This document discusses neuromodulation devices and the challenges in their design. It focuses on electrical contacts, which enable therapy delivery and must be very small, reliable, and ensure optimal signal transmission. Contact design considerations include small size, multipoint conductivity, low resistance, and customizable force requirements. Spring-based contact technology leverages mechanical properties of canted coil springs to provide a compact footprint and redundancy. Integrated contact/seal systems combine contacts and seals to improve speed to market. The document recommends collaborating early in the design process to get engineering advice on contact and interface design to help reduce device size while boosting connection density.

2. Slide 2
Neuromodulation Devices
• Active medical implantables that deliver life-improving
therapies, including:
 Cochlear/middle ear
 Cortical
 Deep brain (DBS)
 Peripheral nerve
 Spinal cord (SCS)
 Sacral nerve (SNS)
 Functional electrical stimulation

3. Slide 3
Neuromodulation Device Challenges
• Conflicting engineering demands
 New therapies require greater functionality
 Patients and surgeons want smaller devices
• The device header
 Area where lead interconnects with battery and
electronics
 Limited real estate – packed with connections
 Represents as much as 30% of the device size
Smaller header = smaller device

4. Slide 4
Electrical Contacts: A Critical Element
• In the header, they
enable transmission of
pulses through the lead
to the body
 Determine performance
of system
 Ensure therapy delivery
at optimal levels
 Must be very small and
ultra-reliable

5. Slide 5
Contact Performance Factors
• Tiny contacts can deliver
BIG performance, as long
as they provide …
 Small pitch to conserve
header space
 Multipoint conductivity to
reduce risk of failure
 Ultra-low contact
resistance (<100 mΩ) for
better signal integrity,
longer device life

6. Slide 6
Contact Performance Factors
• Biocompatibility
 Can be ensured with selection of proven
materials, such as:
 MP35N®
 Platinum iridium
 Titanium
 Stainless/stainless
• Insertion force
 Can be minimized by using a contact that:
 Offers customizable control of lead insertion/removal
requirements
• Reliability
 Can be optimized by employing:
 100% force verification
 Heat lot material control

7. Slide 7
Contact Design Considerations
• Male interface diameter and tolerance
• Materials that will interact with the contact
• Space availability for contact OD
• Force contribution of contact and fluid seals
• Electrical resistance requirements

8. Slide 8
Spring-based Contact Technology
• Consists of spring in metal
housing
 Leverages mechanical and
electrical properties of
canted coil spring
 Multiple coils provide built-in
connection redundancy
 Compact footprint and small
pitch for space savings
 Example: Bal Conn®
electrical contact
Bal Conn® electrical contact,
featuring Bal Spring® canted
coil spring technology

9. Slide 9
Typical Contact Configurations
• Shapes include:
 Circular
 Rectangular
 D-shaped
 Irregular
• Unique housing features

10. Slide 10
Alternative Contact Configurations
• High density (HD) array
 Isolation between contact zones
 2X connector density vs. linear
stack
 Enables reduced header sizes
• Next-generation Bal Conn®
 Alternative construction
 Smaller pitch capability
 Improved electrical performance

11. Slide 11
Integrated Contact/Seal Systems
• Combine proven contact and fluid seal into a
“stackable” configuration
• Eliminate need for separate component
development & testing
• Can improve speed to market
• Example: SYGNUS® implantable contact system
 .9mm, 1.3mm & 3.2mm Lead Sizes
 Custom lead interface capable
 Custom pitch capable
SYGNUS®
implantable contact
system, featuring
Bal Conn ® electrical
contact, stacked
with silicone seals

12. Slide 12
Summary & Recommendations
• To reduce neuro device size AND
boost connection density, consider
electrical contact requirements as
part of your overall device design
• In early design stages, collaborate
with Bal Seal Engineering to:
 Get consultative engineering advice
 Lead interface design
 Integration methods
 Industry practices
 Performance and design impact
discussion
 Recommendations for integration
partners

13. Slide 13
Resources & Contact Information
Mark Russell
Sr. Global Market Manager, Medical
Electronics
Bal Seal Engineering, Inc.
mrussell@balseal.com
+1 630.765.7255
marketing@balseal.com www.balseal.com +1 949.460.2100 Design request form

14. Custom components that drive
tomorrow’s technologies®
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subject of issued or pending United States and foreign patents. Bal Seal Engineering, Inc. products and designs are PROPRIETARY and products may not be manufactured,
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