This is a summary of the newest PCB cleanliness and residue measuring requirements as part of the IPC J-STD-001H. More on this standard including training at solder.net
X Ray inspection of Plated Throughhole Devices Using X-RayBob Wettermann
X-ray inspection can be used to determine and confirm hole fill which is a non-inspectable criteria for PTH devices. Industry standards are reviewed as well as sample x-ray images are provided. Call solder.net for more assistance.
This slide deck takes you through important elements of manula PCB inspection including some definitions, what makes a good inspector , what type of lighting is required to be able to see the important aspects of a PCB and the types of inspection aids. The slide deck ends with some real examples where the user is challenged to make a determination of defect/process indicator/acceptable of an electronics assembly in accordance with the IPC-A-610 and IPC-A-620 standards.
This is one slide set in a multi part series on the BGA rework process. In this section the BGA cleaning and inspection process is explained. Get more information on www.solder.net or to see or multitude of soldering process videos.
Conformal coating is applied to PCBs to protect against temperature, moisture and chemicals. This presentation was developed as a webinar to inform users of the options for spray, brush and dip coating. The methods are outlines and the best alternatives given for masking and de-masking for conformal coating of PCBs.
Presentation regarding the standards Independent Electronic Component Distributors should utilize to mitigate risk and financial exposure of there primes and subs.
X Ray inspection of Plated Throughhole Devices Using X-RayBob Wettermann
X-ray inspection can be used to determine and confirm hole fill which is a non-inspectable criteria for PTH devices. Industry standards are reviewed as well as sample x-ray images are provided. Call solder.net for more assistance.
This slide deck takes you through important elements of manula PCB inspection including some definitions, what makes a good inspector , what type of lighting is required to be able to see the important aspects of a PCB and the types of inspection aids. The slide deck ends with some real examples where the user is challenged to make a determination of defect/process indicator/acceptable of an electronics assembly in accordance with the IPC-A-610 and IPC-A-620 standards.
This is one slide set in a multi part series on the BGA rework process. In this section the BGA cleaning and inspection process is explained. Get more information on www.solder.net or to see or multitude of soldering process videos.
Conformal coating is applied to PCBs to protect against temperature, moisture and chemicals. This presentation was developed as a webinar to inform users of the options for spray, brush and dip coating. The methods are outlines and the best alternatives given for masking and de-masking for conformal coating of PCBs.
Presentation regarding the standards Independent Electronic Component Distributors should utilize to mitigate risk and financial exposure of there primes and subs.
Selection and Economics for Test Fixtures and Test InterconnectGreg Crouch
PXI-based automated test systems require well-engineered product interconnectivity and fixturing to the device under test to ensure signal integrity and tester longevity. Explore methods and trade-offs in the engineering, selection, and fabrication of the device interface connectivity required for today's complex electronics.
Are you IEC61439 ready?
Compliance with the new standard will be compulsory once this standard supersede AS/NZS 3439 series. All assemblies must be shown to meet minimum safety and performance standards by design and routine verification. Many of the alternatives to type testing rely on interpolation from a tested reference design.
Our new edition of the Newsletter "Market Insights by CORIAL" is now available!
Download your copy and read about plasma technology and applications for the Failure Analysis sector
How to find defects in SMT electronics manufacturingBill Cardoso
This presentation covers several examples of defects found in today's SMT electronics manufacturing lines. Learn how x-rays can be used to find these defects, and most importantly, diagnose your manufacturing line.
All x-ray images taken with TruView X-Ray Inspection systems.
- Where Are Defects Introduced in the SMT production line?
- Solder Paste Application Defects
- Component Placement Defects
- Reflow Oven Defects
- Statistical Process Control
Statistical Process Control for SMT Electronic ManufacturingBill Cardoso
Statistical Process Control (SPC) is a statistical method to control and monitor the quality of a production line. In this presentation we cover the detailed development of a SPC program, from selecting the appropriate metrics for a manufacturing process to collecting data to analysing the data. Examples are used to show the power of SPC in diagnosing quality problems with SMT manufacturing lines. The early detection of problems is critical to the success of any manufacturing line.
Transcat + Emerson Webinar: Maximize Safety and Reliability with the Only Wir...Transcat
Join us as Transcat and Kevin Thomas, Emerson's Level Instrumentation Expert, host this informative webinar. In this webinar you will learn about: overfill prevention, how to be alerted to issues such as coating or corrosion, how to monitor and control using the 2140 series Level Detectors, and how to detect sand & sediment with these level detectors.
Shop Rosemount Products: http://www.transcat.com/brand/rosemount?cat=3
Selection and Economics for Test Fixtures and Test InterconnectGreg Crouch
PXI-based automated test systems require well-engineered product interconnectivity and fixturing to the device under test to ensure signal integrity and tester longevity. Explore methods and trade-offs in the engineering, selection, and fabrication of the device interface connectivity required for today's complex electronics.
Are you IEC61439 ready?
Compliance with the new standard will be compulsory once this standard supersede AS/NZS 3439 series. All assemblies must be shown to meet minimum safety and performance standards by design and routine verification. Many of the alternatives to type testing rely on interpolation from a tested reference design.
Our new edition of the Newsletter "Market Insights by CORIAL" is now available!
Download your copy and read about plasma technology and applications for the Failure Analysis sector
How to find defects in SMT electronics manufacturingBill Cardoso
This presentation covers several examples of defects found in today's SMT electronics manufacturing lines. Learn how x-rays can be used to find these defects, and most importantly, diagnose your manufacturing line.
All x-ray images taken with TruView X-Ray Inspection systems.
- Where Are Defects Introduced in the SMT production line?
- Solder Paste Application Defects
- Component Placement Defects
- Reflow Oven Defects
- Statistical Process Control
Statistical Process Control for SMT Electronic ManufacturingBill Cardoso
Statistical Process Control (SPC) is a statistical method to control and monitor the quality of a production line. In this presentation we cover the detailed development of a SPC program, from selecting the appropriate metrics for a manufacturing process to collecting data to analysing the data. Examples are used to show the power of SPC in diagnosing quality problems with SMT manufacturing lines. The early detection of problems is critical to the success of any manufacturing line.
Transcat + Emerson Webinar: Maximize Safety and Reliability with the Only Wir...Transcat
Join us as Transcat and Kevin Thomas, Emerson's Level Instrumentation Expert, host this informative webinar. In this webinar you will learn about: overfill prevention, how to be alerted to issues such as coating or corrosion, how to monitor and control using the 2140 series Level Detectors, and how to detect sand & sediment with these level detectors.
Shop Rosemount Products: http://www.transcat.com/brand/rosemount?cat=3
Whitepaper Series Part 1 - Underwater ConnectivityNorthwireCable
Gain a comprehensive solution for underwater systems by leveraging LEMO’s best-in- class connectors alongside cable components and contract manufacturing services by Northwire.
Lithium Ion Abuse Test Methods Improvement [Presentation Slides] TÜV SÜD America
At the 2012 IEEE Symposium on Product Compliance Engineering (IEEE PSES) on Nov. 5th 2012 in Portland, Oregon, TÜV SÜD America's Erik J Spek, presented on "Lithium Ion Abuse Test Methods Improvement."
Tools and Techniques for Commissioning and Maintaining PV SystemsTranscat
This course will review the tests to perform, the science behind why they are necessary, and the appropriate tools to conduct them, including digital multimeters, clamp meters, thermal imaging, insulation resistance, I-V curve tracers, irradiance meters, power quality, and solar asset management software.
High-Speed Remote-Field Testing in Carbon Steel TubingEddyfi
Carbon steel tubing is present in all industries. The comparative high strength, crack resistance, and low cost of carbon steel tubing makes it the most prevalent type of pipe and tubing material worldwide.
Read more at www.eddyfi.com
IPC A-620 Training for Specialist (CIS) course is designed to improve individual discrimination skills between an acceptable or not acceptable cable or wire harness assembly per the IPC/WHMA-A-620 document. This slide set is a high-level overview of the IPC-A-620 wire and cable harness acceptability certification and training program. It is designed to give you a high-level overview of this acceptability of wire harnesses.
This slide deck goes through a variety of PCB depanelization options. After discussing the options and their positive and negative attributes, the material focuses on laser depanelization. Also, BEST Inc provides laser depaneling services for printed circuit board manufacturers as well as EMS and OEMs.
This is a compilation of the biggest challenges users are facing during BGA component rework as well as various options for solutions. The top five challenges are BGA warping, neighboring device damage, mask damage, pad damage and underfill rework are illuminated in this presentation.
J-STD-001, IPC A-610 F to G Differences WebinarBob Wettermann
BEST presented on the recent updates to IPC-A-610 and IPC J-STD-001. This slide deck was put together by the BEST staff and present as the differences between "F" and "G" webinar series.
BEST Inc. a training and consulting provider for electronics assembly services, presents a RoHS2 update including the institution of CE marking, certificates of conformance and materials file and materials declaration
This deck discusses how and when it is appropriate to use Kapton(TM) stencils for PCB prototyping. It also discusses the advantages of Kapton vs Mylar.
What is the IPC-JSTD-001 Certification ProgramBob Wettermann
This slide set is a high level overview of the IPC J-STD-001 certification and training program. It is designed to give you a high level overview of this soldering and PCB assembly specification certification training program.
This is one slide set in a multi-part series on the BGA placement process. In this section, the BGA reflow process is explained. Get more information on www.solder.net or to see or a multitude of soldering process videos.
This is one slide set in a multi part series on the BGA rework process. In this section the BGA site dressing process is explained. Get more information on www.solder.net or to see or multitude of soldering process videos.
This is one slide set in a multi part series on the BGA rework process. In this section the BGA reflow process is explained. Get more information on www.solder.net or to see or multitude of soldering process videos.
This slide set goes through the challenges of PoP rework. In addition the (2) main strategies for stacking these packages and placing them on to a PCB are depicted.
This presentation covers the top issues dealing with the rework of advanced electronic packages. The material supports QFN rework as well as BGA rework challenges.
This presentation is a high level review of methods for stacking various area array packages together. Included in this discussion are "how tos" related to POP assembly and rework. In addition actual photos of devices processed are shown for POP rework.
This slide show is an overview of several techniques used to rework QFNs. Included is paste printing of the PCB and "bumping" of the component prior to placement of the QFN.
The BGA reballing process is explained in this slide set. The need for reballing is explained as well as the diifferent methods of reballing as a function of the number of devicss to be reballed and the type of BGA package being reballed.A brief description of the reballing process as well as some of the inspection tools is also discussed.If BGA reballing services are required then contact information for BGA reballing is on the last slide.
Welcome to WIPAC Monthly the magazine brought to you by the LinkedIn Group Water Industry Process Automation & Control.
In this month's edition, along with this month's industry news to celebrate the 13 years since the group was created we have articles including
A case study of the used of Advanced Process Control at the Wastewater Treatment works at Lleida in Spain
A look back on an article on smart wastewater networks in order to see how the industry has measured up in the interim around the adoption of Digital Transformation in the Water Industry.
Overview of the fundamental roles in Hydropower generation and the components involved in wider Electrical Engineering.
This paper presents the design and construction of hydroelectric dams from the hydrologist’s survey of the valley before construction, all aspects and involved disciplines, fluid dynamics, structural engineering, generation and mains frequency regulation to the very transmission of power through the network in the United Kingdom.
Author: Robbie Edward Sayers
Collaborators and co editors: Charlie Sims and Connor Healey.
(C) 2024 Robbie E. Sayers
We have compiled the most important slides from each speaker's presentation. This year’s compilation, available for free, captures the key insights and contributions shared during the DfMAy 2024 conference.
6th International Conference on Machine Learning & Applications (CMLA 2024)ClaraZara1
6th International Conference on Machine Learning & Applications (CMLA 2024) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of on Machine Learning & Applications.
Saudi Arabia stands as a titan in the global energy landscape, renowned for its abundant oil and gas resources. It's the largest exporter of petroleum and holds some of the world's most significant reserves. Let's delve into the top 10 oil and gas projects shaping Saudi Arabia's energy future in 2024.
2. Hts of component
Background
How did we get here?
• J-STD-001 revisions F and lower based on ROSE testing
• ROSE testing was initially developed as a process monitoring tool for
entire process and assembly
• ROSE testing developed when component spacing and standoff
heights of components were much greater
• Processes when the standard was developed had a much wider
window-rosin-based fluxes, CFC-based cleaners
• ROSE testing developed in 1970’s now considered an obsolete
practice
3. Hts of component
Background
How did we get here?
• Data generated by Navy established 1.56 ug NaCl eq/cm as the
pass/fail criteria
• Now PCBs in harsh environments such as mining, space, human body
functional monitoring
4. BEST Specialized Electronics Services
Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools
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• Standoff height were soils can hide are now 2-3 mils
• Spacing between components now as small as 3-4 mils
• Fluxes less aggressive-”no cleans” in style
• More critical to get boards clean that are going in harsh
environment-like space , oil wells and underneath vehicles
Where we are At Today
www.soldertools.net
5. BEST Specialized Electronics Services
Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools
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• Tanks are contaminated
• It can tell if saponifier mixture ratios are incorrectly mixed
• It can indicate that a reflow profile has run amuck-more chemical
species which have not been activated from fluxes
ROSE testing can be used for process monitoring
www.soldertools.net
ROSE can answer the question-What Changed?
6. BEST Specialized Electronics Services
Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools
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• Outlined in Section 8-Cleanliness Testing Specification of J-STD-001
• IPC White Paper 019A is companion document where a lot of process
questions answered-How do I do this?
NEW Standard for Cleanliness Testing Developed
www.soldertools.net
7. BEST Specialized Electronics Services
Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools
www.solder.net
• J-STD-001H-if no overwhelming electrical failures due to
electrochemical interaction of residues on PCBs-then can continue
process monitoring using the ROSE testing as a go/no-go gauge
• No issues with dendritic growth or electromigration under
temperature or bias in operating conditions then continue to use
ROSE testing
“If It Ain’t Broke Don’t Fix It”
www.soldertools.net
8. BEST Specialized Electronics Services
Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools
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• Have to have “objective evidence” that chemical species on the
board due not impact the reliability of the electronics assembly
based on data
• Data can be generated through SIR testing, ionic cleanliness testing
or other functional testing as agreed to by the user and the
manufacturer
What About a New Material Set?
www.soldertools.net
9. BEST Specialized Electronics Services
Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools
www.solder.net
• Flux is changed
• Cleaning agents or cleaning agent mix ratios changed
• Changes in cleaning or flux suppliers
• Changes in soldering material
• Changes in board metallization
• Changes in solder mask
• Geographic change in manufacturing locations
When Will a New Requalification of the Process Need t Happen?
www.soldertools.net
10. BEST Specialized Electronics Services
Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools
www.solder.net
• Changes in assembly location
• Changes in cleaning parameters (e.g. belt speed, pressure of
cleaning jets)
• Changes in reflow profiles established in the process qualification
When will a lower level –i.e.“objective evidence” – be required?
www.soldertools.net
11. BEST Specialized Electronics Services
Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools
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• Objective evidence-proof that the cleaning process removes all
harmful “soils” that can impact the reliability negatively
• These soils, under device operating conditions-usually temperature
and humidity will not migrate to a point where their electromigration
will cause harmful effects
When will a lower level –i.e. “objective evidence” – be required
www.soldertools.net
12. Ce bias cond
Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools
www.solder.net
• Ionic cleanliness testing is just a chemical test
• Have to be able to relate this chemical measurement to a biased
level of performance her the species “migrate/move” and cause
harmful electrical effects for the given assembly
• SIR or other reliability testing of the circuit under the biased conditions
When will a lower level –i.e. “objective evidence” – be required
www.soldertools.net
13. Ce bias cond
BEST Specialized Electronics Services
Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools
www.solder.net
• ROSE testing for qualification an obsolete practice
• Have to determine a cleanliness level where residues on the board left behind
due not under bias with temp and humidity conditions cause the board to fail
• ROSE testing is a gross overall number and NOT a determiner of “clean” vs
“dirty”
• There is no single cleanliness “number” good for every assembly
• Have to determine the level of residues which could undermine the board’s
function under real operating conditions-testing is required! (MIL, AUTO, MED,..)
Final Points
www.soldertools.net