The document discusses Siemens' Aprisa digital design software for low-power system-on-chip designs. It introduces Aprisa's low power place-and-route methodology called PowerFirst, which optimizes power as the top priority throughout the implementation flow. PowerFirst uses activity-driven optimization techniques to reduce dynamic power, as well as tradeoffs between timing and power. Aprisa also supports multiple power domains with automatic insertion of power management cells and power domain checking. Measurement results show Aprisa's PowerFirst approach reduced total power by 16% compared to timing-only optimization or other tools.
In electronics, crosstalk is any phenomenon by which a signal transmitted on one circuit or channel of a transmission system creates an undesired effect in another circuit or channel. Crosstalk is usually caused by undesired capacitive, inductive, or conductive coupling from one circuit or channel to another.
Crosstalk is a significant issue in structured cabling, audio electronics, integrated circuit design, wireless communication and other communications systems.
As we push through lower technology nodes in the IC and chip design, the wire width goes thinner along with transistor size. This makes the wire resistance more dominant on 16nm and below technology nodes. This increasing resistance and the decreasing width of metal wires introduce many Electromigration and IR drop issues. These two issues play major roles in reducing the lifespan of an electronic device and are the causes of functionality failure in any electronic devices with lower technology nodes.
In this article, we will discuss the problems of electromigration and IR drop, and techniques to prevent the occurrence of these issues in electronic devices.
Electromigration is the gradual displacement of metal atoms in a semiconductor. It occurs when the current density is high enough to cause the drift of metal ions in the direction of the electron flow, and is characterized by the ion flux density. This density depends on the magnitude of forces that tend to hold the ions in place, i.e., the nature of the conductor, crystal size, interface and grain-boundary chemistry, and the magnitude of forces that tend to dislodge them, including the current density, temperature and mechanical stresses.
The Power supply in the chip is distributed uniformly through metal layers (Vdd & Vss) across the design. These metal layers have finite amount of resistance. When voltage is applied to this metal wires current starts flowing through the metal layers and some voltage is dropped due to that resistance of metal wires and current. this drop is called as IR drop.
https://www.udemy.com/vlsi-academy
Usually, while drawing any circuit on paper, we have only one 'vdd' at the top and one 'vss' at the bottom. But on a chip, it becomes necessary to have a grid structure of power, with more than one 'vdd' and 'vss'. The concept of power grid structure would be uploaded soon. It is actually the scaling trend that drives chip designers for power grid structure.
1. The document discusses the key steps in physical design flow, including import design, floorplanning, placement and routing.
2. Floorplanning is described as a critical step, where the quality of the floorplan can significantly impact timing closure and design implementation. Good techniques for floorplanning include understanding the design requirements and data flow.
3. The document outlines the major steps in floorplanning such as sizing and shaping blocks, voltage area creation, pin placement, row creation, macro placement, adding blockages and special cells. Qualifying the floorplan involves checks on pin grids, design rules, power connections and more.
Routing is an important step in the design of integrated circuits. It involves generating metal wires to connect the pins of same signal while obeying manufacturing design rules. Before routing is performed on the design, cell placement has to be carried out wherein the cells used in the design are placed. But the connections between the pins of the cells pertaining to same signal need to be made. At the time of placement, there are only logical connections between these pins. The physical connections are made by routing. More generally speaking, routing is to locate a set of wires in routing space so as to connect all the nets in the netlist taking into consideration routing channels’ capacities, wire widths and crossings etc. The objective of routing is to minimize total wire length and number of vias and that each net meets its timing budget. The tools that perform routing are termed as routers. You typically provide them with a placed netlist along with list of timing critical nets. These tools, in turn, provide you with the geometry of all the nets in the design.
Physical design involves taking a synthesized netlist as input and performing floorplanning, placement, and routing to produce a physical layout. Key inputs include the netlist, timing constraints, physical libraries, and technology files. The process involves floor planning to determine block placement and routing areas, power planning to create the power distribution network, and pre-routing of standard cells and power grids. The goal is to meet timing constraints while minimizing area.
This document discusses physical design verification checks that are performed on an integrated circuit layout. It describes design rule checking (DRC) which checks that a layout adheres to foundry design rules for manufacturability. Layout versus schematic (LVS) checks that the layout connectivity matches the schematic netlist. Electrical rule checking (ERC) identifies electrical issues like floating devices or short circuits. The document provides examples of DRC, LVS, and ERC checks and typical issues found during these verification steps.
In electronics, crosstalk is any phenomenon by which a signal transmitted on one circuit or channel of a transmission system creates an undesired effect in another circuit or channel. Crosstalk is usually caused by undesired capacitive, inductive, or conductive coupling from one circuit or channel to another.
Crosstalk is a significant issue in structured cabling, audio electronics, integrated circuit design, wireless communication and other communications systems.
As we push through lower technology nodes in the IC and chip design, the wire width goes thinner along with transistor size. This makes the wire resistance more dominant on 16nm and below technology nodes. This increasing resistance and the decreasing width of metal wires introduce many Electromigration and IR drop issues. These two issues play major roles in reducing the lifespan of an electronic device and are the causes of functionality failure in any electronic devices with lower technology nodes.
In this article, we will discuss the problems of electromigration and IR drop, and techniques to prevent the occurrence of these issues in electronic devices.
Electromigration is the gradual displacement of metal atoms in a semiconductor. It occurs when the current density is high enough to cause the drift of metal ions in the direction of the electron flow, and is characterized by the ion flux density. This density depends on the magnitude of forces that tend to hold the ions in place, i.e., the nature of the conductor, crystal size, interface and grain-boundary chemistry, and the magnitude of forces that tend to dislodge them, including the current density, temperature and mechanical stresses.
The Power supply in the chip is distributed uniformly through metal layers (Vdd & Vss) across the design. These metal layers have finite amount of resistance. When voltage is applied to this metal wires current starts flowing through the metal layers and some voltage is dropped due to that resistance of metal wires and current. this drop is called as IR drop.
https://www.udemy.com/vlsi-academy
Usually, while drawing any circuit on paper, we have only one 'vdd' at the top and one 'vss' at the bottom. But on a chip, it becomes necessary to have a grid structure of power, with more than one 'vdd' and 'vss'. The concept of power grid structure would be uploaded soon. It is actually the scaling trend that drives chip designers for power grid structure.
1. The document discusses the key steps in physical design flow, including import design, floorplanning, placement and routing.
2. Floorplanning is described as a critical step, where the quality of the floorplan can significantly impact timing closure and design implementation. Good techniques for floorplanning include understanding the design requirements and data flow.
3. The document outlines the major steps in floorplanning such as sizing and shaping blocks, voltage area creation, pin placement, row creation, macro placement, adding blockages and special cells. Qualifying the floorplan involves checks on pin grids, design rules, power connections and more.
Routing is an important step in the design of integrated circuits. It involves generating metal wires to connect the pins of same signal while obeying manufacturing design rules. Before routing is performed on the design, cell placement has to be carried out wherein the cells used in the design are placed. But the connections between the pins of the cells pertaining to same signal need to be made. At the time of placement, there are only logical connections between these pins. The physical connections are made by routing. More generally speaking, routing is to locate a set of wires in routing space so as to connect all the nets in the netlist taking into consideration routing channels’ capacities, wire widths and crossings etc. The objective of routing is to minimize total wire length and number of vias and that each net meets its timing budget. The tools that perform routing are termed as routers. You typically provide them with a placed netlist along with list of timing critical nets. These tools, in turn, provide you with the geometry of all the nets in the design.
Physical design involves taking a synthesized netlist as input and performing floorplanning, placement, and routing to produce a physical layout. Key inputs include the netlist, timing constraints, physical libraries, and technology files. The process involves floor planning to determine block placement and routing areas, power planning to create the power distribution network, and pre-routing of standard cells and power grids. The goal is to meet timing constraints while minimizing area.
This document discusses physical design verification checks that are performed on an integrated circuit layout. It describes design rule checking (DRC) which checks that a layout adheres to foundry design rules for manufacturability. Layout versus schematic (LVS) checks that the layout connectivity matches the schematic netlist. Electrical rule checking (ERC) identifies electrical issues like floating devices or short circuits. The document provides examples of DRC, LVS, and ERC checks and typical issues found during these verification steps.
This document provides an introduction to VLSI physical design. It discusses the objectives of physical design including understanding the physical design flow, tools used, CMOS process parameters, and scaling issues. The topics covered include technology evolution, scaling issues, design principles, verification and simulation, the detailed physical design flow, and foundry files, parameters, rules and guidelines. It also summarizes key aspects of technology scaling from 0.25um to 0.05um processes including the dominance of interconnect delay, increasing cross coupling capacitance, and implications for multiple clock cycles to cross chips.
The document provides an overview of the ASIC back-end design flow, including physical design steps like floorplanning, timing driven placement, clock tree synthesis, and routing. It explains key concepts in physical design like standard cell libraries, placement, routing grids and tracks, and timing driven optimization. The document also discusses verification steps after physical design like formal verification to check logic equivalence and timing analysis using RC extraction and static timing analysis to check design constraints.
In today’s world, there is an ever-increasing demand for SOC speed, performance, and features. To cater to all those needs, the industry is moving toward lower technology nodes. The current market has become more and more demanding, in turn forcing complex architectures and reduced time to market. The complex integrations and smaller design cycle emphasize the importance of floorplanning, i.e., the first step in netlist-to-GDSII design flow. Floorplanning not only captures designer’s intent, but also presents the challenges and opportunities that affect the entire design flow, from design to implementation and chip assembly.
A typical SOC can include many hard- and soft-IP macros, memories, analog blocks, and multiple power domains. Because of the increases in gate count, power domains, power modes, and special architectural requirements, most SOCs these days are hierarchical designs. The SOC interacts with the outside world through sensors, antennas, displays, and other elements, which introduce a lot of analog component in the chip. All of these limitations directly result in various challenges in floorplanning.
Floorplanning includes macro/block placement, design partitioning, pin placement, power planning, and power grid design. What make the job more important is that the decisions taken for macro/block placement, partitioning, I/O-pad placement, and power planning directly or indirectly impact the overall implementation cycle.
Lots of iterations happen to get an optimum floorplan. The designer takes care of the design parameters, such as power, area, timing, and performance during floorplanning. These estimations are repeatedly reviewed, based on the feedback of other stakeholders such as the implementation team, IP owners, and RTL designers. The outcome of floorplanning is a proper arrangement of macros/blocks, power grid, pin placement, and partitioned blocks that can be implemented in parallel.
In hierarchical designs, the quality of the floorplan is analyzed after the blocks are integrated at the top level. That can results in unnecessary iterative work, wasted resource hours, and longer cycle times, which could mean missed market opportunities. This underscores the importance of floorplanning.
In this paper, we will discuss some of the good practices, techniques, and complex cases that arise while floorplanning in an SOC.
The first rule of thumb for floorplanning is to arrange the hard macros and memories in such a manner that you end up with a core area (to be used for SOG placement) square in shape. This is always not possible, however, because of the large number of analog-IP blocks, memories, and various other requirements in design.
This document discusses various concepts related to physical design implementation. It describes the inputs and outputs of physical design tools, important checks to perform before starting design such as clock and high fanout net budgeting, and concepts like floorplanning, placement, routing, libraries, multi-voltage design, and clock tree synthesis and optimization.
The document discusses various layout optimizations that can be made to standard cells to reduce both internal power and area. These include removing "hammer head" structures to decrease transistor length, moving gate contacts over active areas to reduce transistor height, and reducing source/drain capacitances to decrease dynamic current without impacting speed. Post-layout simulations showed a new D flip-flop design with these optimizations reduced internal power by 20% while maintaining clock-to-Q delay, and improved saturation current by 15-50% while reducing area by 20%.
In the world of Very Large Scale Integration (VLSI), the Physical Design process plays a crucial role in transforming a logical design into a physical layout that can be manufactured. Among the various steps involved in the Physical Design flow, Place and Route (PnR) stand out as a critical phase. PnR consists in placing the different components of a design on a chip and routing the connections between them. In this article, we will delve into the PnR flow, exploring its key steps, challenges, and the tools involved.
1. Partitioning:
Partitioning is a preliminary step in the PnR flow that divides the design into manageable blocks or modules based on functionality, hierarchy, or timing constraints. It enables parallel processing during subsequent steps and facilitates easier placement and routing. Partitioning algorithms aim to balance the workload across partitions and minimize inter-partition communication.
2. Floorplanning:
Floorplanning is a critical aspect of the placement process, defining the overall chip's top-level structure and organizing the different functional blocks. It involves allocating space for each block, determining their relative positions, and defining the placement regions. Effective floorplanning ensures proper utilization of available chip areas, reduces congestion, and facilitates efficient routing.
3. Power Planning:
Power planning focuses on distributing power supply and ensuring a stable power delivery network throughout the chip. It involves inserting power distribution networks, decoupling capacitors, and voltage regulators to minimize voltage drop, signal noise, and power supply fluctuations. Power planning techniques aim to optimize power grid layout, reduce IR drop, and mitigate electromigration issues.
4. Placement:
Placement is the first step in the PnR flow and involves determining the optimal location for each logic component on the chip. The primary objective of placement is to minimize wire length, power consumption, and timing delays while adhering to various constraints such as blockages, power grid, and signal integrity.
5. Clock Tree Synthesis (CTS):
Clock Tree Synthesis is a crucial step in PnR flow that ensures the efficient distribution of clock signals to all sequential elements of the design. CTS aims to minimize clock skew, and power dissipation, and provide a balanced clock network. CTS algorithms construct a tree-like structure by inserting buffers and optimizing wire length to achieve reliable clock distribution.
6. Routing:
6.1 Global Routing:
Once the placement is complete, the next step is global routing, which establishes the connections between the placed components. Global routing generates a coarse routing structure using minimum spanning trees, maze routing, or other algorithms. It focuses on achieving reasonable wirelength and reducing congestion without considering the precise details of the interconnects.
Timing and Design Closure in Physical Design Flows Olivier Coudert
A physical design flow consists of producing a production-worthy layout from a gate-level netlist subject to a set of constraints. We focus on the problems imposed by shrinking process technologies. It exposes the problems of timing closure, signal integrity, design variable dependencies, clock and power/ground routing, and design signoff. It also surveys some physical design flows, and outlines a refinement-based flow.
Before 2000 area, delay and performance were the most important parameters, if anyone design circuit the main focus was on how much less area is occupied by the circuit on the chip and what the speed is. Now situation is changed, the performance and speed is a secondary concern. In all nanometer (deep sub-micron) technology power becomes the most important parameter in the design. Almost all portable devices run on battery power. Power consumption is a very big challenge in modern-day VLSI design as technology is going to shrinks Because of
Increasing transistors count on small chip
Higher speed of operations
Greater device leakage currents
Define Width and Height of Core and Die (http://www.vlsisystemdesign.com/PD-F...VLSI SYSTEM Design
https://www.udemy.com/vlsi-academy
The very first step in chip design is floorplanning, in which the width and height of the chip, basically the area of the chip, is defined. A chip consists of two parts, 'core' and 'die'.
This document discusses ASIC placement, which involves assigning exact locations to circuit components within a chip's core area. The goals of placement are to minimize the total interconnect length and costs while meeting timing requirements. It describes two main placement techniques - global placement, which groups cells to minimize interconnect between groups, and detailed placement, which further optimizes placement objectives. The document outlines various placement algorithms, goals, and trends like mixed-size placement and whitespace distribution to improve routability and performance.
2019 Local I/O ESD protection for 28Gbps to 112Gbps SerDes interfaces in adva...Sofics
2019 Taiwan ESD and reliability conference
Semiconductor companies are developing ever faster wireless, wired and optical interfaces to satisfy the need for higher data throughputs. They rely on BiCMOS, advanced CMOS and FinFET nodes with ESD-sensitive circuits. However, the parasitic capacitance of the traditional ESD solutions limits the signal frequency. This paper demonstrates small area and low-cap Analog I/Os used in TSMC 28nm CMOS and TSMC 16nm, 12nm, 7nm FinFET technologies for high speed SerDes (28Gbps to 112Gbps) circuits. Parasitic capacitance of the ESD solutions is reduced below 100fF and for some silicon photonics applications even below 20fF.
Placement is the process of determining the locations of circuit devices on a die surface. It is an important stage in the VLSI design flow, because it affects routabil- ity, performance, heat distribution, and to a less extent, power consumption of a design.
The document discusses the inputs and outputs of place and route tools used in the chip design process. It describes the .cel, .blk, .par, and .net files that are used as inputs to specify connectivity, layout structure, global parameters, and nets. The outputs include the .p11, .p12, .pin, .twf, and .out files that describe placement and routing results. The document also briefly mentions design capture tools like HDL, schematics, and floor planning, as well as design verification tools such as simulation and timing verification.
The document discusses various aspects of physical design in VLSI circuits. It describes the physical design cycle which involves transforming a circuit diagram into a layout through steps like partitioning, floorplanning, placement, routing, and compaction. It also discusses different design styles like full-custom, standard cell, and gate array. Full-custom design allows maximum flexibility but has higher complexity, while restricted models like standard cell and gate array simplify the design process at the cost of less optimization in the layout. Physical design aims to produce layouts that meet timing and area constraints.
This document discusses engineering change orders (ECOs) used to fix timing, functional, power, and clock issues after physical design and sign-off. It describes the motivation for ECOs due to tool limitations and differences between implementation and sign-off. Common ECO techniques are listed for timing (driver upsizing, buffer insertion, etc.), power (vt-swapping, downsizing, etc.), and metal-only ECOs. Timing ECO tools from Synopsys, Cadence, and other vendors are also mentioned. Upcoming ECO technologies like dynamic power optimization and automatic legalization are noted.
The journey of designing an ASIC (application specific integrated circuit) is long and involves a number of major steps – moving from a concept to specification to tape-outs. Although the end product is typically quite small (measured in nanometers), this long journey is interesting and filled with many engineering challenges.
Today, ASIC design flow is a very mature process in silicon turnkey design. The ASIC design flow and its various steps in VLSI engineering that we describe below are based on best practices and proven methodologies in ASIC chip designs. This blog attempts to explain different steps in the ASIC design flow, starting from ASIC design concept and moving from specifications to benefits.
To ensure successful ASIC design, engineers must follow a proven ASIC design flow which is based on a good understanding of ASIC specifications, requirements, low power design and performance, with a focus on meeting the goal of right time to market. Every stage of ASIC design cycle has EDA tools that can help to implement ASIC design with ease.
In semiconductor design, standard-cell methodology is a method of designing application-specific integrated circuits (ASICs) with mostly digital-logic features. Standard-cell methodology is an example of design abstraction, whereby a low-level very-large-scale integration (VLSI) layout is encapsulated into an abstract logic representation (such as a NAND gate).
Cell-based methodology – the general class to which standard cells belong – makes it possible for one designer to focus on the high-level (logical function) aspect of digital design, while another designer focuses on the implementation (physical) aspect. Along with semiconductor manufacturing advances, standard-cell methodology has helped designers scale ASICs from comparatively simple single-function ICs (of several thousand gates), to complex multi-million gate system-on-a-chip (SoC) devices.
This is the presentation that was shared by Nilesh Ranpura and Vineeth Mathramkote at CDNLIVE 2015. The session briefs about the implementation challenges and covers the solution approach and how to achieve results
This document discusses energy efficient computing architectures. It examines whether architectural features that improve performance also improve energy efficiency. Cache parameters like size affect both performance and energy consumption. Reduced Instruction Set Computing (RISC) architectures can improve performance and efficiency by making instructions a static size. Register file architectures decrease memory traffic and improve efficiency by holding small registers in cache. Wireless sensor networks aim to have long battery life through efficient hardware and software designs like turning radios off during idle periods using protocols like T-MAC.
Design and Implementation of Low Power DSP Core with Programmable Truncated V...ijsrd.com
The programmable truncated Vedic multiplication is the method which uses Vedic multiplier and programmable truncation control bits and which reduces part of the area and power required by multipliers by only computing the most-significant bits of the product. The basic process of truncation includes physical reduction of the partial product matrix and a compensation for the reduced bits via different hardware compensation sub circuits. These results in fixed systems optimized for a given application at design time. A novel approach to truncation is proposed, where a full precision vedic multiplier is implemented, but the active section of the truncation is selected by truncation control bits dynamically at run-time. Such architecture brings together the power reduction benefits from truncated multipliers and the flexibility of reconfigurable and general purpose devices. Efficient implementation of such a multiplier is presented in a custom digital signal processor where the concept of software compensation is introduced and analyzed for different applications. Experimental results and power measurements are studied, including power measurements from both post-synthesis simulations and a fabricated IC implementation. This is the first system-level DSP core using a high speed Vedic truncated multiplier. Results demonstrate the effectiveness of the programmable truncated MAC (PTMAC) in achieving power reduction, with minimum impact on functionality for a number of applications. On comparison with the previous parallel multipliers Vedic should be much more fast and area should be reduced. Programmable truncated Vedic multiplier (PTVM) should be the basic part implemented for the arithmetic and PTMAC units.
This document provides an introduction to VLSI physical design. It discusses the objectives of physical design including understanding the physical design flow, tools used, CMOS process parameters, and scaling issues. The topics covered include technology evolution, scaling issues, design principles, verification and simulation, the detailed physical design flow, and foundry files, parameters, rules and guidelines. It also summarizes key aspects of technology scaling from 0.25um to 0.05um processes including the dominance of interconnect delay, increasing cross coupling capacitance, and implications for multiple clock cycles to cross chips.
The document provides an overview of the ASIC back-end design flow, including physical design steps like floorplanning, timing driven placement, clock tree synthesis, and routing. It explains key concepts in physical design like standard cell libraries, placement, routing grids and tracks, and timing driven optimization. The document also discusses verification steps after physical design like formal verification to check logic equivalence and timing analysis using RC extraction and static timing analysis to check design constraints.
In today’s world, there is an ever-increasing demand for SOC speed, performance, and features. To cater to all those needs, the industry is moving toward lower technology nodes. The current market has become more and more demanding, in turn forcing complex architectures and reduced time to market. The complex integrations and smaller design cycle emphasize the importance of floorplanning, i.e., the first step in netlist-to-GDSII design flow. Floorplanning not only captures designer’s intent, but also presents the challenges and opportunities that affect the entire design flow, from design to implementation and chip assembly.
A typical SOC can include many hard- and soft-IP macros, memories, analog blocks, and multiple power domains. Because of the increases in gate count, power domains, power modes, and special architectural requirements, most SOCs these days are hierarchical designs. The SOC interacts with the outside world through sensors, antennas, displays, and other elements, which introduce a lot of analog component in the chip. All of these limitations directly result in various challenges in floorplanning.
Floorplanning includes macro/block placement, design partitioning, pin placement, power planning, and power grid design. What make the job more important is that the decisions taken for macro/block placement, partitioning, I/O-pad placement, and power planning directly or indirectly impact the overall implementation cycle.
Lots of iterations happen to get an optimum floorplan. The designer takes care of the design parameters, such as power, area, timing, and performance during floorplanning. These estimations are repeatedly reviewed, based on the feedback of other stakeholders such as the implementation team, IP owners, and RTL designers. The outcome of floorplanning is a proper arrangement of macros/blocks, power grid, pin placement, and partitioned blocks that can be implemented in parallel.
In hierarchical designs, the quality of the floorplan is analyzed after the blocks are integrated at the top level. That can results in unnecessary iterative work, wasted resource hours, and longer cycle times, which could mean missed market opportunities. This underscores the importance of floorplanning.
In this paper, we will discuss some of the good practices, techniques, and complex cases that arise while floorplanning in an SOC.
The first rule of thumb for floorplanning is to arrange the hard macros and memories in such a manner that you end up with a core area (to be used for SOG placement) square in shape. This is always not possible, however, because of the large number of analog-IP blocks, memories, and various other requirements in design.
This document discusses various concepts related to physical design implementation. It describes the inputs and outputs of physical design tools, important checks to perform before starting design such as clock and high fanout net budgeting, and concepts like floorplanning, placement, routing, libraries, multi-voltage design, and clock tree synthesis and optimization.
The document discusses various layout optimizations that can be made to standard cells to reduce both internal power and area. These include removing "hammer head" structures to decrease transistor length, moving gate contacts over active areas to reduce transistor height, and reducing source/drain capacitances to decrease dynamic current without impacting speed. Post-layout simulations showed a new D flip-flop design with these optimizations reduced internal power by 20% while maintaining clock-to-Q delay, and improved saturation current by 15-50% while reducing area by 20%.
In the world of Very Large Scale Integration (VLSI), the Physical Design process plays a crucial role in transforming a logical design into a physical layout that can be manufactured. Among the various steps involved in the Physical Design flow, Place and Route (PnR) stand out as a critical phase. PnR consists in placing the different components of a design on a chip and routing the connections between them. In this article, we will delve into the PnR flow, exploring its key steps, challenges, and the tools involved.
1. Partitioning:
Partitioning is a preliminary step in the PnR flow that divides the design into manageable blocks or modules based on functionality, hierarchy, or timing constraints. It enables parallel processing during subsequent steps and facilitates easier placement and routing. Partitioning algorithms aim to balance the workload across partitions and minimize inter-partition communication.
2. Floorplanning:
Floorplanning is a critical aspect of the placement process, defining the overall chip's top-level structure and organizing the different functional blocks. It involves allocating space for each block, determining their relative positions, and defining the placement regions. Effective floorplanning ensures proper utilization of available chip areas, reduces congestion, and facilitates efficient routing.
3. Power Planning:
Power planning focuses on distributing power supply and ensuring a stable power delivery network throughout the chip. It involves inserting power distribution networks, decoupling capacitors, and voltage regulators to minimize voltage drop, signal noise, and power supply fluctuations. Power planning techniques aim to optimize power grid layout, reduce IR drop, and mitigate electromigration issues.
4. Placement:
Placement is the first step in the PnR flow and involves determining the optimal location for each logic component on the chip. The primary objective of placement is to minimize wire length, power consumption, and timing delays while adhering to various constraints such as blockages, power grid, and signal integrity.
5. Clock Tree Synthesis (CTS):
Clock Tree Synthesis is a crucial step in PnR flow that ensures the efficient distribution of clock signals to all sequential elements of the design. CTS aims to minimize clock skew, and power dissipation, and provide a balanced clock network. CTS algorithms construct a tree-like structure by inserting buffers and optimizing wire length to achieve reliable clock distribution.
6. Routing:
6.1 Global Routing:
Once the placement is complete, the next step is global routing, which establishes the connections between the placed components. Global routing generates a coarse routing structure using minimum spanning trees, maze routing, or other algorithms. It focuses on achieving reasonable wirelength and reducing congestion without considering the precise details of the interconnects.
Timing and Design Closure in Physical Design Flows Olivier Coudert
A physical design flow consists of producing a production-worthy layout from a gate-level netlist subject to a set of constraints. We focus on the problems imposed by shrinking process technologies. It exposes the problems of timing closure, signal integrity, design variable dependencies, clock and power/ground routing, and design signoff. It also surveys some physical design flows, and outlines a refinement-based flow.
Before 2000 area, delay and performance were the most important parameters, if anyone design circuit the main focus was on how much less area is occupied by the circuit on the chip and what the speed is. Now situation is changed, the performance and speed is a secondary concern. In all nanometer (deep sub-micron) technology power becomes the most important parameter in the design. Almost all portable devices run on battery power. Power consumption is a very big challenge in modern-day VLSI design as technology is going to shrinks Because of
Increasing transistors count on small chip
Higher speed of operations
Greater device leakage currents
Define Width and Height of Core and Die (http://www.vlsisystemdesign.com/PD-F...VLSI SYSTEM Design
https://www.udemy.com/vlsi-academy
The very first step in chip design is floorplanning, in which the width and height of the chip, basically the area of the chip, is defined. A chip consists of two parts, 'core' and 'die'.
This document discusses ASIC placement, which involves assigning exact locations to circuit components within a chip's core area. The goals of placement are to minimize the total interconnect length and costs while meeting timing requirements. It describes two main placement techniques - global placement, which groups cells to minimize interconnect between groups, and detailed placement, which further optimizes placement objectives. The document outlines various placement algorithms, goals, and trends like mixed-size placement and whitespace distribution to improve routability and performance.
2019 Local I/O ESD protection for 28Gbps to 112Gbps SerDes interfaces in adva...Sofics
2019 Taiwan ESD and reliability conference
Semiconductor companies are developing ever faster wireless, wired and optical interfaces to satisfy the need for higher data throughputs. They rely on BiCMOS, advanced CMOS and FinFET nodes with ESD-sensitive circuits. However, the parasitic capacitance of the traditional ESD solutions limits the signal frequency. This paper demonstrates small area and low-cap Analog I/Os used in TSMC 28nm CMOS and TSMC 16nm, 12nm, 7nm FinFET technologies for high speed SerDes (28Gbps to 112Gbps) circuits. Parasitic capacitance of the ESD solutions is reduced below 100fF and for some silicon photonics applications even below 20fF.
Placement is the process of determining the locations of circuit devices on a die surface. It is an important stage in the VLSI design flow, because it affects routabil- ity, performance, heat distribution, and to a less extent, power consumption of a design.
The document discusses the inputs and outputs of place and route tools used in the chip design process. It describes the .cel, .blk, .par, and .net files that are used as inputs to specify connectivity, layout structure, global parameters, and nets. The outputs include the .p11, .p12, .pin, .twf, and .out files that describe placement and routing results. The document also briefly mentions design capture tools like HDL, schematics, and floor planning, as well as design verification tools such as simulation and timing verification.
The document discusses various aspects of physical design in VLSI circuits. It describes the physical design cycle which involves transforming a circuit diagram into a layout through steps like partitioning, floorplanning, placement, routing, and compaction. It also discusses different design styles like full-custom, standard cell, and gate array. Full-custom design allows maximum flexibility but has higher complexity, while restricted models like standard cell and gate array simplify the design process at the cost of less optimization in the layout. Physical design aims to produce layouts that meet timing and area constraints.
This document discusses engineering change orders (ECOs) used to fix timing, functional, power, and clock issues after physical design and sign-off. It describes the motivation for ECOs due to tool limitations and differences between implementation and sign-off. Common ECO techniques are listed for timing (driver upsizing, buffer insertion, etc.), power (vt-swapping, downsizing, etc.), and metal-only ECOs. Timing ECO tools from Synopsys, Cadence, and other vendors are also mentioned. Upcoming ECO technologies like dynamic power optimization and automatic legalization are noted.
The journey of designing an ASIC (application specific integrated circuit) is long and involves a number of major steps – moving from a concept to specification to tape-outs. Although the end product is typically quite small (measured in nanometers), this long journey is interesting and filled with many engineering challenges.
Today, ASIC design flow is a very mature process in silicon turnkey design. The ASIC design flow and its various steps in VLSI engineering that we describe below are based on best practices and proven methodologies in ASIC chip designs. This blog attempts to explain different steps in the ASIC design flow, starting from ASIC design concept and moving from specifications to benefits.
To ensure successful ASIC design, engineers must follow a proven ASIC design flow which is based on a good understanding of ASIC specifications, requirements, low power design and performance, with a focus on meeting the goal of right time to market. Every stage of ASIC design cycle has EDA tools that can help to implement ASIC design with ease.
In semiconductor design, standard-cell methodology is a method of designing application-specific integrated circuits (ASICs) with mostly digital-logic features. Standard-cell methodology is an example of design abstraction, whereby a low-level very-large-scale integration (VLSI) layout is encapsulated into an abstract logic representation (such as a NAND gate).
Cell-based methodology – the general class to which standard cells belong – makes it possible for one designer to focus on the high-level (logical function) aspect of digital design, while another designer focuses on the implementation (physical) aspect. Along with semiconductor manufacturing advances, standard-cell methodology has helped designers scale ASICs from comparatively simple single-function ICs (of several thousand gates), to complex multi-million gate system-on-a-chip (SoC) devices.
This is the presentation that was shared by Nilesh Ranpura and Vineeth Mathramkote at CDNLIVE 2015. The session briefs about the implementation challenges and covers the solution approach and how to achieve results
This document discusses energy efficient computing architectures. It examines whether architectural features that improve performance also improve energy efficiency. Cache parameters like size affect both performance and energy consumption. Reduced Instruction Set Computing (RISC) architectures can improve performance and efficiency by making instructions a static size. Register file architectures decrease memory traffic and improve efficiency by holding small registers in cache. Wireless sensor networks aim to have long battery life through efficient hardware and software designs like turning radios off during idle periods using protocols like T-MAC.
Design and Implementation of Low Power DSP Core with Programmable Truncated V...ijsrd.com
The programmable truncated Vedic multiplication is the method which uses Vedic multiplier and programmable truncation control bits and which reduces part of the area and power required by multipliers by only computing the most-significant bits of the product. The basic process of truncation includes physical reduction of the partial product matrix and a compensation for the reduced bits via different hardware compensation sub circuits. These results in fixed systems optimized for a given application at design time. A novel approach to truncation is proposed, where a full precision vedic multiplier is implemented, but the active section of the truncation is selected by truncation control bits dynamically at run-time. Such architecture brings together the power reduction benefits from truncated multipliers and the flexibility of reconfigurable and general purpose devices. Efficient implementation of such a multiplier is presented in a custom digital signal processor where the concept of software compensation is introduced and analyzed for different applications. Experimental results and power measurements are studied, including power measurements from both post-synthesis simulations and a fabricated IC implementation. This is the first system-level DSP core using a high speed Vedic truncated multiplier. Results demonstrate the effectiveness of the programmable truncated MAC (PTMAC) in achieving power reduction, with minimum impact on functionality for a number of applications. On comparison with the previous parallel multipliers Vedic should be much more fast and area should be reduced. Programmable truncated Vedic multiplier (PTVM) should be the basic part implemented for the arithmetic and PTMAC units.
Modular blade server architectures address many challenges facing modern data centers by consolidating computing components into smaller, modular form factors that share resources to lower costs and complexity. Blades can satisfy computing needs for servers, desktops, networking and storage. They provide world-class solutions by delivering high performance, reliability, efficiency and scalability without disruption. Proper planning is required, but blade servers are highly efficient platforms for consolidating distributed servers into a common data center through their small size and ability to maximize resource utilization through virtualization.
The document discusses strategies for making data centers more energy efficient without compromising performance or reliability. It outlines 10 best practices including using more efficient processors and power supplies, server virtualization, improved cooling practices, and monitoring systems. Implementing these holistic strategies from the IT equipment level upwards can significantly reduce energy usage through cascading effects while freeing up capacity.
S3 Infotech provides summaries of 10 VLSI projects related to low-power logic circuits, level shifters, adder architectures, optical counters, modular multiplication, transaction IDs, modulo adders, DACs, median filters, and quantum-dot SRAM. The projects explore techniques like spin-based devices, dynamic voltage scaling, pipelining, and cellular automata to improve efficiency, throughput, power consumption, and process variability tolerance in VLSI design.
Area Efficient Pulsed Clock Generator Using Pulsed Latch Shift RegisterIJMTST Journal
The document describes a proposed area efficient pulsed clock generator using pulsed latch shift registers. Conventional shift registers use flip-flops which consume more power and area than latches. The proposed design uses pulsed latches instead of flip-flops to reduce power consumption and area. It solves the timing problem of using latches in shift registers by generating multiple non-overlapping delayed pulsed clock signals. Simulation results show the proposed shift register reduces power consumption by 27% and delay by 21% compared to a conventional flip-flop based shift register.
Low Power 16×16 Bit Multiplier Design using Dadda Algorithmijtsrd
This document describes the design of a low power 16x16 bit multiplier using the Dadda algorithm. It begins with an introduction explaining the importance of reducing power consumption in digital circuits. It then reviews related work on multiplier design and optimization techniques. The proposed design is implemented using Xilinx software. The Dadda algorithm is applied to break the multiplication down into smaller sub-problems by decomposing the operands. Partial products are generated and combined using a Dadda tree structure with optimized full adders to further reduce power. A block diagram and dot diagram illustrate the implementation of the proposed 16x16 bit Dadda multiplier.
DESIGN OF SIMULATION DIFFERENT 8-BIT MULTIPLIERS USING VERILOG CODE BY SAIKIR...Saikiran perfect
This project compares 4 different 8-bit multipliers - Wallace tree, array, Baugh-Wooley, and Vedic multipliers - using Verilog code. Simulations show that Wallace tree multipliers consume more power than array multipliers. Array multipliers are preferred for low power applications. The project designs and simulates the multipliers to analyze power consumption and determine the best option for low power, high speed applications like DSP systems.
The document describes IBM's Data Engine for NoSQL solution for Power Systems. It leverages CAPI to attach flash memory to POWER8 processors, providing up to 57TB of flash as an alternative to expensive DRAM for NoSQL implementations like Redis. This reduces costs while providing sufficient performance for most applications. The solution includes software that provides APIs for applications to access the flash similarly to main memory.
This document evaluates the performance and energy efficiency of running Apache Spark applications on low-power system-on-chip (SoC) processors compared to high-performance processors typically used in data centers. It summarizes related work comparing low-power and high-performance processors. The document then provides details on the Spark framework and the VINEYARD project, which aims to develop energy-efficient heterogeneous data centers using customized hardware accelerators like FPGAs and SoCs. It concludes that deploying low-power embedded processors for Spark could achieve up to 3x higher energy efficiency than high-performance processors.
A Low Power Delay Buffer Using Gated Driver TreeIOSR Journals
This document describes a low power delay buffer circuit that uses several techniques to reduce power consumption. It uses a ring counter addressing scheme with double-edge triggered flip-flops to reduce the clock frequency in half. It also proposes a novel gated clock driver tree to reduce activity on the clock distribution network. The gated driver tree idea is also applied to the input and output ports of the memory block to decrease loading and further reduce power. Simulation results show the effectiveness of these techniques in reducing power consumption for the delay buffer circuit.
G-SLAM:OPTIMIZING ENERGY EFFIIENCY IN CLOUDAlfiya Mahmood
G-SLAM is a framework that optimizes energy efficiency in clouds through software, hardware, and network techniques. It proposes using a Green Service Level Agreement (GSLA) to maintain performance while optimizing for energy efficiency. The software approach reduces active servers through techniques like Ant Colony Optimization and Power Aware Best Fit Decreasing allocation. Hardware techniques apply Dynamic Voltage Frequency Scaling and Dynamic Voltage Scaling to servers. Network techniques aim to reduce traffic and optimize routing through algorithms like Data Center Energy Efficient Network Aware Scheduling and Energy and Topology aware VM Migration.
- Intelligent power management in data centers is important to reduce costs and downtime. Power distribution units (PDUs) play a key role by measuring, switching, and monitoring power usage at the rack level.
- Good PDUs can identify high power users, remotely power cycle equipment to prevent outages, and trigger alarms when power limits are approached to address issues proactively.
- Using PDUs with these capabilities along with defining appropriate power thresholds allows data centers to optimize power efficiency ongoing and solve problems before they lead to downtime.
A Brief Survey of Current Power Limiting StrategiesIRJET Journal
This document provides an overview of current power limiting strategies used in computing systems. It begins with background on power capping capabilities in Intel processors using Running Average Power Limit (RAPL). The document then reviews over 15 strategies that directly limit power consumption while minimizing performance impact, including feedback controllers, dynamic voltage and frequency scaling, task scheduling policies, and power budgeting techniques. It concludes that power limiting has become important for maximizing exascale system performance within power constraints.
A LIGHT WEIGHT VLSI FRAME WORK FOR HIGHT CIPHER ON FPGAIRJET Journal
This document discusses the implementation of a lightweight VLSI design for the HIGHT cipher on an FPGA. It begins with an introduction to lightweight VLSI architecture and its applications in low-resource devices. It then provides background on the HIGHT cipher and discusses prior work implementing cryptographic algorithms on FPGAs. The document goes on to describe the proposed VLSI design for the HIGHT cipher, which is optimized for size, power, and speed. It achieves a throughput of 25 Mbps with an encryption/decryption delay of 0.64 ms. Evaluation results demonstrate the effectiveness and suitability of the design for low-power applications.
This document discusses implementing a supervisory control and data acquisition (SCADA) system for power system automation using a microcontroller. SCADA systems allow utilities to remotely monitor and control substations to improve reliability and efficiency. Specifically, the document proposes using an 8085 microcontroller as a remote terminal unit (RTU) in a SCADA system to reduce costs compared to traditional implementations. It also suggests a distributed dual computer approach to avoid communication bottlenecks when monitoring a large number of RTUs from a control center. The goal is to provide a lower-cost but still user-friendly solution for power system automation and monitoring.
This document discusses the implementation of a Radix-4 Booth multiplier using VHDL. It begins with an introduction to multipliers and their importance in digital circuits. It then provides background on Booth multiplication algorithms and related work that has been done to improve multiplier speed and efficiency. The methodology section describes the design of a configurable Booth multiplier that can detect the bit range of the operands and perform the multiplication accordingly in fewer cycles to reduce delay. Simulation results are provided to verify the operation of the Radix-4 Booth multiplier design for different input values.
HP: HP 3PAR - Storage zrodený pre virtualizované prostredieASBIS SK
This document discusses HP 3PAR Utility Storage. It notes that 3PAR offers efficiencies of consolidation while maximizing flexibility, can be integrated with best-of-breed infrastructure, and offers SLA resiliency beyond just storage HA. It also notes that 3PAR is optimized for specific requirements of virtualized computing like increasing consolidation and simplifying administration. The document provides details on how 3PAR uses thin provisioning, thin conversion, and thin reclamation technologies to reduce storage costs and capacity requirements.
Low Power VLSI Design of Modified Booth Multiplieridescitation
Low power VLSI circuits became very vital criteria
for designing the energy efficient electronic designs for prime
performance and compact devices. Multipliers play a very
important role for planning energy economical processors that
decides the potency of the processor. To scale back the facility
consumption of multiplier factor booth coding methodology
is being employed to rearrange the input bits. The operation
of the booth decoder is to rearrange the given booth equivalent.
Booth decoder can increase the range of zeros in variety. Hence
the switching activity are going to be reduced that further
reduces the power consumption of the design. The input bit
constant determines the switching activity part that’s once
the input constant is zero corresponding rows or column of
the adder ought to be deactivated. When multiplicand contains
a lot of number of zeros the higher power reduction will takes
place. therefore in booth multiplier factor high power
reductions are going to be achieved.
ALGORITHM LEVEL ANALYSIS and DATA CORRELATIONNAVEEN TOKAS
The document discusses power consumption at the algorithm level. It makes three key points:
1. Algorithm power consumption can be divided into algorithm inherent dissipation (AID) and implementation overhead. AID is fundamental to the algorithm's functionality, while overhead depends on hardware architecture choices.
2. AID can be estimated as a weighted sum of the algorithm's operations, using capacitances that reflect each operation. Implementation overhead includes control interconnect and registers, and depends strongly on architectural properties like locality.
3. Techniques for minimizing algorithm-level power consumption include voltage reduction, avoiding wasteful activity through operations reduction and strength reduction, and exploiting algorithm properties like locality and regularity.
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1. SIEMENS DIGITAL INDUSTRIES SOFTWARE
Aprisa place-and-route for
low-power SoCs
A place-and-route methodology for lowest-power-optimized PPA
Executive summary
The Aprisa digital design software helps designers address the many challenges of
low-power designs. Aprisa is the most flexible IC place-and-route tool on the
market—it accepts all industry-standard power formats, has excellent correlation to
third-party signoff tools, and is easy to install, set up, and use. With effective
technology and impressive usability, the Aprisa software ensures cost-effective tape-
outs for power-sensitive designs. This paper introduces the Aprisa low power
solution and innovative low-power methodology to quickly converge on low-power-
optimized power, performance, and area.
Author: Janet Attar
siemens.com/software
2. Contents
Low Power Challenges in Place-and-Route
Introduction to the Aprisa P&R Solution
Aprisa Low Power Technologies - PowerFirst
Aprisa Low Power Technologies - Multiple Power
Domain Support
Built-in Power Domain Checker
Conclusion
Whitepaper – Aprisa place-and-route for low-power SoCs
SIEMENS DIGITAL INDUSTRIES SOFTWARE 2
3. Low Power Challenges in Place-and-
Route
Power, performance, and area (“PPA” for
short) is a phrase in the IC design community
commonly uses when describing the three
key areas to focus on in optimizing an IC
design. Traditionally, when talking about PPA
metrics, “performance” has been the primary
focus. That is, the primary design goal is to
achieve performance goals at all costs and
then work to recover power and area with
minimal effect on timing, or with some
small, relatively harmless tradeoff. But as
designs have moved to smaller, more
advanced process nodes, and as switching
activity has become a dominant component
in power consumption, power has at times
pushed “performance” aside to become the
dominant focus in PPA. Of course, designers
don’t want slower-performing chips, but
power consumption is growing in
importance.
How can strict power specs be achieved
without sacrificing performance during the
implementation phase of the IC design
process? Many of the challenges of achieving
low-power during place-and-route (P&R)
relate to how well the P&R software handles
multiple power domains and the kind of
optimizations the software performs
throughout the flow to achieve low power
goals.
The P&R software used in the digital
implementation flow must be able to buffer
on multiple power domains without errors
and perform placement of all power
management cells such as level shifters,
isolation cells, power switch cells, and
retention flip-flops. Power-sensitive designs
also require routing secondary power/ground
pins and routing to the power grid inside the
voltage islands.
This white paper examines how the Siemens
Aprisa P&R tool addresses these power
challenges in two main ways:
• Through PowerFirst implementation
technology that reduces total power
consumption
• Through multi-power domain
methodology support
But first, a short introduction to the Siemens
Aprisa P&R solution.
Whitepaper – Aprisa place-and-route for low-power SoCs
SIEMENS DIGITAL INDUSTRIES SOFTWARE 3
4. Introduction to the Aprisa P&R
Solution
Aprisa is a best-in-class digital P&R software
for hierarchical and block-level designs.
Aprisa was built from the ground up using
modern algorithms to be a detail-route-
centric P&R tool for fast design closure of
hierarchical and block-level designs. By
considering the impacts of detail route
information throughout the physical design
flow, Aprisa can tame the challenges of
advanced process node designs, turning
complexity into a competitive advantage.
Aprisa uses a unified data model that is
shared throughout the entire flow, so there
are no data or format conversions between
implementation steps. In addition, the
unified data model allows real routing
information and parasitics to be available to
each step in the flow, resulting in consistent
timing and DRC and excellent correlation to
signoff tools.
Aprisa delivers the best PPA for advanced
node designs with patented P&R and
optimization technologies, ease of use, and
complete support for low-power design
methodologies which will be presented in
more detail in the following sections. Figure
1 illustrates the Aprisa architecture.
Figure 1. Aprisa architecture for detail-route-
centric implementation.
Aprisa Low Power Technologies -
PowerFirst
With the design goal of meeting strict power
specifications without sacrificing
performance, Aprisa PowerFirst optimization
takes “best power” as the top priority and
works towards that goal throughout the
flow, using activity-based placement and
routing for lower dynamic power. By starting
with the power metric as the top goal during
optimization, the P&R flow can achieve the
best possible power for that node, library,
and design specs, and then optimize from
that point to reach the timing target (figure
Whitepaper – Aprisa place-and-route for low-power SoCs
SIEMENS DIGITAL INDUSTRIES SOFTWARE 4
5. 2). This method is more effective than trying
to recover power once the most power-
hungry cells have already been used in the
design to achieve timing.
Figure 2. PowerFirst starts from the best
power and optimizes to achieve the timing
target.
However, designing for power is not just a
matter of choosing cells that save power.
That’s why PowerFirst is considered a
methodology, not a single feature; it touches
all engines and steps in the flow to ensure
power-centric design implementation that
can ultimately meet the performance targets
for the chip.
Activity-Driven Methodology for
Dynamic Power
Dynamic power is the dominant concern for
high-performance designs. Aprisa uses
switching activity throughout the flow to
optimize dynamic power.
When the switching activity information is
available, all Aprisa engines have access to
that information and can use it to make low-
power decisions with respect to dynamic
power. For example, as seen in figure 3, the
placement engine will use the switching
information to ensure the high-activity nets
have less capacitance compared to the low-
activity nets. Aprisa can minimize the net
capacitance on those high-activity nets in a
number of ways, starting early in the flow.
Ensuring power optimization from the start
gives better results than using power
recovery techniques later in the flow.
Similarly, during clock tree synthesis (CTS),
Aprisa keeps the high-activity net
connections short in the design to reduce
capacitance, and the low-activity nets can be
spread out to relieve congestion.
The Aprisa router (shown in the last card in
figure 3), spaces the high-activity nets to
reduce the coupling capacitance and reduce
power, but switching activity information
allows the router to make decisions about
what rules to apply to high- and low-activity
nets, as routing resources need to be
managed carefully. All the various design
engines in Aprisa use the switching activity
information, so they can work to reduce
power at every stage of the physical design.
Whitepaper – Aprisa place-and-route for low-power SoCs
SIEMENS DIGITAL INDUSTRIES SOFTWARE 5
6. Figure 3. Managing coupling capacitance at various steps.
Clock Transition Fixing for Better
Power
Aprisa can reduce switching power by
slowing down the sharp transition of the
buffers on the clock tree. The goal is to
reduce the clock power without violating
transition limits. On a timing-only driven
design, Aprisa will focus on achieving a sharp
transition for most buffers. However, on a
power-first design, Aprisa will slow down the
transition of many of those buffers without
causing transition violations. This technique
achieves significantly lower switching power
for both cell and nets and in the process can
also save area.
Tradeoff Small Timing for Large
Power Reduction in CTS
With the PowerFirst methodology, Aprisa
starts early with power vs. timing tradeoffs.
When building the clock tree, the typical goal
is to achieve the best latency and skew, but
this can result in using larger buffers and
more of them than what are really needed
(figure 4).
Whitepaper – Aprisa place-and-route for low-power SoCs
SIEMENS DIGITAL INDUSTRIES SOFTWARE 6
7. Figure 4. Trade off small timing for large power reduction in CTS.
With a very tight skew, the launch and
capture clocks are balanced and the datapath
can more easily meet timing. With a larger
skew, although the datapath may not initially
meet timing, it can be fixed through
optimizations like upsizing a cell or adding a
buffer. Allowing a larger skew ends up
relieving the costs in terms of power that
come with a very tight skew, even on the
critical branch.
For the non-critical branch, large and smaller
buffers are sometimes used in combination
to achieve a tight skew. But if the path is not
critical, timing is already met, and the tighter
skew is not required. This means that a little
timing can be sacrificed to reclaim other
metrics like power by switching some of the
large buffers for smaller ones.
Aprisa looks at the slack value to see if it can
cover some of it through datapath
optimization; and if that is the case, it can
downsize the buffering or remove some
buffers altogether in the clock tree. This
becomes a good tradeoff between timing
and power, and it is a benefit for routing
resources and area.
Multi-Bit-Register Merging and De-
Merging
Another technique, perhaps one of the most
popular during physical implementation for
reducing dynamic power is using multi-bit
flip-flops because they reduce total power by
a significant amount.
Aprisa can merge low bit flip-flops into
higher bit flip-flops, up to 4- or 8-bit
depending on the availability of those cells in
the library (figure 5). This reduces dynamic
power significantly while the place
optimization engine ensures that there is no
effect on timing.
Whitepaper – Aprisa place-and-route for low-power SoCs
SIEMENS DIGITAL INDUSTRIES SOFTWARE 7
8. During optimization, those paths where the
timing potentially degraded due to merging
can be de-merged to improve the timing.
Aprisa does this dynamically and
automatically, achieving a greater number of
multi bit flip-flops while maintaining time
design closure. The advantage of having
Aprisa merge and de-merge during P&R
rather than performing that operation
through logical connection during synthesis
for example, is that it can do so within a
physical-aware context. It knows the
connections and placement of those multi-
bit cells, and it can make merge decisions
based on that information, thus achieving
timing closure and greater dynamic power
reduction.
Figure 5. Merging and de-merging multi-bit flip flops.
Full LVF Analysis and Optimization
to Reduce Over-Design
Optimization techniques alone are not
enough if the analysis data is not accurate.
As technology nodes advanced, on-chip
variation (OCV) became increasingly critical
to design timing and the industry developed
many OCV methodologies to manage the
effects. With the introduction of 10 nm and
below process nodes, the Liberty Variation
Format (LVF) further enhanced the OCV
methodology and introduced a table look up
for the mean and variants of a gate,
according to the input slew and output load.
LVF is the most advanced OCV methodology
to date, and it is required by foundries for
advanced process nodes. The LVF support is
not only needed for signoff STA, but it is also
needed during timing optimization. With
native and precise support of LVF, Aprisa can
avoid unnecessary timing pessimism and
avoid over-design, thus improving design
PPA.
Aprisa’s support of LVF allows accurate
optimization for the real failing paths,
resulting in better power. Reading LVF
natively also means that Aprisa is well
correlated with signoff timing, which
eliminates unnecessary ECO iterations and
improves time to design closure.
Whitepaper – Aprisa place-and-route for low-power SoCs
SIEMENS DIGITAL INDUSTRIES SOFTWARE 8
9. Example Results from PowerFirst
Methodology
PowerFirst optimization reduces the internal,
switching, and leakage power of the most
power-sensitive designs while minimizing
timing tradeoffs. In the design shown here, a
DDR PHY in 7 nm with about 1.3M instances
and a 1 GHz frequency, The customer used
Aprisa to optimize total power using the
PowerFirst techniques. This includes vector
and vectorless activity-driven place and
route, timing, placement aware multi-bit
register merging and de-merging, and
PowerFirst CTS for clock buffer sizing and
transition fixing.
The chart in figure 6 shows that using the
PowerFirst techniques in Aprisa reduces the
total power by 16% compared to Aprisa in
timing-only mode while maintaining the
achieved timing correlated to signoff. The
results from a competitor’s P&R tool in power
savings mode did not achieve the same level
of total power reduction as Aprisa.
Figure 6. Results of Aprisa PowerFirst on internal, switching, and leakage power at sign-off.
Aprisa Low Power Technologies -
Multiple Power Domain Support
While PowerFirst techniques work directly to
reduce dynamic and leakage power, multi-
power domain support ensures all the
elements required in a low power design are
included and used in accordance with the
low-power specs.
Aprisa has comprehensive multi-power
domain support, and it supports UPF. UPF
contains the power intent and unique
functions specific to multi-voltage designs.
This can determine what power
management cells should be implemented in
the design.
Whitepaper – Aprisa place-and-route for low-power SoCs
SIEMENS DIGITAL INDUSTRIES SOFTWARE 9
10. Aprisa can do automatic insertion of power
management cells, such as isolation cells,
level shifters, power switches, always-on/
regular buffer selection.
Its unique Power Domain Checker can flag
the errors related to power domain, cell
placement, connectivity, and buffering.
Figure 7 illustrates power state table
representation of power intent.
Figure 7. Power state table representation of
power intent.
Power Switches
Power switch rules can be defined with UPF
to indicate where they are needed and how
they should be connected. Typically, power
switches connect one or more input supply
nets to a single output supply net based on
control inputs.
There are two types of connections: a header
cell and a footer cell. The header cell (which
is the most common) switches the power
supply. A footer cell switches ground supply.
Power switches may be inserted around the
perimeter of the power domain or distributed
throughout the domain, as shown in the two
pictures in figure 8.
Aprisa can insert power switches and place
them in rows, columns, arrays, rings, or
checkerboard patterns (around or over a
block), and it can daisy-chain the enable
pins.
Figure 8. Power switch placement options.
Whitepaper – Aprisa place-and-route for low-power SoCs
SIEMENS DIGITAL INDUSTRIES SOFTWARE 10
11. Always-on Buffering in Multi-
voltage Designs
Aprisa has two main methodologies for
always-on-buffer support: Always on buffer
cells and voltage islands.
Always on buffers are repeaters powered by a
supply different from the power domain
supply where they are located. They
therefore require a secondary PG pin to
connect to that alternate supply. When these
repeaters are available in the library, Aprisa
can insert them and handle the routing of
that secondary PG pin to the alternate power
supply.
The second method uses power islands or
voltage islands that are created to the specs
of the design. Aprisa places regular repeaters
on those islands, which are connected to a
grid of a different power supply. The images
in figure 9, show the different methodologies
of using an always-on cell (left), and of using
a regular repeater inside a voltage or power
island (right).
Figure 9. Always-on cell vs. voltage island.
Connection to Supply Always-On Buffers
Multi-power domain designs pose specific challenges to P&R tools when it comes to routing.
While designers must weigh the advantages and disadvantages of using always-on buffers
(AON) vs voltage islands, both require careful management when it comes to routing. Aprisa
helps designers ease those challenges no matter what technique is chosen by extending the
capabilities of its patented sibling routing technology for use on power signals and regular
signals from repeaters used within voltage islands.
In the case of AON cells, as shown on the left side of figure 10, Aprisa can automatically
connect the tie signal to the nearest always-on rail. Using these repeaters gives the flexibility of
placing them exactly where needed, but if the connection to the alternate supply is long, this
could lead to IR drop issues.
Whitepaper – Aprisa place-and-route for low-power SoCs
SIEMENS DIGITAL INDUSTRIES SOFTWARE 11
12. Figure 10. Connection to supply always-on buffers.
To reduce such issues, sibling via pillars are used to route the AON repeater’s secondary PG pin
to the always-on supply as shown in figure 11 (left). This technique produces a cleaner routing
topology (right), thus reducing IR drop issues.
Figure 11. Sibling routing technology for alternative power supply.
When using voltage islands (figure 10, right),
the island itself has a different supply and
regular repeaters can be used in this case.
There is a tradeoff between how many of
these islands to add to the design, and how
far to spread them out. Too many, and there
is an area, congestion, and routing penalties;
too few and there may be timing issues on
the buffer are placed to resolve a timing issue
to begin with. Furthermore, if the islands are
too sparse it can lead to buffers not being
placed in an optimal location.
Whitepaper – Aprisa place-and-route for low-power SoCs
SIEMENS DIGITAL INDUSTRIES SOFTWARE 12
13. Aprisa can use sibling routing technology to
connect the pins of those repeaters creating
the via pillars on the fly without the designer
having to manually intervene. Sibling routing
is able to access the lower layer metal pins
with a parallel wire structure only available
with the Aprisa router. It uses “parallel wires”
to connect to the pins as well as to vias up to
the higher layers. Sibling wires are
automatically created during route
optimization only on those nets that need it.
However, designers have the flexibility to
create them with NDR-like rules called sibling
route rules. Sibling routing reduces
resistance, which helps with
electromigration (EM) and improves timing.
Sibling Routing and Secondary PG Pins
As previously discussed, IR drop on secondary PG nets is a big concern, and it impacts the
performance of the always-on cells. Aprisa can use sibling route to reduce resistance on those
secondary PG nets. Figure 12 (left) shows the secondary PG pins routed in the traditional
manner, and the resistance of the secondary power net is 242 Ohms. With sibling route (right),
resistance is reduced significantly to 128 Ohms.
Figure 12. Resistance on secondary power nets with regular routing vs. sibling routing.
A unique strength of Aprisa is that it can do resistance-aware secondary PG routing, which can
result in optimal use of routing resources. Aprisa can dynamically decide where to place sibling
routes to use them only as required to conserve those routing resources.
To recap, sibling routing technology is intended to create the shortest possible connection to
ensure the least resistance: (1) by sharing of fanout to use optimal routing resources; (2) with
NDRs and sibling rules that can be applied on lib pins; and (3) the extension of this patented
technology can be used to route secondary PG pins to reduce IR drop when using always-on
buffers.
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14. Built-in Power Domain Checker
Aprisa offers a comprehensive power domain checker within the tool that checks multi-voltage
setup, power management cells, and correct connectivity. A view of the power domain checker
is shown in figure 13.
Figure 13. Built-in Power Domain Checker.
Aprisa’s checker can identify all the power domain-related errors without the need of an
external verification tool and long before going to signoff, which can ensure correct-by-design
low-power methodology and use of power management cells as required.
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15. In general, most power management cells will already be inserted on the synthesized netlist,
and Aprisa’s power domain checker can catch any missing or incorrect cells. If missing, Aprisa
can insert those power management cells, such as level shifters and isolation cells, and then do
optimization. It can also provide information after optimization to ensure there are no errors in
a way that is easy and intuitive to use and review. Having the checker integrated allows the
designer to do follow-up checks after other optimization steps, keeping tabs on any errors that
may have occurred at any step.
Having this information during P&R can help designers fix any issues while routing resources,
congestion and timing are still manageable. This also allows for an accurate picture of PPA
metrics, and helps keep close correlations with signoff tools, which can avoid costly ECOs.
Conclusion
Design teams will always strive to achieve the best possible PPA. As process technologies
introduce greater challenges to power and as more applications strive for better power
management, having tools and new methodologies to better manage power has become ever
more essential. The Siemens team has put a lot of thought and ingenuity into helping
implementation teams converge on the best PPA possible. To learn more, visit the Aprisa web
page [https://eda.sw.siemens.com/en-US/ic/aprisa/] .
Whitepaper – Aprisa place-and-route for low-power SoCs
SIEMENS DIGITAL INDUSTRIES SOFTWARE 15