This presentation, from Gregor Sievers, Ph.D., of dSPACE GmbH, addresses how the MIPI CSI-2℠, D-PHY℠, CCS, and A-PHY℠ specifications simplify validation and testing and help bring autonomous driving to the streets.
MIPI DevCon Taipei 2019: New Trends in the High-Volume Manufacturing Test of ...MIPI Alliance
Mohamed Hafed, Ph.D., chief executive officer at Introspect Technology, summarizes the fundamental requirements for quality assurance and testing methods for high-speed interfaces including MIPI D-PHY℠, C-PHY℠ and M-PHY®. The presentation includes practical examples of test cell design, test program development and multi-site screening techniques.
MIPI DevCon 2020 | MIPI A-PHY: Laying the Groundwork for MIPI’s Automotive Se...MIPI Alliance
MIPI board member Ariel Lasry and A-PHY subgroup vice lead Edo Cohen share technical details of MIPI A-PHY, the cornerstone of MIPI Automotive SerDes Solutions (MASS).
James Goel, MIPI Technical Steering Group chair, shares a state-of-the-art MASS (MIPI Automotive SerDes Solutions) display architecture that leverages the latest MIPI DSI-2℠ protocols using VDC-M visually lossless compression algorithms to optimize pixel bandwidth within tightly constrained display systems.
MIPI DevCon 2020 | Why an Integrated MIPI C-PHY/D-PHY IP is EssentialMIPI Alliance
Licinio Sousa of Synopsys describes the key advantages of the latest MIPI C-PHY℠ and D-PHY℠ specifications and how designers are implementing them in multipixel cameras and high-resolution displays targeting mobile, drone and automotive applications.
MIPI DevCon Seoul 2018: Mobile Technologies for a Smart World MIPI Alliance
In the MIPI DevCon Seoul keynote address, Jongshin Shin, vice president at Samsung Electronics Co., focuses on technologies such as 5G, ADAS and IoT, with MIPI solutions.
MIPI DevCon Seoul 2018: Troubleshooting MIPI M-PHY Link and Protocol IssuesMIPI Alliance
Gordon Getty and Juhyun Yang, both of Teledyne LeCroy, discuss how higher-layer protocols, including UniPro® and UFS, use MIPI M-PHY® to provide an efficient, low-power storage protocol to be enabled on mobile platforms.
MIPI DevCon Taipei 2019: New Trends in the High-Volume Manufacturing Test of ...MIPI Alliance
Mohamed Hafed, Ph.D., chief executive officer at Introspect Technology, summarizes the fundamental requirements for quality assurance and testing methods for high-speed interfaces including MIPI D-PHY℠, C-PHY℠ and M-PHY®. The presentation includes practical examples of test cell design, test program development and multi-site screening techniques.
MIPI DevCon 2020 | MIPI A-PHY: Laying the Groundwork for MIPI’s Automotive Se...MIPI Alliance
MIPI board member Ariel Lasry and A-PHY subgroup vice lead Edo Cohen share technical details of MIPI A-PHY, the cornerstone of MIPI Automotive SerDes Solutions (MASS).
James Goel, MIPI Technical Steering Group chair, shares a state-of-the-art MASS (MIPI Automotive SerDes Solutions) display architecture that leverages the latest MIPI DSI-2℠ protocols using VDC-M visually lossless compression algorithms to optimize pixel bandwidth within tightly constrained display systems.
MIPI DevCon 2020 | Why an Integrated MIPI C-PHY/D-PHY IP is EssentialMIPI Alliance
Licinio Sousa of Synopsys describes the key advantages of the latest MIPI C-PHY℠ and D-PHY℠ specifications and how designers are implementing them in multipixel cameras and high-resolution displays targeting mobile, drone and automotive applications.
MIPI DevCon Seoul 2018: Mobile Technologies for a Smart World MIPI Alliance
In the MIPI DevCon Seoul keynote address, Jongshin Shin, vice president at Samsung Electronics Co., focuses on technologies such as 5G, ADAS and IoT, with MIPI solutions.
MIPI DevCon Seoul 2018: Troubleshooting MIPI M-PHY Link and Protocol IssuesMIPI Alliance
Gordon Getty and Juhyun Yang, both of Teledyne LeCroy, discuss how higher-layer protocols, including UniPro® and UFS, use MIPI M-PHY® to provide an efficient, low-power storage protocol to be enabled on mobile platforms.
MIPI DevCon Seoul 2018: Next Generation Verification Process for Automotive a...MIPI Alliance
With MIPI CSI-2℠ integrated in many complex systems, this presentation from Thierry Berdah and Yafit Snir, both of Cadence Design Systems, Inc., focuses on methodology for a full verification flow, from the IP level to the SOC level.
Alain Legault, VP IP Products at Hardent, discusses how the combination of VDC-M and MIPI DSI-2℠ can support the development of sophisticated mobile, AR/VR and automotive displays, provides an overview of the VDC-M algorithm and use cases.
MIPI DevCon Taipei 2019: Enabling MIPI Camera Applications Including Automoti...MIPI Alliance
Kelvin Xu, product marketing manager at Synopsys, describes automotive ADAS designs with MIPI camera interface solutions such as CSI-2℠ and D-PHY℠, and outlines other MIPI automotive protocols, including I3C® and DSI℠.
MIPI DevCon Seoul 2018: Powering AI and Automotive Applications with the MIPI...MIPI Alliance
Hyoung-Bae Choi of Synopsys, Inc. discusses use cases and the implementation of MIPI's camera interface in automotive and AI applications, along with the benefits of MIPI I3C℠ in the MIPI camera solution.
Presented by Licinio Sousa, Synopsys, Inc., and Edo Cohen, Valens Semiconductor
Synopsys and Valens Semiconductor outline how MIPI automotive solutions can enable safe and robust long-reach connectivity for cameras and sensors. The ability for high volumes of data to travel at a fast rate over a long reach infrastructure is now mandatory in automotive vision applications. In addition, maintaining a reliable link can be the difference between successful operation and system failure in a car. In this presentation, Synopsys and Valens present a Valens MIPI A-PHY℠ design for in-vehicle connectivity using Synopsys’ ISO 26262-ready MIPI CSI-2® and MIPI C-PHY℠/D-PHY℠ IP in the FinFET process to meet their latency and bandwidth requirements. The presentation also previews examples of display applications that can benefit from the same architecture.
MIPI DevCon Seoul 2018: Integrating Image, Radar, IR and TOF Sensors: Develop...MIPI Alliance
In this presentation, Tom Watzka of Lattice Semiconductor Corp. provides an overview of the architectures and tradeoffs in mission-critical vision applications and the details of combining and tagging multiple data streams, including Camera Control Interface (CCI) integration.
Matt Ronning, director of engineering at Sony Corporation, and Raj Kumar Nagpal, senior staff engineer at Synopsys, provide an update on how MIPI specifications are being leveraged into automotive systems today and offer a detailed look at the upcoming MIPI A-PHY specification, which is being designed to solve the long-reach, high-speed challenge of connecting the highest speed electronic components throughout a vehicle.
MIPI DevCon Seoul 2018: MIPI – Making the 5G Vision a RealityMIPI Alliance
Kenneth Ma of Huawei/HiSilicon and chair of MIPI's Technical Steering Group, and Kevin Yee of Cadence Design Systems, Inc. and chair of MIPI's Marketing Steering Group team up to discuss the implications of 5G mobile and beyond-mobile technologies and use cases.
MIPI DevCon Seoul 2018: MIPI Alliance Meets the Needs of Autonomous DrivingMIPI Alliance
The chair of MIPI's Automotive Working Group, Matt Ronning of Sony Corporation, provides a status update on MIPI's requirements gathering and specification development efforts to support the automotive market.
MPI DevCon Hsinchu City 2017: Building Intelligent, High-Speed Sensor Connect...MIPI Alliance
MIPI I3C enables multiple sensor connectivity using a single integrated bus with minimal pin count and throughput up to 33 Mbps. This presentation briefly describes I3C and its key features, and through examples details how I3C can be used in IoT and automotive systems to enable a more intelligent sensor connectivity.
MIPI DevCon 2021: The MIPI Specification Roadmap: Driving Advancements in Mob...MIPI Alliance
Presented by James Goel, MIPI Technical Steering Group Chair
Despite the many challenges over the past year, MIPI Alliance is on track to release more specifications in 2021 than in any other year in the organization's history. This packed schedule covers updates to many of MIPI's most popular specifications, including all physical layer specifications, MIPI I3C® and I3C Basic℠, and those for camera and display, in addition to introducing several new specifications. James Goel, chair of the MIPI Technical Steering Group, highlights some of the key specifications released over the past year and then provides a look at what's still to come. He' also provides an overview of MIPI's development activity in particular focus areas, such as automotive, IoT, 5G and security.
MPI DevCon Hsinchu City 2017: Mobile Influenced Markets – Evolution of Camera...MIPI Alliance
Tom Watzka of Lattice Semiconductor discusses the evolution of innovative mobile-influenced applications (such as AR/VR and drones), including the unique issues faced by system and software developers.
Presented by James Goel, MIPI Technical Steering Group chair, and Rick Wietfeldt, Security Working Group co-chair
This session brings you up to speed on all the latest developments within MIPI Automotive SerDes Solutions (MASS) – a framework that provides a full-stack, end-to-end sensor/display-to-ECU solution for autonomous driving and ADAS systems that leverage existing MIPI CSI-2®, DSI-2℠ and VESA eDP/DP protocols running over MIPI A-PHY℠. The presentation also explains how recent developments make it easier for you to integrate MIPI A-PHY into your next automotive E/E architecture and how, through A-PHY's adoption as an IEEE standard, it can be accessed for evaluation without MIPI membership.
In addition, the presenters discuss how recently released MIPI Camera and Display Service Extensions (CSE and DSE) and their associated protocol adaptation layers (PALs) work together to embed functional safety and security enablers natively at the "edge" – ultimately within the sensor, display and ECU components themselves.
MIPI DevCon Seoul 2018: Evolving MIPI I3C for New Usages and IndustriesMIPI Alliance
Ken Foust of Intel Corporation focuses on the efforts MIPI is taking to evolve the capabilities and access of I3C℠ to allow broad, long-term adoption across multiple industries and usages.
MIPI DevCon Taipei 2019: PHY Testing Challenges and Opportunities: The Need F...MIPI Alliance
Victor Sanchez-Rico, project manager MIPI at BitifEye Digital Test Solutions GmbH, highlights the challenges observed and the lessons learned from BitifEye's experience with testing of high-speed digital interconnect busses, with a focus on the complex high-speed electrical PHY layer receiver conformance tests.
MIPI DevCon Seoul 2018: Dual Mode C-PHY/D-PHY Use in VR Display IC MIPI Alliance
This co-presentation from Ahmed Ella of Mixel, Inc., and Jeffrey Lukanc of Synaptics, will cover Synaptics VXR7200 DisplayPort to Dual MIPI VR Bridge IC, integrating a Mixel C-PHY℠/D-PHY℠ Combo IP and controller.
MIPI DevCon Seoul 2018: High-Performance VR Applications Drive High-Resolutio...MIPI Alliance
This presentation by Miguel Rodriguez discusses Analogix's DisplayPort to MIPI DSI℠ controller for VR HMDs, which powers today’s tethered VR headsets in various configurations with distinct benefits and performance levels.
MPI DevCon Hsinchu City 2017: Create Higher Resolution Displays With VESA Dis...MIPI Alliance
Alain Legault of Hardent discusses the challenges of designing products to meet the demands of current and future displays and highlights how DSC compression offers an innovative solution to deal with these challenges.
Kevin Yee, chair of MIPI Marketing Steering Group, and Ian Smith, MIPI technical content manager and author of the MIPI Alliance IoT White Paper, explain the advantages of using MIPI specifications within IoT devices and provide an overview of the MIPI specifications that are most relevant to the IoT market.
MIPI DevCon Seoul 2018: Next Generation Verification Process for Automotive a...MIPI Alliance
With MIPI CSI-2℠ integrated in many complex systems, this presentation from Thierry Berdah and Yafit Snir, both of Cadence Design Systems, Inc., focuses on methodology for a full verification flow, from the IP level to the SOC level.
Alain Legault, VP IP Products at Hardent, discusses how the combination of VDC-M and MIPI DSI-2℠ can support the development of sophisticated mobile, AR/VR and automotive displays, provides an overview of the VDC-M algorithm and use cases.
MIPI DevCon Taipei 2019: Enabling MIPI Camera Applications Including Automoti...MIPI Alliance
Kelvin Xu, product marketing manager at Synopsys, describes automotive ADAS designs with MIPI camera interface solutions such as CSI-2℠ and D-PHY℠, and outlines other MIPI automotive protocols, including I3C® and DSI℠.
MIPI DevCon Seoul 2018: Powering AI and Automotive Applications with the MIPI...MIPI Alliance
Hyoung-Bae Choi of Synopsys, Inc. discusses use cases and the implementation of MIPI's camera interface in automotive and AI applications, along with the benefits of MIPI I3C℠ in the MIPI camera solution.
Presented by Licinio Sousa, Synopsys, Inc., and Edo Cohen, Valens Semiconductor
Synopsys and Valens Semiconductor outline how MIPI automotive solutions can enable safe and robust long-reach connectivity for cameras and sensors. The ability for high volumes of data to travel at a fast rate over a long reach infrastructure is now mandatory in automotive vision applications. In addition, maintaining a reliable link can be the difference between successful operation and system failure in a car. In this presentation, Synopsys and Valens present a Valens MIPI A-PHY℠ design for in-vehicle connectivity using Synopsys’ ISO 26262-ready MIPI CSI-2® and MIPI C-PHY℠/D-PHY℠ IP in the FinFET process to meet their latency and bandwidth requirements. The presentation also previews examples of display applications that can benefit from the same architecture.
MIPI DevCon Seoul 2018: Integrating Image, Radar, IR and TOF Sensors: Develop...MIPI Alliance
In this presentation, Tom Watzka of Lattice Semiconductor Corp. provides an overview of the architectures and tradeoffs in mission-critical vision applications and the details of combining and tagging multiple data streams, including Camera Control Interface (CCI) integration.
Matt Ronning, director of engineering at Sony Corporation, and Raj Kumar Nagpal, senior staff engineer at Synopsys, provide an update on how MIPI specifications are being leveraged into automotive systems today and offer a detailed look at the upcoming MIPI A-PHY specification, which is being designed to solve the long-reach, high-speed challenge of connecting the highest speed electronic components throughout a vehicle.
MIPI DevCon Seoul 2018: MIPI – Making the 5G Vision a RealityMIPI Alliance
Kenneth Ma of Huawei/HiSilicon and chair of MIPI's Technical Steering Group, and Kevin Yee of Cadence Design Systems, Inc. and chair of MIPI's Marketing Steering Group team up to discuss the implications of 5G mobile and beyond-mobile technologies and use cases.
MIPI DevCon Seoul 2018: MIPI Alliance Meets the Needs of Autonomous DrivingMIPI Alliance
The chair of MIPI's Automotive Working Group, Matt Ronning of Sony Corporation, provides a status update on MIPI's requirements gathering and specification development efforts to support the automotive market.
MPI DevCon Hsinchu City 2017: Building Intelligent, High-Speed Sensor Connect...MIPI Alliance
MIPI I3C enables multiple sensor connectivity using a single integrated bus with minimal pin count and throughput up to 33 Mbps. This presentation briefly describes I3C and its key features, and through examples details how I3C can be used in IoT and automotive systems to enable a more intelligent sensor connectivity.
MIPI DevCon 2021: The MIPI Specification Roadmap: Driving Advancements in Mob...MIPI Alliance
Presented by James Goel, MIPI Technical Steering Group Chair
Despite the many challenges over the past year, MIPI Alliance is on track to release more specifications in 2021 than in any other year in the organization's history. This packed schedule covers updates to many of MIPI's most popular specifications, including all physical layer specifications, MIPI I3C® and I3C Basic℠, and those for camera and display, in addition to introducing several new specifications. James Goel, chair of the MIPI Technical Steering Group, highlights some of the key specifications released over the past year and then provides a look at what's still to come. He' also provides an overview of MIPI's development activity in particular focus areas, such as automotive, IoT, 5G and security.
MPI DevCon Hsinchu City 2017: Mobile Influenced Markets – Evolution of Camera...MIPI Alliance
Tom Watzka of Lattice Semiconductor discusses the evolution of innovative mobile-influenced applications (such as AR/VR and drones), including the unique issues faced by system and software developers.
Presented by James Goel, MIPI Technical Steering Group chair, and Rick Wietfeldt, Security Working Group co-chair
This session brings you up to speed on all the latest developments within MIPI Automotive SerDes Solutions (MASS) – a framework that provides a full-stack, end-to-end sensor/display-to-ECU solution for autonomous driving and ADAS systems that leverage existing MIPI CSI-2®, DSI-2℠ and VESA eDP/DP protocols running over MIPI A-PHY℠. The presentation also explains how recent developments make it easier for you to integrate MIPI A-PHY into your next automotive E/E architecture and how, through A-PHY's adoption as an IEEE standard, it can be accessed for evaluation without MIPI membership.
In addition, the presenters discuss how recently released MIPI Camera and Display Service Extensions (CSE and DSE) and their associated protocol adaptation layers (PALs) work together to embed functional safety and security enablers natively at the "edge" – ultimately within the sensor, display and ECU components themselves.
MIPI DevCon Seoul 2018: Evolving MIPI I3C for New Usages and IndustriesMIPI Alliance
Ken Foust of Intel Corporation focuses on the efforts MIPI is taking to evolve the capabilities and access of I3C℠ to allow broad, long-term adoption across multiple industries and usages.
MIPI DevCon Taipei 2019: PHY Testing Challenges and Opportunities: The Need F...MIPI Alliance
Victor Sanchez-Rico, project manager MIPI at BitifEye Digital Test Solutions GmbH, highlights the challenges observed and the lessons learned from BitifEye's experience with testing of high-speed digital interconnect busses, with a focus on the complex high-speed electrical PHY layer receiver conformance tests.
MIPI DevCon Seoul 2018: Dual Mode C-PHY/D-PHY Use in VR Display IC MIPI Alliance
This co-presentation from Ahmed Ella of Mixel, Inc., and Jeffrey Lukanc of Synaptics, will cover Synaptics VXR7200 DisplayPort to Dual MIPI VR Bridge IC, integrating a Mixel C-PHY℠/D-PHY℠ Combo IP and controller.
MIPI DevCon Seoul 2018: High-Performance VR Applications Drive High-Resolutio...MIPI Alliance
This presentation by Miguel Rodriguez discusses Analogix's DisplayPort to MIPI DSI℠ controller for VR HMDs, which powers today’s tethered VR headsets in various configurations with distinct benefits and performance levels.
MPI DevCon Hsinchu City 2017: Create Higher Resolution Displays With VESA Dis...MIPI Alliance
Alain Legault of Hardent discusses the challenges of designing products to meet the demands of current and future displays and highlights how DSC compression offers an innovative solution to deal with these challenges.
Kevin Yee, chair of MIPI Marketing Steering Group, and Ian Smith, MIPI technical content manager and author of the MIPI Alliance IoT White Paper, explain the advantages of using MIPI specifications within IoT devices and provide an overview of the MIPI specifications that are most relevant to the IoT market.
Introduction to Software Defined Visualization (SDVis)Intel® Software
Software defined visualization (SDVis) is an open-source initiative from Intel and industry collaborators. Improve the visual fidelity, performance, and efficiency of prominent visualization solutions, while supporting the rapidly growing big data use on workstations through high-performance computing (HPC) on supercomputing clusters without memory limitations and cost of GPU-based solutions.
In the design of electronics and semiconductors, challenges are compounded by the integration of AI, multi-core, real-time software, network, connectivity, diagnostics, and security. Performance limits, battery life, and cost are adoption barriers. It is extremely important to have tools and processes that deliver efficiency throughout the design cycle.
Continuous verification from planning to development addresses the multi-discipline needs of hardware, software, and networks. This unique approach accelerates the design phase, defines the test efforts, and finds defects during specification. Architecture modeling is required to meet timing deadlines, generate the lowest power consumption, and attain the highest Quality-of-Service. optimize the electronic design system and designing of custom components.
Webinar: NVIDIA JETSON – A Inteligência Artificial na palma de sua mãoEmbarcados
Objetivo do Webinar: Venha saber como a plataforma NVIDIA Jetson e suas ferramentas habilitam você a desenvolver e implantar robôs, drones, aplicativos de IVA e outras máquinas autônomas com tecnologia AI que pensam por conta própria.
Apoio: Arrow e NVIDIA.
Convidado: Marcel Saraiva
Gerente de Contas Enterprise da NVIDIA, executivo com 20 anos de expereincia no mercado de TI, teve na sua carreia passagens pela SGI (Silicon Graphics), Intel e Scansource. Engenheiro eletrico formado pela FEI, com pós-graduação em Marketing pela FAAP e MBA em Gestão Empresarial pela FGV.
Link para o Webinar: https://www.embarcados.com.br/webinars/nvidia-jetson-a-inteligencia-artificial-na-palma-de-sua-mao/
MIPI DevCon 2016: Image Sensor and Display Connectivity DisruptionMIPI Alliance
The ability to leverage mobile technologies into new consumer, medical, industrial, and automotive markets creates challenges in image sensor and display interfacing. When interface types or number of the interfaces do not match between image sensors, displays and processors, a bridge is required to enable such connectivity. In this presentation, Grant Jennings of Lattice Semiconductor describes connectivity through programmable interface bridges to aid in the development of these systems that were unforeseen or previously could not be rationalized.
SS-CPSIoT 2023_Kevin Mika and Piotr Zierhoffer presentationVEDLIoT Project
VEDLIoT – Accelerated AIoT. Kevin Mika and Piotr Zierhoffer. CPS&IoT’2023 Summer School on Cyber-Physical Systems and Internet-of-Things, Budva, Montenegro, June 2023
Automotive Challenges Addressed by Standard and Non-Standard Based IPCAST, Inc.
IP cores from CAST for automotive bus controllers and video applications: CAN FD, LIN, SENT, Ethernet, HDR/WDR, and more. Visit http://www.cast-inc.com for more info.
Applying Deep Learning Vision Technology to low-cost/power Embedded SystemsJenny Midwinter
Slides from Ottawa Machine Learning Meetup from January 16, 2016.
Pierre Paulin, Director of R&D at Synopsys (Embedded Vision Subsystems) , will be will be making a presentation on:
“Applying Deep Learning Vision Technology to Low-Cost, Low-Power Embedded Systems: An Industrial Perspective”
Solutions for ADAS and AI data engineering using OpenPOWER/POWER systemsGanesan Narayanasamy
The ultimate goal of ADAS feature development is to make our roads safer and better suited for fully autonomous vehicles in the long run. Still, manufacturers and buyers shouldn’t underestimate the importance of ADAS for meeting current automotive challenges. The most significant impact of advanced driver assistance systems is in providing drivers with essential information and automating difficult and repetitive tasks. This increases safety for everyone on the road
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2022/07/accelerate-tomorrows-models-with-lattice-fpgas-a-presentation-from-lattice-semiconductor/
Hussein Osman, Segment Marketing Director at Lattice Semiconductor, presents the “Accelerate Tomorrow’s Models with Lattice FPGAs” tutorial at the May 2022 Embedded Vision Summit.
Deep learning models are advancing at a dizzying pace, creating difficult dilemmas for system developers. When you begin developing an edge AI system, you select the best available model for your needs. But by the time you’re ready to deploy your product, your original model is obsolete. You’d like to upgrade your model, but your neural network accelerator was designed with previous-generation models in mind and struggles to deliver top performance and efficiency on state-of-the-art models. The solution is hardware that adapts to the needs of whatever algorithms you choose.
Hardware programmability enables Lattice FPGAs to support the latest models and techniques with astounding efficiency, typically consuming less than 200 mW when running visual AI workloads at 30+ frames per second. In this talk, Osman shows how Lattice FPGAs, coupled with our production-proven sensAI solution stack, are being used to quickly develop super-efficient AI implementations that enable groundbreaking features in smart edge devices.
Supermicro’s Universal GPU: Modular, Standards Based and Built for the FutureRebekah Rodriguez
The Universal GPU system architecture combines the latest technologies that support multiple GPU form factors, CPU choices, storage, and networking options.Together, these components are optimized to deliver high performance in a balanced architecture in a highly scalable system. Systems can be optimized for each customer’s specific Artificial Intelligence (AI), Machine Learning (ML), or High Performance Computing (HPC) applications. Organizations worldwide are demanding new options for their future computing environments, which have the thermal headroom for the next generation of CPUs and GPUs.
Join this webinar to learn how to leverage Supermicro's Universal GPU system to simplify customer deployments, deliver ultimate modularity and customization options for AI to Omniverse environments.
Lattice has introduced its CrossLink™ programmable bridging device that supports leading protocols for mobile image sensors and displays. Systems with embedded cameras and displays often do not have the right type or number of interfaces, which can be resolved using a bridge. The new CrossLink device combines the flexibility and fast time to market of an FPGA with the power and functional optimization of an ASSP to create a new product class called programmable ASSP (pASSP™).
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2023/06/tensilica-processor-cores-enable-sensor-fusion-for-robust-perception-a-presentation-from-cadence/
Amol Borkar, Product Marketing Director at Cadence, presents the “Tensilica Processor Cores Enable Sensor Fusion for Robust Perception” tutorial at the May 2023 Embedded Vision Summit.
Until recently, the majority of sensor-based AI processing used vision and speech inputs. Recently, we have begun to see radar, LiDAR, event-based image sensors and other types of sensors used in new AI applications. And, increasingly, system developers are incorporating multiple, heterogeneous sensors in their designs and utilizing sensor fusion techniques to enable more robust machine perception.
In this presentation, Borkar explores some of the heterogeneous sensor combinations and sensor fusion approaches that are gaining adoption in applications such as driver assistance and mobile robots. He also shows how the Cadence Tensilica ConnX and Vision processor IP core families and their associated software tools and libraries support sensor fusion applications with high performance, efficiency and ease of development.
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2022/06/programming-vision-pipelines-on-amds-ai-engines-a-presentation-from-amd/
Kristof Denolf, Principal Engineer, and Bader Alam, Director of Software Engineering, both of AMD, present the “Programming Vision Pipelines on AMD’s AI Engines” tutorial at the May 2022 Embedded Vision Summit.
AMD’s latest generation of Adaptive Compute Acceleration Platforms (ACAP), Versal AI Core and Versal AI Edge, include an array of powerful AI Engines alongside other computation components, such as programmable logic and ARM cores. This array of AI Engines has high computational capability to address the workloads of diverse applications, including automotive solutions.
This presentation introduces the properties and capabilities of these AI Engines for image, video and vision processing. Denolf and Alam begin with a top-down look at how video data makes its way to the AI Engines. Then they delve into a detailed discussion of the compute properties of the VLIW vector architecture of the AI Engines and illustrate how it efficiently executes vision processing kernels. Next, they introduce the Vitis Vision Library and give an overview of its data movement and kernel processing capabilities. They conclude by showing how AMD’s Vitis tools support building a vision pipeline and analyzing its performance.
This session will provide an overview of the new Qualcomm® Snapdragon™ Automotive Development Platform (ADP), which offers the multiple, integrated capabilities of optimized Qualcomm Technologies, Inc., production-grade solutions in a single-board platform. The ADP enables rapid development, testing and deployment of next-generation infotainment apps and experiences for the emerging connected car opportunity. Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc.
Watch this presentation on YouTube:
https://www.youtube.com/watch?v=RMF3AQon3NU
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MIPI DevCon 2021: MIPI I3C Under the Spotlight: A Fireside Chat with the I3C ...MIPI Alliance
Panel discussion with Tim McKee, MIPI I3C Working Group chair; Matthew Schnoor; Eyuel Zewdu Teferi, MIPI I3C Basic Ad-hoc Working Group vice chair; and Radu Pitigoi-Aron
This session puts MIPI I3C® "under the spotlight" by assembling a panel of experts to talk about the latest developments in the world of I3C. The panel discusses the latest I3C specifications (including the latest HCI specification), how to address conformance in the absence of face-to-face plug fests, and how the MIPI I3C interface is being leveraged by other standards organizations.
MIPI DevCon 2021: MIPI I3C Application and Validation Models for IoT Sensor N...MIPI Alliance
Presented by Eyuel Zewdu Teferi, David Schumacher and Souha Kouki, STMicroelectronics
This presentation provides a global overview of using MIPI I3C® protocol for on-board communication among subsystems of an IoT sensor node. It includes adoption of MIPI CTS by using SysML models of requirements and test cases as an approach to manage I3C application use cases requirement validation.
MIPI DevCon 2021: MIPI I3C Signal Integrity Challenges on DDR5-based Server P...MIPI Alliance
Presented by Azusena Lupercio Ramirez, Juan Orozco and Nestor Hernandez Cruz, Intel Corporation
The MIPI I3C® protocol is first used in a server application for the DDR5 DIMM SPD function. MIPI I3C was defined for low capacitance applications, while DDR5 SPD exceeds by far the bus capacitance specification. This presentation covers the interoperability challenges of the dynamic push-pull and open-drain operating modes, on server applications with an in-depth analysis of the implications of long PCB traces, multiple DIMM routing branches, and multiple loads to the electrical and timing parameters.
MIPI DevCon 2021: MIPI I3C interface for the ETSI Smart Secure PlatformMIPI Alliance
Presented by Gulio Follero, ETSI
The ETSI Technical Committee Smart Card Platform (TC SCP) is developing the specification of the next generation secure element, the Smart Secure Platform (SSP). SCP is standardizing the MIPI I3C interface for SSP. This presentation describes the SSP architecture and its main use cases, followed by a discussion of how the MIPI I3C interface is adapted to the SSP and the main benefits in terms of speed, power and efficiency.
MIPI DevCon 2021: MIPI Security for Automotive and IoT – Initial Focus on MASSMIPI Alliance
Presented by Philip Hawkes and Rick Wietfeldt, co-chairs of the MIPI Security Working Group
MIPI Automotive SerDes Solutions (MASS) allows transmission of sensor and display data between sensors, electronic control units (ECUs) and displays distributed around a vehicle. The MIPI Security Working Group is developing a MASS security framework for protecting this data against malicious attacks.
This session covers the objectives of the security framework and explains how the framework achieves those objectives.
MIPI DevCon 2021: MIPI HTI, PTI and STP: The Bases for Next-Generation Online...MIPI Alliance
Presented by Thomas B. Preußer and Alexander Weiss, Accemic Technologies GmbH
The key challenge for testing and debugging embedded multicore systems is their limited observability. MIPI trace protocols provide essential operational insights non-intrusively, and this presentation advocates for the continuous online analysis of these trace data. It also contrasts the challenges posed by the vigorously compressed MIPI trace protocols with the enormous benefits that can be gained by online processing.
MIPI DevCon 2021: Meeting the Needs of Next-Generation Displays with a High-P...MIPI Alliance
Presented by Alain Legault, Hardent Inc.; Joe Rodriguez, Rambus Inc.; and Justin Endo, Mixel, Inc.
Next-generation display applications have an insatiable appetite for bandwidth. Using a combination of VESA Display Stream Compression (DSC) and MIPI DSI-2℠ technology, designers can achieve display resolutions up to 8K without compromise to video quality, battery life or cost. This presentation discusses a fully integrated, off-the-shelf display IP subsystem solution, consisting of Mixel (MIPI C-PHY℠/D-PHY℠ combo), Rambus (MIPI DSI-2® controller) and Hardent (VESA DSC) IP, that can deliver this state-of-the-art performance in a power-efficient and compact footprint.
MIPI DevCon 2021: MIPI CSI-2 v4.0 Panel Discussion with the MIPI Camera Worki...MIPI Alliance
Panel discussion with Haran Thanigasalam, Intel Corporation, MIPI Camera Working Group chair; Natsuko Ibuki, Google, LLC;
Yuichi Mizutani, Sony Corporation; and Wonseok Lee, Samsung Electronics, Co.
MIPI DevCon 2021: MIPI D-PHY and MIPI CSI-2 for IoT: AI Edge DevicesMIPI Alliance
Presented by Ashraf Takla, Mixel Inc.
This presentation covers the deployment of MIPI D-PHY℠ and MIPI CSI-2® in IoT and edge devices. While many mobile-influenced applications benefit from the low-power, small-form factor of MIPI specifications, AI edge processors in particular are seeing a surge in the use of MIPI specifications for their sensors as market trends shift from processing in the cloud or central location, to processing at the edge.
This presentation includes a high-level system overview of a specific use case, Perceive Ergo edge inference processor, and how Mixel was able to meet Perceive’s stringent requirements with its MIPI D-PHY CSI-2 TX and D-PHY CSI-2 RX IPs.
MIPI DevCon 2021: State of the AllianceMIPI Alliance
Get an update on MIPI Alliance priority initiatives in mobile and in the beyond-mobile focus areas of automotive, IoT and 5G. Peter Lefkin, MIPI managing director, discusses collaborative efforts within the Alliance and industry, as well as progress toward strategic priorities, including the development of key specifications and resources, education opportunities, outreach and other activities to support the MIPI member ecosystem.
MIPI DevCon 2020 | Snapshot of MIPI RFFE v3.0 from a System-Architecture Per...MIPI Alliance
Lalan Mishra, vice-chair of the MIPI RFFE Working Group, presents the new features of MIPI RFFE v3.0 to help architecture and design engineers understand how the triggering features in the latest version work together to improve performance and to switch quickly among the various bands and band combinations in a 5G system.
MIPI DevCon 2020 | The Story Behind the MIPI I3C HCI Driver for LinuxMIPI Alliance
Nicolas Pitre of BayLibre covers the work that has been done to date to plan Linux support when new technology is developed and a quick overview of future development.
MIPI DevCon 2020 | Interoperability Challenges and Solutions for MIPI I3CMIPI Alliance
This presentation from Geoffrey Duerden of Introspect Technology features a case study of several specific interoperability challenges and solutions in terms of circuit and layout guidelines, protocol implementations and target applications.
MIPI DevCon 2020 | MIPI to Bluetooth LE: Leveraging Mobile Technology for Wir...MIPI Alliance
Grant Jennings of GOWIN Semiconductor shares use case examples in the wireless IoT space found while helping customers develop new types of solutions with the first SoC FPGA with built in Bluetooth Low Energy (LE) transceiver.
This joint presentation from Ahmed Ella of Mixel and Serge Di Matteo of Renesas covers the deployment of MIPI D-PHY℠ in an autonomous driving use-case and the advantages of using MIPI specifications in functional safety applications.
MIPI DevCon 2020 | State of the AllianceMIPI Alliance
MIPI Managing Director Peter Lefkin shares an overview of progress on priority initiatives in mobile and in the beyond-mobile focus areas of automotive, IoT and 5G.
MIPI DevCon Taipei 2019 Keynote: Technologies for Automated DrivingMIPI Alliance
Simon Teng, assistant general nanager of the Intelligent Automotive Business Unit at MediaTek, discusses the mega trends of automotive, the kinds of technologies needed to realize these mega trends, and how SoC solutions with these technologies will become the foundation of automated driving systems.
MIPI DevCon Taipei 2019: An Introduction to MIPI I3C® v1.1 and What's NextMIPI Alliance
Ken Foust, principal engineer at Intel Corporation, focuses on the new features available in MIPI I3C® v1.1 and the efforts MIPI is taking to advance I3C for broad, long-term adoption across multiple industries and usages.
MIPI DevCon Taipei 2019: Addressing 5G RFFE Control Challenges with MIPI RFFE...MIPI Alliance
Andrew Scott-Mackie, RF control systems engineer at Intel Corporation, discusses how MIPI RFFE℠ 3.0 aims to meet the new 5G control timing requirements and adds several enhancements to the RFFE-Trigger specification to meet 5G use cases.
MIPI DevCon Taipei 2019: Study on the Influence of Random Jitter to the MIPI ...MIPI Alliance
HeeSoo Lee, SerDes/DDR product owner, and Jingshen Liu, R&D engineer, at Keysight Technologies Inc., focus on the influence of random jitters to the MIPI C-PHY℠ high speed timing, providing a reference for MIPI C-PHY designers and informing the future development of MIPI C-PHY.
JMeter webinar - integration with InfluxDB and GrafanaRTTS
Watch this recorded webinar about real-time monitoring of application performance. See how to integrate Apache JMeter, the open-source leader in performance testing, with InfluxDB, the open-source time-series database, and Grafana, the open-source analytics and visualization application.
In this webinar, we will review the benefits of leveraging InfluxDB and Grafana when executing load tests and demonstrate how these tools are used to visualize performance metrics.
Length: 30 minutes
Session Overview
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During this webinar, we will cover the following topics while demonstrating the integrations of JMeter, InfluxDB and Grafana:
- What out-of-the-box solutions are available for real-time monitoring JMeter tests?
- What are the benefits of integrating InfluxDB and Grafana into the load testing stack?
- Which features are provided by Grafana?
- Demonstration of InfluxDB and Grafana using a practice web application
To view the webinar recording, go to:
https://www.rttsweb.com/jmeter-integration-webinar
Neuro-symbolic is not enough, we need neuro-*semantic*Frank van Harmelen
Neuro-symbolic (NeSy) AI is on the rise. However, simply machine learning on just any symbolic structure is not sufficient to really harvest the gains of NeSy. These will only be gained when the symbolic structures have an actual semantics. I give an operational definition of semantics as “predictable inference”.
All of this illustrated with link prediction over knowledge graphs, but the argument is general.
LF Energy Webinar: Electrical Grid Modelling and Simulation Through PowSyBl -...DanBrown980551
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
Join us to learn more about this new, human-in-the-loop capability, brought to you by Integration Service connectors.
And...
Speakers:
Akshay Agnihotri, Product Manager
Charlie Greenberg, Host
Kubernetes & AI - Beauty and the Beast !?! @KCD Istanbul 2024Tobias Schneck
As AI technology is pushing into IT I was wondering myself, as an “infrastructure container kubernetes guy”, how get this fancy AI technology get managed from an infrastructure operational view? Is it possible to apply our lovely cloud native principals as well? What benefit’s both technologies could bring to each other?
Let me take this questions and provide you a short journey through existing deployment models and use cases for AI software. On practical examples, we discuss what cloud/on-premise strategy we may need for applying it to our own infrastructure to get it to work from an enterprise perspective. I want to give an overview about infrastructure requirements and technologies, what could be beneficial or limiting your AI use cases in an enterprise environment. An interactive Demo will give you some insides, what approaches I got already working for real.
Smart TV Buyer Insights Survey 2024 by 91mobiles.pdf91mobiles
91mobiles recently conducted a Smart TV Buyer Insights Survey in which we asked over 3,000 respondents about the TV they own, aspects they look at on a new TV, and their TV buying preferences.
Accelerate your Kubernetes clusters with Varnish CachingThijs Feryn
A presentation about the usage and availability of Varnish on Kubernetes. This talk explores the capabilities of Varnish caching and shows how to use the Varnish Helm chart to deploy it to Kubernetes.
This presentation was delivered at K8SUG Singapore. See https://feryn.eu/presentations/accelerate-your-kubernetes-clusters-with-varnish-caching-k8sug-singapore-28-2024 for more details.