New applications are transforming the market and technology playing field for CMOS image sensors
It’s ten years down the line from the initial Apple iPhone that started the smartphone era. Since then, CMOS imaging has benefited from huge market demand and a technology-driven environment, resulting in an $11.6B industry in 2016. Photography and video is the main application, which is totally transformed by new use cases, new devices and new technologies.
The mobile market is key for the CMOS image sensor (CIS) industry. Despite saturation in the number of handsets, the CIS market has been able to maintain a 10.5% compound annual growth rate (CAGR) for the 2016-2022 period due to the introduction of dual and 3D cameras. These additional cameras are changing the industry’s drivers from form factor and image quality to interactivity.
Penetration into higher added value markets such as automotive, security and medical shows that CIS products are transforming use cases across the board. CIS technology adoption allows greater automation levels at low cost, while using newly available computing architectures such as deep learning. The CMOS image sensor industry is currently in a virtuous circle where a new technology is providing true customer value.
Camera Module Industry 2017 Report by Yole Developpement Yole Developpement
New technologies and applications have restructured the Compact Camera Module industry
AT 12.2% CAGR FOR THE NEXT FIVE YEARS, THE COMPACT CAMERA MODULE INDUSTRY (CCM) IS A GROWTH POWERHOUSE WITH NUMEROUS LARGE COMPANIES THRIVING IN A DYNAMIC MARKET
In 2015, Yole Développement published its first report on the camera module industry and mentioned the immaturity of the ecosystem with numerous small players especially for module assembly. Now the dust has settled and giant camera module players have emerged such as LG Innotek, Semco, Foxconn Sharp, O-Film and Sunny Optical. This 2017 edition is giving you the insights into the trajectory of the industry and of more than 30 players serving mobile and other applications such as automotive and security.
Historically one could differentiate the faith of camera module market from the sub parts such as the image sensor, the lens and the autofocus or optical image stabilization system (Voice Coil Motors - VCM). It seems that differentiated growth has now ended and every sub segment is enjoying almost equal benefit from the rising market tide. This convergence is in part due to the end of quasi-monopoly from Sony in the image sensor sub-segment now joined by Samsung and Omnivision. The story is very similar for Largan Precision in the lens set sub-segment which is now facing renewed competition from Sunny Optical, Kantatsu and Genious Optical.
The last sub-domain of our interest in this report is VCMs. The growth of VCM companies has been undercut by dire structuration efforts. We had mentioned the inability of the VCM to serve the demand in the mobile market. Price pressures have changed the face of competition with competitors such as Mitsumi and Shicoh which were forced out and new players such as New Shicoh and Jawha to take center stage.
More information on that report at http://www.i-micronews.com/reports.html
3D Imaging & Sensing 2018 Reports by Yole DeveloppementYole Developpement
The iPhone X initiated a trend. What happens next?
More information here: https://www.i-micronews.com/category-listing/product/p3d-imaging-sensing-2018.html
For the full video of this presentation, please visit:
https://www.embedded-vision.com/industry-analysis/video-interviews-demos/2d-and-3d-sensing-markets-applications-and-technologies-pre
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Guillaume Girardin, Photonics, Sensing and Display Division Director at Yole Développement, delivers the presentation "2D and 3D Sensing: Markets, Applications, and Technologies" at the Embedded Vision Alliance's September 2019 Vision Industry and Technology Forum. Girardin details the optical depth sensor market and application trends.
Proliferation of cameras for imaging and sensing is driving CMOS image sensor (CIS) growth.
More information on that report at : https://www.i-micronews.com/report/product/status-of-the-cis-industry-2018.html
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
For the full video of this presentation, please visit:
https://www.edge-ai-vision.com/2020/03/market-analysis-on-socs-for-imaging-vision-and-deep-learning-in-automotive-and-mobile-markets-a-presentation-from-yole-developpement/
For more information about edge AI and vision, please visit:
http://www.edge-ai-vision.com
John Lorenz, Market and Technology Analyst for Computing and Software at Yole Développement, delivers the presentation “Market Analysis on SoCs for Imaging, Vision and Deep Learning in Automotive and Mobile Markets” at the Edge AI and Vision Alliance’s March 2020 Vision Industry and Technology Forum. Lorenz presents Yole Développement’s latest analysis on the evolution of SoCs for imaging, vision and deep learning.
Camera Module Industry 2017 Report by Yole Developpement Yole Developpement
New technologies and applications have restructured the Compact Camera Module industry
AT 12.2% CAGR FOR THE NEXT FIVE YEARS, THE COMPACT CAMERA MODULE INDUSTRY (CCM) IS A GROWTH POWERHOUSE WITH NUMEROUS LARGE COMPANIES THRIVING IN A DYNAMIC MARKET
In 2015, Yole Développement published its first report on the camera module industry and mentioned the immaturity of the ecosystem with numerous small players especially for module assembly. Now the dust has settled and giant camera module players have emerged such as LG Innotek, Semco, Foxconn Sharp, O-Film and Sunny Optical. This 2017 edition is giving you the insights into the trajectory of the industry and of more than 30 players serving mobile and other applications such as automotive and security.
Historically one could differentiate the faith of camera module market from the sub parts such as the image sensor, the lens and the autofocus or optical image stabilization system (Voice Coil Motors - VCM). It seems that differentiated growth has now ended and every sub segment is enjoying almost equal benefit from the rising market tide. This convergence is in part due to the end of quasi-monopoly from Sony in the image sensor sub-segment now joined by Samsung and Omnivision. The story is very similar for Largan Precision in the lens set sub-segment which is now facing renewed competition from Sunny Optical, Kantatsu and Genious Optical.
The last sub-domain of our interest in this report is VCMs. The growth of VCM companies has been undercut by dire structuration efforts. We had mentioned the inability of the VCM to serve the demand in the mobile market. Price pressures have changed the face of competition with competitors such as Mitsumi and Shicoh which were forced out and new players such as New Shicoh and Jawha to take center stage.
More information on that report at http://www.i-micronews.com/reports.html
3D Imaging & Sensing 2018 Reports by Yole DeveloppementYole Developpement
The iPhone X initiated a trend. What happens next?
More information here: https://www.i-micronews.com/category-listing/product/p3d-imaging-sensing-2018.html
For the full video of this presentation, please visit:
https://www.embedded-vision.com/industry-analysis/video-interviews-demos/2d-and-3d-sensing-markets-applications-and-technologies-pre
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Guillaume Girardin, Photonics, Sensing and Display Division Director at Yole Développement, delivers the presentation "2D and 3D Sensing: Markets, Applications, and Technologies" at the Embedded Vision Alliance's September 2019 Vision Industry and Technology Forum. Girardin details the optical depth sensor market and application trends.
Proliferation of cameras for imaging and sensing is driving CMOS image sensor (CIS) growth.
More information on that report at : https://www.i-micronews.com/report/product/status-of-the-cis-industry-2018.html
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
For the full video of this presentation, please visit:
https://www.edge-ai-vision.com/2020/03/market-analysis-on-socs-for-imaging-vision-and-deep-learning-in-automotive-and-mobile-markets-a-presentation-from-yole-developpement/
For more information about edge AI and vision, please visit:
http://www.edge-ai-vision.com
John Lorenz, Market and Technology Analyst for Computing and Software at Yole Développement, delivers the presentation “Market Analysis on SoCs for Imaging, Vision and Deep Learning in Automotive and Mobile Markets” at the Edge AI and Vision Alliance’s March 2020 Vision Industry and Technology Forum. Lorenz presents Yole Développement’s latest analysis on the evolution of SoCs for imaging, vision and deep learning.
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
Paramount to the future of safety and autonomy, the automotive imaging market is at a key crossroads.
More information on https://www.i-micronews.com/products/imaging-for-automotive-2019/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Artificial Intelligence Computing for Automotive 2019 Report by Yole Développ...Yole Developpement
Artificial Intelligence for automotive: why you should care.
More information on that report at: https://www.i-micronews.com/produit/artificial-intelligence-computing-for-automotive-2019/
Automotive Packaging: Market and Technologies Trends 2019 report by Yole Déve...Yole Developpement
Automotive Packaging: Market and Technologies Trends 2019
More information on https://www.i-micronews.com/products/automotive-packaging-market-and-technologies-trends-2019/
Emerging semiconductor substrates are expected to grow at a 24% CAGR from 2018 – 2024.
More information on https://www.i-micronews.com/products/emerging-semiconductor-substrates-market-technology-trends-2019/
LiDAR for Automotive and Industrial Applications 2019 by Yole DéveloppementYole Developpement
Is rationalization happening in the LiDAR market?
More information on: https://www.i-micronews.com/produit/lidar-for-automotive-and-industrial-applications-2019/
Status of the Power Electronics Industry 2017 Report by Yole Developpement Yole Developpement
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022.
SOLAR AND ELECTRIC VEHICLE POWER CONVERTER MARKETS GREW SPECTACULARLY – BY MORE THAN 20% – LAST YEAR, DRIVING GROWTH IN THE EXPANDING IGBT MARKET
The power electronics sectors continue to expand their presence almost everywhere. Renewable energies and e-mobility, including electric and hybrid vehicles (EV/HEVs), are especially boosting this market. Both the solar and EV/HEV converter markets grew by over 20% between 2015 and 2016. At the semiconductor level, the power semiconductor market grew by 3.8% compared to 2015. This year, Yole Développement has enlarged its power semiconductor market analysis to all types of power integrated circuits (ICs) including power management ICs, linear regulators and switching regulators, representing a total market of $28B. Among all the different types of power devices including thyristors, MOSFETs, IGBTs and power ICs, IGBTs made the greatest progress, with around 8% growth.
Yole Développement’s decision to start analyzing the power IC market evolution closely is part of an effort to cover the whole power spectrum of this market. We now encompass the complete range from low power, low voltage, highly integrated power management ICs in mobile phones to more robust, high power IGCT modules used in trains.
The report also covers the fast-emerging wide band gap (WBG) semiconductor market, identifying today and tomorrow’s leading silicon carbide (SiC) and gallium nitride (GaN) players and the key technological details. ‘Status of Power Electronics Industry 2017 (SPEI 2017)’ describes the evolution and forecasts the future of the power inverter, power device and silicon wafer markets.
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
Artificial Intelligence Computing for Consumer 2019 report by Yole Développem...Yole Developpement
While AI is a feature expected in smartphones, this fantastic technology has spread like wildfire to the smart home ecosystem and is profoundly impacting the semiconductor industry.
More information on https://www.i-micronews.com/products/artificial-intelligence-computing-for-consumer-2019/
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
More information on: https://www.i-micronews.com/products/high-end-inertial-sensors-for-defense-aerospace-and-industrial-applications-2020/
Sensors and Sensing Modules for Smart Homes and Buildings - 2017 Report by Yo...Yole Developpement
Smart homes and buildings: The “Trojan Horse” strategy
To achieve greener and more secure homes and buildings requires a shift in sensing from today’s basic functions such as turning light switches on or off to more advanced functions. Three main drivers are currently leading the smart buildings market:
Better energy control. With 40% of the world’s energy used for buildings, mostly for heating in residential and lighting in commercial, this is a very strong driver.
Increased security with detection of intrusion, fires and seismic activity.
Better comfort for occupants with sensor modules or hubs like those manufactured by Google/Nest, Fibaro, Smarthings, Canary, and Elgato Eve. They generally include 1-10 sensors, an energy source and a wireless module.
For more information, visit our website: https://www.i-micronews.com/reports.html
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
Paramount to the future of safety and autonomy, the automotive imaging market is at a key crossroads.
More information on https://www.i-micronews.com/products/imaging-for-automotive-2019/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Artificial Intelligence Computing for Automotive 2019 Report by Yole Développ...Yole Developpement
Artificial Intelligence for automotive: why you should care.
More information on that report at: https://www.i-micronews.com/produit/artificial-intelligence-computing-for-automotive-2019/
Automotive Packaging: Market and Technologies Trends 2019 report by Yole Déve...Yole Developpement
Automotive Packaging: Market and Technologies Trends 2019
More information on https://www.i-micronews.com/products/automotive-packaging-market-and-technologies-trends-2019/
Emerging semiconductor substrates are expected to grow at a 24% CAGR from 2018 – 2024.
More information on https://www.i-micronews.com/products/emerging-semiconductor-substrates-market-technology-trends-2019/
LiDAR for Automotive and Industrial Applications 2019 by Yole DéveloppementYole Developpement
Is rationalization happening in the LiDAR market?
More information on: https://www.i-micronews.com/produit/lidar-for-automotive-and-industrial-applications-2019/
Status of the Power Electronics Industry 2017 Report by Yole Developpement Yole Developpement
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022.
SOLAR AND ELECTRIC VEHICLE POWER CONVERTER MARKETS GREW SPECTACULARLY – BY MORE THAN 20% – LAST YEAR, DRIVING GROWTH IN THE EXPANDING IGBT MARKET
The power electronics sectors continue to expand their presence almost everywhere. Renewable energies and e-mobility, including electric and hybrid vehicles (EV/HEVs), are especially boosting this market. Both the solar and EV/HEV converter markets grew by over 20% between 2015 and 2016. At the semiconductor level, the power semiconductor market grew by 3.8% compared to 2015. This year, Yole Développement has enlarged its power semiconductor market analysis to all types of power integrated circuits (ICs) including power management ICs, linear regulators and switching regulators, representing a total market of $28B. Among all the different types of power devices including thyristors, MOSFETs, IGBTs and power ICs, IGBTs made the greatest progress, with around 8% growth.
Yole Développement’s decision to start analyzing the power IC market evolution closely is part of an effort to cover the whole power spectrum of this market. We now encompass the complete range from low power, low voltage, highly integrated power management ICs in mobile phones to more robust, high power IGCT modules used in trains.
The report also covers the fast-emerging wide band gap (WBG) semiconductor market, identifying today and tomorrow’s leading silicon carbide (SiC) and gallium nitride (GaN) players and the key technological details. ‘Status of Power Electronics Industry 2017 (SPEI 2017)’ describes the evolution and forecasts the future of the power inverter, power device and silicon wafer markets.
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
Artificial Intelligence Computing for Consumer 2019 report by Yole Développem...Yole Developpement
While AI is a feature expected in smartphones, this fantastic technology has spread like wildfire to the smart home ecosystem and is profoundly impacting the semiconductor industry.
More information on https://www.i-micronews.com/products/artificial-intelligence-computing-for-consumer-2019/
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
More information on: https://www.i-micronews.com/products/high-end-inertial-sensors-for-defense-aerospace-and-industrial-applications-2020/
Sensors and Sensing Modules for Smart Homes and Buildings - 2017 Report by Yo...Yole Developpement
Smart homes and buildings: The “Trojan Horse” strategy
To achieve greener and more secure homes and buildings requires a shift in sensing from today’s basic functions such as turning light switches on or off to more advanced functions. Three main drivers are currently leading the smart buildings market:
Better energy control. With 40% of the world’s energy used for buildings, mostly for heating in residential and lighting in commercial, this is a very strong driver.
Increased security with detection of intrusion, fires and seismic activity.
Better comfort for occupants with sensor modules or hubs like those manufactured by Google/Nest, Fibaro, Smarthings, Canary, and Elgato Eve. They generally include 1-10 sensors, an energy source and a wireless module.
For more information, visit our website: https://www.i-micronews.com/reports.html
Status of Advanced Packaging - 2017 Report by Yole DeveloppementYole Developpement
How can advanced packaging decrease semiconductor market uncertainty and enable future semiconductor products?
From supporting technology to enabler of future semiconductor products
Future semiconductor drivers are expected to be fragmented and more diverse than in the mobile era. Scaling continues, but functionality and system level features are becoming increasingly important for product differentiation rather than raw computation power. An outlook into the future brings the Internet of Things (from end device to backbone infrastructure), including the Industrial Internet of Things, the semiconductorization of the automotive industry, 5G connectivity, augmented & virtual reality and artificial intelligence. In such an environment, advanced packaging is transforming from follower of scaling technology nodes to enabler of future semiconductor applications and products. Heterogeneous integration of multiple dies from the latest to legacy front-end nodes, involving a mixture of latest technology high density interconnects to lower cost mature interconnects, at high levels of customization is the future of packaging. Advanced packaging has direct impact on product success rates and semiconductor revenues.
More information on that report at: https://www.i-micronews.com/reports.html
Equipment and Materials for 3D TSV Applications - 2017 Report by Yole Develop...Yole Developpement
Driven today mostly by BSI CIS, the 3D TSV equipment & materials business will be supported by 3D stacked memory’s expansion
Technology and application drivers will change over the years, but TSV integration will continue growing
Currently supported mostly by 3D stacked BSI CIS, TSV integration growth will be led mainly by 3D memory applications and new products integrating TSV interconnects in the imaging segment.
Indeed, 3D stacked BSI has been the TSV market’s real driver for a couple of years now. However, with the entrance of 3D hybrid technology (which does not require any TSV interconnects), we expect a decrease of 3D stacked BSI in the TSV market by 2019.
This potential TSV decrease within BSI CIS could be hastened by the 3D single-photon avalanche diodes (SPAD) developed by STMicroelectronics. This is a new approach in time-of-flight that will benefit from 3D hybrid technology by moving the digital pixel into the secondary chip.
While Sony is the current CIS leader and the pioneer of the hybrid stacking method (which was adopted for the first time in the Samsung Galaxy S7 rear camera module), it is too early to fully describe the strategy of other key actors like TSMC/Omnivision and ON Semiconductor, and whether their path will lead to 3D stacked BSI or 3D hybrid stacked.
Another scenario could happen in the next few years and impact the TSV market in a different way. With more complex structures in the BSI CIS field being considered today, some CIS manufacturers might remain on 3D stacked BSI by combining this technology with 3D hybrid stacked for the next generation of products based on multi-stack structure. In this case, 3D hybrid stacked will not compete with 3D stacked BSI, leading to a continuous increase of 3D stacked BSI and 3D hybrid stacked.
For more information please visit our website: http://www.i-micronews.com/reports.html
MEMS and Sensors for Automotive 2017 Report by Yole Developpement Yole Developpement
How will sensor technology shape the cars of the future? We are only at the very beginning of a bright future for sensor providers – be prepared for the golden age of the automotive sensor industry.
THE REBORN AUTOMOTIVE SENSOR MARKET WILL BE WORTH MORE THAN $20B BY 2022
In a global automotive market worth than US$2.3T, the little world of automotive sensors has recently been shaken up by the emergence of electric and autonomous cars. Despite just 3% growth in the volume of cars sold expected through to 2022, Yole Développement (Yole) expects an average growth rate in sensors sales volumes above 8% over the next five years, and above 14% growth in sales value. This is thanks to the expanding integration of high value sensing modules like RADAR, imaging and LiDAR. The current automotive sensing market groups MEMS and classic active sensors such as pressure, tire pressure monitoring systems (TPMS), chemical, inertial, magnetic, ultrasonic, imaging, RADAR and LiDAR. We estimate that this market is worth US$11B in 2016 and is expected to reach US$23B by 2022. This is mainly due to the boom in imaging, RADAR and LiDAR sensors, which will respectively be worth US$7.7B, US$6.2B and US$1.4B by 2022. Among classical sensors like pressure, chemical and magnetic sensors, the impact of electric vehicles will remain small in the short term. However, the advent of electrical vehicles will greatly change the amount and the distribution of pressure and magnetic sensors within the car in the longer term. More electric cars will mean fewer pressure sensors and a surge in magnetic sensors for battery monitoring and various positioning and detection of moving pieces. Finally, we believe that the automotive world is experiencing one of the fastest-changing eras in its evolution ever. Sensor suppliers are now engaged in a race where they need to be prepared for the golden age of the automotive world.
This report describes the applications, technologies, and players associated with the automotive sensor market’s impending changes.
More information on that report at http://www.i-micronews.com/reports.html
Status of the CMOS Image Sensor Industry 2016: New Dynamics in Market and Tec...Yole Developpement
New functions are pushing change in CMOS image sensors, boosting the market toward $18.8B in 2021 at 10.4% CAGR
Beyond $10B: The CMOS image sensor industry keeps growing at high pace
Driven by renewed mobile and automotive applications, the CMOS image sensor (CIS) industry is expected to expand at a compound annual growth rate (CAGR) of 10.4% from 2015 to 2021, reaching US$18.8B market value by 2021.
Yole Développement expects sustained growth of the CMOS image sensor industry for the next five years. Increasing camera content in smartphones will more than offset slower smartphone volume growth. The trend for dual and 3D cameras will have a major impact on CIS volumes. While it is too early to fully describe the strategy of the main actors yet, some products are already on the market. The 2016 report comprehensively covers key market and technology choices.
One big story this year is the consumer market, which is recovering from the total collapse of digital photography. While action cameras seem to have reached a ceiling, new applications such as drones, robots, virtual reality and augmented reality are ready to rejuvenate this emblematic market. The Automotive camera market has established itself as a key growth market for CIS. The Advanced Driver Assistance (ADAS) trend is further increasing pressure on vendors to provide sensors beyond their current technical capabilities. Image analysis is the new frontier and early usage of artificial intelligence is catching people’s imagination. We are therefore in the middle of an explosive growth pattern that will not slow down before 2021. An exceptionally high 23% CAGR is predicted in automotive for the 2015-2021 period.
CMOS Image Sensor Service – Imaging Research 2019 Monitors by Yole DéveloppementYole Developpement
As camera quantity and die size increase per end-device, a 10.1% year-on-year growth rate is expected for 2019.
More information on CMOS monitor at: https://www.i-micronews.com/products/cmos-image-sensor-service-camera-module-research/
Status of the Camera Module Industry 2019 – Focus on Wafer Level Optics repor...Yole Developpement
CMOS Camera Modules (CCM) have become a key sensor technology – what are the dynamics and strategies in this highly competitive market?
More information on: https://www.i-micronews.com/produit/status-of-the-camera-module-industry-2019-focus-on-wafer-level-optics/
How the MEMS Industry Can Extract More Value From its Customers? by JC. Eloy ...Yole Developpement
How the MEMS Industry Can Extract More Value From its Customers ?
Presentation at MEMS Industry Group by JC. Eloy (eloy@yole.fr)
TOP 5 remains unchanged in 2014 (and certainly in 2015) but Bosch now accounts for one-third of the $3.8B MEMS revenues shared by the top 5 MEMS companies (accounting for about one third of the total MEMS business).
The ability to deliver a function!
• The sensor is the way to understand what is happening.Selling sensors without the brain is putting the MEMS industry in a low cost,commoditazation corner where the Moore’s Law is not helping you compared to the semiconductor business.
Technology is almost ready
Players are working on the killer applications
WHAT WILL HAPPEN?
• MEMS is growing as a market, both in volume and total value
• But the value is moving from devices to functions and few MEMS players are taking benefit of this value flow
• Very limited number of companies are entering the field, the last success has been Invensense
• The last really new device was Knowles silicon microphone in 2003
• So it is now important to change the MEMS mind set and to move to functions development…
Machine Vision for Industry and Automation 2018 Report by Yole DeveloppementYole Developpement
Machine vision is at the heart of the automation revolution.
More information on that report at https://www.i-micronews.com/report/product/machine-vision-for-industry-and-automation-2018.html
Imaging Technologies for Automotive 2016 Report by Yole Developpement Yole Developpement
Imaging technology, which is currently mainly cameras, is exploding into the automotive space, and is set to grow at 20% CAGR to reach $7.3B in 2021
INFOTAINMENT AND ADVANCED DRIVER ASSISTANCE SYSTEMS (ADAS) PROPEL AUTOMOTIVE IMAGING
Since 2008, when a recession acted as a wakeup call to the whole industry, the automotive market has undergone obvious structural change. Capitalizing on technologies initially developed for smartphones, electronics have invaded, and imaging technology is now taking center stage. From less than one camera per car on average in 2015, there will be more than three cameras per car by 2021, which means 371 million automotive imaging devices.
Cameras were initially mounted for ADAS purposes on high-end vehicles, with deep learning image analysis techniques promoting early adoption. The Israeli company Mobileye has been instrumental in bringing this technology to market, along with On Semiconductor, which provided the CMOS image sensor. Copycat competition will probably pick up as the market now justifies initial investment in design and technology. It is now a well-established fact that vision-based autonomous emergency braking (AEB) is possible and saves life. Adoption of forward ADAS cameras will therefore accelerate.
Growth of imaging for automotive is also being fueled by the park assist application, and 360° surround view camera volume is skyrocketing. While it’s becoming mandatory in the US to have a rearview camera, that uptake is dwarfed by 360° surround view cameras, which enable a “bird’s eye view” perspective. This trend is most beneficial to companies like Omnivision at sensor level and Panasonic and Valeo, which have become the main manufacturers of automotive cameras.
Mirror replacement cameras are currently the big unknown and take-off will primarily depend on its appeal and car design regulation. Europe and Japan are at the forefront of this trend, which should become slightly significant by 2021.
Solid state lidar is well talked about and will start to be found in high end cars by 2021. Cost reduction will be a key driver as the push for semi-autonomous driving will be felt more strongly by car manufacturers. The report will analyse the impact of lidar for automotive vision in detail.
Night vision cameras using Long Wave Infrared (LWIR) technology were initially perceived as a status symbol. However, they’re increasingly appreciated for their ability to automatically detect pedestrians and wildlife. LWIR will therefore become integrated into ADAS systems in future.
3D cameras will be limited to in-cabin infotainment and driver monitoring. This technology will be key for luxury cars and therefore is of limited use today.
If any significant semi-autonomous trend picks up, the technology will probably become mandatory, due to safety issues.
More information on that report at http://www.i-micronews.com/reports.html
Sensors for robotic vehicles 2018 report by yole developpement i-micronewsYole Developpement
High end industrial sensors will win in the emerging robotic vehicle industry.
THE ROBOTIC VEHICLE SUPPLY CHAIN IS NOW STARTING
Announcements are piling up from companies like
Waymo, Uber, Lyft, Baidu and their automotive
manufacturing partners such as Fiat Chrysler
Automobiles, Mercedes, BMW and Renault-
Nissan. 2018 will most probably be the initial launch
year for robotic taxis in several cities around the
globe. The move has direct consequences for
technology providers in high-end sensing and
computing equipment. The vehicle count that we
can collect suggests several tens of thousands of
vehicles on the road worldwide before end of
2022. As far as we know, each robotic vehicle will
be equipped with a suite of sensors encompassing
Lidars, radars, cameras, Inertial Measurement
Units (IMUs) and Global Navigation Satellite
Systems (GNSS). The technology is ready and
the business models associated with autonomous
driving (AD) seem to match the average selling
prices for those sensors.
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
Microphones, Microspeakers and Audio Solutions Market and Technology Trends 2019Yole Developpement
The voice-based world is shaking up the audio industry, making it worth $20.8B in 2024.
More information on https://www.i-micronews.com/products/microphones-microspeakers-and-audio-solutions-market-and-technology-trends-2019/
Wafer starts for More than Moore applications 2018 Report by Yole Developpement Yole Developpement
Driven by megatrend markets, More than Moore devices’ overall wafer demand is expected to grow at an almost 10% CAGR from 2017 to 2023.
More information on that report at https://www.i-micronews.com/report/product/wafer-starts-for-more-than-moore-applications.html
Hearing, Touching, Smelling, Seeing... What will be the next improvement MEMS...Yole Developpement
Hearing, Touching, Smelling, Seeing... What will be the next improvement MEMS will bring to our senses?
MEMS is a “transfer function” using semiconductor micro-machining based technologies to create devices replacing more complex, bulky or less sensitive devices.
•The 5 criteria that determine a MEMS success: size reduction, potential cost reduction, “good enough” specifications, simpler manufacturing compared to existing solutions (less mechanical parts for e.g.) & reliability.
•Among all the different MEMS devices in development that could have a significant growth in the future, we foresee gas sensors as the next success for the MEMS industry.
•In any case, at least 10 to 15 years of development are necessary to achieve all the successful criteria.
Gas sensors are likely to have a marketrampup.
Light Shaping Technologies for Consumer and Automotive Applications 2019Yole Developpement
Legacy micro-optics are on the verge of being reshaped by the semiconductor industry and nanostructuring techniques.
More information on: https://www.i-micronews.com/products/light-shaping-technologies-for-consumer-and-automotive-applications-2019/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Next-Generation Human Machine Interaction in Displays 2019 report by Yole Dév...Yole Developpement
Sensors directly integrated in displays: still a long way to wow!
More information on https://www.i-micronews.com/products/next-generation-human-machine-interaction-in-displays-2019/
Image Signal Processor and Vision Processor Market and Technology Trends 2019...Yole Developpement
Artificial intelligence-powered newcomers are reshuffling the pack.
More information on https://www.i-micronews.com/products/image-signal-processor-and-vision-processor-market-and-technology-trends-2019/
3D Accelerometer and Acoustic Sensor Market Size, Share, & Trends Estimation ...subishsam
Sensors like 3D accelerometers and acoustic sensors can measure acceleration and sound. It can be used to measure how fast something is moving, how loud something is, or both at the same time. The sensor can measure acceleration and sound in three dimensions because it has three axes for acceleration and three axes for sound.
3D sensors are used in many different industries, including consumer electronics, healthcare, industrial robotics, security, automotive, surveillance, and many more. 3D sensors are made up of devices that respond to their surroundings in three dimensions by making 3D maps of the area around the user. The sensor is made up of different sensing technologies, such as ultrasound, time-of-flight (TOF), and structured light. As the need for gesture analysis applications grows, 3D sensors play an important role in improving the performance and efficiency of large, complex systems in industries like electronics and automotive.
Global and china cmos camera modules industry report, 2013 2014ResearchInChina
In 2013, the CMOS image sensor shipment reached 3.26 billion units at an increase of 15.2%, and the market size hit approximately USD8.008 billion. The shipment is expected to rise by 16% to 3.782 billion units, and the market size will be USD8.698 billion or so in 2014. Camera modules are not only applied to photographing, but also motion sensing for postural control, which will propel the market.
For the full video of this presentation, please visit:
https://www.embedded-vision.com/platinum-members/embedded-vision-alliance/embedded-vision-training/videos/pages/may-2019-embedded-vision-summit-tschudi
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Yohann Tschudi, Technology and Market Analyst at Yole Développement, presents the "AI Is Moving to the Edge—What’s the Impact on the Semiconductor Industry?" tutorial at the May 2019 Embedded Vision Summit.
Artificial intelligence is proliferating into numerous edge applications and disrupting numerous industries. Clearly this represents a huge opportunity for technology suppliers. But it can be difficult to discern exactly what form this opportunity will take. For example, will edge devices perform AI computation locally, or in the cloud? Will edge devices use separate chips for AI, or will AI processing engines be incorporated into the main processor SoCs already used in these devices?
In this talk, Tschudi answers these questions by presenting and explaining his firm's market data and forecasts for AI processors in mobile phones, drones, smart home devices and personal robots. He explains why there is a strong trend towards executing AI computation at the edge, and quantifies the opportunity for separate processor chips and on-chip accelerators that address visual and audio AI tasks.
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
Similar to Status of the CMOS Image Sensor Industry 2017 - Report by Yole Developpement (20)
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...Yole Developpement
High-Performance Computing and cloud gaming are setting the bar for leadership in the high-end CPU and GPU markets.
More info on: https://www.i-micronews.com/products/xpu-high-end-cpu-and-gpu-for-datacenter-applications-2020/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Nano-Imprint Technology Trends for Semiconductor Applications 2019 Report by...Yole Developpement
Nano-Imprint Lithography is revived by photonics and biochips as well as front-end memory applications.
More information on: https://www.i-micronews.com/products/nano-imprint-technology-trends-for-semiconductor-applications-2019/
Elevating Tactical DDD Patterns Through Object CalisthenicsDorra BARTAGUIZ
After immersing yourself in the blue book and its red counterpart, attending DDD-focused conferences, and applying tactical patterns, you're left with a crucial question: How do I ensure my design is effective? Tactical patterns within Domain-Driven Design (DDD) serve as guiding principles for creating clear and manageable domain models. However, achieving success with these patterns requires additional guidance. Interestingly, we've observed that a set of constraints initially designed for training purposes remarkably aligns with effective pattern implementation, offering a more ‘mechanical’ approach. Let's explore together how Object Calisthenics can elevate the design of your tactical DDD patterns, offering concrete help for those venturing into DDD for the first time!
Removing Uninteresting Bytes in Software FuzzingAftab Hussain
Imagine a world where software fuzzing, the process of mutating bytes in test seeds to uncover hidden and erroneous program behaviors, becomes faster and more effective. A lot depends on the initial seeds, which can significantly dictate the trajectory of a fuzzing campaign, particularly in terms of how long it takes to uncover interesting behaviour in your code. We introduce DIAR, a technique designed to speedup fuzzing campaigns by pinpointing and eliminating those uninteresting bytes in the seeds. Picture this: instead of wasting valuable resources on meaningless mutations in large, bloated seeds, DIAR removes the unnecessary bytes, streamlining the entire process.
In this work, we equipped AFL, a popular fuzzer, with DIAR and examined two critical Linux libraries -- Libxml's xmllint, a tool for parsing xml documents, and Binutil's readelf, an essential debugging and security analysis command-line tool used to display detailed information about ELF (Executable and Linkable Format). Our preliminary results show that AFL+DIAR does not only discover new paths more quickly but also achieves higher coverage overall. This work thus showcases how starting with lean and optimized seeds can lead to faster, more comprehensive fuzzing campaigns -- and DIAR helps you find such seeds.
- These are slides of the talk given at IEEE International Conference on Software Testing Verification and Validation Workshop, ICSTW 2022.
GridMate - End to end testing is a critical piece to ensure quality and avoid...ThomasParaiso2
End to end testing is a critical piece to ensure quality and avoid regressions. In this session, we share our journey building an E2E testing pipeline for GridMate components (LWC and Aura) using Cypress, JSForce, FakerJS…
UiPath Test Automation using UiPath Test Suite series, part 5DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 5. In this session, we will cover CI/CD with devops.
Topics covered:
CI/CD with in UiPath
End-to-end overview of CI/CD pipeline with Azure devops
Speaker:
Lyndsey Byblow, Test Suite Sales Engineer @ UiPath, Inc.
GraphSummit Singapore | The Future of Agility: Supercharging Digital Transfor...Neo4j
Leonard Jayamohan, Partner & Generative AI Lead, Deloitte
This keynote will reveal how Deloitte leverages Neo4j’s graph power for groundbreaking digital twin solutions, achieving a staggering 100x performance boost. Discover the essential role knowledge graphs play in successful generative AI implementations. Plus, get an exclusive look at an innovative Neo4j + Generative AI solution Deloitte is developing in-house.
Transcript: Selling digital books in 2024: Insights from industry leaders - T...BookNet Canada
The publishing industry has been selling digital audiobooks and ebooks for over a decade and has found its groove. What’s changed? What has stayed the same? Where do we go from here? Join a group of leading sales peers from across the industry for a conversation about the lessons learned since the popularization of digital books, best practices, digital book supply chain management, and more.
Link to video recording: https://bnctechforum.ca/sessions/selling-digital-books-in-2024-insights-from-industry-leaders/
Presented by BookNet Canada on May 28, 2024, with support from the Department of Canadian Heritage.
Alt. GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using ...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
Smart TV Buyer Insights Survey 2024 by 91mobiles.pdf91mobiles
91mobiles recently conducted a Smart TV Buyer Insights Survey in which we asked over 3,000 respondents about the TV they own, aspects they look at on a new TV, and their TV buying preferences.
Why You Should Replace Windows 11 with Nitrux Linux 3.5.0 for enhanced perfor...SOFTTECHHUB
The choice of an operating system plays a pivotal role in shaping our computing experience. For decades, Microsoft's Windows has dominated the market, offering a familiar and widely adopted platform for personal and professional use. However, as technological advancements continue to push the boundaries of innovation, alternative operating systems have emerged, challenging the status quo and offering users a fresh perspective on computing.
One such alternative that has garnered significant attention and acclaim is Nitrux Linux 3.5.0, a sleek, powerful, and user-friendly Linux distribution that promises to redefine the way we interact with our devices. With its focus on performance, security, and customization, Nitrux Linux presents a compelling case for those seeking to break free from the constraints of proprietary software and embrace the freedom and flexibility of open-source computing.
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
Pushing the limits of ePRTC: 100ns holdover for 100 daysAdtran
At WSTS 2024, Alon Stern explored the topic of parametric holdover and explained how recent research findings can be implemented in real-world PNT networks to achieve 100 nanoseconds of accuracy for up to 100 days.
Dr. Sean Tan, Head of Data Science, Changi Airport Group
Discover how Changi Airport Group (CAG) leverages graph technologies and generative AI to revolutionize their search capabilities. This session delves into the unique search needs of CAG’s diverse passengers and customers, showcasing how graph data structures enhance the accuracy and relevance of AI-generated search results, mitigating the risk of “hallucinations” and improving the overall customer journey.
Observability Concepts EVERY Developer Should Know -- DeveloperWeek Europe.pdfPaige Cruz
Monitoring and observability aren’t traditionally found in software curriculums and many of us cobble this knowledge together from whatever vendor or ecosystem we were first introduced to and whatever is a part of your current company’s observability stack.
While the dev and ops silo continues to crumble….many organizations still relegate monitoring & observability as the purview of ops, infra and SRE teams. This is a mistake - achieving a highly observable system requires collaboration up and down the stack.
I, a former op, would like to extend an invitation to all application developers to join the observability party will share these foundational concepts to build on:
13. 13
6TH CMOS IMAGE SENSOR REPORT
• The CMOS Image Sensor market has reached $11.5B in 2016 and Yole is maintaining a 10.5% CAGR forecast for the
2016-2022 period mainly due to the penetration of additional cameras in smartphone supporting functionalities such
as optical zoom, biometry and 3D interactions.
• Concerning the ecosystem CIS is now heavily dominated by 3 Asian heavyweights, Sony, Samsung and Omnivision,
this last company adopting Chinese nationality beginning of 2016.The US has maintained a presence in the high end
sector with On Semi for Machine vision and Automotive, and Teledyne for Machine vision and Medical. In Europe the
rise of AMS and STM in the consumer sensing space is a notable development still in the making.
• Market wise Mobile is dominating the revenues and the technology developments. New approaches such as hybrid
stack and triple stack are driving new applications such as super slow motion and 3D sensing. The growth story in
Automotive encountered a big hiccup involving Tesla and Mobileye, eventually solved into the $15B Intel purchase of
Mobileye. Security is the nice story of the year boosted by the end of CCD and the new capabilities of IP cameras,
probably the only significant IoT story so far.
• Technology wise the domain is increasingly innovative, being at the forefront of 3D semiconductor technologies,
quantum energy detection, artificial intelligence and more. It is a key part of much general trends including
autonomous vehicles and the robotic revolution in general.
CIS is a key
market and a
key technology
18. 18
CIS WAFER PRODUCTION FORECAST 2010–2022
By technology
CIS is
predominantly
produced
using “3D”
stacked
technology
Since 2010 BSI
technology took
increasing market
share.
Since 2014 the stacked
and BSI approach has
become dominant.
Production stagnated
due to transfer to logic
wafers (DIG).
Hybrid stack technique
will be predominantly
used for specific
sensors such as 3D
imagers.
26. It’s ten years down the line from the initial
Apple iPhone that started the smartphone era.
Since then, CMOS imaging has benefited from
huge market demand and a technology-driven
environment, resulting in an $11.6B industry
in 2016. Photography and video is the main
application, which has been totally transformed by
new use cases, new devices and new technologies.
The mobile market is key for the CMOS image
sensor (CIS) industry. Despite saturation in the
number of handsets, the CIS market is able to
maintain a 10.5% compound annual growth rate
(CAGR) for the 2016-2022 period due to the
introduction of dual and 3D cameras. These
additional cameras are changing the industry’s
drivers from form factor and image quality to
interactivity.
Penetration into higher added value markets
such as automotive, security and medical shows
that CIS products are transforming use cases
across the board. CIS technology adoption allows
greater automation levels at low cost, while using
newly available computing architectures such as
deep learning. The CMOS image sensor industry
is currently in a virtuous circle where a new
technology is providing true customer value.
Besides the transformation of current applications,
new applications such as drone photography,
biometric identification, and augmented reality
are relying on CIS innovation. All these new
applications are part of the story told in the ‘2017
Status of the CIS Industry’ report.
STATUS OF THE CMOS IMAGE SENSOR INDUSTRY 2017
Market & Technology report - June 2017
NEW APPLICATIONS ARE TRANSFORMING THE MARKET AND TECHNOLOGY
PLAYING FIELD FOR CMOS IMAGE SENSORS
New use cases and applications are transforming the CMOS Image Sensor (CIS) landscape
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
• 2016 CIS revenue breakdown
by market
• 2016 CIS revenue ranking by player
• 2016 CIS production ranking
by foundry
• CIS volume shipment forecast
by application 2010-2022
• CIS revenue forecast by application
2010-2022
• CIS average selling price forecast
by application 2010-2022
• CIS wafer production forecast by
application 2010-2022
WHAT’S NEW
• 2016-2022 forecast
• 2016 MA activity
• Ecosystem update
• Dual and 3D camera trends for
mobile
• Automotive camera adoption
curve
• Security camera trend
• 3D stacking technology update
REPORT OBJECTIVES
Ecosystem identification and analysis:
• Determination of the range of
applications
• Technical market segmentation
• Market trends and forecasts
• Key players by market, and analysis
Analysis and description of markets
and technologies involved:
• Detailed applications for each
market segment
• Major players worldwide
• Technology trends
• Main technical challenges (Yole Développement, June 2017)
Image sensor application: what is next
BEYOND $11.6B IN 2016, THE CIS ECOSYSTEM HAS NOT BECOME
THE OLIGOPOLY WE WOULD HAVE EXPECTED
Sony has established itself as industry leader,
market and technology wise. However, the 2016
earthquake in Japan slowed down its operation
and helped maintain the growth of its close
competitors. Indeed, despite Toshiba’s exit from
the market, two thirds of players have seen
growth in the last year. Samsung, Omnivision
and Panasonic have delivered 15% year-on-year
growth. Those large players are increasing the
weight Asia carries in the CIS industry.
In the US, On Semi has suffered from the public
relations mess that followed a fatal crash involving
Tesla’s semi-autonomous driving system, which
included a Mobileye sensor. Automotive cameras
Technology x market
penetration
20242016 2018 2020 2022 2026
Computational
photography
Interaction
capability
ADAS Level 2
assistance
ADAS level 3
autonomy
ADAS level 4
Robotic vehicles
IP cameras
Analytics
Behavioral analysis
Augmented
reality
Ambiant
intelligence
Augmentation
capability
Sensing computing era
Artificial intelligence era
Cognition era
Robotic
buttler
Drones
27. STATUS OF THE CMOS IMAGE SENSOR INDUSTRY 2017
(Yole Développement, June 2017)
2016 CIS revenue breakdown
SPEED OF TECHNOLOGY ADOPTION MIRRORS THE APPLICATION DEVELOPMENT
FRENZY
(Yole Développement, June 2017)
Image sensor technology: what is next
A CMOS image sensor is an analog device using a
digital process. Therefore, the industry has been
following a key principle of “one application, one pixel,
one process”. This probably explains the dynamism of
the ecosystem and the ability of different players to
coexist in different markets. On Semi, Teledyne, ams
and STMicroelectronics all provide perfect examples
of successful differentiating strategies.
The impact of 3D semiconductors is currently a key
element of the competition. Samsung has finally joined
Sony as a provider of stacked back-side illuminated
(BSI) sensors. Omnivision and SK Hynix will also
soon launch this technology. Meanwhile, SMIC and
STMicroelectronics will probably be the next players
to unveil their versions of stacked technology.
Increases in CIS production capacity have
momentarily stopped due to this stacked trend. This
is currently mainly due to Sony, which can source
its logic wafers from TSMC. In coming years Sony,
Samsung, STMicroelectronics, HLMC and SK Hynix
will all announce extra CIS capacity in order to meet
market demand, despite stacked BSI adoption.
Imagesensorshavebecomeasignificantsemiconductor
segment alongside processors and memories. They
still provide a technology-driven environment that
is profit-friendly despite fierce competition. The
outcome of the competition depends on a combination
of application pull and technology fit. To help judge
that, this report is aimed at giving the best possible
snapshot of the current status of the CIS industry.
Purchasers can therefore use it in order to proactively
benefit from the next wave of innovations.
are safety-critical and therefore the reaction is strong
if performance does not match expectations. Tesla
being cleared by the US National Highway Traffic
Safety Administration and Intel’s $15B purchase
of Mobileye should quickly put this application and
affiliated players back on the growth track.
Moving along the technology ladder proved to be
difficult for SK Hynix, which was not able to switch
quickly enough toward 8MP image sensors requiring
300mm wafer diameter operations.
Another noticeable activity has been STMicroelectronics’
revival of its CIS business through the development of
3D ‘Time of Flight’ (ToF) devices. These devices have
had the ability to move from proximity to distance
rangers and then fully fledged 3D cameras. They will
probably be the biggest event of the end of 2017, if
they materialize in the Apple iPhone 8 as is rumored.
Sony
42%
Samsung
18%
Omnivision
12%
On Semi
6%
Panasonic
3%
Canon
3%
SK Hynix
3%
STMicro
3%
Galaxycore
2%
Pixart
2%
Hamamatsu
1%
Pixelplus
1%
Other
4%
2015
$10.3B
2016
$11.6B
1900 1980 2020 2030 2040 2045
Technology x Market Penetration
Acceleration :The speed in technology change doubles every technology shift
Era of
Photography
5 years10 years20 years40 years80 years
Era of Machine
Sensing
Main
Players
could
change
Proximity
Sensor
Autofocus
Single
Photon
Imagers
Multi
Wavelength
Imagers
Next Era
Sensor
Fusion ?
Human Vision
Enhancement ?
3D Time
of Flight
By 2030 new
technologies serving
machine sensing could
become dominant
Event based
imagers
Holographic
imagers?
28. Find more
details about
this report here:
MARKET TECHNOLOGY REPORT
Glossary 2
Table of contents 3
Report objectives 6
Methodology 8
Companies cited 13
Executive summary 14
Introduction 31
Market segmentation
Historical perspective
CMOS image sensor landscape by player
CMOS image sensor landscape by application
CMOS image sensor technology shift CMOS vs CCD
CMOS image sensor technology shift BSI vs FSI
CMOS image sensor technology shift 300mm
vs 200mm
Market forecast 47
2016 CIS revenue breakdown by market
CIS volume shipment forecast 2010-2022
CIS revenue forecast 2010-2022
CIS average selling price forecast 2010-2022
CIS wafer production forecast 2010-2022
Ecosystem 61
2016 MA activity in CIS
CMOS image sensor ecosystem
CMOS image sensor competitive landscape
Geographic mapping of CIS players
Geographic mapping of CIS foundries
Players and rankings 71
2016 CIS revenue ranking by player
2016 CIS production ranking by foundry
2016 CIS player activity breakdown
2016 CIS revenue mobile market breakdown by
player
2016 CIS revenue photography market breakdown
by player
2016 CIS revenue tablet market breakdown by
player
2016 CIS revenue laptop PC market breakdown
by player
2016 CIS revenue medical X-ray market
breakdown by player
2016 CIS revenue security and surveillance
market breakdown by player
2016 CIS revenue machine vision market
breakdown by player
Mobile market trends 88
Consumer electronics volume forecast
Consumer electronics revenue forecast
Who can afford a smartphone?
Revenue comparison
Mobile market volume forecast by phone type
Mobile market volume forecast by player
Market drivers
Mobile resolution mix forecast
Dual camera rollout scenario
3D camera applications
Mobile market trends
Other consumer market trends 111
Consumer photography volume forecast
Action camera and drone volume forecast
360° camera trend
AR/VR headset volume forecast
AR/VR headset trend
Wearable volume forecast
Consumer drone volume forecast
Consumer robotics volume forecast
Computing volume forecast
Other market trends 132
Light vehicle volume forecast
Automotive imaging trend
Automotive camera volume forecast
Robotic vehicle trend
Medical CIS volume forecast
Medical CIS trend
Security and surveillance volume forecast
Machine vision volume forecast
Technology trends 155
Pixel/Resolution/Optical Format
From FSI to BSI to stacked BSI
Hybrid stack/Multi-stack
3D imaging and sensing
Technology by players
Conclusion 193
Yole Développement presentation 197
TABLE OF CONTENTS (complete content on i-Micronews.com)
COMPANIES CITED IN THE REPORT (non exhaustive list)
Almalence, Ambarella, Apple, Agilent, Arm, Axis, ams Basler, Bosch, Brigates, BYD, Caeleste, Canon,
Clairpixel, CMOSIS, Cognex, Continental, Core Photonics, CSEM, Dongbu HiTek, DXO, Dynamax,
ESPROS Photonics, Evg, Excelitas Technologies, Fairchild Imaging, Flir, Forza Silicon, Fotonic, Foxconn,
Fraunhofer, Fujitsu, Fujifilm, GalaxyCore, Given Imaging, GoPro, Grace Valley, Hamamatsu, Hasselblad,
Heliotis,HimaxImaging,Honeywell,Hoya,HTC,Huawei,ImageLab,IMEC,Infineon,Invisage,InvenSense,
Kingpak, Konica Minolta, Lattice, Leap Motion, Leica, Lenovo, LFoundry, LG, Luxima, Magna, Mantis
Vision, Medigus, Melexis, Mesa Imaging, Micron, Microsoft, Mobileye, Mobotix, Movidius, New Imaging
Technologies, Nikon, NXP, Nvidia, Odos Imaging, Omnivision, Omron, ON Semiconductor, Panasonic,
PerkinElmer, Philips, Pixart, PixelPlus, Pelco, PMD Technologies, Point Grey Research, Pyxalis, Raytrix,
Rosnes, Samsung, Sanei Hytech, Sharp, SiliconFile, Sirona, Soft Kinetic, SK Hynix, SMIC, Siemens,
Socionext, Soitec, Sony, STMicroelectronics, SuperPix, Teledyne e2v, Teledyne DALSA, Teradyne,
Tessera, Toshiba, Trixell, TSMC, Toshiba Teli, TowerJazz, Tridicam, UMC, Valeo, Videantis, Viimagic,
WLCSP, Xiaomi, X-Fab, Xintec, ZTE and more…
• Imaging Technologies for Automotive 2016
• STMicroelectronics Time of Flight Proximity
Sensor in the Apple iPhone 7 Plus
• 3D TSV and 2.5D Business Update - Market
and Technology Trends 2017
• Solid-State Medical Imaging 2017
• Mobileye EyeQ3®
Automotive Vision-Based
SoC
Find all our reports on www.i-micronews.com
RELATED REPORTS
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AUTHORS
From 1999, Pierre Cambou has been
part of the imaging industry. Pierre took
several positions at Thomson TCS which
became Atmel Grenoble in 2001 and
e2v Semiconductors in 2006. In 2012 he
founded a start-up called Vence Innovation
(now Irlynx) in order to bring to market a
disruptive infrared interaction technology.
He has an Engineering degree from
Université de Technologie de Compiègne
Tech. More recently he graduated from
Grenoble Ecole de Management’s MBA.
He joined Yole Développement as Imaging
Activity Leader in 2014.
From 1996 to 1999 Jean-Luc Jaffard
paved the way of imaging activity at
STMicroelectronics being at the forefront
of the emergence and growth of this
business. At STMicroelectronics Imaging
division he has been appointed Research
Development and Innovation Director
managing a large multidisciplinary and
multicultural team and was later on
promoted Deputy General Manager and
Advanced Technology Director in charge
of identifying, sourcing or developing
the breakthrough Imaging Technologies
and Applications to transform them into
innovative and profitable products. In 2010
he was appointed STMicroelectronics
Intellectual Property Business Unit Director.
In 2014 he created the Technology and
Innovation branch of Red Belt Conseil, to
support High Tech actors like SME, Research
Institutes, Start-ups, Analysts, Investors
and public authorities. Jean-Luc Jaffard
owns multiple patents in semiconductor
and Imaging domains and has been invited
speaker in many conferences worldwide.
He studied Electronic and Microelectronic
and has been graduated from Ecole
Supérieure d’Electricité of Paris in 1979.
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the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact
shall decide who within the Buyer, shall be entitled to access
on line the reports on I-micronews.com. In this respect, the
Seller will give the Buyer a maximum of 10 password, unless
the multiple sites organization of the Buyer requires more
passwords. The Seller reserves the right to check from time
to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee
of the buyer can access the report or the employee of the
companies in which the buyer have 100% shares. As a matter
of fact the investor of a company, the joint venture done with
a third party etc..cannot access the report and should pay a
full license price.
7. TERMINATION
7.1 If the Buyer cancels the order in whole or in part or postpones
the date of mailing, the Buyer shall indemnify the Seller for
the entire costs that have been incurred as at the date of
notification by the Buyer of such delay or cancellation. This
may also apply for any other direct or indirect consequential
loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions
or the order, the non-breaching Party may send a notification
to the other by recorded delivery letter upon which, after a
period of thirty (30) days without solving the problem, the
non-breaching Party shall be entitled to terminate all the
pending orders, without being liable for any compensation.
8. MISCELLANEOUS
All the provisions of these Terms and Conditions are for the
benefit of the Seller itself, but also for its licensors, employees
and agents. Each of them is entitled to assert and enforce those
provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in
writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and
Conditions and the Buyer, is deemed to have accepted the latest
version of these terms and conditions, provided they have been
communicated to him in due time.
9. GOVERNING LAW AND JURISDICTION
9.1 Any dispute arising out or linked to these Terms and
Conditions or to any contract (orders) entered into in
application of these Terms and Conditions shall be settled
by the French Commercial Courts of Lyon, which shall have
exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and
the Seller, in accordance with these Terms and Conditions.
TERMS AND CONDITIONS OF SALES