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The document is a device modeling report that includes SPICE models for the power MOSFET and body diode of the Toshiba TPC6105 MOSFET. It describes the model parameters, shows simulation results comparing measurements and simulations, and evaluates characteristics including transconductance, capacitance, switching times, and reverse recovery behavior. The report also includes modeling for the integrated ESD protection diode and evaluates its zener voltage characteristic.
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SPICE MODEL of TPC6105 (Standard+BDS Model) in SPICE PARK
1. Device Modeling Report
COMPONENTS: Power MOSFET (Model parameter)
PART NUMBER: TPC6105
MANUFACTURER: TOSHIBA
Body Diode (Model parameter) / ESD Protection Diode
Bee Technologies Inc.
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
2. MOSFET MODEL
PSpice model
Model description
parameter
LEVEL
L Channel Length
W Channel Width
KP Transconductance
RS Source Ohmic Resistance
RD Ohmic Drain Resistance
VTO Zero-bias Threshold Voltage
RDS Drain-Source Shunt Resistance
TOX Gate Oxide Thickness
CGSO Zero-bias Gate-Source Capacitance
CGDO Zero-bias Gate-Drain Capacitance
CBD Zero-bias Bulk-Drain Junction Capacitance
MJ Bulk Junction Grading Coefficient
PB Bulk Junction Potential
FC Bulk Junction Forward-bias Capacitance Coefficient
RG Gate Ohmic Resistance
IS Bulk Junction Saturation Current
N Bulk Junction Emission Coefficient
RB Bulk Series Resistance
PHI Surface Inversion Potential
GAMMA Body-effect Parameter
DELTA Width effect on Threshold Voltage
ETA Static Feedback on Threshold Voltage
THETA Mobility Modulation
KAPPA Saturation Field Factor
VMAX Maximum Drift Velocity of Carriers
XJ Metallurgical Junction Depth
UO Surface Mobility
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
11. BODY DIODE
Forward Current Characteristic
Circuit Simulation Result
100A
10A
1.0A
0V 0.4V 0.8V 1.2V 1.6V 2.0V
I(R1)
V_V1
Evaluation Circuit
R1
0.01m
U1
V1
0Vdc
TPC6105
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
12. Comparison Graph
Circuit Simulation Result
Measurement
Simulation
9
Drain reverse current IDR(A)
7
5
3
1
0 0.4 0.8 1.2 1.6 2
Source-Drain voltage VSD(V)
Simulation Result
VSD(V)
IDR(A) Measuremen Simulation %Error
1 0.76 0.762 0.263
2 0.82 0.817 -0.366
5 0.93 0.931 0.108
10 1.08 1.0754 -0.426
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
13. Reverse Recovery Characteristic
Circuit Simulation Result
400mA
200mA
0A
-200mA
-400mA
14.98us 15.00us 15.05us 15.09us
I(RL)
Time
Evaluation Circuit
RL
50 U1
V1 = -9.35 V1
V2 = 10.7
TD = 0
TR = 8n TPC6105
TF = 8n
PW = 15u
PER = 100u
0
Compare Measurement vs. Simulation
Trr(ns) Measurement Simulation Error (%)
Trj+Trb (ns) 18.6 19.477 4.715
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
14. Reverse Recovery Characteristic Reference
Trj=6.8(ns)
Trb=11.8(ns)
Conditions:Ifwd=lrev=0.2(A),Rl=50
Example
Relation between trj and trb
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
15. ESD PROTECTION DIODE
Zener Voltage Characteristic
Circuit Simulation Result
10mA
5mA
0A
0V 4V 8V 12V 16V 20V
I(R1)
V_V1
Evaluation Circuit
U1
R1
0.01m
TPC6105
R2
V1
0Vdc 1G
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006