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National instruments track e


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National instruments track e

  1. 1. Semiconductor Test with Software-Defined Modular Instrumentation Yechiel PELED National Instruments ISRAEL Ltd & NI PXIe-6544/45/47/48 High-Speed Digital I/O NI PXI-4132 High-Precision Source Measure Unit NI PXIe-5663E/5673E 6.6 GHz VSA & VSG
  2. 2. Challenges in Testing Mixed-Signal ICs
  3. 3. Circuit Design <ul><li>Circuit design / Circuit simulation </li></ul><ul><li>Floor planning, Design review & Layout </li></ul><ul><li>Design For Test & Test pattern generation </li></ul><ul><li>Design for manufacturability (IC) </li></ul>Production Validation <ul><li>Wafer Fabrication </li></ul><ul><li>Wafer Testing, Die Sort </li></ul><ul><li>Packaging, Package Testing </li></ul><ul><li>Burn In & Final Test </li></ul><ul><li>Design Validation & Verification </li></ul><ul><li>Device Characterization </li></ul><ul><li>Datasheet Generation </li></ul><ul><li>Failure Analysis </li></ul>Design to Validation
  4. 4. Structural vs. Functional <ul><li>Structural Test/Validation </li></ul><ul><ul><li>Properly Deposited </li></ul></ul><ul><ul><li>No Faults </li></ul></ul><ul><ul><li>Focus on DC and Digital </li></ul></ul><ul><li>Functional Test/Validation </li></ul><ul><ul><li>Final Setup (simulation) </li></ul></ul><ul><ul><li>Meets Specifications </li></ul></ul><ul><ul><li>Digital, Mixed Signal, RF </li></ul></ul>
  5. 5. Parametric Measurements <ul><li>Verify structure by checking that certain features are within acceptable limits </li></ul><ul><ul><li>DC Parameters </li></ul></ul><ul><ul><ul><li>Power Consumption </li></ul></ul></ul><ul><ul><ul><li>Voltage Thresholds </li></ul></ul></ul><ul><ul><ul><li>Current Input/Output </li></ul></ul></ul><ul><ul><li>AC Parameters </li></ul></ul><ul><ul><ul><li>Rise Time </li></ul></ul></ul><ul><ul><ul><li>Setup / Hold Time </li></ul></ul></ul>
  6. 6. Microelectrical mechanical Systems (MEMS) <ul><li>Types of MEMS devices: </li></ul><ul><li>Accelerometers, gyroscopes, microphones, etc. </li></ul><ul><li>Industry Trends: </li></ul><ul><li>Rapid industry adoption into consumer electronics </li></ul><ul><li>Lower test costs due to quantities / purchasing structure </li></ul><ul><li>Key Measurements: </li></ul><ul><li>Typical IC characterization measurements </li></ul><ul><ul><li>Open and shorts measurements </li></ul></ul><ul><ul><li>Leakage and standby current draw </li></ul></ul><ul><li>Vary based on sensor type – typically very analog heavy </li></ul>
  7. 7. PXI Microelectromechanical (MEMS) Test System Characterize MEMS Accelerometers, Gyroscopes, Microphones <ul><li>±20 V, 2 A source/measure capability for parametric measurements down to 1 nA sensitivity </li></ul><ul><li>Two simultaneously updated analog inputs and outputs with 24-bit resolution up to 204.8 kS/s </li></ul><ul><li>Up to 200 MHz digital I/O with various voltage levels for MEMS output/input signals </li></ul><ul><li>Characterize open/shorts, standby/leakage current (IDD), positive/negative continuity, and more </li></ul><ul><li>Switch in DC instrumentation to multiple test points </li></ul><ul><li>Control MEMS operation through common digital protocols including SPI, I2C, and JTAG </li></ul>
  8. 8. LabVIEW Graphical Programming <ul><li>Compiled graphical development environment </li></ul><ul><li>Development time reduction of four to ten times </li></ul><ul><li>Tools to acquire, analyze, and present your data </li></ul>
  9. 9. Custom, Software-Defined Chip Test Graphical Programming Configuration Textual Math Modeling & Simulation Statecharts
  10. 10. Chip Testing with PXI and LabVIEW <ul><li>MEMS Devices </li></ul><ul><li>Accelerometers </li></ul><ul><li>Gyroscopes </li></ul><ul><li>Microphones </li></ul><ul><li>Power Management ICs (PMICs) </li></ul><ul><li>DC-DC Converters </li></ul><ul><li>LDOs </li></ul><ul><li>LED Drivers </li></ul><ul><li>Memory Devices </li></ul><ul><li>SRAM </li></ul><ul><li>DRAM </li></ul><ul><li>F-RAM </li></ul><ul><li>Wireless ICs (RFICs) </li></ul><ul><li>Mod/Demodulators </li></ul><ul><li>Power Amplifiers </li></ul><ul><li>Transceivers </li></ul><ul><li>Discrete Components </li></ul><ul><li>Transistors </li></ul><ul><li>Diodes </li></ul><ul><li>Capacitors </li></ul><ul><li>Resistors </li></ul><ul><li>ADCs and DACs </li></ul><ul><li>A/D Converters </li></ul><ul><li>D/A Converters </li></ul>Video Devices NDT (Non-Destructive Test ) & Ultrasound applications
  11. 11. Software-Defined Modular Instrumentation
  12. 12. PXI – PC-Based Modular Instrumentation Backplane - PCI bus communication - Timing and Synchronization Peripheral Instrument Modules - Over 1,500 modules from 70+ vendors Chassis - 4, 8 and 18 slot options Controller - Embedded PC, remote PC, or laptop interface - Runs all standard SW Systems Alliance
  13. 13. Lower Cost and Size of PXI-Based System Photos courtesy of Agilent, Keithley, Advantest, Nicolet, and Tektronix <ul><li>Integrated SW & HW </li></ul><ul><li>Flexible performance </li></ul><ul><li>Small size </li></ul><ul><li>High throughput </li></ul><ul><li>Cost effective </li></ul>
  14. 14. NI PXI Semiconductor Suite <ul><li>Expanded capabilities for mixed-signal chip test </li></ul><ul><ul><li>Fast single-ended digital clock rates up to 200 MHz </li></ul></ul><ul><ul><li>High-resolution current measurements down to 10 pA </li></ul></ul><ul><ul><li>Deterministic multiband RF measurements with RF List Mode </li></ul></ul><ul><ul><li>Advanced per-pin DC measurements with signal insertion switch </li></ul></ul><ul><ul><li>Added support for importing WGL and STIL data formats </li></ul></ul>NI PXI/PXIe-2515 HSDIO Switch NI PXIe-6544/45/47/48 High-Speed Digital I/O NI PXI-4132 High-Precision Source Measure Unit WGL/STIL SW File Importing NI PXIe-5663E/5673E 6.6 GHz VSA & VSG
  15. 15. Chip Test System Architecture Application Development Test Management Software Digital Instrumentation Analog Instrumentation DC Parametric Measurements Switching/Connectivity <ul><li>Up to 200 MHz/400 Mbps </li></ul><ul><li>- SPI, I2C, JTAG, etc. </li></ul><ul><li>Up to 24-bit acquisition </li></ul><ul><li>Bandwidth over 1 GHz </li></ul><ul><li>Resolution down to 10 pA </li></ul><ul><li>Open/shorts, leakage, etc. </li></ul>High-Speed Digital and FPGA I/O SMUs and Power Supplies Digitizers and RF VSAs/VSGs SSRs and FETs <ul><li>~50 switch module options </li></ul><ul><li>Multiple topologies </li></ul>PXI Modular Instrumentation Platform Characterization or Production NI TestStand
  16. 16. Chip Testing with PXI and LabVIEW <ul><li>Flexible Test Platform </li></ul><ul><ul><li>Custom, one-off measurements in SW </li></ul></ul><ul><ul><li>Modular instrumentation / small footprint </li></ul></ul><ul><li>Lower Total Cost of Test </li></ul><ul><ul><li>Improve quality - automated testing (repeatable) </li></ul></ul><ul><ul><li>Improve throughput – faster test development </li></ul></ul><ul><ul><li>Correlate results - characterization vs production </li></ul></ul><ul><li>Mixed Signal Instrumentation </li></ul><ul><ul><li>Instrument options from DC to RF on one platform </li></ul></ul><ul><ul><li>Synchronized measurements across analog and digital </li></ul></ul>
  17. 17. ImagingLab Robotics Library for DENSO - LabVIEW Toolkit for Directly Controlling DENSO Robotics Robotics- Wafers & components handling Robot places part at several known positions Vision reads part location at each position Software determines linear transfer function for X, Y and theta Coordinate Vision and Robot Space
  18. 18. Analog Instrumentation Digitizers and Arbitrary Waveform Generators
  19. 19. A/D and D/A Converter Testing <ul><li>Types of data converters: </li></ul><ul><li>Analog-to-Digital (ADC); Digital-to-Analog (DAC) </li></ul><ul><li>Industry Trends: </li></ul><ul><li>Integration into SoC and SiP designs </li></ul><ul><li>Increased complexity with footprint and power reduction </li></ul><ul><li>Key Measurements: </li></ul><ul><li>Dynamic performance </li></ul><ul><ul><li>SINAD, THD, SNR, SFDR, EOB, PHSN, IMD, and ISO </li></ul></ul><ul><li>Linearity testing (INL/DNL) </li></ul><ul><li>Current consumption (I IH , I IL , I DDQ , standby) </li></ul><ul><li>Voltage thresholds (V OH , V OL , V IH , V IL ) plus gain and offsets </li></ul>
  20. 20. Automated ADC Characterization <ul><li>Characterize dynamic performance of ADC </li></ul><ul><ul><li>SINAD, SNR, THD, EOB, PHSN </li></ul></ul><ul><li>Test INL / DNL, IMD, Iref, Vref, and other specifications </li></ul><ul><li>Tight synchronization of HSDIO, FGEN, and M Series </li></ul>Box Instrument Approach Automation with PXI, LabVIEW, and DIAdem
  21. 21. PXI and PCI Digitizers Model Description Platforms Input Channels Sampling Rate (S/s) Bandwidth (MHz) Resolution (bits) NI 5152/3/4 High-speed, high-bandwidth PXI, PCI 2 1 G (or 2 G on 1 ch) 300/500/ 1000 8 NI 5114 High-speed, low-cost PXI, PCI 2 250 M 125 8 NI 5124 High-resolution PXI, PCI 2 200 M 150 12 NI 5122 High-resolution PXI, PXIe, PCI 2 100 M 100 14 NI 5142 High-resolution, IF acquisition PXI, PCI 2 100 M 100 14 NI 5132/33 Low-cost, portable USB 2 50 M/100 M 50 8 NI 5105 High-density, low-cost PXI 8 60 M 60 12 NI 5622 High-resolution, IF acquisition PXIe 1 150 M 3 to 60 16 NI 5922 High-resolution PXI, PCI 2 15 M 6 24 to 16
  22. 22. NI & Tektronix collaborate on Fastest PXI Digitizer
  23. 23. High-Speed Signal Generators Function Generators Arbitrary Waveform Generators 5402 5404 5406 5412 5421 5422 5441 5442 Type Function Clock Function Arb Arb Arb Arb Arb Bandwidth 20 MHz 105 MHz 40 MHz 20 MHz 43 MHz 80 MHz 43 MHz 43 MHz Sample Rate 400 MS/s 300 MS/s 400 MS/s 100 MS/s 100 MS/s 200 MS/s 100 MS/s 100 MS/s Resolution (bits) 14 12 16 14 16 16 16 16
  24. 24. Power Management IC / MOSFET Characterization <ul><li>Create standard test platform on benchtop </li></ul><ul><ul><li>Fast edge, propagation delay, and jitter measurements </li></ul></ul><ul><ul><li>Correlate with ATE in production </li></ul></ul><ul><li>Chose PXI and LabVIEW </li></ul><ul><ul><li>Smaller footprint, tighter integration </li></ul></ul><ul><ul><li>Less expensive, better repeatability </li></ul></ul>“ PXI offered us a characterization platform for PMICs with a smaller footprint and tighter integration than our bench top instruments at a lower cost.”     - Amiri McCain, ON Semiconductor
  25. 25. Digital Instrumentation Digital Waveform Generators / Analyzers, FPGA-Enabled I/O
  26. 26. Digital Communication Protocols <ul><li>Component/IC Communication </li></ul><ul><ul><li>SPI, I 2 C, JTAG, PS/2, … </li></ul></ul><ul><li>System Communication </li></ul><ul><ul><li>Aerospace: MIL-STD-1553, ARINC-429, … </li></ul></ul><ul><ul><li>Automotive: CAN, MOST, KWP, 1939, … </li></ul></ul><ul><li>Consumer Electronics </li></ul><ul><ul><li>Digital Audio: S/PDIF, I 2 S </li></ul></ul><ul><li>Custom </li></ul>
  27. 27. Digital Structural Test <ul><li>Boundary Scan </li></ul><ul><ul><li>Board Level Testing of Multiple Components </li></ul></ul><ul><ul><li>JTAG Communication – “Scan Chain” </li></ul></ul><ul><li>BIST (Built-In Self Test) </li></ul><ul><ul><li>Chip Level Testing of Single Components </li></ul></ul><ul><ul><li>AMBIST, mBIST, LBIST </li></ul></ul>
  28. 28. Bit Error Rate Testing (BERT) <ul><li>Testing method for digital communication circuits that uses predetermined stress patterns </li></ul>Clk In Start Data In Data Out Clk Out Data Active Timing & Triggering Stimulus / Response Response Digital Pattern Generator (Pin Electronics) VDD
  29. 29. NI PXI High Speed Digital Offering PCI / PXI-6541/42 PXIe-6544/45 PXIe-6547/48 PCI / PXI-6551/52 Max Speed 50 / 100 MHz 100MHz / 200 MHz 100MHz / 200 MHz 50 / 100 MHz Platform PCI / PXI PXI Express PXI Express PCI / PXI # of Channels 32 32 32 / 24 (with HWC) 20 Direction Input or Output Input or Output In/Out or Bidirectional Bidirectional Precision CLK No Yes Yes No Max DDR No No 400/300 Mbps (out/in) No Voltage Levels Selectable 1.8, 2.5, 3.3, 5V* Selectable - 1.2, 1.5, 2.5, 1.8, 3.3 V Selectable 1.2 - 3.3V (100 mV res.) Programmable -2 to 5V (10 mV res.) HWC / Tri-state No No Yes (24 ch) Yes (20 ch) Streaming 115 MB/s 400 / 660 MB/s 400 / 660 MB/s 115 MB/s
  30. 30. NI PXIe-6544/45 & PXIe-6547/48 <ul><li>Applications </li></ul><ul><li>Interfacing to high-speed semiconductor chip designs </li></ul><ul><li>Standard and custom protocols (SPI, I2C, JTAG, etc) </li></ul><ul><li>1080p video test (via NI VideoMASTER) </li></ul><ul><li>High-bandwidth data streaming of digital data </li></ul>PXI Express x4 link provides up to 660 MB/s Banked data delay for custom edge placement Up to 32 channels DIO or 24 ch. bidirectional Voltage levels from 1.2 - 3.3V (down to 100 mV precision) High resolution on-board clock with subHz resolution 100 & 200 MHz clock rates
  31. 31. WGL/STIL Software Importer <ul><li>Import WGL & STIL file formats </li></ul><ul><li>Outputs a CSV ASCII file </li></ul><ul><li>Allows user to adjust signal </li></ul><ul><li>settings to adapt to different </li></ul><ul><li>device capabilities </li></ul><ul><li>Vectors work directly with </li></ul><ul><li>HSDIO hardware </li></ul><ul><ul><li>654x, 655x, 656x </li></ul></ul><ul><ul><li>Ships with 30 day eval </li></ul></ul><ul><li>Sold and supported by TSSI </li></ul><ul><ul><li>Eval version ships with NI HSDIO </li></ul></ul>
  32. 32. HSDIO or RIO? HighSpeed Digital I/O or Reconfigurable ( FPGA based ) I/O <ul><li>HSDIO for high-performance signaling and digital characterization </li></ul><ul><li>RIO for implementing standard and custom protocols at slower speeds. </li></ul>
  33. 33. Precision DC Instrumentation Multimeters, Power Suppliers, Source Measure Units
  34. 34. NI PXI-4071 7½-Digit FlexDMM NI’s Complete Digital Multimeter Offering <ul><li>Industry’s Most Accurate 7½-digit DMM </li></ul><ul><li>Wide measurements ranges </li></ul><ul><ul><li>± 10 nV to 1000 VDC, ±1 pA to 3 A , 10 µ  to 5 G  </li></ul></ul><ul><ul><li>±500 VDC/Vrms common-mode isolation </li></ul></ul><ul><li>1.8 MS/s isolated, high-voltage digitizer </li></ul><ul><ul><li>Flexible resolution: 1.8 MS/s at 10 bits to 5 S/s at 23 bits </li></ul></ul>Product Description Platform Digits PXI-4071 High-resolution DMM and 1.8 MS/s isolated digitizer PXI 7½ PXI-4072 DMM, 1.8 MS/s isolated digitizer, and LCR meter PXI 7 NI 4070 DMM and 1.8 MS/s isolated digitizer PCI, PXI 7 NI 4065 Low-cost DMM PXI, PCI, PCIe, USB 6½
  35. 35. NI PXI Power Supply / SMU Offering NI PXI-4110 Power Supply NI PXI-4130 Power SMU NI PXI-4132 Precision SMU Target Apps 3-channels - Power source/readback High power (40W) IV sweeps, Low-power (2W) leakage testing Max Voltage +6V, +20V, -20V +/-20V +/- 100V Max Current 1A on each channel +/- 2A +/- 100mA (2W max) 4-quadrant No Yes Yes Current Meas. Sensitivity 400 nA 1 nA 10pA Integrated Guarding No No Yes Output timing Software Timed Software Timed SW or HW timed Triggering No No Yes – PXI backplane
  36. 36. NI PXI-4132 High-Precision SMU <ul><li>Applications </li></ul><ul><li>Leakage test on discrete components </li></ul><ul><li>Parametric measurements on packaged semiconductors </li></ul><ul><li>IV characterization LEDs / transistors </li></ul><ul><li>High-voltage physical measurements, wafer test </li></ul>10pA measurement sensitivity Up to +/-100V and up to +/-100mA Remote (4-wire) sense, guarding High-speed hardware sequencing and triggering 4-quadrant source/sink operation
  37. 37. Source Measure Unit <ul><li>An SMU can: </li></ul><ul><ul><li>Source Current (positive and negative) </li></ul></ul><ul><ul><li>Measure Voltage </li></ul></ul><ul><ul><li>Source Voltage </li></ul></ul><ul><ul><li>Measure Current (uA resolution) </li></ul></ul><ul><ul><li>Sink Current (Dissipate Power) </li></ul></ul><ul><ul><li>Be Used with Other SMUs or Supplies </li></ul></ul>
  38. 38. Power Consumption Tests <ul><li>Goal: Verify that a device doesn’t draw too much power in a variety of states </li></ul><ul><ul><li>After Reset </li></ul></ul><ul><ul><li>In Standby Mode </li></ul></ul><ul><ul><li>While Active </li></ul></ul>VDD VSS DUT Circuitry Source Measure Unit Digital I/O
  39. 39. RF Instrumentation Vector Signal Generators / Analyzers and Modulation Software
  40. 40. NI RF Hardware Products <ul><li>RF Hardware </li></ul><ul><li>2.7 GHz Vector Signal Analyzer </li></ul><ul><li>2.7 GHz Vector Signal Generator </li></ul><ul><li>6.6 GHz Vector Signal Analyzer </li></ul><ul><li>6.6 GHz Vector Signal Generator </li></ul><ul><li>6.6 GHz CW Generator </li></ul><ul><li>3.0 GHz 30 dB Pre-Amp </li></ul><ul><li>6 GHz True-RMS Power Meter </li></ul><ul><li>Up to 26.5 GHz, mux, GP relays </li></ul><ul><li>IF/Baseband Hardware </li></ul><ul><li>400 MS/s 16-bit Dual Channel AWG </li></ul><ul><li>150 MS/s 16-bit High-speed IF digitizer </li></ul><ul><li>32 Channel, 400 Mb/s High-speed DIO </li></ul><ul><li>LabVIEW FPGA Hardware </li></ul><ul><li>IF- RIO </li></ul><ul><li>FlexRio </li></ul>
  41. 41. RF Testing Capability <ul><li>Software defined instruments </li></ul><ul><li>Fast RF measurement speed </li></ul><ul><li>Standard-specific measurements for WILAN, WIMAX, GPS, GSM/EDGE, WCDMA,… </li></ul>PXIe-5673 VSG <ul><li>PXIe-5663 6.6 GHz VSA </li></ul><ul><li>10 MHz to 6.6 GHz </li></ul><ul><li>50 MHz Instantaneous BW (3 dB) </li></ul><ul><li>PXIe-5673 6.6 GHz VSG </li></ul><ul><li>85 MHz to 6.6 GHz </li></ul><ul><li>>100 MHz Instantaneous BW </li></ul><ul><li>RF Software </li></ul><ul><li>Modulation/Spectral Measurements </li></ul><ul><li>Standard-specific toolkits </li></ul>
  42. 42. MIMO - Four Channel of Phase-Coherent VSA Local Oscillator Downconverters Digitizers Shared LO Shared ADC Clock
  43. 43. Wireless IC (RFIC) Testing <ul><li>Types of wireless ICs: </li></ul><ul><li>Power amplifiers (PAs) </li></ul><ul><li>Transceivers / RF front-ends </li></ul><ul><li>Modulators and demodulators </li></ul><ul><li>Industry Trends: </li></ul><ul><li>Increased integration with other chips in consumer electronics </li></ul><ul><li>Key Measurements: </li></ul><ul><li>Input/output power and efficiency </li></ul><ul><li>EVM, carrier leakage, frequency offset </li></ul><ul><li>Variety of modulation schemes (QAM, ASK, FSK, etc.) </li></ul>
  44. 44. Software-Defined Wireless IC Characterization <ul><li>Automate global testing of complex RFICs </li></ul><ul><ul><li>Many teams with different capabilities </li></ul></ul><ul><ul><li>Improve quality with repeatability </li></ul></ul><ul><ul><li>Reduce total test time </li></ul></ul><ul><li>Common Set of Measurement Tools </li></ul><ul><ul><li>Share software code between groups </li></ul></ul><ul><ul><li>Easy to use operator interface </li></ul></ul>“ To improve code reuse and reduce test development time, we needed to implement a standard test automation framework built on common software tools. We reduced the time necessary to validate an IC from two months to three weeks.” - Sylvain Bertrand, ST-Ericsson
  45. 45. NI RIO Technology Platform RIO = FPGA based Reconfigurable I/O
  46. 46. NI FlexRIO – Speed and Flexibility <ul><li>FlexRIO FPGA Module </li></ul><ul><li>Up to 132 channels </li></ul><ul><li>Up to 1 Gb/s per pair </li></ul><ul><li>Up to 128 MB of DDR2 DRAM </li></ul><ul><li>FlexRIO Adapter Module </li></ul><ul><li>Interchangeable I/O </li></ul><ul><li>Customizable by users </li></ul><ul><li>Module Development Kit </li></ul>
  47. 47. FlexRIO Adapter Modules from NI <ul><li>PXI-6581R - 100 MHz SE / 54 Ch. DIO </li></ul><ul><li>100 MHz Clock Rates </li></ul><ul><li>54 DIO lines </li></ul><ul><li>Selectable voltages of 1.8, 2.5, and 3.3 V or external reference voltage (1.8 to 5.5 V) </li></ul><ul><li>PXI-6585R – 200 MHz LVDS / 32 ch. DIO </li></ul><ul><li>200 MHz Clock Rates </li></ul><ul><li>32 LVDS DIO lines </li></ul><ul><li>10 PFI lines for triggers and clocks </li></ul>
  48. 48. PXI-5752R - 32-Channel, 12-Bit, 50MS/s Digitizer for NDT (Non-Destructive Test ) and Ultrasound applications <ul><li>Specifications </li></ul><ul><li>32 differential inputs (100 ohm) </li></ul><ul><li>AC coupling </li></ul><ul><li>NDT-specific ADC features </li></ul><ul><li>16 DO channels </li></ul><ul><li>Markets/Application Areas </li></ul><ul><li>Replacing custom, in-house NDT systems </li></ul><ul><li>OEM NDT systems </li></ul><ul><li>Phased array and other high channel count NDT research </li></ul>
  49. 49. What is Non-Destructive Test? The use of noninvasive techniques to determine the integrity of a material, component or structure or quantitatively measure some characteristic of an object. i.e. Inspect or measure without doing harm.
  50. 50. Video Testing ( Analog to HDMI)