HERMETIC SILICON
PHOTODARLINGTON
L14F1

L14F2

PACKAGE DIMENSIONS
0.230 (5.84)
0.209 (5.31)
0.195 (4.95)
0.178 (4.52)

0.255 (6.47)
0.225 (5.71)

0.030 (0.76)
NOM

0.500 (12.7)
MIN

0.100 (2.54)

SCHEMATIC

0.050 (1.27)

(CONNECTED TO CASE)
COLLECTOR
3

2
1

3

0.038 (0.97)
0.046 (1.16)
0.036 (0.92)

Ø0.020 (0.51) 3X

BASE 2

45°

NOTES:

1
EMITTER

1. Dimensions for all drawings are in inches (mm).
2. Tolerance of ± .010 (.25) on all non-nominal dimensions
unless otherwise specified.

DESCRIPTION
The L14F1/L14F2 are silicon photodarlingtons mounted in a narrow angle, TO-18 package.

FEATURES
• Hermetically sealed package
• Narrow reception angle

 2001 Fairchild Semiconductor Corporation
DS300306
6/01/01

1 OF 4

www.fairchildsemi.com
HERMETIC SILICON
PHOTODARLINGTON
L14F1
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating Temperature
Storage Temperature
Soldering Temperature (Iron)(3,4,5 and 6)
Soldering Temperature (Flow)(3,4 and 6)
Collector to Emitter Breakdown Voltage
Collector to Base Breakdown Voltage
Emitter to Base Breakdwon Voltage
Power Dissipation (TA = 25°C)(1)
Power Dissipation (TC = 25°C)(2)

L14F2

(TA = 25°C unless otherwise specified)
Symbol
TOPR
TSTG
TSOL-I
TSOL-F
VCEO
VCBO
VEBO
PD
PD

Rating
-65 to +125
-65 to +150
240 for 5 sec
260 for 10 sec
25
25
12
300
600

Unit
°C
°C
°C
°C
V
V
V
mW
mW

NOTE:
1. Derate power dissipation linearly 3.00 mW/°C above 25°C ambient.
2. Derate power dissipation linearly 6.00 mW/°C above 25°C case.
3. RMA flux is recommended.
4. Methanol or isopropyl alcohols are recommended as cleaning agents.
5. Soldering iron tip 1/16” (1.6mm) minimum from housing.
6. As long as leads are not under any stress or spring tension.
7. Light source is a GaAs LED emitting light at a peak wavelength of 940 nm.
8. Figure 1 and figure 2 use light source of tungsten lamp at 2870°K color temperature. A GaAs source of 0.05 mW/cm2 is approximately
equivalent to a tungsten source, at 2870°K, of 0.2 mW/cm2.

ELECTRICAL / OPTICAL CHARACTERISTICS
PARAMETER

Collector-Emitter Breakdown
Emitter-Base Breakdown
Collector-Base Breakdown
Collector-Emitter Leakage
Reception Angle at 1/2 Sensitivity
On-State Collector Current L14F1
On-State Collector Current L14F2
Rise Time
Fall Time

www.fairchildsemi.com

(TA =25°C) (All measurements made under pulse conditions)

TEST CONDITIONS

SYMBOL

MIN

IC = 10 mA, Ee = 0
IE = 100 µA, Ee = 0
IC = 100 µA, Ee = 0
VCE = 12 V, Ee = 0

BVCEO
BVEBO
BVCBO
ICEO
θ
IC(ON)
IC(ON)
tr
tf

25
12
25
—

Ee = .125 mW/cm2, VCE = 5 V(7)
Ee = .125 mW/cm2, VCE = 5 V(7)
IC = 10 mA, VCC = 5 V, RL =100 Ω
IC = 10 mA, VCC = 5 V, RL =100 Ω

2 OF 4

TYP

MAX

UNITS

—
—
—
100

V
V
V
nA
Degrees
mA
mA
µs
µs

±8
7.5
2.5

—
300
250

6/01/01

DS300306
HERMETIC SILICON
PHOTODARLINGTON
L14F1

Figure 2. Relative Light Current vs. Ambient Temperature

Figure 1. Light Current vs. Collector to Emitter Voltage
5.0 mW/cm2

IL / IL @25°C, RELATIVE LIGHT CURRENT

IL, NORMALIZED LIGHT CURRENT

100

2.0
1.0

10

.5
.2
1.0

.1
.05

NORMALIZED TO:
VCE = 5 V
Ee = .2 mW/cm2

0.1
0

5

10

15

20

25

30

10
8
6
4
2
1.0
.8
.6
.4
.2
.1
.08
.06
.04

VCE = 5 V
H = .2 mW/cm2

.02
.01
-50

35

-25

0

50

25

75

100

125

T, TEMPERATURE (°C)

VCE , COLLECTOR TO EMITTER VOLTAGE (V)

Figure 3. Spectral Response

Figure 4. Angular Response

1.0

110

0.9

100

0.8

90

0.7

RELATIVE AMPLITUDE

RELATIVE SPECTRAL RESPONSE

L14F2

0.6
0.5
0.4
0.3

80
70
60
50
40
30

0.2

20

0.1

10

0
400

500

600

700

800

900

1000

1100

0
-90°

1200

-70°

-30°

-50°

λ, WAVE LENGTH (NANOMETERS)

10°

-10°

50°

30°

70°

90°

DEGREES

Figure 6. Light Current vs. Relative Switching Speed
100
VCC

OUTPUT
PULSE

INPUT
LED56

10%

LED
td

RL

OUTPUT

tf
tr

ts

IL, LIGHT CURRENT (mA)

90%

L14F

I

LOAD RESISTANCE
10 Ω

1.0 V

100 Ω

10

1000 Ω

1.0

INPUT PULSE
tOFF = ts + tf
tON = td + tr

NORMALIZED TO:
RL = 100 Ω
IL = 10 mA

VCC = 10 V
0.1
0.01

Figure 5. Test Circuit and Voltage Waveforms

0.1

1.0

10

100

RELATIVE SWITCHING SPEED
td + tr + ts + tf

DS300306

6/01/01

3 OF 4

www.fairchildsemi.com
HERMETIC SILICON
PHOTODARLINGTON
L14F1

L14F2

DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF
OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical
implant into the body,or (b) support or sustain life,
and (c) whose failure to perform when properly
used in accordance with instructions for use provided
in labeling, can be reasonably expected to result in a
significant injury of the user.

DS300306

6/01/01

2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.

4 OF 4

www.fairchildsemi.com

L14F1/L14F2 Transistor datasheet

  • 1.
    HERMETIC SILICON PHOTODARLINGTON L14F1 L14F2 PACKAGE DIMENSIONS 0.230(5.84) 0.209 (5.31) 0.195 (4.95) 0.178 (4.52) 0.255 (6.47) 0.225 (5.71) 0.030 (0.76) NOM 0.500 (12.7) MIN 0.100 (2.54) SCHEMATIC 0.050 (1.27) (CONNECTED TO CASE) COLLECTOR 3 2 1 3 0.038 (0.97) 0.046 (1.16) 0.036 (0.92) Ø0.020 (0.51) 3X BASE 2 45° NOTES: 1 EMITTER 1. Dimensions for all drawings are in inches (mm). 2. Tolerance of ± .010 (.25) on all non-nominal dimensions unless otherwise specified. DESCRIPTION The L14F1/L14F2 are silicon photodarlingtons mounted in a narrow angle, TO-18 package. FEATURES • Hermetically sealed package • Narrow reception angle  2001 Fairchild Semiconductor Corporation DS300306 6/01/01 1 OF 4 www.fairchildsemi.com
  • 2.
    HERMETIC SILICON PHOTODARLINGTON L14F1 ABSOLUTE MAXIMUMRATINGS Parameter Operating Temperature Storage Temperature Soldering Temperature (Iron)(3,4,5 and 6) Soldering Temperature (Flow)(3,4 and 6) Collector to Emitter Breakdown Voltage Collector to Base Breakdown Voltage Emitter to Base Breakdwon Voltage Power Dissipation (TA = 25°C)(1) Power Dissipation (TC = 25°C)(2) L14F2 (TA = 25°C unless otherwise specified) Symbol TOPR TSTG TSOL-I TSOL-F VCEO VCBO VEBO PD PD Rating -65 to +125 -65 to +150 240 for 5 sec 260 for 10 sec 25 25 12 300 600 Unit °C °C °C °C V V V mW mW NOTE: 1. Derate power dissipation linearly 3.00 mW/°C above 25°C ambient. 2. Derate power dissipation linearly 6.00 mW/°C above 25°C case. 3. RMA flux is recommended. 4. Methanol or isopropyl alcohols are recommended as cleaning agents. 5. Soldering iron tip 1/16” (1.6mm) minimum from housing. 6. As long as leads are not under any stress or spring tension. 7. Light source is a GaAs LED emitting light at a peak wavelength of 940 nm. 8. Figure 1 and figure 2 use light source of tungsten lamp at 2870°K color temperature. A GaAs source of 0.05 mW/cm2 is approximately equivalent to a tungsten source, at 2870°K, of 0.2 mW/cm2. ELECTRICAL / OPTICAL CHARACTERISTICS PARAMETER Collector-Emitter Breakdown Emitter-Base Breakdown Collector-Base Breakdown Collector-Emitter Leakage Reception Angle at 1/2 Sensitivity On-State Collector Current L14F1 On-State Collector Current L14F2 Rise Time Fall Time www.fairchildsemi.com (TA =25°C) (All measurements made under pulse conditions) TEST CONDITIONS SYMBOL MIN IC = 10 mA, Ee = 0 IE = 100 µA, Ee = 0 IC = 100 µA, Ee = 0 VCE = 12 V, Ee = 0 BVCEO BVEBO BVCBO ICEO θ IC(ON) IC(ON) tr tf 25 12 25 — Ee = .125 mW/cm2, VCE = 5 V(7) Ee = .125 mW/cm2, VCE = 5 V(7) IC = 10 mA, VCC = 5 V, RL =100 Ω IC = 10 mA, VCC = 5 V, RL =100 Ω 2 OF 4 TYP MAX UNITS — — — 100 V V V nA Degrees mA mA µs µs ±8 7.5 2.5 — 300 250 6/01/01 DS300306
  • 3.
    HERMETIC SILICON PHOTODARLINGTON L14F1 Figure 2.Relative Light Current vs. Ambient Temperature Figure 1. Light Current vs. Collector to Emitter Voltage 5.0 mW/cm2 IL / IL @25°C, RELATIVE LIGHT CURRENT IL, NORMALIZED LIGHT CURRENT 100 2.0 1.0 10 .5 .2 1.0 .1 .05 NORMALIZED TO: VCE = 5 V Ee = .2 mW/cm2 0.1 0 5 10 15 20 25 30 10 8 6 4 2 1.0 .8 .6 .4 .2 .1 .08 .06 .04 VCE = 5 V H = .2 mW/cm2 .02 .01 -50 35 -25 0 50 25 75 100 125 T, TEMPERATURE (°C) VCE , COLLECTOR TO EMITTER VOLTAGE (V) Figure 3. Spectral Response Figure 4. Angular Response 1.0 110 0.9 100 0.8 90 0.7 RELATIVE AMPLITUDE RELATIVE SPECTRAL RESPONSE L14F2 0.6 0.5 0.4 0.3 80 70 60 50 40 30 0.2 20 0.1 10 0 400 500 600 700 800 900 1000 1100 0 -90° 1200 -70° -30° -50° λ, WAVE LENGTH (NANOMETERS) 10° -10° 50° 30° 70° 90° DEGREES Figure 6. Light Current vs. Relative Switching Speed 100 VCC OUTPUT PULSE INPUT LED56 10% LED td RL OUTPUT tf tr ts IL, LIGHT CURRENT (mA) 90% L14F I LOAD RESISTANCE 10 Ω 1.0 V 100 Ω 10 1000 Ω 1.0 INPUT PULSE tOFF = ts + tf tON = td + tr NORMALIZED TO: RL = 100 Ω IL = 10 mA VCC = 10 V 0.1 0.01 Figure 5. Test Circuit and Voltage Waveforms 0.1 1.0 10 100 RELATIVE SWITCHING SPEED td + tr + ts + tf DS300306 6/01/01 3 OF 4 www.fairchildsemi.com
  • 4.
    HERMETIC SILICON PHOTODARLINGTON L14F1 L14F2 DISCLAIMER FAIRCHILD SEMICONDUCTORRESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body,or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in labeling, can be reasonably expected to result in a significant injury of the user. DS300306 6/01/01 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 4 OF 4 www.fairchildsemi.com