Catalog DLMM 2019-Metalized composite 2mm pitch connector that meets Mil-8351...NICOMATIC
Metalized composite 2mm pitch connector that meets Mil-83513 requirements. Perfect fit for inside the box application with EMI protection need applications: UAV, Defense, Communication, Aerospace.
Relong’s RC350 is commercial microwave and RF laminate
material designed with tightly controlled dielectric constant
tolerance (± 0.05) and very low loss characteristics. This
ceramic-filled, woven fiberglass reinforced PTFE composite
material uses unique chemistry formulation and processing to
offer RF and Microwave designers an advantage for
improving electrical properties and mechanical performances.
A Silicon-to-System Thermo-Mechanical Review of ElectronicsKamal Karimanal
A Silicon-to-System Review of Thermo-Mechanical Considerations in Electronics
Author: Kamal Karimanal, Cielution LLC
Thermal and Mechanical challenges to IC package reliability has been addressed with a sufficiently working system of information exchange across a supply chain that spans the foundries to system level assembly plants.The never ending market demand for miniaturization, performance, functionality and cost reduction invariably translates to manufacturing, design, assembly, and reliability challenges to the engineer. Within the Thermal and Mechanical realm these challenges manifest to the engineer in the form of seemingly disconnected problems areas such as BEOL yield, flipchip interconnect reliability, warpage mitigation, heat sink retention design, interface choice, thermally aware board and chassis layout, fan sizing and system level optimization. Evolving technology also introduces newer puzzles such as heterogeneous packaging using 3D ICs. The talk will focus on the tools, methodologies and information exchange protocols used by the thermal management and mechanical reliability professionals across the supply chain to address the various challenges.
Relong’s RC255 is commercial microwave and RF laminate
material designed with low dielectric constant and very low
loss characteristics. This ceramic-filled, woven fiberglass
reinforced PTFE composite material is use unique chemistry
formulation and processing to offer RF and Microwave
designers an advantage for improving electrical properties
and mechanical performances.RC255 provides a significant
improvement in performance stability over the current
product line and other traditional fluoropolymer-glass
laminates.
Catalog DLMM 2019-Metalized composite 2mm pitch connector that meets Mil-8351...NICOMATIC
Metalized composite 2mm pitch connector that meets Mil-83513 requirements. Perfect fit for inside the box application with EMI protection need applications: UAV, Defense, Communication, Aerospace.
Relong’s RC350 is commercial microwave and RF laminate
material designed with tightly controlled dielectric constant
tolerance (± 0.05) and very low loss characteristics. This
ceramic-filled, woven fiberglass reinforced PTFE composite
material uses unique chemistry formulation and processing to
offer RF and Microwave designers an advantage for
improving electrical properties and mechanical performances.
A Silicon-to-System Thermo-Mechanical Review of ElectronicsKamal Karimanal
A Silicon-to-System Review of Thermo-Mechanical Considerations in Electronics
Author: Kamal Karimanal, Cielution LLC
Thermal and Mechanical challenges to IC package reliability has been addressed with a sufficiently working system of information exchange across a supply chain that spans the foundries to system level assembly plants.The never ending market demand for miniaturization, performance, functionality and cost reduction invariably translates to manufacturing, design, assembly, and reliability challenges to the engineer. Within the Thermal and Mechanical realm these challenges manifest to the engineer in the form of seemingly disconnected problems areas such as BEOL yield, flipchip interconnect reliability, warpage mitigation, heat sink retention design, interface choice, thermally aware board and chassis layout, fan sizing and system level optimization. Evolving technology also introduces newer puzzles such as heterogeneous packaging using 3D ICs. The talk will focus on the tools, methodologies and information exchange protocols used by the thermal management and mechanical reliability professionals across the supply chain to address the various challenges.
Relong’s RC255 is commercial microwave and RF laminate
material designed with low dielectric constant and very low
loss characteristics. This ceramic-filled, woven fiberglass
reinforced PTFE composite material is use unique chemistry
formulation and processing to offer RF and Microwave
designers an advantage for improving electrical properties
and mechanical performances.RC255 provides a significant
improvement in performance stability over the current
product line and other traditional fluoropolymer-glass
laminates.
Wide-bandgap applications need DC Link and decoupling capacitors that can withstand 200°C, work at 1+ MHz switching frequencies, and support up to 2,000 V. KEMET continues to move forward on developing the most advanced ceramic DC Link capacitor technology.
As a member of the PSMA Packaging Committee, Dr. John Bultitude presents the work his team has done to make ultra-stable, highly robust Ceramic DC Link Capacitors available in Leadless stacks.
This presentation was presented at APEC 2017 in Tampa, FL.
Please note, this paper describes a technology under active development. Please contact us for the latest information on this technology and the products it is producing.
In this paper the key property differences between solders and TLPS interconnect technologies are compared in detail for MLCC interconnects. The development of a new range of nickel Base Metal Electrode C0G MLCC stacks rated for 200oC is described and performance compared to traditional Precious Metal Electrode (PME) stacks. Thermal cycling performance to 200oC of BME X7R stacks made with 10Sn/88Pb/2Ag solders are compared to similar stacks made with TLPS interconnects of Cu-Sn and In-Ag. The development of leadless stacks, a new bulk capacitance form factor enabled by TLPS technology, is described and their properties compared to traditional stacks.
Relong’s RC300C is commercial microwave and RF laminate
material designed with low dielectric constant and very low
loss characteristics. This ceramic-filled, woven fiberglass
reinforced PTFE composite material is use unique chemistry
formulation and processing to offer RF and Microwave
designers an advantage for improving electrical properties
and mechanical performances.RC300C provides a significant
improvement in performance stability over the current
product line and other traditional fluoropolymer-glass
laminates.
Embedded capacitors can be placed inside of magnetics, power converter silicon, or even the PCB. Based on our AO-CAP's aluminum polymer technology, our KAP is an embedded capacitor.
This presentation shows a preview of the technology. Use the contact form below if you'd like to discuss for your application.
Presented at APEC 2017 in Tampa, Flordia.
Relong’s RC300E is commercial microwave and RF laminate
material designed with low dielectric constant and very low
loss characteristics. This ceramic-filled, woven fiberglass
reinforced PTFE composite material is use unique chemistry
formulation and processing to offer RF and Microwave
designers an advantage for improving electrical properties
and mechanical performances.RC300E provides a significant
improvement in performance stability over the current
product line and other traditional fluoropolymer-glass
laminates.
Thermo-Mechanical Simulation of Through Silicon Stack AssemblyKamal Karimanal
The electronics industry has been using Finite Element Analysis (FEA) to model IC package assembly process for understanding the effects of process conditions, material choice as well as design parameters. What was already practiced as an engineering-art within packaging organizations for monolithic IC packages has now become more complex due to the need for collaboration across organizational walls in the case of 3D stacking. The holistic solution needed for collaborative engineering of 3D stacking process calls for streamlined methodologies and information exchange protocols.
This presentation will introduce the idea of automated chip stacking process modeling approach with detailed discussions on inputs needed, gaps in existing modeling methodologies and output metrics of engineering relevance. The presentation will discuss wafer level warpage due to thinning and RDL films, their control, assembly implications of different under filling and encapsulation processes and pre attach warpage at reflow temperature
Direct Bond Interconnect (DBI) Technology as an Alternative to Thermal Compre...Invensas
DBI® is a low temperature hybrid direct bonding technology that allows wafers or die to be bonded with exceptionally fine pitch 3D electrical interconnect.
IC Socket and interconnect technologies such as embedded wire on elastomer, spring pin, stamped pin, silver particle elastomer, diamond particle interconnect enable testing of IC devices
Abhijit Gurav presented the latest data we've collected on our BME Ceramic DC Link capacitor platform. These C0G ceramic capacitors are designed for high frequency and high-temperature DC Link applications. This update was presented at APEC 2017 in Tampa, FL.
As we see the switching frequency of power converters rise, there is a clear need for a high-frequency and high-temperature capacitor solution. Some designs are looking to place a relatively small ceramic capacitor right at the silicon. These requirements mean these capacitors must withstand temperatures as high as 200°C while responding to frequencies in the MHz range. KEMET's Ceramic DC Link capacitors are based on our very popular C0G platform.
Our Base Metal Electrode (BME) development provides designers two options. Capacitors based on the ultra-stable C0G dielectric or U2J dielectric. In this presentation, KEMET shows potential packages, capacitances, and rated voltages with these two technologies.
T&D are distributors for ABB Kabeldon High Voltage Cable Joints, Cable Terminations and Screened Separable Connectors for high voltage XLPE cable terminating and jointing 11kV, 24kV and 33kV. ABB HV cable connectors are premolded screened separable connectors for terminating and connecting XLPE insulated single or three core cables with copper or aluminium conductors, 11-24kV-33kV, into high voltage switchgear and transformers.
ABB connectors terminate high voltage cables with copper wire and copper tape screens, with or without aluminium (AWA) or steel wire armour (SWA) inot switchgear and transformers.
At PEIM 2016, KEMET presented work related to our BME C0G technology. This evaluation is driven by the rising need for a suitable Ceramic DC Link Capacitor for use in wide bandgap applications.
The presentation covers KEMET's previous application of BME C0G technology in similar areas.
Ironwood Electronics offers high performance test sockets and adapters for both laboratory and production use. IC packages covered include QFN, BGA, SOIC, QFP, and other SMT packages.
Silicon Valley Test Workshop - 2.5D-3D What - Ira Feldman 111111Ira Feldman
2.5D? 3D? What? Overview of 3D Integrated Circuit Packaging and Test Challenges presented at Silicon Valley Test Workshop (November 11, 2011) by Ira Feldman (www.hightechbizdev.com)
Wide-bandgap applications need DC Link and decoupling capacitors that can withstand 200°C, work at 1+ MHz switching frequencies, and support up to 2,000 V. KEMET continues to move forward on developing the most advanced ceramic DC Link capacitor technology.
As a member of the PSMA Packaging Committee, Dr. John Bultitude presents the work his team has done to make ultra-stable, highly robust Ceramic DC Link Capacitors available in Leadless stacks.
This presentation was presented at APEC 2017 in Tampa, FL.
Please note, this paper describes a technology under active development. Please contact us for the latest information on this technology and the products it is producing.
In this paper the key property differences between solders and TLPS interconnect technologies are compared in detail for MLCC interconnects. The development of a new range of nickel Base Metal Electrode C0G MLCC stacks rated for 200oC is described and performance compared to traditional Precious Metal Electrode (PME) stacks. Thermal cycling performance to 200oC of BME X7R stacks made with 10Sn/88Pb/2Ag solders are compared to similar stacks made with TLPS interconnects of Cu-Sn and In-Ag. The development of leadless stacks, a new bulk capacitance form factor enabled by TLPS technology, is described and their properties compared to traditional stacks.
Relong’s RC300C is commercial microwave and RF laminate
material designed with low dielectric constant and very low
loss characteristics. This ceramic-filled, woven fiberglass
reinforced PTFE composite material is use unique chemistry
formulation and processing to offer RF and Microwave
designers an advantage for improving electrical properties
and mechanical performances.RC300C provides a significant
improvement in performance stability over the current
product line and other traditional fluoropolymer-glass
laminates.
Embedded capacitors can be placed inside of magnetics, power converter silicon, or even the PCB. Based on our AO-CAP's aluminum polymer technology, our KAP is an embedded capacitor.
This presentation shows a preview of the technology. Use the contact form below if you'd like to discuss for your application.
Presented at APEC 2017 in Tampa, Flordia.
Relong’s RC300E is commercial microwave and RF laminate
material designed with low dielectric constant and very low
loss characteristics. This ceramic-filled, woven fiberglass
reinforced PTFE composite material is use unique chemistry
formulation and processing to offer RF and Microwave
designers an advantage for improving electrical properties
and mechanical performances.RC300E provides a significant
improvement in performance stability over the current
product line and other traditional fluoropolymer-glass
laminates.
Thermo-Mechanical Simulation of Through Silicon Stack AssemblyKamal Karimanal
The electronics industry has been using Finite Element Analysis (FEA) to model IC package assembly process for understanding the effects of process conditions, material choice as well as design parameters. What was already practiced as an engineering-art within packaging organizations for monolithic IC packages has now become more complex due to the need for collaboration across organizational walls in the case of 3D stacking. The holistic solution needed for collaborative engineering of 3D stacking process calls for streamlined methodologies and information exchange protocols.
This presentation will introduce the idea of automated chip stacking process modeling approach with detailed discussions on inputs needed, gaps in existing modeling methodologies and output metrics of engineering relevance. The presentation will discuss wafer level warpage due to thinning and RDL films, their control, assembly implications of different under filling and encapsulation processes and pre attach warpage at reflow temperature
Direct Bond Interconnect (DBI) Technology as an Alternative to Thermal Compre...Invensas
DBI® is a low temperature hybrid direct bonding technology that allows wafers or die to be bonded with exceptionally fine pitch 3D electrical interconnect.
IC Socket and interconnect technologies such as embedded wire on elastomer, spring pin, stamped pin, silver particle elastomer, diamond particle interconnect enable testing of IC devices
Abhijit Gurav presented the latest data we've collected on our BME Ceramic DC Link capacitor platform. These C0G ceramic capacitors are designed for high frequency and high-temperature DC Link applications. This update was presented at APEC 2017 in Tampa, FL.
As we see the switching frequency of power converters rise, there is a clear need for a high-frequency and high-temperature capacitor solution. Some designs are looking to place a relatively small ceramic capacitor right at the silicon. These requirements mean these capacitors must withstand temperatures as high as 200°C while responding to frequencies in the MHz range. KEMET's Ceramic DC Link capacitors are based on our very popular C0G platform.
Our Base Metal Electrode (BME) development provides designers two options. Capacitors based on the ultra-stable C0G dielectric or U2J dielectric. In this presentation, KEMET shows potential packages, capacitances, and rated voltages with these two technologies.
T&D are distributors for ABB Kabeldon High Voltage Cable Joints, Cable Terminations and Screened Separable Connectors for high voltage XLPE cable terminating and jointing 11kV, 24kV and 33kV. ABB HV cable connectors are premolded screened separable connectors for terminating and connecting XLPE insulated single or three core cables with copper or aluminium conductors, 11-24kV-33kV, into high voltage switchgear and transformers.
ABB connectors terminate high voltage cables with copper wire and copper tape screens, with or without aluminium (AWA) or steel wire armour (SWA) inot switchgear and transformers.
At PEIM 2016, KEMET presented work related to our BME C0G technology. This evaluation is driven by the rising need for a suitable Ceramic DC Link Capacitor for use in wide bandgap applications.
The presentation covers KEMET's previous application of BME C0G technology in similar areas.
Ironwood Electronics offers high performance test sockets and adapters for both laboratory and production use. IC packages covered include QFN, BGA, SOIC, QFP, and other SMT packages.
Silicon Valley Test Workshop - 2.5D-3D What - Ira Feldman 111111Ira Feldman
2.5D? 3D? What? Overview of 3D Integrated Circuit Packaging and Test Challenges presented at Silicon Valley Test Workshop (November 11, 2011) by Ira Feldman (www.hightechbizdev.com)
RT/duroid® 6006/6010LM microwave laminates are
ceramic-PTFE composites designed for electronic
and microwave circuit applications requiring a
high dielectric constant. RT/duroid 6006 laminate
is available with a dielectric constant value of 6.15
and RT/duroid 6010LM laminate has a dielectric
constant of 10.2.
RT/duroid® 6002 microwave material is the first low loss and low dielectric constant laminate to offer superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.
Amity Thermosets (P) Ltd. manufacture and suppliers of high quality Phenol Formaldehyde Moulding Powder.
Grade: AMITY 100
Colour : Black
Mode of Moulding : Injection
Description : High Mechanical, High Electrical.
HTR India - Products - Current Sense Resistors - Electron Beam Welded - HEE (...Creativity Please
This product is a type of Electron Beam Welded, which is a type of Current Sense Resistors.
For more information of this product, please copy & paste the url given below:
http://htr-india.com/product/hee/
HTR India - Products - Current Sense Resistors - Ceramic Encased Resistor - H...Creativity Please
This product is a type of Ceramic Encased Resistor, which is a type of Current Sense Resistors. Features of this product are: Alloy ribbon element in square profile ceramic tube, Ceramic encased for greater heat dissipation and thermal stability, Low TCR, Negligible inductance. This product is consumable for Current Sensing for Industrial and Power Conditioning Applications.
For more information of this product, please copy & paste the url given below:
http://htr-india.com/product/heal/
Taconic NF-30 for 77-79 GHz Safety and Reliability ApplicationsManfred Huschka
Due to the expected potential growth of 77/79 GHz ADAS (Advanced river-Assistance System) several non-PTFE (Polytetra Fluoro Ethylene) laminates are trying to find their way into designs. However from electrical and mechanical reliability points of view non-reinforced PTFE/Ceramic laminates still provide a leading edge
2. Structure and Features
Structure
Dielectric
Available Metal
(Al2O3 filled PTFE)
Cu
Grade
Dielectric Thermal
Thickness Thickness
Conductivity Type
(㎛) (mm)
(W/m·K)
Base Metal
Aluminium 0.6
TacLED-3D- (A-5052), 1.0
1.0 85
10/85 Copper 1.5
(C-106) 2.0
Features
● Bendable and formable for 3D LED light
● Excellent heat dissipation
● Ultra high thermal resistance
● Superior dielectric adhesion strength on Al and Copper
-2-
4. Applications for 3D LED Light
DK Thermal’s products
(WWW.DKThermal.co.uk)
-4-
5. Hi-Pot Test in 3D Structure
☞ Bend Hi-Pot Test ( Compare to TacLED )
√. Test Condition
- Peak Voltage : DC3000 volts and limited current 1mA
- Ramp rate to peak voltage : 1000 volts per second
- Hold time at peak voltage : 2 seconds
√. Specimen Trace lengthXwidth : 180mmX200㎛
√. Degree of bend
90° 45° 20°
-5-
6. ▶ Stretched Result ( Bending with dielectric on outside )
3.5 3.5
TacLED-3D 10/85 C2/Al1.5mm TacLED-3D 10/85 C2/Al1.0mm
3.0 3R 3.0
4R 3R
2.5 2.5
conventional 4R
2.0 2.0
1.5 1.5
1.0 1.0
0.5 0.5
0.0 0.0
no bend 90° 45° 20° no bend 90° 45° 20°
3.5 3.5
TacLED-3D 10/85 C1/Al 0.8mm TacLED-3D 10/85 C1/Al 0.6mm
3.0 3.0
3R
2.5 3R
2.5
4R
4R
2.0 2.0
1.5 1.5
1.0 1.0
0.5 0.5
0.0 0.0
no bend 90° 45° 20° no bend 90° 45° 20°
※ All specimens passed 3KV Hi-Pot test in Compressed Bending
( Bending with dielectric on inside )
-6-
11. Repeated Bending with 45 degree /4x bending
K Volts
3.5
TacLED-3D 10/85 stanfard copper
TacLED-3D 10/85 High Elongation copper
3.0
TacLED 10/85 stanfard copper
2.5
2.0
1.5
1.0
0.5
0.0
0 1 2 3
times
※ Circuit of TacLED 10/85 was opened
after twice repeated bending
- 11 -
12. Bending Hi-Pot Property (standard copper type vs. high elongation copper)
K Volts
3.5
3.0
2.5
2.0
1.5
1.0 TacLED-3D 10/85 stanfard copper ( 3R)
TacLED-3D 10/85 stanfard copper ( 4R)
0.5 TacLED-3D 10/85 High Elongation copper(3R)
TacLED-3D 10/85 High Elongation copper(4R)
0.0
No bend 90° 45° 20°
times
- 12 -
13. Bending Reliability Check by X-Ray
√. Specimen : -. TacLED-10/85 C2/Al1.5mm without/with solder resist ink coating
-. TacLED-3D-10/85 C2/Al1.5mm without/with solder resist ink coating
√. Bending : -. Angle : No bend -> 90 ° , 45 °, 20 ° & twist
-. Direction : Stretched , Compressed
( hard to define defect after compressed direction bending )
√. Test Equipment : X- eye SF160 model
- 13 -
14. No Bend 90° 45° 20° Twist
With solder resist coating
Without solder resist coating
TacLED-
10/85 C2/Al
1.5mm With solder resist coating Without solder resist coating
flexible solder
resist req.
※ open circuit and pad (land) lifting after bending
- 14 -
15. No Bend 90° 45° 20° Twist
With solder resist coating
Without solder resist coating
TacLED-
10/85-3D
C2/Al
1.5mm With solder resist coating Without solder resist coating
※ No open circuit after bending but corner of pad was slightly
lifted after 20 ° bending
- 15 -
16. Heat Dissipation
Overall Thermal Conductivity and Dielectric Thermal Impedance
Base Metal
Trace Dielectric Dielectric Overall
Copper Thermal Conductivity Thermal Impedance*1 Thermal Conductivity*2
(oz) Al-5052 Cu (W/m·K) (℃㎠/W) / (℃in2/W) (W/m·K)
(mm) (mm)
1 1.0 1 0.85 / 0.13 25.0
1 1.0 1 0.85 / 0.13 34.0
*1 Calculated Data
*2 Measured in Laser Flash in Ajou Univ. Lab. in 2010
- 16 -
17. Thermal Resistance
Specimen : 2” x 2”, n=12
Test Condition : Floating for 30min @300℃
Solder Float Tester (Solder Pot)
Result : No Blister and No Delamination
1 2 3 4 5 6 7 8 9 10 11 12
OK OK OK OK OK OK OK OK OK OK OK OK
- 17 -