The document discusses the evolution of device connectivity, particularly focusing on PCIe add-in cards and riser card architectures, highlighting the benefits of front face plate pluggable devices. It outlines various form factors, power options, and the importance of connector features for enhanced gatherability. The overall aim is to address connectivity requirements and advancements in high-speed interconnects for modern computing devices.

1. EVERY CONNECTION COUNTS
Card Edge Interconnects –
Understanding Device & Riser Card
Connectivity Tradeoffs
Christopher Blackburn
Principal Technologist – System Architecture

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Device Connectivity Today VS. Tomorrow
2
• PCIE Add-In-Cards are 20 years old!
• Riser card architectures disappearing
• Front face plate pluggable devices
offer many benefits:
• Shortened electrical channel
• Hot swap capability
• Improved serviceability
• Devices are evolving to enable
multiple use cases:
• SSDs
• Expanded memory
• Accelerators
PCIe AIC
EDSFF
OCP NIC 3.0

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Many Device Form Factor Choices
3
PCIe Add-In-Cards EDSFF OCP NIC 3.0 SFF-TA-1034 PMM
Many variations and options across device form factors drives
expansive list of connectivity requirements

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4
High Speed
Lanes
Power
Length
(mm)
Width
X-Y Area
(mm2)
Heights
(mm)
Front Faceplate
Pluggable?
PCIe FH-FL AIC
x4, x8, x16
75W through CEM Connector,
150W, 225W, 300W, 600W options
with auxiliary power connectors
312 111.28 34,719
Single Slot = 18.71
Double Slot = 39.04
Triple Slot = 59.36
No
PCIe FH-3/4L AIC 254 111.28 28,265 No
PCIe FH-HL AIC 167.65 111.28 18,656 No
PCIe LP-HL AIC 167.65 68.90 11,551 No
SFF-TA-1021 PECFF FH-FL
x16, x32
660W (12V)
1024W (48V)
312 111.28 34,719 No
SFF-TA-1021 PECFF FH-HL 254 112.28 28,265 No
E1.S
x4, x8
5.9 = 12W, 8.01 = 16W
9.5 = 20W, 15/25 = 25W
111.49 31.50 3,512 5.9, 8.01, 9.5, 15, 25 Yes
E1.L
9.5 = 25W
18 = 40W
318.75 38.40 12,240 9.50, 18 Yes
E3.S
x4, x8, x16
1T = 25W
2T= 40W
112.75 76.00 8,569
1T = 7.5
2T = 16.8
Yes
E3.L 142.20 76.00 10,807 Yes
OCP NIC 3.0 SFF x16 80W 76 115 8,740 11.5, TSFF = 14.2 Yes
OCP NIC 3.0 LFF x16, x32 150W 139 115 15,985 11.5 Yes
SFF-TA-1034 PMM Long
x32 200W, 400W, 600W
230 125 28,750
1T = 18.3
2T = 38.40
Yes
SFF-TA-1034 PMM Short 167 125 20,875 Yes
Supported
with
Sliver
Connector

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Sliver Ecosystem Timeline
5

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Card Edge Connectivity Options
6
Sliver MCIO MXIO PCIe CEM
Standards
SFF-TA-1002, SFF-TA-
1020, SFF-TA-1021,
SFF-TA-1037, EDSFF,
OCP NIC, DC-SCM
SFF-TA-1016, PCI-SIG SFF-TA-1033, DC-MHS PCI-SIG
High Speed Lanes x4, x8, x16, x32 x4, x8, x16 x4, x8, x16 x4, x8, x16
Integrated Power
Options
Up to 600W (12V) NO Up to 660W (12V) Up to 75W (12V)
Best Suited
Applications
Device card edge,
Board to Board cabling,
Board Riser, Cabled Riser
Board to Board Cabling Cabled Riser
Board Riser,
PCIe Add-In-Card

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Device Connectivity Today VS. Tomorrow
7
I
D
Size /
Config
Connector
Orientation
Cable Exit
Configurati
on
A 1C | 56p
Vertical
Right
Angle
B 2C | 84p
C 4C | 140p
D 4C+ | 168p
E 1C | 56p
Left Side
Exit
F 2C | 84p
G 4C | 140p
H 4C+ | 168p
J 1C | 56p
Right Side
Exit
K 2C | 84p
L 4C | 140p
M 4C+ | 168p
N 1C | 56p
Right Angle
Straight
Exit
P 2C | 84p
Q 4C | 140p
R 4C+ | 168p
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
Connectors
• Vertical
• Right Angle
• Straddle
• Orthogonal
Straddle Mount Connector Orthogonal Connector
Lateral Exit Cable Cable Receptacle
Vertical Connector
Cables
• Straight Exit
• Right Angle Exit
• Lateral Exit
• Receptacle

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Linear & Angular Gatherability
8
Interface Linear Gatherabiliy X-Direction Linear Gatherability Y-Direction Angular Gatherability X-Direction Angular Gatherability Y-Direction
MCIO / MXIO +/- 0.34mm +/- 0.40mm +/- 3˚ +/- 3˚
Sliver +/- 1.00mm +/- 1.00mm +/- 5˚ +/- 8˚
CEM +/- 1.16mm +/- 1.12mm +/- 2˚ +/- 2˚
SFF-TA-1002 (Sliver) CEM
X-Axis
X-Axis Y-Axis
Y-Axis
+/- 1.16
+/- 2˚ +/- 2˚
+/- 1.12
SFF-TA-1016 (MCIO)
SFF-TA-1033 (MXIO)

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Connector Features for Gatherability
9
Sliver 2.0
SFF-TA-1002 & SFF-TA-1020
Contacts recessed well below housing top surface
• Minimizes mating card angle prior to engaging contacts
• Helps to avoid incidental contact from foreign objects
Increased gap between slot end wall and first contact
• Reduces risk of mating PCB corner from catching contact during angular mating
2.7mm
1.37mm
Chamfer C 0.75
Chamfer C 0.3
MCIO & MXIO
SFF-TA-1016 & SFF-TA-1033

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SFF-TA-1002 Replacing CEM
10
Custom NICs & DPUs replacing CEM connectors
with SFF-TA-1002
• Condensed pitch
• High power options
Supports thicker PCBs
• 62mil  93mil
• Need better tolerances from PCB manufacturers
PCIe CEM
Card Edge
Interface
SFF-TA-1002
Card Edge
Interface

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Cabling Directly to Devices
11
OCP NiC 3.0
EDSFF
PCIe Add-In-Card
1C / 56P 2C / 84P
4C / 140P 4C+ / 168P
SFF-TA-1002 Cable Receptacles
4C+ / 168P Cable Receptacle 4C+ Cabled Riser

12. ANY
CONNECTION
CAN CHANGE
THE WORLD
EVERY CONNECTION COUNTS