The document discusses the various technology files and rules required for physical design. It describes foundry files like the technology file, LEF, DEF, PLIB, PDEF files as well as parameters, rules and guidelines. It then covers the different aspects of technology rules including manufacturing grid, routing grid, standard cell placement tile, routing layers, blockages, vias, density rules, antenna rules and more. Finally it briefly mentions other file formats used like CLF, ALF, TLU, ITF that provide additional details for physical design.
This document discusses ASIC placement, which involves assigning exact locations to circuit components within a chip's core area. The goals of placement are to minimize the total interconnect length and costs while meeting timing requirements. It describes two main placement techniques - global placement, which groups cells to minimize interconnect between groups, and detailed placement, which further optimizes placement objectives. The document outlines various placement algorithms, goals, and trends like mixed-size placement and whitespace distribution to improve routability and performance.
Power gating is the main power reduction techniques for the static power. As long as technology scaling is taking place, static power becomes paramount important factor to the VLSI designs.Therefore Power gating is the recent power reduction technique that is actively in research areas.
Low power VLSI design has become important due to increasing integration leading to higher power consumption. Low power design is essential for handheld devices to allow long battery life and better performance. There are various techniques for low power design including reducing supply voltage, minimizing capacitance and switching activity, and employing strategies like clock gating and power gating. Low power design can be achieved at different levels from system to logic to physical design.
System partitioning in VLSI and its considerationsSubash John
System partitioning divides a large circuit into smaller subcircuits. This allows the subcircuits to be designed independently and in parallel, speeding up the design process. Effective partitioning aims to minimize connections between subcircuits. Tool-based partitioning allows constraints to be set to generate a partitioned netlist that balances subcircuit sizes and minimizes connections between top-level blocks.
The document discusses several key challenges in physical design for semiconductor chips. It outlines general challenges faced in analog, digital, and mixed-signal design such as manufacturing technology limitations, leakage power, interconnect delay, and congestion. Specific issues discussed in more detail include routing congestion, IR drop causing voltage variations, crosstalk interference, scaling challenges between different process nodes, and thermal issues in 3D chip design involving through-silicon vias. The document provides an overview of design objectives to optimize power, timing, area, and yield against these physical implementation challenges.
The physical design flow begins with placement which involves assigning exact locations to modules like gates and standard cells to minimize area and interconnect cost while meeting timing constraints, with the goal of enabling easier routing; placement tools take as input the netlist, floorplan, libraries, and constraints to perform global and detailed placement as well as optimization. The quality of placement significantly impacts the ability to route the design successfully.
Fusion Compiler is the next-generation RTL-to-GDSII implementation system architected to address the complexities of advanced node designs and deliver up to 20% improved PPA while reducing Time To Results (TTR) by 2X.
Implementing Useful Clock Skew Using Skew GroupsM Mei
Implementing useful skew through skew groups or manual buffer insertion can improve timing in a large memory block design. Skew groups define a target skew value for groups of clock pins before clock tree synthesis, resulting in a smaller clock tree, lower power increase, and less routing complexity compared to manual buffer insertion. Manual insertion precisely controls skew by adding buffers but dramatically increases clock cell count and power consumption versus skew groups. Both methods effectively improved setup timing for the memory block design.
This document discusses ASIC placement, which involves assigning exact locations to circuit components within a chip's core area. The goals of placement are to minimize the total interconnect length and costs while meeting timing requirements. It describes two main placement techniques - global placement, which groups cells to minimize interconnect between groups, and detailed placement, which further optimizes placement objectives. The document outlines various placement algorithms, goals, and trends like mixed-size placement and whitespace distribution to improve routability and performance.
Power gating is the main power reduction techniques for the static power. As long as technology scaling is taking place, static power becomes paramount important factor to the VLSI designs.Therefore Power gating is the recent power reduction technique that is actively in research areas.
Low power VLSI design has become important due to increasing integration leading to higher power consumption. Low power design is essential for handheld devices to allow long battery life and better performance. There are various techniques for low power design including reducing supply voltage, minimizing capacitance and switching activity, and employing strategies like clock gating and power gating. Low power design can be achieved at different levels from system to logic to physical design.
System partitioning in VLSI and its considerationsSubash John
System partitioning divides a large circuit into smaller subcircuits. This allows the subcircuits to be designed independently and in parallel, speeding up the design process. Effective partitioning aims to minimize connections between subcircuits. Tool-based partitioning allows constraints to be set to generate a partitioned netlist that balances subcircuit sizes and minimizes connections between top-level blocks.
The document discusses several key challenges in physical design for semiconductor chips. It outlines general challenges faced in analog, digital, and mixed-signal design such as manufacturing technology limitations, leakage power, interconnect delay, and congestion. Specific issues discussed in more detail include routing congestion, IR drop causing voltage variations, crosstalk interference, scaling challenges between different process nodes, and thermal issues in 3D chip design involving through-silicon vias. The document provides an overview of design objectives to optimize power, timing, area, and yield against these physical implementation challenges.
The physical design flow begins with placement which involves assigning exact locations to modules like gates and standard cells to minimize area and interconnect cost while meeting timing constraints, with the goal of enabling easier routing; placement tools take as input the netlist, floorplan, libraries, and constraints to perform global and detailed placement as well as optimization. The quality of placement significantly impacts the ability to route the design successfully.
Fusion Compiler is the next-generation RTL-to-GDSII implementation system architected to address the complexities of advanced node designs and deliver up to 20% improved PPA while reducing Time To Results (TTR) by 2X.
Implementing Useful Clock Skew Using Skew GroupsM Mei
Implementing useful skew through skew groups or manual buffer insertion can improve timing in a large memory block design. Skew groups define a target skew value for groups of clock pins before clock tree synthesis, resulting in a smaller clock tree, lower power increase, and less routing complexity compared to manual buffer insertion. Manual insertion precisely controls skew by adding buffers but dramatically increases clock cell count and power consumption versus skew groups. Both methods effectively improved setup timing for the memory block design.
This document discusses physical design verification checks that are performed on an integrated circuit layout. It describes design rule checking (DRC) which checks that a layout adheres to foundry design rules for manufacturability. Layout versus schematic (LVS) checks that the layout connectivity matches the schematic netlist. Electrical rule checking (ERC) identifies electrical issues like floating devices or short circuits. The document provides examples of DRC, LVS, and ERC checks and typical issues found during these verification steps.
This document discusses digital VLSI design flows. It begins by acknowledging previous work that informed the presentation. It then discusses considerations in developing an electronic system, including components of the system. It describes integrated circuits based on application, fabrication technology, device, and device count. It discusses using standard or application-specific integrated circuits. It outlines a top-down design approach and terminology used in the design flow.
This document discusses library characterization, which involves characterizing standard cell libraries used in semiconductor design. It begins with an overview of why library characterization is an interesting career and then discusses fundamental terminology. It provides examples of characterizing an inverter and D flip-flop, covering timing analysis, power characterization, and more. Advanced topics discussed include state dependent delays, load capacitance characterization, and measuring tri-state delays. References are provided for further reading.
The document discusses input/output (I/O) circuits and packaging for integrated circuits. It begins by describing how chips are connected to the outside world via I/O circuits, bonding wires, and packages. It then discusses the main properties and requirements of packages, including electrical characteristics, number of I/O pins, and thermal properties. The document outlines different packaging technologies like wire bonding and flip chip packaging. It also discusses I/O circuit requirements and different types of I/O cells like digital I/O buffers and analog I/O cells. Finally, it briefly introduces system-in-package technologies that integrate multiple silicon chips or dies into a single package using techniques like multi-chip modules, silicon interposers,
This document provides an introduction to VLSI physical design. It discusses the objectives of physical design including understanding the physical design flow, tools used, CMOS process parameters, and scaling issues. The topics covered include technology evolution, scaling issues, design principles, verification and simulation, the detailed physical design flow, and foundry files, parameters, rules and guidelines. It also summarizes key aspects of technology scaling from 0.25um to 0.05um processes including the dominance of interconnect delay, increasing cross coupling capacitance, and implications for multiple clock cycles to cross chips.
The document discusses floor planning, which is the first step in physical design. It involves defining the size of the chip, pre-placing hard macros, I/O pads, and defining the power grid. A good floorplan partitions the design into functional blocks, arranges the blocks on the chip, places macros and I/O pads, and decides on the power distribution. Key inputs to floorplanning include the netlist, physical and timing libraries, timing constraints, and power requirements. The document then discusses various aspects of floorplanning such as die size calculations, macro placement guidelines, and different types of physical cells.
This document discusses various low power techniques for integrated circuits. It begins by describing the increasing challenges of power consumption as device densities and clock frequencies increase while supply voltages and threshold voltages decrease. It then discusses different types of power consumption, including dynamic power, static power, leakage power from different sources, and how they can be reduced. The document covers many low power design techniques like multi-threshold CMOS, clock gating, multi-voltage, DVFS, and more. It discusses the evolution of these techniques and challenges in their implementation like timing issues, level shifters, and floorplanning for multi-voltage designs.
The document discusses low power design techniques in VLSI. It begins by explaining why low power has become important, especially with the rise of mobile devices. It then discusses the different sources of power consumption, including dynamic and static power. Several low power design techniques are covered, such as clock gating, multi-Vt libraries, multi-voltage design, and power gating. The document emphasizes analyzing power at the system level and using EDA tools to implement low power techniques throughout the design flow. Overall, it provides an overview of analyzing power consumption and the goals and methods of low power VLSI design.
This document discusses engineering change orders (ECOs) used to fix timing, functional, power, and clock issues after physical design and sign-off. It describes the motivation for ECOs due to tool limitations and differences between implementation and sign-off. Common ECO techniques are listed for timing (driver upsizing, buffer insertion, etc.), power (vt-swapping, downsizing, etc.), and metal-only ECOs. Timing ECO tools from Synopsys, Cadence, and other vendors are also mentioned. Upcoming ECO technologies like dynamic power optimization and automatic legalization are noted.
This document provides an introduction to electronic design automation (EDA) tools and discusses different types of programmable logic devices including field programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs). It describes the basic architecture of FPGAs including logic blocks, interconnects, and input/output blocks. The advantages of FPGAs such as shorter development time and flexibility are also summarized.
Low Power VLSI Design Presentation_finalJITENDER -
This document discusses low power VLSI design techniques. It describes sources of power dissipation such as dynamic power from switching and static leakage power. It then discusses several approaches to reduce power consumption, including supply voltage scaling, minimizing switching capacitance through techniques like clock gating, and minimizing leakage through multi-threshold CMOS and power gating. The need for a power intent language to describe low power constructs is also discussed. Finally, it mentions low power EDA tools that can reduce power through techniques like clock gating and low power placement.
Define Width and Height of Core and Die (http://www.vlsisystemdesign.com/PD-F...VLSI SYSTEM Design
https://www.udemy.com/vlsi-academy
The very first step in chip design is floorplanning, in which the width and height of the chip, basically the area of the chip, is defined. A chip consists of two parts, 'core' and 'die'.
Vlsi physical design automation on partitioningSushil Kundu
This document provides an introduction to VLSI physical design automation and partitioning. It discusses the importance of partitioning large circuits into smaller subcircuits for manageable design. The objectives of partitioning are to minimize the number of partitions and interconnections between partitions. Common partitioning algorithms discussed include min-cut bipartitioning, Kernighan-Lin iterative improvement algorithm, and other methods like ratio cut, genetic algorithms, and simulated annealing. Partitioning is an essential step in the physical design flow and impacts circuit performance and layout costs.
This document discusses low power VLSI design challenges and solutions. It motivates the need for low power design due to increasing power densities in VLSI chips and limited battery capacities. Sources of power dissipation in CMOS VLSI circuits are discussed including dynamic power during switching, static leakage power, and short circuit power. The document outlines various low power design methodologies at circuit, logic, architecture and software levels like reducing switching activity, glitch power reduction, gated clocking, reducing switched capacitance, using variable threshold voltages, and software optimizations.
Placement is the process of determining the locations of circuit devices on a chip. It is a critical step that affects performance, routability, heat distribution, and power consumption. There are different types of placement like standard cell placement and building block placement. Placement algorithms aim to optimize objectives like minimizing total area and wire length. Simulated annealing is a commonly used iterative placement algorithm that models the physical annealing process to arrive at a low-cost solution. Other algorithms include partitioning-based approaches and cluster growth.
1. Power functionality cannot be easily verified without changing RTL code since power domains and constraints are not represented consistently across the design flow.
2. Tools from different vendors use different specifications for power management, making end-to-end verification and signoff difficult.
3. Constraints and intent for low power techniques like multi-VT, power gating, and DVFS cannot be validated without a common representation.
The document discusses placement in physical design. It describes placement as assigning positions to predesigned cells on a chip without overlapping to optimize objectives like minimizing area and interconnects. It discusses different placement types, formulates the placement problem, and describes algorithms like partitioning-based placement, simulated annealing placement, and iterative placement methods.
Validate data
Questionnaire checking
Edit acceptable questionnaires
Code the questionnaires
Keypunch the data
Clean the data set
Statistically adjust the data
Store the data set for analysis
Analyse data
This document discusses physical design verification checks that are performed on an integrated circuit layout. It describes design rule checking (DRC) which checks that a layout adheres to foundry design rules for manufacturability. Layout versus schematic (LVS) checks that the layout connectivity matches the schematic netlist. Electrical rule checking (ERC) identifies electrical issues like floating devices or short circuits. The document provides examples of DRC, LVS, and ERC checks and typical issues found during these verification steps.
This document discusses digital VLSI design flows. It begins by acknowledging previous work that informed the presentation. It then discusses considerations in developing an electronic system, including components of the system. It describes integrated circuits based on application, fabrication technology, device, and device count. It discusses using standard or application-specific integrated circuits. It outlines a top-down design approach and terminology used in the design flow.
This document discusses library characterization, which involves characterizing standard cell libraries used in semiconductor design. It begins with an overview of why library characterization is an interesting career and then discusses fundamental terminology. It provides examples of characterizing an inverter and D flip-flop, covering timing analysis, power characterization, and more. Advanced topics discussed include state dependent delays, load capacitance characterization, and measuring tri-state delays. References are provided for further reading.
The document discusses input/output (I/O) circuits and packaging for integrated circuits. It begins by describing how chips are connected to the outside world via I/O circuits, bonding wires, and packages. It then discusses the main properties and requirements of packages, including electrical characteristics, number of I/O pins, and thermal properties. The document outlines different packaging technologies like wire bonding and flip chip packaging. It also discusses I/O circuit requirements and different types of I/O cells like digital I/O buffers and analog I/O cells. Finally, it briefly introduces system-in-package technologies that integrate multiple silicon chips or dies into a single package using techniques like multi-chip modules, silicon interposers,
This document provides an introduction to VLSI physical design. It discusses the objectives of physical design including understanding the physical design flow, tools used, CMOS process parameters, and scaling issues. The topics covered include technology evolution, scaling issues, design principles, verification and simulation, the detailed physical design flow, and foundry files, parameters, rules and guidelines. It also summarizes key aspects of technology scaling from 0.25um to 0.05um processes including the dominance of interconnect delay, increasing cross coupling capacitance, and implications for multiple clock cycles to cross chips.
The document discusses floor planning, which is the first step in physical design. It involves defining the size of the chip, pre-placing hard macros, I/O pads, and defining the power grid. A good floorplan partitions the design into functional blocks, arranges the blocks on the chip, places macros and I/O pads, and decides on the power distribution. Key inputs to floorplanning include the netlist, physical and timing libraries, timing constraints, and power requirements. The document then discusses various aspects of floorplanning such as die size calculations, macro placement guidelines, and different types of physical cells.
This document discusses various low power techniques for integrated circuits. It begins by describing the increasing challenges of power consumption as device densities and clock frequencies increase while supply voltages and threshold voltages decrease. It then discusses different types of power consumption, including dynamic power, static power, leakage power from different sources, and how they can be reduced. The document covers many low power design techniques like multi-threshold CMOS, clock gating, multi-voltage, DVFS, and more. It discusses the evolution of these techniques and challenges in their implementation like timing issues, level shifters, and floorplanning for multi-voltage designs.
The document discusses low power design techniques in VLSI. It begins by explaining why low power has become important, especially with the rise of mobile devices. It then discusses the different sources of power consumption, including dynamic and static power. Several low power design techniques are covered, such as clock gating, multi-Vt libraries, multi-voltage design, and power gating. The document emphasizes analyzing power at the system level and using EDA tools to implement low power techniques throughout the design flow. Overall, it provides an overview of analyzing power consumption and the goals and methods of low power VLSI design.
This document discusses engineering change orders (ECOs) used to fix timing, functional, power, and clock issues after physical design and sign-off. It describes the motivation for ECOs due to tool limitations and differences between implementation and sign-off. Common ECO techniques are listed for timing (driver upsizing, buffer insertion, etc.), power (vt-swapping, downsizing, etc.), and metal-only ECOs. Timing ECO tools from Synopsys, Cadence, and other vendors are also mentioned. Upcoming ECO technologies like dynamic power optimization and automatic legalization are noted.
This document provides an introduction to electronic design automation (EDA) tools and discusses different types of programmable logic devices including field programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs). It describes the basic architecture of FPGAs including logic blocks, interconnects, and input/output blocks. The advantages of FPGAs such as shorter development time and flexibility are also summarized.
Low Power VLSI Design Presentation_finalJITENDER -
This document discusses low power VLSI design techniques. It describes sources of power dissipation such as dynamic power from switching and static leakage power. It then discusses several approaches to reduce power consumption, including supply voltage scaling, minimizing switching capacitance through techniques like clock gating, and minimizing leakage through multi-threshold CMOS and power gating. The need for a power intent language to describe low power constructs is also discussed. Finally, it mentions low power EDA tools that can reduce power through techniques like clock gating and low power placement.
Define Width and Height of Core and Die (http://www.vlsisystemdesign.com/PD-F...VLSI SYSTEM Design
https://www.udemy.com/vlsi-academy
The very first step in chip design is floorplanning, in which the width and height of the chip, basically the area of the chip, is defined. A chip consists of two parts, 'core' and 'die'.
Vlsi physical design automation on partitioningSushil Kundu
This document provides an introduction to VLSI physical design automation and partitioning. It discusses the importance of partitioning large circuits into smaller subcircuits for manageable design. The objectives of partitioning are to minimize the number of partitions and interconnections between partitions. Common partitioning algorithms discussed include min-cut bipartitioning, Kernighan-Lin iterative improvement algorithm, and other methods like ratio cut, genetic algorithms, and simulated annealing. Partitioning is an essential step in the physical design flow and impacts circuit performance and layout costs.
This document discusses low power VLSI design challenges and solutions. It motivates the need for low power design due to increasing power densities in VLSI chips and limited battery capacities. Sources of power dissipation in CMOS VLSI circuits are discussed including dynamic power during switching, static leakage power, and short circuit power. The document outlines various low power design methodologies at circuit, logic, architecture and software levels like reducing switching activity, glitch power reduction, gated clocking, reducing switched capacitance, using variable threshold voltages, and software optimizations.
Placement is the process of determining the locations of circuit devices on a chip. It is a critical step that affects performance, routability, heat distribution, and power consumption. There are different types of placement like standard cell placement and building block placement. Placement algorithms aim to optimize objectives like minimizing total area and wire length. Simulated annealing is a commonly used iterative placement algorithm that models the physical annealing process to arrive at a low-cost solution. Other algorithms include partitioning-based approaches and cluster growth.
1. Power functionality cannot be easily verified without changing RTL code since power domains and constraints are not represented consistently across the design flow.
2. Tools from different vendors use different specifications for power management, making end-to-end verification and signoff difficult.
3. Constraints and intent for low power techniques like multi-VT, power gating, and DVFS cannot be validated without a common representation.
The document discusses placement in physical design. It describes placement as assigning positions to predesigned cells on a chip without overlapping to optimize objectives like minimizing area and interconnects. It discusses different placement types, formulates the placement problem, and describes algorithms like partitioning-based placement, simulated annealing placement, and iterative placement methods.
Validate data
Questionnaire checking
Edit acceptable questionnaires
Code the questionnaires
Keypunch the data
Clean the data set
Statistically adjust the data
Store the data set for analysis
Analyse data
Theory & Practice of Data Cleaning: Introduction to OpenRefineBertram Ludäscher
This document provides an introduction to OpenRefine, an open source tool for cleaning and transforming messy data. It discusses how to create a new project in OpenRefine, use different facets like text, timeline and scatterplot facets to explore data, perform clustering and mass edits to normalize values, and leverage the operation history for provenance tracking. Example datasets on farmers markets and historic restaurant menus are also used to demonstrate common data cleaning tasks in OpenRefine.
RESEARCH METHODOLOGY- PROCESSING OF DATAjeni jerry
This document discusses research methodology and the processing of data. It outlines important steps in preparing raw data for analysis, including questionnaire checking, editing, coding, classification, tabulation, and graphical representation. The document also covers data cleaning and adjusting to ensure consistency and handle missing values, improving the quality of analysis. Proper data preparation through these steps is necessary to obtain reliable results from the analysis.
Description of four techniques for Data Cleaning:
1.DWCLEANER Framework
2.Data Mining Techniques include Association Rule and Functional Dependecies
,...
research methodology data processing EDITING Suvin Lal
This document discusses the process of data processing. It explains that data collected through surveys must undergo processing before it can be analyzed. This processing involves editing, coding, and tabulation of the data. The editing process specifically involves checking questionnaires for completeness, accuracy, and uniformity. It also involves addressing issues like fictitious interviews, inconsistent replies, incorrect or incomplete answers in the collected data.
Challenges of emerging memory memristor.Remy Lumin
This document discusses memristors and their applications in memory chips. It describes memristors as passive two-terminal components that relate charge and magnetic flux. Memristors can be used in Resistive Random Access Memory (RRAM) cells. The document discusses titanium dioxide memristors, which were proposed by HP researchers. Memristors are promising for building high capacity, low power memory structures. They allow data to be written and read nearly 100 times faster than flash memory. Resistive RAM using memristors has write voltages and times lower than flash. Memristors can store data through the formation of conductive filaments, and retain data when unpowered. They can enable more efficient computing through applications like non-
Ideal 3D Stacked Die Test - IEEE Semiconductor Wafer Test Workshop SWTW 2013Ira Feldman
My presentation from IEEE SWTW 2013 - For a full description please see my blog:
http://hightechbizdev.com/2013/06/10/ira-feldman-high-technology-business-development-ieee-semiconductor-wafer-test-workshop-2013/
Jorge Tonfat defended his Ph.D. thesis on a frame-level redundancy scrubbing technique for mitigating soft errors in SRAM-based FPGAs. The thesis outlined the increasing soft error rate issues in newer FPGA technologies, described existing mitigation techniques like triple modular redundancy and memory scrubbing, and proposed a new frame-level redundancy scrubbing approach. Experimental validation through radiation testing and fault injection showed the effectiveness of the frame-level redundancy scrubbing technique.
UNIT-III CASE STUDIES -FPGA & CPGA ARCHITECTURES APPLICATIONSDr.YNM
voltage circuits from the programming voltage.
This document discusses different types of programming technologies used in field programmable gate arrays (FPGAs). It describes SRAM-based programming technology, which is the most commonly used technology due to its re-programmability and use of standard CMOS processes. Flash programming technology and anti-fuse programming technology are also discussed. Each technology has advantages and disadvantages related to factors like area efficiency, volatility, re-programmability, and process requirements. The document provides detailed information on how each technology works at a circuit level.
The document discusses stick diagrams and design rules for VLSI layout. It begins by explaining stick diagrams, which provide topological information to represent circuits between the schematic and layout levels. Examples of stick diagrams for CMOS inverters and other gates are shown. The document then covers design rules, which specify geometries and spacing to optimize yield and reliability. Examples of minimum widths, spacings, and other rules are discussed. The end discusses layout verification using techniques like DRC, LVS, and extraction to check for errors and ensure consistency between schematic and layout.
FPGA IMPLEMENTATION OF RECOVERY BOOSTING TECHNIQUE TO ENHANCE NBTI RECOVERY I...Editor IJMTER
Negative Bias Temperature Instability is an important lifetime reliability problem in
microprocessors. SRAM-based structures within the processor are especially susceptible to NBTI
since one of the PMOS devices in the memory cell always has an input of ‘0’. Previously proposed
recovery techniques for SRAM cells aim to balance the degradation of the two PMOS devices by
attempting to keep their inputs at a logic ‘0’ exactly 50% of the time. However, one of the devices is
always in the negative bias condition at any given time. In this paper, we propose a technique called
Recovery Boosting that allows both PMOS devices in the memory cell to be put into the recovery
mode by slightly modifying the design of conventional SRAM cells to verify its functionality and
quantity area and power consumption.
GaAs PCM or WAT data to device model using Neural Network to predict device performance and yield and also target and verify device to process centering.
The document discusses using process control monitor (PCM) data from wafer fabrication to predict device performance and wafer yield. PCM data from various sites on the wafer are collected during fabrication and correlated with performance data from devices near those sites. A predictive model is created using the PCM data as inputs to predict device parameters and yield as outputs. The model allows early prediction of wafer and device quality before full testing. Neural networks and linear models were tested, with neural networks showing slightly better prediction accuracy. The model was deployed using a database and scripting to efficiently predict performance for new wafers based on their PCM data.
This document contains an individual's resume summarizing their education and work experience in layout engineering. It includes details of the person's projects in standard cell layout for 28nm and 90nm processes, analog layout for a 180nm opamp, and SRAM leaf cell layout for 28nm. The resume lists the tools used like Mentor Graphics and challenges faced in layout like routing issues and transistor placement. It also provides education qualifications and academic projects in face recognition using VHDL and optimized add multiply operator design.
Process Variation and Radiation-Immune Single Ended 6T SRAM CellIDES Editor
The leakage power can dominate the system power
dissipation and determine the battery life in battery-operated
applications with low duty cycles, such as the wireless sensors,
cellular phones, PDAs or pacemakers. Driven by the need of
ultra-low power applications, this paper presents single ended
6T SRAM (static random access memory) cell which is also
radiation hardened due to maximum use of PMOS
transistors. Due to process imperfection, starting from the 65
nm technology node, device scaling no longer delivers the
power gains. Since then the supply voltage has remained
almost constant and improvement in dynamic power has
stagnated, while the leakage currents have continued to
increase. Therefore, power reduction is the major area of
concern in today’s circuit with minimum-geometry devices
such as nanoscale memories. The proposed design in this
paper saves dynamic write power more than 50%. It also
offers 29.7% improvement in TWA (write access time), 38.5%
improvement in WPWR (write power), 69.6% improvement in
WEDP (write energy delay product), 26.3% improvement in
WEDP variability, 5.6% improvement in RPWR (read power) at
the cost of 22.5% penalty in SNM (static noise margin) at
nominal voltage of VDD = 1 V. The tighter spread in write EDP
implies its robustness against process and temperature
variations. Monte Carlo simulation measurements validate
the design at 32 nm technology node.
FEA AND EXPERIMENTAL QUASI-STATIC CRUSHING OF ALUMINIUM HONEYCOMB STRUCTUREVishal Mudka
The honeycomb is a typical cellular structure composed of metals, polymers, ceramics and paper which are commonly used as energy absorbing materials for various engineering applications such as, packaging, protective materials, core materials of sandwich panels, and building materials. A series of experiments were conducted on hexagonal aluminium honeycomb specimens in their principal loading direction i.e. Out-of-plane (along the direction of cell axis parallel to the thickness of specimen) as per the ASTM C-365 standards. In both the cases, load-displacement characteristics and the deformation mechanisms were studied in order to assess energy absorbing capacities. The study also focuses on the crushing behavior of honeycomb under the above loading configuration. This experimental results are compared with FEA using Ls-Dyna and Hypermesh.
Finite element simulation using Ls-Dyna is carried out on aluminium honeycomb. A comparison of energy absorption capacities of this material obtained from the experiment simulation is made. The results obtained from the simulation of aluminium honeycomb are in good agreement with experimental results.
Low Power Design of Standard Digital Gate Design Using Novel Sleep Transisto...IJMER
In the nanometer range design technologies static power consumption is very important
issue in present peripheral devices. In the CMOS based VLSI circuits technology is scaling towards
down in respect of size and achieving higher operating speeds. We have also considered these
parameters such that we can control the leakage power. As process model design are getting smaller
the density of device increases and threshold voltage as well as oxide thickness decrease to maintain
the device performance. In this article two novel circuit techniques for reduction leakage current in
NAND and NOR inverters using novel sleepy and sleepy property are investigated. We have proposed a
design model that has significant reduction in power dissipation during inactive (standby) mode of
operation compared to classical power gating methods for these circuit techniques. The proposed
circuit techniques are applied to NAND and NOR inverters and the results are compared with earlier
inverter leakage minimization techniques. All low leakage models of inverters are designed and
simulated in Tanner Tool environment using 65 nm CMOS Technology (1volt) technologies. Average
power, Leakage power, sleep transistor
Smit Patel is seeking a position in analog and mixed signal layout design. He has experience in standard cell layout design, analog layout design, and memory layout design from internships. His projects include layout of a 32x32 bit SRAM cell in 28nm technology and design of a two stage op-amp in 180nm technology. He is familiar with tools like IC Studio, Pyxis, Calibre, Virtuoso and Eldo.
“Design of Efficient Mobile Femtocell by Compression and Aggregation Technolo...Virendra Uppalwar
Here I am providing a complete power point presentation for students who are searching for femtocell based technology study material. In our project for improving spectral efficiency of femtocell based handoff we use LZMA data compression techique. we obtain a positive results on our performance metrics parameter like Delay, Energy and Throughput.
IEEE Semiconductor Wafer Test Workshop SWTW 2014 - International Technology R...Ira Feldman
Please see full abstract on my blog: http://hightechbizdev.com/2014/06/12/ira-feldman-high-technology-business-development-ieee-semiconductor-wafer-test-workshop-2014-presentation/. Co-authored with Dave Armstrong (Advantest) and Marc Loranger (FormFactor).
Embedded DRAM was developed to integrate DRAM memory circuits with logic circuits on a single chip. There are two approaches - incorporating memory in a logic-optimized technology or logic in a DRAM-optimized technology. Embedded DRAM benefits applications like network processors and DSPs by reducing chip count, power consumption, and increasing performance through high-density and proximity between memory and logic on the same die. It works by arranging DRAM cells of a transistor and capacitor at row and column crosspoints that can store data as charge on the capacitor.
Testing DRAM and Correcting errorsby using Adaptive TechniqueIJERA Editor
DRAM(dynamic random access memory) is most widely used in memorytoday. Leakage power is the main
issue of DRAM cell. Iteffects the performance of the DRAM. In this paper introduce a new technique ie
adaptive technique a spare wire is used to reroute the data in cell which is damaged
Temple of Asclepius in Thrace. Excavation resultsKrassimira Luka
The temple and the sanctuary around were dedicated to Asklepios Zmidrenus. This name has been known since 1875 when an inscription dedicated to him was discovered in Rome. The inscription is dated in 227 AD and was left by soldiers originating from the city of Philippopolis (modern Plovdiv).
Chapter wise All Notes of First year Basic Civil Engineering.pptxDenish Jangid
Chapter wise All Notes of First year Basic Civil Engineering
Syllabus
Chapter-1
Introduction to objective, scope and outcome the subject
Chapter 2
Introduction: Scope and Specialization of Civil Engineering, Role of civil Engineer in Society, Impact of infrastructural development on economy of country.
Chapter 3
Surveying: Object Principles & Types of Surveying; Site Plans, Plans & Maps; Scales & Unit of different Measurements.
Linear Measurements: Instruments used. Linear Measurement by Tape, Ranging out Survey Lines and overcoming Obstructions; Measurements on sloping ground; Tape corrections, conventional symbols. Angular Measurements: Instruments used; Introduction to Compass Surveying, Bearings and Longitude & Latitude of a Line, Introduction to total station.
Levelling: Instrument used Object of levelling, Methods of levelling in brief, and Contour maps.
Chapter 4
Buildings: Selection of site for Buildings, Layout of Building Plan, Types of buildings, Plinth area, carpet area, floor space index, Introduction to building byelaws, concept of sun light & ventilation. Components of Buildings & their functions, Basic concept of R.C.C., Introduction to types of foundation
Chapter 5
Transportation: Introduction to Transportation Engineering; Traffic and Road Safety: Types and Characteristics of Various Modes of Transportation; Various Road Traffic Signs, Causes of Accidents and Road Safety Measures.
Chapter 6
Environmental Engineering: Environmental Pollution, Environmental Acts and Regulations, Functional Concepts of Ecology, Basics of Species, Biodiversity, Ecosystem, Hydrological Cycle; Chemical Cycles: Carbon, Nitrogen & Phosphorus; Energy Flow in Ecosystems.
Water Pollution: Water Quality standards, Introduction to Treatment & Disposal of Waste Water. Reuse and Saving of Water, Rain Water Harvesting. Solid Waste Management: Classification of Solid Waste, Collection, Transportation and Disposal of Solid. Recycling of Solid Waste: Energy Recovery, Sanitary Landfill, On-Site Sanitation. Air & Noise Pollution: Primary and Secondary air pollutants, Harmful effects of Air Pollution, Control of Air Pollution. . Noise Pollution Harmful Effects of noise pollution, control of noise pollution, Global warming & Climate Change, Ozone depletion, Greenhouse effect
Text Books:
1. Palancharmy, Basic Civil Engineering, McGraw Hill publishers.
2. Satheesh Gopi, Basic Civil Engineering, Pearson Publishers.
3. Ketki Rangwala Dalal, Essentials of Civil Engineering, Charotar Publishing House.
4. BCP, Surveying volume 1
Beyond Degrees - Empowering the Workforce in the Context of Skills-First.pptxEduSkills OECD
Iván Bornacelly, Policy Analyst at the OECD Centre for Skills, OECD, presents at the webinar 'Tackling job market gaps with a skills-first approach' on 12 June 2024
A Visual Guide to 1 Samuel | A Tale of Two HeartsSteve Thomason
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The chapter Lifelines of National Economy in Class 10 Geography focuses on the various modes of transportation and communication that play a vital role in the economic development of a country. These lifelines are crucial for the movement of goods, services, and people, thereby connecting different regions and promoting economic activities.
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