Olympus and Given Imaging are leading intellectual property in the capsule endoscopy industry, but for how long? The global capsule endoscopy systems market is expected to show a significant growth with the rise in aging population who require much medical care. However, since 2009, the number of new patent applications are decreasing. As the industry matures, there’s less and less room for breakthrough innovation and fundamental patents that could shape the industry. In such conditions, we can expect an increase in patent cross-licensing agreements, acquisitions (e.g. Covidien acquisition of Given Imaging) and litigation between the industry players in the next few years. Capsule endoscopy is a medical procedure which has revolutionized endoscopy as it has enabled for the first time a painless inspection of the small intestine. The procedure was unveiled in 2000 and is based on a vitaminsize pill which captures images of the digestive tract while it is transported passively by peristalsis. The device consists of an image sensor, an illumination module, a radio-frequency transmitter and a battery. More information on that report at http://www.i-micronews.com/reports/Capsule-Endoscopy-Patent-Landscape-2014/4/458/

1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for theconsequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
1
ElectronicCosting & TechnologyExperts
www.systemplus.fr
21 rue la Nouë Bras de Fer
44200 Nantes –France
Phone : +33 (0) 240 180 916
email : info@systemplus.fr
August 2014 –Version 1 –Written by Elena Barbarini

2. Galaxy 5S Fingerprint Sensor
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
2
Glossary1. Overview / Introduction4
–Executive Summary
–Reverse Costing Methodology2. Company Profile8
–Validity/Synaptics
–Samsung3. Physical Analysis12
–Synthesis of the Physical Analysis
–Galaxy S5 Fingerprint button disassembly16
–Fingerprint Button Removal
–Fingerprint Button Assembly20
–Fingerprint Button Assembly Views
–Fingerprint Button View
–FingerprintSensor Disassembly
–Fingerprint Sensor Packaging25
–Package View & Dimensions
–Package Opening
–Package Cross-Section
–FingerprintSensor Patents
–Sensing PCB32
–Sensing PCB View & Dimensions
–SensingPCB Delayering
–SensingPCB Cross-Section
–SeningPCB Process Characteristics
–ASIC Die41
–ASIC Die View & Dimensions
–ASIC Die marking
–ASIC Die Delayering
–ASIC Die
–ASIC Die main Blocs
–ASIC Die Process
–ASIC Die Cross-Section
–ASIC Die Process Characteristic
–Flex PCB57
–Flex PCB View & Dimensions
–Flex PCB Cross-Section
–Flex PCB Process Characteristics4. Sensor Manufacturing Process 62
–ASIC Front-End Process
–ASIC Front-End Wafer Fabrication Unit
–Sensing PCB Fabrication Unit
–Synthesisof the main parts5. Cost Analysis67
–Synthesis of the cost analysis
–Main steps of economic analysis
–Yields Explanation
–Yields Hypotheses
–ASIC die72
–ASIC Front-End Cost
–ASICProbe Test, Thinning, Bumping & Dicing
–ASIC Wafer Cost
–ASIC Die Cost
–Sensing PCB Cost78
–Home Button Assembly 81
–Assembled Components Cost
–Synthesisof the assembling
–Home ButtonAssemblyCost
6. Samsung’s vs Apple’s fingerprint sensor 88
Contact

3. Galaxy 5S Fingerprint Sensor
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
3
•Thisfullreversecostingstudyhasbeenconductedtoprovideinsightontechnologydata, manufacturingcostandsellingpriceoftheSamsungGalaxyS5FingerprintSensorAssembly.
•ForthefirsttimeSamsungintegratesafingerprintsensorintheGalaxyproductline.TheFingerprintSensortechnologyhasbeendevelopedbyValidityInc.which,sinceNovember2013ispartofSynapticsInc.,worldleaderincapacitivesensinghumaninterfacesolutionsforconsumerelectronicscompanies.
•Samsung’stechnologicalchoiceforthefingerprintsensorgototheoppositedirectionthanApple’sone.Differencesonthecapacitivetechnology,onthemanufacturingandthepackagingmaterials, leadtoaspecificsupplychainandadevicewithsmallerfootprintandmanufacturingcost.
•Samsung’sfingerprintsensorPCBbasedtechnologyincludesmultipleconductiveelementswhicharesequentiallyexcitedbyshortelectronicwaveformburst.Swipingafingeracrossthegapsbetweentheconductiveelements,atwo-dimensionalimageofthefingerprintbasedoncapacitancesisgenerated.
•ThefingerprintsensoroftheGalaxyS5islocatedabovethehomebuttonandithasthedimensionof17.5x5.5mm.Thesensorisincorporatedwithinarectangularshapedhousingcomposedofanaluminumringandastainlesssteelbase.Thesensorisprotectedbyawhiteplasticcover.

4. Galaxy 5S Fingerprint Sensor
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
4
FingerprintButtonAssembly:
Electroniccomponentsassembly:Surface-mounteddevice(SMD)
FingerprintPCBsensor
FingerprintICsensor
ElectricalConnectionsandsupport:flexPCB,2metallayers
Protective cover
IC Sensor
Fingerprint PCB Sensor
FingerprintPCBSensor:
SensingPrinciple:capacitive
Process:
FR4,4metallayers,microvias
Placement:solderedtotheflexsubstrate.
Flex
PCB
Galaxy S5 Fingerprint sensor Assembly
FingerprintICSensor:
Process:
CMOS0.13μm1P8M
ElectricalConnection:copperpillars
Placement:flipchiptorigidPCB.
Stainless steel base

5. Galaxy 5S Fingerprint Sensor
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
5

6. Galaxy 5S Fingerprint Sensor
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
6

7. Galaxy 5S Fingerprint Sensor
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
7
Rigid PCB Cross-Section –SEM View

8. Galaxy 5S Fingerprint Sensor
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
8
•The die marking includes:
Ⓜ2008
© VAL004A8-T
Sensor Die Marking

9. Galaxy 5S Fingerprint Sensor
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
9
Sensor Die cross-section –SEM View

10. Galaxy 5S Fingerprint Sensor
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
10

11. Galaxy 5S Fingerprint Sensor
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
11
•WeperformtheeconomicanalysisoftheSensorICFront-End&Back-End0withtheICPrice+tool.
•WeperformtheeconomicanalysisoftheSensorrigidPCBwiththePCBPrice+tool.

12. Galaxy 5S Fingerprint Sensor
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
12

13. Galaxy 5S Fingerprint Sensor
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
13

14. Galaxy 5S Fingerprint Sensor
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
14

15. Galaxy 5S Fingerprint Sensor
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
15

16. Galaxy 5S Fingerprint Sensor
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved.
16
Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/-10% correction on the manufacturing cost (if all parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:
European& USA Office
•Yole Développement Headquarter, France:David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email: jourdan@yole.fr
JapanOffice
•For custom research: YutakaKatano, General Manager, Yole Japan& President, Yole K.K.
Phone: (81) 362 693 457 -Cell: (81) 80 3440 6466 -Fax: (81) 362 693 448 -Email: katano@yole.fr
•For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: onozawa@yole.fr
KoreaOffice
•HaileyYang, Business DevelopmentManager, Phone : (82) 2 2010 883 -Cell: (82) 10 4097 5810
-Fax: (82) 2 2010 8899 –Email: yang@yole.fr