The document discusses BGA rework, highlighting its importance for tasks such as removing misplaced parts, upgrading components, and addressing failures. It outlines the rework process, including site dressing, removal, placement, reflow, cleaning, and inspection. Additionally, it emphasizes the proper cleaning of solder to avoid damage to PCBs and nearby components.

1. BGA Rework- Site Dressing
Rework and Repair of PCBs
 Solder/Assembly Training
Rework/Repair Soldering Tools
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2. BGA Rework
I.
II.
III.
Why Rework
Scope of Material Covered
BGA Rework Process
A.
B.
C.
D.
E.
F.
IV.
Removal
Site Dressing
Placement
Reflow
Cleaning
Inspection
Materials
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3. BGA Rework-Why Rework?
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Misplaced part
Part Upgrade
Failed Part
Do not know why
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4. BGA Rework-the process
Site Dressing
Objective is to properly clean up the remnant
solder (and in some cases remove Pb to less than .
1% lead by weight), flatten solder, without
damaging the PCB or nearby components.
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5. More Questions?
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6. More Questions?
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