SPICE MODEL of 2SK3301 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3301 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3301 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8029 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a TPC8029 power MOSFET. It includes:
1) Details of the MOSFET model parameters and equations used in the Pspice simulation.
2) Simulation results and comparisons to measurement data for key MOSFET characteristics like transconductance, Vgs-Id, output characteristics, and switching times.
3) The model for the internal body diode and simulation results for forward and reverse recovery characteristics compared to measurements.
4) A diagram showing the relationship between reverse recovery times trj and trb.
SPICE MODEL of TPCM8003-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCM8003-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8028 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8028 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4065-DL-E (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4065-DL-E (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K101TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a TOSHIBA SSM3K101TU power MOSFET and its internal body diode and ESD protection diode. It includes SPICE models and simulation results for the MOSFET characteristics like transconductance, gate charge, output, switching time and for the diode characteristics like forward current, reverse recovery and zener voltage. The simulations match well with measurements with less than 5% error for most characteristics.
SPICE MODEL of 2SK4065-DL-E (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4065-DL-E (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8026 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8026 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3301 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3301 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8029 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a TPC8029 power MOSFET. It includes:
1) Details of the MOSFET model parameters and equations used in the Pspice simulation.
2) Simulation results and comparisons to measurement data for key MOSFET characteristics like transconductance, Vgs-Id, output characteristics, and switching times.
3) The model for the internal body diode and simulation results for forward and reverse recovery characteristics compared to measurements.
4) A diagram showing the relationship between reverse recovery times trj and trb.
SPICE MODEL of TPCM8003-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCM8003-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8028 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8028 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4065-DL-E (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4065-DL-E (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K101TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a TOSHIBA SSM3K101TU power MOSFET and its internal body diode and ESD protection diode. It includes SPICE models and simulation results for the MOSFET characteristics like transconductance, gate charge, output, switching time and for the diode characteristics like forward current, reverse recovery and zener voltage. The simulations match well with measurements with less than 5% error for most characteristics.
SPICE MODEL of 2SK4065-DL-E (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4065-DL-E (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8026 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8026 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8401 (Professional+BDP N&P Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8401 (Professional+BDP N&P Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K16FU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a Power MOSFET component. It includes:
1) A description of the MOSFET model parameters used in the PSpice simulation.
2) Simulation results and comparisons to measurement data for the MOSFET's transconductance, Vgs-Id curve, Rds(on), gate charge, capacitances and switching times.
3) Forward and reverse current characteristics along with the reverse recovery behavior.
4) A zener voltage characteristic simulation of the MOSFET's body diode.
SPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K15FU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a TOSHIBA Power MOSFET with part number SSM3K15FU. The 3-sentence summary is:
The report includes PSpice models and simulation results characterizing the electrical parameters and performance of the MOSFET, such as its transconductance, threshold voltage, on-resistance, switching times, and forward/reverse current characteristics. Comparisons between measured data and simulated values show good agreement within a few percent error. Component specifications and simulation circuits are provided to model and evaluate the MOSFET's electrical behavior.
SPICE MODEL of 2SK4066-DL-E (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the device modeling report for a MOSFET transistor and body diode. It includes:
1) Component details such as part number, manufacturer, and remarks on the MOSFET and body diode models.
2) Descriptions and parameters for the MOSFET and diode SPICE models.
3) Results of circuit simulations characterizing key transistor properties like transconductance, Vgs-Id curve, gate charge, switching times and comparing to manufacturer data.
SPICE MODEL of SSM3K15FU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K15FU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4066-DL-E (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4066-DL-E (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K101TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K101TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCM8002-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCM8002-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3670 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3670 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2461 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2461 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8032-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8032-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4087LS (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4087LS (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2601 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2601 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2461 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report that includes:
1) Summaries of the SPICE models for the power MOSFET, its body diode, and ESD protection diode components of the 2SK2461 part, including model parameters and characteristics.
2) Graphs of simulated circuit characteristics like transconductance, Vgs-Id, Rds(on), capacitance, and switching time compared to manufacturer measurements.
3) Evaluation circuits and simulation results for the MOSFET and diode components covering characteristics like forward current, reverse recovery, and zener voltage.
SPICE MODEL of 2SJ656 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ656 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2610 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2610 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3903 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3903 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a Toshiba TPC8107 power MOSFET. It includes:
1. Details of the MOSFET components and manufacturer.
2. Equivalent circuit diagrams and descriptions of the MOSFET model parameters.
3. Simulation results graphs comparing measurements and simulations of key MOSFET characteristics like transconductance, drain current, gate charge, switching times and more.
4. Evaluation circuits and simulation settings used to generate the results.
5. Tables comparing measurement and simulation data with percent error calculations.
The report demonstrates accurate modeling of the MOSFET's electrical behavior through PSpice simulation versus real-world measurements
SPICE MODEL of TPCA8011-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8011-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK1544 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK1544 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK1544 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK1544 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8401 (Professional+BDP N&P Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8401 (Professional+BDP N&P Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K16FU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a Power MOSFET component. It includes:
1) A description of the MOSFET model parameters used in the PSpice simulation.
2) Simulation results and comparisons to measurement data for the MOSFET's transconductance, Vgs-Id curve, Rds(on), gate charge, capacitances and switching times.
3) Forward and reverse current characteristics along with the reverse recovery behavior.
4) A zener voltage characteristic simulation of the MOSFET's body diode.
SPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K15FU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a TOSHIBA Power MOSFET with part number SSM3K15FU. The 3-sentence summary is:
The report includes PSpice models and simulation results characterizing the electrical parameters and performance of the MOSFET, such as its transconductance, threshold voltage, on-resistance, switching times, and forward/reverse current characteristics. Comparisons between measured data and simulated values show good agreement within a few percent error. Component specifications and simulation circuits are provided to model and evaluate the MOSFET's electrical behavior.
SPICE MODEL of 2SK4066-DL-E (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the device modeling report for a MOSFET transistor and body diode. It includes:
1) Component details such as part number, manufacturer, and remarks on the MOSFET and body diode models.
2) Descriptions and parameters for the MOSFET and diode SPICE models.
3) Results of circuit simulations characterizing key transistor properties like transconductance, Vgs-Id curve, gate charge, switching times and comparing to manufacturer data.
SPICE MODEL of SSM3K15FU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K15FU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4066-DL-E (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4066-DL-E (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K101TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K101TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCM8002-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCM8002-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3670 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3670 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2461 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2461 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8032-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8032-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4087LS (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4087LS (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2601 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2601 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2461 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report that includes:
1) Summaries of the SPICE models for the power MOSFET, its body diode, and ESD protection diode components of the 2SK2461 part, including model parameters and characteristics.
2) Graphs of simulated circuit characteristics like transconductance, Vgs-Id, Rds(on), capacitance, and switching time compared to manufacturer measurements.
3) Evaluation circuits and simulation results for the MOSFET and diode components covering characteristics like forward current, reverse recovery, and zener voltage.
SPICE MODEL of 2SJ656 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ656 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2610 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2610 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3903 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3903 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a Toshiba TPC8107 power MOSFET. It includes:
1. Details of the MOSFET components and manufacturer.
2. Equivalent circuit diagrams and descriptions of the MOSFET model parameters.
3. Simulation results graphs comparing measurements and simulations of key MOSFET characteristics like transconductance, drain current, gate charge, switching times and more.
4. Evaluation circuits and simulation settings used to generate the results.
5. Tables comparing measurement and simulation data with percent error calculations.
The report demonstrates accurate modeling of the MOSFET's electrical behavior through PSpice simulation versus real-world measurements
SPICE MODEL of TPCA8011-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8011-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK1544 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK1544 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK1544 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK1544 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8003-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8003-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2508 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2508 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2508 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2508 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8003-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8003-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK30A06J3 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK30A06J3 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8026 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8026 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6P54TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6P54TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8032-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8032-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8011-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8011-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8004-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This 3 sentence summary provides the key components and modeling parameters of the TPCA8004-H power MOSFET:
The document reports on the modeling of the TPCA8004-H power MOSFET manufactured by Toshiba, including its body diode and ESD protection diode. It details the model parameters, simulation results comparing measurements and simulations, and characteristic performance curves for the MOSFET, body diode and protection diode such as transconductance, capacitance, switching time and reverse recovery.
SPICE MODEL of TPC8107 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8107 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK40J60T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK40J60T (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MTM23223 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of MTM23223 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MTM23223 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of MTM23223 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2417 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2417 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K35FS (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K35FS (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2417 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2417 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ656 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ656 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3863 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of components in a device, including:
1) A power MOSFET model with parameters such as length, width, threshold voltage.
2) Simulation results showing characteristics like transconductance, drain current, and capacitance match measurements.
3) A body diode model with simulation of forward current matching measurements.
4) An ESD protection diode model with zener voltage characteristic simulation shown.
SPICE MODEL of TPC8110 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8110 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
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Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Tsuyoshi Horigome
The document provides an inventory update from March 2024 of parts in the Spice Park warehouse. It lists 6,725 total parts across various categories including semiconductors, passive parts, batteries, mechanical parts, motors, and lamps. The semiconductor section lists 652 general purpose rectifier diodes from 18 different manufacturers with quantities ranging from 2 to 145 pieces.
This document provides an inventory list of parts at Spice Park as of March 2024. It contains 3 sections - Semiconductor parts (diodes, transistors, ICs etc.), Passive parts (capacitors, resistors etc.), and Battery parts. For Semiconductor parts, it lists 36 different part types and provides the quantity of each part. It then provides further details of Diode/General Purpose Rectifiers, listing the manufacturer and quantity of 652 individual part numbers.
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Tsuyoshi Horigome
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 total pieces of electronic components and parts. It lists 36 categories of semiconductor devices, 11 categories of passive parts, 10 types of batteries, 5 mechanical parts, DC motors, lamps, and power supplies. It provides the most detailed listing for solar cells, with 1,003 total pieces from 51 manufacturers listed with part numbers.
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 electronic components. It lists the components by type (e.g. semiconductor), part number, manufacturer, thermal rating, and quantity on hand. For example, it shows that there are 621 general purpose rectifier diodes from manufacturers such as Fairchild, Fuji, Intersil, Rohm, Shindengen, and Toshiba. The detailed four-page section provides further information on the first item, general purpose rectifier diodes, including 152 individual part numbers and specifications.
This document discusses circuit simulations using LTspice. It describes driving a circuit simulation by inserting a 250 ohm resistor between the output terminals. It also describes simulating a 1 channel bridge circuit where the DUT1 and DUT2 resistors are both set to 100 ohms and the input voltage is set to either 1V or 5V.
This document discusses parametric sweeps of external and internal resistance values Rg for circuit simulation in LTspice. It also references outputting a waveform similar to a report on fall time characteristics for a device modeling report with customer Samsung.
Sudheer Mechineni, Head of Application Frameworks, Standard Chartered Bank
Discover how Standard Chartered Bank harnessed the power of Neo4j to transform complex data access challenges into a dynamic, scalable graph database solution. This keynote will cover their journey from initial adoption to deploying a fully automated, enterprise-grade causal cluster, highlighting key strategies for modelling organisational changes and ensuring robust disaster recovery. Learn how these innovations have not only enhanced Standard Chartered Bank’s data infrastructure but also positioned them as pioneers in the banking sector’s adoption of graph technology.
GraphSummit Singapore | The Future of Agility: Supercharging Digital Transfor...Neo4j
Leonard Jayamohan, Partner & Generative AI Lead, Deloitte
This keynote will reveal how Deloitte leverages Neo4j’s graph power for groundbreaking digital twin solutions, achieving a staggering 100x performance boost. Discover the essential role knowledge graphs play in successful generative AI implementations. Plus, get an exclusive look at an innovative Neo4j + Generative AI solution Deloitte is developing in-house.
Alt. GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using ...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
GraphSummit Singapore | The Art of the Possible with Graph - Q2 2024Neo4j
Neha Bajwa, Vice President of Product Marketing, Neo4j
Join us as we explore breakthrough innovations enabled by interconnected data and AI. Discover firsthand how organizations use relationships in data to uncover contextual insights and solve our most pressing challenges – from optimizing supply chains, detecting fraud, and improving customer experiences to accelerating drug discoveries.
Full-RAG: A modern architecture for hyper-personalizationZilliz
Mike Del Balso, CEO & Co-Founder at Tecton, presents "Full RAG," a novel approach to AI recommendation systems, aiming to push beyond the limitations of traditional models through a deep integration of contextual insights and real-time data, leveraging the Retrieval-Augmented Generation architecture. This talk will outline Full RAG's potential to significantly enhance personalization, address engineering challenges such as data management and model training, and introduce data enrichment with reranking as a key solution. Attendees will gain crucial insights into the importance of hyperpersonalization in AI, the capabilities of Full RAG for advanced personalization, and strategies for managing complex data integrations for deploying cutting-edge AI solutions.
Unlocking Productivity: Leveraging the Potential of Copilot in Microsoft 365, a presentation by Christoforos Vlachos, Senior Solutions Manager – Modern Workplace, Uni Systems
UiPath Test Automation using UiPath Test Suite series, part 5DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 5. In this session, we will cover CI/CD with devops.
Topics covered:
CI/CD with in UiPath
End-to-end overview of CI/CD pipeline with Azure devops
Speaker:
Lyndsey Byblow, Test Suite Sales Engineer @ UiPath, Inc.
Threats to mobile devices are more prevalent and increasing in scope and complexity. Users of mobile devices desire to take full advantage of the features
available on those devices, but many of the features provide convenience and capability but sacrifice security. This best practices guide outlines steps the users can take to better protect personal devices and information.
Enchancing adoption of Open Source Libraries. A case study on Albumentations.AIVladimir Iglovikov, Ph.D.
Presented by Vladimir Iglovikov:
- https://www.linkedin.com/in/iglovikov/
- https://x.com/viglovikov
- https://www.instagram.com/ternaus/
This presentation delves into the journey of Albumentations.ai, a highly successful open-source library for data augmentation.
Created out of a necessity for superior performance in Kaggle competitions, Albumentations has grown to become a widely used tool among data scientists and machine learning practitioners.
This case study covers various aspects, including:
People: The contributors and community that have supported Albumentations.
Metrics: The success indicators such as downloads, daily active users, GitHub stars, and financial contributions.
Challenges: The hurdles in monetizing open-source projects and measuring user engagement.
Development Practices: Best practices for creating, maintaining, and scaling open-source libraries, including code hygiene, CI/CD, and fast iteration.
Community Building: Strategies for making adoption easy, iterating quickly, and fostering a vibrant, engaged community.
Marketing: Both online and offline marketing tactics, focusing on real, impactful interactions and collaborations.
Mental Health: Maintaining balance and not feeling pressured by user demands.
Key insights include the importance of automation, making the adoption process seamless, and leveraging offline interactions for marketing. The presentation also emphasizes the need for continuous small improvements and building a friendly, inclusive community that contributes to the project's growth.
Vladimir Iglovikov brings his extensive experience as a Kaggle Grandmaster, ex-Staff ML Engineer at Lyft, sharing valuable lessons and practical advice for anyone looking to enhance the adoption of their open-source projects.
Explore more about Albumentations and join the community at:
GitHub: https://github.com/albumentations-team/albumentations
Website: https://albumentations.ai/
LinkedIn: https://www.linkedin.com/company/100504475
Twitter: https://x.com/albumentations
Climate Impact of Software Testing at Nordic Testing DaysKari Kakkonen
My slides at Nordic Testing Days 6.6.2024
Climate impact / sustainability of software testing discussed on the talk. ICT and testing must carry their part of global responsibility to help with the climat warming. We can minimize the carbon footprint but we can also have a carbon handprint, a positive impact on the climate. Quality characteristics can be added with sustainability, and then measured continuously. Test environments can be used less, and in smaller scale and on demand. Test techniques can be used in optimizing or minimizing number of tests. Test automation can be used to speed up testing.
Goodbye Windows 11: Make Way for Nitrux Linux 3.5.0!SOFTTECHHUB
As the digital landscape continually evolves, operating systems play a critical role in shaping user experiences and productivity. The launch of Nitrux Linux 3.5.0 marks a significant milestone, offering a robust alternative to traditional systems such as Windows 11. This article delves into the essence of Nitrux Linux 3.5.0, exploring its unique features, advantages, and how it stands as a compelling choice for both casual users and tech enthusiasts.
Dr. Sean Tan, Head of Data Science, Changi Airport Group
Discover how Changi Airport Group (CAG) leverages graph technologies and generative AI to revolutionize their search capabilities. This session delves into the unique search needs of CAG’s diverse passengers and customers, showcasing how graph data structures enhance the accuracy and relevance of AI-generated search results, mitigating the risk of “hallucinations” and improving the overall customer journey.
SPICE MODEL of 2SK3301 (Standard+BDS Model) in SPICE PARK
1. Device Modeling Report
COMPONENTS: Power MOSFET
PART NUMBER: 2SK3301
MANUFACTURER: TOSHIBA
Body Diode (Model Parameter) /ESD Protection Diode
Bee Technologies Inc.
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
2. MOSFET MODEL
Pspice model
Model description
parameter
LEVEL
L Channel Length
W Channel Width
KP Transconductance
RS Source Ohmic Resistance
RD Ohmic Drain Resistance
VTO Zero-bias Threshold Voltage
RDS Drain-Source Shunt Resistance
TOX Gate Oxide Thickness
CGSO Zero-bias Gate-Source Capacitance
CGDO Zero-bias Gate-Drain Capacitance
CBD Zero-bias Bulk-Drain Junction Capacitance
MJ Bulk Junction Grading Coefficient
PB Bulk Junction Potential
FC Bulk Junction Forward-bias Capacitance Coefficient
RG Gate Ohmic Resistance
IS Bulk Junction Saturation Current
N Bulk Junction Emission Coefficient
RB Bulk Series Resistance
PHI Surface Inversion Potential
GAMMA Body-effect Parameter
DELTA Width effect on Threshold Voltage
ETA Static Feedback on Threshold Voltage
THETA Modility Modulation
KAPPA Saturation Field Factor
VMAX Maximum Drift Velocity of Carriers
XJ Metallurgical Junction Depth
UO Surface Mobility
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
3. Transconductance Characteristic
Circuit Simulation Result
0.50
Measurement
Simulation
0.40
0.30
GFS (s)
0.20
0.10
0.00
0.00 0.10 0.20 0.30 0.40 0.50 0.60
DRAIN CURRENT ID (A)
Comparison table
gfs
Id(A) Error(%)
Measurement Simulation
0.050 0.143 0.145 1.469
0.100 0.205 0.205 0.098
0.200 0.286 0.291 1.608
0.500 0.427 0.431 0.937
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
15. Reverse Recovery Characteristic
Circuit Simulation Result
400mA
0A
-400mA
16us 20us 24us 28us 32us 36us 40us 44us 48us 52us
I(RL21)
Time
Evaluation Circuit
RL21
50
V1 = -9.38
V2 = 10.60
V21
TD = 12.4u
TF = 10n U21
TR = 10n
PW = 20u 2SK3301
PER = 60u
0
Compare Measurement vs. Simulation
Measurement Simulation Error (%)
trj 0.900 us 0.902 us 0.222
trb 2.800 us 1.049 us -62.536
trr 3.700 us 1.951 us -47.270
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
16. Reverse Recovery Characteristic Reference
Trj=0.90(us)
Trb=2.8(us)
Conditions:Ifwd=lrev=0.2(A),Rl=50
Example
Relation between trj and trb
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
17. ESD PROTECTION DIODE SPICE MODEL
Zener Voltage Characteristic
Circuit Simulation Result
10mA
9mA
8mA
7mA
6mA
5mA
4mA
3mA
2mA
1mA
0A
0V 20V 40V 60V 80V 100V 120V 140V 160V 180V
I(R1)
V_V1
Evaluation Circuit
R1
0.01m
Open
U19
V1
0Vdc
2SK3301
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006