwidth
is also called the resolution bandwidth (RBW) of
the analyzer and can be changed via the front
panel of the analyzer.
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59. Envelope Detector
• The analyzer must covert the IF signal to a baseband or
video signal so it can be digitized and then viewed on the
analyzer display. This is accomplished with an envelope
detector whose video output is then digitized with an
ADC.
• The digitized output of the ADC is then represented as
the signal’s amplitude on the Y-axis of the display. This
allows for several different detector modes of how the
signal is displayed.
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60. Video F i l t e r
• The video filter is a low-pass filter that is
located after the envelope detector and
before the ADC. This filter determines the
bandwidth of the video amplifier, and is
used to average or smooth the trace seen
on the screen.
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61. Other Components
• The local oscillator (LO) s a Voltage Controlled
Oscillator (VCO) which in effect tunes the
analyzer. The sweep generator actually tunes
the LO so that its frequency changes in
proportion to the ramp voltage.
• The RF attenuator attenuates the input signal to
a suitable mixer input level.
• The IF gain is used to adjust the vertical position
of signals on the display without affecting the
signal level at the input mixer.
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62. Theory o f Operation
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63. Theory o f Operation
• The signal to be analyzed is connected to
the input of the analyzer.
• This signal is then combined with the LO
through the mixer to convert it to an IF.
• These signals are then sent to the IF filter,
whose output is detected, indicating the
presence of a signal at the analyzer's
tuned frequency.
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64. Theory o f Operation
• The output voltage of the detector drives
the vertical axis (amplitude) of the LCD
display.
The sweep generator provides
synchronization between the horizontal
axis (frequency) and tuning of the LO.
• The resulting display shows amplitude
versus frequency of the spectral
components of each incoming signal.
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65. Specifications
1) what's the frequency range?
2)what's the amplitude range (maximum
input and sensitivity)?
3)to what level can I measure the
difference
between two signals, both in amplitude
(dynamic range) and frequency
(resolution)?
4)how accurate are my measurements once
I've made them?
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66. Frequency Range-
Resolution
• The range of frequencies that device
works on.
• Resolution is an important specification when
you are trying to measure signals that are close
together and want to be able to distinguish
them from each other.
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67. Sensiti v i t y
• One of the primary uses of a spectrum analyzer is to
search out and measure low-level signals.
• The sensitivity of any receiver is an indication of how
well it can measure small signals.
• A perfect receiver would add no additional noise to the
natural amount of thermal noise present in all electronic
systems.
• In practice, all receivers, including spectrum analyzers,
add some amount of internally generated noise.
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69. Dynamic Range
• Dynamic Range is defined as the maximum ratio of two
signal levels simultaneously present at the input which
can be measured to a specified accuracy. You can
imagine connecting two signals to the analyzer input -
one which is the maximum allowable level for the
analyzer's input range and the other which is much
smaller. The smaller one is
reduced in amplitude until it is no longer detectable by
the analyzer. When the smaller signal is just
measurable, the
ratio of the two signal levels (in dB) defines the dynamic
range of the analyzer.
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