Panel level packaging players are ready for high volume production.
More information on that report at https://www.i-micronews.com/report/product/status-of-panel-level-packaging-2018.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
Status of Panel-Level Packaging & Manufacturing 2015 Report by Yole Developpe...Yole Developpement
Which applications will drive panel platforms?
For more than four decades, the semiconductor industry has rigorously followed Moore’s Law in scaling down CMOS technologies. However, a huge investment in new lithography solutions is required to achieve advanced nodes in a range of 20 nm. Although some packaging platforms processed on wafer, i.e. SI interposer, exhibit good performance, high cost is still the main obstacle that limits its adoption for high-volume manufacturing.
The demand for lower cost with higher performance has driven the semiconductor industry to develop innovative solutions. One new approach to reducing overall cost is to switch from wafer to a larger-size panel format. Indeed, the panel infrastructure has attracted considerable interest from the semiconductor industry and is certainly a promising market due to its cost advantages and economy of scale benefits. Panel-level manufacturing has the potential to leverage the knowledge and infrastructure of wafer-level packaging (WLP) and the PCB/Flat-Panel Display/Photovoltaic industries....
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach $4.6B in 2020 at an impressive 16% CAGR.
What is driving the advanced packaging market in China?
China has the world’s largest population, and its economy will continue to grow at a high pace (more than 6%), reaching around $16T by 2020. Also, an increase in per capita income (more purchasing power) will ensure China remains a dominant market in the coming years. No business can afford to ignore China. China commands a significant market for key electronic products. In fact, over half of all key electronic products are consumed in China. In 2014, the Chinese smartphone, LCD, notebook/tablet, and wearable markets were around 81%, 63%, 71%, and 47% of the global market, respectively. The global IC market will grow by a CAGR of 4% from 2014 - 2020, while the Chinese IC market will grow by 7% over the same period. The Chinese IC market is expected to reach ~$149B by 2020, around 40% of the total IC market. There is a huge gap between China’s IC consumption and its manufacturing. In 2015, China produced only ~12.5% of the IC it consumes, and the gap between IC consumption and production is ~$91B. Currently, IC is China’s #1 import commodity, exceeding oil. China considers the IC industry to be a key strategic sector. The Chinese government is making a significant effort through funding and a national IC policy, with an aggressive growth strategy to make China an IC design and manufacturing hub. The goal by 2030 is to become the global leader in all primary IC industrial supply chain segments. This report gives an overview of China’s semiconductor ecosystem and discusses in detail the country’s advanced packaging market. This report will also describe China’s semiconductor outlook, prospects, market drivers, key players, and supply chain evolution. It will discuss at length the Chinese government’s approach to developing China’s IC industry, including details about different private funds, their objectives, and investments made to date. Overall, this report will help local and global players identify challenges and opportunities in the Chinese IC market and assist them in developing strategies to maximize their market share in China’s fast-growing IC ecosystem, particularly in advanced packaging.
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
Status of Panel-Level Packaging & Manufacturing 2015 Report by Yole Developpe...Yole Developpement
Which applications will drive panel platforms?
For more than four decades, the semiconductor industry has rigorously followed Moore’s Law in scaling down CMOS technologies. However, a huge investment in new lithography solutions is required to achieve advanced nodes in a range of 20 nm. Although some packaging platforms processed on wafer, i.e. SI interposer, exhibit good performance, high cost is still the main obstacle that limits its adoption for high-volume manufacturing.
The demand for lower cost with higher performance has driven the semiconductor industry to develop innovative solutions. One new approach to reducing overall cost is to switch from wafer to a larger-size panel format. Indeed, the panel infrastructure has attracted considerable interest from the semiconductor industry and is certainly a promising market due to its cost advantages and economy of scale benefits. Panel-level manufacturing has the potential to leverage the knowledge and infrastructure of wafer-level packaging (WLP) and the PCB/Flat-Panel Display/Photovoltaic industries....
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach $4.6B in 2020 at an impressive 16% CAGR.
What is driving the advanced packaging market in China?
China has the world’s largest population, and its economy will continue to grow at a high pace (more than 6%), reaching around $16T by 2020. Also, an increase in per capita income (more purchasing power) will ensure China remains a dominant market in the coming years. No business can afford to ignore China. China commands a significant market for key electronic products. In fact, over half of all key electronic products are consumed in China. In 2014, the Chinese smartphone, LCD, notebook/tablet, and wearable markets were around 81%, 63%, 71%, and 47% of the global market, respectively. The global IC market will grow by a CAGR of 4% from 2014 - 2020, while the Chinese IC market will grow by 7% over the same period. The Chinese IC market is expected to reach ~$149B by 2020, around 40% of the total IC market. There is a huge gap between China’s IC consumption and its manufacturing. In 2015, China produced only ~12.5% of the IC it consumes, and the gap between IC consumption and production is ~$91B. Currently, IC is China’s #1 import commodity, exceeding oil. China considers the IC industry to be a key strategic sector. The Chinese government is making a significant effort through funding and a national IC policy, with an aggressive growth strategy to make China an IC design and manufacturing hub. The goal by 2030 is to become the global leader in all primary IC industrial supply chain segments. This report gives an overview of China’s semiconductor ecosystem and discusses in detail the country’s advanced packaging market. This report will also describe China’s semiconductor outlook, prospects, market drivers, key players, and supply chain evolution. It will discuss at length the Chinese government’s approach to developing China’s IC industry, including details about different private funds, their objectives, and investments made to date. Overall, this report will help local and global players identify challenges and opportunities in the Chinese IC market and assist them in developing strategies to maximize their market share in China’s fast-growing IC ecosystem, particularly in advanced packaging.
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Bonding and Lithography Equipment Market for More than Moore Devices by Yole ...Yole Developpement
More than Moore devices fueled by megatrend applications will strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market.
More information on that report at https://www.i-micronews.com/report/product/bonding-and-lithography-equipment-market-for-more-than-moore-devices.html
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV integration is creating growth and significant interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year....
More information on that report at: http://www.i-micronews.com/advanced-packaging-report/product/equipment-materials-for-3dic-wafer-level-packaging-applications.html#description
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
Polymeric Materials for Advanced Packaging at the Wafer-Level 2018 Report by...Yole Developpement
Polymeric materials market revenue will double over the next five years.
More information on that report at : https://www.i-micronews.com/report/product/polymeric-materials-for-advanced-packaging-at-the-wafer-level.html
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Advanced Packaging Role after Moore’s Law: Transition from Technology Node Er...Yole Developpement
The growing and diversifying system requirements have continued to drive the development of a variety of new package styles and configurations:
Small-form-factor
Lightweight technology
Low-profile technology
High-pin-count technology
High-speed technology
High Reliability
Improved thermal management
Lower cost
Fan-in WLP maintains its appeal as the package that can provide 2 unmatchable advantages:
• Reduced form factor
• Low cost
Demand is reaching available capacity
Technology innovation in fan-in WLP continues:
• Die size increases
• Bump pitch reduces
Foundry involvement is no longer a dent in fan-in WLP production
Increased activity of Chinese capital on the market
New applications are emerging while other are declining
• Disruptions also expected in the MEMS and CIS domains
• Internet of Things
Mobile sector is driving fan-in WLP production and growing
IoT is on the horizon and is expected to have a significant impact on fan-in packages and the packaging industry as a whole
Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report b...Yole Developpement
GaN market growth is fed by Lidar, wireless charging and fast charging solutions.
More information on : https://www.i-micronews.com/category-listing/product/power-gan-2018-epitaxy-devices-applications-and-technology-trends.html
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
Status of Advanced Packaging - 2017 Report by Yole DeveloppementYole Developpement
How can advanced packaging decrease semiconductor market uncertainty and enable future semiconductor products?
From supporting technology to enabler of future semiconductor products
Future semiconductor drivers are expected to be fragmented and more diverse than in the mobile era. Scaling continues, but functionality and system level features are becoming increasingly important for product differentiation rather than raw computation power. An outlook into the future brings the Internet of Things (from end device to backbone infrastructure), including the Industrial Internet of Things, the semiconductorization of the automotive industry, 5G connectivity, augmented & virtual reality and artificial intelligence. In such an environment, advanced packaging is transforming from follower of scaling technology nodes to enabler of future semiconductor applications and products. Heterogeneous integration of multiple dies from the latest to legacy front-end nodes, involving a mixture of latest technology high density interconnects to lower cost mature interconnects, at high levels of customization is the future of packaging. Advanced packaging has direct impact on product success rates and semiconductor revenues.
More information on that report at: https://www.i-micronews.com/reports.html
Equipment and Materials for 3D TSV Applications - 2017 Report by Yole Develop...Yole Developpement
Driven today mostly by BSI CIS, the 3D TSV equipment & materials business will be supported by 3D stacked memory’s expansion
Technology and application drivers will change over the years, but TSV integration will continue growing
Currently supported mostly by 3D stacked BSI CIS, TSV integration growth will be led mainly by 3D memory applications and new products integrating TSV interconnects in the imaging segment.
Indeed, 3D stacked BSI has been the TSV market’s real driver for a couple of years now. However, with the entrance of 3D hybrid technology (which does not require any TSV interconnects), we expect a decrease of 3D stacked BSI in the TSV market by 2019.
This potential TSV decrease within BSI CIS could be hastened by the 3D single-photon avalanche diodes (SPAD) developed by STMicroelectronics. This is a new approach in time-of-flight that will benefit from 3D hybrid technology by moving the digital pixel into the secondary chip.
While Sony is the current CIS leader and the pioneer of the hybrid stacking method (which was adopted for the first time in the Samsung Galaxy S7 rear camera module), it is too early to fully describe the strategy of other key actors like TSMC/Omnivision and ON Semiconductor, and whether their path will lead to 3D stacked BSI or 3D hybrid stacked.
Another scenario could happen in the next few years and impact the TSV market in a different way. With more complex structures in the BSI CIS field being considered today, some CIS manufacturers might remain on 3D stacked BSI by combining this technology with 3D hybrid stacked for the next generation of products based on multi-stack structure. In this case, 3D hybrid stacked will not compete with 3D stacked BSI, leading to a continuous increase of 3D stacked BSI and 3D hybrid stacked.
For more information please visit our website: http://www.i-micronews.com/reports.html
Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple...system_plus
The latest Apple application processor engine : from the stacked board to the A11, and reverse costing of TSMC's updated inFO packaging
More information on that report at http://www.systemplus.fr/reverse-costing-reports/second-generation-of-tsmcs-integrated-fan-out-info-packaging-for-the-apple-a11-found-in-the-iphone-x/
Equipment and Materials for Fan-Out Packaging 2019 report by Yole Développement Yole Developpement
Electronic packaging equipment and materials revenue growth is highly reliant on big players’ investments. A new killer application is needed to fuel robust growth.
More information on https://www.i-micronews.com/products/equipment-and-materials-for-fan-out-packaging-2019/
Composites Market Industry Trends Share & Size - Recent Developments.pptxKailas S
Composites Market by Fiber Type (Glass Fiber Composites, Carbon Fiber Composites, Natural Fiber Composites), Resin Type (Thermoset Composites, Thermoplastic Composites), Manufacturing Process, End-use Industry and Region
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Bonding and Lithography Equipment Market for More than Moore Devices by Yole ...Yole Developpement
More than Moore devices fueled by megatrend applications will strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market.
More information on that report at https://www.i-micronews.com/report/product/bonding-and-lithography-equipment-market-for-more-than-moore-devices.html
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV integration is creating growth and significant interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year....
More information on that report at: http://www.i-micronews.com/advanced-packaging-report/product/equipment-materials-for-3dic-wafer-level-packaging-applications.html#description
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
Polymeric Materials for Advanced Packaging at the Wafer-Level 2018 Report by...Yole Developpement
Polymeric materials market revenue will double over the next five years.
More information on that report at : https://www.i-micronews.com/report/product/polymeric-materials-for-advanced-packaging-at-the-wafer-level.html
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Advanced Packaging Role after Moore’s Law: Transition from Technology Node Er...Yole Developpement
The growing and diversifying system requirements have continued to drive the development of a variety of new package styles and configurations:
Small-form-factor
Lightweight technology
Low-profile technology
High-pin-count technology
High-speed technology
High Reliability
Improved thermal management
Lower cost
Fan-in WLP maintains its appeal as the package that can provide 2 unmatchable advantages:
• Reduced form factor
• Low cost
Demand is reaching available capacity
Technology innovation in fan-in WLP continues:
• Die size increases
• Bump pitch reduces
Foundry involvement is no longer a dent in fan-in WLP production
Increased activity of Chinese capital on the market
New applications are emerging while other are declining
• Disruptions also expected in the MEMS and CIS domains
• Internet of Things
Mobile sector is driving fan-in WLP production and growing
IoT is on the horizon and is expected to have a significant impact on fan-in packages and the packaging industry as a whole
Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report b...Yole Developpement
GaN market growth is fed by Lidar, wireless charging and fast charging solutions.
More information on : https://www.i-micronews.com/category-listing/product/power-gan-2018-epitaxy-devices-applications-and-technology-trends.html
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
Status of Advanced Packaging - 2017 Report by Yole DeveloppementYole Developpement
How can advanced packaging decrease semiconductor market uncertainty and enable future semiconductor products?
From supporting technology to enabler of future semiconductor products
Future semiconductor drivers are expected to be fragmented and more diverse than in the mobile era. Scaling continues, but functionality and system level features are becoming increasingly important for product differentiation rather than raw computation power. An outlook into the future brings the Internet of Things (from end device to backbone infrastructure), including the Industrial Internet of Things, the semiconductorization of the automotive industry, 5G connectivity, augmented & virtual reality and artificial intelligence. In such an environment, advanced packaging is transforming from follower of scaling technology nodes to enabler of future semiconductor applications and products. Heterogeneous integration of multiple dies from the latest to legacy front-end nodes, involving a mixture of latest technology high density interconnects to lower cost mature interconnects, at high levels of customization is the future of packaging. Advanced packaging has direct impact on product success rates and semiconductor revenues.
More information on that report at: https://www.i-micronews.com/reports.html
Equipment and Materials for 3D TSV Applications - 2017 Report by Yole Develop...Yole Developpement
Driven today mostly by BSI CIS, the 3D TSV equipment & materials business will be supported by 3D stacked memory’s expansion
Technology and application drivers will change over the years, but TSV integration will continue growing
Currently supported mostly by 3D stacked BSI CIS, TSV integration growth will be led mainly by 3D memory applications and new products integrating TSV interconnects in the imaging segment.
Indeed, 3D stacked BSI has been the TSV market’s real driver for a couple of years now. However, with the entrance of 3D hybrid technology (which does not require any TSV interconnects), we expect a decrease of 3D stacked BSI in the TSV market by 2019.
This potential TSV decrease within BSI CIS could be hastened by the 3D single-photon avalanche diodes (SPAD) developed by STMicroelectronics. This is a new approach in time-of-flight that will benefit from 3D hybrid technology by moving the digital pixel into the secondary chip.
While Sony is the current CIS leader and the pioneer of the hybrid stacking method (which was adopted for the first time in the Samsung Galaxy S7 rear camera module), it is too early to fully describe the strategy of other key actors like TSMC/Omnivision and ON Semiconductor, and whether their path will lead to 3D stacked BSI or 3D hybrid stacked.
Another scenario could happen in the next few years and impact the TSV market in a different way. With more complex structures in the BSI CIS field being considered today, some CIS manufacturers might remain on 3D stacked BSI by combining this technology with 3D hybrid stacked for the next generation of products based on multi-stack structure. In this case, 3D hybrid stacked will not compete with 3D stacked BSI, leading to a continuous increase of 3D stacked BSI and 3D hybrid stacked.
For more information please visit our website: http://www.i-micronews.com/reports.html
Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple...system_plus
The latest Apple application processor engine : from the stacked board to the A11, and reverse costing of TSMC's updated inFO packaging
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More information on https://www.i-micronews.com/products/equipment-and-materials-for-fan-out-packaging-2019/
Composites Market Industry Trends Share & Size - Recent Developments.pptxKailas S
Composites Market by Fiber Type (Glass Fiber Composites, Carbon Fiber Composites, Natural Fiber Composites), Resin Type (Thermoset Composites, Thermoplastic Composites), Manufacturing Process, End-use Industry and Region
PVDF Membrane Market by Type (Hydrophilic, Hydrophobic), Technology, Application (General Filtration, Sample Preparation, Bead-based Assays), End-use Industry (Biopharmaceutical, Industrial, Food & & Beverage), and Region
PolyDADMAC are the main source of water purification and treatment process.Sharath Chandra
PolyDADMAC is mainly used in water purification. The water treated using PolyDADMAC is not 100% purified. However, due to its advantages all the other minor problems are been ignored therefore PolyDADMAC water treatment is the choice for most water and wastewater treatment applications in low cost.It is anticipated that three years down the line the demand for PolyDADMAC will decrease due to the substitute’s product available in market.
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More Info:- https://www.imarcgroup.com/paper-bag-manufacturing-plant-project-report
#Manufacturing #PlantSetup #IMARCGroup #PlantReport
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Nail Polish Manufacturing Plant Project Report PPT 2021ChinkiTyagi
Increasing awareness about beauty trends, along with rising brand consciousness, represents one of the significant factors impelling the growth of the nail polish market. Besides this, the easy availability of nail polishes with unique finishing, such as glitter, magnetic, sequins and metallic, and a wide array of colors are positively boosting the overall sales. Other factors, such as the introduction of low-cost nail polishes, are strengthening the growth of the market. Additionally, the escalating demand for organic and natural nail polishes acts as another growth-inducing factor.
Read more: https://www.syndicatedanalytics.com/nail-polish-manufacturing-plant-project-report
PVC Recycling Market Industry Leaders Outlook 2024 & New Revenue Pockets.pptxKailas S
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More Info:- https://www.imarcgroup.com/corrugated-box-manufacturing-plant-project-report
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More Info:- https://www.imarcgroup.com/paperboard-tubes-manufacturing-plant-project-report
Global T-C Reflective Fabric Market research provides insights into consumer behavior, industry trends, and market competition through the use of various research techniques, including surveys, interviews, and data analysis.
PE Pipes Manufacturing Plant Project Report 2023AlinaEllis1
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Similar to Status of Panel Level Packaging 2018 Report by Yole Developpement (18)
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Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
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Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
More information on: https://www.i-micronews.com/products/high-end-inertial-sensors-for-defense-aerospace-and-industrial-applications-2020/
Neuro-symbolic is not enough, we need neuro-*semantic*Frank van Harmelen
Neuro-symbolic (NeSy) AI is on the rise. However, simply machine learning on just any symbolic structure is not sufficient to really harvest the gains of NeSy. These will only be gained when the symbolic structures have an actual semantics. I give an operational definition of semantics as “predictable inference”.
All of this illustrated with link prediction over knowledge graphs, but the argument is general.
JMeter webinar - integration with InfluxDB and GrafanaRTTS
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In this webinar, we will review the benefits of leveraging InfluxDB and Grafana when executing load tests and demonstrate how these tools are used to visualize performance metrics.
Length: 30 minutes
Session Overview
-------------------------------------------
During this webinar, we will cover the following topics while demonstrating the integrations of JMeter, InfluxDB and Grafana:
- What out-of-the-box solutions are available for real-time monitoring JMeter tests?
- What are the benefits of integrating InfluxDB and Grafana into the load testing stack?
- Which features are provided by Grafana?
- Demonstration of InfluxDB and Grafana using a practice web application
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GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
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Speakers:
Bob Boule
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Get an exclusive demo of the new family of UiPath LLMs – GenAI models specialized for processing different types of documents and messages
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42. The demand for lower cost plus higher
performance, coupled with OSAT/assembly house
end-customers’ desire for increasingly lower
prices, has driven the semiconductor industry to
develop innovative solutions. One approach to
reducing overall cost is to switch from wafer and
strip-level to a larger-size panel format that takes
advantage of efficiency and economies of scale.
Going from wafer to panel (for example 12” wafer
to 18” x 24” panel) could enable cost reductions
of up to 50% (if technologies are ready) and
yields exceeding 90%. Panel-level manufacturing
has the potential to leverage the knowledge and
infrastructure of wafer-level packaging (WLP) and
the PCB/flat-panel display/photovoltaic industries.
Various factors are driving Panel Level Packaging
(PLP) development and encouraging diverse
players from across the supply chain (including
equipment and materials) to invest in panel
infrastructure. On one side, the leading fabless
players want OSATs to reduce the cost of high-
density FOWLP and going to large size panel is
seen as the key step to significantly reducing
the package price. In fact, FOPLP is on every big
OSAT’s roadmap. On the other side are players
whose strategy is to invest and develop PLP
capability and push hard for its adoption. These
players, mainly driven by the success and publicity
surrounding FOWLP, are also those that:
• Missed the early FOWLP (eWLB) wave (i.e. PTI, ASE)
• Were affected by losses in the substrate business
and want a new business model that utilizes
their experience in substrate manufacturing (i.e.
SEMCO, Unimicron)
• Already have experience in panel processes (i.e.
LCD packaging) and believe they can leverage
this experience for PLP (i.e. NEPES)
• Want to develop high-density, low-cost
packaging to support their front-end chip
business (Samsung Electronics, Intel)
STATUS OF PANEL LEVEL PACKAGING 2018
Market Technology report - April 2018
WHY IS THE INDUSTRY INTERESTED IN PANEL LEVEL PACKAGING?
Panel level packaging players are ready for high volume production.
WHAT’S NEW
• Updated 2017 - 2023 Panel Level
Packaging (PLP) forecast, by
packaging platform
• Updated, in-depth analysis of
potential applications that could
drive the PLP business
• Update on the activities of the
various players involved in PLP
• Updated “Equipment and
Materials” section: in-depth
coverage of the processes, tools,
and materials for PLP, as well as
technical challenges, key suppliers,
and competitive benchmarking
• Equipment suppliers’ PLP-specific
strategies
• Different players’ PLP technology
development, readiness, and
adoption time
• Comprehensive analysis of the
various manufacturing challenges
for PLP adoption
• Revised technology roadmap
(based on the 2017 - 2023 high
volume manufacturing technology
roadmap)
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
• Overview of panel packaging
technologies that are available or
in-development: FOWLP panel
and embedded die
• Commercialization status, market
adoption, and potential for each
packaging technology
• Drivers and challenges for
technology adoption
• Per-player product/technology
description and analysis
• Detailed supply chain, market
adoption roadmap, and volume
forecast for each panel platform
• Panel adoption and panel
equipment readiness roadmap
• Equipment and materials challenges
(Yole Développement,April 2018)
Market drivers for panel level packaging platforms
PLP
Drivers
TECHNOLOGY
• Form factor /Thin profile
• High electrical /thermal performance
• High components integration
COST
APPLICATION
STRATEGIC MOVE
• Design flexibility
• Physical protection
• Enter the fan-out business
• New business model
• Leverage experience of
FPD/PCB/PV expertise
• High density, low cost package
solution to support front-end
business
• Higher efficiency and economies of scale
• Higher carrier usage ratio 95%
• Benefit for large package size
• Wafer to panel FO ~ 50% less cost
• Mobile / IoT /Wearables
• Automotive
• Computing
• Medical
SUPPLY CHAIN: STATUS AND READINESS
Many packaging platforms can be considered
panel-based, but for this report we consider only
two packaging technologies to be PLP, where
both RDL interconnect fabrication and further
assembly are done at panel level (with panel size
300 mm x 300 mm): FOPLP and embedded die.
Between the two, FOPLP is the most-discussed
and the one which attracts the greatest interest of
many players (including equipment and suppliers),
and thus is the main focus of this report.
Lots of players have been developing FOPLP
technology, but after years of development/
qualification/sampling, three players will
finally enter in production in 2018: Powertech
Technologies (PTI), NEPES, and SEMCO. NEPES
has been in low-volume production since 2017. ASE,
in partnership with Deca Technologies, is in the
advanced development stage and will commence
volume production in 2019/2020. Each player has
its own business strategy and is working on its
own FOPLP technology (panel size, leveraging
43. STATUS OF PANEL LEVEL PACKAGING 2018
TECHNICAL CHALLENGES AND HIGH VOLUME MANUFACTURING ROADMAP FOR
PANEL LEVEL PACKAGING
Certain criteria must be fulfilled and certain challenges
overcome for FOPLP’s broad adoption. These criteria/
challenges are linked to large capex investment,
standardization, multisource availability, and most
importantly, market availability to keep the panel line
running. There are technical challenges too, such as
warpage control, die placement accuracy, and the
fabrication of sub 10/10um line, etc. on large panels.
Standardization of the panel size and assembly process
is the biggest hurdle for FOPLP adoption. Each player
is developing its own process using different panel sizes
and infrastructure (PCB/LCD/WLP/PV/Mix) catering
to specific applications and customers. In this scenario
it’s very difficult for end-customers to multisource.
Also, it’s not profitable for equipment suppliers to
design and manufacture equipment according to
different customers’ requirements.
Given the technical challenges that will adversely affect
the yield, the FOPLP that go into HVM production will
support a relatively simple design: 10/10 umL/S, 10 x
10 mm2
package size, Max 2L RDL. With the maturation
of the technology and the experience gained, FOPLP
will eventually be adopted for high-density design with
10/10um L/S, multi-layer RDL, 15 x 15mm2
package
size, and multi-die SiP integration.
different infrastructure, etc.). For example, NEPES is
focused on the coarse design (10/10 L/S), targeting
automotive, sensors, and IoT applications, and will
likely not explore high-density design. On the other
hand, PTI and SEMCO’s long-term aim is to target
mid and high-end applications that require 8/8 or less
L/S. Meanwhile, Unimicron is working on a business
model whereby it will manufacture the high-density
RDL, with further assembly done by an OSAT partner
or customer. Also, prominent OSATs like Amkor and
JCET/STATS ChipPAC are currently in a “wait and
see” stage, evaluating various options. They will not
enter volume production before 2022.
Equipment availability for PLP is not a bottleneck today.
Tools are available in the market to support various
process steps in panel processing. However, certain tools
that support high-density panel packaging are special and
expensive. So, tool cost, not availability, is the bottleneck.
For some panel-producing process steps (plating, physical
vapor deposition [PVD], molding, die attach, and dicing),
tools are readily available and can be adapted from the
PCB, flat-panel display, or LCD industries. However, for
other key process steps inherent to advanced packaging
(i.e. lithography), the development of new, upgraded tool
capabilities is necessary to support such steps as fine
L/S patterning on panel, thick-resist lithography, panel-
handling capabilities, exposure field size, and depth of
focus. Over the last few years, these tools have been in
development at equipment suppliers.
Equipment suppliers are adopting different strategies
for entering the PLP business: acquisition (for example,
Rudolph Technologies has developed PLP-focused tools
based on knowledge received through its acquisition of
AZORES Flat Panel Display Panel Printer); by leveraging
tool experience from other businesses and upgrading
it (i.e. Evatec, Atotech, SCREEN); and by organically
developing PLP tools from scratch (ASM). Also, some
tool suppliers have a strong position in the FOWLP
market but are skeptical of the PLP business and thus
are taking a wait-and-see approach (Ultratech, Applied
Materials, Lam Research).
Tool supplier strategies to enter panel business
(Yole Développement,April 2018)
Broadly 4
strategies
employed by
players
By organically developing
tools for Panel Level
Packaging from scratch
By leveraging tool
experience in other
business upgrading itBy acquisition
Wait watch
approach. Not enter till
market becomes big.
Non exhaustive list of companies
Before
2016
2017 2018 2019 2020 2021 2022
NEPES, PTI SEMCO will enter production in 2018
RD Sampling + LowVolume Manufacturing HighVolume Manufacturing
Non exhaustive list of companies
Timeline: Readiness for fan-out panel level packaging
(Yole Développement,April 2018)
44. Find more
details about
this report here:
MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
AMS, Amicra Microtechnologies, Amkor, Analog Devices, Apple, Applied Materials, Asahi Kasei, ASE,
ASM Pacific, ATS, Atotech, AVX, Besi, Bosch, Canon, CEA-LETI, Continental, Dai Nippon, Daimler,
DNP, DYCONEX AG, Dow Electronic Materials, Evatec, EVG Group, Ford, Fujikura, GaN Systems,
General Electric, Hanmi, HD Micro/DuPont, Heidelberg Instruments, HighTec EDV System,Huawei,
Ibiden, Infineon, Intel, IPDiA, IME A*Star, IMEC, ITRI, IZM Fraunhofer, J-Devices, JSR Micro, Kulicke
Soffa (KS), Kyocera, Maxim, Merck/AZ EM, Mitsui Kinzoku,Murata Electronics, Nagase, Nanium, NCAP
China, Nikon, Nitto Denko, ON Semiconductor, Orbotech, ORC, Panasonic, Powertech Technologies,
Qorvo, Qualcomm, Rohm Semiconductor, Rudolph, Sarda Technologies, Schweizer, SCREEN, Shinko,
Shin Etsu, STMicroelectronics, SUSS MicroTec, Taiyo Yuden, Tazmo, TCL, TDK-EPCOS, TEL, Texas
Instruments (TI), Thales, Towa, TransSiP, Tokyo Ohka Kogyo Co., LTD. (TOK), TSMC, Shin-Etsu
MicroSi, Samsung Electro Mechanics (SEMCO), STATS ChipPAC, Ultratech, Unimicron, USHIO,UTAC,
Valeo, Vishay, Yamada and many more…
AUTHOR
Santosh Kumar is currently working
as Senior Technology Market Research
Analyst at Yole Développement, the «More
than Moore» market research and strategy
consulting company. He worked as senior
RD engineer at MK Electron Co. Ltd
where he was engaged in the electronics
packaging materials development and
technical marketing. His main interest areas
are advanced electronic packaging materials
and technology including TSV and 3D
packaging, modeling and simulation, reliability
and material characterization, wire bonding
and novel solder materials and process etc.
He received the bachelor and master degree
in engineering from the Indian Institute of
Technology (IIT), Roorkee and University of
Seoul respectively. He has published more
than 20 papers in peer reviewed journals and
has obtained 2 patents. He has presented
and given talks at numerous conferences and
technical symposiums related to advanced
microelectronics packaging.
Introduction, definitions and methodology 2
Report objectives
Who should be interested in this report?
Companies cited in this report
Definitions, limitations and methodology
Glossary
What’s new since last report ?
Executive summary 17
Advanced packaging trends and market drivers 32
Overview of panel manufacturing 36
Definition of Panel Level Packaging
Overview of the Panel technologies /Key
segments descriptions
2017-2023 total market forecast
(revenues, units)
Applications targeted with Panel
Market drivers: general motivations and drivers
Key players activities worldwide
Industrial players activity
Key RD players activity
Commercialization status
Supply chain
Fan-Out Panel Level Packaging (FOPLP) 68
FOPLP players having panel manufacturing
activities
Key challenges
FOPLP HVM adoption issues
FOPLP Panel commercialization status
and supply chain
2017–2023 market forecast (revenues, units,
panel starts)
Embedded Die 136
Overview of the ED technologies
Key players activity
Motivations and drivers
2017–2023 market forecast (revenues, units)
Market dynamics
Embedded die package volume production
roadmap
Business model supply chain
Equipment and materials tool-box 152
Equipment and material for FOPLP
Equipment and material for ED
Conclusion and perspectives 248
TABLE OF CONTENTS (complete content on i-Micronews.com)
Roadmap: volume production for fan-out panel level packaging
(Yole Développement,April 2018)
OBJECTIVES OF THE REPORT
• Provide an overview of panel package technologies
• Describe the key applications that could use the panel infrastructure
• Highlight panel package solutions and the players supporting these packages
• Identify the current and future industrial players for each packaging technology, based on panel level
• Provide market data and forecasts for panel products
• Explore each segment’s competitive landscape
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Embedded Dies Interconnects,
Substrate Like PCB Trends
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Industry 2017
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Fan-Out Wafer-Level System-in-Package
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Sensor
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2018 2019 2020 2021
Line/Space
Package minimum thickness
(without BGA)
Maximum level of RDL
Minimum die-to-die distance
Minimum die size
(X-Y directions)
Maximum die size
(X–Y directions)
Minimum bump pitch
Maximum package size 8*8mm 10*10mm 15*15mm
2RDL 3RDL
15/15 m 10/10 m 8/8 m 5/5um
250 m 200 m 150 m
900 m 500 m 200 m
10mm 12mm 15mm
400 m 350 m
250 m 200 m
45. ORDER FORM
Status of Panel Level Packaging 2018
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