Since the 1980’s microelectromechanical systems (“MEMS”) based devices have been manufactured primarily on round silicon (“Si”) substrates. This has been accomplished by primarily riding the “coattails” of the semiconductor (“SEMI”) integrated circuit chip industry, where Si substrate diameters have grown from less than 50 mm to 300 mm. As new larger diameter fabrication equipment was needed the previous generation tools (refurbished) were adopted by the MEMS industry at much lower price points.
Today, the SEMI industry has stalled at 300 mm, likewise the MEMS industry is mired at 200 mm diameter. The issue is that many MEMS chip dimensions can be large, greater than 10 x 10 mm^2 in area and can have expensive wafer-level packaging (“WLP”) utilized to protect its moving parts from inexpensive plastic molded packaging. When considering the $1 per mm^2 ‘rule of thumb’ for unyielded chip production cost, these “Big MEMS” chips are very difficult to fabricate cost effectively for their accompanying product market adoption.
Meanwhile over the last two decades of flat panel display (FPD) technology requirements have continued to increase in complexity and manufacturing capabilities. This includes increasing FPD resolution from today’s 4K to 8K and glass substrate size up to 3.1 x 3.1 m^2, a.k.a. ‘Generation 10 (Gen 10 or G10)’ glass. To achieve these challenging levels many manufacturing obstacles have had to be overcome, such as magnetron sputtering over large areas, including deposition thickness uniformity and optical property uniformity, the reduction of yield detractors, such as particles generated due to plasma arcing, and other process challenges.
What if the MEMS/sensor industry wasn’t restricted in substrate size, such as by utilizing G8 (2.1 x 2.4 m^2) or older (smaller area) fabrication equipment? Then, the chip cost could dramatically decrease.
MEMS or Micro-Electro Mechanical System is a technique of combining Electrical and Mechanical components together on a chip, to produce a system of miniature dimensions. MEMS is the integration of a number of micro-components on a single chip which allows the microsystem to both sense and control the environment.
MEMS or Micro-Electro Mechanical System is a technique of combining Electrical and Mechanical components together on a chip, to produce a system of miniature dimensions. MEMS is the integration of a number of micro-components on a single chip which allows the microsystem to both sense and control the environment.
Micromachined Electro-Mechanical Systems, also called microfabricated Systems, have evoked great interest in the scientific and engineering communities. This is primarily due to several substantive advantages that MEMS offer: orders of magnitude smaller size, better performance than other solutions, possibilities for batch fabrication and cost-effective integration with electronics, virtually zero dc power consumption and potentially large reduction in power consumption, etc.
This Seminar would give an introduction to these exciting developments and the technology and design approaches for the realization of these integrated systems. It would be followed with an introduction to the design of microsensors, such as the pressure sensor and the accelerometer, which began the MEMS revolution.
A systematic approach is developed to select manufacturing Process Chains for the generic elements of a MEMS device. A database of MEMS Process Chains and their attendant process attributes is developed from the existing literature, and used to construct Process Attribute charts. The performance requirements of MEMS beams and trenches are translated into the same set of Process Attributes. This allows for a screening of the Process Chains to obtain a list of candidate manufacturing methods.
I begin with a quick introduction to MEMS technology, micron scale and show that silicon is eminently suited for micromechanical devices and therefore the possibility of integrating MEMS with VLSI electronics. Smart cell phones and wireless enabled devices are poised to become commercial engines for the next generation of MEMS, since MEMS provide not only better functionality with smaller chip area, but also alternative transceiver architectures for improved functionality, performance and reliability.
The application domains cover microsensors and actuators for physical quantities, of which MEMS for automobile & consumer electronics forms a large segment; microfabricated subsystems for communications and computer systems.
Micro-Electro-Mechanical Systems, or MEMS, is a technology that in its most general form can be defined as miniaturized mechanical and electro-mechanical elements (i.e., devices and structures) that are made using the techniques of microfabrication. The critical physical dimensions of MEMS devices can vary from well below one micron on the lower end of the dimensional spectrum, all the way to several millimeters. Likewise, the types of MEMS devices can vary from relatively simple structures having no moving elements, to extremely complex electromechanical systems with multiple moving elements under the control of integrated microelectronics. The one main criterion of MEMS is that there are at least some elements having some sort of mechanical functionality whether or not these elements can move. In other words Microsystems are miniaturized integrated systems in a small package or more specifically, micro-sized components working together as a system and assembled into a package that fits on a pinhead. In the United States, these devices are referred to as microelectromechanical systems or MEMS. European countries referred to such devices as microsystems or MST. These two terms – MEMS and MST – are often used interchangeably. Microsystems are microscopic, integrated, self-aware, stand-alone products that can sense, think, communicate and act. Some systems can do all of these things, plus scavenge for power.
complete animated and info graphic description of EMI and EMP and EMC along with definition, causes, effects, products for EMI / EMP shielding and preventive measures
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
MEMS & sensors transitioning towards 3 main Hubs…
The inertial hub
Examples of MEMS companies with a «sensors integration» road (e.g., mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo sensors, AMS with optical combos, InvenSense with IMUs ….
In this presentation we will look at thermal interface materials, influencing factors for heat sink selection, and steps to identify the right heat sink for an LED system design.
Micromachined Electro-Mechanical Systems, also called microfabricated Systems, have evoked great interest in the scientific and engineering communities. This is primarily due to several substantive advantages that MEMS offer: orders of magnitude smaller size, better performance than other solutions, possibilities for batch fabrication and cost-effective integration with electronics, virtually zero dc power consumption and potentially large reduction in power consumption, etc.
This Seminar would give an introduction to these exciting developments and the technology and design approaches for the realization of these integrated systems. It would be followed with an introduction to the design of microsensors, such as the pressure sensor and the accelerometer, which began the MEMS revolution.
A systematic approach is developed to select manufacturing Process Chains for the generic elements of a MEMS device. A database of MEMS Process Chains and their attendant process attributes is developed from the existing literature, and used to construct Process Attribute charts. The performance requirements of MEMS beams and trenches are translated into the same set of Process Attributes. This allows for a screening of the Process Chains to obtain a list of candidate manufacturing methods.
I begin with a quick introduction to MEMS technology, micron scale and show that silicon is eminently suited for micromechanical devices and therefore the possibility of integrating MEMS with VLSI electronics. Smart cell phones and wireless enabled devices are poised to become commercial engines for the next generation of MEMS, since MEMS provide not only better functionality with smaller chip area, but also alternative transceiver architectures for improved functionality, performance and reliability.
The application domains cover microsensors and actuators for physical quantities, of which MEMS for automobile & consumer electronics forms a large segment; microfabricated subsystems for communications and computer systems.
Micro-Electro-Mechanical Systems, or MEMS, is a technology that in its most general form can be defined as miniaturized mechanical and electro-mechanical elements (i.e., devices and structures) that are made using the techniques of microfabrication. The critical physical dimensions of MEMS devices can vary from well below one micron on the lower end of the dimensional spectrum, all the way to several millimeters. Likewise, the types of MEMS devices can vary from relatively simple structures having no moving elements, to extremely complex electromechanical systems with multiple moving elements under the control of integrated microelectronics. The one main criterion of MEMS is that there are at least some elements having some sort of mechanical functionality whether or not these elements can move. In other words Microsystems are miniaturized integrated systems in a small package or more specifically, micro-sized components working together as a system and assembled into a package that fits on a pinhead. In the United States, these devices are referred to as microelectromechanical systems or MEMS. European countries referred to such devices as microsystems or MST. These two terms – MEMS and MST – are often used interchangeably. Microsystems are microscopic, integrated, self-aware, stand-alone products that can sense, think, communicate and act. Some systems can do all of these things, plus scavenge for power.
complete animated and info graphic description of EMI and EMP and EMC along with definition, causes, effects, products for EMI / EMP shielding and preventive measures
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
MEMS & sensors transitioning towards 3 main Hubs…
The inertial hub
Examples of MEMS companies with a «sensors integration» road (e.g., mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo sensors, AMS with optical combos, InvenSense with IMUs ….
In this presentation we will look at thermal interface materials, influencing factors for heat sink selection, and steps to identify the right heat sink for an LED system design.
These slides use concepts from my (Jeff Funk) course entitled analyzing hi-tech opportunities to show how energy harvesters are becoming more economically feasible for the Internet of Things (IoT). Small amounts of energy can be harvested from vibrations, temperature differences, and radio frequencies using various types of electronic devices such as piezoelectric, MEMS, thermo-electric power generators, and other devices. As improvements in them occur and as the energy requirements of accelerometers, pressure sensors, gas detectors, bio-sensors, and readout circuits fall from microwatts to hundreds of nano-watts, energy harvesters become cheaper and better than are batteries. Improvements in energy harvesting are occurring in the form of higher power per area or higher power per temperature difference and improvements of about five times are expected to occur in the next 5 to 10 years. The market for energy harvesters is expected to reach $2.5 Billion by 2024. In addition to their impact on buildings and the other usual applications for IoT, they will also impact on agriculture, aircraft, and medical implants.
Summary of the Nanofone Micromachined Capacitive Microphone (MCM) company, Nanofone. History, description of the works made in Nanofone and also the patents held by Nanofone is presented.
Micro-Electro-Mechanical Systems, or MEMS, is a technology that in its most general form can be defined as miniaturized mechanical and electro-mechanical elements (i.e., devices and structures) that are made using the techniques of microfabrication. The critical physical dimensions of MEMS devices can vary from well below one micron on the lower end of the dimensional spectrum, all the way to several millimeters. Likewise, the types of MEMS devices can vary from relatively simple structures having no moving elements, to extremely complex electromechanical systems with multiple moving elements under the control of integrated microelectronics. The one main criterion of MEMS is that there are at least some elements having some sort of mechanical functionality whether or not these elements can move. The term used to define MEMS varies in different parts of the world. In the United States they are predominantly called MEMS, while in some other parts of the world they are called “Microsystems Technology” or “micromachined devices”.
We have compiled the most important slides from each speaker's presentation. This year’s compilation, available for free, captures the key insights and contributions shared during the DfMAy 2024 conference.
Forklift Classes Overview by Intella PartsIntella Parts
Discover the different forklift classes and their specific applications. Learn how to choose the right forklift for your needs to ensure safety, efficiency, and compliance in your operations.
For more technical information, visit our website https://intellaparts.com
Hybrid optimization of pumped hydro system and solar- Engr. Abdul-Azeez.pdffxintegritypublishin
Advancements in technology unveil a myriad of electrical and electronic breakthroughs geared towards efficiently harnessing limited resources to meet human energy demands. The optimization of hybrid solar PV panels and pumped hydro energy supply systems plays a pivotal role in utilizing natural resources effectively. This initiative not only benefits humanity but also fosters environmental sustainability. The study investigated the design optimization of these hybrid systems, focusing on understanding solar radiation patterns, identifying geographical influences on solar radiation, formulating a mathematical model for system optimization, and determining the optimal configuration of PV panels and pumped hydro storage. Through a comparative analysis approach and eight weeks of data collection, the study addressed key research questions related to solar radiation patterns and optimal system design. The findings highlighted regions with heightened solar radiation levels, showcasing substantial potential for power generation and emphasizing the system's efficiency. Optimizing system design significantly boosted power generation, promoted renewable energy utilization, and enhanced energy storage capacity. The study underscored the benefits of optimizing hybrid solar PV panels and pumped hydro energy supply systems for sustainable energy usage. Optimizing the design of solar PV panels and pumped hydro energy supply systems as examined across diverse climatic conditions in a developing country, not only enhances power generation but also improves the integration of renewable energy sources and boosts energy storage capacities, particularly beneficial for less economically prosperous regions. Additionally, the study provides valuable insights for advancing energy research in economically viable areas. Recommendations included conducting site-specific assessments, utilizing advanced modeling tools, implementing regular maintenance protocols, and enhancing communication among system components.
Water billing management system project report.pdfKamal Acharya
Our project entitled “Water Billing Management System” aims is to generate Water bill with all the charges and penalty. Manual system that is employed is extremely laborious and quite inadequate. It only makes the process more difficult and hard.
The aim of our project is to develop a system that is meant to partially computerize the work performed in the Water Board like generating monthly Water bill, record of consuming unit of water, store record of the customer and previous unpaid record.
We used HTML/PHP as front end and MYSQL as back end for developing our project. HTML is primarily a visual design environment. We can create a android application by designing the form and that make up the user interface. Adding android application code to the form and the objects such as buttons and text boxes on them and adding any required support code in additional modular.
MySQL is free open source database that facilitates the effective management of the databases by connecting them to the software. It is a stable ,reliable and the powerful solution with the advanced features and advantages which are as follows: Data Security.MySQL is free open source database that facilitates the effective management of the databases by connecting them to the software.
6th International Conference on Machine Learning & Applications (CMLA 2024)ClaraZara1
6th International Conference on Machine Learning & Applications (CMLA 2024) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of on Machine Learning & Applications.
NO1 Uk best vashikaran specialist in delhi vashikaran baba near me online vas...Amil Baba Dawood bangali
Contact with Dawood Bhai Just call on +92322-6382012 and we'll help you. We'll solve all your problems within 12 to 24 hours and with 101% guarantee and with astrology systematic. If you want to take any personal or professional advice then also you can call us on +92322-6382012 , ONLINE LOVE PROBLEM & Other all types of Daily Life Problem's.Then CALL or WHATSAPP us on +92322-6382012 and Get all these problems solutions here by Amil Baba DAWOOD BANGALI
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Cosmetic shop management system project report.pdfKamal Acharya
Buying new cosmetic products is difficult. It can even be scary for those who have sensitive skin and are prone to skin trouble. The information needed to alleviate this problem is on the back of each product, but it's thought to interpret those ingredient lists unless you have a background in chemistry.
Instead of buying and hoping for the best, we can use data science to help us predict which products may be good fits for us. It includes various function programs to do the above mentioned tasks.
Data file handling has been effectively used in the program.
The automated cosmetic shop management system should deal with the automation of general workflow and administration process of the shop. The main processes of the system focus on customer's request where the system is able to search the most appropriate products and deliver it to the customers. It should help the employees to quickly identify the list of cosmetic product that have reached the minimum quantity and also keep a track of expired date for each cosmetic product. It should help the employees to find the rack number in which the product is placed.It is also Faster and more efficient way.
Harnessing WebAssembly for Real-time Stateless Streaming PipelinesChristina Lin
Traditionally, dealing with real-time data pipelines has involved significant overhead, even for straightforward tasks like data transformation or masking. However, in this talk, we’ll venture into the dynamic realm of WebAssembly (WASM) and discover how it can revolutionize the creation of stateless streaming pipelines within a Kafka (Redpanda) broker. These pipelines are adept at managing low-latency, high-data-volume scenarios.
Literature Review Basics and Understanding Reference Management.pptxDr Ramhari Poudyal
Three-day training on academic research focuses on analytical tools at United Technical College, supported by the University Grant Commission, Nepal. 24-26 May 2024
NUMERICAL SIMULATIONS OF HEAT AND MASS TRANSFER IN CONDENSING HEAT EXCHANGERS...ssuser7dcef0
Power plants release a large amount of water vapor into the
atmosphere through the stack. The flue gas can be a potential
source for obtaining much needed cooling water for a power
plant. If a power plant could recover and reuse a portion of this
moisture, it could reduce its total cooling water intake
requirement. One of the most practical way to recover water
from flue gas is to use a condensing heat exchanger. The power
plant could also recover latent heat due to condensation as well
as sensible heat due to lowering the flue gas exit temperature.
Additionally, harmful acids released from the stack can be
reduced in a condensing heat exchanger by acid condensation. reduced in a condensing heat exchanger by acid condensation.
Condensation of vapors in flue gas is a complicated
phenomenon since heat and mass transfer of water vapor and
various acids simultaneously occur in the presence of noncondensable
gases such as nitrogen and oxygen. Design of a
condenser depends on the knowledge and understanding of the
heat and mass transfer processes. A computer program for
numerical simulations of water (H2O) and sulfuric acid (H2SO4)
condensation in a flue gas condensing heat exchanger was
developed using MATLAB. Governing equations based on
mass and energy balances for the system were derived to
predict variables such as flue gas exit temperature, cooling
water outlet temperature, mole fraction and condensation rates
of water and sulfuric acid vapors. The equations were solved
using an iterative solution technique with calculations of heat
and mass transfer coefficients and physical properties.
Lowering Production Cost of "Big MEMS (and Sensors)" Chip Technologies using Large Area Manufacturing Techniques
1. www.advanced-energy.com
1
REDUCING PRODUCTION COST OF “BIG MEMS”
CHIP TECHNOLOGIES USING LARGE AREA
MANUFACTURING TECHNIQUES
Dr. Robert G. Andosca
Director, Worldwide Applications Technology
Advanced Materials Processes (AMP)
Advanced Energy Industries Inc.
An Invited Keynote Address – given May 2nd 2019
2. www.advanced-energy.com
ABOUT THE SPEAKER
2
Robert G. Andosca, Ph.D.
Director
Worldwide Applications Technology
Advanced Energy Inc.
• 25+ years semiconductor and MEMS / sensor industry experience
– C-level and operations management, business development
• Formed numerous strategic partnerships and strong business relationships
• Wrote $4.4M in awarded government proposals and corporate JDA
– Entrepreneur – Founder and former CEO/CTO, MicroGen Systems Inc.
• Piezo-MEMS based vibration energy harvester products to power
various automotive and industrial Internet of Things (IoT) sensor modules
• Raised $8M in strategic corporate and angel venture investment
– Scientist and engineer
• Ph.D. / M.S. Materials Science (EE, ME & Physics), The University of Vermont
• Design – Semiconductor IC, MEMS, sensors and photovoltaics
• Process specialty – PVD, PECVD and etch (e.g. DRIE) of various thin films
– 12 publications, 25 issued US and international patents (another 11 pending)
– Invited speaker worldwide (28X)
• IoT, energy harvesting and various thin film based technologies
5. www.advanced-energy.com
IOT – TRILLION SENSOR VISION
5
Dr. Janusz Bryzek, sometimes referred to as “The Father
of Sensors” and “The Trillion Sensor Man”, is the Chairman
and CEO of Trillion Sensors Summit.
Co-Founder of NovaSensor (acquired by GE), LV Sensors,
InvenSense (acquired by TDK), Jyve (acquired by Fairchild),
eXo (currently CEO) and several other MEMS companies.
60T / year
in 2035
https://www.eenewsanalog.com/news/janusz-bryzek-trillion-sensor-man-part-1/page/0/1
https://www.eenewsanalog.com/news/janusz-bryzek-trillion-sensor-man-part-2-0
7. www.advanced-energy.com
WHAT IS MEMS?
7
✓ Micro Electro Mechanical Systems (MEMS)
• Micro-scale dimensions – typical features < 100 microns
• Electrical and Mechanical features
• Systems – internal and external features combine to form a function
✓ Typical fabrication techniques
• Originally only used IC fabrication techniques on Si substrates
• Batch processing is used to lower cost
• More MEMS specific processes (e.g. DRIE) and materials
(e.g. glass and flexible substrates) now in use
Majority of MEMS devices
are < 10 mm2 in size
1-axis MACRO-
accelerometer (early 1990’s)
3-axis MEMS accelerometer
(up to 12-axes today)
✓ MEMS is an enabling technology
• Able to reduce size | macro-scale → micro-scale
(e.g. accelerometers – see pictures)
• Can lower unit cost
• Can have more precise functionality
8. www.advanced-energy.com
MEMS – SURFACE -VS- BULK MICROMACHINING
8
Surface micromachining (2D)
✓ Multilayered deposition, patterning, etch and release of
structures only on surface of substrate
✓ No etching of the substrate – serves as foundation only
Bulk micromachining (3D)
✓ Includes surface micromachining
✓ Utilizes substrate as a functional mechanism
(e.g. membrane or spring) via etching
✓ Substrate bonding may be used as well
Mirror (popped up) Gear train
Membrane pressure sensor
KOH etched Si forming
54.7° wall angle – (111) plane
Can be DRIE with 90° walls
for chip packing density
substrate sideview
surface structures
top down view
2nd substrate sideview
substrate sideview bonding
surface structures
backside port
cavity
11. www.advanced-energy.com
WHAT IS “BIG MEMS”?
11
• Big MEMS – large devices that cannot miniaturize well, yet could benefit from alternative
high volume manufacturing techniques and the resulting lower production costs
✓ External connections (non-electrical) –
• Microfluidic bio-devices – e.g. connections to external tubing
• Optical switching – e.g. connections to fiber optics
✓ Surface area dependency –
• Electrical power generating devices
• Piezoelectric and thermal energy harvesting – e.g. powering IoT wireless sensors!
• Micro-fuel cells (MFC) – e.g. to enable mobile electronics
• Biometric sensors
• Piezoresistive (and piezoelectric) pressure sensors
• Microphones / micro speakers – e.g. mobile phones
Small chip size, but very
high production volume
Flexible Fingerprint Sensor
2D optical cross connect
12. www.advanced-energy.com
BIG MEMS – E.G.
12
Solid Oxide micro-Fuel Cell (SOFC)
✓ Seven (7) 4 x 3 cm2 MEMS die stacked and glass-frit bonded
✓ Up to 8-photo mask levels per wafer (average 4 levels per wafer)
✓ Required nano- to micro-layer thickness control with high
uniformity and low stress
✓ Otherwise contains large printed feature dimensions
piezoMEMS Vibration Energy Harvester (pVEH)
✓ Three (3) 1-1.5 cm x 1-1.5 cm MEMS die stacked, including
glass wafer-level-packaging (glass-frit bonded)
✓ 6-photo mask levels excluding wafer-level packaging (WLP)
✓ Required nano- to micro-layer thickness control with high
uniformity and low stress
✓ Otherwise contains large printed feature dimensions
13. www.advanced-energy.com
BIG MEMS – E.G.
BioMEMS microfluidic chip
• An automated FISH microfluidic chip,
which integrates a reagent multiplexer, a
cell chamber with a thin-film heater layer,
and a peristaltic pump.
13
Fluorescence in situ hybridization (FISH) is a molecular
cytogenetic technique that uses fluorescent probes that bind
to only those parts of a nucleic acid sequence with a high
degree of sequence complementarity.
14. www.advanced-energy.com
BIG MEMS – E.G.
14
• Most optical switching companies went out of business after the Telecom Bubble crash in 2001
• LA manufacturing could revitalize such MEMS optical switch products for telecom today!
15. www.advanced-energy.com
BIG MEMS – E.G. BIOMETRIC SENSORS
15
All Fingers Entire Hand
• Example backlit images of individual fingerprints and full hand
• Reflected light is detected by the dpiX digital a-Si TFT & photodiode array
• Images are grey scale (light intensity measured, not color)
16. www.advanced-energy.com
IMMEDIATE HIGH VOLUME SMALL MEMS EXAMPLES FOR LA PRODUCTION
Pressure sensors (e.g. automotive TPMS) piezoMEMS microphones (e.g. mobile devices)
16
• 500M TPMS units per year to
be sold in 2025
• Used within Amazon Echo®
✓ Water proof microphone design
17. www.advanced-energy.com 17
MEMS
IC
• As IC substrate sizes increased MEMS
companies and foundries adopted the older
equipment technology at low cost
Diameter Chip size
+ 200 mm scribe
Chips / wafer Est. chip cost low volume
6-masks, 90% yield
Est. chip cost high volume
6-masks, 90% yield
150 mm 1 x 1 cm2 113 $28 chip only | $49 WLP $3 chip only | $5 WLP
200 mm 1 x 1 cm2 216 $21 chip only | $37 WLP $2 chip only | $4 WLP
ECONOMIES OF SCALE → MEMS MARKET ADOPTION
(adoption year?)
• Now, the IC industry is stalled at 300 mm
• Consequently, MEMS is mired at 200 mm
✓ MEMS market entry/adoption
is being blocked by high unit
cost in low volume
18. www.advanced-energy.com
300 370
460
Gen 1 / 2
ECONOMIES OF SCALE – FABRICATE MEMS USING LARGE AREA TECHNIQUES
18
GEN Chip size
+ 200 mm scribe
Chips / substrate Est. chip cost low volume
6-masks, 90% yield
Est. chip cost high volume
6-masks, 90% yield
2.0 1 x 1 cm2 1406 $3.80 chip only | $8.00 WLP $0.38 chip | $0.80 WLP
4.0 1 x 1 cm2 4945 $1.46 chip only | $3.00 WLP $0.15 chip | $0.30 WLP
A single Gen 2 substrate area equivalency –
✓ 6.5 wafers @ 200 mm diameter
A single Gen 4 substrate area equivalency –
✓ 22 wafers @ 200 mm diameter
✓ Market entry is much more
tractable using large area
manufacturing techniques … let
alone the high volume cost-points
19. www.advanced-energy.com
SVC TECHCON 2019 – LARGE AREA MEMS & SENSORS MANUFACTURING
19
. . . just imagine using large area manufacturing techniques
to drive down production cost!
At normally 1 US$ per 1 mm2 for each Si die . . .
Optical
waveguide switches
BioMEMS
✓ Could benefit from
LA fabrication
techniques
20. www.advanced-energy.com
E.G. – EMERGING IOT TECH THAT IS NEEDING COST REDUCTION (1)
20
"Energy is a challenge. To power trillions of
sensors requires energy and per unit (cost) will
have to be reduced from today's levels. It will
need to be derived from light, vibration,
thermal energy scavengers. Particularly we
need to reduce the energy to power radios by
a factor of 100 to allow them to be powered by
scavenging,“
-- Dr. Janusz Bryzek
https://www.eenewsanalog.com/news/janusz-bryzek-trillion-sensor-man-part-2-0/page/0/1
21. www.advanced-energy.com
E.G. – EMERGING IOT TECH THAT NEEDING COST REDUCTION (2)
21
piezoMEMS
vibration energy
harvester for
powering IoT
wireless sensors
• $75-100 → < $10 each
in low → high standard
200 mm diameter
manufacturing volume
(without energy management
electronics)
✓ $3 - 6 each → << $1 each in low → high
Gen 2 - 4 manufacturing volume (without
energy management electronics)
25. www.advanced-energy.com
MOBILE DEVICES DRIVING HIGHER RESOLUTION
25
HD TV → 758 pixels/ inch2
8K TV → 12K pixels/ inch2
iPhone X’s → 213K pixels/inch2
Large Screen
LCD-TV
High Resolution
Smart Phone
Pixel Structure
26. www.advanced-energy.com
SUBSTRATE SIZE INCREASING FOR MANUFACTURING ECONOMICS
26
3.4 meters
Large area manufacturing
uses similar techniques as
IC processing
✓ 1X and stepper
photolithography
• Spinless resist coating
• Down to 1.2 mm linewidths
✓ DC and RF magnetron
sputtering and PECVD
deposition
• High uniformity
✓ RF plasma etch
• High uniformity
Substrate generations
jumbo
28. www.advanced-energy.com
KEY PROCESS STEPS FOR CONVERSION
Process type Sub-process Large Area (LA) LA MEMS comments
PHOTOLITHOGRAPHY Resist coat ✓ Yes ✓ Yes
Align / expose ✓ Yes ✓ Yes
Develop ✓ Yes ✓ Yes
Resist strip ✓ Yes ✓ Yes
Metal liftoff ✓ Yes ✓ Yes
DEPOSITION Evaporation ✓ Yes ✓ Yes
LPCVD conformal coatings
@ 600-1100’C |
No No Temperature issues w/ glass
substrates
Electroplating ✓ Yes ✓ Yes
DC & RF magnetron
sputtering
✓ Yes ✓ Yes Non-high aspect ratio a = etch
depth/width conformal coatings can
be achieved.
PECVD ✓ Yes ✓ Yes Non-high a conformal coatings can
be achieved.
ETCH Wet (e.g. BOE) ✓ Yes ✓ Yes
Dry (e.g. HF and XeF2) ✓ Yes ✓ Yes
Plasma (e.g. ICP) ✓ Yes Yes, except Deep RIE of
glass. Oxide etch rate is
much slower than Si rate.
Through-glass substrate etching will
need work around (e.g. wet chemical
etching, sand blasting, laser).
28
No clear show stoppers
35. www.advanced-energy.com
DC & RF MAGNETRON SPUTTERING
35
Cathode / target containing raw
material that is sputtered off by
the positive ions impacts
Anode / substrate where
thin film is deposited
substrate
Balanced
Slightly
unbalanced
Highly
unbalanced
plasma plasma
plasma
plasma
cathode / target
substrate
target
36. www.advanced-energy.com
JUMBO GLASS COATERS CAN ACHIEVE NANOMETER LEVEL
DEPOSITION UNIFORMITY → PERFECT FOR MEMS !
36
Source – ULVAC
Power synchronization and
balancing plus superior arc
management across 16
cathodes to increase
uniformity and yield
✓ Advanced Energy is the
world’s leading expert for
plasma power technology!
The aforementioned requires . . .
41. www.advanced-energy.com
SPTS – SILICON VERSUS GLASS ETCHING SUMMARY
• Silicon Deep Reactive Ion Etching (DRIE) etch rates are very fast compared
to glass, yet similar etch profiles can be achieved
– >10 mm/min versus 0.3-0.8 mm/min today → needs improvement, but not
a show stopper since large area substrate processing will compensate for
3-4X added cost to this etch step
– 73-90 degree etch profiles can be achieved in glass w/ various masks
• Pure quartz and fused silica etch like thermal oxide – lower power, smooth
→ 83-90 degree wall angles
• Pyrex contains impurities – requires higher process power with resulting
rougher surfaces
→ 73-83 degree wall angles
• Large area glass DRIE equipment has to be designed/constructed for MEMS
– Requires market pull it takes just 1 large area Gen X MEMS foundry to get market
traction and compete with 200 mm MEMS foundries (see slides # 40-43)
41
43. www.advanced-energy.com
GEN 4.5 FPD FOUNDRY – NOW ONLY LARGE AREA MEMS FOUNDRY IN WORLD
• World class cleanroom facility
– Location: Colorado Springs, CO, USA
– Building: 260,000 ft2
– Cleanroom: 65,000 ft2
– Substrate size: single G4.5 plate = (39) 6” wafers
– Single lot: (20) G4.5 plates = (780) 6” wafers
• Volumes
– Prototyping
– Pilot production
– Mass production
• Customer Benefits
– Provide customers a secure IP environment for
technology and product development
– Extensive design engineering expertise
• Open for business → MEMS April 2019 !
43
X-ray photo detector arrays
for medical imaging on
Gen 4.5 glass
X-ray photo detector arrays
for medical imaging on
Gen 4.5 flexible substrate
44. www.advanced-energy.com
CORE TECHNOLOGY AND CAPABILITIES
• Core Technology
– Substrates: Gen 4.5 glass 700 mm* thick and flexible PI
– Thin Film Transistors (TFTs): a-Si and IGZO**
– Photodiodes: amorphous-Si and organic
• Testing
– Parametric (test structures)
– Full contact (optical sensor arrays)
• Process Capability
– Photolithography
• Resist coating: Extrusion
• Align / expose: Stepper (2.25 μm feature size)
• Develop: Puddle
– Deposition
• PVD: metals, ITO and IGZO
• PECVD: dielectrics and a-Si
– Etching
• Wet: various, including BOE
• Plasma etch: metals, dielectrics
44
M
et
al
a-Si Photodiode
Glass Substrate
TFT
Polyimide Flex Substrate
TFT
a-Si Photodiode
GATE Line
Diode Bias
Top down view
Pixel (FLEX)
PECVD – AMAT tool shown
(As shown using optional polyimide (PI) and moisture
barrier layers for FLEX substrate)
Cross Section View
* 700 mm is the foundry standard, 500 mm thick is optional ** IGZO = Indium Gallium Zinc Oxide
45. www.advanced-energy.com 45
POTENTIAL MEMS / SENSORS APPLICATIONS TODAY!
Substrate = Flex
Metal Electrode 2
Electrolyte
Metal Electrode 1 Substrate = Glass or Flex
TFT Backplane
Lens Array and Hardcoat
Photodiode
Substrate = Flex
TFT Backplane
Photodiode
LED
Finger
Substrate = Glass or Flex
Functionalized TFT Backplane
ââââ Environmental Species ââââ
Substrate = Glass
TFT Backplane
Photodiode
Species w/ Fluorescent Marker
ââââ Excitation ââââ
✓ Solid state battery ✓ Chem-bio
optical sensor
✓ Biometric sensor
✓ Oximeter (patient
O2 monitoring)
✓ Environmental
sensor
✓ And more
• Pressure sensors
• Energy harvesters
• Optical switches
• Fuel cells
47. www.advanced-energy.com
47
60T
1
10,000
~60 Trillion IoT sensors per year deployed in 2035
Only 1 large area MEMS foundry today, yet this
number will increase as dpiX obtains market traction
and competes with 200 mm MEMS foundries
Estimated number of coaters/etchers needed to
manufacturer 60T sensors per year (back of
envelope calculation; needs substantiation)
(Below NOT SHOWN, but STATED)
48. www.advanced-energy.com
MY FINAL ASSERTION (BELOW NOT SHOWN, BUT STATED)
1. Start by making dpiX’s Gen 4.5 MEMS foundry successful by transferring high volume
products as soon as possible to make a competitive impact on 150/200mm MEMS foundries.
2. Next transfer emerging MEMS products from 150/200mm diameter MEMS foundries to Gen 2
MEMS production, which also serves as a learning platform
✓ Remember, there is still quite a bit of equipment and process engineering learning needed for
this transfer to be successful (it is not a slam dunk) and scaling to even larger area Gen X
substrate sizes
✓ It can be done, because engineers love to solve problems!
3. Establish volume production level products and create market tension with 200 mm foundries
4. As volumes increase and price-points require reduction for IoT applications to become
ubiquitous → create more Gen 4+ MEMS production
✓ Keep Gen 2 as pilot line/ low volume production for emerging technologies
5. Don’t be the “quiet company”, make waves by getting out there and doing product and
promotional marketing!
48
49. www.advanced-energy.com
ROBERT G. ANDOSCA, PH.D.
Director, Worldwide Applications Technology
1625 Sharp Point Drive, Fort Collins, CO 80525
+1 (970) 407-6380 office | +1 (970) 829-6107 cell
robert.andosca@aei.com
Precision. Power. Performance.
50. www.advanced-energy.com
ABSTRACT
• Since the 1980’s microelectromechanical systems (“MEMS”) based devices have been manufactured
primarily on round silicon (“Si”) substrates. This has been accomplished by primarily riding the “coattails”
of the semiconductor (“SEMI”) integrated circuit chip industry, where Si substrate diameters have grown
from less than 50 mm to 300 mm. As new larger diameter fabrication equipment was needed the previous
generation tools (refurbished) were adopted by the MEMS industry at much lower price points.
• Today, the SEMI industry has stalled at 300 mm, likewise the MEMS industry is mired at 200 mm diameter.
The issue is that many MEMS chip dimensions can be large, greater than 10 x 10 mm2 in area and can
have expensive wafer-level packaging (“WLP”) utilized to protect its moving parts from inexpensive plastic
molded packaging. When considering the $1 per mm2 ‘rule of thumb’ for unyielded chip production cost,
these “Big MEMS” chips are very difficult to fabricate cost effectively for their accompanying product
market adoption.
• Meanwhile over the last two decades of flat panel display (FPD) technology requirements have continued
to increase in complexity and manufacturing capabilities. This includes increasing FPD resolution from
today’s 4K to 8K and glass substrate size up to 3.1 x 3.1 m2, a.k.a. ‘Gen 10 (G10)’ glass. To achieve these
challenging levels many manufacturing obstacles have had to be overcome, such as magnetron sputtering
over large areas, including deposition thickness uniformity and optical property uniformity, the reduction of
yield detractors, such as particles generated due to plasma arcing, and other process challenges.
• What if the MEMS industry wasn’t restricted in substrate size, such as by utilizing G8 (2.1 x 2.4 m2) or
older (smaller area) fabrication equipment? Then, the chip cost could dramatically decrease.
50
51. www.advanced-energy.com
SPEAKER BIO
Dr. Robert Andosca (www.linkedin.com/in/randosca) is the Director, Worldwide
Applications Technology focusing on plasma-based deposition and etch of thin films
materials for Advanced Energy (www.advancedenergy.com) headquartered in Fort
Collins, CO. He has 25+ years’ experience in the semiconductor,
microelectromechanical systems (MEMS) and photovoltaic industries.
Dr. Andosca's professional experience ranges from C-level to operational to
engineering management and business development, and has been a scientist and
engineer focusing on many thin film based products. Dr. Andosca is the founder and
former CEO of MicroGen Systems Inc. (www.microgensystems.com), has held
senior level positions at the Smart System Technology & Commercialization Center,
Lilliputian Systems, Umicore, Corning IntelliSense, Clare, Lockheed Martin and
Irvine Sensors, and is an adjunct professor in the Rochester Institute of
Technology’s Mechanical Engineering (www.rit.edu/kgcoe/mechanical) Department.
Dr. Andosca completed his Ph.D. from The University of Vermont (www.uvm.edu) in
Materials Science (multi-disciplinary program between EE, ME and Physics). His
dissertation research was on theoretical and experimental studies of piezoelectric
MEMS-based vibration energy harvester devices and sensors. He also holds an
M.S. in Materials Science from UVM, and B.S. degrees in Mathematics and Physics
from Keene State College. He is an author on twelve (12) published scientific
papers, and is an inventor on twenty-five (25) issued US and international patents
and has another eleven (11) pending. Dr. Andosca has been an invited speaker
worldwide on Internet of Things, energy harvesting and various thin film based
product technologies.
51
Robert G. Andosca, Ph.D.
Director
Worldwide Applications Technology
Advanced Energy Inc.