The document is a comprehensive introduction to LED technology, covering its structure, emission processes, efficiencies, and various applications. It details the science behind light emission, materials used, and specifications for different types of LEDs, including white light generation techniques. Additionally, it discusses LED parameters, color representation, and includes a disclaimer regarding the information provided.

1. LED Basics
LED 101
September 1st, 2010

2. III/V-Technologies for Optoelectronics
6,2
4,0 AlN
InGaAlP
dgap Energ [eV]
3,5 GaN
m]
gy
Wavelength [nm
400
3,0
SiC
AlP
2,5 500
Band
GaP
2,0 600
InN 700
1,5
15
InGaN GaAs InP
1,0
2,5
25 3,0
30 3,5
35 4,0
40 4,5
45 5,0
50 5,5
55 6,0
60 6,5
65
Lattice Parameter [A]
LED 101 | 09/01/2010 | Page 2
LED Basics | Date: 09/01/2010 | OS SJ AE | RS

3. How Does a LED Emit Light?
LED Chip Structure
n-Crystal
y p-Crystal
p-contact
-
Anode
P-doped
n-doped
Active
epitaxy
+
layer
l
Substrate Depletion zone
Cathode
Electrons
n-contact Holes
H l
LED 101 | 09/01/2010 | Page 3
LED Basics | Date: 09/01/2010 | OS SJ AE | RS

4. Efficiency of an LED
contact
shadowing
h d i
extraction
total internal
Radiative reflection
recombination
Non-radiative
recombinatior
absorption
Internal Efficiency: 60-90% Extraction Efficiency: 50-75%
LED 101 | 09/01/2010 | Page 4
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5. Thinfilm Class - Chip Technology Comparison
Standard Power LED
Thinfilm Technology gy
(generic)
surface emitter
volume emitter
top and bottom contacts
top or bottom contacts
~ 49 % > 97 %
top emission
p
Side emission
 OSRAM O t ’ Thi fil t h l
Opto’s Thin-film technology was th fi t on th market
the first the k t
LED 101 | 09/01/2010 | Page 5
LED Basics | Date: 09/01/2010 | OS SJ AE | RS

6. ThinGAN® Scalable Technology Platform
Light Output with Scaleable 5
Chip Size
5
4
Relative Ligh Output
3 2
ht
2
3
1
1 Constant Amp/ mm²
R
4
Emitting Area
Optimize cost and “Usable Lumens”
p
with proper LED Selection
LED 101 | 09/01/2010 | Page 6
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7. Production of a LED and Efficiencies
Conduction Band
Photons
Chip Processing Packaging
Valence Band Light extraction
“Bandgap Engineering” Thermal
Light extraction management
Epitaxy
Electrical losses -conversion
Internal quantum
efficacy
Substrate Wall plug = int . electr . extr . package
.
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8. Structure of the LED
LED-Chip
Wire Bond
Epoxy
Lead frame
Lead Bond
Frame Chip Wire
Reflector
Cavity Mold
0.25 mm
Printed Circuit Board (PCB)
1.0 ~ 4.0 mm
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9. Structure of the High Power LED
GOLDEN DRAGON PLUS
LED 101 | 09/01/2010 | Page 9
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10. Overview of Packages – T
O i fP k Targeted for Applications
t d f A li ti
Advanced Power OSTAR® OSTAR®
High-Power LED Packages TOPLED® Golden Diamond
Compact SMT
DRAGON® DRAGON®
Plus
Power TOPLED®
Power with lens OSLON SSL® 3.65 x 4.0 x 4.68 x 5.75 x
11.0 x 6.0 1.195 mm 1.1 mm
TOPLED® 3.4 x 3.3 x
x 4.2 mm
1.9 mm
11.0 x 6.0 x
MultiLED® 3.1 mm
3.5 x 2.8 x 3.1 x 3.1 x
TOPLED®
3.6 mm 2.2 mm
3.5 x 2.8 x
1.9 mm
3.4 3.3
34x33x
1.9 mm Dimensions: length x width x height
3.5 x 2.8 x
1.9 mm
SIDELED®
PointLED®
Mini
TOPLED® Micro
Chipled SIDELED®
1.0 SmartLED®
4.0 x 4.0 x
3.4 x 2.5 x FIREFLY ® SmartLED®
3.6 mm
0.725 mm 2.2 x 1.4 x
1.3
1 3 mm 1.6 0.8
16x08x 3.0 x 1.2 x
0.6 mm 1.7 x 0.8 x 1.8 x 1.2 x 1.7 x 0.8 x
Miniature LED Packages 1.0 mm
0.5 mm 0.35 mm
0.6 mm
LED 101 | 09/01/2010 | Page 10
LED Basics | Date: 09/01/2010 | OS SJ AE | RS

11. LED Parameters
Optical Quantities
p Electrical Quantities
 Luminous Intensity IV mcd  Forward Voltage VF Volts (min/typ/max)
 Luminous Flux V lm  Forward Current IF Amperes (max/typ)
 Luminance LV cd/m² (nits)  Reverse Current IR
 Beam angle φ
 Dominant Wavelength dom nm
 Color Coordinates Cx, Cy
Thermal Quantities Misc
 Junction Temperature ˚C  Lifetime h
 Temperature Coefficients lm/K, V/K  CRI
 Thermal Resistance K/W  CCT K
 Luminous Efficacy lm/W
LED 101 | 09/01/2010 | Page 11
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12. Spectral Power Distribution of Single-Color LED
S t lP Di t ib ti f Si l C l LEDs
A single-color LED emits light in a narrow spectral band,
resulting in a saturated color.
1,0
GaN blue (465)
( )
relative intensity of the LED radiation
n
0,9
09 InGaN blue (470)
0,8 verde (505)
true green (525)
0,7 pure green (560)
0,6
06
green (570)
e
yellow (587)
ll
0,5 orange (605)
amber (617)
0,4 super-red (632)
0,3 hyper-red (645)
e
0,2
0,1
0,0
380 400 420 440 460 480 500 520 540 560 580 600 620 640 660 680 700 720 740 760
wavelength [nm]
LED 101 | 09/01/2010 | Page 12
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13. LED M i l and C l
Materials d Colors
White
W = White (GaN) (x=0.32/y=0.31)
W = White (InGaN) (x=0.32/y=0.31)
Green Yellow
Y = Yellow (InGaAlP) 587nm
V= Verde-Green (InGaN) 505nm
T= True Green (InGaN) 525nm
Orange
O = Orange (InGaAlP) 605nm
P=Pure Green (InGaAlP) 560nm
G= Green (InGaAlP) 570nm Amber (Orange Red)
A = Org. Red (InGaAlP) 617nm
Blue
B = Blue (InGaN) 470nm
Red
S = Super-Red (InGaAlP) 630nm
B = Blue (GaN) 466nm
H = Hyper-Red (GaAlAs) 645nm
D = Deep Blue (InGaN) 455nm
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14. How Does LED Generate White Light?
White LED Approaches
Tri-Color Colorimetry
RGB-
Red/ Green/ Blue – primary colors Chips + +
400 500 600 700nm
White
Whit – mixture of 3 primary colors
i t f i l
Blue + Yellow
Chip Chip
400 500 600 700nm
Blue 1 Phosphor
Chip +
400 500 600 700nm
UV-
3 Phosphors
Chip + +
White = Red + Green + Blue 400
Emission Wavelength
500 600 700nm
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15. White light from LEDs
Blue InGaN chip + Phosphor = White LED
Blue Chip Yellow Phosphor
InGaN LED Single-Chip White, LW W5AM
ctral Power (%)
(
YAG Phosphor
Relative Spec
White LED
R
Wavelength (nm)
Wavelength (nm)
LED 101 | 09/01/2010 | Page 15
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16. Volume / Chiplevel Conversion (CLC)
Yellow Blue
Volume conversion
Converter particles
dispersed in casting /
molding material
Chiplevel Conversion (CLC)
Phosphor layer on surface
emitting chip Yellow Blue
LED 101 | 09/01/2010 | Page 16
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17. Phosphor Technology
Customer-selected LED color
t e es a e poss b e
themes are possible
New color regions
capable with Color on Demand
LED technology
Epoxy with
Phosphor
Blue LED Chip
LED 101 | 09/01/2010 | Page 17
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18. Correlated Color Temperature (CCT)
C l t dC l T t
Color Temperature Chart
Correlated Color Temperature (CCT) 7000K
Defines a color as the temperature [K] that a
"black body" source must reach in order to Standard white LED
produce that same color. 6,500 K
6000K
5000K Noon sunlight
Cold Fluorescent
4,200 K
4000K
Std. Metal Halide
4,000
4 000 K
Halogen
3000K 3,000 K
Std. Incandescent
2,850 K
2000K
LED 101 | 09/01/2010 | Page 18
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19. Spectrum of Whit LED in Various Color Bins
S t f White i V i C l Bi
1 7139K
5L-7139K
0.9
6819K
6L-6819K
6L 6819K
5423K
7L-5423K
0.8
4831K
8L-4831K
0.7
07 3945K
J4-3945K
Relative Radiant Power
0.6
3374K
M4-3374K
2833K
Q4-2833K
0.5
R
0.4
0.3
0.2
02
0.1
0
380 400
00 420
20 440
0 460
60 480
80 500
00 520
20 540
0 560
60 580
80 600 620 640
6 0 660 680 700
00 720
20 740
0 760
60 780
80
Wavelength (nm)
LED 101 | 09/01/2010 | Page 19
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20. Color Rendering Index (CRI)
 Color Rendering Index (CRI) – is a quantitative measure of the ability of a
light source to reproduce the colors of various objects faithfully in comparison
with an ideal or natural reference light source with the same CCT
Reference Li ht Source:
R f Light S
 For CCT<5000K, Planckian radiator of
that CCT;
 For CCT>5000K, mathematically
derived daylight t th
d i d d li ht at the nearest CCT
t
Color Samples: 8 Standard Color Samples
 8 standard color samples for
calculating CRI values
l l ti l
 6 special color samples for evaluating
saturated color rendering, skin tone
and green foliage Special Color Samples #9 to #14
LED 101 | 09/01/2010 | Page 20
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21. Disclaimer
 All information contained in this document has been checked with the greatest care.
OSRAM Opto Semiconductors GmbH can however, not be made liable for any damage
that occurs in connection with the use of these contents
contents.
 OSRAM Opto Semiconductor GmbH makes no representations and warranties as to a
possible interference with third parties' intellectual property rights in view of products
originating from one of OSRAM Opto Semiconductor GmbH's partners, or in view of
products being a combination of an OSRAM Opto Semiconductor GmbH's product and
a product of one of OSRAM Opto Semiconductor GmbH's partners. Furthermore,
OSRAM Opto Semiconductors GmbH cannot be made liable for any damage that
occurs in connection with the use of a product of one of OSRAM Opto Semiconductor
GmbH's partners, or with the use of a combination of an OSRAM Opto Semiconductor
GmbH's product and a product of one of OSRAM Opto Semiconductor GmbH's
partners.
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22. Thank you for your attention.