This document provides an overview of Dynamic & Proto Circuits Inc.'s facilities and manufacturing capabilities. It summarizes their 54,000 square foot facility, multilayer PCB process, equipment including strip-etch-strip lines, automated optical inspection, drilling machines, via plugging machines, soldermask coaters, HASL machines, IST testers, and lists their substrate and high frequency materials. It also lists their North American top tier customers and encourages the reader to have DAPC work on their projects.

1. 1
Dynamic & Proto Circuits Inc.
Corporate
Presentation

2. 2
DAPC Facility
54,000 Sq.ft./6,000 Sq.M

3. 3
Multilayer Process

4. 4
Solder Mask Options
BLUE
BLACK
GREENRED
CLEAR
DRY FILM

5. 5
Investing in Technology
New equipment to optimize our
production and delivery
capabilities

6. 6
SES Line
The spray system on the
Strip-Etch-Strip line offers a
high etching quality with high
etching factor and the nozzle
control system ensures uniform
etching patterns without
"puddle effects".
The transport system is flexible
to allow for all PCB thicknesses
from 2 to 250 mils. Chemistry is
automatically maintained at
optimum performance levels.

7. 7
AOI
CAMTEK Inspectify™ mode of operation enables the inspection and
verification of both sides of circuit panels at a single workstation; hence, the
Orion becomes an independent inspection and verification cell that saves both
footprint and handling time providing immediate feedback to the production
line.
Automated Optical Inspection

8. 8
High Speed / Small Hole N/C Drilling Equipment
The Schmoll Drilling
machines have 6 (six)
stations per drilling
machine and allow DAPC
to be more efficient in
drilling panels with a large
volume of vias at a rapid
speed and accuracy. We
are able to mechanically
drill holes as small as 6
mil. This greatly enhances
the efficiency of high mix
low volume production and
mass production quantities
of printed circuit boards.

9. 9
Mass VCP-5001
Via Plugging
Machine
This machine is designed to
fill holes in printed circuit
boards with conductive or
non-conductive paste. The
hole filling can be performed
with through-hole vias and
blind vias. The machine is
equipped with a full vacuum
chamber and heated heads
to ensure reliable via filling for
the most demanding aspect
ratios and a glass cover for
visual quality control on both
panel sides.

10. 10
Soldermask Coater
The DP-1500 applies all
types of liquid
photoimageable
coatings, including
soldermask, primary
image, dielectric, and
legend. This versatile
machine incorporates
more than eight years of
experience of dual-sided
coating with many new
features designed to
reduce cycle time,
increase yields and
improve process
reliability.

11. 11
HASL Machine
The HAL5224 Hot Air Solder Leveling
System is designed to provide the
highest quality solder leveling at high
throughput rates while preserving the
highest reliability and serviceability
standards available.
Argus International has been designing,
building and operating HASL systems
for over a decade. The experience
earned in a decade of dedication to
engineering the HASL process is
evident by the high quality work
produced.

12. 12
IST Tester
PWB Interconnect Solutions Inc. is an
advanced technology company which
offers a revolutionary method for
assessing the quality of printed circuit
boards (PCB). Their patented
interconnect stress test (IST)
technology has the unique ability to
identify the presence and severity of
post separation of both the plated
through hole (PTH) and vias within
multilayer PCBs. IST technology offers
significant advantages over traditional
test methods while providing
microsection analysis with precise fault
locations.

13. 13
Technology Roadmaps
Materials and Manufacturing
Capabilities

14. 14
Technology Roadmap
Attribute Standard Advanced 2012
Minimum Line Spacing, Internal Layer 0.005”/.005” 0.003”/0.003” 0.003”/0.003”
Minimum Line/Spacing, External Layer 0.005”/.005” 0.003”/0.003” 0.003”/0.003”
Minimum drilled hole size 0.008” 0.006” 0.004”
Aspect Ratio (Thickness to Drill) 8:1 16:1 25:1
Land Size Internal (Diameter over Drill) 0.012” 0.010” 0.010”
Land size External (Diameter over Drill) 0.012” 0.008” 0.008”
No Connect (Diameter over Drill) 0.020 0.016 0.015
Plated Hole Tolerance ± .003” ± 0.002” ± 0.002”
Minimum Laser Via Hole N/A N/A .004”
Laser Via Aspect Ratio N/A N/A 1.5:1
Laser Via Land Size (Diameter Over Drill) N/A N/A 0.008”
Minimum Dielectric Thickness 0.004” 0.003” 0.002”
Minimum core Thickness 0.004” 0.003” 0.002”
Maximum PCB Thickness 0.125” 0.256” 0.256”
Thickness Tolerance (%) 10 7 6
Maximum Board Dimensions 16.5”x22.5” 19.5”x22.5” 19.5”x22.5”
Bow And Twist (Through Hole) % 1.50 1.25 1.00
Bow And Twist (SMT) % 0.75 0.75 0.75
Minimum Conductor to Edge 0.012 0.008 0.006
Layer-To-Layer Registration Tolerance 0.005” 0.004” 0.003”
Component Pitch 0.020” 0.016” 0.008”
Soldermask Clearance 0.005” 0.003” 0.002”
Soldermask Dams 0.004” 0.003” 0.002”
Impedance Tolerance (>50 Ohms) % ± 10 ± 5 ± 3
Maximum layers 22 36 36
Maximum Copper Weight Internal (oz.) 3 3 3
Maximum Copper Weight External (oz.) 4 5 5

15. 15
Technology Roadmap continued
Materials
Via Construction
Surface Finish
Electrical Test Method
Attribute Standard Advanced 2012
FR4 Yes Yes Yes
High Tg FR4 – (170C..) Yes Yes Yes
BT Epoxy Yes Yes Yes
Polyimide Yes Yes Yes
Teflon Yes Yes Yes
Duroid Yes Yes Yes
RoHS Compliant Materials Yes Yes Yes
Nelco N4000-13 Yes Yes Yes
Heatsink Manufacturing and Lamination Yes Yes Yes
Through Hole Yes Yes Yes
Blind (Mechanical) Sequential Lamination Yes Yes Yes
Buried (Mechanical) Yes Yes Yes
Blind Laser No No Yes
ENIG Yes Yes Yes
OSP Yes Yes Yes
White Tin Yes Yes Yes
HASL Yes Yes Yes
Electrolytic Nickel/Gold Yes Yes Yes
Silver Yes Yes Yes
Quality System
MIL-P-55110 Yes Yes Yes
MIL-PRF-31032 Yes Yes Yes
ISO-9001:2000 Yes Yes
Flying Probe Yes Yes Yes
Yes
AS9100B Yes YesYes
Isola FR408 Yes Yes Yes

16. 16
Substrate Materials
13 PPM70 PPM0.0134.3260Nelco N7000-2V0Polyimide
12 PPM55 PPM0.0093.8250Nelco N8000Cyanate Ester
15-18 PPM140 PPM0.0134.1185Isola G200BT-Epoxy
CTE-X & Y AxisCTE-Z Axis
Dissipation
Factor
Dielectric
Constant @
1 MHZTg (° .C)
Supplier/Material
TypeMaterial
High Temperature Materials
11-13 PPM65 PPM0.015-0.0234.0180Isola IS410Hi-Temp FR4
10-14 PPM45 PPM0.015-0.0224.4180Panasonic R-1755VHi-Temp FR4
10-14 PPM35 PPM0.0093.9200Nelco N4000-13
13-14 PPM<55 PPM0.01-0.0153.8 Typ.175-185Isola FR408
10-14 PPM37 PPM0.0234.4180Nelco N4000-6Hi-Temp FR-4
12-16 PPM45 PPM0.0274.4140Nelco N4000-2FR-4
CTE-X & Y AxisCTE-Z Axis
Dissipation
Factor
Dielectric
Constant
@
1 MHZTg (° .C)
Supplier/Material
TypeMaterial
Standard
Modified FR-4
Modified FR-4

17. 17
Substrate Materials
YesYes12/1595
2.50-3.20 @ 10
GHzArlon
YesYes9.5/9.5120
0.001 typ @
10 GHz
2.40-2.60 +/-
0.04RogersUltralam 2000
YesYes17/1724
0.0025 @ 10
GHz
6.15 +/- 0.15 @
10 GHzRogersRO3006
YesYes
14/1650
0.0040 @ 10
GHz
3.48 +/- 0.05
@10 GHzRogersRO4350
YesYes
14/1646
0.0022 @ 10
GHz
3.38 +/- 0.05 @
10 GHzRogersRO4003
YesNo
31/482370.00092.20 +/- 0.020RT/duroid 5880
YesNo
16/1624
0.0012 @ 10
GHz
2.94 +/- 0.04 @
10 GHzRogersRT/duroid 6002
YesYes
19/2464
0.0018 @ 1.9
GHz3.50 @ 1.9 GHz
Taconic
RF-35
YesYes
9-12130-145
0.0019 @ 10
GHz
2.45-2.65 +/-
0.04 @ 10 GHz
Taconic
TLX
Yes
Yes
9-1270
0.0030 @ 10
GHz
2.75-3.20 +/-
0.05 @ 10 GHzTaconicTLC
Immersion
Gold/Tin Finish?
HASL
Finish?
CTE-X
& Y AxisCTE-Z Axis
Dissipation
Factor
Dielectric
Constant
Supplier/Material
TypeMaterial
High Frequency Materials (core material only)
AD Series
0.0018-0.0038
@ 10 GHz
Rogers

18. 18
North American
Top Tier Customers

19. 19
Let the DAPC team get started
on your project today!