This slide show is an overview of several techniques used to rework QFNs. Included is paste printing of the PCB and "bumping" of the component prior to placement of the QFN.
This presentation covers the top issues dealing with the rework of advanced electronic packages. The material supports QFN rework as well as BGA rework challenges.
This is one slide set in a multi part series on the BGA rework process. In this section the BGA site dressing process is explained. Get more information on www.solder.net or to see or multitude of soldering process videos.
The BGA reballing process is explained in this slide set. The need for reballing is explained as well as the diifferent methods of reballing as a function of the number of devicss to be reballed and the type of BGA package being reballed.A brief description of the reballing process as well as some of the inspection tools is also discussed.If BGA reballing services are required then contact information for BGA reballing is on the last slide.
This is a compilation of the biggest challenges users are facing during BGA component rework as well as various options for solutions. The top five challenges are BGA warping, neighboring device damage, mask damage, pad damage and underfill rework are illuminated in this presentation.
This is one slide set in a multi-part series on the BGA placement process. In this section, the BGA reflow process is explained. Get more information on www.solder.net or to see or a multitude of soldering process videos.
This slide deck takes you through important elements of manula PCB inspection including some definitions, what makes a good inspector , what type of lighting is required to be able to see the important aspects of a PCB and the types of inspection aids. The slide deck ends with some real examples where the user is challenged to make a determination of defect/process indicator/acceptable of an electronics assembly in accordance with the IPC-A-610 and IPC-A-620 standards.
This presentation covers the top issues dealing with the rework of advanced electronic packages. The material supports QFN rework as well as BGA rework challenges.
This is one slide set in a multi part series on the BGA rework process. In this section the BGA site dressing process is explained. Get more information on www.solder.net or to see or multitude of soldering process videos.
The BGA reballing process is explained in this slide set. The need for reballing is explained as well as the diifferent methods of reballing as a function of the number of devicss to be reballed and the type of BGA package being reballed.A brief description of the reballing process as well as some of the inspection tools is also discussed.If BGA reballing services are required then contact information for BGA reballing is on the last slide.
This is a compilation of the biggest challenges users are facing during BGA component rework as well as various options for solutions. The top five challenges are BGA warping, neighboring device damage, mask damage, pad damage and underfill rework are illuminated in this presentation.
This is one slide set in a multi-part series on the BGA placement process. In this section, the BGA reflow process is explained. Get more information on www.solder.net or to see or a multitude of soldering process videos.
This slide deck takes you through important elements of manula PCB inspection including some definitions, what makes a good inspector , what type of lighting is required to be able to see the important aspects of a PCB and the types of inspection aids. The slide deck ends with some real examples where the user is challenged to make a determination of defect/process indicator/acceptable of an electronics assembly in accordance with the IPC-A-610 and IPC-A-620 standards.
he Filtec Omnivision I All Surface Empty Bottle Inspector (ASEBI), with a modular design that makes expandable functionality possible through available technology upgrades, meets the needs of small to medium size bottling facilities. Operating at speeds of up to 700 bottles per minute, the standard ASEBI comes equipped with a high resolution Camera Base Inspection system. Optional functions include inspection of the finish, thread, outer sidewall, inner sidewall, as well as the detection of residual liquid by infrared and RF techniques.
Transparent films are detected with a special optical technique known as the Bright Field Analyzer. Reject verification, test bottle verification, rotating self-cleaning diffuser glass, serial interface port (MODBUS Protocol), isolated PLC outputs, and enclosure doors are also available as options. All of these options can easily be upgraded in the field, which assures maximum adaptability of the Filtec Omnivision I.
Filtec Omnivision I is appropriate for bottling operations that fill returnable plastic or glass bottles for soft drinks, beer, and other products. The Filtec Omnivision I requires minimal floor space and is designed to reduce installation costs by using a single vacuum starwheel system that eliminates the additional conveyors and line control systems required with linear type machines. The production conveyor powers the automatic starwheel drive system; this assures that the starwheel is always synchronized with bottle flow. Upstream sensors control the starwheel drive system and regulate gap closure of bottles entering the starwheel to provide smooth stops and starts which minimize breakage, jams, and noise.
Handling bottles up to 104-mm-dia, the Filtec Omnivision I improves productivity by reducing changeover related downtime to less than five min. The Filtec Omnivision I offers a touchpad control panel and LCD color monitor that are both mounted on a swing arm that rotates for easy operator viewing.
Here is a user guide for one of the screens from Elite
Elite screens are available from Dukane.
Dukane is an American company serving the education, corporate, government and house of worship markets for over 85 years.
For more information contact Dukane AV :
Phone: 800-676-2485
Fax: (630) 584-5156
Email: AVSales@Dukane.com
Website: www.Dukane.com/AV
Dukane AV
2900 Dukane Drive
St. Charles, IL 60174
The Saker Plus is a large venue electric/motorized projector screen. The Saker Plus utilizes our GREENGUARD Gold Certified MaxWhite™ (matte white) front projection material, which has a 1.1 Gain and a wide viewing angle. For more details visit at http://www.elitescreens.com/products/electric-wall-ceiling-projection-screens
This is a summary of the newest PCB cleanliness and residue measuring requirements as part of the IPC J-STD-001H. More on this standard including training at solder.net
he Filtec Omnivision I All Surface Empty Bottle Inspector (ASEBI), with a modular design that makes expandable functionality possible through available technology upgrades, meets the needs of small to medium size bottling facilities. Operating at speeds of up to 700 bottles per minute, the standard ASEBI comes equipped with a high resolution Camera Base Inspection system. Optional functions include inspection of the finish, thread, outer sidewall, inner sidewall, as well as the detection of residual liquid by infrared and RF techniques.
Transparent films are detected with a special optical technique known as the Bright Field Analyzer. Reject verification, test bottle verification, rotating self-cleaning diffuser glass, serial interface port (MODBUS Protocol), isolated PLC outputs, and enclosure doors are also available as options. All of these options can easily be upgraded in the field, which assures maximum adaptability of the Filtec Omnivision I.
Filtec Omnivision I is appropriate for bottling operations that fill returnable plastic or glass bottles for soft drinks, beer, and other products. The Filtec Omnivision I requires minimal floor space and is designed to reduce installation costs by using a single vacuum starwheel system that eliminates the additional conveyors and line control systems required with linear type machines. The production conveyor powers the automatic starwheel drive system; this assures that the starwheel is always synchronized with bottle flow. Upstream sensors control the starwheel drive system and regulate gap closure of bottles entering the starwheel to provide smooth stops and starts which minimize breakage, jams, and noise.
Handling bottles up to 104-mm-dia, the Filtec Omnivision I improves productivity by reducing changeover related downtime to less than five min. The Filtec Omnivision I offers a touchpad control panel and LCD color monitor that are both mounted on a swing arm that rotates for easy operator viewing.
Here is a user guide for one of the screens from Elite
Elite screens are available from Dukane.
Dukane is an American company serving the education, corporate, government and house of worship markets for over 85 years.
For more information contact Dukane AV :
Phone: 800-676-2485
Fax: (630) 584-5156
Email: AVSales@Dukane.com
Website: www.Dukane.com/AV
Dukane AV
2900 Dukane Drive
St. Charles, IL 60174
The Saker Plus is a large venue electric/motorized projector screen. The Saker Plus utilizes our GREENGUARD Gold Certified MaxWhite™ (matte white) front projection material, which has a 1.1 Gain and a wide viewing angle. For more details visit at http://www.elitescreens.com/products/electric-wall-ceiling-projection-screens
This is a summary of the newest PCB cleanliness and residue measuring requirements as part of the IPC J-STD-001H. More on this standard including training at solder.net
X Ray inspection of Plated Throughhole Devices Using X-RayBob Wettermann
X-ray inspection can be used to determine and confirm hole fill which is a non-inspectable criteria for PTH devices. Industry standards are reviewed as well as sample x-ray images are provided. Call solder.net for more assistance.
Conformal coating is applied to PCBs to protect against temperature, moisture and chemicals. This presentation was developed as a webinar to inform users of the options for spray, brush and dip coating. The methods are outlines and the best alternatives given for masking and de-masking for conformal coating of PCBs.
IPC A-620 Training for Specialist (CIS) course is designed to improve individual discrimination skills between an acceptable or not acceptable cable or wire harness assembly per the IPC/WHMA-A-620 document. This slide set is a high-level overview of the IPC-A-620 wire and cable harness acceptability certification and training program. It is designed to give you a high-level overview of this acceptability of wire harnesses.
This slide deck goes through a variety of PCB depanelization options. After discussing the options and their positive and negative attributes, the material focuses on laser depanelization. Also, BEST Inc provides laser depaneling services for printed circuit board manufacturers as well as EMS and OEMs.
J-STD-001, IPC A-610 F to G Differences WebinarBob Wettermann
BEST presented on the recent updates to IPC-A-610 and IPC J-STD-001. This slide deck was put together by the BEST staff and present as the differences between "F" and "G" webinar series.
BEST Inc. a training and consulting provider for electronics assembly services, presents a RoHS2 update including the institution of CE marking, certificates of conformance and materials file and materials declaration
This deck discusses how and when it is appropriate to use Kapton(TM) stencils for PCB prototyping. It also discusses the advantages of Kapton vs Mylar.
What is the IPC-JSTD-001 Certification ProgramBob Wettermann
This slide set is a high level overview of the IPC J-STD-001 certification and training program. It is designed to give you a high level overview of this soldering and PCB assembly specification certification training program.
This is one slide set in a multi part series on the BGA rework process. In this section the BGA cleaning and inspection process is explained. Get more information on www.solder.net or to see or multitude of soldering process videos.
This is one slide set in a multi part series on the BGA rework process. In this section the BGA reflow process is explained. Get more information on www.solder.net or to see or multitude of soldering process videos.
This slide set goes through the challenges of PoP rework. In addition the (2) main strategies for stacking these packages and placing them on to a PCB are depicted.
This presentation is a high level review of methods for stacking various area array packages together. Included in this discussion are "how tos" related to POP assembly and rework. In addition actual photos of devices processed are shown for POP rework.
Transcript: Selling digital books in 2024: Insights from industry leaders - T...BookNet Canada
The publishing industry has been selling digital audiobooks and ebooks for over a decade and has found its groove. What’s changed? What has stayed the same? Where do we go from here? Join a group of leading sales peers from across the industry for a conversation about the lessons learned since the popularization of digital books, best practices, digital book supply chain management, and more.
Link to video recording: https://bnctechforum.ca/sessions/selling-digital-books-in-2024-insights-from-industry-leaders/
Presented by BookNet Canada on May 28, 2024, with support from the Department of Canadian Heritage.
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
Accelerate your Kubernetes clusters with Varnish CachingThijs Feryn
A presentation about the usage and availability of Varnish on Kubernetes. This talk explores the capabilities of Varnish caching and shows how to use the Varnish Helm chart to deploy it to Kubernetes.
This presentation was delivered at K8SUG Singapore. See https://feryn.eu/presentations/accelerate-your-kubernetes-clusters-with-varnish-caching-k8sug-singapore-28-2024 for more details.
State of ICS and IoT Cyber Threat Landscape Report 2024 previewPrayukth K V
The IoT and OT threat landscape report has been prepared by the Threat Research Team at Sectrio using data from Sectrio, cyber threat intelligence farming facilities spread across over 85 cities around the world. In addition, Sectrio also runs AI-based advanced threat and payload engagement facilities that serve as sinks to attract and engage sophisticated threat actors, and newer malware including new variants and latent threats that are at an earlier stage of development.
The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
Generating a custom Ruby SDK for your web service or Rails API using Smithyg2nightmarescribd
Have you ever wanted a Ruby client API to communicate with your web service? Smithy is a protocol-agnostic language for defining services and SDKs. Smithy Ruby is an implementation of Smithy that generates a Ruby SDK using a Smithy model. In this talk, we will explore Smithy and Smithy Ruby to learn how to generate custom feature-rich SDKs that can communicate with any web service, such as a Rails JSON API.
Securing your Kubernetes cluster_ a step-by-step guide to success !KatiaHIMEUR1
Today, after several years of existence, an extremely active community and an ultra-dynamic ecosystem, Kubernetes has established itself as the de facto standard in container orchestration. Thanks to a wide range of managed services, it has never been so easy to set up a ready-to-use Kubernetes cluster.
However, this ease of use means that the subject of security in Kubernetes is often left for later, or even neglected. This exposes companies to significant risks.
In this talk, I'll show you step-by-step how to secure your Kubernetes cluster for greater peace of mind and reliability.
6. Step #1
Align and apply
stencil to
device. Roll
solder paste
through
apertures.
Part Bumping Using a Polyimide
Peel-n-Stick Stencil(s)
IPC 7711 5.8.1.2.
7. Step #2
Reflow per solder
mfr’s profile
recommendations
Part Bumping Using a Polyimide
Peel-n-Stick Stencil(s)
10. Step #4
Prep land
area on PCB
where device
is to be
placed
Part Bumping Using a Polyimide
Peel-n-Stick Stencil(s)
11. Step #5
Align and
adhere board
stencil on
PCB. Roll
solder paste
into apertures
and clean off
residue.
Part Bumping Using a Polyimide
Peel-n-Stick Stencil(s)
13. Step #7
Reflow as per
solder paste
manufacturers’
profile
recommendations.
Perform visual
inspection.
Perform X-ray
inspection.
Part Bumping Using a Polyimide
Peel-n-Stick Stencil(s)
Background 2006 RoHS Fast Forward we have more 0201s, stacked packages, leadless devices have replaced BGAs in terms of # of placements and lead free solder pastes are NOT going away # 2 is Novemeber 1 st from 1-2:30PM EST