Overview about applications of RMPD and 3D-CSP until 2013; technologies in consumer electronics, medical and automotive.

1. Production Technologies and Applications
Industry, Life Science and Consumer Products
Contents:
Page 1 - 18 Overview and Applications in Fluidics and Communication
Page 19 - 33 Three Dimensional Chip Size Packaging and Products
Page 34 - 38 Technologies and Materials
Page 39 - 40 microTEC locations and contact data
Please see also (attached or at www.microtec-d.com “download”) the documents
“Design rules” and “StepbyStep2011”.
Don’t hesitate to contact us for any questions:
Tel: +49 6322 650 220 , Tel: +49 203 306 2050 and info@microtec-d.com
microTEC team customer care.
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microTEC Gesellschaft für Mikrotechnologie mbH

2. RMPD® and 3D-CSP Technologies and Application
multimat stick2 parallel mask
3D-CSP
parallel batch production >300 materials no tools
coating microFLUIDIC nanoface
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microTEC Gesellschaft für Mikrotechnologie mbH

3. 3D-CSP Package: THz-module
Input NLTL
THz die
Coupling
NLTL – Vivaldi
antenna
Vivaldi antenna
tan delta < 0.00001
-60
Polymer package
Floating
0V
RMPD ®
-65 -0.5V
R e c e iv e d P o w e r (d B m )
+0.5V
-70
-75
-80
-85
4,5 mm
75 80 85 90 95 100 105 110
Frequency (GHz)
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microTEC Gesellschaft für Mikrotechnologie mbH

4. High Precision, any Order Quantity
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5. Planetary Gear Wheel Components
• Diameter = 828µm/1200µm
• Module = 0,06; n1/n2 = 20/24; di = 400 µm
• Lubricants integrated
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6. Desktop Production, flexible and fast:
10 parts or 1 Million Parts, all in 10 days
2,7 x 0,8 x 0,2 mm³,
40 µm wall thickness
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microTEC Gesellschaft für Mikrotechnologie mbH

7. 2006
Anchor tube diameter 200 µm
High Aspect Ratio Anchor tube length 20.000 µm
Distance between holes 50 µm
15mm
1997
Anchor tube diameter 150 µm
Anchor tube length 15.000 µm
Distance between holes 70 µm
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8. Multi Channel Nozzle
5 inlets
5 coaxial outlets
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9. Microfluidics for Lifescience and Medical Technology:
Dispenser Structures
Self-filling by capillary force
Fluidic-stop
transition from
hydrophilic
to
hydrophobic
material
• Fluidic-stop solution for dispenser structures
• Lab-on-a-chip applications
• High-through-put screening
• Technology: RMPD®-mask
Inner diameter: 150 µm
Length: 3000 µm (3 mm)
Volume: 52 nl
Page 9 of 40 Apply pressure to dispens
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10. RMPD®-Multimat Application
Well 300x300µm
Wellplate 28x28
Bottom clear
RMPD-polymere
Well 300x300µm,
dark RMPD polymere, no fluorescence
Page 10 of 40
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microTEC Gesellschaft für Mikrotechnologie mbH

11. RMPD®-Mask Batch
Page 11 of 40
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12. RMPD®-microFLUIDIC Sealing
sealing
• Sealing without gluing Loading box
• Direct covalent binding
between structure
and sealing
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13. Fluidic Chip Successfully Tested at zero-g in Space
Loading box
Reaction chambers for optical analysis Ventilation chamber
• Two different materials in vertical direction
• Intrinsic hydrophilic and hydrophobic materials
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14. microFluidics for Flow Cytometry, with Hydrodynamic
Focusing Buffer Stream (Disposable)
Sample stream
Probe Connection
Buffer stream Buffer Waste connection
stream
Buffer connection
over pressure
Page 14 of 40
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15. Lab-on-a-chip System Design Study for Water Analysis
Integration of micro fluidic and 3D-CSP
Reaction chambers, e.g.
Reaction chambers PCR or hybridization 20 Reaction
to break open cell or PCR Chambers for
Ventilation optical or electrical
chamber 1 Ventilation analysis Ventilation
chamber 2 chambers 3
Filter
with cells
Cavity to be filled with liquid
Integration of sensors, actuators,
electrodes and interconnections
Electrical connectors
Change of cross sections => increase of capillary forces
Sequential opening of chambers=> time controlled filling = valve function
Time 1 Time 2 Time 3
Page 15 of 40
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16. Parallel Batch Production RMPD®
Page 16 of 40
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17. 3D-Coil Variations with RMPD® and 3D-CSP
Advantage:
parallel direct integration pitch 50µm
Application:
Wireless energy supply
and communication
Ferrite core possible
Page 17 of 40
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18. Connector with Magnetic Beads
2 magnetic inserts
magnetic beads
male
female
Page 18 of 40
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19. 3D-CSP Batch Process
5 inch, 9 inch, 14 inch, 350mm
Substrate
4 Step Process to build MEMS
1. RMPD®-mask
2. Placement of inserts
3. Metallisation
Page 19 of 40
4. Metal Layer structuring
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20. 3D-CSP Batch: Bottom generation
bottom
4 Step Process to build MEMS
1. RMPD®-mask
2. Placement of inserts
3. Metallisation
Page 20 of 40
4. Metal Layer structuring
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21. 3D-CSP Batch: Cavity generation
Cavities
4 Step Process to build MEMS
1. RMPD®-mask
2. Placement of inserts
3. Metallisation
Page 21 of 40
4. Metal Layer structuring
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microTEC Gesellschaft für Mikrotechnologie mbH

22. 3D-CSP Batch: Die insertion
Dies
Pads
4 Step Process to build MEMS
1. RMPD®-mask
2. Placement of inserts
3. Metallisation
Page 22 of 40
4. Metal Layer structuring
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23. 3D-CSP Batch: Covering
Vias 1
Open holes over pad (vias)
4 Step Process to build MEMS
1. RMPD®-mask
2. Placement of inserts
3. Metallisation
Page 23 of 40
4. Metal Layer structuring
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24. 3D-CSP Batch Metallisation
Metallisation layer
4 Step Process to build MEMS
1. RMPD®-mask
2. Placement of inserts
3. Metallisation
Page 24 of 40
4. Metal Layer structuring
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microTEC Gesellschaft für Mikrotechnologie mbH

25. 3D-CSP Batch: Structuring
Interconnection layer
4 Step Process to build MEMS
1. RMPD®-mask
2. Placement of inserts
3. Metallisation
Page 25 of 40
4. Metal Layer structuring
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microTEC Gesellschaft für Mikrotechnologie mbH

26. 3D- MOEMS, SMD Case Sizes 0603 and less
Parallel batch production
<= compare with pencil diameter 0,5mm
0,8 mm
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microTEC Gesellschaft für Mikrotechnologie mbH

27. Blue LED die (460 nm) in 3D-CSP Package
Al reflector
0,7 mm
RMPD® housing
1 x 1 mm
LED die Open window for cooling
LED die Al reflector
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microTEC Gesellschaft für Mikrotechnologie mbH

28. Research and development of modular based production units for
the seamless, high throughput manufacture of micro-structured,
polymer based components and microsystems.
Courtesy of Designled Products Ltd.
Funded by European Community's Seventh Framework
Programme under Grant Agreement n° CP-TP 228686
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microTEC Gesellschaft für Mikrotechnologie mbH

29. Pressure sensor with 24-Bit Capacitance – to Digital
Converter
Technology: 3D-CSP with RMPD®, special sensor adaptation with low interferences
Connected PCB flex circuit
interconnection
sensor layer
1,2mm
3D-CSP System die
capacitor
Temperatur sensor on chip resolution 0.1°C
Two wire serial interface (I2C- compatible)
Page 29 of 40
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30. Processing Unit
12 x 12 x 2 mm
2 layers with elements
DSP
DDR2
Flash
Quartz
83 passive elements
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31. 3D-CSP application:
Memory Card with encryption chip and NANDs
Page 31 of 40
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32. Stacked Dies 7 x 9 x 0,05 mm
Technology 3D-CSP 3D-CSP 3D-CSP 3D-CSP 3D-CSP 3D-CSP
Dies stacked 2 4 6 8 10 12
Controller 1 1 1 1 1 1
Die Thicknesses (um) 260 120 70 50 45 40
Gap between Dies (um) 40 30 30 30 25 20
Border outside bottom (µm) 100 100 100 80 50 40
Border outside top (µm) 100 100 100 80 50 40
Card Thickness (µm) 800 800 800 800 800 800
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33. 3D-CSP RF Test Structures, RF-Parameter
available for Development of Baluns and 25µm
Antennas
Frequency range: 100 MHz … 8,5 GHz
Full selected
3D CAD structure
4 interconnection and shielding layers, 6 isolation layers
Page 33 of 40
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34. From CAD directly into high volume series production:
Reality for small parts and MEMS (Micro Electro Mechanical Systems)
From CAD directly into high volume series production: reality now for MEMS (Micro Electro
Mechanical Systems). RMPD® is an internationally patented family of technologies designed
to generate microparts, microstructures, and microsystems in a parallel batch process.
Photo sensitive monomer, oligomer and hybrid materials (sol-gel) are polymerized by UV-light to
generate the products. Today more then 300 suitable UV curable materials are on the market, price
per litre is in a wide range between 30 Euros and 2500 Euros. Several material properties can be
chosen with respect to, eg, mechanical, optical, electrical etc. parameters. FDA approved materials
are available, too!
The technologies used at microTEC are:
• RMPD®-mask (parallel batch production at high volumes by UV light sources with micrometer
precision),
• RMPD®-direct write system (building freeform parts by parallel laser beams),
• RMPD®-multimat (volume specific material properties),
• RMPD®-stick2 (parts directly built on a foil, wafer, glass or other materials),
• RMPD®-nanoface (surface roughness in sub-nm range),
• 3D-CSP (Three Dimensional Chip Size packaging.
The challenge to achieve high productivity is solved by fast parallel batch production.
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35. Generative Processes for
Parallel production by RMPD®
Production of Microstructures
Parallel laser beams
Structures by RMPD®-mask
micro-structures
after polymerisation
mask light curable
acrylate or epoxy
1. 2. 3. ...n
light curable acrylate
or epoxy
Best accuracies
• Fast
• Limitations on geometric design
Page 35 of 40
• Costs and delivery time for mask
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microTEC Gesellschaft für Mikrotechnologie mbH

36. RMPD®-stick2
=>building up microstructures directly on silicon
wafer with micro electronics
Interfacing other materials
• Growth of microstructures on substrates
• Glass, silicon, metal, ...
• Examples:
- tube connectors on silicon/glass wafers
- sealing rings
- fluidic polymer channels on glass slides
- fiber holder over pin diodes
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37. RMPD®-multimat Background
Freedom of choice to grow materials
• Substitute materials
vertically or horizontally
• Layer thickness of up to 200 µm
(depending on the polymer)
• Examples:
- waveguides with two refractive indices
- dispenser systems with different
chemical properties depending on tip height
- different mechanical properties
• Outlook:
- p and n doping
- photon collecting
- photon radiation
different materials different materials
vertical horizontal
Page 37 of 40
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38. Selection of Material Parameters of RMPD®-Polymers
Minimum Maximum
Temperature resistance [°C] long term -50 250
short term -50 285
Refractive index 1,33 1,54
Tensile strength [Mpa] 2 80
Elongation (at break) [%] 2 590
Tensile modulus [Mpa] 7 11700
Thermal conductivity [W/m *K] 0,2 0,7
Surface tension [degree] 20° 120°
Dielectrical permittivity 2 5
tan δ 0,02 0,3
Sterillizable and parts conform to FDA USP 23 Class
VI
Epoxide, Acrylate, Urethane, Methacrylic Acid,
Hybrid Materials e. g. Acrylate with Al or Si
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39. microTEC Locations
Duisburg Bad Dürkheim
Customer Idea + microTEC
Consulting
R&D, Simulation
Prototyping
Direct Mass Production
Training/Licensing
=Customer Product Innovation
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40. Visit us – You are welcome:
microTEC
Gesellschaft für
Mikrotechnologie mbH
Bismarckstraße 142b
47057 Duisburg
Tel: +49 203 306 2050
Fax: +49 203 306 2069
Kaiserslauterer 353
67098 Bad Dürkheim
Tel: +49 6322 650 220
Fax: +49 6322 650 221
http://www.microTEC-D.com
Page 40 of 40
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microTEC Gesellschaft für Mikrotechnologie mbH