New technologies and applications have restructured the Compact Camera Module industry
AT 12.2% CAGR FOR THE NEXT FIVE YEARS, THE COMPACT CAMERA MODULE INDUSTRY (CCM) IS A GROWTH POWERHOUSE WITH NUMEROUS LARGE COMPANIES THRIVING IN A DYNAMIC MARKET
In 2015, Yole Développement published its first report on the camera module industry and mentioned the immaturity of the ecosystem with numerous small players especially for module assembly. Now the dust has settled and giant camera module players have emerged such as LG Innotek, Semco, Foxconn Sharp, O-Film and Sunny Optical. This 2017 edition is giving you the insights into the trajectory of the industry and of more than 30 players serving mobile and other applications such as automotive and security.
Historically one could differentiate the faith of camera module market from the sub parts such as the image sensor, the lens and the autofocus or optical image stabilization system (Voice Coil Motors - VCM). It seems that differentiated growth has now ended and every sub segment is enjoying almost equal benefit from the rising market tide. This convergence is in part due to the end of quasi-monopoly from Sony in the image sensor sub-segment now joined by Samsung and Omnivision. The story is very similar for Largan Precision in the lens set sub-segment which is now facing renewed competition from Sunny Optical, Kantatsu and Genious Optical.
The last sub-domain of our interest in this report is VCMs. The growth of VCM companies has been undercut by dire structuration efforts. We had mentioned the inability of the VCM to serve the demand in the mobile market. Price pressures have changed the face of competition with competitors such as Mitsumi and Shicoh which were forced out and new players such as New Shicoh and Jawha to take center stage.
More information on that report at http://www.i-micronews.com/reports.html
Proliferation of cameras for imaging and sensing is driving CMOS image sensor (CIS) growth.
More information on that report at : https://www.i-micronews.com/report/product/status-of-the-cis-industry-2018.html
3D Imaging & Sensing 2018 Reports by Yole DeveloppementYole Developpement
The iPhone X initiated a trend. What happens next?
More information here: https://www.i-micronews.com/category-listing/product/p3d-imaging-sensing-2018.html
Status of the CMOS Image Sensor Industry 2017 - Report by Yole DeveloppementYole Developpement
New applications are transforming the market and technology playing field for CMOS image sensors
It’s ten years down the line from the initial Apple iPhone that started the smartphone era. Since then, CMOS imaging has benefited from huge market demand and a technology-driven environment, resulting in an $11.6B industry in 2016. Photography and video is the main application, which is totally transformed by new use cases, new devices and new technologies.
The mobile market is key for the CMOS image sensor (CIS) industry. Despite saturation in the number of handsets, the CIS market has been able to maintain a 10.5% compound annual growth rate (CAGR) for the 2016-2022 period due to the introduction of dual and 3D cameras. These additional cameras are changing the industry’s drivers from form factor and image quality to interactivity.
Penetration into higher added value markets such as automotive, security and medical shows that CIS products are transforming use cases across the board. CIS technology adoption allows greater automation levels at low cost, while using newly available computing architectures such as deep learning. The CMOS image sensor industry is currently in a virtuous circle where a new technology is providing true customer value.
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
For the full video of this presentation, please visit:
https://www.embedded-vision.com/industry-analysis/video-interviews-demos/2d-and-3d-sensing-markets-applications-and-technologies-pre
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Guillaume Girardin, Photonics, Sensing and Display Division Director at Yole Développement, delivers the presentation "2D and 3D Sensing: Markets, Applications, and Technologies" at the Embedded Vision Alliance's September 2019 Vision Industry and Technology Forum. Girardin details the optical depth sensor market and application trends.
Lithography technology and trends for « Semiconductor frontier » held by Aman...Yole Developpement
Lithography technology and trends for « Semiconductor frontier »
Mask aligners are the fastest lithography technology
Stepper technology provides the best resolution
Key requirements for Advanced Packaging
LED manufacturers use small diameter wafers (2”, 3”, 4” or 6”) and transition more rapidly than traditional semiconductor’s industry to larger diameters
WAFER SIZE
Wafer bow can reach up to 50μm for 2” wafers and 100μm for 4”, inducing pattern distortion.
WAFER BOW
2”
4”
6”
LED manufacturers can use different substrates, mostly sapphire or SiCwafers, which are transparent with light-diffusing features such as rough or patterned surfaces. Also, they can use metal wafers for vertical structures, so there’s large material variability.
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
Proliferation of cameras for imaging and sensing is driving CMOS image sensor (CIS) growth.
More information on that report at : https://www.i-micronews.com/report/product/status-of-the-cis-industry-2018.html
3D Imaging & Sensing 2018 Reports by Yole DeveloppementYole Developpement
The iPhone X initiated a trend. What happens next?
More information here: https://www.i-micronews.com/category-listing/product/p3d-imaging-sensing-2018.html
Status of the CMOS Image Sensor Industry 2017 - Report by Yole DeveloppementYole Developpement
New applications are transforming the market and technology playing field for CMOS image sensors
It’s ten years down the line from the initial Apple iPhone that started the smartphone era. Since then, CMOS imaging has benefited from huge market demand and a technology-driven environment, resulting in an $11.6B industry in 2016. Photography and video is the main application, which is totally transformed by new use cases, new devices and new technologies.
The mobile market is key for the CMOS image sensor (CIS) industry. Despite saturation in the number of handsets, the CIS market has been able to maintain a 10.5% compound annual growth rate (CAGR) for the 2016-2022 period due to the introduction of dual and 3D cameras. These additional cameras are changing the industry’s drivers from form factor and image quality to interactivity.
Penetration into higher added value markets such as automotive, security and medical shows that CIS products are transforming use cases across the board. CIS technology adoption allows greater automation levels at low cost, while using newly available computing architectures such as deep learning. The CMOS image sensor industry is currently in a virtuous circle where a new technology is providing true customer value.
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
For the full video of this presentation, please visit:
https://www.embedded-vision.com/industry-analysis/video-interviews-demos/2d-and-3d-sensing-markets-applications-and-technologies-pre
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Guillaume Girardin, Photonics, Sensing and Display Division Director at Yole Développement, delivers the presentation "2D and 3D Sensing: Markets, Applications, and Technologies" at the Embedded Vision Alliance's September 2019 Vision Industry and Technology Forum. Girardin details the optical depth sensor market and application trends.
Lithography technology and trends for « Semiconductor frontier » held by Aman...Yole Developpement
Lithography technology and trends for « Semiconductor frontier »
Mask aligners are the fastest lithography technology
Stepper technology provides the best resolution
Key requirements for Advanced Packaging
LED manufacturers use small diameter wafers (2”, 3”, 4” or 6”) and transition more rapidly than traditional semiconductor’s industry to larger diameters
WAFER SIZE
Wafer bow can reach up to 50μm for 2” wafers and 100μm for 4”, inducing pattern distortion.
WAFER BOW
2”
4”
6”
LED manufacturers can use different substrates, mostly sapphire or SiCwafers, which are transparent with light-diffusing features such as rough or patterned surfaces. Also, they can use metal wafers for vertical structures, so there’s large material variability.
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Apple iphone 6 and 6 plus front camera module teardown reverse costing report...Yole Developpement
For the iPhone 6 FaceTime camera module, Apple integrate an innovative CMOS Image Sensor constituted of an original structure of 4.8 MPixel sub-microlenses array mediated by the color filters to get the final 1.2 Mpixel resolution. This technical choice has a strong impact on the camera performances and on the device manufacturing cost.
The unique technology from Sony (Exmor-RS) consists in a stacking of a pixel array circuit which uses a Back-Side Illuminated (BSI) technology and a logic ISP circuit processed with a 65nm technology node. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process. This allows to raise the pixel array size by 15% and to considerably improve the light sensitivity by integrating an innovative grid and lenses design.
The camera module, with dimensions of 6.2 x 6.0 x 3.8mm, is equipped with a 4-elements lens module and a f/2.2 camera aperture which increase light sensitivity.
The report includes a comparison of Apple’s technical choices between iPhone6 Rear and Front camera.
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
24 camera modules for consumer and automotive applications, all from the main OEMs - analyzed and compared!
Smartphone manufacturers are increasingly integrating options and powerful components into their products. 3D and dual-camera modules are now available, offering better-image quality and providing more options, i.e. iris scanners and augmented reality.
The automotive camera module market is also rising steadily and is beginning to take significant market share.
Paralleling Yole Développement’s Camera Module Industry 2017 Market Report, this comparative review was conducted to provide insights into the structure and technology of 19 CMOS camera modules (CCM) released in flagship smartphones from the major brands.
In this report, rear and front-facing compact camera modules (including standard (mono), dual, iris scanners, and 3D camera modules) are analyzed and compared in terms of structural overview, module integration, lens number and dimensions, CIS res
olution, and pixel size. Indeed, OIS (Optical Image Stabilization) and dual-cameras are the big new trends for mobile camera modules.
More information on that report at http://www.i-micronews.com/reports.html
Status of the Camera Module Industry 2019 – Focus on Wafer Level Optics repor...Yole Developpement
CMOS Camera Modules (CCM) have become a key sensor technology – what are the dynamics and strategies in this highly competitive market?
More information on: https://www.i-micronews.com/produit/status-of-the-camera-module-industry-2019-focus-on-wafer-level-optics/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
LiDAR for Automotive and Industrial Applications 2019 by Yole DéveloppementYole Developpement
Is rationalization happening in the LiDAR market?
More information on: https://www.i-micronews.com/produit/lidar-for-automotive-and-industrial-applications-2019/
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
MEMS & sensors transitioning towards 3 main Hubs…
The inertial hub
Examples of MEMS companies with a «sensors integration» road (e.g., mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo sensors, AMS with optical combos, InvenSense with IMUs ….
Status of the Power Electronics Industry 2018 report by Yole DéveloppementYole Developpement
EV/HEV, motor drives, computing and storage propel power electronics market growth, from devices to passives, packaging and integration.
More information on https://www.i-micronews.com/report/product/status-of-the-power-electronics-industry-2018.html
LiDARs for Automotive and Industrial Applications 2018 Report by Yole Develop...Yole Developpement
Will automotive change the LiDAR market?
More information on that report at https://www.i-micronews.com/report/product/lidars-for-automotive-and-industrial-applications-2018.html
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
BioMEMS & Non-Invasive Sensors: Microsystems for Life Sciences & Healthcare 2...Yole Developpement
A new wave of sensors, responding to the challenge of global healthcare transformation, opens new business opportunities for mobile healthcare and emerging non-invasive devices.
More information on that report at https://www.i-micronews.com/category-listing/product/biomems-non-invasive-sensors-microsystems-for-life-sciences-healthcare-2018.html#table-of-contents
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
Acoustic MEMS and Audio Solutions 2017 - Report by Yole DeveloppementYole Developpement
The audio business is about to experience profound changes
Audio is becoming a key function of multiple existing and new products that increasingly has to be analyzed as a complete landscape compared to independent devices. From mobile phones to cars, from home assistants to drones, audio products like microphones, speakers and audio integrated circuits (ICs) are essential for all the new systems driving consumer electronic markets. The total audio business was worth more than $15B in 2016. With a compound annual growth rate (CAGR) close to 6%, in 2022, the audio device market will be worth $20B and become a key feature in all the applications it is involved in. And there’s clearly room for more added value in the audio supply and value chain, as well as other significant changes.
In 2016, Yole estimates that the MEMS microphone market has almost reached the $1B milestone, with a value of $993M. Combined with the $700M electret condenser microphone (ECM) market, now the acquisition of sound is almost a $2B value market. The µspeaker market is estimated to be worth $8.7B, (meaning speakers less than two inches in diameter). In addition to these two visible elements of the audio chain, the audio IC market, which includes codecs, digital signal processors (DSPs) and amplifiers, is estimated to be worth $4.3B in 2016.
This new Yole report describes the evolution of the three audio functions, microphones, speakers and audio ICs, technical trends, as well as the evolution of the strategies of the main players to capture a larger part of this fast-growing field.
For more information about our report, please visit our website: https://www.i-micronews.com/reports.html
Sensors and Sensing Modules for Smart Homes and Buildings - 2017 Report by Yo...Yole Developpement
Smart homes and buildings: The “Trojan Horse” strategy
To achieve greener and more secure homes and buildings requires a shift in sensing from today’s basic functions such as turning light switches on or off to more advanced functions. Three main drivers are currently leading the smart buildings market:
Better energy control. With 40% of the world’s energy used for buildings, mostly for heating in residential and lighting in commercial, this is a very strong driver.
Increased security with detection of intrusion, fires and seismic activity.
Better comfort for occupants with sensor modules or hubs like those manufactured by Google/Nest, Fibaro, Smarthings, Canary, and Elgato Eve. They generally include 1-10 sensors, an energy source and a wireless module.
For more information, visit our website: https://www.i-micronews.com/reports.html
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Apple iphone 6 and 6 plus front camera module teardown reverse costing report...Yole Developpement
For the iPhone 6 FaceTime camera module, Apple integrate an innovative CMOS Image Sensor constituted of an original structure of 4.8 MPixel sub-microlenses array mediated by the color filters to get the final 1.2 Mpixel resolution. This technical choice has a strong impact on the camera performances and on the device manufacturing cost.
The unique technology from Sony (Exmor-RS) consists in a stacking of a pixel array circuit which uses a Back-Side Illuminated (BSI) technology and a logic ISP circuit processed with a 65nm technology node. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process. This allows to raise the pixel array size by 15% and to considerably improve the light sensitivity by integrating an innovative grid and lenses design.
The camera module, with dimensions of 6.2 x 6.0 x 3.8mm, is equipped with a 4-elements lens module and a f/2.2 camera aperture which increase light sensitivity.
The report includes a comparison of Apple’s technical choices between iPhone6 Rear and Front camera.
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
24 camera modules for consumer and automotive applications, all from the main OEMs - analyzed and compared!
Smartphone manufacturers are increasingly integrating options and powerful components into their products. 3D and dual-camera modules are now available, offering better-image quality and providing more options, i.e. iris scanners and augmented reality.
The automotive camera module market is also rising steadily and is beginning to take significant market share.
Paralleling Yole Développement’s Camera Module Industry 2017 Market Report, this comparative review was conducted to provide insights into the structure and technology of 19 CMOS camera modules (CCM) released in flagship smartphones from the major brands.
In this report, rear and front-facing compact camera modules (including standard (mono), dual, iris scanners, and 3D camera modules) are analyzed and compared in terms of structural overview, module integration, lens number and dimensions, CIS res
olution, and pixel size. Indeed, OIS (Optical Image Stabilization) and dual-cameras are the big new trends for mobile camera modules.
More information on that report at http://www.i-micronews.com/reports.html
Status of the Camera Module Industry 2019 – Focus on Wafer Level Optics repor...Yole Developpement
CMOS Camera Modules (CCM) have become a key sensor technology – what are the dynamics and strategies in this highly competitive market?
More information on: https://www.i-micronews.com/produit/status-of-the-camera-module-industry-2019-focus-on-wafer-level-optics/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
LiDAR for Automotive and Industrial Applications 2019 by Yole DéveloppementYole Developpement
Is rationalization happening in the LiDAR market?
More information on: https://www.i-micronews.com/produit/lidar-for-automotive-and-industrial-applications-2019/
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
MEMS & sensors transitioning towards 3 main Hubs…
The inertial hub
Examples of MEMS companies with a «sensors integration» road (e.g., mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo sensors, AMS with optical combos, InvenSense with IMUs ….
Status of the Power Electronics Industry 2018 report by Yole DéveloppementYole Developpement
EV/HEV, motor drives, computing and storage propel power electronics market growth, from devices to passives, packaging and integration.
More information on https://www.i-micronews.com/report/product/status-of-the-power-electronics-industry-2018.html
LiDARs for Automotive and Industrial Applications 2018 Report by Yole Develop...Yole Developpement
Will automotive change the LiDAR market?
More information on that report at https://www.i-micronews.com/report/product/lidars-for-automotive-and-industrial-applications-2018.html
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
BioMEMS & Non-Invasive Sensors: Microsystems for Life Sciences & Healthcare 2...Yole Developpement
A new wave of sensors, responding to the challenge of global healthcare transformation, opens new business opportunities for mobile healthcare and emerging non-invasive devices.
More information on that report at https://www.i-micronews.com/category-listing/product/biomems-non-invasive-sensors-microsystems-for-life-sciences-healthcare-2018.html#table-of-contents
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
Acoustic MEMS and Audio Solutions 2017 - Report by Yole DeveloppementYole Developpement
The audio business is about to experience profound changes
Audio is becoming a key function of multiple existing and new products that increasingly has to be analyzed as a complete landscape compared to independent devices. From mobile phones to cars, from home assistants to drones, audio products like microphones, speakers and audio integrated circuits (ICs) are essential for all the new systems driving consumer electronic markets. The total audio business was worth more than $15B in 2016. With a compound annual growth rate (CAGR) close to 6%, in 2022, the audio device market will be worth $20B and become a key feature in all the applications it is involved in. And there’s clearly room for more added value in the audio supply and value chain, as well as other significant changes.
In 2016, Yole estimates that the MEMS microphone market has almost reached the $1B milestone, with a value of $993M. Combined with the $700M electret condenser microphone (ECM) market, now the acquisition of sound is almost a $2B value market. The µspeaker market is estimated to be worth $8.7B, (meaning speakers less than two inches in diameter). In addition to these two visible elements of the audio chain, the audio IC market, which includes codecs, digital signal processors (DSPs) and amplifiers, is estimated to be worth $4.3B in 2016.
This new Yole report describes the evolution of the three audio functions, microphones, speakers and audio ICs, technical trends, as well as the evolution of the strategies of the main players to capture a larger part of this fast-growing field.
For more information about our report, please visit our website: https://www.i-micronews.com/reports.html
Sensors and Sensing Modules for Smart Homes and Buildings - 2017 Report by Yo...Yole Developpement
Smart homes and buildings: The “Trojan Horse” strategy
To achieve greener and more secure homes and buildings requires a shift in sensing from today’s basic functions such as turning light switches on or off to more advanced functions. Three main drivers are currently leading the smart buildings market:
Better energy control. With 40% of the world’s energy used for buildings, mostly for heating in residential and lighting in commercial, this is a very strong driver.
Increased security with detection of intrusion, fires and seismic activity.
Better comfort for occupants with sensor modules or hubs like those manufactured by Google/Nest, Fibaro, Smarthings, Canary, and Elgato Eve. They generally include 1-10 sensors, an energy source and a wireless module.
For more information, visit our website: https://www.i-micronews.com/reports.html
InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sens...Yole Developpement
World’s first ‘7-Axis’ motion tracking device targeting drone application
Having supplied Apple for many years, InvenSense (TDK) is a leader in the inertial measurement unit (IMU) market. It has a large market share, competing with Bosch and others. This year, with the acquisition of Sensirion’s barometric pressure sensor division, InvenSense has entered a new market area. It has now released of its first ‘7-axis’ motion tracking combo, bringing together a 6-axis IMU and a pressure sensor, moving it into drone applications.
The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axis device, incorporating a 3-axis gyroscope and a 3-axis accelerometer, and a barometric pressure sensor previously developed by Sensirion in the same package. Compared with the stand-alone sensor hub, this approach eliminates a package and minimizes board area requirements.
More information on that report at http://www.i-micronews.com/reports.html
Smaller package and improved accuracy in a pressure sensor for wearables!
With its wide 300hPa - 1250hPa measurement-covering range and a low power consumption of only 2.0µA, Bosch’s BMP380 pressure sensor is more accurate than the previous BMP280 pressure sensor. Assembled in a 10-pin, metal-lid 2.0mm x 2.0mm x 0.75mm land-grid array package, the BMP380 integrates a digital pressure sensor and a temperature sensor.
It is equipped with only one MEMS die and an amplification application-specific integrated circuit - the same number of dies as the BMP280, but with smaller dimensions.
The pressure sensor is manufactured with Bosch’s “Advanced Porous Silicon Membrane” process, integrating a flexible pressure membrane and temperature diodes on a silicon substrate.
This System-in-Package consists of two sensors in one small package, mixing wire bonding and flip-chip connections. A thorough package analysis is included in this report, which also describes and compares MEMS and ASIC technology evolutions.
Phosphors and Quantum Dots 2017: LED downconverters for Lighting and Displays...Yole Developpement
Volume saturation, price pressure and a shifting intellectual property landscape are forcing the LED phosphor industry into a rationalization period, with innovation key for survival
EXPIRATION OF FUNDAMENTAL INTELLECTUAL PROPERTY CHANGES THE MATERIAL LANDSCAPE
Key patents held by Nichia and Osram have started expiring in 2017 and will continue to do so in 2018. While both companies have since built on those patents and created broad families of intellectual property (IP), it will become much more difficult for them to prevent competitors from using garnet phosphors in their LED packages.
As a result, phosphor families such as silicates and yellow nitrides (LYSN) are expected to lose market share as LED packagers transition to garnets. The switch will especially affect silicates, which are perceived to have lower performance than yttrium aluminum garnet (YAG) and other garnets, However, some of the most recent silicate compositions developed by tier-1 suppliers are now matching YAG performance but come at a premium price. Leading phosphor suppliers with a strong focus on silicate materials must therefore diversify their portfolio. They need to create new silicate compositions with unique features to meet specific demands in various high added value lighting applications.
LYSN might fare better in the long term. Yellow nitrides have exhibited steady and continuous performance improvement since entering the market in 2010. The material is already matching garnet performance in most aspects and, being less mature, still offers significant room for improvement. Attractive features of yellow nitride include a lower infrared tail that could translate to higher efficiency compared to YAG. Leaders in nitride phosphors could therefore find a new growth driver as the red nitride market reaches saturation.
More information on that report at http://www.i-micronews.com/reports.html
Status of the CMOS Image Sensor Industry 2016: New Dynamics in Market and Tec...Yole Developpement
New functions are pushing change in CMOS image sensors, boosting the market toward $18.8B in 2021 at 10.4% CAGR
Beyond $10B: The CMOS image sensor industry keeps growing at high pace
Driven by renewed mobile and automotive applications, the CMOS image sensor (CIS) industry is expected to expand at a compound annual growth rate (CAGR) of 10.4% from 2015 to 2021, reaching US$18.8B market value by 2021.
Yole Développement expects sustained growth of the CMOS image sensor industry for the next five years. Increasing camera content in smartphones will more than offset slower smartphone volume growth. The trend for dual and 3D cameras will have a major impact on CIS volumes. While it is too early to fully describe the strategy of the main actors yet, some products are already on the market. The 2016 report comprehensively covers key market and technology choices.
One big story this year is the consumer market, which is recovering from the total collapse of digital photography. While action cameras seem to have reached a ceiling, new applications such as drones, robots, virtual reality and augmented reality are ready to rejuvenate this emblematic market. The Automotive camera market has established itself as a key growth market for CIS. The Advanced Driver Assistance (ADAS) trend is further increasing pressure on vendors to provide sensors beyond their current technical capabilities. Image analysis is the new frontier and early usage of artificial intelligence is catching people’s imagination. We are therefore in the middle of an explosive growth pattern that will not slow down before 2021. An exceptionally high 23% CAGR is predicted in automotive for the 2015-2021 period.
Machine Vision for Industry and Automation 2018 Report by Yole DeveloppementYole Developpement
Machine vision is at the heart of the automation revolution.
More information on that report at https://www.i-micronews.com/report/product/machine-vision-for-industry-and-automation-2018.html
Imaging Technologies for Automotive 2016 Report by Yole Developpement Yole Developpement
Imaging technology, which is currently mainly cameras, is exploding into the automotive space, and is set to grow at 20% CAGR to reach $7.3B in 2021
INFOTAINMENT AND ADVANCED DRIVER ASSISTANCE SYSTEMS (ADAS) PROPEL AUTOMOTIVE IMAGING
Since 2008, when a recession acted as a wakeup call to the whole industry, the automotive market has undergone obvious structural change. Capitalizing on technologies initially developed for smartphones, electronics have invaded, and imaging technology is now taking center stage. From less than one camera per car on average in 2015, there will be more than three cameras per car by 2021, which means 371 million automotive imaging devices.
Cameras were initially mounted for ADAS purposes on high-end vehicles, with deep learning image analysis techniques promoting early adoption. The Israeli company Mobileye has been instrumental in bringing this technology to market, along with On Semiconductor, which provided the CMOS image sensor. Copycat competition will probably pick up as the market now justifies initial investment in design and technology. It is now a well-established fact that vision-based autonomous emergency braking (AEB) is possible and saves life. Adoption of forward ADAS cameras will therefore accelerate.
Growth of imaging for automotive is also being fueled by the park assist application, and 360° surround view camera volume is skyrocketing. While it’s becoming mandatory in the US to have a rearview camera, that uptake is dwarfed by 360° surround view cameras, which enable a “bird’s eye view” perspective. This trend is most beneficial to companies like Omnivision at sensor level and Panasonic and Valeo, which have become the main manufacturers of automotive cameras.
Mirror replacement cameras are currently the big unknown and take-off will primarily depend on its appeal and car design regulation. Europe and Japan are at the forefront of this trend, which should become slightly significant by 2021.
Solid state lidar is well talked about and will start to be found in high end cars by 2021. Cost reduction will be a key driver as the push for semi-autonomous driving will be felt more strongly by car manufacturers. The report will analyse the impact of lidar for automotive vision in detail.
Night vision cameras using Long Wave Infrared (LWIR) technology were initially perceived as a status symbol. However, they’re increasingly appreciated for their ability to automatically detect pedestrians and wildlife. LWIR will therefore become integrated into ADAS systems in future.
3D cameras will be limited to in-cabin infotainment and driver monitoring. This technology will be key for luxury cars and therefore is of limited use today.
If any significant semi-autonomous trend picks up, the technology will probably become mandatory, due to safety issues.
More information on that report at http://www.i-micronews.com/reports.html
How the MEMS Industry Can Extract More Value From its Customers? by JC. Eloy ...Yole Developpement
How the MEMS Industry Can Extract More Value From its Customers ?
Presentation at MEMS Industry Group by JC. Eloy (eloy@yole.fr)
TOP 5 remains unchanged in 2014 (and certainly in 2015) but Bosch now accounts for one-third of the $3.8B MEMS revenues shared by the top 5 MEMS companies (accounting for about one third of the total MEMS business).
The ability to deliver a function!
• The sensor is the way to understand what is happening.Selling sensors without the brain is putting the MEMS industry in a low cost,commoditazation corner where the Moore’s Law is not helping you compared to the semiconductor business.
Technology is almost ready
Players are working on the killer applications
WHAT WILL HAPPEN?
• MEMS is growing as a market, both in volume and total value
• But the value is moving from devices to functions and few MEMS players are taking benefit of this value flow
• Very limited number of companies are entering the field, the last success has been Invensense
• The last really new device was Knowles silicon microphone in 2003
• So it is now important to change the MEMS mind set and to move to functions development…
CMOS Image Sensor Service – Imaging Research 2019 Monitors by Yole DéveloppementYole Developpement
As camera quantity and die size increase per end-device, a 10.1% year-on-year growth rate is expected for 2019.
More information on CMOS monitor at: https://www.i-micronews.com/products/cmos-image-sensor-service-camera-module-research/
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2021/09/the-transformation-from-imaging-to-sensing-driving-a-market-revolution-a-presentation-from-yole-developpement/
Pierre Cambou, Principal Analyst at Yole Développement, presents the “Transformation from Imaging to Sensing: Driving a Market Revolution” tutorial at the May 2021 Embedded Vision Summit.
Over the past 20 years, digital imaging has grown to become a huge industry with a focus on producing images for human consumption. More recently, the emphasis has begun shifting to using images as sensory inputs to machines. In this talk, Cambou explores how this shift is transforming the imaging industry.
Cambou examines market dynamics in the mobile, consumer, computing, automotive, medical, security, industrial, and aerospace and defense segments. He explains how image sensor sales are being affected by this shift, using the example of 3D face recognition in mobile. He also discusses how image-related computing is being impacted. For example, while in the past most devices had to incorporate some kind of ISP, now the VPU is becoming the new imperative.
Light Shaping Technologies for Consumer and Automotive Applications 2019Yole Developpement
Legacy micro-optics are on the verge of being reshaped by the semiconductor industry and nanostructuring techniques.
More information on: https://www.i-micronews.com/products/light-shaping-technologies-for-consumer-and-automotive-applications-2019/
Paramount to the future of safety and autonomy, the automotive imaging market is at a key crossroads.
More information on https://www.i-micronews.com/products/imaging-for-automotive-2019/
For the full video of this presentation, please visit:
https://www.embedded-vision.com/platinum-members/embedded-vision-alliance/embedded-vision-training/videos/pages/may-2019-embedded-vision-summit-tschudi
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Yohann Tschudi, Technology and Market Analyst at Yole Développement, presents the "AI Is Moving to the Edge—What’s the Impact on the Semiconductor Industry?" tutorial at the May 2019 Embedded Vision Summit.
Artificial intelligence is proliferating into numerous edge applications and disrupting numerous industries. Clearly this represents a huge opportunity for technology suppliers. But it can be difficult to discern exactly what form this opportunity will take. For example, will edge devices perform AI computation locally, or in the cloud? Will edge devices use separate chips for AI, or will AI processing engines be incorporated into the main processor SoCs already used in these devices?
In this talk, Tschudi answers these questions by presenting and explaining his firm's market data and forecasts for AI processors in mobile phones, drones, smart home devices and personal robots. He explains why there is a strong trend towards executing AI computation at the edge, and quantifies the opportunity for separate processor chips and on-chip accelerators that address visual and audio AI tasks.
Global and china cmos camera modules industry report, 2013 2014ResearchInChina
In 2013, the CMOS image sensor shipment reached 3.26 billion units at an increase of 15.2%, and the market size hit approximately USD8.008 billion. The shipment is expected to rise by 16% to 3.782 billion units, and the market size will be USD8.698 billion or so in 2014. Camera modules are not only applied to photographing, but also motion sensing for postural control, which will propel the market.
Sensors for robotic vehicles 2018 report by yole developpement i-micronewsYole Developpement
High end industrial sensors will win in the emerging robotic vehicle industry.
THE ROBOTIC VEHICLE SUPPLY CHAIN IS NOW STARTING
Announcements are piling up from companies like
Waymo, Uber, Lyft, Baidu and their automotive
manufacturing partners such as Fiat Chrysler
Automobiles, Mercedes, BMW and Renault-
Nissan. 2018 will most probably be the initial launch
year for robotic taxis in several cities around the
globe. The move has direct consequences for
technology providers in high-end sensing and
computing equipment. The vehicle count that we
can collect suggests several tens of thousands of
vehicles on the road worldwide before end of
2022. As far as we know, each robotic vehicle will
be equipped with a suite of sensors encompassing
Lidars, radars, cameras, Inertial Measurement
Units (IMUs) and Global Navigation Satellite
Systems (GNSS). The technology is ready and
the business models associated with autonomous
driving (AD) seem to match the average selling
prices for those sensors.
Image Signal Processor and Vision Processor Market and Technology Trends 2019...Yole Developpement
Artificial intelligence-powered newcomers are reshuffling the pack.
More information on https://www.i-micronews.com/products/image-signal-processor-and-vision-processor-market-and-technology-trends-2019/
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2023/09/3d-sensing-market-and-industry-update-a-presentation-from-the-yole-group/
Florian Domengie, Senior Technology and Market Analyst at Yole Intelligence (part of the Yole Group), presents the “3D Sensing: Market and Industry Update” tutorial at the May 2023 Embedded Vision Summit.
While the adoption of mobile 3D sensing has slowed in Android phones, the market has still been growing fast, thanks to Apple. Apple is continuing to adopt 3D cameras for iPhones in both front and rear. Along the way, Apple has updated face ID and simplified and shrunk 3D camera optical structures. Meanwhile, due to Android phone OEMs mostly choosing not to incorporate 3D cameras, sensor suppliers and integrators have had to work hard to open up other consumer markets.
In addition to consumer markets, the use of 3D sensing has been blossoming in markets such as the industrial market and the nascent automotive market, where 3D sensing is increasingly used for advanced driver assistance systems and driver monitoring systems. In this talk, Domengie provides an overview of the main application, market, industry and technology trends of the 3D sensing industry.
Silicon Photonics 2018 - Report by Yole Developpement Yole Developpement
Fueled by increasing internet traffic thanks to social networks, video and gaming content, increasing bandwidth will be required for inter- and intra-data center communications. As a short term answer to this possible bandwidth congestion, new photonics technology for transceivers is still pulled onto the market by Google, Apple, Facebook, Amazon and Microsoft (GAFAM) and now by Baidu, Alibaba and Tencent (BAT) in China.
More information on that report at http://www.i-micronews.com/reports.html
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
Next-Generation Human Machine Interaction in Displays 2019 report by Yole Dév...Yole Developpement
Sensors directly integrated in displays: still a long way to wow!
More information on https://www.i-micronews.com/products/next-generation-human-machine-interaction-in-displays-2019/
Video content analysis and video analytics are other terms for intelligent video. It analyses video surveillance feeds automatically and extracts vital data, such as the detection of an intruder in photographs. Intelligent Video is commonly used for video motion detection, video pattern matching, and auto-tracking. Surveillance cameras are increasingly being used by security organizations to keep a close eye on the surrounding environment 24 hours a day, seven days a week. IP technology enables the creation of an open, trustworthy, and scalable surveillance system. While the amount of video data available grows, a person can only see a limited amount of it. People are notorious for losing concentration quickly, and suspicious gestures on the screen are frequently ignored. Intelligent video monitors around the clock, seven days a week, and improves monitoring accuracy and efficacy. Here's another application for Intelligent Video. It transforms video data into a gold mine for business requirements. The camera captures customer behavior and provides critical data for marketing, retail operations, building layout design, traffic patterns, and other activities. Going through hours of video from a dozen cameras was a difficult, labor-intensive, and time-consuming operation. The intelligent video quickly analyses large amounts of video data. Intelligent video is undoubtedly useful for monitoring and a variety of corporate tasks, but it is costly and difficult to implement because it necessitates high-performance computers and specialized software.
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
More information on: https://www.i-micronews.com/products/high-end-inertial-sensors-for-defense-aerospace-and-industrial-applications-2020/
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...Yole Developpement
High-Performance Computing and cloud gaming are setting the bar for leadership in the high-end CPU and GPU markets.
More info on: https://www.i-micronews.com/products/xpu-high-end-cpu-and-gpu-for-datacenter-applications-2020/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
State of ICS and IoT Cyber Threat Landscape Report 2024 previewPrayukth K V
The IoT and OT threat landscape report has been prepared by the Threat Research Team at Sectrio using data from Sectrio, cyber threat intelligence farming facilities spread across over 85 cities around the world. In addition, Sectrio also runs AI-based advanced threat and payload engagement facilities that serve as sinks to attract and engage sophisticated threat actors, and newer malware including new variants and latent threats that are at an earlier stage of development.
The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
Elevating Tactical DDD Patterns Through Object CalisthenicsDorra BARTAGUIZ
After immersing yourself in the blue book and its red counterpart, attending DDD-focused conferences, and applying tactical patterns, you're left with a crucial question: How do I ensure my design is effective? Tactical patterns within Domain-Driven Design (DDD) serve as guiding principles for creating clear and manageable domain models. However, achieving success with these patterns requires additional guidance. Interestingly, we've observed that a set of constraints initially designed for training purposes remarkably aligns with effective pattern implementation, offering a more ‘mechanical’ approach. Let's explore together how Object Calisthenics can elevate the design of your tactical DDD patterns, offering concrete help for those venturing into DDD for the first time!
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on the notifications, alerts, and approval requests using Slack for Bonterra Impact Management. The solutions covered in this webinar can also be deployed for Microsoft Teams.
Interested in deploying notification automations for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
Join us to learn more about this new, human-in-the-loop capability, brought to you by Integration Service connectors.
And...
Speakers:
Akshay Agnihotri, Product Manager
Charlie Greenberg, Host
Essentials of Automations: Optimizing FME Workflows with ParametersSafe Software
Are you looking to streamline your workflows and boost your projects’ efficiency? Do you find yourself searching for ways to add flexibility and control over your FME workflows? If so, you’re in the right place.
Join us for an insightful dive into the world of FME parameters, a critical element in optimizing workflow efficiency. This webinar marks the beginning of our three-part “Essentials of Automation” series. This first webinar is designed to equip you with the knowledge and skills to utilize parameters effectively: enhancing the flexibility, maintainability, and user control of your FME projects.
Here’s what you’ll gain:
- Essentials of FME Parameters: Understand the pivotal role of parameters, including Reader/Writer, Transformer, User, and FME Flow categories. Discover how they are the key to unlocking automation and optimization within your workflows.
- Practical Applications in FME Form: Delve into key user parameter types including choice, connections, and file URLs. Allow users to control how a workflow runs, making your workflows more reusable. Learn to import values and deliver the best user experience for your workflows while enhancing accuracy.
- Optimization Strategies in FME Flow: Explore the creation and strategic deployment of parameters in FME Flow, including the use of deployment and geometry parameters, to maximize workflow efficiency.
- Pro Tips for Success: Gain insights on parameterizing connections and leveraging new features like Conditional Visibility for clarity and simplicity.
We’ll wrap up with a glimpse into future webinars, followed by a Q&A session to address your specific questions surrounding this topic.
Don’t miss this opportunity to elevate your FME expertise and drive your projects to new heights of efficiency.
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
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Revenue($B)
2016 2015
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2016 2015
Image sensor players
Module assy players
Lens players
2016 2015
Next 10 players between $300M and $1B
Other players between $100M and $300M
10 players beyond $1B
Mettre en dessous de Image sensor playersDupliquer les dates 2016 et 2015 sous Module assy players et mettre les carrés en vert
(selon les colonnes dans le graph). Vert foncé à gauche, vert clair à droite.Faire de même pour Lens players,
mettre les dates en dessous en bleu. Et idem pourVCM players, mettre les dates en dessous en gris.
VCM players
In 2015, Yole Développement published its first
report on the camera module industry and
mentioned the immaturity of the ecosystem
with numerous small players especially for
module assembly. Now the dust has settled
and giant camera module players have emerged
such as LG Innotek, Semco, Foxconn Sharp,
O-Film and Sunny Optical. This 2017 edition
is giving you the insights into the trajectory
of the industry and of more than 30 players
serving mobile and other applications such as
automotive and security.
Historically one could differentiate the faith
of camera module market from the sub parts
such as the image sensor, the lens and the
autofocus or optical image stabilization system
(Voice Coil Motors - VCM). It seems that
differentiated growth has now ended and every
sub segment is enjoying almost equal benefit
from the rising market tide. This convergence is
in part due to the end of quasi-monopoly from
Sony in the image sensor sub-segment now
joined by Samsung and Omnivision. The story
is very similar for Largan Precision in the lens
set sub-segment which is now facing renewed
competition from Sunny Optical, Kantatsu and
Genious Optical. The last sub-domain of our
interest in this report is VCMs. The growth
of VCM companies has been undercut by dire
structuration efforts. We had mentioned the
inability of the VCM to serve the demand in the
mobile market. Price pressures have changed
the face of competition with competitors such
as Mitsumi and Shicoh which were forced out
and new players such as New Shicoh and Jawha
to take center stage.
CAMERA MODULE INDUSTRY 2017
Market & Technology report - November 2017
AT 12.2% CAGR FOR THE NEXT FIVE YEARS, THE COMPACT CAMERA
MODULE (CCM) INDUSTRY IS A GROWTH POWERHOUSEWITH NUMEROUS
LARGE COMPANIES THRIVING IN A DYNAMIC MARKET
New technologies and applications have restructured the Compact Camera Module industry.
(Yole Développement, November 2017)
Status of the camera module industry
WHAT’S NEW
• 2016-2022 forecast
• Ecosystem update
• Penetration of autofocus (AF)
Optical Image Stabilization (OIS)
technology
• Penetration of dual and 3D
cameras technology
• Automotive camera market growth
• Security camera market growth
OBJECTIVES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
To provide market data on key CCM
metrics dynamics
• CCM revenue forecast, volume
shipments and component share
• Market share with detailed
breakdown by player.
• Application focus on key areas
of growth for CCM: mobile and
automotive
To provide in-depth understanding
of the CCM value chain,
infrastructure players
• Who are the CCM players
(CIS manufacturers, CCM
manufacturer, optics
manufacturer…) and how they
are related?
• Who are the key suppliers to
watch and more generally how will
the camera module
industry evolve.
To provide key technical insight
analysis about future technology
trends and challenges
• Manufacturing technologies:
design structure
• Device technologies: CCM
application across markets.
• Technology focus on game
changing areas such as OIS and
WLC.
NEW TECHNOLOGIES ARE SERVING DEMANDING APPLICATIONS IN A
MARKET HUNGRY FOR TECHNOLOGY PERFORMANCE
Mobile rear photography camera is still the
main driver of the camera module industry
that reached $23.4 Billion in 2016 and that
will reach $46.8 Billion by 2022. In 2015
optical image stabilization (OIS) was the
VCM technology differentiator introduced
by Apple. While competition and the whole
ecosystem was struggling to incorporate this
innovation, the dual camera approach has
been an elegant solution from LG and Huawei
to recycle old module designs into state
of the art systems. Those two innovations
have collided and resulted into the impetus
to provide dual rear cameras with dual OIS
which is only happening end of 2017.
18. Mobile camera modules vs. automotive camera modules
(Yole Développement, November 2017)
CAMERA MODULE INDUSTRY 2017
AUTOMOTIVE CAMERA MODULES ARE REACHING $2 BILLIONS IN REVENUE
AND ARE NOW WELL BEYOND EMERGENCE
While 2016 has been a crazy year for automotive
camera modules as it paused for a quarter and
ended with the $15B purchase of Mobileye by Intel.
The “explosive” growth pattern is maintained
with 20% CAGR predicted for 2016-2022. In
this context, the balance of power has gradually
switched from the camera module makers who
may have discussed directly with the OEMS,
now replaced by the tier ones such as Bosch,
Continental and Autoliv that do not necessarily
manufacture the camera module themselves.
Most camera module makers are in fact part of
this game as tier twos.
Automotive cameras are part of a bigger picture
of automotive electronics, ADAS and automated
driving. They have hugely benefited from the
infrastructure left by Digital Still Camera (DSC)
manufacturers and the know-how developed from
mobile camera modules. The direct consequence
has been the dramatic decrease in average selling
prices (ASP) as we expect it to cross the $20 line
in 2017.
Technology wise we do also see much more
maturity in the way automotive camera modules
are build. As standardization is fostering
competition, we expect more players to enter
the fray. Today we are witnessing a duopoly on
the image sensor side from ON Semiconductor
and Omnivision. The link between image
acquisition and image analysis is very strong in
ADAS where ultimately all automotive cameras
will be categorized. One of the big question is the
future compatibility of vision processors and the
evolution in market dominance of vendors such as
Intel Mobileye.
2012-2022 Compact Camera Module revenue forecast
COMPANIES CITED IN THE REPORT (non exhaustive list)
AAC Technologies, Ability Opto, AGC, Alps, Apple, Asia Optical, Brigates, BYD Microelectronics, Calin
Technology, Cammsys, Cha Diostech, Chicony, Continental, Cowell Optics, Cresyn, Crystal-Optech, Ddk, DJI,
Foxconn, Fujifilm, Fujinon, Fujitsu, Galaxycore, Genius Optical, Google, Gopro, Haesung Optics, Himax, Hirose,
Hoya, Huawei, IM, Intel, Jawah, JSR, Kantatsu, Kinko Optical, Kolen, Kyocera, Largan, Lenovo, LG Innotek, Liteon,
Magna, Materion, Mcnex, Microsoft, Mitsumi, Mobileye, Nalux, New Shicoh, Nidec, NTK, O-Film, Omnivision, On
Semiconductor, Optis, Panasonic, Parrot, Partron, Pixart, Pixelplus, Powerlogic, Primax, Q-Tech, Ricoh, Samsung,
Schott, Semco, Sharp, Sekonix, SK Hynix, Softkinetic, Sony, ST Microelectronics, Sunny Optical, Sunex, Superpix,
Suyin, TDK, Toshiba, Truly, Valeo, Viavi, Volvo, Xiaomi, Xperi, Zeiss , Zeon, Zte and more…
0
10
20
30
40
50
60
Revenue($B)
~ +12.2% CAGR 2016–2022
2012 2013 2014 2015 2016 2017e 2018e 2019e 2020e 2021e 2022e
Mobile Consumer Computing Automotive
2015 estimationMedical Security Industrial
(Yole Développement, November 2017)
On the mobile front camera side, the impact
of selfies has been increasing the performance
and cost of camera devices. Now Apple and
Samsung are coming out with dual front camera
setup incorporating biometric capability and also
adding a 3D sensing user interface for Apple.
Those innovations are game changing as they
explain the enormous increase in camera module
content per smartphone. While 2 cameras were
needed few years ago, now the new normal
in the high end of mobile is to have 4 cameras,
2 on both sides. With a gross average cost of
$6 per camera it is quite easy to understand we
left a world of $12 per smartphone (in 2015) and
have entered a world in the range of $24 worth
of camera module per smartphone.
This vision is currently being implemented by
most OEMs and while the smartphone industry
is entering into a more modest growth pattern
due to maturity, the camera module industry
is not slowing down its pace thanks to volume
demand, sustained prices and a technology
driven environment.
Two industries controlled by giant companies with ~$200B in revenuewo industries controlled by aniesTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTTwwwwwwwwwwwwwwwwwwwwwwwwwTTTTTTTTTTTTTT
x2=
with ~$200BB in revenue
19. MARKET TECHNOLOGY REPORT
Find more
details about
this report here:
Report objectives and scope 5
Methodology 7
Executive summary 14
Introduction 43
Global technology roadmaps
Camera module definition
Cost breakdown by resolution in $
Cost breakdown by resolution in %
Market forecast 59
Segmentation
2012-2022 volume shipment forecast by
market
2012-2022 volume shipment forecast by
application
2012-2022 ASP forecast by application
2012-2022 revenue forecast by market
2012-2022 revenue forecast by application
2012-2020 revenue forecast by
component
Value breakdown of the CCM market
Analysis of the CCM market forecast
Company ecosystem 72
Ecosystem of the CCM industry
Value chain of CCM industry
Mobile camera supply chain
Automotive camera supply chain
2016 CCM revenue market share
CCM market share analysis
2016 sensor for CCM revenue market
share
Sensor for CCM market share analysis
2016 lens for CCM revenue market share
Lens for CCM market share analysis
2014 autofocus OIS for CCM revenue
market share
Autofocus OIS for CCM market share
analysis
Analysis of the CCM ecosystem
Application trends 100
Mobile
Consumer
Automotive
Other : Medical, machine vision
Technology trends 147
Image sensor
Optics
IR cut filter
Connectors
Packaging
Specific manufacturing equipment
AF OIS
Automotive technology focus 181
Image sensor
Optics
Packaging
Conclusions and perspectives 192
Appendix – Yole Développement 194
TABLE OF CONTENTS (complete content on i-Micronews.com)
• Status of the CMOS Image Sensor Industry
2017
• 3D Imaging and Sensing 2017
RELATED REPORTS
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AUTHORS
Pierre Cambou joined the imaging
industry in 1999. Following an engineering
degree from Université de Technologie
de Compiègne in parallel to a master
of science from Virginia Tech in 1998,
as well as graduating from Grenoble
Ecole de Management’s MBA, Cambou
took several positions at Thomson TCS,
which became Atmel Grenoble in 2001
and e2v Semiconductors in 2006. In
2012 he founded Vence Innovation, now
called Irlynx, in order to bring to market
a disruptive man-to-machine interaction
technology. He joined market research
and strategy consulting company Yole
Développement as imaging activity
leader in 2014.
From 1996 to 1999 Jean-Luc Jaffard
paved the way of imaging activity
at STMicroelectronics being at the
forefront of the emergence and growth
of this business. At STMicroelectronics
Imaging division he has been
appointed Research Development and
Innovation Director managing a large
multidisciplinary and multicultural team
and was later on promoted Deputy
General Manager and Advanced
Technology Director in charge of
identifying, sourcing or developing the
breakthrough Imaging Technologies
and Applications to transform
them into innovative and profitable
products. In 2010 he was appointed
S T M i c r o e l e c t r o n i c s I n t e l l e c t u a l
Property Business Unit Director. In
2014 he created the Technology and
Innovation branch of Red Belt Conseil,
to support High Tech actors like SME,
Research Institutes, Start-ups, Analysts,
Investors and public authorities. Jean-
Luc Jaffard owns multiple patents in
semiconductor and Imaging domains
and has been invited speaker in many
conferences worldwide. He studied
Electronic and Microelectronic and has
been graduated from Ecole Supérieure
d’Electricité of Paris in 1979.
Find all our reports on www.i-micronews.com
KEY FEATURES OF THE REPORT
• 2016 camera module market share (in %)
• 2016 sensor for CCM market share (in %)
• 2016 lens for CCM market share (in %)
• 2016 autofocus OIS for CCM market share (in %)
• CCM volume shipment forecast by application 2012-2022
• CCM average selling price forecast by application 2012-2022
• CCM revenue forecast by application 2012-2022
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Camera Module Industry 2017
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