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V8.6 Brochure

IntelliSuite is a complete design environment for MEMS that provides tools across the entire product development cycle. It includes schematic capture tool Synple, physical design tool Blueprint, process design tools CleanRoom, and multiphysics solvers FastField. IntelliSuite aims to link the entire MEMS organization through a unified platform. It offers a seamless flow from concept to tapeout through integrated tools for simulation, layout, verification, and more. IntelliSuite has established itself as the standard industry tool used by MEMS professionals worldwide.

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IntelliSuite The shortest distance between your MEMS concept & product
IntelliSuite, IntelliFAB, IntelliMask, MEMaterial, AnisE, RECIPE, Synple, Blueprint, IntelliEtch, Hexpresso, WaveRunner, TapeOut, EDA Linker, 3DBuilder, MEMS SoC, Total MEMS solutions, CAD for MEMS and Solutions for the MEMS professional are trademarks of IntelliSense Software Corporation. All other trademarks are © or ™ of their respective owners. Errors and Omissions Excepted. This document is subject to frequent changes. IntelliSense Software does not accept liabilities due to errors or omissions in this document. © IntelliSense Software, 2010
Synple Blueprint Clean Room Fast Field EDA Linker Schematic capture Physical design Process flow design Multiphysics solvers Link to EDA tools Component based Parametric Process debug Coupled field analysis Cadence, Mentor, Design exploration capabilities Process visualization System model Synopsys, Ansoft, Mesh, Mask and 3D Auto HEX meshing extraction Mathworks etc… synthesis Layout/DRC Tape Out
A living design environment Used by MEMS professionals worldwide for design, development and manufacturing of MEMS, IntelliSuite has firmly established itself as industry’s standard tool. IntelliSense provides MEMS companies and individual users with a complete living design environment to manage their MEMS product through its life cycle. IntelliSuite is a tightly integrated design environment that will link your entire MEMS organization together. Built to scale from a point tool to an organization-wide tool, IntelliSuite unifies various engineering and manufacturing tasks into a single living design environment.
Behavioral Structural 1 Schematic Component 4 capture Library Synthesis System Model & Extraction Optimization 3D Multiphysics engine Behavioral Multiphysics engine Layout engine Verification engine DRC engine Ab Initio Physical & Extraction Process modeling Process Layout Modeling 2 3 Physical Process level
Seamless design flow IntelliSuite contains a wide range of closely integrated tools to seamlessly go from schematic capture and optimization to design verification and tapeout. A flexible design flow allows you to start your design at either schematic, layout or 3D level. IntelliSuite consists of a number of advanced tools that work together. For instance, Synple allows you to capture your MEMS at a schematic level, much like SPICE for electrical circuits. Your design can then be quickly iterated and optimized at different granularities. Sophisticated synthesis algorithms can automatically convert your schematic into mask layout, 3D or better yet a meshed structure for full multiphysics analysis. Blueprint, is a physical design tool that incorporates advanced layout, design rule check, cross section exploration, and automated mask to hex mesh capabilities. CleanRoom process suite allows you to create and debug your process flow and your mask set before you enter the clean room. It allows you to make virtual prototypes to save costly fabrication mistakes. Advanced Fastfield Multiphysics tools feature fully coupled electrostatic, mechanical, fluidic, and electromagnetic engines. Advanced Model Order Reduction based Extraction techniques capture electromechanical, fluidic and damping behavior into compact models, while EDA Linker seamlessly links IntelliSuite to other leading EDA tools.
Behavioral modeling
Schematic Capture Parallelized Multiphysics Synthesis Yield Engineering Link to other tools Design Exploration Engine Schematic to mask DfM Automatic meshing Optimization Mechanics Schematic to 3D Process Corner studies Derive process flow Design for Electrostatics Schematic to mesh Yield prediction Link to ModeFrontier™, manufacture Damping/Dissipation Phoenix Integration Piezo and other optimization Mixed Signal tools Control Systems 1000X faster than FEA
Seamless design flow Synple enables schematic based MEMS design capture, design exploration, optimization and system synthesis. Unlike other tools which give you a warmed over electrical circuit editor, Synple features a sophisticated schematic editor designed specifically for MEMS and Multiphysics modeling. Elements can be wired using a multiphysics bus which carries mechanical, electrical, fluidic and temperature signals across elements. A massively parallel, multi-physics computation engine allows you to perform sophisticated coupled mechanical, electrostatic, fluidic, piezo, analysis along with analog and mixed signal circuit elements (such as transistors, amplifiers, logic, etc) and control elements (such as PID, Sigma-Delta, sliding-mode etc). Synple allows you to optimize your design, explore manufacturability issues and quickly converge upon a robust design for manufacturing.
Multiphysics analysis Compute time: 4 hr (Full 3D) vs 30s (compact) Schematic based behavioral modeling Synple places a large array of common MEMS design elements such as straight and curved beams, joints, elastic and rigid plates, frames of references, electrostatic actuating and sensing mechanisms to quickly wire up a complex device in minutes. Compact modeling allows you analyze coupled thermo-electro-mechanical and fluid-structure interaction problems in seconds. Monte Carlo based process variation analysis
3D result visualization 3D Visualization of Schematic Results Synple connects to WaveRunner our advanced waveform tool for MEMS, Analog Mode 1: In Phase and Mixed Signal analysis. In addition, Synple also connects to VisualEase, IntelliSense’s easy to use 3D result analysis tool. Analysis results can be viewed in 3D so that complex motions can be easily visualized. Mode 2: Anti Phase
Automated layout synthesis Attention to detail. Synple features advanced MEMS placement algorithms to convert schematics into fab-ready layouts. Real world details such as stress relief curves, dimples, bumpers, etch compensation features are automatically generated saving you hours of tedious grunt work. Stress relief curves Dimples Comb Etch compensation bumpers features
Process, 3D and mesh synthesis Take the pain out of meshing Synple’s synthesis routines can convert the schematic into a process flow that can be used as a basis for your fabrication. In addition, Synple now integrates our popular HEXPRESSO™ hex meshing tool, automatically converting your schematics into a high-fidelity pure Hexahedral meshes that can be used in Multiphysics analysis.
Physical design & verification
Design capture Design Rule Check Layout visualization Hexpresso Layout optimized for MEMS Tape Out DRC Editor Cross section drawing Automated HEX mesher AutoCAD™ like interface Powerful hierarchical DRC 3D Visualization of layout 1 click Mask to Mesh Large design library All angle support Hierarchy support Easy Error Navigator Smart Layers Pathfinders Scripting
Blueprint capabilities
AutoCAD™ like interface makes Blueprint a familiar to new users. Every element of Blueprint from menus to toolbars to keyboard accelerators can be customized to make the interface your own. Layer, view and cell management tools make navigating complex layouts a breeze. Mask Courtesy: Matthew Last, BSAC Built in scripting support allows you to automate the creation of complex geometries without breaking a sweat. Mask Courtesy: Prof Tim Dallas,Texas Tech Univ
Layout to TapeOut Blueprint is an all-in-one tool for physical design and verification of MEMS. Blueprint features a layout editor designed for MEMS. An AutoCAD like interface and command line will put most engineers at ease with a feature laden interface. Blueprint integrates a number of technologies that go beyond pure layout. For instance, an integrated cross sectioning tool allows you to examine the process cross section along any line segment. Similarly, built in HEXPRESSO™ support can create pure hexahedral meshes based upon mask layout and process flow. Blueprint also links to TapeOut™, IntelliSense powerful all angle Design Rule Check (DRC) engine to verify your layouts. TapeOut & ErrorNav Blueprint now features a multi-threaded, all angle DRC engine to allow you to verify your designs. An easy to use Error Navigator allows you to identiy and fix errors
Mesh morphing One click meshing Create parametric meshes that can morph Use our robust Hexpresso™ engine to across design parameters such as film go from mask to mesh based upon a thickness, electrostatic gaps, sidewall angle process sequence. Hexpresso allows and skew, line width offsets without need you automatically refine flexures and for remeshing other high stress areas, account for process flow and process variations .
hex meshing in a jiffy
Process validation
Process capture Material databases Process simulation Hexpresso Develop process traveller Process correlated databases FABViewer: Flow visualization Automated HEX mesher Debug traveller Material properties AnisE - Anisotropic etching 1 click Mask to Mesh Create process databases IntelliEtch - ab initio etching RECIPE - RIE/ICP etch simulator
Process traveller based virtual prototyping IntelliFAB™ allows you to create and debug your process flow and your mask set before you enter the clean room. It allows you to make virtual prototypes to save costly fabrication mistakes. Use IntelliFAB to • Debug your process traveller • Visualize your process flow • Create accurate device models • Automatically mesh your devices • Share process flows across the organization • Capture process knowledge • Create devices based on foundry templates
Simulate complex MEMS process flows CleanRoom tools allow you to prototype complex process flows. A process flow that combines multi-step mask transfers, oxide and nitride layers, sacrificial layer deposition and wet etching and DRIE processes is shown above. Composite processes, Shikida Mitsuhiro, J. Micromech. Microeng. 14
56 um 56.89 um 50 min 51.27 min Measured vs modeled CleanRoom 110 um 110.93 um simulation tools 100 min 95.27 min are rigorously benchmarked against process studies to ensure first time right design. 166 um 166.40 um 150 min 139.62 min 225 um 200 min 226.13 um 190.44 min
Experimental verification. A RECIPE etch profile (right) is compared with an SEM. A 5µm trench was sequentially etched using a etch/polymerization configuration of 7s/7s, 9s/ 7s and 5s/7s, each for 5 minutes Progression of an etch featuring three processes: 1. Isotropic RIE to create a wine bowl 2. Bosch etch (DRIE) to create the wine stem and 3 Isotropic RIE to smooth the scalloping and improve sidewall coverage. Inset shows the detail of the sidewall scalloping.
Bosch etch +XeF2 isotropic release Bosch etch +XeF2 isotropic release Deep silicon process debug Bosch etch +XeF2 isotropic release Unreleased areas Unreleased sections Simulate representative area Process Debug: RECIPE-3D allows you to fine tune your deep silicon based process flows before entering the fab. In the above example a comb based Released structure Released sections device is fabricated using the SCREAM process (Single Crystal Reactive Etching and Metallization). The results show areas that are unreleased after the etch (top) and released areas (bottom), indicating that the layout will need some tweaks before entering the fab.
Fastfield multiphysics
Fastfield Multiphysics Fully coupled Specialized engines Extraction Unique FEM-BEM formulation Thermal BioMEMS Multiphysics capture 64 bit multi-processor enabled Electrostatics High frequency EMag Efficient for 5-10X faster than pure FEM Mechanical verification Fluidics Lagrangian models Contact physics 1000X more efficient Piezo than FEA Magnetostatics
It all fits together The Thermo-Electro-Mechanical (TEM) analysis module allows you to perform fully coupled thermal, electrical and electrostatic, magnetostatic, fluidic and mechanical analysis. TEM allows you to perform fully coupled static, dynamic, harmonic, transient, contact and post- contact analyses on linear or non-linear systems. Use TEM for analyzing a wide range of devices based on electrostatic, thermal, piezo, electromagnetic or electrothermal principles. TEM incorporates many custom MEMS algorithms that are unmatched by other tools. • Full dynamics capability • State of the art multi-pole accelerated Boundary Element field calculations are 100X faster than comparable FEA tools on the market • Integrated Fluid Structure Interaction (FSI) for electromechanical, piezoelectric and fast damping extraction calculations
Rotary ring gyro Draper vibratory gyro Lockheed inertial device Raytheon/TI RF switch Rate/Coriolis analysis Electrostatic drive Squeeze film analysis Non-linear contact analysis Hitachi NASA Corning NASA RF Tunable Filter Adaptive optics 3D Optical cross connect Radiation detectors
Fastfield technology now supports fully coupled fluid structure interaction (FSI) for electromechanical, piezoelectric and damping (frequency domain) calculations. FSI capability has been widely tested in a number of applications ranging from piezo-pumps to microphone condensers to a variety of MEMS structures. PZT actuated membrane Outlet Microphone condenser Pressure distribution Inlet Flow chamber Flow evolution in a piezoelectric membrane micro pump
Fast Impedance Extraction Phase ripple in a BAW device Multi-processor BAW/SAW simulation Fast impedance and phase ripple calculations are now a cinch in IntelliSuite
COUPLED ELECTROSTATIC-MECHANICAL-CONTACT PHYSICS & HIGH FREQUENCY (RF) ELECTROMAGNETICS IntelliSuite ships with a new full 3D FEM based ElectroMagnetics engine optimized for RF MEMS simulation. The Electromagnetics engine is coupled with ThermoElectroMechnaical (TEM) analysis capabilities. FullWave ElectroMagnetic analysis of electro-mechanically deformed structures can be seamlessly simulated for the first time within a single software. In addition, IntelliSuite ships with several other unique features that allow you to explore phenomenon such as dynamic closure of switches including simulating switch bounce.
Client Agilent Inc Application Detector chip Analysis Package Thermo-mechanical analysis Client Corning Inc Application Fiber optic switching Warpage due to packaging Analysis Full board level packaging analysis 256x256 micro-mirror array Fiber block integration Temperature distribution Final device Final Boards with warpage Stress contours Board deformation Deflection of the mirrors reduction mechanism Wrap it up! IntelliSuite includes comprehensive packaging analysis. Stresses, CTE mismatches, shock effects, effects of packaging pressure on device damping, parasitic effects and high frequency electromagnetic effects can all be modeled with ease.
Package and board level analyses IntelliSuite simplifies the packaging of MEMS devices, reducing the cost of packaging development. The tools you need to perform die level and board level packaging analyses come standard with IntelliSuite. IntelliSuite solves most complex packaging problems involving linear and non-linear, static, frequency, and dynamic behavior. Stress, strain and warpage calculations, thermal-electrical (joule heating), vibrational analysis including shock testing, damping analysis can all be performed with ease. Our new package model extraction allows you to model the impact of package stresses at a system level, allowing you to compensate package induced effects in electronics. This allows you to perform JEDEC, MIL STD, or Belcore tests on packaged devices before costly device fabrication.
Microfluidics and BioMEMS analysis We created a full 3D Navier-Stokes solver optimized for microfluidic applications from the ground up. Simultaneously, we went way beyond the existing code bases by adding support for electrokinetic phenomena, Red- Ox reactions, acids, bases, ampholytes and fluid structure interaction. An optimized ElectroWetting on Dielectric (EWOD) engine allows you to quickly simulate droplet transport, merging and splitting. We then added advanced visualization algorithms to look at cross-sectional profiles, velocity vectors, streamlines and transient results. Our code base is not only faster at solving microfludics problems but is the only MEMS tool for problems from ranging from high frequency dielectrophoresis to isoelectric focusing to electro-osmotically enhanced flow. Discover why top BioMEMS companies are choosing the IntelliSense solution.
Membrane Inlet Micro-mixing in a valve Flow mixing Fluid Structure Interaction Flow separation device Concentration gradient evolution Y combiner Inlet flow - membrane interaction Microfluidics• Electrokinetics • Transport stochiometry • Heat transfer • Electro-Wetting on Dielectric (EWOD) • Digital droplet microfluidics • Free Surface Flow • Fluid Structure Interaction • Electrochemistry Micro-mixing • Electrophoresis • Dielectrophoresis • Capillary flow and electro-separation Electro-osmosis • Electro-hydrodynamics • Micro-pumps Electrokinetics Electro-osmotic driven flow Electrophoresis/Dielectrophoresis Free surface flow Multiplex focusing Electrohydrodynamics for cooling High Frequency Waste separation Slide coater
High frequency electromagnetic analysis The IntelliSuite electromagnetic analysis module is specifically designed to address the needs of researchers in RF MEMS, microwave, and Optical MEMS by providing fast, accurate, cost-effective solutions for high frequency electromagnetic phenomena. The Electromagnetics module is the only fully integrated high frequency solver available for MEMS simulation. Traditional high frequency tools are designed for planar or quasi-planar structures, not for the high aspect ratio structures of MEMS. These tools also fail badly when it comes to highly resonant mechanical structures. Additionally, we removed more limitations found in most other high frequency tools by adding support for lossy conductors and dielectric discontinuities. Best of all, it tightly integrates with the IntelliSuite environment, providing you with all the tools for your MEMS needs!
Create and model complex geometries such as vias and through feeds with ease.While IntelliSense’s multi-pole accelerated impedance extraction algorithms will rapidly compute critical parameters. IntelliSuite is the only tool on the market that allows you to perform coupled Thermo- Electro-Mechanical & Full Wave ElectroMagnetic analyses— this is particularly useful in designing deformable RF-MEMS such as switches, tunable capacitors and varactors.
Extraction & verification
System model extractor (SME) IntelliSense introduces SME for dramatically reducing the computational time to perform accurate dynamic analysis of MEMS. Based upon sub-space model reduction and energy based algorithms, very large non-linear thermo-electromechanical, electrothermal, piezoelectric or piezoresistive FEM models can be reduced into computationally efficient behavioral models. These behavioral models fully capture the complex non-linear dynamics inherent in MEMS due to electrostatic forces, electrothermal and residual stresses, squeeze film damping, and multiple mechanical degrees of freedom. IntelliSuite is the only tool that gives you the freedom to create arbitrary degree of freedom compact models. These n-DOF 3D models fully capture all of the harmonic modes of the MEMS enabling you to quickly develop readout or control electronics.
SME allows you to create 3D macro models that accurately capture the dynamic response of MEMS 100-1000x faster than equivalent FEA simulations.The response of a clamped beam driven at 50 kHz (above) and at 3 MHz (left) accurately captures the beam motion.
Capture strain energy Capture electrostatic energy Capture fluid damping associated with each mode associated with each mode characteristics Arnoldi/Krylov First mode sub-space reduction HDL HDL formulation Hardware Second mode Description N-DOF behavioral model based on Lagrangian formulation d # "L & "L % () =0 dt % "q j ( "q j $ ' Third mode ! ❶ Capture total energy of relevant mode ❷ Krylov/Arnoldi subspace ❸ Create Lookup table based fast (Mechanical, Electrostatic, Fluidic, methods to generate Compact model for Dissipation) and modal interactions Lagrangian formulation system modeling
Extraction algorithms can now capture modal fluid damping, package, and temperature related effects. Modal fluid damping is extracted in the frequency domain to accurately capture variation of fluid film force and damping components with operating frequency. Package warpage and temperature coefficient releated effects are also captured and included in system models.
EDA-Linker — Integrate MEMS + ASIC design flows Seamless integration with your preferred EDA Workflow EDA Linker allows you to incorporate IntelliSuite directly into your EDA workflow. Whether you are using a Cadence, Mentor, Synopsys, Matlab or Tanner environment, or a mixed tool environment IntelliSuite will fit right in. EDA Linker allows you to co-simulate your micro- devices along with the electronics in your favorite mixed signal or system level environment. Automated code generation Users can easily convert complex electro-mechanical devices such as gyroscopes, resonators, switches etc into an equivalent hardware description language with the click of a button. EDA Linker supports, VHDL- AMS, Verilog-A, HSPICE, PSPICE, Simulink MEX based flows.
Open standards based exchange Physical layout GDS, DXF, CIF, GERBER, RS-247, EMK, HOLES Structural and 3D IGES, SAT, VRML, GEOM, DXF UNV, PAT, CDB, SAT (Ansoft, Ansys, ABAQUS, Patran, Analysis and mesh structure Nastran, Simulia) VERILOG-A, VHDL, PSPICE, HSPICE, SIMETRIX, System and circuit level SIMULINK (MEX), TOUCHSTONE Result files ASCII, CSV (Excel), Touchstone, PLT (Tecplot) IntelliSuite provides compatibility with many of the existing tools in your toolbox. At the physical layout level it provides seamless data exchange with L-Edit, Virtuoso, AutoCAD and other popular layout editors; at the solid model level you can exchange data with any SAT or IGES based tool such as SolidWorks, CATIA, ProE. At the analysis level you can exchange data with Abaqus, Ansys, Ansoft, Comsol, Nastran or Patran; at a mixed signal or system level you can export directly to ADS, Ansoft, Cadence, Mentor, Mathworks Simulink, Synopsys or Tanner based workflows. Additionally, all result files can be visualized in any Tecplot compatible tool.
Design to device services
Engineering services Design services IntelliSense has a strong background in offering design services for MEMS. In fact, we have been involved in many a MEMS program since 1991. IntelliSense offers a wide range of design services ranging from traditional work for hire to specialized IP development. Turnkey MEMS fabrication services IntelliSense operates as a fabless MEMS company and offers design/prototyping/ manufacturing, IP licensing and consulting services. IntelliSense has formed strong affiliations with established MEMS foundries and research institutions throughout the United States and the world. Our partnerships across the value chain allow IntelliSense to prototype and transfer MEMS based components into production at the lowest cost. Consulting services Although we are extremely discrete about our clientele you will find that we have worked with the top names in the world. We have tackled some of the most challenging MEMS problems over the years. Be it solving manufacturability issues or process technology recommendations we are ready to take on your problem.
Microsensors RF MEMS Microfluidics Optical MEMS
Design to Device together. That is why Reducing risk IntelliSense has formed Our strategic partnerships Services strategic partnerships with the gives you access to the right leading MEMS foundries. vendor for the right job. By Prototype development, Supply chain management working with several vendors, including packaging and test, is we closely keep track of their IntelliSense has formed strong done with these partners. Pilot- evolving expertise and affiliations with established line manufacturing can be competence in different areas. MEMS foundries and research completed with these local This allows us to put together institutions throughout the foundries as well. To reduce the right partnerships to get United States and the world. cost, higher volume your devices to market Our partnerships through out manufacturing can be done in quicker. the value chain allow our overseas partners’ facilities. IntelliSense to prototype and We can help you drive down transfer MEMS based MEMS, BioMEMS and opto- components into production at electronic packaging costs, the lowest cost. reduce your risk in the Prototype to manufacturing development cycle, and smooth the path through pilot It is important for custom scale to high-volume MEMS design that design and process development manufacturing. engineers work closely
ASIA + AMERICAS China India Japan IntelliSense China BigTec, Bangalore ADTECH, Tokyo Tel: +86 25-83478765 Tel: +91 80 4107 0138 Tel: +81-3-5464-2971 Fax: +86 25-8471 9905 E-mail: guru@bigtec.org E-mail: info@ad-tech.co.jp Web: www.intellisense.com.cn E-mail:china@intellisense.com Middle East Korea Malaysia SSV-Co UIT Solutions Inc, Seoul Trans-Dist Tel: +966 -1- 4766 036 Tel: + 82-2-587-2303 Tel: + 60 6(03) 8888-9908 Web: www.ssv.com.sa E-mail: uitinc@uitsolutions.com Fax: + 60 6(03) 8888-9909 E-mail: alkhusheiny@gmail.com E-mail: mandy@transdist..com Singapore Taiwan North and South America including the United States E•Mation Technologies, Singapore Avant Technology, Hsinchu Tel: +65-68586882 Tel: +886-3-5160188 IntelliSense Head Quarters, E-mail:emation@singnet.com.sg E-mail: sales@avant.com.tw Boston Tel: +1 781 933 8098 E-mail: sales@intellisense.com
EUROPE Austria Belgium, The Netherlands, Denmark, France Sweden, Norway, Denmark, Italy and UNIDOST Spain MMSolutions, Paris Tel: +43 664 3133223 Tel: +33 1 42965379 Fax: +43 1 9716164 PhoenixBV, Enschede Guy Debruyne E-mail: info@unidost.com Phone: +31 (0)53 483 64 60 <guy.debruyne@club-internet.fr> E-mail: info@phoenixbv.com Germany Israel Turkey MMSolutions, Germany WaldyTech Ltd. UNIDOST, Istanbul Tel: +49 6340 9191 34 Tel: + 972 9 9573649 Tel: +90 216 4141958 Kai Dehrmann Fax: +972 9 9576231 Fax: +90 216 3368923 <kai@mmsolutions.com> E-mail: walter_d@waldytech.com E-mail: info@unidost.com UNIVERSITY & EDUCATIONAL SALES UK Europractice Software Service MMSolutions, UK Rutherford Appleton Labs United Kingdom Tel: +44 (0)1235 44 5327 Tel: +44 1628 488649 E-mail: enquiries@msc.rl.ac.uk Email: info@mmsolutions.com
Total MEMS Solutions Intel IntelliSense ignited the MEMS industry in the early 1990s with its IntelliSuite® family of innovative CAD/EDA tools — and is now the leading innovator and supplier of design and development solutions for the MEMS professional. With users in more than 30 countries, IntelliSense offers software tools and custom design, consulting and market research services to universities, blue-chip companies and start-ups worldwide. What's more, IntelliSense has formed strong affiliations with dozens of leading MEMS foundries and research institutes worldwide, which allow us to prototype and transfer MEMS-based components into production at the lowest cost. As a fabless MEMS company, IntelliSense also offers design, IP licensing and consulting services.
www.intellisense.com

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V8.6 Brochure

  • 1.
    IntelliSuite The shortest distancebetween your MEMS concept & product
  • 2.
    IntelliSuite, IntelliFAB, IntelliMask, MEMaterial,AnisE, RECIPE, Synple, Blueprint, IntelliEtch, Hexpresso, WaveRunner, TapeOut, EDA Linker, 3DBuilder, MEMS SoC, Total MEMS solutions, CAD for MEMS and Solutions for the MEMS professional are trademarks of IntelliSense Software Corporation. All other trademarks are © or ™ of their respective owners. Errors and Omissions Excepted. This document is subject to frequent changes. IntelliSense Software does not accept liabilities due to errors or omissions in this document. © IntelliSense Software, 2010
  • 3.
    Synple Blueprint Clean Room Fast Field EDA Linker Schematic capture Physical design Process flow design Multiphysics solvers Link to EDA tools Component based Parametric Process debug Coupled field analysis Cadence, Mentor, Design exploration capabilities Process visualization System model Synopsys, Ansoft, Mesh, Mask and 3D Auto HEX meshing extraction Mathworks etc… synthesis Layout/DRC Tape Out
  • 5.
    A living designenvironment Used by MEMS professionals worldwide for design, development and manufacturing of MEMS, IntelliSuite has firmly established itself as industry’s standard tool. IntelliSense provides MEMS companies and individual users with a complete living design environment to manage their MEMS product through its life cycle. IntelliSuite is a tightly integrated design environment that will link your entire MEMS organization together. Built to scale from a point tool to an organization-wide tool, IntelliSuite unifies various engineering and manufacturing tasks into a single living design environment.
  • 6.
    Behavioral Structural 1 Schematic Component 4 capture Library Synthesis System Model & Extraction Optimization 3D Multiphysics engine Behavioral Multiphysics engine Layout engine Verification engine DRC engine Ab Initio Physical & Extraction Process modeling Process Layout Modeling 2 3 Physical Process level
  • 7.
    Seamless design flow IntelliSuitecontains a wide range of closely integrated tools to seamlessly go from schematic capture and optimization to design verification and tapeout. A flexible design flow allows you to start your design at either schematic, layout or 3D level. IntelliSuite consists of a number of advanced tools that work together. For instance, Synple allows you to capture your MEMS at a schematic level, much like SPICE for electrical circuits. Your design can then be quickly iterated and optimized at different granularities. Sophisticated synthesis algorithms can automatically convert your schematic into mask layout, 3D or better yet a meshed structure for full multiphysics analysis. Blueprint, is a physical design tool that incorporates advanced layout, design rule check, cross section exploration, and automated mask to hex mesh capabilities. CleanRoom process suite allows you to create and debug your process flow and your mask set before you enter the clean room. It allows you to make virtual prototypes to save costly fabrication mistakes. Advanced Fastfield Multiphysics tools feature fully coupled electrostatic, mechanical, fluidic, and electromagnetic engines. Advanced Model Order Reduction based Extraction techniques capture electromechanical, fluidic and damping behavior into compact models, while EDA Linker seamlessly links IntelliSuite to other leading EDA tools.
  • 9.
  • 10.
    Schematic Capture Parallelized Multiphysics Synthesis Yield Engineering Link to other tools Design Exploration Engine Schematic to mask DfM Automatic meshing Optimization Mechanics Schematic to 3D Process Corner studies Derive process flow Design for Electrostatics Schematic to mesh Yield prediction Link to ModeFrontier™, manufacture Damping/Dissipation Phoenix Integration Piezo and other optimization Mixed Signal tools Control Systems 1000X faster than FEA
  • 11.
    Seamless design flow Synple enables schematic based MEMS design capture, design exploration, optimization and system synthesis. Unlike other tools which give you a warmed over electrical circuit editor, Synple features a sophisticated schematic editor designed specifically for MEMS and Multiphysics modeling. Elements can be wired using a multiphysics bus which carries mechanical, electrical, fluidic and temperature signals across elements. A massively parallel, multi-physics computation engine allows you to perform sophisticated coupled mechanical, electrostatic, fluidic, piezo, analysis along with analog and mixed signal circuit elements (such as transistors, amplifiers, logic, etc) and control elements (such as PID, Sigma-Delta, sliding-mode etc). Synple allows you to optimize your design, explore manufacturability issues and quickly converge upon a robust design for manufacturing.
  • 12.
    Multiphysics analysis Compute time: 4 hr (Full 3D) vs 30s (compact) Schematic based behavioral modeling Synple places a large array of common MEMS design elements such as straight and curved beams, joints, elastic and rigid plates, frames of references, electrostatic actuating and sensing mechanisms to quickly wire up a complex device in minutes. Compact modeling allows you analyze coupled thermo-electro-mechanical and fluid-structure interaction problems in seconds. Monte Carlo based process variation analysis
  • 13.
    3D result visualization 3DVisualization of Schematic Results Synple connects to WaveRunner our advanced waveform tool for MEMS, Analog Mode 1: In Phase and Mixed Signal analysis. In addition, Synple also connects to VisualEase, IntelliSense’s easy to use 3D result analysis tool. Analysis results can be viewed in 3D so that complex motions can be easily visualized. Mode 2: Anti Phase
  • 14.
    Automated layout synthesis Attention to detail. Synple features advanced MEMS placement algorithms to convert schematics into fab-ready layouts. Real world details such as stress relief curves, dimples, bumpers, etch compensation features are automatically generated saving you hours of tedious grunt work. Stress relief curves Dimples Comb Etch compensation bumpers features
  • 15.
    Process, 3D andmesh synthesis Take the pain out of meshing Synple’s synthesis routines can convert the schematic into a process flow that can be used as a basis for your fabrication. In addition, Synple now integrates our popular HEXPRESSO™ hex meshing tool, automatically converting your schematics into a high-fidelity pure Hexahedral meshes that can be used in Multiphysics analysis.
  • 17.
    Physical design &verification
  • 18.
    Design capture Design Rule Check Layout visualization Hexpresso Layout optimized for MEMS Tape Out DRC Editor Cross section drawing Automated HEX mesher AutoCAD™ like interface Powerful hierarchical DRC 3D Visualization of layout 1 click Mask to Mesh Large design library All angle support Hierarchy support Easy Error Navigator Smart Layers Pathfinders Scripting
  • 19.
  • 20.
    AutoCAD™ like interfacemakes Blueprint a familiar to new users. Every element of Blueprint from menus to toolbars to keyboard accelerators can be customized to make the interface your own. Layer, view and cell management tools make navigating complex layouts a breeze. Mask Courtesy: Matthew Last, BSAC Built in scripting support allows you to automate the creation of complex geometries without breaking a sweat. Mask Courtesy: Prof Tim Dallas,Texas Tech Univ
  • 21.
    Layout to TapeOut Blueprint is an all-in-one tool for physical design and verification of MEMS. Blueprint features a layout editor designed for MEMS. An AutoCAD like interface and command line will put most engineers at ease with a feature laden interface. Blueprint integrates a number of technologies that go beyond pure layout. For instance, an integrated cross sectioning tool allows you to examine the process cross section along any line segment. Similarly, built in HEXPRESSO™ support can create pure hexahedral meshes based upon mask layout and process flow. Blueprint also links to TapeOut™, IntelliSense powerful all angle Design Rule Check (DRC) engine to verify your layouts. TapeOut & ErrorNav Blueprint now features a multi-threaded, all angle DRC engine to allow you to verify your designs. An easy to use Error Navigator allows you to identiy and fix errors
  • 22.
    Mesh morphing One click meshing Create parametric meshes that can morph Use our robust Hexpresso™ engine to across design parameters such as film go from mask to mesh based upon a thickness, electrostatic gaps, sidewall angle process sequence. Hexpresso allows and skew, line width offsets without need you automatically refine flexures and for remeshing other high stress areas, account for process flow and process variations .
  • 23.
  • 25.
  • 26.
    Process capture Material databases Process simulation Hexpresso Develop process traveller Process correlated databases FABViewer: Flow visualization Automated HEX mesher Debug traveller Material properties AnisE - Anisotropic etching 1 click Mask to Mesh Create process databases IntelliEtch - ab initio etching RECIPE - RIE/ICP etch simulator
  • 27.
    Process traveller based virtualprototyping IntelliFAB™ allows you to create and debug your process flow and your mask set before you enter the clean room. It allows you to make virtual prototypes to save costly fabrication mistakes. Use IntelliFAB to • Debug your process traveller • Visualize your process flow • Create accurate device models • Automatically mesh your devices • Share process flows across the organization • Capture process knowledge • Create devices based on foundry templates
  • 28.
    Simulate complex MEMSprocess flows CleanRoom tools allow you to prototype complex process flows. A process flow that combines multi-step mask transfers, oxide and nitride layers, sacrificial layer deposition and wet etching and DRIE processes is shown above. Composite processes, Shikida Mitsuhiro, J. Micromech. Microeng. 14
  • 29.
    56 um 56.89 um 50 min 51.27 min Measured vs modeled CleanRoom 110 um 110.93 um simulation tools 100 min 95.27 min are rigorously benchmarked against process studies to ensure first time right design. 166 um 166.40 um 150 min 139.62 min 225 um 200 min 226.13 um 190.44 min
  • 30.
    Experimental verification. A RECIPE etch profile (right) is compared with an SEM. A 5µm trench was sequentially etched using a etch/polymerization configuration of 7s/7s, 9s/ 7s and 5s/7s, each for 5 minutes Progression of an etch featuring three processes: 1. Isotropic RIE to create a wine bowl 2. Bosch etch (DRIE) to create the wine stem and 3 Isotropic RIE to smooth the scalloping and improve sidewall coverage. Inset shows the detail of the sidewall scalloping.
  • 31.
    Bosch etch +XeF2isotropic release Bosch etch +XeF2 isotropic release Deep silicon process debug Bosch etch +XeF2 isotropic release Unreleased areas Unreleased sections Simulate representative area Process Debug: RECIPE-3D allows you to fine tune your deep silicon based process flows before entering the fab. In the above example a comb based Released structure Released sections device is fabricated using the SCREAM process (Single Crystal Reactive Etching and Metallization). The results show areas that are unreleased after the etch (top) and released areas (bottom), indicating that the layout will need some tweaks before entering the fab.
  • 33.
  • 34.
    Fastfield Multiphysics Fully coupled Specialized engines Extraction Unique FEM-BEM formulation Thermal BioMEMS Multiphysics capture 64 bit multi-processor enabled Electrostatics High frequency EMag Efficient for 5-10X faster than pure FEM Mechanical verification Fluidics Lagrangian models Contact physics 1000X more efficient Piezo than FEA Magnetostatics
  • 35.
    It all fitstogether The Thermo-Electro-Mechanical (TEM) analysis module allows you to perform fully coupled thermal, electrical and electrostatic, magnetostatic, fluidic and mechanical analysis. TEM allows you to perform fully coupled static, dynamic, harmonic, transient, contact and post- contact analyses on linear or non-linear systems. Use TEM for analyzing a wide range of devices based on electrostatic, thermal, piezo, electromagnetic or electrothermal principles. TEM incorporates many custom MEMS algorithms that are unmatched by other tools. • Full dynamics capability • State of the art multi-pole accelerated Boundary Element field calculations are 100X faster than comparable FEA tools on the market • Integrated Fluid Structure Interaction (FSI) for electromechanical, piezoelectric and fast damping extraction calculations
  • 36.
    Rotary ring gyro Draper vibratory gyro Lockheed inertial device Raytheon/TI RF switch Rate/Coriolis analysis Electrostatic drive Squeeze film analysis Non-linear contact analysis Hitachi NASA Corning NASA RF Tunable Filter Adaptive optics 3D Optical cross connect Radiation detectors
  • 37.
    Fastfield technology nowsupports fully coupled fluid structure interaction (FSI) for electromechanical, piezoelectric and damping (frequency domain) calculations. FSI capability has been widely tested in a number of applications ranging from piezo-pumps to microphone condensers to a variety of MEMS structures. PZT actuated membrane Outlet Microphone condenser Pressure distribution Inlet Flow chamber Flow evolution in a piezoelectric membrane micro pump
  • 38.
    Fast Impedance Extraction Phase ripplein a BAW device Multi-processor BAW/SAW simulation Fast impedance and phase ripple calculations are now a cinch in IntelliSuite
  • 39.
    COUPLED ELECTROSTATIC-MECHANICAL-CONTACT PHYSICS &HIGH FREQUENCY (RF) ELECTROMAGNETICS IntelliSuite ships with a new full 3D FEM based ElectroMagnetics engine optimized for RF MEMS simulation. The Electromagnetics engine is coupled with ThermoElectroMechnaical (TEM) analysis capabilities. FullWave ElectroMagnetic analysis of electro-mechanically deformed structures can be seamlessly simulated for the first time within a single software. In addition, IntelliSuite ships with several other unique features that allow you to explore phenomenon such as dynamic closure of switches including simulating switch bounce.
  • 40.
    Client Agilent Inc ApplicationDetector chip Analysis Package Thermo-mechanical analysis Client Corning Inc Application Fiber optic switching Warpage due to packaging Analysis Full board level packaging analysis 256x256 micro-mirror array Fiber block integration Temperature distribution Final device Final Boards with warpage Stress contours Board deformation Deflection of the mirrors reduction mechanism Wrap it up! IntelliSuite includes comprehensive packaging analysis. Stresses, CTE mismatches, shock effects, effects of packaging pressure on device damping, parasitic effects and high frequency electromagnetic effects can all be modeled with ease.
  • 41.
    Package and boardlevel analyses IntelliSuite simplifies the packaging of MEMS devices, reducing the cost of packaging development. The tools you need to perform die level and board level packaging analyses come standard with IntelliSuite. IntelliSuite solves most complex packaging problems involving linear and non-linear, static, frequency, and dynamic behavior. Stress, strain and warpage calculations, thermal-electrical (joule heating), vibrational analysis including shock testing, damping analysis can all be performed with ease. Our new package model extraction allows you to model the impact of package stresses at a system level, allowing you to compensate package induced effects in electronics. This allows you to perform JEDEC, MIL STD, or Belcore tests on packaged devices before costly device fabrication.
  • 42.
    Microfluidics and BioMEMSanalysis We created a full 3D Navier-Stokes solver optimized for microfluidic applications from the ground up. Simultaneously, we went way beyond the existing code bases by adding support for electrokinetic phenomena, Red- Ox reactions, acids, bases, ampholytes and fluid structure interaction. An optimized ElectroWetting on Dielectric (EWOD) engine allows you to quickly simulate droplet transport, merging and splitting. We then added advanced visualization algorithms to look at cross-sectional profiles, velocity vectors, streamlines and transient results. Our code base is not only faster at solving microfludics problems but is the only MEMS tool for problems from ranging from high frequency dielectrophoresis to isoelectric focusing to electro-osmotically enhanced flow. Discover why top BioMEMS companies are choosing the IntelliSense solution.
  • 43.
    Membrane Inlet Micro-mixing in a valve Flow mixing Fluid Structure Interaction Flow separation device Concentration gradient evolution Y combiner Inlet flow - membrane interaction Microfluidics• Electrokinetics • Transport stochiometry • Heat transfer • Electro-Wetting on Dielectric (EWOD) • Digital droplet microfluidics • Free Surface Flow • Fluid Structure Interaction • Electrochemistry Micro-mixing • Electrophoresis • Dielectrophoresis • Capillary flow and electro-separation Electro-osmosis • Electro-hydrodynamics • Micro-pumps Electrokinetics Electro-osmotic driven flow Electrophoresis/Dielectrophoresis Free surface flow Multiplex focusing Electrohydrodynamics for cooling High Frequency Waste separation Slide coater
  • 44.
    High frequency electromagneticanalysis The IntelliSuite electromagnetic analysis module is specifically designed to address the needs of researchers in RF MEMS, microwave, and Optical MEMS by providing fast, accurate, cost-effective solutions for high frequency electromagnetic phenomena. The Electromagnetics module is the only fully integrated high frequency solver available for MEMS simulation. Traditional high frequency tools are designed for planar or quasi-planar structures, not for the high aspect ratio structures of MEMS. These tools also fail badly when it comes to highly resonant mechanical structures. Additionally, we removed more limitations found in most other high frequency tools by adding support for lossy conductors and dielectric discontinuities. Best of all, it tightly integrates with the IntelliSuite environment, providing you with all the tools for your MEMS needs!
  • 45.
    Create and modelcomplex geometries such as vias and through feeds with ease.While IntelliSense’s multi-pole accelerated impedance extraction algorithms will rapidly compute critical parameters. IntelliSuite is the only tool on the market that allows you to perform coupled Thermo- Electro-Mechanical & Full Wave ElectroMagnetic analyses— this is particularly useful in designing deformable RF-MEMS such as switches, tunable capacitors and varactors.
  • 47.
  • 48.
    System model extractor(SME) IntelliSense introduces SME for dramatically reducing the computational time to perform accurate dynamic analysis of MEMS. Based upon sub-space model reduction and energy based algorithms, very large non-linear thermo-electromechanical, electrothermal, piezoelectric or piezoresistive FEM models can be reduced into computationally efficient behavioral models. These behavioral models fully capture the complex non-linear dynamics inherent in MEMS due to electrostatic forces, electrothermal and residual stresses, squeeze film damping, and multiple mechanical degrees of freedom. IntelliSuite is the only tool that gives you the freedom to create arbitrary degree of freedom compact models. These n-DOF 3D models fully capture all of the harmonic modes of the MEMS enabling you to quickly develop readout or control electronics.
  • 49.
    SME allows youto create 3D macro models that accurately capture the dynamic response of MEMS 100-1000x faster than equivalent FEA simulations.The response of a clamped beam driven at 50 kHz (above) and at 3 MHz (left) accurately captures the beam motion.
  • 50.
    Capture strain energy Capture electrostatic energy Capture fluid damping associated with each mode associated with each mode characteristics Arnoldi/Krylov First mode sub-space reduction HDL HDL formulation Hardware Second mode Description N-DOF behavioral model based on Lagrangian formulation d # "L & "L % () =0 dt % "q j ( "q j $ ' Third mode ! ❶ Capture total energy of relevant mode ❷ Krylov/Arnoldi subspace ❸ Create Lookup table based fast (Mechanical, Electrostatic, Fluidic, methods to generate Compact model for Dissipation) and modal interactions Lagrangian formulation system modeling
  • 51.
    Extraction algorithms cannow capture modal fluid damping, package, and temperature related effects. Modal fluid damping is extracted in the frequency domain to accurately capture variation of fluid film force and damping components with operating frequency. Package warpage and temperature coefficient releated effects are also captured and included in system models.
  • 52.
    EDA-Linker — IntegrateMEMS + ASIC design flows Seamless integration with your preferred EDA Workflow EDA Linker allows you to incorporate IntelliSuite directly into your EDA workflow. Whether you are using a Cadence, Mentor, Synopsys, Matlab or Tanner environment, or a mixed tool environment IntelliSuite will fit right in. EDA Linker allows you to co-simulate your micro- devices along with the electronics in your favorite mixed signal or system level environment. Automated code generation Users can easily convert complex electro-mechanical devices such as gyroscopes, resonators, switches etc into an equivalent hardware description language with the click of a button. EDA Linker supports, VHDL- AMS, Verilog-A, HSPICE, PSPICE, Simulink MEX based flows.
  • 53.
    Open standards basedexchange Physical layout GDS, DXF, CIF, GERBER, RS-247, EMK, HOLES Structural and 3D IGES, SAT, VRML, GEOM, DXF UNV, PAT, CDB, SAT (Ansoft, Ansys, ABAQUS, Patran, Analysis and mesh structure Nastran, Simulia) VERILOG-A, VHDL, PSPICE, HSPICE, SIMETRIX, System and circuit level SIMULINK (MEX), TOUCHSTONE Result files ASCII, CSV (Excel), Touchstone, PLT (Tecplot) IntelliSuite provides compatibility with many of the existing tools in your toolbox. At the physical layout level it provides seamless data exchange with L-Edit, Virtuoso, AutoCAD and other popular layout editors; at the solid model level you can exchange data with any SAT or IGES based tool such as SolidWorks, CATIA, ProE. At the analysis level you can exchange data with Abaqus, Ansys, Ansoft, Comsol, Nastran or Patran; at a mixed signal or system level you can export directly to ADS, Ansoft, Cadence, Mentor, Mathworks Simulink, Synopsys or Tanner based workflows. Additionally, all result files can be visualized in any Tecplot compatible tool.
  • 55.
  • 57.
    Engineering services Design services IntelliSensehas a strong background in offering design services for MEMS. In fact, we have been involved in many a MEMS program since 1991. IntelliSense offers a wide range of design services ranging from traditional work for hire to specialized IP development. Turnkey MEMS fabrication services IntelliSense operates as a fabless MEMS company and offers design/prototyping/ manufacturing, IP licensing and consulting services. IntelliSense has formed strong affiliations with established MEMS foundries and research institutions throughout the United States and the world. Our partnerships across the value chain allow IntelliSense to prototype and transfer MEMS based components into production at the lowest cost. Consulting services Although we are extremely discrete about our clientele you will find that we have worked with the top names in the world. We have tackled some of the most challenging MEMS problems over the years. Be it solving manufacturability issues or process technology recommendations we are ready to take on your problem.
  • 58.
    Microsensors RF MEMS Microfluidics Optical MEMS
  • 59.
    Design to Device together. That is why Reducing risk IntelliSense has formed Our strategic partnerships Services strategic partnerships with the gives you access to the right leading MEMS foundries. vendor for the right job. By Prototype development, Supply chain management working with several vendors, including packaging and test, is we closely keep track of their IntelliSense has formed strong done with these partners. Pilot- evolving expertise and affiliations with established line manufacturing can be competence in different areas. MEMS foundries and research completed with these local This allows us to put together institutions throughout the foundries as well. To reduce the right partnerships to get United States and the world. cost, higher volume your devices to market Our partnerships through out manufacturing can be done in quicker. the value chain allow our overseas partners’ facilities. IntelliSense to prototype and We can help you drive down transfer MEMS based MEMS, BioMEMS and opto- components into production at electronic packaging costs, the lowest cost. reduce your risk in the Prototype to manufacturing development cycle, and smooth the path through pilot It is important for custom scale to high-volume MEMS design that design and process development manufacturing. engineers work closely
  • 60.
    ASIA + AMERICAS China India Japan IntelliSense China BigTec, Bangalore ADTECH, Tokyo Tel: +86 25-83478765 Tel: +91 80 4107 0138 Tel: +81-3-5464-2971 Fax: +86 25-8471 9905 E-mail: guru@bigtec.org E-mail: info@ad-tech.co.jp Web: www.intellisense.com.cn E-mail:china@intellisense.com Middle East Korea Malaysia SSV-Co UIT Solutions Inc, Seoul Trans-Dist Tel: +966 -1- 4766 036 Tel: + 82-2-587-2303 Tel: + 60 6(03) 8888-9908 Web: www.ssv.com.sa E-mail: uitinc@uitsolutions.com Fax: + 60 6(03) 8888-9909 E-mail: alkhusheiny@gmail.com E-mail: mandy@transdist..com Singapore Taiwan North and South America including the United States E•Mation Technologies, Singapore Avant Technology, Hsinchu Tel: +65-68586882 Tel: +886-3-5160188 IntelliSense Head Quarters, E-mail:emation@singnet.com.sg E-mail: sales@avant.com.tw Boston Tel: +1 781 933 8098 E-mail: sales@intellisense.com
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    EUROPE Austria Belgium, The Netherlands, Denmark, France Sweden, Norway, Denmark, Italy and UNIDOST Spain MMSolutions, Paris Tel: +43 664 3133223 Tel: +33 1 42965379 Fax: +43 1 9716164 PhoenixBV, Enschede Guy Debruyne E-mail: info@unidost.com Phone: +31 (0)53 483 64 60 <guy.debruyne@club-internet.fr> E-mail: info@phoenixbv.com Germany Israel Turkey MMSolutions, Germany WaldyTech Ltd. UNIDOST, Istanbul Tel: +49 6340 9191 34 Tel: + 972 9 9573649 Tel: +90 216 4141958 Kai Dehrmann Fax: +972 9 9576231 Fax: +90 216 3368923 <kai@mmsolutions.com> E-mail: walter_d@waldytech.com E-mail: info@unidost.com UNIVERSITY & EDUCATIONAL SALES UK Europractice Software Service MMSolutions, UK Rutherford Appleton Labs United Kingdom Tel: +44 (0)1235 44 5327 Tel: +44 1628 488649 E-mail: enquiries@msc.rl.ac.uk Email: info@mmsolutions.com
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    Total MEMS Solutions Intel IntelliSense ignited the MEMS industry in the early 1990s with its IntelliSuite® family of innovative CAD/EDA tools — and is now the leading innovator and supplier of design and development solutions for the MEMS professional. With users in more than 30 countries, IntelliSense offers software tools and custom design, consulting and market research services to universities, blue-chip companies and start-ups worldwide. What's more, IntelliSense has formed strong affiliations with dozens of leading MEMS foundries and research institutes worldwide, which allow us to prototype and transfer MEMS-based components into production at the lowest cost. As a fabless MEMS company, IntelliSense also offers design, IP licensing and consulting services.
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