SPICE MODEL of SCT2080KE (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SCH2080KE (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SCH2080KE (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SCH2080KE (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SCH2080KE (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SCT2080KE (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SCT2080KE (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of CBS10S40 (Professional Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a SiC Schottky Barrier Diode. It includes the diode model parameters, results of circuit simulations to characterize the diode's forward and reverse current characteristics and junction capacitance, and comparisons of the simulation results to measurement data showing good agreement within a few percent error.
This document provides a design report from WEBENCH for a buck-boost converter using the TPS63070RNMR IC. The design converts an input voltage range of 4.5V to 13V to a regulated 5V output at 1.5A. The report includes performance curves, a bill of materials, and design specifications. It recommends using the TPS63070RNMR with 11 components including capacitors, inductors, and resistors to implement the converter design.
2SK4017 (Standard Model) PSpice Model (Free SPICE Model)Tsuyoshi Horigome
This document provides a SPICE model for the TOSHIBA 2SK4017 MOSFET. It includes:
1. Model parameters for the MOSFET and its internal body diode.
2. Simulation results that match measurements of the MOSFET's electrical characteristics like transconductance, drain current, and switching times.
3. Circuit simulations validating the model, including the forward and reverse characteristics of the internal body diode.
High Voltage Isolation Flyback Converter using LTspiceTsuyoshi Horigome
The document describes a high voltage isolation flyback converter circuit using an LT3511 controller chip. It provides specifications for input/output voltages and currents. Simulation waveforms are shown for various circuit nodes and compared to experimental measurements. Components like the transformer and output capacitor are modeled in detail. The simulation verifies the circuit operation and matches experimental results well.
The document describes the design and operation of a boost DC/DC converter circuit using the NJM2377 control IC. Key aspects covered include:
1) The basic operation of a PWM boost converter and equations for determining output voltage, inductor selection, peak currents, and output capacitor selection.
2) The application circuit configuration using the NJM2377 IC, including settings for soft start time, oscillation frequency, and feedback loop parameters.
3) Simulation results verifying the circuit performance in terms of output voltage, ripple, efficiency and response to load changes.
SPICE MODEL of SCH2080KE (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SCH2080KE (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SCH2080KE (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SCH2080KE (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SCT2080KE (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SCT2080KE (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of CBS10S40 (Professional Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a SiC Schottky Barrier Diode. It includes the diode model parameters, results of circuit simulations to characterize the diode's forward and reverse current characteristics and junction capacitance, and comparisons of the simulation results to measurement data showing good agreement within a few percent error.
This document provides a design report from WEBENCH for a buck-boost converter using the TPS63070RNMR IC. The design converts an input voltage range of 4.5V to 13V to a regulated 5V output at 1.5A. The report includes performance curves, a bill of materials, and design specifications. It recommends using the TPS63070RNMR with 11 components including capacitors, inductors, and resistors to implement the converter design.
2SK4017 (Standard Model) PSpice Model (Free SPICE Model)Tsuyoshi Horigome
This document provides a SPICE model for the TOSHIBA 2SK4017 MOSFET. It includes:
1. Model parameters for the MOSFET and its internal body diode.
2. Simulation results that match measurements of the MOSFET's electrical characteristics like transconductance, drain current, and switching times.
3. Circuit simulations validating the model, including the forward and reverse characteristics of the internal body diode.
High Voltage Isolation Flyback Converter using LTspiceTsuyoshi Horigome
The document describes a high voltage isolation flyback converter circuit using an LT3511 controller chip. It provides specifications for input/output voltages and currents. Simulation waveforms are shown for various circuit nodes and compared to experimental measurements. Components like the transformer and output capacitor are modeled in detail. The simulation verifies the circuit operation and matches experimental results well.
The document describes the design and operation of a boost DC/DC converter circuit using the NJM2377 control IC. Key aspects covered include:
1) The basic operation of a PWM boost converter and equations for determining output voltage, inductor selection, peak currents, and output capacitor selection.
2) The application circuit configuration using the NJM2377 IC, including settings for soft start time, oscillation frequency, and feedback loop parameters.
3) Simulation results verifying the circuit performance in terms of output voltage, ripple, efficiency and response to load changes.
Free SPICE Model of 1SR139-400 , TC=25degree in SPICE PARKTsuyoshi Horigome
FREE SPICE MODEL of 1SR139-400 , TC=25degree in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
The document provides a SPICE model and simulation results for an Insulated Gate Bipolar Transistor (IGBT) part number MBN600E45A manufactured by Hitachi. Key characteristics such as transfer, saturation, output, rise/fall times and reverse recovery are modeled and compared to manufacturer data with good agreement within a few percent error. Simulation results are aimed to help designers evaluate this IGBT for switching applications operating at 600A and 2.6kV.
The document provides a SPICE model and simulation results for an Insulated Gate Bipolar Transistor (IGBT) manufactured by Hitachi. Key sections include:
1) A SPICE model for the IGBT part number MBN600E45A.
2) Simulation results showing the transfer characteristic, saturation characteristic, output characteristic and switching times match well with manufacturer measurements.
3) Forward conduction and reverse recovery characteristics also show good agreement between simulation and measurements.
This document provides a summary of semiconductor parts inventory from Spice Park in June 2016. It lists 282 general purpose rectifier diodes from various manufacturers such as Fairchild, Fuji, International Rectifier, Intersil, ROHM, Shindengen, and Toshiba. For each part, the manufacturer, model, thermal characteristics, and date are provided. The majority of the rectifiers are from Fairchild, Intersil, and ROHM.
This document contains a SPICE model for the Cree CSD01060A silicon carbide schottky diode, including:
- A SPICE subcircuit model for the diode.
- Descriptions of the model parameters like saturation current, emission coefficient, and breakdown voltage.
- Simulation results showing the diode's forward and reverse I-V characteristics and junction capacitance, along with comparisons to manufacturer measurements.
The document is an inventory report from Spice Park, a component stockpile, dated January 2018. It contains details of 4,792 electronic parts across various categories such as semiconductors, passive parts, batteries, and mechanical parts. Semiconductors make up 75% of the total parts. The report includes an breakdown of the semiconductor parts with over 400 general purpose diodes from manufacturers like Fairchild, ROHM, and Toshiba. It also notes that 10 additional Schottky rectifier diodes were added in the January 2018 update.
The document provides an update on the Spice Park inventory as of August 2018. It summarizes that the total inventory is 4,873 pieces, with the majority (75%) being semiconductor products. It also provides detailed lists and descriptions of the individual products in each category.
This document provides a summary of simulation results for a MOSFET device model. It includes:
1) A SPICE model for the MTM23223 power MOSFET including parameters for the MOSFET, body diode, and ESD protection diodes.
2) Simulation results graphs for transconductance, Vgs-Id characteristics, Rds(on), gate charge, capacitance characteristics, switching time, output characteristics, and reverse recovery that compare measurements to simulations.
3) Evaluation circuits used in the simulations and tables comparing measurement and simulation results.
The document provides an inventory update of Spice Park in April 2018. It details that the total number of parts in Spice Park as of April 2018 is 4,818 parts, up from 4,792 parts in January 2018. The majority of parts (75%) are semiconductors. The document then lists semiconductor part numbers and manufacturers in the inventory.
This document provides information about semiconductor components in Spice Park's inventory in September 2017. It shows that semiconductors made up 75% of the total inventory of 4,749 pieces. The document includes a breakdown of the 391 diode/general purpose rectifier components in inventory, listing the manufacturer, part number, model, type, thermal rating, and date the information was last updated for each part number.
This document provides an update on the Spice Park inventory as of January 2018. It details that the total number of parts in the Spice Park is 4,792 pieces. The majority are semiconductor parts (75%), with passive parts making up 12% and batteries 10%. It then lists specific parts by category (semiconductors, passive parts, batteries, etc.) with descriptions and quantities. For example, there are 838 Schottky rectifier diodes from various manufacturers such as Cree, Infineon, and Hitachi.
The document is a parts inventory from Spice Park that summarizes semiconductor parts stocked in March 2017. It shows that semiconductors made up 75% of total parts stocked. The first page provides a breakdown of parts categories and quantities. Subsequent pages provide detailed data on specific semiconductor part numbers and manufacturers, including diodes from companies like Fairchild, Fuji, ROHM, and Shindengen.
This document contains a device modeling report for a TLP172A photocoupler made by Toshiba. It includes the SPICE model, equivalent circuit diagram, and simulation results for the forward current, capacitance, off-state current, trigger LED current, and I-V characteristics of the photocoupler, as well as comparisons to measurement data. Switching time characteristics are also provided from a circuit simulation with a 5mA forward current and 20V power supply.
This document provides an inventory update of Spice Park in July 2018. It summarizes that the total number of parts in Spice Park as of July 2018 is 4,850 parts, which is an increase from the April 2018 and January 2018 updates. It also provides a breakdown of the parts by category, showing that semiconductors make up the largest portion at 75%. The rest of the document provides detailed lists and part numbers of general purpose rectifier diodes from various manufacturers.
This document provides an inventory update of Spice Park from August 2018. It contains a breakdown of 4,873 total parts by category. The largest categories are Semiconductor parts at 75% and Passive Parts at 12%. The document also lists details of 430 Diode/General Purpose Rectifier parts under Semiconductor including manufacturer, part number, model, type, and thermal ratings.
This document provides a parts list and specifications for general purpose rectifier diodes. It contains 174 diodes from 12 manufacturers including Fairchild, Fuji, International Rectifier, Intersil, Panasonic, Philips, ROHM, Sanken, Shindengen, Toshiba, and Vishay. For each diode, it lists the part number, manufacturer, model, thermal characteristics, and last update date. The purpose is to catalog general purpose rectifier diodes for the SpicePark parts database.
The document is an inventory report of the Spice Park component library as of January 2018. It contains 4,792 parts across categories like semiconductors, passive parts, batteries, motors and lamps. Semiconductors make up 75% of the total parts and include diodes, transistors, ICs and other devices. The report provides a breakdown of parts by category and manufacturer. It also notes that 10 additional Schottky rectifier diodes were added to the diode sample stock in the January 2018 update.
The document provides design specifications and steps for a critical conduction mode power factor correction (PFC) circuit. It includes an application circuit diagram using a TB6819AFG controller IC along with component values and equations. Time scaling is used to speed up transient simulations in SPICE. Key steps explained are selecting the output voltage and feedback resistors, output capacitor, inductor, input capacitor, auxiliary winding, and circuits for current and zero current detection.
This document provides a summary of parts inventory for Spice Park, including 4,051 total parts. It lists various semiconductors like transistors, diodes, integrated circuits. It also lists passive components like resistors, capacitors, coils. Additionally, it provides a table listing 158 types of MOSFET parts with information on manufacturer, part number, and model. The document appears to be a company's internal inventory report.
This document provides a list of MOSFET devices in the SPICE PARK semiconductor library. It includes 153 MOSFET part numbers from 12 different manufacturers such as Fuji Electric, Hitachi, Infineon, International Rectifier, NEC, Panasonic, SANYO, ROHM, and TOSHIBA. For each part number, it specifies the manufacturer, polarity (P-channel or N-channel), model type, and last update date. The purpose of this document is to catalog the MOSFET devices available in the SPICE PARK circuit simulation library for modeling and simulation.
Free SPICE Model of 1SR139-400 , TC=25degree in SPICE PARKTsuyoshi Horigome
FREE SPICE MODEL of 1SR139-400 , TC=25degree in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
The document provides a SPICE model and simulation results for an Insulated Gate Bipolar Transistor (IGBT) part number MBN600E45A manufactured by Hitachi. Key characteristics such as transfer, saturation, output, rise/fall times and reverse recovery are modeled and compared to manufacturer data with good agreement within a few percent error. Simulation results are aimed to help designers evaluate this IGBT for switching applications operating at 600A and 2.6kV.
The document provides a SPICE model and simulation results for an Insulated Gate Bipolar Transistor (IGBT) manufactured by Hitachi. Key sections include:
1) A SPICE model for the IGBT part number MBN600E45A.
2) Simulation results showing the transfer characteristic, saturation characteristic, output characteristic and switching times match well with manufacturer measurements.
3) Forward conduction and reverse recovery characteristics also show good agreement between simulation and measurements.
This document provides a summary of semiconductor parts inventory from Spice Park in June 2016. It lists 282 general purpose rectifier diodes from various manufacturers such as Fairchild, Fuji, International Rectifier, Intersil, ROHM, Shindengen, and Toshiba. For each part, the manufacturer, model, thermal characteristics, and date are provided. The majority of the rectifiers are from Fairchild, Intersil, and ROHM.
This document contains a SPICE model for the Cree CSD01060A silicon carbide schottky diode, including:
- A SPICE subcircuit model for the diode.
- Descriptions of the model parameters like saturation current, emission coefficient, and breakdown voltage.
- Simulation results showing the diode's forward and reverse I-V characteristics and junction capacitance, along with comparisons to manufacturer measurements.
The document is an inventory report from Spice Park, a component stockpile, dated January 2018. It contains details of 4,792 electronic parts across various categories such as semiconductors, passive parts, batteries, and mechanical parts. Semiconductors make up 75% of the total parts. The report includes an breakdown of the semiconductor parts with over 400 general purpose diodes from manufacturers like Fairchild, ROHM, and Toshiba. It also notes that 10 additional Schottky rectifier diodes were added in the January 2018 update.
The document provides an update on the Spice Park inventory as of August 2018. It summarizes that the total inventory is 4,873 pieces, with the majority (75%) being semiconductor products. It also provides detailed lists and descriptions of the individual products in each category.
This document provides a summary of simulation results for a MOSFET device model. It includes:
1) A SPICE model for the MTM23223 power MOSFET including parameters for the MOSFET, body diode, and ESD protection diodes.
2) Simulation results graphs for transconductance, Vgs-Id characteristics, Rds(on), gate charge, capacitance characteristics, switching time, output characteristics, and reverse recovery that compare measurements to simulations.
3) Evaluation circuits used in the simulations and tables comparing measurement and simulation results.
The document provides an inventory update of Spice Park in April 2018. It details that the total number of parts in Spice Park as of April 2018 is 4,818 parts, up from 4,792 parts in January 2018. The majority of parts (75%) are semiconductors. The document then lists semiconductor part numbers and manufacturers in the inventory.
This document provides information about semiconductor components in Spice Park's inventory in September 2017. It shows that semiconductors made up 75% of the total inventory of 4,749 pieces. The document includes a breakdown of the 391 diode/general purpose rectifier components in inventory, listing the manufacturer, part number, model, type, thermal rating, and date the information was last updated for each part number.
This document provides an update on the Spice Park inventory as of January 2018. It details that the total number of parts in the Spice Park is 4,792 pieces. The majority are semiconductor parts (75%), with passive parts making up 12% and batteries 10%. It then lists specific parts by category (semiconductors, passive parts, batteries, etc.) with descriptions and quantities. For example, there are 838 Schottky rectifier diodes from various manufacturers such as Cree, Infineon, and Hitachi.
The document is a parts inventory from Spice Park that summarizes semiconductor parts stocked in March 2017. It shows that semiconductors made up 75% of total parts stocked. The first page provides a breakdown of parts categories and quantities. Subsequent pages provide detailed data on specific semiconductor part numbers and manufacturers, including diodes from companies like Fairchild, Fuji, ROHM, and Shindengen.
This document contains a device modeling report for a TLP172A photocoupler made by Toshiba. It includes the SPICE model, equivalent circuit diagram, and simulation results for the forward current, capacitance, off-state current, trigger LED current, and I-V characteristics of the photocoupler, as well as comparisons to measurement data. Switching time characteristics are also provided from a circuit simulation with a 5mA forward current and 20V power supply.
This document provides an inventory update of Spice Park in July 2018. It summarizes that the total number of parts in Spice Park as of July 2018 is 4,850 parts, which is an increase from the April 2018 and January 2018 updates. It also provides a breakdown of the parts by category, showing that semiconductors make up the largest portion at 75%. The rest of the document provides detailed lists and part numbers of general purpose rectifier diodes from various manufacturers.
This document provides an inventory update of Spice Park from August 2018. It contains a breakdown of 4,873 total parts by category. The largest categories are Semiconductor parts at 75% and Passive Parts at 12%. The document also lists details of 430 Diode/General Purpose Rectifier parts under Semiconductor including manufacturer, part number, model, type, and thermal ratings.
This document provides a parts list and specifications for general purpose rectifier diodes. It contains 174 diodes from 12 manufacturers including Fairchild, Fuji, International Rectifier, Intersil, Panasonic, Philips, ROHM, Sanken, Shindengen, Toshiba, and Vishay. For each diode, it lists the part number, manufacturer, model, thermal characteristics, and last update date. The purpose is to catalog general purpose rectifier diodes for the SpicePark parts database.
The document is an inventory report of the Spice Park component library as of January 2018. It contains 4,792 parts across categories like semiconductors, passive parts, batteries, motors and lamps. Semiconductors make up 75% of the total parts and include diodes, transistors, ICs and other devices. The report provides a breakdown of parts by category and manufacturer. It also notes that 10 additional Schottky rectifier diodes were added to the diode sample stock in the January 2018 update.
The document provides design specifications and steps for a critical conduction mode power factor correction (PFC) circuit. It includes an application circuit diagram using a TB6819AFG controller IC along with component values and equations. Time scaling is used to speed up transient simulations in SPICE. Key steps explained are selecting the output voltage and feedback resistors, output capacitor, inductor, input capacitor, auxiliary winding, and circuits for current and zero current detection.
This document provides a summary of parts inventory for Spice Park, including 4,051 total parts. It lists various semiconductors like transistors, diodes, integrated circuits. It also lists passive components like resistors, capacitors, coils. Additionally, it provides a table listing 158 types of MOSFET parts with information on manufacturer, part number, and model. The document appears to be a company's internal inventory report.
This document provides a list of MOSFET devices in the SPICE PARK semiconductor library. It includes 153 MOSFET part numbers from 12 different manufacturers such as Fuji Electric, Hitachi, Infineon, International Rectifier, NEC, Panasonic, SANYO, ROHM, and TOSHIBA. For each part number, it specifies the manufacturer, polarity (P-channel or N-channel), model type, and last update date. The purpose of this document is to catalog the MOSFET devices available in the SPICE PARK circuit simulation library for modeling and simulation.
This document lists 5 part numbers for components that will be updated in the SPICE PARK in November 2013, including TPCA8057-H, TPCA8055-H, TPCA8058-H, TPCA8065-H, and TPCP8R01, manufactured by TOSHIBA.
The document compares the performance of a MOSFET model in PSpice and LTspice simulation software. It includes circuits and characteristic graphs for the MOSFET's ID-VGS, output, Rds(on), switching time, and gate charge characteristics. The summaries show the characteristics are similar between the two simulations, but PSpice provides more accurate results.
The document provides instructions for creating a MOSFET symbol model in LTSpice. It involves drawing the symbol graphics, adding pin attributes, editing symbol attributes to reference the subcircuit name, saving the symbol file, and copying it to the LTSpice symbol and subcircuit libraries. The steps are: 1) draw the symbol graphics and add pins; 2) edit the symbol attributes to reference the subcircuit name; 3) add additional attributes like instname and spicemodel; 4) save and copy the symbol file to the LTSpice libraries.
SPICE MODEL of TPCP8204 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary report of the modeling and simulation of a MOSFET transistor. It includes the manufacturer and part number details, as well as the results of simulations and comparisons to measurements for key transistor characteristics like transconductance, drain current, gate charge, switching time, and reverse recovery time. Circuit simulations were performed to model the electrical behavior and validate the model against real-world transistor measurements.
SPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary report of the modeling and simulation of a MOSFET transistor. It includes the manufacturer and part number details, as well as the results of simulations characterizing the transistor's electrical properties and performance metrics like drain current, transconductance, switching time, and reverse recovery. The simulations are compared to measurement data and most show good agreement within a few percent error.
SPICE MODEL of 2SK4207 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4207 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8064-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8064-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8204 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8204 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK12A60U (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK12A60U (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K318T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for the SSM3K318T MOSFET manufactured by Toshiba. It includes summaries of simulations and measurements of the MOSFET's electrical characteristics such as transconductance, output characteristics, switching times, and reverse recovery characteristics. Model parameters are also provided for the MOSFET and its internal body diode in the PSpice model. Circuit simulations are shown to match measurements within a few percent error.
SPICE MODEL of TPCC8105 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCC8105 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK65L60V (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK65L60V (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK8A50D (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK8A50D (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK65E10N1 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a 14-page report on modeling and simulation parameters for a Toshiba MOSFET transistor (TK65E10N1). It includes:
- MOSFET model parameters for the PSpice simulation.
- Simulation results and comparisons to measurements for various transistor characteristics like transconductance, output characteristics, capacitance, gate charge, switching times and reverse recovery.
- Circuit schematics used to simulate and evaluate the transistor parameters.
- Tables and graphs comparing simulation results to manufacturer measurements with good agreement within a few percent error.
SPICE MODEL of SSM6N24TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6N24TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8305 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8305 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8305 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8305 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK65L60V (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary of simulation results and measurements for the characteristics of a Toshiba TK65L60V MOSFET and its associated body diode. It includes simulation and measurement data for parameters such as transconductance, threshold voltage, on-resistance, switching time, gate charge, forward current, and reverse recovery characteristics. The simulations show good agreement with measurements, with most values matching to within 1% error.
SPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8205-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
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Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Tsuyoshi Horigome
This document provides an inventory update of 6,747 parts at Spice Park as of April 2024. It lists the part numbers, manufacturers, and quantities of various semiconductor components, including 1,697 Schottky rectifier diodes from 29 different manufacturers. It also includes details on passive components, batteries, mechanical parts, motors, and lamps in the inventory.
The document provides an inventory update from April 2024 of the Spice Park collection which contains 6,747 electronic components. It includes tables listing the types of semiconductor components, passive parts, batteries, mechanical parts, motors, and lamps in the collection along with their manufacturer and quantities. One of the semiconductor components, the general purpose rectifier diode, is broken down into a more detailed table with 116 entries providing part numbers, manufacturers, thermal ratings, and remarks.
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Tsuyoshi Horigome
The document provides an inventory update from March 2024 of parts in the Spice Park warehouse. It lists 6,725 total parts across various categories including semiconductors, passive parts, batteries, mechanical parts, motors, and lamps. The semiconductor section lists 652 general purpose rectifier diodes from 18 different manufacturers with quantities ranging from 2 to 145 pieces.
This document provides an inventory list of parts at Spice Park as of March 2024. It contains 3 sections - Semiconductor parts (diodes, transistors, ICs etc.), Passive parts (capacitors, resistors etc.), and Battery parts. For Semiconductor parts, it lists 36 different part types and provides the quantity of each part. It then provides further details of Diode/General Purpose Rectifiers, listing the manufacturer and quantity of 652 individual part numbers.
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Tsuyoshi Horigome
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 total pieces of electronic components and parts. It lists 36 categories of semiconductor devices, 11 categories of passive parts, 10 types of batteries, 5 mechanical parts, DC motors, lamps, and power supplies. It provides the most detailed listing for solar cells, with 1,003 total pieces from 51 manufacturers listed with part numbers.
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 electronic components. It lists the components by type (e.g. semiconductor), part number, manufacturer, thermal rating, and quantity on hand. For example, it shows that there are 621 general purpose rectifier diodes from manufacturers such as Fairchild, Fuji, Intersil, Rohm, Shindengen, and Toshiba. The detailed four-page section provides further information on the first item, general purpose rectifier diodes, including 152 individual part numbers and specifications.
This document discusses circuit simulations using LTspice. It describes driving a circuit simulation by inserting a 250 ohm resistor between the output terminals. It also describes simulating a 1 channel bridge circuit where the DUT1 and DUT2 resistors are both set to 100 ohms and the input voltage is set to either 1V or 5V.
This document discusses parametric sweeps of external and internal resistance values Rg for circuit simulation in LTspice. It also references outputting a waveform similar to a report on fall time characteristics for a device modeling report with customer Samsung.
TrustArc Webinar - 2024 Global Privacy SurveyTrustArc
How does your privacy program stack up against your peers? What challenges are privacy teams tackling and prioritizing in 2024?
In the fifth annual Global Privacy Benchmarks Survey, we asked over 1,800 global privacy professionals and business executives to share their perspectives on the current state of privacy inside and outside of their organizations. This year’s report focused on emerging areas of importance for privacy and compliance professionals, including considerations and implications of Artificial Intelligence (AI) technologies, building brand trust, and different approaches for achieving higher privacy competence scores.
See how organizational priorities and strategic approaches to data security and privacy are evolving around the globe.
This webinar will review:
- The top 10 privacy insights from the fifth annual Global Privacy Benchmarks Survey
- The top challenges for privacy leaders, practitioners, and organizations in 2024
- Key themes to consider in developing and maintaining your privacy program
HCL Notes and Domino License Cost Reduction in the World of DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-and-domino-license-cost-reduction-in-the-world-of-dlau/
The introduction of DLAU and the CCB & CCX licensing model caused quite a stir in the HCL community. As a Notes and Domino customer, you may have faced challenges with unexpected user counts and license costs. You probably have questions on how this new licensing approach works and how to benefit from it. Most importantly, you likely have budget constraints and want to save money where possible. Don’t worry, we can help with all of this!
We’ll show you how to fix common misconfigurations that cause higher-than-expected user counts, and how to identify accounts which you can deactivate to save money. There are also frequent patterns that can cause unnecessary cost, like using a person document instead of a mail-in for shared mailboxes. We’ll provide examples and solutions for those as well. And naturally we’ll explain the new licensing model.
Join HCL Ambassador Marc Thomas in this webinar with a special guest appearance from Franz Walder. It will give you the tools and know-how to stay on top of what is going on with Domino licensing. You will be able lower your cost through an optimized configuration and keep it low going forward.
These topics will be covered
- Reducing license cost by finding and fixing misconfigurations and superfluous accounts
- How do CCB and CCX licenses really work?
- Understanding the DLAU tool and how to best utilize it
- Tips for common problem areas, like team mailboxes, functional/test users, etc
- Practical examples and best practices to implement right away
Main news related to the CCS TSI 2023 (2023/1695)Jakub Marek
An English 🇬🇧 translation of a presentation to the speech I gave about the main changes brought by CCS TSI 2023 at the biggest Czech conference on Communications and signalling systems on Railways, which was held in Clarion Hotel Olomouc from 7th to 9th November 2023 (konferenceszt.cz). Attended by around 500 participants and 200 on-line followers.
The original Czech 🇨🇿 version of the presentation can be found here: https://www.slideshare.net/slideshow/hlavni-novinky-souvisejici-s-ccs-tsi-2023-2023-1695/269688092 .
The videorecording (in Czech) from the presentation is available here: https://youtu.be/WzjJWm4IyPk?si=SImb06tuXGb30BEH .
How to Interpret Trends in the Kalyan Rajdhani Mix Chart.pdfChart Kalyan
A Mix Chart displays historical data of numbers in a graphical or tabular form. The Kalyan Rajdhani Mix Chart specifically shows the results of a sequence of numbers over different periods.
Let's Integrate MuleSoft RPA, COMPOSER, APM with AWS IDP along with Slackshyamraj55
Discover the seamless integration of RPA (Robotic Process Automation), COMPOSER, and APM with AWS IDP enhanced with Slack notifications. Explore how these technologies converge to streamline workflows, optimize performance, and ensure secure access, all while leveraging the power of AWS IDP and real-time communication via Slack notifications.
Building Production Ready Search Pipelines with Spark and MilvusZilliz
Spark is the widely used ETL tool for processing, indexing and ingesting data to serving stack for search. Milvus is the production-ready open-source vector database. In this talk we will show how to use Spark to process unstructured data to extract vector representations, and push the vectors to Milvus vector database for search serving.
Your One-Stop Shop for Python Success: Top 10 US Python Development Providersakankshawande
Simplify your search for a reliable Python development partner! This list presents the top 10 trusted US providers offering comprehensive Python development services, ensuring your project's success from conception to completion.
Project Management Semester Long Project - Acuityjpupo2018
Acuity is an innovative learning app designed to transform the way you engage with knowledge. Powered by AI technology, Acuity takes complex topics and distills them into concise, interactive summaries that are easy to read & understand. Whether you're exploring the depths of quantum mechanics or seeking insight into historical events, Acuity provides the key information you need without the burden of lengthy texts.
Best 20 SEO Techniques To Improve Website Visibility In SERPPixlogix Infotech
Boost your website's visibility with proven SEO techniques! Our latest blog dives into essential strategies to enhance your online presence, increase traffic, and rank higher on search engines. From keyword optimization to quality content creation, learn how to make your site stand out in the crowded digital landscape. Discover actionable tips and expert insights to elevate your SEO game.
HCL Notes und Domino Lizenzkostenreduzierung in der Welt von DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-und-domino-lizenzkostenreduzierung-in-der-welt-von-dlau/
DLAU und die Lizenzen nach dem CCB- und CCX-Modell sind für viele in der HCL-Community seit letztem Jahr ein heißes Thema. Als Notes- oder Domino-Kunde haben Sie vielleicht mit unerwartet hohen Benutzerzahlen und Lizenzgebühren zu kämpfen. Sie fragen sich vielleicht, wie diese neue Art der Lizenzierung funktioniert und welchen Nutzen sie Ihnen bringt. Vor allem wollen Sie sicherlich Ihr Budget einhalten und Kosten sparen, wo immer möglich. Das verstehen wir und wir möchten Ihnen dabei helfen!
Wir erklären Ihnen, wie Sie häufige Konfigurationsprobleme lösen können, die dazu führen können, dass mehr Benutzer gezählt werden als nötig, und wie Sie überflüssige oder ungenutzte Konten identifizieren und entfernen können, um Geld zu sparen. Es gibt auch einige Ansätze, die zu unnötigen Ausgaben führen können, z. B. wenn ein Personendokument anstelle eines Mail-Ins für geteilte Mailboxen verwendet wird. Wir zeigen Ihnen solche Fälle und deren Lösungen. Und natürlich erklären wir Ihnen das neue Lizenzmodell.
Nehmen Sie an diesem Webinar teil, bei dem HCL-Ambassador Marc Thomas und Gastredner Franz Walder Ihnen diese neue Welt näherbringen. Es vermittelt Ihnen die Tools und das Know-how, um den Überblick zu bewahren. Sie werden in der Lage sein, Ihre Kosten durch eine optimierte Domino-Konfiguration zu reduzieren und auch in Zukunft gering zu halten.
Diese Themen werden behandelt
- Reduzierung der Lizenzkosten durch Auffinden und Beheben von Fehlkonfigurationen und überflüssigen Konten
- Wie funktionieren CCB- und CCX-Lizenzen wirklich?
- Verstehen des DLAU-Tools und wie man es am besten nutzt
- Tipps für häufige Problembereiche, wie z. B. Team-Postfächer, Funktions-/Testbenutzer usw.
- Praxisbeispiele und Best Practices zum sofortigen Umsetzen
Driving Business Innovation: Latest Generative AI Advancements & Success StorySafe Software
Are you ready to revolutionize how you handle data? Join us for a webinar where we’ll bring you up to speed with the latest advancements in Generative AI technology and discover how leveraging FME with tools from giants like Google Gemini, Amazon, and Microsoft OpenAI can supercharge your workflow efficiency.
During the hour, we’ll take you through:
Guest Speaker Segment with Hannah Barrington: Dive into the world of dynamic real estate marketing with Hannah, the Marketing Manager at Workspace Group. Hear firsthand how their team generates engaging descriptions for thousands of office units by integrating diverse data sources—from PDF floorplans to web pages—using FME transformers, like OpenAIVisionConnector and AnthropicVisionConnector. This use case will show you how GenAI can streamline content creation for marketing across the board.
Ollama Use Case: Learn how Scenario Specialist Dmitri Bagh has utilized Ollama within FME to input data, create custom models, and enhance security protocols. This segment will include demos to illustrate the full capabilities of FME in AI-driven processes.
Custom AI Models: Discover how to leverage FME to build personalized AI models using your data. Whether it’s populating a model with local data for added security or integrating public AI tools, find out how FME facilitates a versatile and secure approach to AI.
We’ll wrap up with a live Q&A session where you can engage with our experts on your specific use cases, and learn more about optimizing your data workflows with AI.
This webinar is ideal for professionals seeking to harness the power of AI within their data management systems while ensuring high levels of customization and security. Whether you're a novice or an expert, gain actionable insights and strategies to elevate your data processes. Join us to see how FME and AI can revolutionize how you work with data!