MEMS Extraction & Verification

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❶ Capture total energy of relevant mode (Mechanical, Electrostatic, Dissipation) ❷ Krylov/Arnoldi methods to generate Lagrangian formulation ❸ Create Compact model for system modeling

What is extraction?
Simplifying a full 3D model into behavioral model
Convert FEA/BEA model (large DOFs) into computationally eﬃcient model

Develop pre-computed energy based model that captures multiphysics

What is extracted ?
Mechanical Strain Energy of Modes of Interest (Including stress and stress gradient eﬀects)

Capacitive energy

Thermal eﬀects (deformation due to temperature change)

Fluidic Structure Interaction (due to compressive or non-compressive media)

Other dissipation sources (thermoelastic damping (v8.6.1) and anchor acoustic losses (v8.6.2))

System Model Extraction (SME)
Capture strain energy Capture electrostatic energy Capture fluid damping
associated with each mode associated with each mode characteristics

Arnoldi/Krylov
First mode sub-space Compact
reduction Representation

HDL
HDL formulation

Second mode
Hardware
N-DOF behavioral model Description
based on Lagrangian
formulation

d # "L & "L
% () =0
dt % "q j ( "q j
$ '
Third mode

!

❶ Capture total energy of relevant mode ❷ Krylov/Arnoldi methods to ❸ Create Compact model for
(Mechanical, Electrostatic, Dissipation) generate Lagrangian formulation system modeling

System model extraction (SME) ﬂow chart

/ SPICE OR OTHER EDA TOOL

Summary: Convert problem from Newtonian (inertia based) to more eﬃcient Lagrangian domain (energy based)

SME advantages

• Automated full • 3D MEMS system
multi-physics simulation
capture
• Device and package
• 1000 X faster than level extraction
pure FEA
• Automated VHDL/
• Matches FEA to Verilog/ SPICE
within 1% accuracy generation

• Fully capture
harmonic responses

EDA Linker capabilities (compatibility)

Create accurate N-DOF dynamic system model
from MEMS FEA/BEA model

Output system model into SPICE, HDL, and
Simulink formats

Compatible with EDA tools from Cadence,
Mathworks, Mentor, Synopsys and Tanner

Integrated CMOS-MEMS (SoC/SiP) compatibility

Integrated design ﬂow for MEMS + IC
Device/System Design Exploration
1 Design of Experiments
(SYNPLE/IntelliSuite)

Final MEMS Device design
2
(Multiphysics)

MEMS-CMOS integration
N-DOF Lagrangian design flow can be based on :
3 System Model Extraction
(IntelliSuite) √ VHDL-AMS
√ Verilog-A
Transistor level design √ SPICE netlist
4 (SPICE/SYNPLE or other EDA tools)
√ Matlab/Simulink .MEX

Gate level
5 Place and route, DRC, LVS
(Cadence/Synopsys/Mentor/ViewLogic/Tanner etc)

6
Final Layout
(IntelliMask Pro/ L-Edit/ Virtuoso/other)

What is veriﬁcation?

Model veriﬁcation (Schematic vs 3D)
Verify schematic model and 3D model match

Ensure MEMS model used in circuit development is accurate

Physical veriﬁcation (‘Tape Out’)
Verify physical layout is consistent with Design Rules

Ensure design meets manufacturability criteria

Static model veriﬁcation

0.200
Extracted 3D

-0.200

-0.600

-1.000

-1.400

-1.800
0 2 4 6 8 10 12
Pull-in: Schematic results vs Full 3D results

Damping model veriﬁcation

Perforated condenser membrane

Full 3D (TEM) vs Macromodel comparison

Full capture of ﬂuidic damping and spring force

Dynamic model veriﬁcation

Transient response of device: Schematic vs FEA (3D)

Easy error navigation

all angle support

intuitive error markings
Tape Out
Physical veriﬁcation

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cloudSME

Presented at NAFEMS DACH regional conference for numerical simulation methods by LCM and cloudSME in Wiesbaden on the 14th of November 2019. The Linz Center of Mechatronics GmbH showcased how they easily optimize electrical drive engines in the cloud. We supported LCM to work out the right cloud-based service solutions for their customers based on their existing software. By respecting the latest developments in the industry and science, including security and privacy compliance and hosting flexibility (free choice of data centre, no vendor lock-in). Check out their cool System Model Space "SyMSpace" for electrical drive engines and trusted by industrial partners! (https://bit.ly/2CKGphb) #poweredbycloudSME Yes, Cloud Computing is offering a broad range of actions and can be confusing. You want to dig deeper? Write us an email or give us a call so that we can work out how to approach the perfect cloud solution for your needs.

My Postdoctoral Research

Po-Ting Wu

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MEMS Extraction & Verification

1. MEMS Extraction & veriﬁcation

2. What is extraction? Simplifying a full 3D model into behavioral model Convert FEA/BEA model (large DOFs) into computationally efficient model Develop pre-computed energy based model that captures multiphysics What is extracted ? Mechanical Strain Energy of Modes of Interest (Including stress and stress gradient effects) Capacitive energy Thermal effects (deformation due to temperature change) Fluidic Structure Interaction (due to compressive or non-compressive media) Other dissipation sources (thermoelastic damping (v8.6.1) and anchor acoustic losses (v8.6.2))

3. System Model Extraction (SME) Capture strain energy Capture electrostatic energy Capture fluid damping associated with each mode associated with each mode characteristics Arnoldi/Krylov First mode sub-space Compact reduction Representation HDL HDL formulation Second mode Hardware N-DOF behavioral model Description based on Lagrangian formulation d # "L & "L % () =0 dt % "q j ( "q j $ ' Third mode ! ❶ Capture total energy of relevant mode ❷ Krylov/Arnoldi methods to ❸ Create Compact model for (Mechanical, Electrostatic, Dissipation) generate Lagrangian formulation system modeling

4. System model extraction (SME) ﬂow chart / SPICE OR OTHER EDA TOOL Summary: Convert problem from Newtonian (inertia based) to more eﬃcient Lagrangian domain (energy based)

5. SME advantages • Automated full • 3D MEMS system multi-physics simulation capture • Device and package • 1000 X faster than level extraction pure FEA • Automated VHDL/ • Matches FEA to Verilog/ SPICE within 1% accuracy generation • Fully capture harmonic responses

6. EDA Linker capabilities (compatibility) Create accurate N-DOF dynamic system model from MEMS FEA/BEA model Output system model into SPICE, HDL, and Simulink formats Compatible with EDA tools from Cadence, Mathworks, Mentor, Synopsys and Tanner Integrated CMOS-MEMS (SoC/SiP) compatibility

7. Integrated design ﬂow for MEMS + IC Device/System Design Exploration 1 Design of Experiments (SYNPLE/IntelliSuite) Final MEMS Device design 2 (Multiphysics) MEMS-CMOS integration N-DOF Lagrangian design flow can be based on : 3 System Model Extraction (IntelliSuite) √ VHDL-AMS √ Verilog-A Transistor level design √ SPICE netlist 4 (SPICE/SYNPLE or other EDA tools) √ Matlab/Simulink .MEX Gate level 5 Place and route, DRC, LVS (Cadence/Synopsys/Mentor/ViewLogic/Tanner etc) 6 Final Layout (IntelliMask Pro/ L-Edit/ Virtuoso/other)

8. What is verification? Model verification (Schematic vs 3D) Verify schematic model and 3D model match Ensure MEMS model used in circuit development is accurate Physical verification (‘Tape Out’) Verify physical layout is consistent with Design Rules Ensure design meets manufacturability criteria

9. Static model veriﬁcation 0.200 Extracted 3D -0.200 -0.600 -1.000 -1.400 -1.800 0 2 4 6 8 10 12 Pull-in: Schematic results vs Full 3D results

10. Damping model veriﬁcation Perforated condenser membrane Full 3D (TEM) vs Macromodel comparison Full capture of ﬂuidic damping and spring force

11. Dynamic model veriﬁcation Transient response of device: Schematic vs FEA (3D)

12. Easy error navigation all angle support intuitive error markings Tape Out Physical veriﬁcation

MEMS Extraction & Verification

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