SlideShare a Scribd company logo
Device Modeling Report



COMPONENTS: Power MOSFET (Model Parameter)
PART NUMBER: TPC8026
MANUFACTURER: TOSHIBA
Body Diode (Model Parameter)




                  Bee Technologies Inc.




    All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
Circuit Configuration




MOSFET MODEL

Pspice model
                                        Model description
 parameter
  LEVEL
      L        Channel Length
     W         Channel Width
     KP        Transconductance
     RS        Source Ohmic Resistance
     RD        Ohmic Drain Resistance
    VTO        Zero-bias Threshold Voltage
    RDS        Drain-Source Shunt Resistance
    TOX        Gate Oxide Thickness
   CGSO        Zero-bias Gate-Source Capacitance
   CGDO        Zero-bias Gate-Drain Capacitance
    CBD        Zero-bias Bulk-Drain Junction Capacitance
     MJ        Bulk Junction Grading Coefficient
     PB        Bulk Junction Potential
     FC        Bulk Junction Forward-bias Capacitance Coefficient
     RG        Gate Ohmic Resistance
     IS        Bulk Junction Saturation Current
      N        Bulk Junction Emission Coefficient
     RB        Bulk Series Resistance
    PHI        Surface Inversion Potential
  GAMMA        Body-effect Parameter
   DELTA       Width effect on Threshold Voltage
    ETA        Static Feedback on Threshold Voltage
  THETA        Modility Modulation
  KAPPA        Saturation Field Factor
   VMAX        Maximum Drift Velocity of Carriers
     XJ        Metallurgical Junction Depth
     UO        Surface Mobility

            All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
Transconductance Characteristic

Circuit Simulation Result

            50
                            Measurement
                            Simulation


            40




            30
     gfs




            20




            10




             0
                 0.0      1.0    2.0     3.0     4.0     5.0    6.0   7.0   8.0   9.0     10.0
                                               ID : Drain Current A


Comparison table

           Id(A)                                   gfs                                  Error(%)

                                Measurement                    Simulation

             0.100                          3.500                      3.334                     -4.743
             0.200                          5.200                      5.000                     -3.846
             0.500                          8.700                      8.929                      2.632
             1.000                         12.300                     12.500                      1.626
             2.000                         17.345                     17.544                      1.147
             5.000                         24.500                     24.038                     -1.886
            10.000                         33.000                     33.113                      0.342




                       All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
Vgs-Id Characteristic

Circuit Simulation result

          10A




         1.0A




        100mA




         10mA
            1.0V    1.5V     2.0V   2.5V     3.0V      3.5V     4.0V       4.5V   5.0V
                I(V3)
                                             V_V2


Evaluation circuit


                                               V3


                                                      0Vdc

                                            U2
                                            TPC8026


                                                              Vv ariable


                     10Vdc                                    10Vdc



                     V2



                                      0




                All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
Comparison Graph

Circuit Simulation Result

                                  10.00
                                                  Measurement
                                                  Simulation




                                   1.00
           ID : Drain Current A




                                   0.10




                                   0.01
                                          1.0             2.0               3.0             4.0      5.0
                                                               VGS : Gate to Source Voltage V


Simulation Result


        ID(A)                                                     VGS(V)                          Error (%)
                                                Measurement                  Simulation

          0.010                                                2.540                     2.560              0.787
          0.020                                                2.550                     2.573              0.902
          0.050                                                2.563                     2.580              0.663
          0.100                                                2.610                     2.602             -0.326
          0.200                                                2.630                     2.625             -0.186
          0.500                                                2.652                     2.672              0.765
          1.000                                                2.710                     2.725              0.557
          2.000                                                2.780                     2.800              0.719
          5.000                                                3.000                     2.950             -1.680
         10.000                                                3.100                     3.120              0.639



                                   All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
Rds(on) Characteristic

Circuit Simulation result

         10A


          9A


          8A


          7A


          6A


          5A


          4A


          3A


          2A


          1A


          0A
               0V       10mV      20mV    30mV   40mV       50mV          60mV      70mV   80mV
                    I(V3)
                                                 V_VDS

Evaluation circuit

                                                          V3


                                                                   0Vdc

                                                         U2
                                                         TPC8026


                                                                             VDS


                          10Vdc                                              0Vdc



                          VGS



                                                 0



Simulation Result

      ID=6.5A, VGS=10V                   Measurement                 Simulation               Error (%)
         R DS (on) ()                               0.0051                      0.00505          -0.980



                    All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
Gate Charge Characteristic
Circuit Simulation result
            20V




            16V




            12V




             8V




             4V




             0V
                  0       10n          20n          30n       40n      50n            60n      70n
                      V(W1:3)
                                                        Time*1mS

Evaluation circuit

                                                                              V2


                                                                                    0Vdc

                                                                    U2
                                                                    TPC8026


                                                                                      Dbreak

                  PER = 1000u                                                          D1
                  PW = 600u              W1                                                    I2
                  TF = 10n                 +                                                   13Adc
                  TR = 10n
                                           -
                  TD = 0
                  I2 = 1m                W
                                I1   IOFF = 0.1mA
                  I1 = 0             ION = 0uA                                                 V1
                                                                                               24Vdc



                                                    0



Simulation Result

        VDD=24V,ID=13A                 Measurement                  Simulation                  Error (%)
           ,VGS=10V
                 Qgs(nc)                             6.500                          6.487               -0.200
                Qgd(nc)                             14.000                         14.030                0.214
                  Qg(nc)                            42.000                         33.793              -19.540


                  All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
Capacitance Characteristic


                                                    Measurement
                                                    Simulation




Simulation Result


           VDS(V)                     Cbd(pF)                       Error(%)
                          Measurement          Simulation

                    0.1              640                   646            0.940
                    0.2              630                   628           -0.320
                    0.5              580                   575           -0.860
                      1              510                   510            0.000
                      2              420                   422            0.480
                      5              290                   292            0.690
                    10               200                   203            1.500
                    20               140                   137           -2.140




              All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
Switching Time Characteristic

Circuit Simulation result

           20V




           15V




           10V




            5V




            0V
            1.85us        1.95us          2.05us          2.15us       2.25us       2.35us
                 V(2)*1.5    V(3)
                                                   Time


Evaluation circuit

                                                                   3      L2

                                                                          50n

                                                                   U2
                                                                   TPC8026
                                                                                              RL
                                                                                              2.3
                             R1           L1       2


            V1 = 0           4.7          30nH                                             VDD
            V2 = 20     V2                                                      15Vdc
            TD = 2u                 R2
            TR = 6n
            TF = 7n                 4.7
            PW = 2u
            PER = 10u

                                                                                          0



Simulation Result

        ID=6.5A, VDD=15V            Measurement               Simulation                Error(%)
            VGS=10V
             Ton(ns)                             28.000            28.074                      0.264


                 All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
Output Characteristic

Circuit Simulation result

        50A
                                                                                4



        40A

                                                                                              3.8


        30A

                                                                                              3.6


        20A


                                                                                              3.4
                                                                                              3.3
        10A
                                                                                              3.2
                                                                                              3.1
                                                                                      VGS= 3 V
         0A
              0V      0.2V  0.4V    0.6V   0.8V     1.0V      1.2V     1.4V         1.6V   1.8V 2.0V
                   I(Vdsense)
                                                 V_Vvariable



Evaluation circuit



                                                           Vdsense


                                                                0Vdc

                                                    U2
                                                    TPC8026

                                                                       Vv ariable


                                                                       0Vdc
                        10Vdc



                        Vstep



                                             0




                    All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
BODY DIODE SPICE MODEL

Forward Current Characteristic

Circuit Simulation Result

        10A




       1.0A




      100mA




       10mA
              0V           0.2V         0.4V      0.6V       0.8V        1.0V      1.2V
                   I(R1)
                                                  V_V1

Evaluation Circuit


                                       R1


                                       0.01m


                                  V1
                           0Vdc                               TPC8026
                                                              U2




                                  0




                    All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
Comparison Graph

Circuit Simulation Result

                                        10.00
                                                    Measurement
                                                    Simulation
         Drain reverse current IDR(A)




                                         1.00




                                         0.10




                                         0.01
                                                0     0.2        0.4    0.6       0.8       1       1.2

                                                            Source: Drain voltage VSD(V)


Simulation Result


       IDR(A)                                         VDS(V)                    VDS(V)                %Error
                                                    Measurement                Simulation
                                    0.010                    0.480                      0.497              3.542
                                    0.020                    0.499                      0.506              1.403
                                    0.050                    0.510                      0.520              1.961
                                    0.100                    0.525                      0.530              0.952
                                    0.200                    0.548                      0.543             -0.912
                                    0.500                    0.572                      0.568             -0.699
                                    1.000                    0.614                      0.600             -2.280
                                    2.000                    0.661                      0.655             -0.908
                                    5.000                    0.798                      0.809              1.378
                                   10.000                    1.080                      1.060             -1.852



                                           All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
Reverse Recovery Characteristic

Circuit Simulation Result

         400mA




         200mA




            0A




        -200mA




        -400mA
           19.92us       20.00us      20.08us            20.16us    20.24us   20.32us
                I(R1)
                                                  Time

Evaluation Circuit


                                        R1


                                             50

                   V1 = -9.4v    V1
                   V2 = 10.7v
                   TD = 15n                                         TPC8026
                   TR = 10ns                                        U2
                   TF = 9ns
                   PW = 20us
                   PER = 100us



                                 0



Compare Measurement vs. Simulation

                          Measurement                     Simulation          Error (%)
        Trr(ns)                       87.200                       87.404               0.234




                 All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
Reverse Recovery Characteristic                                        Reference




Trj= 18.4 (ns)
Trb= 68.8 (ns)
Conditions:Ifwd=lrev=0.2(A),Rl=50




                                                     Example




                               Relation between trj and trb




              All Rights Reserved Copyright (c) Bee Technologies Inc. 2007

More Related Content

What's hot

SPICE MODEL of 2SK3435 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3435 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK3435 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3435 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SK3435 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3435 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3435 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3435 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3J117TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J117TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3J117TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J117TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3K102TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K102TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K102TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K102TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3J117TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J117TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3J117TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J117TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SK2462 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2462 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK2462 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2462 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCM8003-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCM8003-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCM8003-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCM8003-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCM8002-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCM8002-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCM8002-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCM8002-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM6P54TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6P54TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM6P54TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6P54TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3K126TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K126TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K126TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K126TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC8111 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8111 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8111 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8111 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SK3906 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3906 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3906 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3906 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC8118 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8118 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8118 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8118 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3K102TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K102TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3K102TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K102TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8014-H (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of TPCA8014-H (Professional+BDSP Model) in SPICE PARKSPICE MODEL of TPCA8014-H (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of TPCA8014-H (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SJ448 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ448 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SJ448 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ448 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3J112TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J112TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3J112TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J112TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SJ495 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ495 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SJ495 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ495 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 

What's hot (20)

SPICE MODEL of 2SK3435 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3435 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK3435 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3435 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SK3435 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3435 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3435 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3435 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM3J117TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J117TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3J117TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J117TU (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3K102TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K102TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K102TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K102TU (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3J117TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J117TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3J117TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J117TU (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK2462 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2462 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK2462 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2462 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCM8003-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCM8003-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCM8003-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCM8003-H (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCM8002-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCM8002-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCM8002-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCM8002-H (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM6P54TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6P54TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM6P54TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6P54TU (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3K126TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K126TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K126TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K126TU (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPC8111 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8111 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8111 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8111 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK3906 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3906 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3906 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3906 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPC8118 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8118 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8118 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8118 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3K102TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K102TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3K102TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K102TU (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8014-H (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of TPCA8014-H (Professional+BDSP Model) in SPICE PARKSPICE MODEL of TPCA8014-H (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of TPCA8014-H (Professional+BDSP Model) in SPICE PARK
 
SPICE MODEL of 2SJ448 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ448 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SJ448 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ448 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM3J112TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J112TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3J112TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J112TU (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SJ495 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ495 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SJ495 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ495 (Standard+BDS Model) in SPICE PARK
 

Similar to SPICE MODEL of TPC8026 (Standard+BDS Model) in SPICE PARK

SPICE MODEL of 2SK2508 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK2508 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK2508 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK2508 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SK2508 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2508 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK2508 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2508 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC8117 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8117 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8117 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8117 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3K116TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K116TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K116TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K116TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCM8002-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCM8002-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCM8002-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCM8002-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8004-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8004-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8004-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8004-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3K104TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K104TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K104TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K104TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3K101TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K101TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K101TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K101TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC8A02-H (Professional+ZDSP Model) in SPICE PARK
SPICE MODEL of TPC8A02-H (Professional+ZDSP Model) in SPICE PARKSPICE MODEL of TPC8A02-H (Professional+ZDSP Model) in SPICE PARK
SPICE MODEL of TPC8A02-H (Professional+ZDSP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TK40J60T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK40J60T (Standard+BDS Model) in SPICE PARKSPICE MODEL of TK40J60T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK40J60T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM6P54TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6P54TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM6P54TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6P54TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCM8003-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCM8003-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCM8003-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCM8003-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC8029 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8029 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8029 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8029 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3J115TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J115TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3J115TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J115TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SK4108 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4108 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK4108 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4108 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SK3301 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3301 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3301 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3301 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM6L13TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6L13TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM6L13TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6L13TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC6004 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC6004 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC6004 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC6004 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC8110 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8110 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8110 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8110 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 

Similar to SPICE MODEL of TPC8026 (Standard+BDS Model) in SPICE PARK (20)

SPICE MODEL of 2SK2508 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK2508 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK2508 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK2508 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SK2508 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2508 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK2508 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2508 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPC8117 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8117 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8117 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8117 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM3K116TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K116TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K116TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K116TU (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCM8002-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCM8002-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCM8002-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCM8002-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCA8004-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8004-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8004-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8004-H (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM3K104TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K104TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K104TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K104TU (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3K101TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K101TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K101TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K101TU (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPC8A02-H (Professional+ZDSP Model) in SPICE PARK
SPICE MODEL of TPC8A02-H (Professional+ZDSP Model) in SPICE PARKSPICE MODEL of TPC8A02-H (Professional+ZDSP Model) in SPICE PARK
SPICE MODEL of TPC8A02-H (Professional+ZDSP Model) in SPICE PARK
 
SPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TK40J60T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK40J60T (Standard+BDS Model) in SPICE PARKSPICE MODEL of TK40J60T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK40J60T (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM6P54TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6P54TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM6P54TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6P54TU (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCM8003-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCM8003-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCM8003-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCM8003-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPC8029 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8029 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8029 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8029 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM3J115TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J115TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3J115TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J115TU (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SK4108 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4108 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK4108 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4108 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK3301 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3301 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3301 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3301 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM6L13TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6L13TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM6L13TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6L13TU (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPC6004 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC6004 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC6004 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC6004 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPC8110 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8110 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8110 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8110 (Standard+BDS Model) in SPICE PARK
 

More from Tsuyoshi Horigome

FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)Tsuyoshi Horigome
 
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)Tsuyoshi Horigome
 
SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )Tsuyoshi Horigome
 
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Tsuyoshi Horigome
 
SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )Tsuyoshi Horigome
 
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Tsuyoshi Horigome
 
SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )Tsuyoshi Horigome
 
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Tsuyoshi Horigome
 
SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )Tsuyoshi Horigome
 
Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)Tsuyoshi Horigome
 
Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Tsuyoshi Horigome
 
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspiceTsuyoshi Horigome
 
PSpice simulation of power supply for TI is Error
PSpice simulation of power supply  for TI is ErrorPSpice simulation of power supply  for TI is Error
PSpice simulation of power supply for TI is ErrorTsuyoshi Horigome
 
IGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintIGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintTsuyoshi Horigome
 
Electronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsElectronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsTsuyoshi Horigome
 
Electronic component sales method focused on new hires
Electronic component sales method focused on new hiresElectronic component sales method focused on new hires
Electronic component sales method focused on new hiresTsuyoshi Horigome
 
Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Tsuyoshi Horigome
 
Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Tsuyoshi Horigome
 
伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)Tsuyoshi Horigome
 
DXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモDXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモTsuyoshi Horigome
 

More from Tsuyoshi Horigome (20)

FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
 
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
 
SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )
 
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
 
SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )
 
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
 
SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )
 
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
 
SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )
 
Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)
 
Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)
 
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
 
PSpice simulation of power supply for TI is Error
PSpice simulation of power supply  for TI is ErrorPSpice simulation of power supply  for TI is Error
PSpice simulation of power supply for TI is Error
 
IGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintIGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or Rgint
 
Electronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsElectronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposals
 
Electronic component sales method focused on new hires
Electronic component sales method focused on new hiresElectronic component sales method focused on new hires
Electronic component sales method focused on new hires
 
Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)
 
Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出
 
伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)
 
DXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモDXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモ
 

Recently uploaded

AI revolution and Salesforce, Jiří Karpíšek
AI revolution and Salesforce, Jiří KarpíšekAI revolution and Salesforce, Jiří Karpíšek
AI revolution and Salesforce, Jiří KarpíšekCzechDreamin
 
Designing Great Products: The Power of Design and Leadership by Chief Designe...
Designing Great Products: The Power of Design and Leadership by Chief Designe...Designing Great Products: The Power of Design and Leadership by Chief Designe...
Designing Great Products: The Power of Design and Leadership by Chief Designe...Product School
 
Search and Society: Reimagining Information Access for Radical Futures
Search and Society: Reimagining Information Access for Radical FuturesSearch and Society: Reimagining Information Access for Radical Futures
Search and Society: Reimagining Information Access for Radical FuturesBhaskar Mitra
 
Essentials of Automations: Optimizing FME Workflows with Parameters
Essentials of Automations: Optimizing FME Workflows with ParametersEssentials of Automations: Optimizing FME Workflows with Parameters
Essentials of Automations: Optimizing FME Workflows with ParametersSafe Software
 
From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...
From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...
From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...Product School
 
From Daily Decisions to Bottom Line: Connecting Product Work to Revenue by VP...
From Daily Decisions to Bottom Line: Connecting Product Work to Revenue by VP...From Daily Decisions to Bottom Line: Connecting Product Work to Revenue by VP...
From Daily Decisions to Bottom Line: Connecting Product Work to Revenue by VP...Product School
 
SOQL 201 for Admins & Developers: Slice & Dice Your Org’s Data With Aggregate...
SOQL 201 for Admins & Developers: Slice & Dice Your Org’s Data With Aggregate...SOQL 201 for Admins & Developers: Slice & Dice Your Org’s Data With Aggregate...
SOQL 201 for Admins & Developers: Slice & Dice Your Org’s Data With Aggregate...CzechDreamin
 
In-Depth Performance Testing Guide for IT Professionals
In-Depth Performance Testing Guide for IT ProfessionalsIn-Depth Performance Testing Guide for IT Professionals
In-Depth Performance Testing Guide for IT ProfessionalsExpeed Software
 
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...Jeffrey Haguewood
 
How world-class product teams are winning in the AI era by CEO and Founder, P...
How world-class product teams are winning in the AI era by CEO and Founder, P...How world-class product teams are winning in the AI era by CEO and Founder, P...
How world-class product teams are winning in the AI era by CEO and Founder, P...Product School
 
"Impact of front-end architecture on development cost", Viktor Turskyi
"Impact of front-end architecture on development cost", Viktor Turskyi"Impact of front-end architecture on development cost", Viktor Turskyi
"Impact of front-end architecture on development cost", Viktor TurskyiFwdays
 
Empowering NextGen Mobility via Large Action Model Infrastructure (LAMI): pav...
Empowering NextGen Mobility via Large Action Model Infrastructure (LAMI): pav...Empowering NextGen Mobility via Large Action Model Infrastructure (LAMI): pav...
Empowering NextGen Mobility via Large Action Model Infrastructure (LAMI): pav...Thierry Lestable
 
UiPath Test Automation using UiPath Test Suite series, part 1
UiPath Test Automation using UiPath Test Suite series, part 1UiPath Test Automation using UiPath Test Suite series, part 1
UiPath Test Automation using UiPath Test Suite series, part 1DianaGray10
 
De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...
De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...
De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...Product School
 
Introduction to Open Source RAG and RAG Evaluation
Introduction to Open Source RAG and RAG EvaluationIntroduction to Open Source RAG and RAG Evaluation
Introduction to Open Source RAG and RAG EvaluationZilliz
 
Unpacking Value Delivery - Agile Oxford Meetup - May 2024.pptx
Unpacking Value Delivery - Agile Oxford Meetup - May 2024.pptxUnpacking Value Delivery - Agile Oxford Meetup - May 2024.pptx
Unpacking Value Delivery - Agile Oxford Meetup - May 2024.pptxDavid Michel
 
ODC, Data Fabric and Architecture User Group
ODC, Data Fabric and Architecture User GroupODC, Data Fabric and Architecture User Group
ODC, Data Fabric and Architecture User GroupCatarinaPereira64715
 
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...UiPathCommunity
 
Mission to Decommission: Importance of Decommissioning Products to Increase E...
Mission to Decommission: Importance of Decommissioning Products to Increase E...Mission to Decommission: Importance of Decommissioning Products to Increase E...
Mission to Decommission: Importance of Decommissioning Products to Increase E...Product School
 
Integrating Telephony Systems with Salesforce: Insights and Considerations, B...
Integrating Telephony Systems with Salesforce: Insights and Considerations, B...Integrating Telephony Systems with Salesforce: Insights and Considerations, B...
Integrating Telephony Systems with Salesforce: Insights and Considerations, B...CzechDreamin
 

Recently uploaded (20)

AI revolution and Salesforce, Jiří Karpíšek
AI revolution and Salesforce, Jiří KarpíšekAI revolution and Salesforce, Jiří Karpíšek
AI revolution and Salesforce, Jiří Karpíšek
 
Designing Great Products: The Power of Design and Leadership by Chief Designe...
Designing Great Products: The Power of Design and Leadership by Chief Designe...Designing Great Products: The Power of Design and Leadership by Chief Designe...
Designing Great Products: The Power of Design and Leadership by Chief Designe...
 
Search and Society: Reimagining Information Access for Radical Futures
Search and Society: Reimagining Information Access for Radical FuturesSearch and Society: Reimagining Information Access for Radical Futures
Search and Society: Reimagining Information Access for Radical Futures
 
Essentials of Automations: Optimizing FME Workflows with Parameters
Essentials of Automations: Optimizing FME Workflows with ParametersEssentials of Automations: Optimizing FME Workflows with Parameters
Essentials of Automations: Optimizing FME Workflows with Parameters
 
From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...
From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...
From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...
 
From Daily Decisions to Bottom Line: Connecting Product Work to Revenue by VP...
From Daily Decisions to Bottom Line: Connecting Product Work to Revenue by VP...From Daily Decisions to Bottom Line: Connecting Product Work to Revenue by VP...
From Daily Decisions to Bottom Line: Connecting Product Work to Revenue by VP...
 
SOQL 201 for Admins & Developers: Slice & Dice Your Org’s Data With Aggregate...
SOQL 201 for Admins & Developers: Slice & Dice Your Org’s Data With Aggregate...SOQL 201 for Admins & Developers: Slice & Dice Your Org’s Data With Aggregate...
SOQL 201 for Admins & Developers: Slice & Dice Your Org’s Data With Aggregate...
 
In-Depth Performance Testing Guide for IT Professionals
In-Depth Performance Testing Guide for IT ProfessionalsIn-Depth Performance Testing Guide for IT Professionals
In-Depth Performance Testing Guide for IT Professionals
 
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...
 
How world-class product teams are winning in the AI era by CEO and Founder, P...
How world-class product teams are winning in the AI era by CEO and Founder, P...How world-class product teams are winning in the AI era by CEO and Founder, P...
How world-class product teams are winning in the AI era by CEO and Founder, P...
 
"Impact of front-end architecture on development cost", Viktor Turskyi
"Impact of front-end architecture on development cost", Viktor Turskyi"Impact of front-end architecture on development cost", Viktor Turskyi
"Impact of front-end architecture on development cost", Viktor Turskyi
 
Empowering NextGen Mobility via Large Action Model Infrastructure (LAMI): pav...
Empowering NextGen Mobility via Large Action Model Infrastructure (LAMI): pav...Empowering NextGen Mobility via Large Action Model Infrastructure (LAMI): pav...
Empowering NextGen Mobility via Large Action Model Infrastructure (LAMI): pav...
 
UiPath Test Automation using UiPath Test Suite series, part 1
UiPath Test Automation using UiPath Test Suite series, part 1UiPath Test Automation using UiPath Test Suite series, part 1
UiPath Test Automation using UiPath Test Suite series, part 1
 
De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...
De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...
De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...
 
Introduction to Open Source RAG and RAG Evaluation
Introduction to Open Source RAG and RAG EvaluationIntroduction to Open Source RAG and RAG Evaluation
Introduction to Open Source RAG and RAG Evaluation
 
Unpacking Value Delivery - Agile Oxford Meetup - May 2024.pptx
Unpacking Value Delivery - Agile Oxford Meetup - May 2024.pptxUnpacking Value Delivery - Agile Oxford Meetup - May 2024.pptx
Unpacking Value Delivery - Agile Oxford Meetup - May 2024.pptx
 
ODC, Data Fabric and Architecture User Group
ODC, Data Fabric and Architecture User GroupODC, Data Fabric and Architecture User Group
ODC, Data Fabric and Architecture User Group
 
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...
 
Mission to Decommission: Importance of Decommissioning Products to Increase E...
Mission to Decommission: Importance of Decommissioning Products to Increase E...Mission to Decommission: Importance of Decommissioning Products to Increase E...
Mission to Decommission: Importance of Decommissioning Products to Increase E...
 
Integrating Telephony Systems with Salesforce: Insights and Considerations, B...
Integrating Telephony Systems with Salesforce: Insights and Considerations, B...Integrating Telephony Systems with Salesforce: Insights and Considerations, B...
Integrating Telephony Systems with Salesforce: Insights and Considerations, B...
 

SPICE MODEL of TPC8026 (Standard+BDS Model) in SPICE PARK

  • 1. Device Modeling Report COMPONENTS: Power MOSFET (Model Parameter) PART NUMBER: TPC8026 MANUFACTURER: TOSHIBA Body Diode (Model Parameter) Bee Technologies Inc. All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
  • 2. Circuit Configuration MOSFET MODEL Pspice model Model description parameter LEVEL L Channel Length W Channel Width KP Transconductance RS Source Ohmic Resistance RD Ohmic Drain Resistance VTO Zero-bias Threshold Voltage RDS Drain-Source Shunt Resistance TOX Gate Oxide Thickness CGSO Zero-bias Gate-Source Capacitance CGDO Zero-bias Gate-Drain Capacitance CBD Zero-bias Bulk-Drain Junction Capacitance MJ Bulk Junction Grading Coefficient PB Bulk Junction Potential FC Bulk Junction Forward-bias Capacitance Coefficient RG Gate Ohmic Resistance IS Bulk Junction Saturation Current N Bulk Junction Emission Coefficient RB Bulk Series Resistance PHI Surface Inversion Potential GAMMA Body-effect Parameter DELTA Width effect on Threshold Voltage ETA Static Feedback on Threshold Voltage THETA Modility Modulation KAPPA Saturation Field Factor VMAX Maximum Drift Velocity of Carriers XJ Metallurgical Junction Depth UO Surface Mobility All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
  • 3. Transconductance Characteristic Circuit Simulation Result 50 Measurement Simulation 40 30 gfs 20 10 0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 ID : Drain Current A Comparison table Id(A) gfs Error(%) Measurement Simulation 0.100 3.500 3.334 -4.743 0.200 5.200 5.000 -3.846 0.500 8.700 8.929 2.632 1.000 12.300 12.500 1.626 2.000 17.345 17.544 1.147 5.000 24.500 24.038 -1.886 10.000 33.000 33.113 0.342 All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
  • 4. Vgs-Id Characteristic Circuit Simulation result 10A 1.0A 100mA 10mA 1.0V 1.5V 2.0V 2.5V 3.0V 3.5V 4.0V 4.5V 5.0V I(V3) V_V2 Evaluation circuit V3 0Vdc U2 TPC8026 Vv ariable 10Vdc 10Vdc V2 0 All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
  • 5. Comparison Graph Circuit Simulation Result 10.00 Measurement Simulation 1.00 ID : Drain Current A 0.10 0.01 1.0 2.0 3.0 4.0 5.0 VGS : Gate to Source Voltage V Simulation Result ID(A) VGS(V) Error (%) Measurement Simulation 0.010 2.540 2.560 0.787 0.020 2.550 2.573 0.902 0.050 2.563 2.580 0.663 0.100 2.610 2.602 -0.326 0.200 2.630 2.625 -0.186 0.500 2.652 2.672 0.765 1.000 2.710 2.725 0.557 2.000 2.780 2.800 0.719 5.000 3.000 2.950 -1.680 10.000 3.100 3.120 0.639 All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
  • 6. Rds(on) Characteristic Circuit Simulation result 10A 9A 8A 7A 6A 5A 4A 3A 2A 1A 0A 0V 10mV 20mV 30mV 40mV 50mV 60mV 70mV 80mV I(V3) V_VDS Evaluation circuit V3 0Vdc U2 TPC8026 VDS 10Vdc 0Vdc VGS 0 Simulation Result ID=6.5A, VGS=10V Measurement Simulation Error (%) R DS (on) () 0.0051 0.00505 -0.980 All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
  • 7. Gate Charge Characteristic Circuit Simulation result 20V 16V 12V 8V 4V 0V 0 10n 20n 30n 40n 50n 60n 70n V(W1:3) Time*1mS Evaluation circuit V2 0Vdc U2 TPC8026 Dbreak PER = 1000u D1 PW = 600u W1 I2 TF = 10n + 13Adc TR = 10n - TD = 0 I2 = 1m W I1 IOFF = 0.1mA I1 = 0 ION = 0uA V1 24Vdc 0 Simulation Result VDD=24V,ID=13A Measurement Simulation Error (%) ,VGS=10V Qgs(nc) 6.500 6.487 -0.200 Qgd(nc) 14.000 14.030 0.214 Qg(nc) 42.000 33.793 -19.540 All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
  • 8. Capacitance Characteristic Measurement Simulation Simulation Result VDS(V) Cbd(pF) Error(%) Measurement Simulation 0.1 640 646 0.940 0.2 630 628 -0.320 0.5 580 575 -0.860 1 510 510 0.000 2 420 422 0.480 5 290 292 0.690 10 200 203 1.500 20 140 137 -2.140 All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
  • 9. Switching Time Characteristic Circuit Simulation result 20V 15V 10V 5V 0V 1.85us 1.95us 2.05us 2.15us 2.25us 2.35us V(2)*1.5 V(3) Time Evaluation circuit 3 L2 50n U2 TPC8026 RL 2.3 R1 L1 2 V1 = 0 4.7 30nH VDD V2 = 20 V2 15Vdc TD = 2u R2 TR = 6n TF = 7n 4.7 PW = 2u PER = 10u 0 Simulation Result ID=6.5A, VDD=15V Measurement Simulation Error(%) VGS=10V Ton(ns) 28.000 28.074 0.264 All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
  • 10. Output Characteristic Circuit Simulation result 50A 4 40A 3.8 30A 3.6 20A 3.4 3.3 10A 3.2 3.1 VGS= 3 V 0A 0V 0.2V 0.4V 0.6V 0.8V 1.0V 1.2V 1.4V 1.6V 1.8V 2.0V I(Vdsense) V_Vvariable Evaluation circuit Vdsense 0Vdc U2 TPC8026 Vv ariable 0Vdc 10Vdc Vstep 0 All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
  • 11. BODY DIODE SPICE MODEL Forward Current Characteristic Circuit Simulation Result 10A 1.0A 100mA 10mA 0V 0.2V 0.4V 0.6V 0.8V 1.0V 1.2V I(R1) V_V1 Evaluation Circuit R1 0.01m V1 0Vdc TPC8026 U2 0 All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
  • 12. Comparison Graph Circuit Simulation Result 10.00 Measurement Simulation Drain reverse current IDR(A) 1.00 0.10 0.01 0 0.2 0.4 0.6 0.8 1 1.2 Source: Drain voltage VSD(V) Simulation Result IDR(A) VDS(V) VDS(V) %Error Measurement Simulation 0.010 0.480 0.497 3.542 0.020 0.499 0.506 1.403 0.050 0.510 0.520 1.961 0.100 0.525 0.530 0.952 0.200 0.548 0.543 -0.912 0.500 0.572 0.568 -0.699 1.000 0.614 0.600 -2.280 2.000 0.661 0.655 -0.908 5.000 0.798 0.809 1.378 10.000 1.080 1.060 -1.852 All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
  • 13. Reverse Recovery Characteristic Circuit Simulation Result 400mA 200mA 0A -200mA -400mA 19.92us 20.00us 20.08us 20.16us 20.24us 20.32us I(R1) Time Evaluation Circuit R1 50 V1 = -9.4v V1 V2 = 10.7v TD = 15n TPC8026 TR = 10ns U2 TF = 9ns PW = 20us PER = 100us 0 Compare Measurement vs. Simulation Measurement Simulation Error (%) Trr(ns) 87.200 87.404 0.234 All Rights Reserved Copyright (c) Bee Technologies Inc. 2007
  • 14. Reverse Recovery Characteristic Reference Trj= 18.4 (ns) Trb= 68.8 (ns) Conditions:Ifwd=lrev=0.2(A),Rl=50 Example Relation between trj and trb All Rights Reserved Copyright (c) Bee Technologies Inc. 2007