Presented by Alain Legault, Hardent Inc.; Joe Rodriguez, Rambus Inc.; and Justin Endo, Mixel, Inc.
Next-generation display applications have an insatiable appetite for bandwidth. Using a combination of VESA Display Stream Compression (DSC) and MIPI DSI-2℠ technology, designers can achieve display resolutions up to 8K without compromise to video quality, battery life or cost. This presentation discusses a fully integrated, off-the-shelf display IP subsystem solution, consisting of Mixel (MIPI C-PHY℠/D-PHY℠ combo), Rambus (MIPI DSI-2® controller) and Hardent (VESA DSC) IP, that can deliver this state-of-the-art performance in a power-efficient and compact footprint.
MIPI DevCon 2016: Testing of MIPI High Speed PHY Standard ImplementationsMIPI Alliance
Interoperability in mobile devices shall be achieved through a variety of protocol standards such as MIPI CSI, DSI, UniPro or JEDEC UFS and their underlying physical layer standards MIPI M-PHY, D-PHY or C-PHY. Integration of different vendors' designs into a working system is simplified using standard conformant parts. Testing them according to the procedures outlined in the applicable Conformance Test Suite guarantees their conformance. However, increasing data rates, lower power dissipation and modularity of mobile devices create challenges for debugging and conformance verification of the affected components. In this presentation, Joel Birch of Keysight Technologies discusses these challenges and offers possible solutions to address them.
MIPI DevCon Seoul 2018: Dual Mode C-PHY/D-PHY Use in VR Display IC MIPI Alliance
This co-presentation from Ahmed Ella of Mixel, Inc., and Jeffrey Lukanc of Synaptics, will cover Synaptics VXR7200 DisplayPort to Dual MIPI VR Bridge IC, integrating a Mixel C-PHY℠/D-PHY℠ Combo IP and controller.
In this presentation, George Wiley of Qualcomm Technologies discusses the unique properties of the MIPI C-PHY physical layer, as well as system-level benefits and values for camera and display interfaces.
The D-PHY specification, since the release of its first version more than a decade ago, continues to evolve and push the envelope of throughput to support current and future needs of mobile interfaces – camera and display in particular. In this process, PHY layer test and measurement solutions are posed with newer challenges to provide for the feature additions to the specification. This presentation by Parthasarathy Raju and Suryakant Kumar of Tektronix discusses an introduction to both transmitter and receiver characteristics of D-PHY, and highlights the importance of test modes. Also discussed are test/measurement solutions to overcome these challenges and simplify the testing of devices to accomplish conformance.
Presented by James Goel, MIPI Technical Steering Group chair, and Rick Wietfeldt, Security Working Group co-chair
This session brings you up to speed on all the latest developments within MIPI Automotive SerDes Solutions (MASS) – a framework that provides a full-stack, end-to-end sensor/display-to-ECU solution for autonomous driving and ADAS systems that leverage existing MIPI CSI-2®, DSI-2℠ and VESA eDP/DP protocols running over MIPI A-PHY℠. The presentation also explains how recent developments make it easier for you to integrate MIPI A-PHY into your next automotive E/E architecture and how, through A-PHY's adoption as an IEEE standard, it can be accessed for evaluation without MIPI membership.
In addition, the presenters discuss how recently released MIPI Camera and Display Service Extensions (CSE and DSE) and their associated protocol adaptation layers (PALs) work together to embed functional safety and security enablers natively at the "edge" – ultimately within the sensor, display and ECU components themselves.
MIPI DevCon 2016: MIPI CSI-2 Application for Vision and Sensor Fusion SystemsMIPI Alliance
The expanding demand for imaging- and vision-based systems in mobile, IoT and automotive products is making the need for multi camera and sensor fusion systems look for novel ways to gather and process multiple data streams while still fitting into the mobile interface. The CSI-2 protocol allows camera sensor and processed image data to be combined into a single data stream using interleaving, allowing the application processor to extract the image data using the virtual channel or data type information. In this presentation, Richard Sproul of Cadence Design Systems will highlight some of the key details and requirements for a system with image processing of multi camera/sensor systems.
MIPI DevCon 2016: How to Use the VESA Display Stream Compression (DSC) Standa...MIPI Alliance
The VESA Display Stream Compression (DSC) standard is a visually lossless video compression algorithm that decreases transmission bandwidth by up to 3X, while lowering power and reducing EMI. The standard has been adopted by leading suppliers of semiconductors for use in mobiles, tablets, in-car video, and DTV applications in order to achieve higher resolution displays. This presentation by Hardent's Alain Legault provides background information about DSC and the role it plays in today’s interface IP ecosystem when combined with MIPI® DSI, USB Type-C™, DisplayPort™ and Embedded DisplayPort™, and HDMI™ IPs. Several use cases are discussed, and practical information on how to successfully integrate DSC in semiconductor designs is also provided.
MIPI DevCon 2016: Testing of MIPI High Speed PHY Standard ImplementationsMIPI Alliance
Interoperability in mobile devices shall be achieved through a variety of protocol standards such as MIPI CSI, DSI, UniPro or JEDEC UFS and their underlying physical layer standards MIPI M-PHY, D-PHY or C-PHY. Integration of different vendors' designs into a working system is simplified using standard conformant parts. Testing them according to the procedures outlined in the applicable Conformance Test Suite guarantees their conformance. However, increasing data rates, lower power dissipation and modularity of mobile devices create challenges for debugging and conformance verification of the affected components. In this presentation, Joel Birch of Keysight Technologies discusses these challenges and offers possible solutions to address them.
MIPI DevCon Seoul 2018: Dual Mode C-PHY/D-PHY Use in VR Display IC MIPI Alliance
This co-presentation from Ahmed Ella of Mixel, Inc., and Jeffrey Lukanc of Synaptics, will cover Synaptics VXR7200 DisplayPort to Dual MIPI VR Bridge IC, integrating a Mixel C-PHY℠/D-PHY℠ Combo IP and controller.
In this presentation, George Wiley of Qualcomm Technologies discusses the unique properties of the MIPI C-PHY physical layer, as well as system-level benefits and values for camera and display interfaces.
The D-PHY specification, since the release of its first version more than a decade ago, continues to evolve and push the envelope of throughput to support current and future needs of mobile interfaces – camera and display in particular. In this process, PHY layer test and measurement solutions are posed with newer challenges to provide for the feature additions to the specification. This presentation by Parthasarathy Raju and Suryakant Kumar of Tektronix discusses an introduction to both transmitter and receiver characteristics of D-PHY, and highlights the importance of test modes. Also discussed are test/measurement solutions to overcome these challenges and simplify the testing of devices to accomplish conformance.
Presented by James Goel, MIPI Technical Steering Group chair, and Rick Wietfeldt, Security Working Group co-chair
This session brings you up to speed on all the latest developments within MIPI Automotive SerDes Solutions (MASS) – a framework that provides a full-stack, end-to-end sensor/display-to-ECU solution for autonomous driving and ADAS systems that leverage existing MIPI CSI-2®, DSI-2℠ and VESA eDP/DP protocols running over MIPI A-PHY℠. The presentation also explains how recent developments make it easier for you to integrate MIPI A-PHY into your next automotive E/E architecture and how, through A-PHY's adoption as an IEEE standard, it can be accessed for evaluation without MIPI membership.
In addition, the presenters discuss how recently released MIPI Camera and Display Service Extensions (CSE and DSE) and their associated protocol adaptation layers (PALs) work together to embed functional safety and security enablers natively at the "edge" – ultimately within the sensor, display and ECU components themselves.
MIPI DevCon 2016: MIPI CSI-2 Application for Vision and Sensor Fusion SystemsMIPI Alliance
The expanding demand for imaging- and vision-based systems in mobile, IoT and automotive products is making the need for multi camera and sensor fusion systems look for novel ways to gather and process multiple data streams while still fitting into the mobile interface. The CSI-2 protocol allows camera sensor and processed image data to be combined into a single data stream using interleaving, allowing the application processor to extract the image data using the virtual channel or data type information. In this presentation, Richard Sproul of Cadence Design Systems will highlight some of the key details and requirements for a system with image processing of multi camera/sensor systems.
MIPI DevCon 2016: How to Use the VESA Display Stream Compression (DSC) Standa...MIPI Alliance
The VESA Display Stream Compression (DSC) standard is a visually lossless video compression algorithm that decreases transmission bandwidth by up to 3X, while lowering power and reducing EMI. The standard has been adopted by leading suppliers of semiconductors for use in mobiles, tablets, in-car video, and DTV applications in order to achieve higher resolution displays. This presentation by Hardent's Alain Legault provides background information about DSC and the role it plays in today’s interface IP ecosystem when combined with MIPI® DSI, USB Type-C™, DisplayPort™ and Embedded DisplayPort™, and HDMI™ IPs. Several use cases are discussed, and practical information on how to successfully integrate DSC in semiconductor designs is also provided.
During the CXL Forum at OCP Global Summit 23, Rick Kutcipal and Sreeni Bagalkote of Broadcom presented their PCIe/CXL Roadmap and announced their Atlas 4 CXL switch.
MIPI DevCon 2020 | Why an Integrated MIPI C-PHY/D-PHY IP is EssentialMIPI Alliance
Licinio Sousa of Synopsys describes the key advantages of the latest MIPI C-PHY℠ and D-PHY℠ specifications and how designers are implementing them in multipixel cameras and high-resolution displays targeting mobile, drone and automotive applications.
MPI DevCon Hsinchu City 2017: Next generation MIPI Physical Layer Design and ...MIPI Alliance
SK Choi of Keysight Technologies looks at the key changes in the new MIPI C-PHY, MIPI D-PHY and MIPI M-PHY specifications, as well as the CTS (conformance test suite), and addresses the challenges to support the new PHY layer. The new MIPI PHY specifications will bring new technology innovation that will also bring new challenges to design or evaluation engineering.
MIPI DevCon 2021: MIPI D-PHY and MIPI CSI-2 for IoT: AI Edge DevicesMIPI Alliance
Presented by Ashraf Takla, Mixel Inc.
This presentation covers the deployment of MIPI D-PHY℠ and MIPI CSI-2® in IoT and edge devices. While many mobile-influenced applications benefit from the low-power, small-form factor of MIPI specifications, AI edge processors in particular are seeing a surge in the use of MIPI specifications for their sensors as market trends shift from processing in the cloud or central location, to processing at the edge.
This presentation includes a high-level system overview of a specific use case, Perceive Ergo edge inference processor, and how Mixel was able to meet Perceive’s stringent requirements with its MIPI D-PHY CSI-2 TX and D-PHY CSI-2 RX IPs.
2019 Local I/O ESD protection for 28Gbps to 112Gbps SerDes interfaces in adva...Sofics
2019 Taiwan ESD and reliability conference
Semiconductor companies are developing ever faster wireless, wired and optical interfaces to satisfy the need for higher data throughputs. They rely on BiCMOS, advanced CMOS and FinFET nodes with ESD-sensitive circuits. However, the parasitic capacitance of the traditional ESD solutions limits the signal frequency. This paper demonstrates small area and low-cap Analog I/Os used in TSMC 28nm CMOS and TSMC 16nm, 12nm, 7nm FinFET technologies for high speed SerDes (28Gbps to 112Gbps) circuits. Parasitic capacitance of the ESD solutions is reduced below 100fF and for some silicon photonics applications even below 20fF.
The use of multiple cameras applications is exploding. We're not just talking about 2 cameras for 3D or depth sensing, but 3-12 cameras for applications like drones, robotics, automotive, etc. The increasing use of multiple cameras combined with the growing use of mobile components such as apps processors, image sensors, displays, etc., being used by the broad market requires logic to connect these devices. In this presentation, Ted Marena of Microsemi explains how FPGAs can be used to leverage mobile components to aggregate a large number of MIPI CSI-2 camera interfaces.
Evaluating UCIe based multi-die SoC to meet timing and power Deepak Shankar
Multi-die designs allow systems engineering to pack more functionality with different timing and power constraints into a single package. Older generation multi-die split the dies into high-speed and low speed. Newer, high-performance multi-die System-on-Chip (SoC) requires interaction between memories across the die-to-die interfaces. Connections between dies must be power efficient, have low latency, provide high bandwidth to transfer massive amounts of data, and deliver error-free operation. The distribution of cores, deep neural networks and AI engines across these dies makes it extremely hard to predict the expected end-to-end latency, power spikes and effective bandwidth. Moreover, Multi-die architectures have evolved from proprietary to industry standard UCIe.
This Webinar looks at the system-wide view of performance and power in a multi-die SOC. We will be showcasing a few use cases that combines various types of processing engines across PCIe and interconnected UCIe. This modeling effort will present the user with different system performance and system architecture models and a guide on how to best bring different aspects of their design together in a holistic way that is optimized for power, timing and functionality.
During the Webinar, users can follow along using VisualSim Cloud. To get started with VisualSim Cloud, users can register and receive a login at https://www.mirabilisdesign.com/visualsim-cloud-login/. Once you receive the login, follow the instructions, and open the models provided in the Template pull-down. More instructions will be provided at the start of the Webinar.
MIPI DevCon Bangalore 2017: C-PHY and How it Enables Next Generation Display ...MIPI Alliance
Mohamed Hafed of Introspect Technology follows up the previous MIPI C-PHY introduction presentations with this presentation on MIPI C-PHY basics and the latest enhancements in recent revisions of the specification. Subsequently, presenters delve into a description of innovations in the next generation MIPI CSI-2 and MIPI DSI-2 protocols that are made possible by quite elegant properties of the MIPI C-PHY encoding scheme and its associated MIPI Alliance specification innovations.
MIPI DevCon Seoul 2018: Troubleshooting MIPI M-PHY Link and Protocol IssuesMIPI Alliance
Gordon Getty and Juhyun Yang, both of Teledyne LeCroy, discuss how higher-layer protocols, including UniPro® and UFS, use MIPI M-PHY® to provide an efficient, low-power storage protocol to be enabled on mobile platforms.
Evaluating GPU programming Models for the LUMI SupercomputerGeorge Markomanolis
It is common in the HPC community that the achieved performance with just CPUs is limited for many computational cases. The EuroHPC pre-exascale and the coming exascale systems are mainly focused on accelerators, and some of the largest upcoming supercomputers such as LUMI and Frontier will be powered by AMD Instinct accelerators. However, these new systems create many challenges for developers who are not familiar with the new ecosystem or with the required programming models that can be used to program for heterogeneous architectures. In this paper, we present some of the more well-known programming models to program for current and future GPU systems. We then measure the performance of each approach using a benchmark and a mini-app, test with various compilers, and tune the codes where necessary. Finally, we compare the performance, where possible, between the NVIDIA Volta (V100), Ampere (A100) GPUs, and the AMD MI100 GPU.
Presentation of a paper accepted in Supercomputing Frontiers Asia 2022
Alain Legault, VP IP Products at Hardent, discusses how the combination of VDC-M and MIPI DSI-2℠ can support the development of sophisticated mobile, AR/VR and automotive displays, provides an overview of the VDC-M algorithm and use cases.
MIPI DevCon Seoul 2018: High-Performance VR Applications Drive High-Resolutio...MIPI Alliance
This presentation by Miguel Rodriguez discusses Analogix's DisplayPort to MIPI DSI℠ controller for VR HMDs, which powers today’s tethered VR headsets in various configurations with distinct benefits and performance levels.
During the CXL Forum at OCP Global Summit 23, Rick Kutcipal and Sreeni Bagalkote of Broadcom presented their PCIe/CXL Roadmap and announced their Atlas 4 CXL switch.
MIPI DevCon 2020 | Why an Integrated MIPI C-PHY/D-PHY IP is EssentialMIPI Alliance
Licinio Sousa of Synopsys describes the key advantages of the latest MIPI C-PHY℠ and D-PHY℠ specifications and how designers are implementing them in multipixel cameras and high-resolution displays targeting mobile, drone and automotive applications.
MPI DevCon Hsinchu City 2017: Next generation MIPI Physical Layer Design and ...MIPI Alliance
SK Choi of Keysight Technologies looks at the key changes in the new MIPI C-PHY, MIPI D-PHY and MIPI M-PHY specifications, as well as the CTS (conformance test suite), and addresses the challenges to support the new PHY layer. The new MIPI PHY specifications will bring new technology innovation that will also bring new challenges to design or evaluation engineering.
MIPI DevCon 2021: MIPI D-PHY and MIPI CSI-2 for IoT: AI Edge DevicesMIPI Alliance
Presented by Ashraf Takla, Mixel Inc.
This presentation covers the deployment of MIPI D-PHY℠ and MIPI CSI-2® in IoT and edge devices. While many mobile-influenced applications benefit from the low-power, small-form factor of MIPI specifications, AI edge processors in particular are seeing a surge in the use of MIPI specifications for their sensors as market trends shift from processing in the cloud or central location, to processing at the edge.
This presentation includes a high-level system overview of a specific use case, Perceive Ergo edge inference processor, and how Mixel was able to meet Perceive’s stringent requirements with its MIPI D-PHY CSI-2 TX and D-PHY CSI-2 RX IPs.
2019 Local I/O ESD protection for 28Gbps to 112Gbps SerDes interfaces in adva...Sofics
2019 Taiwan ESD and reliability conference
Semiconductor companies are developing ever faster wireless, wired and optical interfaces to satisfy the need for higher data throughputs. They rely on BiCMOS, advanced CMOS and FinFET nodes with ESD-sensitive circuits. However, the parasitic capacitance of the traditional ESD solutions limits the signal frequency. This paper demonstrates small area and low-cap Analog I/Os used in TSMC 28nm CMOS and TSMC 16nm, 12nm, 7nm FinFET technologies for high speed SerDes (28Gbps to 112Gbps) circuits. Parasitic capacitance of the ESD solutions is reduced below 100fF and for some silicon photonics applications even below 20fF.
The use of multiple cameras applications is exploding. We're not just talking about 2 cameras for 3D or depth sensing, but 3-12 cameras for applications like drones, robotics, automotive, etc. The increasing use of multiple cameras combined with the growing use of mobile components such as apps processors, image sensors, displays, etc., being used by the broad market requires logic to connect these devices. In this presentation, Ted Marena of Microsemi explains how FPGAs can be used to leverage mobile components to aggregate a large number of MIPI CSI-2 camera interfaces.
Evaluating UCIe based multi-die SoC to meet timing and power Deepak Shankar
Multi-die designs allow systems engineering to pack more functionality with different timing and power constraints into a single package. Older generation multi-die split the dies into high-speed and low speed. Newer, high-performance multi-die System-on-Chip (SoC) requires interaction between memories across the die-to-die interfaces. Connections between dies must be power efficient, have low latency, provide high bandwidth to transfer massive amounts of data, and deliver error-free operation. The distribution of cores, deep neural networks and AI engines across these dies makes it extremely hard to predict the expected end-to-end latency, power spikes and effective bandwidth. Moreover, Multi-die architectures have evolved from proprietary to industry standard UCIe.
This Webinar looks at the system-wide view of performance and power in a multi-die SOC. We will be showcasing a few use cases that combines various types of processing engines across PCIe and interconnected UCIe. This modeling effort will present the user with different system performance and system architecture models and a guide on how to best bring different aspects of their design together in a holistic way that is optimized for power, timing and functionality.
During the Webinar, users can follow along using VisualSim Cloud. To get started with VisualSim Cloud, users can register and receive a login at https://www.mirabilisdesign.com/visualsim-cloud-login/. Once you receive the login, follow the instructions, and open the models provided in the Template pull-down. More instructions will be provided at the start of the Webinar.
MIPI DevCon Bangalore 2017: C-PHY and How it Enables Next Generation Display ...MIPI Alliance
Mohamed Hafed of Introspect Technology follows up the previous MIPI C-PHY introduction presentations with this presentation on MIPI C-PHY basics and the latest enhancements in recent revisions of the specification. Subsequently, presenters delve into a description of innovations in the next generation MIPI CSI-2 and MIPI DSI-2 protocols that are made possible by quite elegant properties of the MIPI C-PHY encoding scheme and its associated MIPI Alliance specification innovations.
MIPI DevCon Seoul 2018: Troubleshooting MIPI M-PHY Link and Protocol IssuesMIPI Alliance
Gordon Getty and Juhyun Yang, both of Teledyne LeCroy, discuss how higher-layer protocols, including UniPro® and UFS, use MIPI M-PHY® to provide an efficient, low-power storage protocol to be enabled on mobile platforms.
Evaluating GPU programming Models for the LUMI SupercomputerGeorge Markomanolis
It is common in the HPC community that the achieved performance with just CPUs is limited for many computational cases. The EuroHPC pre-exascale and the coming exascale systems are mainly focused on accelerators, and some of the largest upcoming supercomputers such as LUMI and Frontier will be powered by AMD Instinct accelerators. However, these new systems create many challenges for developers who are not familiar with the new ecosystem or with the required programming models that can be used to program for heterogeneous architectures. In this paper, we present some of the more well-known programming models to program for current and future GPU systems. We then measure the performance of each approach using a benchmark and a mini-app, test with various compilers, and tune the codes where necessary. Finally, we compare the performance, where possible, between the NVIDIA Volta (V100), Ampere (A100) GPUs, and the AMD MI100 GPU.
Presentation of a paper accepted in Supercomputing Frontiers Asia 2022
Alain Legault, VP IP Products at Hardent, discusses how the combination of VDC-M and MIPI DSI-2℠ can support the development of sophisticated mobile, AR/VR and automotive displays, provides an overview of the VDC-M algorithm and use cases.
MIPI DevCon Seoul 2018: High-Performance VR Applications Drive High-Resolutio...MIPI Alliance
This presentation by Miguel Rodriguez discusses Analogix's DisplayPort to MIPI DSI℠ controller for VR HMDs, which powers today’s tethered VR headsets in various configurations with distinct benefits and performance levels.
Through these 10 GigE (Gigabit Ethernet) Vision slides you will cover all the given below topics:
1- About Emergent Vision Technologies
2- Industry Standards
3- What is 10 GigE
4- Why 10 GigE
5- HT-Series & HR Series Cameras
6- Sony Pregius IMX253, IMX252, IMX250 and IMX255
7- CMOSIS CMV20000, CMV50000 Image Sensors
8- Network Interface Cards (NIC) Cards
9- Cables, Transceivers and Powersupplies
10- Machine Vision Application
11- Frequently Asked Questions
MIPI DevCon Seoul 2018: Powering AI and Automotive Applications with the MIPI...MIPI Alliance
Hyoung-Bae Choi of Synopsys, Inc. discusses use cases and the implementation of MIPI's camera interface in automotive and AI applications, along with the benefits of MIPI I3C℠ in the MIPI camera solution.
MIPI DevCon 2016: Image Sensor and Display Connectivity DisruptionMIPI Alliance
The ability to leverage mobile technologies into new consumer, medical, industrial, and automotive markets creates challenges in image sensor and display interfacing. When interface types or number of the interfaces do not match between image sensors, displays and processors, a bridge is required to enable such connectivity. In this presentation, Grant Jennings of Lattice Semiconductor describes connectivity through programmable interface bridges to aid in the development of these systems that were unforeseen or previously could not be rationalized.
MPI DevCon Hsinchu City 2017: Create Higher Resolution Displays With VESA Dis...MIPI Alliance
Alain Legault of Hardent discusses the challenges of designing products to meet the demands of current and future displays and highlights how DSC compression offers an innovative solution to deal with these challenges.
Lattice has introduced its CrossLink™ programmable bridging device that supports leading protocols for mobile image sensors and displays. Systems with embedded cameras and displays often do not have the right type or number of interfaces, which can be resolved using a bridge. The new CrossLink device combines the flexibility and fast time to market of an FPGA with the power and functional optimization of an ASSP to create a new product class called programmable ASSP (pASSP™).
Hai Tao at AI Frontiers: Deep Learning For Embedded Vision SystemAI Frontiers
This presentation will demonstrate our recent progress in developing advanced computer vision algorithms using embedded platforms for video-based face recognition, vehicle attribute analysis, urban management event detection, and high-density crowd counting. These algorithms combine the traditional CV approach with recent advances in deep learning to make high-performance computer vision systems practical and enable products in several vertical markets including intelligent transportation systems (ITS), business intelligence (BI), and smart video surveillance. We will demonstrate algorithm design and optimization scheme for several recently available processors from Movidius, Nvidia, and ARM.
MIPI DevCon 2021: MIPI I3C Under the Spotlight: A Fireside Chat with the I3C ...MIPI Alliance
Panel discussion with Tim McKee, MIPI I3C Working Group chair; Matthew Schnoor; Eyuel Zewdu Teferi, MIPI I3C Basic Ad-hoc Working Group vice chair; and Radu Pitigoi-Aron
This session puts MIPI I3C® "under the spotlight" by assembling a panel of experts to talk about the latest developments in the world of I3C. The panel discusses the latest I3C specifications (including the latest HCI specification), how to address conformance in the absence of face-to-face plug fests, and how the MIPI I3C interface is being leveraged by other standards organizations.
MIPI DevCon 2021: MIPI I3C Application and Validation Models for IoT Sensor N...MIPI Alliance
Presented by Eyuel Zewdu Teferi, David Schumacher and Souha Kouki, STMicroelectronics
This presentation provides a global overview of using MIPI I3C® protocol for on-board communication among subsystems of an IoT sensor node. It includes adoption of MIPI CTS by using SysML models of requirements and test cases as an approach to manage I3C application use cases requirement validation.
MIPI DevCon 2021: MIPI I3C Signal Integrity Challenges on DDR5-based Server P...MIPI Alliance
Presented by Azusena Lupercio Ramirez, Juan Orozco and Nestor Hernandez Cruz, Intel Corporation
The MIPI I3C® protocol is first used in a server application for the DDR5 DIMM SPD function. MIPI I3C was defined for low capacitance applications, while DDR5 SPD exceeds by far the bus capacitance specification. This presentation covers the interoperability challenges of the dynamic push-pull and open-drain operating modes, on server applications with an in-depth analysis of the implications of long PCB traces, multiple DIMM routing branches, and multiple loads to the electrical and timing parameters.
MIPI DevCon 2021: MIPI I3C interface for the ETSI Smart Secure PlatformMIPI Alliance
Presented by Gulio Follero, ETSI
The ETSI Technical Committee Smart Card Platform (TC SCP) is developing the specification of the next generation secure element, the Smart Secure Platform (SSP). SCP is standardizing the MIPI I3C interface for SSP. This presentation describes the SSP architecture and its main use cases, followed by a discussion of how the MIPI I3C interface is adapted to the SSP and the main benefits in terms of speed, power and efficiency.
MIPI DevCon 2021: MIPI Security for Automotive and IoT – Initial Focus on MASSMIPI Alliance
Presented by Philip Hawkes and Rick Wietfeldt, co-chairs of the MIPI Security Working Group
MIPI Automotive SerDes Solutions (MASS) allows transmission of sensor and display data between sensors, electronic control units (ECUs) and displays distributed around a vehicle. The MIPI Security Working Group is developing a MASS security framework for protecting this data against malicious attacks.
This session covers the objectives of the security framework and explains how the framework achieves those objectives.
MIPI DevCon 2021: MIPI HTI, PTI and STP: The Bases for Next-Generation Online...MIPI Alliance
Presented by Thomas B. Preußer and Alexander Weiss, Accemic Technologies GmbH
The key challenge for testing and debugging embedded multicore systems is their limited observability. MIPI trace protocols provide essential operational insights non-intrusively, and this presentation advocates for the continuous online analysis of these trace data. It also contrasts the challenges posed by the vigorously compressed MIPI trace protocols with the enormous benefits that can be gained by online processing.
MIPI DevCon 2021: MIPI CSI-2 v4.0 Panel Discussion with the MIPI Camera Worki...MIPI Alliance
Panel discussion with Haran Thanigasalam, Intel Corporation, MIPI Camera Working Group chair; Natsuko Ibuki, Google, LLC;
Yuichi Mizutani, Sony Corporation; and Wonseok Lee, Samsung Electronics, Co.
Presented by Licinio Sousa, Synopsys, Inc., and Edo Cohen, Valens Semiconductor
Synopsys and Valens Semiconductor outline how MIPI automotive solutions can enable safe and robust long-reach connectivity for cameras and sensors. The ability for high volumes of data to travel at a fast rate over a long reach infrastructure is now mandatory in automotive vision applications. In addition, maintaining a reliable link can be the difference between successful operation and system failure in a car. In this presentation, Synopsys and Valens present a Valens MIPI A-PHY℠ design for in-vehicle connectivity using Synopsys’ ISO 26262-ready MIPI CSI-2® and MIPI C-PHY℠/D-PHY℠ IP in the FinFET process to meet their latency and bandwidth requirements. The presentation also previews examples of display applications that can benefit from the same architecture.
MIPI DevCon 2021: The MIPI Specification Roadmap: Driving Advancements in Mob...MIPI Alliance
Presented by James Goel, MIPI Technical Steering Group Chair
Despite the many challenges over the past year, MIPI Alliance is on track to release more specifications in 2021 than in any other year in the organization's history. This packed schedule covers updates to many of MIPI's most popular specifications, including all physical layer specifications, MIPI I3C® and I3C Basic℠, and those for camera and display, in addition to introducing several new specifications. James Goel, chair of the MIPI Technical Steering Group, highlights some of the key specifications released over the past year and then provides a look at what's still to come. He' also provides an overview of MIPI's development activity in particular focus areas, such as automotive, IoT, 5G and security.
MIPI DevCon 2021: State of the AllianceMIPI Alliance
Get an update on MIPI Alliance priority initiatives in mobile and in the beyond-mobile focus areas of automotive, IoT and 5G. Peter Lefkin, MIPI managing director, discusses collaborative efforts within the Alliance and industry, as well as progress toward strategic priorities, including the development of key specifications and resources, education opportunities, outreach and other activities to support the MIPI member ecosystem.
MIPI DevCon 2020 | Snapshot of MIPI RFFE v3.0 from a System-Architecture Per...MIPI Alliance
Lalan Mishra, vice-chair of the MIPI RFFE Working Group, presents the new features of MIPI RFFE v3.0 to help architecture and design engineers understand how the triggering features in the latest version work together to improve performance and to switch quickly among the various bands and band combinations in a 5G system.
MIPI DevCon 2020 | The Story Behind the MIPI I3C HCI Driver for LinuxMIPI Alliance
Nicolas Pitre of BayLibre covers the work that has been done to date to plan Linux support when new technology is developed and a quick overview of future development.
MIPI DevCon 2020 | Interoperability Challenges and Solutions for MIPI I3CMIPI Alliance
This presentation from Geoffrey Duerden of Introspect Technology features a case study of several specific interoperability challenges and solutions in terms of circuit and layout guidelines, protocol implementations and target applications.
MIPI DevCon 2020 | MIPI to Bluetooth LE: Leveraging Mobile Technology for Wir...MIPI Alliance
Grant Jennings of GOWIN Semiconductor shares use case examples in the wireless IoT space found while helping customers develop new types of solutions with the first SoC FPGA with built in Bluetooth Low Energy (LE) transceiver.
Kevin Yee, chair of MIPI Marketing Steering Group, and Ian Smith, MIPI technical content manager and author of the MIPI Alliance IoT White Paper, explain the advantages of using MIPI specifications within IoT devices and provide an overview of the MIPI specifications that are most relevant to the IoT market.
This presentation, from Gregor Sievers, Ph.D., of dSPACE GmbH, addresses how the MIPI CSI-2℠, D-PHY℠, CCS, and A-PHY℠ specifications simplify validation and testing and help bring autonomous driving to the streets.
James Goel, MIPI Technical Steering Group chair, shares a state-of-the-art MASS (MIPI Automotive SerDes Solutions) display architecture that leverages the latest MIPI DSI-2℠ protocols using VDC-M visually lossless compression algorithms to optimize pixel bandwidth within tightly constrained display systems.
This joint presentation from Ahmed Ella of Mixel and Serge Di Matteo of Renesas covers the deployment of MIPI D-PHY℠ in an autonomous driving use-case and the advantages of using MIPI specifications in functional safety applications.
MIPI DevCon 2020 | MIPI A-PHY: Laying the Groundwork for MIPI’s Automotive Se...MIPI Alliance
MIPI board member Ariel Lasry and A-PHY subgroup vice lead Edo Cohen share technical details of MIPI A-PHY, the cornerstone of MIPI Automotive SerDes Solutions (MASS).
MIPI DevCon 2020 | State of the AllianceMIPI Alliance
MIPI Managing Director Peter Lefkin shares an overview of progress on priority initiatives in mobile and in the beyond-mobile focus areas of automotive, IoT and 5G.
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...UiPathCommunity
💥 Speed, accuracy, and scaling – discover the superpowers of GenAI in action with UiPath Document Understanding and Communications Mining™:
See how to accelerate model training and optimize model performance with active learning
Learn about the latest enhancements to out-of-the-box document processing – with little to no training required
Get an exclusive demo of the new family of UiPath LLMs – GenAI models specialized for processing different types of documents and messages
This is a hands-on session specifically designed for automation developers and AI enthusiasts seeking to enhance their knowledge in leveraging the latest intelligent document processing capabilities offered by UiPath.
Speakers:
👨🏫 Andras Palfi, Senior Product Manager, UiPath
👩🏫 Lenka Dulovicova, Product Program Manager, UiPath
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
Neuro-symbolic is not enough, we need neuro-*semantic*Frank van Harmelen
Neuro-symbolic (NeSy) AI is on the rise. However, simply machine learning on just any symbolic structure is not sufficient to really harvest the gains of NeSy. These will only be gained when the symbolic structures have an actual semantics. I give an operational definition of semantics as “predictable inference”.
All of this illustrated with link prediction over knowledge graphs, but the argument is general.
Let's dive deeper into the world of ODC! Ricardo Alves (OutSystems) will join us to tell all about the new Data Fabric. After that, Sezen de Bruijn (OutSystems) will get into the details on how to best design a sturdy architecture within ODC.
LF Energy Webinar: Electrical Grid Modelling and Simulation Through PowSyBl -...DanBrown980551
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
"Impact of front-end architecture on development cost", Viktor TurskyiFwdays
I have heard many times that architecture is not important for the front-end. Also, many times I have seen how developers implement features on the front-end just following the standard rules for a framework and think that this is enough to successfully launch the project, and then the project fails. How to prevent this and what approach to choose? I have launched dozens of complex projects and during the talk we will analyze which approaches have worked for me and which have not.
Kubernetes & AI - Beauty and the Beast !?! @KCD Istanbul 2024Tobias Schneck
As AI technology is pushing into IT I was wondering myself, as an “infrastructure container kubernetes guy”, how get this fancy AI technology get managed from an infrastructure operational view? Is it possible to apply our lovely cloud native principals as well? What benefit’s both technologies could bring to each other?
Let me take this questions and provide you a short journey through existing deployment models and use cases for AI software. On practical examples, we discuss what cloud/on-premise strategy we may need for applying it to our own infrastructure to get it to work from an enterprise perspective. I want to give an overview about infrastructure requirements and technologies, what could be beneficial or limiting your AI use cases in an enterprise environment. An interactive Demo will give you some insides, what approaches I got already working for real.
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
UiPath Test Automation using UiPath Test Suite series, part 3DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 3. In this session, we will cover desktop automation along with UI automation.
Topics covered:
UI automation Introduction,
UI automation Sample
Desktop automation flow
Pradeep Chinnala, Senior Consultant Automation Developer @WonderBotz and UiPath MVP
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
Software Delivery At the Speed of AI: Inflectra Invests In AI-Powered QualityInflectra
In this insightful webinar, Inflectra explores how artificial intelligence (AI) is transforming software development and testing. Discover how AI-powered tools are revolutionizing every stage of the software development lifecycle (SDLC), from design and prototyping to testing, deployment, and monitoring.
Learn about:
• The Future of Testing: How AI is shifting testing towards verification, analysis, and higher-level skills, while reducing repetitive tasks.
• Test Automation: How AI-powered test case generation, optimization, and self-healing tests are making testing more efficient and effective.
• Visual Testing: Explore the emerging capabilities of AI in visual testing and how it's set to revolutionize UI verification.
• Inflectra's AI Solutions: See demonstrations of Inflectra's cutting-edge AI tools like the ChatGPT plugin and Azure Open AI platform, designed to streamline your testing process.
Whether you're a developer, tester, or QA professional, this webinar will give you valuable insights into how AI is shaping the future of software delivery.
The Art of the Pitch: WordPress Relationships and SalesLaura Byrne
Clients don’t know what they don’t know. What web solutions are right for them? How does WordPress come into the picture? How do you make sure you understand scope and timeline? What do you do if sometime changes?
All these questions and more will be explored as we talk about matching clients’ needs with what your agency offers without pulling teeth or pulling your hair out. Practical tips, and strategies for successful relationship building that leads to closing the deal.
Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
Join us to learn more about this new, human-in-the-loop capability, brought to you by Integration Service connectors.
And...
Speakers:
Akshay Agnihotri, Product Manager
Charlie Greenberg, Host