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O-1350-J
Improving Diagnostic Accuracy With
EMI Shielding Springs
David Wang, Global Market Manager
Bal Seal Engineering, Inc.
Slide 2
February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced,
copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc.
Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products
may not be manufactured, or caused to be manufactured, by any other party.
Common Medical Diagnostic
Equipment Environments
• Operating conditions
 High vibration
 Abrupt temperature rise
 High magnetism
 ‘Noisy’ high current motors
 Wide EM frequency range
• Design challenges
 Sensitive sensors
 Cable loss
 Low signal-to-noise ratio (SNR)
 Analog signals
 High image quality
 Mobile/compact
 Lightweight and flexible
 Multiple latch/unlatch cycles
Slide 3
February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced,
copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc.
Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products
may not be manufactured, or caused to be manufactured, by any other party.
Common Applications
• MRI
• X-rays
• Ultrasound
• Connectors
• Probes
• Surgical robots
• Endoscopes
Slide 4
February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced,
copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc.
Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products
may not be manufactured, or caused to be manufactured, by any other party.
What is Electromagnetic Interference (EMI)?
• EMI occurs when one (or more)
electronic device adversely
interferes with the operation of
another electronic device
• Any radio frequency (RF)
transmitting device has the
potential to interfere with the
operation of another device
• Different forms of EM energy can
cause EMI: conducted, radiated,
and electrostatic discharge (ESD)
• The strength of the EM field is
inversely proportional to the
distance, and is directly
proportional to the radiated power
of the transmitter
Slide 5
February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced,
copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc.
Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products
may not be manufactured, or caused to be manufactured, by any other party.
EMI Shielding: A Critical Element
• Increasing prevalence of
electronics and wireless
devices in medical equipment
• EMI problems with medical
devices can be very complex
from a technical perspective
and from a public health
standpoint
• More functions are being
performed by smaller devices
requiring less power, but more
susceptible to EMI
Slide 6
February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced,
copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc.
Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products
may not be manufactured, or caused to be manufactured, by any other party.
Approach to Solve EMI Problems
• The key is to recognize that EMI
involves not only the device itself
but also the environment in which it
is used, and anything that may
come into that environment
• EMI must be viewed as a systems
problem requiring a systems
approach
• Understand operating conditions
and attenuation requirements (i.e.,
IEC 60601-1-2, AAMI TIR 18, etc)
• Optimize hardware configuration
early in design stage
• Choose the right shielding type to
achieve repeated desired EMI
shielding effectiveness
Slide 7
February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced,
copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc.
Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products
may not be manufactured, or caused to be manufactured, by any other party.
Shielding Factors
• Factors that influence a shielding
component’s performance
 EM wave frequency
 Base material
 Plating material
 Applied force
 Hardware material
 Oxide/film layers
 Galvanic compatibility
 Component pitch/gap size
 Cycle & wear life
Slide 8
February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced,
copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc.
Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products
may not be manufactured, or caused to be manufactured, by any other party.
Common Shielding Solutions
• Fingerstock
• Ferrites
• Conductive elastomers
• Conductive adhesives
• Conductive fabric/foam
• Wire mesh
• Wire gasket
• Conductive paints/coatings
Slide 9
February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced,
copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc.
Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products
may not be manufactured, or caused to be manufactured, by any other party.
Canted Coil Spring: The Innovative Approach
• What is it?
 An engineered component
comprised of many precisely-angled
coils
 Capable of both electrical and
mechanical functions
 Mechanical – hold, latch, and lock
 Electrical – conductor, grounding, EMI
 Proven to provide effective shielding
in EMI critical applications
 Customizable
 Electrical conductivity and mechanical
forces are adjustable
 Gentle on hardware
Slide 10
February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced,
copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc.
Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products
may not be manufactured, or caused to be manufactured, by any other party.
The Canted Coil Spring Advantage
• High density coil pitch
• High electrical and RF
conductivity
 Multiple contact points
• Flat force vs. deflection
curve
 Compensates for hardware
variations and provides
consistent performance
• Secure latching and
customizable force
 Able to achieve over 10lbs
of latching force for a ¼”
diameter pin
Slide 11
February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced,
copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc.
Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products
may not be manufactured, or caused to be manufactured, by any other party.
Canted Coil Spring EMI Performance
• Test conducted between 100MHz to 1GHz
 50Ω characteristic impedance coaxial connector
with copper alloy spring
 Provided more than 90dB attenuation
0
10
20
30
40
50
60
70
80
90
100
100 325 550 775 1000
Attenuation(dB)
Frequency (MHz)
Attenuation vs. Frequency, 100MHz - 1GHz
No Spring BSE9 BSE3
Slide 12
February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced,
copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc.
Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products
may not be manufactured, or caused to be manufactured, by any other party.
Canted Coil Spring Additional Benefits
• 3-in-1 Component
 Electrical, mechanical, and EMI
 Simplifies system design
 Saves space and weight
 Tool-less and enables modular design
• Confident tactile connection
 Reliable through multiple mate and de-mate cycles
 Repeatable and consistent mechanical and
electrical performance.
 ‘Snap’ connection for audible confirmation
• Flexibility to take shapes other than circular
Slide 13
February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced,
copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc.
Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products
may not be manufactured, or caused to be manufactured, by any other party.
Optimizing the Shielding Design
Requirements Solutions
• EMI/RFI Shielding
• EMC
• FCC certification
• Minimize gaps, high coil pitch
• Increase contact force
• Bal Spring® material selection matched to
maximize galvanic compatibility, conductivity, and
RF absorption
• Base material: stainless steel or copper alloy
• Plating material: nickel
• Multiple contact points
• High signal quality
• Low loss
• Bal Spring® material selection matched to minimize
electrical resistance
• Base material: copper alloy
• Plating material: silver
• Modular tool-less design
• High mate/de-mate cycles
• Large tolerance
• Bal Spring® canted coil spring precisely controls
applied mechanical contact force
• Unique force curve administers consistent
pressure over large tolerance range
• Small form factor • Bal Spring® cross sections start as small as 0.016”
(0.40mm) and pin diameters 0.020” (0.50mm)
Slide 14
February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced,
copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc.
Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products
may not be manufactured, or caused to be manufactured, by any other party.
Summary & Recommendations
• To eliminate costly mistakes and delays,
consider EMI shielding requirements as
part of overall system design
• In the early stages, collaborate with Bal
Seal Engineering to:
 Custom design a EMI solution that meets
all your system/application requirements
 Receive complimentary consultative
engineering advice
 Hardware design review
 Produce high-quality spring prototypes
 Test to verify performance
 Force
 Conductivity
 Shielding effectiveness
 Cycle life
 Transition successful prototype to full
production
Slide 15
February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced,
copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc.
Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products
may not be manufactured, or caused to be manufactured, by any other party.
Resources & Contact Information
David Wang
Global Market Manager, Medical Devices
Bal Seal Engineering, Inc.
O: +1 949.460.2147
M: +1 949.322.3972
marketing@balseal.com www.balseal.com +1 949.460.2100 Design request form
Custom components that drive
tomorrow’s technologies®

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Improving Diagnostic Accuracy with EMI Shielding Springs

  • 1. O-1350-J Improving Diagnostic Accuracy With EMI Shielding Springs David Wang, Global Market Manager Bal Seal Engineering, Inc.
  • 2. Slide 2 February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced, copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc. Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products may not be manufactured, or caused to be manufactured, by any other party. Common Medical Diagnostic Equipment Environments • Operating conditions  High vibration  Abrupt temperature rise  High magnetism  ‘Noisy’ high current motors  Wide EM frequency range • Design challenges  Sensitive sensors  Cable loss  Low signal-to-noise ratio (SNR)  Analog signals  High image quality  Mobile/compact  Lightweight and flexible  Multiple latch/unlatch cycles
  • 3. Slide 3 February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced, copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc. Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products may not be manufactured, or caused to be manufactured, by any other party. Common Applications • MRI • X-rays • Ultrasound • Connectors • Probes • Surgical robots • Endoscopes
  • 4. Slide 4 February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced, copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc. Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products may not be manufactured, or caused to be manufactured, by any other party. What is Electromagnetic Interference (EMI)? • EMI occurs when one (or more) electronic device adversely interferes with the operation of another electronic device • Any radio frequency (RF) transmitting device has the potential to interfere with the operation of another device • Different forms of EM energy can cause EMI: conducted, radiated, and electrostatic discharge (ESD) • The strength of the EM field is inversely proportional to the distance, and is directly proportional to the radiated power of the transmitter
  • 5. Slide 5 February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced, copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc. Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products may not be manufactured, or caused to be manufactured, by any other party. EMI Shielding: A Critical Element • Increasing prevalence of electronics and wireless devices in medical equipment • EMI problems with medical devices can be very complex from a technical perspective and from a public health standpoint • More functions are being performed by smaller devices requiring less power, but more susceptible to EMI
  • 6. Slide 6 February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced, copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc. Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products may not be manufactured, or caused to be manufactured, by any other party. Approach to Solve EMI Problems • The key is to recognize that EMI involves not only the device itself but also the environment in which it is used, and anything that may come into that environment • EMI must be viewed as a systems problem requiring a systems approach • Understand operating conditions and attenuation requirements (i.e., IEC 60601-1-2, AAMI TIR 18, etc) • Optimize hardware configuration early in design stage • Choose the right shielding type to achieve repeated desired EMI shielding effectiveness
  • 7. Slide 7 February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced, copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc. Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products may not be manufactured, or caused to be manufactured, by any other party. Shielding Factors • Factors that influence a shielding component’s performance  EM wave frequency  Base material  Plating material  Applied force  Hardware material  Oxide/film layers  Galvanic compatibility  Component pitch/gap size  Cycle & wear life
  • 8. Slide 8 February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced, copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc. Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products may not be manufactured, or caused to be manufactured, by any other party. Common Shielding Solutions • Fingerstock • Ferrites • Conductive elastomers • Conductive adhesives • Conductive fabric/foam • Wire mesh • Wire gasket • Conductive paints/coatings
  • 9. Slide 9 February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced, copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc. Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products may not be manufactured, or caused to be manufactured, by any other party. Canted Coil Spring: The Innovative Approach • What is it?  An engineered component comprised of many precisely-angled coils  Capable of both electrical and mechanical functions  Mechanical – hold, latch, and lock  Electrical – conductor, grounding, EMI  Proven to provide effective shielding in EMI critical applications  Customizable  Electrical conductivity and mechanical forces are adjustable  Gentle on hardware
  • 10. Slide 10 February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced, copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc. Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products may not be manufactured, or caused to be manufactured, by any other party. The Canted Coil Spring Advantage • High density coil pitch • High electrical and RF conductivity  Multiple contact points • Flat force vs. deflection curve  Compensates for hardware variations and provides consistent performance • Secure latching and customizable force  Able to achieve over 10lbs of latching force for a ¼” diameter pin
  • 11. Slide 11 February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced, copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc. Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products may not be manufactured, or caused to be manufactured, by any other party. Canted Coil Spring EMI Performance • Test conducted between 100MHz to 1GHz  50Ω characteristic impedance coaxial connector with copper alloy spring  Provided more than 90dB attenuation 0 10 20 30 40 50 60 70 80 90 100 100 325 550 775 1000 Attenuation(dB) Frequency (MHz) Attenuation vs. Frequency, 100MHz - 1GHz No Spring BSE9 BSE3
  • 12. Slide 12 February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced, copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc. Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products may not be manufactured, or caused to be manufactured, by any other party. Canted Coil Spring Additional Benefits • 3-in-1 Component  Electrical, mechanical, and EMI  Simplifies system design  Saves space and weight  Tool-less and enables modular design • Confident tactile connection  Reliable through multiple mate and de-mate cycles  Repeatable and consistent mechanical and electrical performance.  ‘Snap’ connection for audible confirmation • Flexibility to take shapes other than circular
  • 13. Slide 13 February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced, copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc. Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products may not be manufactured, or caused to be manufactured, by any other party. Optimizing the Shielding Design Requirements Solutions • EMI/RFI Shielding • EMC • FCC certification • Minimize gaps, high coil pitch • Increase contact force • Bal Spring® material selection matched to maximize galvanic compatibility, conductivity, and RF absorption • Base material: stainless steel or copper alloy • Plating material: nickel • Multiple contact points • High signal quality • Low loss • Bal Spring® material selection matched to minimize electrical resistance • Base material: copper alloy • Plating material: silver • Modular tool-less design • High mate/de-mate cycles • Large tolerance • Bal Spring® canted coil spring precisely controls applied mechanical contact force • Unique force curve administers consistent pressure over large tolerance range • Small form factor • Bal Spring® cross sections start as small as 0.016” (0.40mm) and pin diameters 0.020” (0.50mm)
  • 14. Slide 14 February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced, copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc. Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products may not be manufactured, or caused to be manufactured, by any other party. Summary & Recommendations • To eliminate costly mistakes and delays, consider EMI shielding requirements as part of overall system design • In the early stages, collaborate with Bal Seal Engineering to:  Custom design a EMI solution that meets all your system/application requirements  Receive complimentary consultative engineering advice  Hardware design review  Produce high-quality spring prototypes  Test to verify performance  Force  Conductivity  Shielding effectiveness  Cycle life  Transition successful prototype to full production
  • 15. Slide 15 February 18 ©Bal Seal Engineering, Inc. This document contains and/or refers to PROPRIETARY information of Bal Seal Engineering, Inc., and may not be reproduced, copied, published, or distributed in any form or disclosed to a third party, in whole or in part, without the written authorization of an officer of Bal Seal Engineering, Inc. Products are the subject of issued or pending United States and foreign patents. Products of Bal Seal Engineering, Inc. and this document are PROPRIETARY and products may not be manufactured, or caused to be manufactured, by any other party. Resources & Contact Information David Wang Global Market Manager, Medical Devices Bal Seal Engineering, Inc. O: +1 949.460.2147 M: +1 949.322.3972 marketing@balseal.com www.balseal.com +1 949.460.2100 Design request form
  • 16. Custom components that drive tomorrow’s technologies®