SlideShare a Scribd company logo
Slide 2
Neuromodulation Devices
• Active medical implantables that deliver life-improving
therapies, including:
 Cochlear/middle ear
 Cortical
 Deep brain (DBS)
 Peripheral nerve
 Spinal cord (SCS)
 Sacral nerve (SNS)
 Functional electrical stimulation
Slide 3
Neuromodulation Device Challenges
• Conflicting engineering demands
 New therapies require greater functionality
 Patients and surgeons want smaller devices
• The device header
 Area where lead interconnects with battery and
electronics
 Limited real estate – packed with connections
 Represents as much as 30% of the device size
Smaller header = smaller device
Slide 4
Electrical Contacts: A Critical Element
• In the header, they
enable transmission of
pulses through the lead
to the body
 Determine performance
of system
 Ensure therapy delivery
at optimal levels
 Must be very small and
ultra-reliable
Slide 5
Contact Performance Factors
• Tiny contacts can deliver
BIG performance, as long
as they provide …
 Small pitch to conserve
header space
 Multipoint conductivity to
reduce risk of failure
 Ultra-low contact
resistance (<100 mΩ) for
better signal integrity,
longer device life
Slide 6
Contact Performance Factors
• Biocompatibility
 Can be ensured with selection of proven
materials, such as:
 MP35N®
 Platinum iridium
 Titanium
 Stainless/stainless
• Insertion force
 Can be minimized by using a contact that:
 Offers customizable control of lead insertion/removal
requirements
• Reliability
 Can be optimized by employing:
 100% force verification
 Heat lot material control
Slide 7
Contact Design Considerations
• Male interface diameter and tolerance
• Materials that will interact with the contact
• Space availability for contact OD
• Force contribution of contact and fluid seals
• Electrical resistance requirements
Slide 8
Spring-based Contact Technology
• Consists of spring in metal
housing
 Leverages mechanical and
electrical properties of
canted coil spring
 Multiple coils provide built-in
connection redundancy
 Compact footprint and small
pitch for space savings
 Example: Bal Conn®
electrical contact
Bal Conn® electrical contact,
featuring Bal Spring® canted
coil spring technology
Slide 9
Typical Contact Configurations
• Shapes include:
 Circular
 Rectangular
 D-shaped
 Irregular
• Unique housing features
Slide 10
Alternative Contact Configurations
• High density (HD) array
 Isolation between contact zones
 2X connector density vs. linear
stack
 Enables reduced header sizes
• Next-generation Bal Conn®
 Alternative construction
 Smaller pitch capability
 Improved electrical performance
Slide 11
Integrated Contact/Seal Systems
• Combine proven contact and fluid seal into a
“stackable” configuration
• Eliminate need for separate component
development & testing
• Can improve speed to market
• Example: SYGNUS® implantable contact system
 .9mm, 1.3mm & 3.2mm Lead Sizes
 Custom lead interface capable
 Custom pitch capable
SYGNUS®
implantable contact
system, featuring
Bal Conn ® electrical
contact, stacked
with silicone seals
Slide 12
Summary & Recommendations
• To reduce neuro device size AND
boost connection density, consider
electrical contact requirements as
part of your overall device design
• In early design stages, collaborate
with Bal Seal Engineering to:
 Get consultative engineering advice
 Lead interface design
 Integration methods
 Industry practices
 Performance and design impact
discussion
 Recommendations for integration
partners
Slide 13
Resources & Contact Information
Mark Russell
Sr. Global Market Manager, Medical
Electronics
Bal Seal Engineering, Inc.
mrussell@balseal.com
+1 630.765.7255
marketing@balseal.com www.balseal.com +1 949.460.2100 Design request form
Custom components that drive
tomorrow’s technologies®
©Bal Seal Engineering, Inc. This document contains and/or refers to information that is PROPRIETARY to Bal Seal Engineering, Inc. Products referenced herein are the
subject of issued or pending United States and foreign patents. Bal Seal Engineering, Inc. products and designs are PROPRIETARY and products may not be manufactured,
or caused to be manufactured, by any other party.

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More Connections in Less Space for Neuro Devices

  • 1.
  • 2. Slide 2 Neuromodulation Devices • Active medical implantables that deliver life-improving therapies, including:  Cochlear/middle ear  Cortical  Deep brain (DBS)  Peripheral nerve  Spinal cord (SCS)  Sacral nerve (SNS)  Functional electrical stimulation
  • 3. Slide 3 Neuromodulation Device Challenges • Conflicting engineering demands  New therapies require greater functionality  Patients and surgeons want smaller devices • The device header  Area where lead interconnects with battery and electronics  Limited real estate – packed with connections  Represents as much as 30% of the device size Smaller header = smaller device
  • 4. Slide 4 Electrical Contacts: A Critical Element • In the header, they enable transmission of pulses through the lead to the body  Determine performance of system  Ensure therapy delivery at optimal levels  Must be very small and ultra-reliable
  • 5. Slide 5 Contact Performance Factors • Tiny contacts can deliver BIG performance, as long as they provide …  Small pitch to conserve header space  Multipoint conductivity to reduce risk of failure  Ultra-low contact resistance (<100 mΩ) for better signal integrity, longer device life
  • 6. Slide 6 Contact Performance Factors • Biocompatibility  Can be ensured with selection of proven materials, such as:  MP35N®  Platinum iridium  Titanium  Stainless/stainless • Insertion force  Can be minimized by using a contact that:  Offers customizable control of lead insertion/removal requirements • Reliability  Can be optimized by employing:  100% force verification  Heat lot material control
  • 7. Slide 7 Contact Design Considerations • Male interface diameter and tolerance • Materials that will interact with the contact • Space availability for contact OD • Force contribution of contact and fluid seals • Electrical resistance requirements
  • 8. Slide 8 Spring-based Contact Technology • Consists of spring in metal housing  Leverages mechanical and electrical properties of canted coil spring  Multiple coils provide built-in connection redundancy  Compact footprint and small pitch for space savings  Example: Bal Conn® electrical contact Bal Conn® electrical contact, featuring Bal Spring® canted coil spring technology
  • 9. Slide 9 Typical Contact Configurations • Shapes include:  Circular  Rectangular  D-shaped  Irregular • Unique housing features
  • 10. Slide 10 Alternative Contact Configurations • High density (HD) array  Isolation between contact zones  2X connector density vs. linear stack  Enables reduced header sizes • Next-generation Bal Conn®  Alternative construction  Smaller pitch capability  Improved electrical performance
  • 11. Slide 11 Integrated Contact/Seal Systems • Combine proven contact and fluid seal into a “stackable” configuration • Eliminate need for separate component development & testing • Can improve speed to market • Example: SYGNUS® implantable contact system  .9mm, 1.3mm & 3.2mm Lead Sizes  Custom lead interface capable  Custom pitch capable SYGNUS® implantable contact system, featuring Bal Conn ® electrical contact, stacked with silicone seals
  • 12. Slide 12 Summary & Recommendations • To reduce neuro device size AND boost connection density, consider electrical contact requirements as part of your overall device design • In early design stages, collaborate with Bal Seal Engineering to:  Get consultative engineering advice  Lead interface design  Integration methods  Industry practices  Performance and design impact discussion  Recommendations for integration partners
  • 13. Slide 13 Resources & Contact Information Mark Russell Sr. Global Market Manager, Medical Electronics Bal Seal Engineering, Inc. mrussell@balseal.com +1 630.765.7255 marketing@balseal.com www.balseal.com +1 949.460.2100 Design request form
  • 14. Custom components that drive tomorrow’s technologies® ©Bal Seal Engineering, Inc. This document contains and/or refers to information that is PROPRIETARY to Bal Seal Engineering, Inc. Products referenced herein are the subject of issued or pending United States and foreign patents. Bal Seal Engineering, Inc. products and designs are PROPRIETARY and products may not be manufactured, or caused to be manufactured, by any other party.