Licinio Sousa of Synopsys describes the key advantages of the latest MIPI C-PHY℠ and D-PHY℠ specifications and how designers are implementing them in multipixel cameras and high-resolution displays targeting mobile, drone and automotive applications.
MIPI DevCon Seoul 2018: Troubleshooting MIPI M-PHY Link and Protocol IssuesMIPI Alliance
Gordon Getty and Juhyun Yang, both of Teledyne LeCroy, discuss how higher-layer protocols, including UniPro® and UFS, use MIPI M-PHY® to provide an efficient, low-power storage protocol to be enabled on mobile platforms.
In this presentation, George Wiley of Qualcomm Technologies discusses the unique properties of the MIPI C-PHY physical layer, as well as system-level benefits and values for camera and display interfaces.
MIPI DevCon Taipei 2019: Study on the Influence of Random Jitter to the MIPI ...MIPI Alliance
HeeSoo Lee, SerDes/DDR product owner, and Jingshen Liu, R&D engineer, at Keysight Technologies Inc., focus on the influence of random jitters to the MIPI C-PHY℠ high speed timing, providing a reference for MIPI C-PHY designers and informing the future development of MIPI C-PHY.
Presented by James Goel, MIPI Technical Steering Group chair, and Rick Wietfeldt, Security Working Group co-chair
This session brings you up to speed on all the latest developments within MIPI Automotive SerDes Solutions (MASS) – a framework that provides a full-stack, end-to-end sensor/display-to-ECU solution for autonomous driving and ADAS systems that leverage existing MIPI CSI-2®, DSI-2℠ and VESA eDP/DP protocols running over MIPI A-PHY℠. The presentation also explains how recent developments make it easier for you to integrate MIPI A-PHY into your next automotive E/E architecture and how, through A-PHY's adoption as an IEEE standard, it can be accessed for evaluation without MIPI membership.
In addition, the presenters discuss how recently released MIPI Camera and Display Service Extensions (CSE and DSE) and their associated protocol adaptation layers (PALs) work together to embed functional safety and security enablers natively at the "edge" – ultimately within the sensor, display and ECU components themselves.
MIPI DevCon 2021: Meeting the Needs of Next-Generation Displays with a High-P...MIPI Alliance
Presented by Alain Legault, Hardent Inc.; Joe Rodriguez, Rambus Inc.; and Justin Endo, Mixel, Inc.
Next-generation display applications have an insatiable appetite for bandwidth. Using a combination of VESA Display Stream Compression (DSC) and MIPI DSI-2℠ technology, designers can achieve display resolutions up to 8K without compromise to video quality, battery life or cost. This presentation discusses a fully integrated, off-the-shelf display IP subsystem solution, consisting of Mixel (MIPI C-PHY℠/D-PHY℠ combo), Rambus (MIPI DSI-2® controller) and Hardent (VESA DSC) IP, that can deliver this state-of-the-art performance in a power-efficient and compact footprint.
Manoj Sharma Tanikella and Amitkumar Shrichand Gound of Synopsy describe various training sequences used in MIPI PHYs to reduce inter-symbol interference.The latest MIPI PHY specifications (M-PHY, D-PHY and C-PHY) introduce training sequences for the equalizer settings to reduce inter-symbol interference: adapt sequence in M-PHY, alternate sequence in D-PHY and C-PHY. In addition, C-PHY uses preamble and user-define sequences.
MIPI DevCon 2016: MIPI CSI-2 Application for Vision and Sensor Fusion SystemsMIPI Alliance
The expanding demand for imaging- and vision-based systems in mobile, IoT and automotive products is making the need for multi camera and sensor fusion systems look for novel ways to gather and process multiple data streams while still fitting into the mobile interface. The CSI-2 protocol allows camera sensor and processed image data to be combined into a single data stream using interleaving, allowing the application processor to extract the image data using the virtual channel or data type information. In this presentation, Richard Sproul of Cadence Design Systems will highlight some of the key details and requirements for a system with image processing of multi camera/sensor systems.
MIPI DevCon Seoul 2018: Troubleshooting MIPI M-PHY Link and Protocol IssuesMIPI Alliance
Gordon Getty and Juhyun Yang, both of Teledyne LeCroy, discuss how higher-layer protocols, including UniPro® and UFS, use MIPI M-PHY® to provide an efficient, low-power storage protocol to be enabled on mobile platforms.
In this presentation, George Wiley of Qualcomm Technologies discusses the unique properties of the MIPI C-PHY physical layer, as well as system-level benefits and values for camera and display interfaces.
MIPI DevCon Taipei 2019: Study on the Influence of Random Jitter to the MIPI ...MIPI Alliance
HeeSoo Lee, SerDes/DDR product owner, and Jingshen Liu, R&D engineer, at Keysight Technologies Inc., focus on the influence of random jitters to the MIPI C-PHY℠ high speed timing, providing a reference for MIPI C-PHY designers and informing the future development of MIPI C-PHY.
Presented by James Goel, MIPI Technical Steering Group chair, and Rick Wietfeldt, Security Working Group co-chair
This session brings you up to speed on all the latest developments within MIPI Automotive SerDes Solutions (MASS) – a framework that provides a full-stack, end-to-end sensor/display-to-ECU solution for autonomous driving and ADAS systems that leverage existing MIPI CSI-2®, DSI-2℠ and VESA eDP/DP protocols running over MIPI A-PHY℠. The presentation also explains how recent developments make it easier for you to integrate MIPI A-PHY into your next automotive E/E architecture and how, through A-PHY's adoption as an IEEE standard, it can be accessed for evaluation without MIPI membership.
In addition, the presenters discuss how recently released MIPI Camera and Display Service Extensions (CSE and DSE) and their associated protocol adaptation layers (PALs) work together to embed functional safety and security enablers natively at the "edge" – ultimately within the sensor, display and ECU components themselves.
MIPI DevCon 2021: Meeting the Needs of Next-Generation Displays with a High-P...MIPI Alliance
Presented by Alain Legault, Hardent Inc.; Joe Rodriguez, Rambus Inc.; and Justin Endo, Mixel, Inc.
Next-generation display applications have an insatiable appetite for bandwidth. Using a combination of VESA Display Stream Compression (DSC) and MIPI DSI-2℠ technology, designers can achieve display resolutions up to 8K without compromise to video quality, battery life or cost. This presentation discusses a fully integrated, off-the-shelf display IP subsystem solution, consisting of Mixel (MIPI C-PHY℠/D-PHY℠ combo), Rambus (MIPI DSI-2® controller) and Hardent (VESA DSC) IP, that can deliver this state-of-the-art performance in a power-efficient and compact footprint.
Manoj Sharma Tanikella and Amitkumar Shrichand Gound of Synopsy describe various training sequences used in MIPI PHYs to reduce inter-symbol interference.The latest MIPI PHY specifications (M-PHY, D-PHY and C-PHY) introduce training sequences for the equalizer settings to reduce inter-symbol interference: adapt sequence in M-PHY, alternate sequence in D-PHY and C-PHY. In addition, C-PHY uses preamble and user-define sequences.
MIPI DevCon 2016: MIPI CSI-2 Application for Vision and Sensor Fusion SystemsMIPI Alliance
The expanding demand for imaging- and vision-based systems in mobile, IoT and automotive products is making the need for multi camera and sensor fusion systems look for novel ways to gather and process multiple data streams while still fitting into the mobile interface. The CSI-2 protocol allows camera sensor and processed image data to be combined into a single data stream using interleaving, allowing the application processor to extract the image data using the virtual channel or data type information. In this presentation, Richard Sproul of Cadence Design Systems will highlight some of the key details and requirements for a system with image processing of multi camera/sensor systems.
The D-PHY specification, since the release of its first version more than a decade ago, continues to evolve and push the envelope of throughput to support current and future needs of mobile interfaces – camera and display in particular. In this process, PHY layer test and measurement solutions are posed with newer challenges to provide for the feature additions to the specification. This presentation by Parthasarathy Raju and Suryakant Kumar of Tektronix discusses an introduction to both transmitter and receiver characteristics of D-PHY, and highlights the importance of test modes. Also discussed are test/measurement solutions to overcome these challenges and simplify the testing of devices to accomplish conformance.
Presented by Licinio Sousa, Synopsys, Inc., and Edo Cohen, Valens Semiconductor
Synopsys and Valens Semiconductor outline how MIPI automotive solutions can enable safe and robust long-reach connectivity for cameras and sensors. The ability for high volumes of data to travel at a fast rate over a long reach infrastructure is now mandatory in automotive vision applications. In addition, maintaining a reliable link can be the difference between successful operation and system failure in a car. In this presentation, Synopsys and Valens present a Valens MIPI A-PHY℠ design for in-vehicle connectivity using Synopsys’ ISO 26262-ready MIPI CSI-2® and MIPI C-PHY℠/D-PHY℠ IP in the FinFET process to meet their latency and bandwidth requirements. The presentation also previews examples of display applications that can benefit from the same architecture.
Arasan Chip Systems develops and marketing interface IP that meets MIPI standards. Digital IP can typically be emulated in FPGA, but mixed signal IP for physical interface cannot. Arasan provides MIPI D-PHY and MIPI M-PHY is module form for application processor / system on a chip developers to use with their emulation boards.
MIPI DevCon Seoul 2018: Dual Mode C-PHY/D-PHY Use in VR Display IC MIPI Alliance
This co-presentation from Ahmed Ella of Mixel, Inc., and Jeffrey Lukanc of Synaptics, will cover Synaptics VXR7200 DisplayPort to Dual MIPI VR Bridge IC, integrating a Mixel C-PHY℠/D-PHY℠ Combo IP and controller.
MIPI DevCon Bangalore 2017: C-PHY and How it Enables Next Generation Display ...MIPI Alliance
Mohamed Hafed of Introspect Technology follows up the previous MIPI C-PHY introduction presentations with this presentation on MIPI C-PHY basics and the latest enhancements in recent revisions of the specification. Subsequently, presenters delve into a description of innovations in the next generation MIPI CSI-2 and MIPI DSI-2 protocols that are made possible by quite elegant properties of the MIPI C-PHY encoding scheme and its associated MIPI Alliance specification innovations.
MIPI DevCon 2021: MIPI D-PHY and MIPI CSI-2 for IoT: AI Edge DevicesMIPI Alliance
Presented by Ashraf Takla, Mixel Inc.
This presentation covers the deployment of MIPI D-PHY℠ and MIPI CSI-2® in IoT and edge devices. While many mobile-influenced applications benefit from the low-power, small-form factor of MIPI specifications, AI edge processors in particular are seeing a surge in the use of MIPI specifications for their sensors as market trends shift from processing in the cloud or central location, to processing at the edge.
This presentation includes a high-level system overview of a specific use case, Perceive Ergo edge inference processor, and how Mixel was able to meet Perceive’s stringent requirements with its MIPI D-PHY CSI-2 TX and D-PHY CSI-2 RX IPs.
MIPI DevCon 2021: MIPI I3C Signal Integrity Challenges on DDR5-based Server P...MIPI Alliance
Presented by Azusena Lupercio Ramirez, Juan Orozco and Nestor Hernandez Cruz, Intel Corporation
The MIPI I3C® protocol is first used in a server application for the DDR5 DIMM SPD function. MIPI I3C was defined for low capacitance applications, while DDR5 SPD exceeds by far the bus capacitance specification. This presentation covers the interoperability challenges of the dynamic push-pull and open-drain operating modes, on server applications with an in-depth analysis of the implications of long PCB traces, multiple DIMM routing branches, and multiple loads to the electrical and timing parameters.
MIPI DevCon 2016: Testing of MIPI High Speed PHY Standard ImplementationsMIPI Alliance
Interoperability in mobile devices shall be achieved through a variety of protocol standards such as MIPI CSI, DSI, UniPro or JEDEC UFS and their underlying physical layer standards MIPI M-PHY, D-PHY or C-PHY. Integration of different vendors' designs into a working system is simplified using standard conformant parts. Testing them according to the procedures outlined in the applicable Conformance Test Suite guarantees their conformance. However, increasing data rates, lower power dissipation and modularity of mobile devices create challenges for debugging and conformance verification of the affected components. In this presentation, Joel Birch of Keysight Technologies discusses these challenges and offers possible solutions to address them.
There are numerous design challenges associated with implementing Automotive Ethernet. This session will discuss what to test in order to improve the chances of a successful design
MIPI DevCon 2016: MIPI C-PHY - Introduction From Basic Theory to Practical Im...MIPI Alliance
In this presentation, Mohamed Hafed of Introspect Technology will introduce the fundamental principles of three-phase encoding and then describe the evolutionary process involved in going from a D-PHY circuit topology to a C-PHY one. Also discussed are protocol implementation properties and guidelines for both CSI-2 and DSI-2 applications running over C-PHY links, all the while highlighting unique bandwidth, power, and encoding properties for this new SerDes standard. Practical implementation experiences that were gained when creating the world's first interoparable C-PHY systems will also be presented.
MIPI DevCon 2020 | MIPI A-PHY: Laying the Groundwork for MIPI’s Automotive Se...MIPI Alliance
MIPI board member Ariel Lasry and A-PHY subgroup vice lead Edo Cohen share technical details of MIPI A-PHY, the cornerstone of MIPI Automotive SerDes Solutions (MASS).
MIPI DevCon 2021: MIPI CSI-2 v4.0 Panel Discussion with the MIPI Camera Worki...MIPI Alliance
Panel discussion with Haran Thanigasalam, Intel Corporation, MIPI Camera Working Group chair; Natsuko Ibuki, Google, LLC;
Yuichi Mizutani, Sony Corporation; and Wonseok Lee, Samsung Electronics, Co.
The Ultimate Guide to HBM2E Implementation & Selection - Frank Ferro - Rambus...Rambus
In this presentation we'll be discussing HBM2 and 2E memory technology. There's a lot of decisions that need to be made when you're developing high speed products for AI, and HBM has become the memory of choice. So we're going to go into detail and talk about the selection criteria and implementation details for HBM2E memory.
MPI DevCon Hsinchu City 2017: Next generation MIPI Physical Layer Design and ...MIPI Alliance
SK Choi of Keysight Technologies looks at the key changes in the new MIPI C-PHY, MIPI D-PHY and MIPI M-PHY specifications, as well as the CTS (conformance test suite), and addresses the challenges to support the new PHY layer. The new MIPI PHY specifications will bring new technology innovation that will also bring new challenges to design or evaluation engineering.
The use of multiple cameras applications is exploding. We're not just talking about 2 cameras for 3D or depth sensing, but 3-12 cameras for applications like drones, robotics, automotive, etc. The increasing use of multiple cameras combined with the growing use of mobile components such as apps processors, image sensors, displays, etc., being used by the broad market requires logic to connect these devices. In this presentation, Ted Marena of Microsemi explains how FPGAs can be used to leverage mobile components to aggregate a large number of MIPI CSI-2 camera interfaces.
Radu Pitigoi-Aron of Qualcomm Technologies Inc. discusses the MIPI I3C bus, its features that streamline various transactions, and how those features provide scalable and efficient interconnectivity solutions. The Flow Control and the Timing Control tools provided by MIPI I3C interface are the subject of this presentation. Elements of solved problems, their challenges and practical aspects are included.
MIPI DevCon Seoul 2018: Powering AI and Automotive Applications with the MIPI...MIPI Alliance
Hyoung-Bae Choi of Synopsys, Inc. discusses use cases and the implementation of MIPI's camera interface in automotive and AI applications, along with the benefits of MIPI I3C℠ in the MIPI camera solution.
MIPI DevCon Taipei 2019: Enabling MIPI Camera Applications Including Automoti...MIPI Alliance
Kelvin Xu, product marketing manager at Synopsys, describes automotive ADAS designs with MIPI camera interface solutions such as CSI-2℠ and D-PHY℠, and outlines other MIPI automotive protocols, including I3C® and DSI℠.
The D-PHY specification, since the release of its first version more than a decade ago, continues to evolve and push the envelope of throughput to support current and future needs of mobile interfaces – camera and display in particular. In this process, PHY layer test and measurement solutions are posed with newer challenges to provide for the feature additions to the specification. This presentation by Parthasarathy Raju and Suryakant Kumar of Tektronix discusses an introduction to both transmitter and receiver characteristics of D-PHY, and highlights the importance of test modes. Also discussed are test/measurement solutions to overcome these challenges and simplify the testing of devices to accomplish conformance.
Presented by Licinio Sousa, Synopsys, Inc., and Edo Cohen, Valens Semiconductor
Synopsys and Valens Semiconductor outline how MIPI automotive solutions can enable safe and robust long-reach connectivity for cameras and sensors. The ability for high volumes of data to travel at a fast rate over a long reach infrastructure is now mandatory in automotive vision applications. In addition, maintaining a reliable link can be the difference between successful operation and system failure in a car. In this presentation, Synopsys and Valens present a Valens MIPI A-PHY℠ design for in-vehicle connectivity using Synopsys’ ISO 26262-ready MIPI CSI-2® and MIPI C-PHY℠/D-PHY℠ IP in the FinFET process to meet their latency and bandwidth requirements. The presentation also previews examples of display applications that can benefit from the same architecture.
Arasan Chip Systems develops and marketing interface IP that meets MIPI standards. Digital IP can typically be emulated in FPGA, but mixed signal IP for physical interface cannot. Arasan provides MIPI D-PHY and MIPI M-PHY is module form for application processor / system on a chip developers to use with their emulation boards.
MIPI DevCon Seoul 2018: Dual Mode C-PHY/D-PHY Use in VR Display IC MIPI Alliance
This co-presentation from Ahmed Ella of Mixel, Inc., and Jeffrey Lukanc of Synaptics, will cover Synaptics VXR7200 DisplayPort to Dual MIPI VR Bridge IC, integrating a Mixel C-PHY℠/D-PHY℠ Combo IP and controller.
MIPI DevCon Bangalore 2017: C-PHY and How it Enables Next Generation Display ...MIPI Alliance
Mohamed Hafed of Introspect Technology follows up the previous MIPI C-PHY introduction presentations with this presentation on MIPI C-PHY basics and the latest enhancements in recent revisions of the specification. Subsequently, presenters delve into a description of innovations in the next generation MIPI CSI-2 and MIPI DSI-2 protocols that are made possible by quite elegant properties of the MIPI C-PHY encoding scheme and its associated MIPI Alliance specification innovations.
MIPI DevCon 2021: MIPI D-PHY and MIPI CSI-2 for IoT: AI Edge DevicesMIPI Alliance
Presented by Ashraf Takla, Mixel Inc.
This presentation covers the deployment of MIPI D-PHY℠ and MIPI CSI-2® in IoT and edge devices. While many mobile-influenced applications benefit from the low-power, small-form factor of MIPI specifications, AI edge processors in particular are seeing a surge in the use of MIPI specifications for their sensors as market trends shift from processing in the cloud or central location, to processing at the edge.
This presentation includes a high-level system overview of a specific use case, Perceive Ergo edge inference processor, and how Mixel was able to meet Perceive’s stringent requirements with its MIPI D-PHY CSI-2 TX and D-PHY CSI-2 RX IPs.
MIPI DevCon 2021: MIPI I3C Signal Integrity Challenges on DDR5-based Server P...MIPI Alliance
Presented by Azusena Lupercio Ramirez, Juan Orozco and Nestor Hernandez Cruz, Intel Corporation
The MIPI I3C® protocol is first used in a server application for the DDR5 DIMM SPD function. MIPI I3C was defined for low capacitance applications, while DDR5 SPD exceeds by far the bus capacitance specification. This presentation covers the interoperability challenges of the dynamic push-pull and open-drain operating modes, on server applications with an in-depth analysis of the implications of long PCB traces, multiple DIMM routing branches, and multiple loads to the electrical and timing parameters.
MIPI DevCon 2016: Testing of MIPI High Speed PHY Standard ImplementationsMIPI Alliance
Interoperability in mobile devices shall be achieved through a variety of protocol standards such as MIPI CSI, DSI, UniPro or JEDEC UFS and their underlying physical layer standards MIPI M-PHY, D-PHY or C-PHY. Integration of different vendors' designs into a working system is simplified using standard conformant parts. Testing them according to the procedures outlined in the applicable Conformance Test Suite guarantees their conformance. However, increasing data rates, lower power dissipation and modularity of mobile devices create challenges for debugging and conformance verification of the affected components. In this presentation, Joel Birch of Keysight Technologies discusses these challenges and offers possible solutions to address them.
There are numerous design challenges associated with implementing Automotive Ethernet. This session will discuss what to test in order to improve the chances of a successful design
MIPI DevCon 2016: MIPI C-PHY - Introduction From Basic Theory to Practical Im...MIPI Alliance
In this presentation, Mohamed Hafed of Introspect Technology will introduce the fundamental principles of three-phase encoding and then describe the evolutionary process involved in going from a D-PHY circuit topology to a C-PHY one. Also discussed are protocol implementation properties and guidelines for both CSI-2 and DSI-2 applications running over C-PHY links, all the while highlighting unique bandwidth, power, and encoding properties for this new SerDes standard. Practical implementation experiences that were gained when creating the world's first interoparable C-PHY systems will also be presented.
MIPI DevCon 2020 | MIPI A-PHY: Laying the Groundwork for MIPI’s Automotive Se...MIPI Alliance
MIPI board member Ariel Lasry and A-PHY subgroup vice lead Edo Cohen share technical details of MIPI A-PHY, the cornerstone of MIPI Automotive SerDes Solutions (MASS).
MIPI DevCon 2021: MIPI CSI-2 v4.0 Panel Discussion with the MIPI Camera Worki...MIPI Alliance
Panel discussion with Haran Thanigasalam, Intel Corporation, MIPI Camera Working Group chair; Natsuko Ibuki, Google, LLC;
Yuichi Mizutani, Sony Corporation; and Wonseok Lee, Samsung Electronics, Co.
The Ultimate Guide to HBM2E Implementation & Selection - Frank Ferro - Rambus...Rambus
In this presentation we'll be discussing HBM2 and 2E memory technology. There's a lot of decisions that need to be made when you're developing high speed products for AI, and HBM has become the memory of choice. So we're going to go into detail and talk about the selection criteria and implementation details for HBM2E memory.
MPI DevCon Hsinchu City 2017: Next generation MIPI Physical Layer Design and ...MIPI Alliance
SK Choi of Keysight Technologies looks at the key changes in the new MIPI C-PHY, MIPI D-PHY and MIPI M-PHY specifications, as well as the CTS (conformance test suite), and addresses the challenges to support the new PHY layer. The new MIPI PHY specifications will bring new technology innovation that will also bring new challenges to design or evaluation engineering.
The use of multiple cameras applications is exploding. We're not just talking about 2 cameras for 3D or depth sensing, but 3-12 cameras for applications like drones, robotics, automotive, etc. The increasing use of multiple cameras combined with the growing use of mobile components such as apps processors, image sensors, displays, etc., being used by the broad market requires logic to connect these devices. In this presentation, Ted Marena of Microsemi explains how FPGAs can be used to leverage mobile components to aggregate a large number of MIPI CSI-2 camera interfaces.
Radu Pitigoi-Aron of Qualcomm Technologies Inc. discusses the MIPI I3C bus, its features that streamline various transactions, and how those features provide scalable and efficient interconnectivity solutions. The Flow Control and the Timing Control tools provided by MIPI I3C interface are the subject of this presentation. Elements of solved problems, their challenges and practical aspects are included.
MIPI DevCon Seoul 2018: Powering AI and Automotive Applications with the MIPI...MIPI Alliance
Hyoung-Bae Choi of Synopsys, Inc. discusses use cases and the implementation of MIPI's camera interface in automotive and AI applications, along with the benefits of MIPI I3C℠ in the MIPI camera solution.
MIPI DevCon Taipei 2019: Enabling MIPI Camera Applications Including Automoti...MIPI Alliance
Kelvin Xu, product marketing manager at Synopsys, describes automotive ADAS designs with MIPI camera interface solutions such as CSI-2℠ and D-PHY℠, and outlines other MIPI automotive protocols, including I3C® and DSI℠.
Alain Legault, VP IP Products at Hardent, discusses how the combination of VDC-M and MIPI DSI-2℠ can support the development of sophisticated mobile, AR/VR and automotive displays, provides an overview of the VDC-M algorithm and use cases.
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2023/10/introduction-to-the-csi-2-image-sensor-interface-standard-a-presentation-from-the-mipi-alliance/
Haran Thanigasalam, Camera and Imaging Consultant to the MIPI Alliance, presents the “Introduction to the MIPI CSI-2 Image Sensor Interface Standard” tutorial at the May 2023 Embedded Vision Summit.
By taking advantage of select features in standardized interfaces, vision system architects can help reduce processor load, cost and power consumption while gaining flexibility to source components from multiple vendors. In this presentation, Thanigasalam introduces the standardized MIPI CSI-2 imaging conduit solution for interfacing image sensors to processors.
Thanigasalam explains how the solution supports basic operations of a camera sensor, including physical frame transport options and orthogonal commands for autoexposure, autofocus, auto white balance and event detection. He also introduces command sets to help bring up and tune sensors. In addition, Thanigasalam explores provisions to alleviate RF emissions, enable aggregation of data from multiple remote sensors and alleviate the need for dual voltage signaling to avoid electrical overstress issues. He also touches on emerging support for frame transport using WiFi.
Matt Ronning, director of engineering at Sony Corporation, and Raj Kumar Nagpal, senior staff engineer at Synopsys, provide an update on how MIPI specifications are being leveraged into automotive systems today and offer a detailed look at the upcoming MIPI A-PHY specification, which is being designed to solve the long-reach, high-speed challenge of connecting the highest speed electronic components throughout a vehicle.
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2023/10/mipi-csi-2-image-sensor-interface-standard-features-enable-efficient-embedded-vision-systems-a-presentation-from-the-mipi-alliance/
Haran Thanigasalam, Camera and Imaging Consultant to the MIPI Alliance, presents the “MIPI CSI-2 Image Sensor Interface Standard Features Enable Efficient Embedded Vision Systems” tutorial at the May 2023 Embedded Vision Summit.
As computer vision applications continue to evolve rapidly, there’s a growing need for a smarter standardized interface connecting multiple image sensors to processors for real-time perception and decision-making. In this presentation, Thanigasalam provides a deep dive into the latest version of the widely implemented CSI-2 v4.0 interface from MIPI Alliance.
This new version includes key features specifically designed to support computer vision applications, including democratized Smart Region of Interest, Always-On Sentinel Conduit, Multi-Pixel Compression and Latency Reduction and Transport Efficiency. These novel features enable sophisticated machine awareness with reduced system power and processing needs, making them well suited for consumer, commercial and infrastructure platforms.
MPI DevCon Hsinchu City 2017: Mobile Influenced Markets – Evolution of Camera...MIPI Alliance
Tom Watzka of Lattice Semiconductor discusses the evolution of innovative mobile-influenced applications (such as AR/VR and drones), including the unique issues faced by system and software developers.
Kevin Yee, chair of MIPI Marketing Steering Group, and Ian Smith, MIPI technical content manager and author of the MIPI Alliance IoT White Paper, explain the advantages of using MIPI specifications within IoT devices and provide an overview of the MIPI specifications that are most relevant to the IoT market.
MPI DevCon Hsinchu City 2017: ADAS High Bandwidth Imaging Implementation Stra...MIPI Alliance
Shiou Mei Huang of Texas Instruments discusses strategies to meet design goals using the MIPI CSI-2 standard, and uses DS90UB96x camera hub and TDAx processor as an example for discussion. With the MIPI CSI-2 specification finding applications for Advanced Driver Assistance Systems (ADAS) such as parking assistance, collision avoidance, electronic mirrors, radar sensing and fusion, the upsurge in camera usage puts a strain for designers to explore methods that reduce pin counts, optimize board size, and retain high image resolution.
MIPI DevCon Seoul 2018: Integrating Image, Radar, IR and TOF Sensors: Develop...MIPI Alliance
In this presentation, Tom Watzka of Lattice Semiconductor Corp. provides an overview of the architectures and tradeoffs in mission-critical vision applications and the details of combining and tagging multiple data streams, including Camera Control Interface (CCI) integration.
MIPI DevCon Seoul 2018: Next Generation Verification Process for Automotive a...MIPI Alliance
With MIPI CSI-2℠ integrated in many complex systems, this presentation from Thierry Berdah and Yafit Snir, both of Cadence Design Systems, Inc., focuses on methodology for a full verification flow, from the IP level to the SOC level.
Presented by Shiou Mei Huang, automotive processor hardware applications engineer at Texas Instruments, and Mayank Mangla, imaging architect at Texas Instruments.
MIPI DevCon 2016: Meeting Demands for Camera and Sensor Interfaces in IoT and...MIPI Alliance
Enhanced IoT and automotive applications are driving demand for multiple camera interfaces to enable embedded vision use cases. In this presentation, Synopsys' Hezi Saar outlines typical camera and display use cases for automotive and IoT applications, and how multiple Rx and Tx image streams can be integrated into an SoC to create a flexible and reusable architecture. The presentation will also provide a quick overview of the MIPI CSI-2 and I3C specifications and their key features that are important to meeting the required functionality, performance and power targets.
MIPI DevCon Seoul 2018: MIPI Alliance Meets the Needs of Autonomous DrivingMIPI Alliance
The chair of MIPI's Automotive Working Group, Matt Ronning of Sony Corporation, provides a status update on MIPI's requirements gathering and specification development efforts to support the automotive market.
For the full video of this presentation, please visit:
https://www.edge-ai-vision.com/2020/12/trends-in-neural-network-topologies-for-vision-at-the-edge-a-presentation-from-synopsys/
For more information about edge AI and computer vision, please visit:
https://www.edge-ai-vision.com
Pierre Paulin, Director of R&D for Embedded Vision at Synopsys, presents the “Trends in Neural Network Topologies for Vision at the Edge” tutorial at the September 2020 Embedded Vision Summit.
The widespread adoption of deep neural networks (DNNs) in embedded vision applications has increased the importance of creating DNN topologies that maximize accuracy while minimizing computation and memory requirements. This has led to accelerated innovation in DNN topologies.
In this talk, Paulin summarizes the key trends in neural network topologies for embedded vision applications, highlighting techniques employed by widely used networks such as EfficientNet and MobileNet to boost both accuracy and efficiency. He also touches on other optimization methods—such as pruning, compression and layer fusion—that developers can use to further reduce the memory and computation demands of modern DNNs.
Lattice has introduced its CrossLink™ programmable bridging device that supports leading protocols for mobile image sensors and displays. Systems with embedded cameras and displays often do not have the right type or number of interfaces, which can be resolved using a bridge. The new CrossLink device combines the flexibility and fast time to market of an FPGA with the power and functional optimization of an ASSP to create a new product class called programmable ASSP (pASSP™).
MIPI DevCon 2021: MIPI I3C Under the Spotlight: A Fireside Chat with the I3C ...MIPI Alliance
Panel discussion with Tim McKee, MIPI I3C Working Group chair; Matthew Schnoor; Eyuel Zewdu Teferi, MIPI I3C Basic Ad-hoc Working Group vice chair; and Radu Pitigoi-Aron
This session puts MIPI I3C® "under the spotlight" by assembling a panel of experts to talk about the latest developments in the world of I3C. The panel discusses the latest I3C specifications (including the latest HCI specification), how to address conformance in the absence of face-to-face plug fests, and how the MIPI I3C interface is being leveraged by other standards organizations.
MIPI DevCon 2021: MIPI I3C Application and Validation Models for IoT Sensor N...MIPI Alliance
Presented by Eyuel Zewdu Teferi, David Schumacher and Souha Kouki, STMicroelectronics
This presentation provides a global overview of using MIPI I3C® protocol for on-board communication among subsystems of an IoT sensor node. It includes adoption of MIPI CTS by using SysML models of requirements and test cases as an approach to manage I3C application use cases requirement validation.
MIPI DevCon 2021: MIPI I3C interface for the ETSI Smart Secure PlatformMIPI Alliance
Presented by Gulio Follero, ETSI
The ETSI Technical Committee Smart Card Platform (TC SCP) is developing the specification of the next generation secure element, the Smart Secure Platform (SSP). SCP is standardizing the MIPI I3C interface for SSP. This presentation describes the SSP architecture and its main use cases, followed by a discussion of how the MIPI I3C interface is adapted to the SSP and the main benefits in terms of speed, power and efficiency.
MIPI DevCon 2021: MIPI Security for Automotive and IoT – Initial Focus on MASSMIPI Alliance
Presented by Philip Hawkes and Rick Wietfeldt, co-chairs of the MIPI Security Working Group
MIPI Automotive SerDes Solutions (MASS) allows transmission of sensor and display data between sensors, electronic control units (ECUs) and displays distributed around a vehicle. The MIPI Security Working Group is developing a MASS security framework for protecting this data against malicious attacks.
This session covers the objectives of the security framework and explains how the framework achieves those objectives.
MIPI DevCon 2021: MIPI HTI, PTI and STP: The Bases for Next-Generation Online...MIPI Alliance
Presented by Thomas B. Preußer and Alexander Weiss, Accemic Technologies GmbH
The key challenge for testing and debugging embedded multicore systems is their limited observability. MIPI trace protocols provide essential operational insights non-intrusively, and this presentation advocates for the continuous online analysis of these trace data. It also contrasts the challenges posed by the vigorously compressed MIPI trace protocols with the enormous benefits that can be gained by online processing.
MIPI DevCon 2021: The MIPI Specification Roadmap: Driving Advancements in Mob...MIPI Alliance
Presented by James Goel, MIPI Technical Steering Group Chair
Despite the many challenges over the past year, MIPI Alliance is on track to release more specifications in 2021 than in any other year in the organization's history. This packed schedule covers updates to many of MIPI's most popular specifications, including all physical layer specifications, MIPI I3C® and I3C Basic℠, and those for camera and display, in addition to introducing several new specifications. James Goel, chair of the MIPI Technical Steering Group, highlights some of the key specifications released over the past year and then provides a look at what's still to come. He' also provides an overview of MIPI's development activity in particular focus areas, such as automotive, IoT, 5G and security.
MIPI DevCon 2021: State of the AllianceMIPI Alliance
Get an update on MIPI Alliance priority initiatives in mobile and in the beyond-mobile focus areas of automotive, IoT and 5G. Peter Lefkin, MIPI managing director, discusses collaborative efforts within the Alliance and industry, as well as progress toward strategic priorities, including the development of key specifications and resources, education opportunities, outreach and other activities to support the MIPI member ecosystem.
MIPI DevCon 2020 | Snapshot of MIPI RFFE v3.0 from a System-Architecture Per...MIPI Alliance
Lalan Mishra, vice-chair of the MIPI RFFE Working Group, presents the new features of MIPI RFFE v3.0 to help architecture and design engineers understand how the triggering features in the latest version work together to improve performance and to switch quickly among the various bands and band combinations in a 5G system.
MIPI DevCon 2020 | The Story Behind the MIPI I3C HCI Driver for LinuxMIPI Alliance
Nicolas Pitre of BayLibre covers the work that has been done to date to plan Linux support when new technology is developed and a quick overview of future development.
MIPI DevCon 2020 | Interoperability Challenges and Solutions for MIPI I3CMIPI Alliance
This presentation from Geoffrey Duerden of Introspect Technology features a case study of several specific interoperability challenges and solutions in terms of circuit and layout guidelines, protocol implementations and target applications.
MIPI DevCon 2020 | MIPI to Bluetooth LE: Leveraging Mobile Technology for Wir...MIPI Alliance
Grant Jennings of GOWIN Semiconductor shares use case examples in the wireless IoT space found while helping customers develop new types of solutions with the first SoC FPGA with built in Bluetooth Low Energy (LE) transceiver.
This presentation, from Gregor Sievers, Ph.D., of dSPACE GmbH, addresses how the MIPI CSI-2℠, D-PHY℠, CCS, and A-PHY℠ specifications simplify validation and testing and help bring autonomous driving to the streets.
James Goel, MIPI Technical Steering Group chair, shares a state-of-the-art MASS (MIPI Automotive SerDes Solutions) display architecture that leverages the latest MIPI DSI-2℠ protocols using VDC-M visually lossless compression algorithms to optimize pixel bandwidth within tightly constrained display systems.
This joint presentation from Ahmed Ella of Mixel and Serge Di Matteo of Renesas covers the deployment of MIPI D-PHY℠ in an autonomous driving use-case and the advantages of using MIPI specifications in functional safety applications.
MIPI DevCon 2020 | State of the AllianceMIPI Alliance
MIPI Managing Director Peter Lefkin shares an overview of progress on priority initiatives in mobile and in the beyond-mobile focus areas of automotive, IoT and 5G.
MIPI DevCon Taipei 2019 Keynote: Technologies for Automated DrivingMIPI Alliance
Simon Teng, assistant general nanager of the Intelligent Automotive Business Unit at MediaTek, discusses the mega trends of automotive, the kinds of technologies needed to realize these mega trends, and how SoC solutions with these technologies will become the foundation of automated driving systems.
MIPI DevCon Taipei 2019: An Introduction to MIPI I3C® v1.1 and What's NextMIPI Alliance
Ken Foust, principal engineer at Intel Corporation, focuses on the new features available in MIPI I3C® v1.1 and the efforts MIPI is taking to advance I3C for broad, long-term adoption across multiple industries and usages.
MIPI DevCon Taipei 2019: Addressing 5G RFFE Control Challenges with MIPI RFFE...MIPI Alliance
Andrew Scott-Mackie, RF control systems engineer at Intel Corporation, discusses how MIPI RFFE℠ 3.0 aims to meet the new 5G control timing requirements and adds several enhancements to the RFFE-Trigger specification to meet 5G use cases.
MIPI DevCon Taipei 2019: PHY Testing Challenges and Opportunities: The Need F...MIPI Alliance
Victor Sanchez-Rico, project manager MIPI at BitifEye Digital Test Solutions GmbH, highlights the challenges observed and the lessons learned from BitifEye's experience with testing of high-speed digital interconnect busses, with a focus on the complex high-speed electrical PHY layer receiver conformance tests.
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
UiPath Test Automation using UiPath Test Suite series, part 4DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 4. In this session, we will cover Test Manager overview along with SAP heatmap.
The UiPath Test Manager overview with SAP heatmap webinar offers a concise yet comprehensive exploration of the role of a Test Manager within SAP environments, coupled with the utilization of heatmaps for effective testing strategies.
Participants will gain insights into the responsibilities, challenges, and best practices associated with test management in SAP projects. Additionally, the webinar delves into the significance of heatmaps as a visual aid for identifying testing priorities, areas of risk, and resource allocation within SAP landscapes. Through this session, attendees can expect to enhance their understanding of test management principles while learning practical approaches to optimize testing processes in SAP environments using heatmap visualization techniques
What will you get from this session?
1. Insights into SAP testing best practices
2. Heatmap utilization for testing
3. Optimization of testing processes
4. Demo
Topics covered:
Execution from the test manager
Orchestrator execution result
Defect reporting
SAP heatmap example with demo
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
Essentials of Automations: Optimizing FME Workflows with ParametersSafe Software
Are you looking to streamline your workflows and boost your projects’ efficiency? Do you find yourself searching for ways to add flexibility and control over your FME workflows? If so, you’re in the right place.
Join us for an insightful dive into the world of FME parameters, a critical element in optimizing workflow efficiency. This webinar marks the beginning of our three-part “Essentials of Automation” series. This first webinar is designed to equip you with the knowledge and skills to utilize parameters effectively: enhancing the flexibility, maintainability, and user control of your FME projects.
Here’s what you’ll gain:
- Essentials of FME Parameters: Understand the pivotal role of parameters, including Reader/Writer, Transformer, User, and FME Flow categories. Discover how they are the key to unlocking automation and optimization within your workflows.
- Practical Applications in FME Form: Delve into key user parameter types including choice, connections, and file URLs. Allow users to control how a workflow runs, making your workflows more reusable. Learn to import values and deliver the best user experience for your workflows while enhancing accuracy.
- Optimization Strategies in FME Flow: Explore the creation and strategic deployment of parameters in FME Flow, including the use of deployment and geometry parameters, to maximize workflow efficiency.
- Pro Tips for Success: Gain insights on parameterizing connections and leveraging new features like Conditional Visibility for clarity and simplicity.
We’ll wrap up with a glimpse into future webinars, followed by a Q&A session to address your specific questions surrounding this topic.
Don’t miss this opportunity to elevate your FME expertise and drive your projects to new heights of efficiency.
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
Smart TV Buyer Insights Survey 2024 by 91mobiles.pdf91mobiles
91mobiles recently conducted a Smart TV Buyer Insights Survey in which we asked over 3,000 respondents about the TV they own, aspects they look at on a new TV, and their TV buying preferences.
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...UiPathCommunity
💥 Speed, accuracy, and scaling – discover the superpowers of GenAI in action with UiPath Document Understanding and Communications Mining™:
See how to accelerate model training and optimize model performance with active learning
Learn about the latest enhancements to out-of-the-box document processing – with little to no training required
Get an exclusive demo of the new family of UiPath LLMs – GenAI models specialized for processing different types of documents and messages
This is a hands-on session specifically designed for automation developers and AI enthusiasts seeking to enhance their knowledge in leveraging the latest intelligent document processing capabilities offered by UiPath.
Speakers:
👨🏫 Andras Palfi, Senior Product Manager, UiPath
👩🏫 Lenka Dulovicova, Product Program Manager, UiPath
Kubernetes & AI - Beauty and the Beast !?! @KCD Istanbul 2024Tobias Schneck
As AI technology is pushing into IT I was wondering myself, as an “infrastructure container kubernetes guy”, how get this fancy AI technology get managed from an infrastructure operational view? Is it possible to apply our lovely cloud native principals as well? What benefit’s both technologies could bring to each other?
Let me take this questions and provide you a short journey through existing deployment models and use cases for AI software. On practical examples, we discuss what cloud/on-premise strategy we may need for applying it to our own infrastructure to get it to work from an enterprise perspective. I want to give an overview about infrastructure requirements and technologies, what could be beneficial or limiting your AI use cases in an enterprise environment. An interactive Demo will give you some insides, what approaches I got already working for real.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
Software Delivery At the Speed of AI: Inflectra Invests In AI-Powered QualityInflectra
In this insightful webinar, Inflectra explores how artificial intelligence (AI) is transforming software development and testing. Discover how AI-powered tools are revolutionizing every stage of the software development lifecycle (SDLC), from design and prototyping to testing, deployment, and monitoring.
Learn about:
• The Future of Testing: How AI is shifting testing towards verification, analysis, and higher-level skills, while reducing repetitive tasks.
• Test Automation: How AI-powered test case generation, optimization, and self-healing tests are making testing more efficient and effective.
• Visual Testing: Explore the emerging capabilities of AI in visual testing and how it's set to revolutionize UI verification.
• Inflectra's AI Solutions: See demonstrations of Inflectra's cutting-edge AI tools like the ChatGPT plugin and Azure Open AI platform, designed to streamline your testing process.
Whether you're a developer, tester, or QA professional, this webinar will give you valuable insights into how AI is shaping the future of software delivery.