Laser Depaneling of PCBs
May,2018
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Precision Requirements•
• No Component Damage
•
Smallaspossiblekeepout
Forcutout area
• No Circuit Damage
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Traditional Methods
Routing,Nibbling, V-Scoring
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Traditional Methods
Routing,Nibbling,Snapoff V-ScoredAreas
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CO2 Laser for Flex
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Imparttoomuchheat
Toohighof energydensity
Wavelengthtoo absorbent
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Die Punching for Depaneling
Typical Flexcutwidths1mm- toolarge
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UV Laser De-Panelizing
•
•
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Low Energy Levelsfor
MinimumThermal Impact.
30μmcutwidth
Smoothverticalcutedge
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UV Flexible in Cutting
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Polyimides– Kapton™,
PET materials– Akaflex™,
Others- Pyralux™.
Rigid
Aluminum
Copper
Copper Adhesive
Insulator
Adhesive Copper
Insulator
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•
•
Circuitcomponentscanbeplacednearer the
edgeof thecircuit.
BetterPanelfill
UV Laser De-Panelizing
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•
• Byrepeatedlygoingoverthesamecuttingtrackthinlayers
of thematerialwillberemoveduntilthebeamhascutall the
waythrough-ablation@ 355nm
Accuracy50um
UV Laser De-Panelizing
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DistancefromCutCenterline(mm)
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MaxrecordedTempduringAblation(C)
25reps
5 reps
TempRiseinMaterialWhile Depaneling
17WUV,40KHz, 200mm/sec
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50umspacebetweenboards
Accuracy25um(<1 mil)
Temperaturerisedepends on:
Beampower,beamspeed,focus,laser
pulserateandrepetitionrate
Addstopsbetweenpassestocoolmaterial
UV Laser De-Panelizing
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UV Flexible in Cutting
and Solder Training & Tools www.sYour B ES T choice in PCB Test/ Rework/ Repair older.net
http://www.solder.net/
PCB Laser De-Panelizing

Laser Depanelization of PCBs