I-Bytes Technology Industry

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I-Bytes
Technology
March Edition 2020
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Table of Contents
1. Financial, M & A Updates...................................................................................................................................1
2. Solution Updates................................................................................................................................................10
3. Rewards and Recognition Updates..................................................................................................................46
4. Customer Success..............................................................................................................................................60
5. Partnership Ecosystem Updates......................................................................................................................71
6. Event Updates...................................................................................................................................................93

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Financial, M & A
Technology Industry

Financial, M&A Updates
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Analog Devices (USA) Reports First Quarter Fiscal 2020 Results
First Quarter
• Revenue of $1.3 billion, in-line with our expectations for the first
quarter
• Operating cash flow of $2.2 billion and free cash flow of $2.0
billion on a trailing twelve months basis
• Returned over $300 million to shareholders in the first quarter
through dividends and share repurchases
• Increased quarterly dividend by 15%, the high-end of target
range of 7% to 15%
Executive Commentary
“ADI’s first quarter results were in-line with our expectations.
Encouragingly, demand across our end markets has stabilized
and is beginning to show signs of improvement as we enter our
fiscal second quarter,” said President and CEO. We are building
on this momentum by executing on our 2020 priorities –
deepening our customer-centricity, deploying our capital
efficiently, and capitalizing on secular trends to expand our
addressable markets and drive diversified growth. Further, we
raised our quarterly dividend by 15%, reflecting the stability of
our cash flows and our optimism regarding ADI’s future.”
1
Key Financial Highlights

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Arista Networks, Inc. (USA) Reports Fourth Quarter and Year End 2019
Financial Results
Fourth Quarter Financial Highlights
• Revenue of $552.5 million, a decrease of 15.6% compared to the third quarter of 2019,
and a decrease of 7.2% from the fourth quarter of 2018.
• GAAP gross margin of 64.5%, compared to GAAP gross margin of 63.8% in the third
quarter of 2019 and 62.9% in the fourth quarter of 2018.
• Non-GAAP gross margin of 65.2%, compared to non-GAAP gross margin of 64.4% in
the third quarter of 2019 and 64.1% in the fourth quarter of 2018.
• GAAP net income of $260.7 million, or $3.25 per diluted share, compared to GAAP net
income of $170.3 million, or $2.10 per diluted share in the fourth quarter of 2018.
• Non-GAAP net income of $183.4 million, or $2.29 per diluted share, compared to
non-GAAP net income of $182.2 million, or $2.25 per diluted share in the fourth quarter of
2018.
Full Year Financial Highlights
• Revenue of $2.41 billion, an increase of 12.1% compared to fiscal year 2018.
• GAAP gross margin of 64.1%, compared to GAAP gross margin of 63.8% in fiscal year
2018.
• Non-GAAP gross margin of 64.7%, compared to non-GAAP gross margin of 64.4% in
fiscal year 2018.
• GAAP net income of $859.9 million, or $10.63 per diluted share, compared to GAAP net
income of $328.1 million, or $4.06 per diluted share, in fiscal year 2018.
• Non-GAAP net income of $786.8 million or $9.73 per diluted share, compared to
non-GAAP net income of $643.3 million, or $7.96 per diluted share, in fiscal year 2018.
"Despite the volatility of cloud spend, 2019 marked the entry of Arista in the campus and
mainstream enterprise. Our cloud networking technology is being accepted in thousands
of diverse enterprise customers. We are excited by our prospects in 2020 and committed
to a multi-year foundation of growth, innovation and profitability,” stated Arista’s
President and CEO.
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Arista Networks (USA) Announces Acquisition of Big Switch Networks
Arista Networks, a leader in cloud networking, announced that it has acquired Big
Switch Networks, a network monitoring and SDN pioneer. Arista Networks
provides a complete and visionary cloud networking suite, with rich capabilities in
all critical areas of the campus, data center and public cloud. The acquisition of Big
Switch will further strengthen the company’s network monitoring and observability
suite delivered through Arista’s software platform Cloud VisionⓇ and DANZ
capabilities. Big Switch Networks was recognized as a Visionary in Gartner’s
Magic Quadrant for Data Center Networking for the third time. Additionally, Big
Switch won the best of VMworld for Networking in 2019. Arista and Dell will
continue to partner to deliver cloud fabric and observability capabilities. Arista
Networks pioneered software-driven, cognitive cloud networking for large-scale
datacenter and campus environments. Arista’s award-winning platforms redefine
and deliver availability, agility, automation, analytics, and security. Arista has
shipped more than twenty million cloud networking ports worldwide with
Cloud-Vision and EOS, an advanced network operating system. Committed to open
standards across private, public and hybrid cloud solutions, Arista products are
supported worldwide directly and through partners.
“For nearly six years, Big Switch Networks and Dell EMC Networking have
collaborated in support of Open Networking and the flexibility and choice it
offers customers, said Senior Vice President and General Manager, Dell EMC
Networking & Solutions. “We look forward to continuing to offer advanced
cloud and monitoring fabric capabilities to customers in partnership with Big
Switch, now part of Arista Networks.”
Description
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Applied Materials (USA) Announces First Quarter 2020 Results
First Quarter
• Applied generated revenue of $4.16 billion.
• On a GAAP basis, the company recorded gross margin of 44.6
percent, operating income of $1.04 billion or 25.0 percent of net
sales, and earnings per share of $0.96.
• On a non-GAAP adjusted basis, the company reported gross margin
of 44.9 percent, operating income of $1.07 billion or 25.7 percent of
net sales, and EPS of $0.98.
• The company returned $392 million to shareholders including $200
million in share repurchases and dividends of $192 million.
“Applied Materials’ first quarter earnings exceeded the top-end of
our guidance, giving us great momentum entering 2020, said
President and CEO. We believe we can deliver strong double-digit
growth in our semiconductor business this year as our unique
solutions accelerate our customers’ success in the AI-Big Data
era.”
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Autodesk, Inc. (USA) Announces Fiscal 2020 Fourth Quarter and
Full-Year Results
Fourth Quarter Fiscal 2020 Financial Highlights
• Total ARR was $3.43 billion, an increase of 25 percent as reported, and 26 percent on a constant currency basis.
• Subscription plan ARR was $3.11 billion, an increase of 41 percent as reported, and 43 percent on a constant currency
basis.
• Maintenance plan ARR was $320 million, a decrease of 42 percent as reported, and on a constant currency basis.
• Core ARR increased 21 percent to $3.17 billion. On a sequential basis, core ARR increased 6 percent.
• Cloud ARR increased 102 percent to $255 million. Acquisitions from the fourth quarter of last year contributed $126
million or 72 percentage points of the growth
• Billings increased 43 percent to $1.49 billion.
• Total revenue was $899 million, an increase of 22 percent as reported, and 23 percent on a constant currency basis.
• Net revenue retention rate was within the range of 110 to 120 percent.
• GAAP operating income was $134 million compared to $40 million in the fourth quarter last year. GAAP operating margin
was 15 percent, up 9 percentage points.
• Total non-GAAP operating income was $259 million compared to $139 million in the fourth quarter last year. Non-GAAP
operating margin was 29 percent, up 10 percentage points.
• GAAP diluted net income per share was $0.59, compared to GAAP diluted net income per share of $0.29 in the fourth
quarter last year.
• Cash flow from operating activities was $698 million, an increase of $387 million compared to the fourth quarter last year.
Fiscal 2020 Financial Highlights
• Billings increased 55 percent to $4.19 billion, up 46 percent adjusted for the impact of ASC 606 in fiscal 2019.
• Total revenue increased 27 percent to $3.27 billion. Total revenue includes a $106 million contribution from the fourth
quarter fiscal 2019 acquisitions, and 4 percentage points.
• Recurring revenue increased to 96 percent, compared to 95 percent in fiscal 2019.
• Subscription plan subscriptions increased 934,000 from the end of fiscal 2019 to 4.47 million at the end of fiscal 2020.
• Total ARPS increased 11 percent to $704. Included in total ARPS is the negative impact of $4 from the fourth quarter fiscal
2019 acquisitions.
• GAAP operating income (loss) was $343 million compared to $(25) million last year. GAAP operating margin was 10
percent, up 11 percentage points.
• Total non-GAAP operating income was $803 million compared to $316 million last year. Non-GAAP operating margin was
25 percent, up 12 percentage points.
• Cash flow from operating activities increased to $1.42 billion, compared to $377 million in fiscal 2019. Free cash flow
increased to $1.36 billion, compared to $310 million in fiscal 2019.
"We ended fiscal 2020 on a very strong note with revenue, earnings, and free cash flow coming in above expectations.
We are entering the sustainable growth phase of our subscription journey with great momentum, said Autodesk president
and CEO. Our construction business had a landmark year, we continue to gain share in manufacturing, and are making
steady progress in monetizing non-compliant users. We are highly confident in our long-term growth drivers and fiscal
2023 targets."
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Innolux Corporation (Taiwan) Reports Fourth Quarter 2019 Financial Results
• In 4Q19, the Company shipped 7.62 million square meters of total panel, an increase of 8.2% quarter-on-quarter.
• Blended area ASP for TFT-LCD panels averaged US$ 275 per square meter. Small and medium-sized panel revenues were NT$ 17.7 billion in
4Q19, an increase of 0.6% quarter-on-quarter.
• The Company shipped 765.6 thousand square meters of small and medium-sized panel during the fourth quarter of 2019, an increase of 11.4%
quarter-on-quarter.
• The Company shipped 28.94 million square meters of panel in 2019, a decrease of 5.5% over 30.64 million square meters in 2018.
• For the full year 2019, the company shipped 257million for small-and-medium-sized units, a 5.5% decrease over the 272 million units shipped in
2018.
• For the full year of 2019, the Company reported consolidated revenues of NT$ 252 billion.
• For the full year Gross profit was NT$ 3 billion, for a gross margin of 1.2%.
• For the full year Operating loss totaled NT$ 19.9 billion. Net loss amounted to NT$ 17.4 billion. EPS equaled NT$ -1.77.
• The Company shipped 28.94 million square meters of panel in 2019, a decrease of 5.5% over 30.64 million square meters in 2018.
• For the full year 2019, the company shipped 257million for small-and-medium-sized units, a 5.5% decrease over the 272 million units shipped in
2018.
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RELX (UK) 2019 Results
2019 Results
• Revenue £7,874m +5%; underlying growth +4%: The underlying growth rate reflects good growth in
electronic and face-to-face revenues, and the further development of our analytics and decision tools, partially
offset by continued print revenue declines.
• Adjusted operating profit £2,491m (£2,346m) +6%; underlying growth +5%: Growth was driven by revenue
growth and continued operating process innovation.
• Reported operating profit £2,101m +7%: Reported operating profit includes amortization of acquired
intangible assets of £295m and acquisition-related costs of £84m.
• Interest: Adjusted net interest expense was £291m, with the increase including a charge of £99m in respect of
the early redemption of bonds that were scheduled to mature in October 2022, partially offset by lower average
interest rates on borrowings.
• The adjusted tax charge was £388m (£465m), and includes a credit of £89m in respect of a substantial
resolution during the year of certain historical tax issues, giving an effective tax rate of 17.6%. Excluding this
item, the adjusted effective tax rate would have been 21.7%, in line with the prior year.
• Reported net interest expense was £305m (£211m), and the reported tax charge was £338m (£292m).
• Adjusted EPS 93.0p +10%; constant currency growth +7%
• Reported EPS 77.4p +8%: Reported EPS includes a credit for gains on disposals and other non-operating
items of £51m.
• ROIC: Return on invested capital was 13.6%, benefitting from the lower adjusted tax rate mentioned above.
Based on a tax rate of 21.7% ROIC would have been 13.0%.
• Net debt/EBITDA 2.5x including leases and pensions: Net debt, including leases as per IFRS 16, was £6.2bn
(£6.2bn) at 31 December 2019. Excluding leases and pensions, net debt/EBITDA was 2.2x.
• Portfolio development: In 2019 we completed 14 acquisitions of content, data analytics and exhibition assets
for a total consideration of £416m, and disposed of a number of small assets for a total of £63m.
Chief Executive Officer, commented: “RELX continued to make good progress in 2019. Our number one
strategic priority is unchanged: the organic development of increasingly sophisticated information-based
analytics and decision tools that deliver enhanced value to our customers, supplemented by selective
acquisitions of targeted data, analytics and exhibition assets that support our organic growth strategies. We
achieved good underlying revenue growth, with underlying adjusted operating profit growth slightly ahead
of underlying revenue growth, and adjusted earnings per share growth at constant currencies ahead of
underlying profit growth.”
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STMicroelectronics (Switzerland) to Acquire Majority Stake in Gallium Nitride
innovator Exagan
STMicroelectronics, a global semiconductor leader serving customers across the
spectrum of electronics applications, announced it has signed an agreement to
acquire a majority stake in French Gallium Nitride innovator Exagan. Exagan’s
expertise in epitaxy, product development and application know-how will broaden
and accelerate ST’s power GaN roadmap and business for automotive, industrial
and consumer applications. Exagan will continue to execute its product roadmap
and will be supported by ST in the deployment of its products. Terms of the
transaction were not disclosed and closing of the acquisition remains subject to
customary regulatory approvals from French authorities. The signed agreement also
provides for the acquisition by ST of the remaining minority stake in Exagan 24
months after the closing of the acquisition of the majority stake. The transaction is
funded with available cash. Gallium Nitride belongs to the family of wide bandgap
(WBG) materials which include Silicon Carbide. GaN-based devices represent a
major step forward in power electronics providing high-frequency operation, with
increased efficiency and higher power density compared to silicon-based
transistors, leading to power savings and total system downsizing. GaN products
will address a wide variety of applications such as power factor correction and
DC/DC converters in servers, telecom and industrial applications, on-board
chargers for EV and DC-DC converters for automotive applications, as well
personal electronics applications like power adaptors.
“ST has built strong momentum in silicon carbide and is now expanding in
another very promising compound material, gallium nitride, to drive adoption of
the power products based on GaN by customers across the automotive, industrial
and consumer markets said President and CEO of STMicroelectronics. The
acquisition of a majority stake in Exagan is another step forward in strengthening
our global technology leadership in power semiconductors and our long-term
GaN roadmap, ecosystem and business. It comes in addition to ongoing
developments with CEA-Leti in Tours, France, and the recently-announced
collaboration with TSMC.”
Description
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Verisign (USA) Reports Fourth Quarter and Full Year 2019 Results
Fourth Quarter GAAP Financial Results
• Reported revenue of $311 million for the fourth quarter of 2019, up 1.0 percent from the same
quarter in 2018.
• Verisign reported net income of $148 million and diluted earnings per share of $1.26 for the fourth
quarter of 2019, compared to net income of $182 million and diluted EPS of $1.50 for the same
quarter in 2018.
• The operating margin was 63.9 percent for the fourth quarter of 2019 compared to 63.1 percent for
the same quarter in 2018.
Fourth Quarter Non-GAAP Financial Results
• Verisign reported net income of $154 million and diluted EPS of $1.31 for the fourth quarter of
2019, compared to net income of $191 million and diluted EPS of $1.58 for the same quarter in
2018.
• The non-GAAP operating margin was 67.9 percent for the fourth quarter of 2019 compared to 66.7
percent for the same quarter in 2018.
2019 GAAP Financial Results
• Verisign reported revenue of $1.23 billion for 2019, up 1.4 percent from $1.21 billion in 2018.
• Verisign reported net income of $612 million and diluted EPS of $5.15 for 2019, compared to net
income of $582 million and diluted EPS of $4.75 in 2018.
• The operating margin for 2019 was 65.5 percent compared to 63.2 percent in 2018.
2019 Non-GAAP Financial Results
• Verisign reported net income of $631 million and diluted EPS of $5.31 for 2019, compared to net
income of $620 million and diluted EPS of $5.05 in 2018.
• The non-GAAP operating margin for 2019 was 69.6 percent compared to 67.5 percent in 2018.
“Focused execution yielded another solid quarter that caps off not only a solid year but a strong
decade in which we’ve focused on our core business, expanded the domain name base and
returned value to our shareholders. In 2019 we marked more than 22 years of uninterrupted
availability of the Verisign DNS for .com and .net,” said Executive Chairman, President and
Chief Executive Officer.
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Solutions Updates
Technology Industry

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Agilent (USA) Introduces Three New Microarrays for Prenatal and Postnatal
Research
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Solution Description
Agilent Technologies Inc. introduced three new microarrays to meet the needs of cytogenetic laboratories conducting both
prenatal and postnatal research. The new Agilent GenetiSure Cyto microarrays include updated, clinically relevant content
from respected databases. The probes on the Cyto microarrays provide high-resolution detection of copy number
variations, and copy-neutral loss of heterozygosity associated with developmental delay, neuropsychiatric disorders,
intellectual disability, congenital anomalies, or unexplained dysmorphic features in constitutional DNA samples. Meldrum
noted that Agilent’s new arrays focus on clinically relevant regions with different specifications, depending on application
(prenatal and postnatal research) down to exon-level resolution. Agilent is a leading manufacturer of high-quality
microarrays for copy number analysis and provides a complete workflow from sample preparation to interpretation.
Agilent Technologies Inc. is a global leader in life sciences, diagnostics, and applied chemical markets. Now in its 20th
year as an independent company delivering insight and innovation toward improving the quality of life, Agilent
instruments, software, services, solutions, and people provide trusted answers to customers' most challenging questions.
The company generated revenue of $5.16 billion in fiscal 2019 and employs 16,300 people worldwide.

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High-performance 96Boards platforms from Arrow Electronics (USA) harness the i.MX 8
family of multicore processors for machine learning and Human Machine Interface
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Arrow Electronics has introduced two out-of-the-box 96Boards™ platforms for developers to leverage the multi-application-core
performance of NXP’s i.MX 8 processors with convenient mezzanine expansion opportunities. eInfochips, an Arrow company, is the
design partner for these boards and provides customization and ongoing support for these platforms. For a fast start to machine-learning
projects such as industrial image recognition and autonomous driving, the AI_ML Board is built on the i.MX 8QuadXPlus application
processor, which combines four Arm® Cortex®-A35 cores and one Cortex-M4F embedded core with floating-point and DSP extensions.
A dedicated GPU featuring four Vec4 shaders with 16 execution units and OpenGL/OpenGL ES support augments the highly efficient
application cores. In addition, there is a Video Processing Unit capable of handling popular compression standards including H.264,
H.265, AVS, and more. A Tensilica® HiFi 4 DSP is also integrated on-chip for audio processing and voice recognition. The i.MX 8M
Quad processor is at the heart of Arrow’s Thor96 board teams four Arm Cortex-A53 cores with the Cortex-M4F. Richly featured for audio
and video streaming, imaging, and scanning in consumer and industrial contexts, it contains a dedicated GPU with OpenGL/ES support
and 3D graphics, and a VPU with H.265 and VP9 decode at up to 4K resolution and 60 fps. The i.MX 8M Quad also features a
failover-ready display controller with hardware acceleration for up to 4Kp60 video playback. Arrow has designed both boards leveraging
the 96Boards specification. High-speed and low-speed interfaces allow users to choose from the wide variety of 96Boards mezzanines,
such as cellular and audio modules, for hardware expansion.

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Arista (USA) Showcases Cloud Networking for Healthy Hospitals at HIMSS 2020
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Arista Networks announced participation in the Healthy Hospital HIMSS Interoperability Showcase, a demonstration for secure, reliable
hospital infrastructures. The companies, together, will emphasize mission critical networking requirements so that clinicians can focus on
patient care free of application or network productivity issues. Arista’s cognitive approach to networking, is built on cloud principles of
availability, agility, automation and analytics, to deliver a combination of inference and real-time action.
What this means for healthcare infrastructure is a network that:
• Ensures access to mission critical health care applications.
• Automatically prioritizes and optimizes patient monitoring, imaging, and EHR applications.
• Cognitive edge for WiFi identifies healthcare clinicians/nurses’ kiosks running EHR applications and automatically prioritizes network
access for those applications.
• Provides a secure network infrastructure enabling surgical over-the-air prevention, automatically and accurately creates alerts and
classifies wireless threats from hackers. With dedicated wireless intrusion prevention (WIPS) sensor, threats are detected and blocked
instantly.
• Minimizes hospital network downtime with cognitive WiFi AI and machine learning automated network problem resolution to improve
the patient experience. Quickly identifies and isolates with real time location services critical healthcare devices- EKG machines,
incubators, etc.

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Broadcom (USA) Announces World’s First Wi-Fi 6E Chip for Mobile Devices
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Broadcom Inc. announced the world’s first Wi-Fi 6E client device, the BCM4389. Wi-Fi 6E extends the Wi-Fi 6 standard to support the
soon-to-be-operational 6 GHz band with wider 160 MHz channel bandwidths that double Wi-Fi speeds and cut latency in half compared
to Wi-Fi 5. The BCM4389 delivers over 2 Gbps of real-world speeds and up to five times better battery utilization, making it an ideal
solution for flagship smartphones and future AR/VR devices. Wi-Fi 6E builds on the rich feature set of Wi-Fi 6, which includes improved
performance in crowded environments, advanced roaming capabilities and increased security. This enhancement of Wi-Fi 6 uses new
spectrum in the 6 GHz band to deliver multi-gigabit speeds while avoiding congestion with legacy devices. The BCM4389 expands on
the accelerated deployment of Wi-Fi 6, delivering a steady, swift and secure consumer experience in tandem with over 150 million
smartphones already in the market. With the additional innovations of Wi-Fi 6E, it unlocks high-speed bi-directional video applications
and augmented reality. For more on Wi-Fi 6E and 6 GHz Wi-Fi, read our blog here. The BCM4389 also brings advanced multi-radio
technology to Bluetooth. Inspired by sophisticated Wi-Fi communication techniques such as multiple-input multiple-output and
beamforming, the BCM4389 improves audio performance and range for any connected Bluetooth accessory. Phones equipped with the
BCM4389 will provide a seamless, “glitch-free” audio experience with popular Bluetooth headsets even in congested places such as
subway stations.

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Fujifilm (Japan) launches mirrorless digital camera “FUJIFILM X-T4”
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FUJIFILM Corporation is pleased to announce the launch of the mirrorless digital camera “FUJIFILM X-T4” in April 2020, the latest
addition to the X Series of mirrorless digital cameras known for their compact and lightweight body and superior image quality based on
the company's proprietary colour reproduction technology. The X-T4 delivers the world's fastest* 15fps shooting and a high-speed AF
performance as fast as 0.02 seconds. This will be a new flagship model, boasting the highest performance in the history of the X Series
including the use of a five-axis in-body image stabilization mechanism that offers up to 6.5 stops of image stabilization. The X-T4 is a
compact, lightweight and stylish mirrorless digital camera that inherits the “central viewfinder style” adopted by the X-T Series. The use
of a newly-developed focal plane shutter enables burst-shooting at 15fps. This combines with a further-evolved algorithm for fast and
highly-accurate AF performance at the speed as fast as 0.02 seconds, ensuring to capture a precious photo moment. The camera is also
X-T Series' first model equipped with a five-axis IBIS mechanism that gives up to 6.5-stop** advantage, making it a perfect choice for
sports and other active shooting situations. The Film Simulation function, which reproduces colours and tonal expressions of
photographic film Velvia and cinematic film ETERNA, has been added with the new ETERNA Bleach Bypass mode, adding richness
with its high-contrast and low-saturation.

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Fujifilm (Japan) launches “instax mini 11”
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FUJIFILM Corporation is pleased to announce the launch of “instax mini 11” (mini 11) on or after March 5, 2020, a stylish renewal of the globally most
popular mini format entry model*. It will be a new addition to the “instax” series of instant cameras, allowing users to enjoy on-the-spot photo printing. To
be released this time are stylish mini-format instax film “BLUE MARBLE” and square-format instax film “WHITE MARBLE,” both featuring marble
patterns on the frames. The marble-design frames are accentuated with glittery gold and silver, turning a daily snap into a memorable special piece. The
“instax” series of instant cameras, launched in 1998, now offers a wide variety of models that cater to diverse user needs in over 100 countries worldwide,
including Japan, Europe, Americas, China and Southeast Asia. The series has gained popularity especially among young people, who love being able to print
and share a precious moment on the spot, and feel a sepcial sense of connection with friends when sharing photo prints with them. It is embraced by a large
number of people as a tool for creating real communication. “Instax” has been affectionately called “Cheki” in Japan for over 20 years since its initial launch.
The new mini 11 is the first entry model to feature the “Automatic Exposure” function, in which the camera automatically senses the level of ambient light
when the shutter button is pressed, and optimizes the shutter speed and flash output according to the condition. It allows users to take photos optimally
exposed to the main subject and the background in a variety of situations including a bright sunny day outdoors and a dark indoor condition at a restaurant
or a party venue, producing high-quality instant photo prints on the spot.

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Alps Alpine (Japan) Expands SKSU Series Automotive TACT Switch™ Lineup
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Alps Alpine Co., Ltd. has added a new model, with 5N operating force and 1.04mm travel, to its SKSU Series compact, middle-stroke TACT
Switch™ lineup suitable for automotive use. As an automobile safety consideration, input switches inside vehicles are increasingly integrated into
the steering wheel area for drivers to operate without taking their eyes off the road. Moves to place driving automation controls at drivers’
fingertips, too, are also picking up pace given that Level 2 and Level 3 automated driving, the focus of current commercialization efforts, require
switching between human driver and automated driving system modes depending on the circumstances, an action that makes use of switches and
must be performed quickly in an emergency. Automakers are also stepping up requests for the feel of human-machine interfaces to be customized
as a way of establishing a strong brand image. This creates additional need for an even more unique and diverse lineup of switches for automotive
use. Alps Alpine responds to these needs of the market and customers with the development of a new model for its SKSU Series of compact and
quiet TACT Switch™ products. The SKSUBBE010 has a 1.04mm travel, at the longer end of the middle stroke range, and a relatively heavy 5N
operating force. These characteristics both enhance clarity, helping to prevent accidental operation, and impress with a premium operating feel.
The SKSUBBE010 also incorporates a pre-stroke design – a well-received feature of existing automotive TACT Switch™ products – helping to
prevent rattling* while integrated into the end product.

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Hikvision (China) launches new generation of AcuSense products
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Hikvision, the world’s leading provider of innovative security products and solutions, announces the launch of a new generation of
its signature AcuSense products, with significant updates. The latest Hikvision AcuSense devices are engineered with an upgraded
deep learning algorithm, which analyses live video streams and labels them as “human,” “vehicle,” or “other events.” Those labeled
as human and vehicle will trigger alarms for security staff, while other events such as rain drops, animals, or the movement of foliage,
for example, will be drastically disregarded. The result is a striking reduction in false alarms – now with an accuracy approaching
98%. In this way, security personnel can focus on genuine security issues and take action. Additionally, related videos are
automatically sorted by categories for easier search. Customers familiar with Motion Detection will appreciate the capabilities of
AcuSense technology as well. Taking users’ habits into full consideration, Hikvision designed AcuSense products to integrate human
and vehicle classifications with motion detection. More specifically, when motion is detected, the system analyses whether or not it
is associated with a human or a vehicle, and whether an alarm should be triggered. So, when users enable the motion detection
function, they can enjoy the same level of alarm accuracy afforded by Hikvision’s AcuSense technology.

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KLA (USA) Introduces New IC Metrology Systems
18
KLA Corporation announced the Archer™ 750 imaging-based overlay metrology system and the SpectraShape™ 11k optical critical
dimension metrology system for integrated circuit manufacturing. As each layer in a chip is constructed, the Archer 750 helps verify
that pattern features are correctly aligned to features on previous layers, while the SpectraShape 11k monitors the shapes of
three-dimensional structures, such as transistors and memory cells, to ensure they remain in spec. By identifying subtle variations in
pattern alignment or feature shape, these new metrology systems help IC manufacturers maintain strict control of the complex
processes required to bring high-performance memory and logic chips to market, for applications such as 5G, AI, data centers, and
edge computing. The Archer 750 overlay metrology system generates accurate and robust measurements of overlay error in the
presence of process variation, while achieving productivity levels previously seen only with scatterometry-based overlay systems.
This breakthrough system delivers accurate, fast feedback across a range of layers, helping lithographers identify process excursions
inline and improve overall patterning integrity, for faster yield ramp and more stable production of advanced logic, DRAM and 3D
NAND devices. The SpectraShape 11k CD and dimensional shape metrology system provides an unprecedented combination of
sensitivity and productivity, and accommodates materials, structures and wafer shapes that were previously inaccessible. With its
ability to measure advanced logic, DRAM and 3D NAND device features with high precision and speed, the SpectraShape 11k
enables quick identification of process issues and rigorous process monitoring during production.

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KYOCERA (Japan) Develops Silicon MEMS Resonator Production Technology
19
Kyocera Corporation announced that it has successfully developed a proprietary technology to produce silicon MEMS resonators for
the silicon MEMS market. Following Kyocera's July 2019 acquisition of 100% of the shares of Tikitin Oy, a Finnish venture company
possessing advanced MEMS technology, and the subsequent establishment of Kyocera Tikitin Oy, the company has achieved
outstanding frequency temperature coefficient and ESR characteristics*1 never previously attained with conventional quartz and
silicon products. Timing devices that generate stable frequencies at regular intervals are essential for the control and operation of
electronic circuits. Driven in part by widespread adoption of IoT and wearable devices, as well as the acceleration of ADAS and EV
technologies, the timing device market is expected to expand to 4.5 billion U.S. dollars by around 2030. Because demand is rising
rapidly for timing devices that are smaller, lower-profile, higher-frequency, and superior with regard to temperature resistance, silicon
MEMS resonators that meet these requirements will become widely used. Kyocera will begin mass producing high-value-added
silicon MEMS resonators in 2021, and will continue its technological development to address demand for further miniaturization,
lower profile, and higher frequency, thereby advancing the field of high-added-value timing devices.

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Lam Research (USA) Breaks New Ground in Etch Technology and Productivity for Chipmaking
Processes
20
Lam Research Corp. announced the launch of a completely transformed plasma etch technology and system solution, designed to
provide chipmakers with advanced functionality and extendibility required for future innovation. Lam’s ground-breaking Sense.i™
platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest
productivity, supporting logic and memory device roadmaps through the coming decade. Lam Research’s new Sense.i etch system
has industry-leading productivity and innovative sensor technology. With core technology evolved from Lam’s industry-leading
Kiyo® and Flex® process modules, the Sense.i platform enables the critical etch capabilities required to continue advancing
uniformity and etch profile control for maximizing yield and lowering wafer costs. As dimensions shrink and aspect ratios increase,
the Sense.i platform is designed to support future technology inflections. Powered by Lam’s Equipment Intelligence® technology,
the self-aware Sense.i platform enables semiconductor manufacturers to capture and analyze data, identify patterns and trends, and
specify actions for improvement. Sense.i also features autonomous calibration and maintenance capabilities that reduce downtime
and labor costs, and delivers machine learning algorithms that allow the tool to self-adapt to minimize process variations and
maximize wafer output.

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Lam Research (USA) Unveils Technology Breakthrough for EUV Lithography
21
Lam Research Corp. announced a dry resist technology for extreme ultraviolet patterning. By combining Lam’s deposition and etch
process leadership with strategic partnerships with ASML and imec, Lam is developing a new dry resist technology that will help to
extend the resolution, productivity, and yield of EUV lithography. Lam’s dry resist solutions offer significant EUV sensitivity and
resolution advantages and thus an improved overall cost for each EUV wafer pass. As EUV lithography systems are now being used
in high volume manufacturing by leading-edge chipmakers, further improvements to productivity and resolution will help extend
affordable scaling to future process nodes. Lam’s new dry resist application and development technologies will enable lower dose and
increased resolution, thereby increasing productivity and enlarging the exposure process window. Additionally, by utilizing five to
ten times less raw materials, Lam’s dry resist approach provides significant running cost savings to customers while also delivering
a more sustainable solution for environmental, social, and governance measures. Lam is engaged with multiple chipmakers in solving
key challenges of EUV lithography using this dry resist technology. The new dry resist technology enables continued scaling for
advanced logic and memory devices. Lam Research Corporation is a global supplier of innovative wafer fabrication equipment and
services to the semiconductor industry. As a trusted, collaborative partner to the world’s leading semiconductor companies.

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LG Display-(South Korea) supported Breakthrough in Next-generation Display Technology
22
LG Display, the world’s leading innovator of display technologies, announced the publication of its breakthrough in cutting-edge
display technology by world-renowned science journal Nature Communications. The research was carried out under an LG Display
support program by a team led by Professor of the Department of Materials Science and Engineering at Yonsei University, one of the
most prestigious universities in Korea. The paper published by Nature Communications examines the development of new display
photolithography technology that has overcome the limitations in realizing micron-resolution. The technology is expected to
implement nanoscale-level patterns for high resolution images even with the current display facilities for photolithography and soft
masks. It could also be applied to curved substrates, which raises hope for the technology to be used for various types of both LCD
and OLED display production processes in the future. LG Display has been operating its ‘Incubation Program’ in collaboration with
Yonsei University since 2015, aiming to advance the development of the display field. Through this program, the company is
dedicated to searching for ideas and conducting research on display technologies to turn them into realistic outcomes from a business
perspective. The outstanding paper on this occasion is just one of the achievements that the program has brought about.

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LG (South Korea) Announces V60 THINQ 5g With LG Dual Screen, Designed for A Truly
Mobile Future
23
LG Electronics introduced the LG V60 ThinQ 5G, the latest evolution of the iconic V series smartphone. Featuring 5G connectivity,
upgraded audio, video and photo capabilities and updated software experiences with a refined aesthetic. LG V60 ThinQ 5G is
designed for a mobile lifestyle and purposefully built to maximize productivity and entertainment. LG has equipped the LG V60
ThinQ 5G with its most advanced camera features and technologies yet, to offer next-level videography experiences. The LG V60
ThinQ 5G features two rear cameras and a time of flight sensor array, including a 64MP main camera lens for sharper, brighter images
regardless of lighting conditions. Also available is a 13MP wide angle lens for more agile and all-encompassing shots. For the first
time ever on an LG device, LG V60 ThinQ 5G supports 8K video recording for capturing videos in stunning 8K quality and
jaw-dropping detail. Alongside the latest camera and video innovations, LG’s latest smartphone continues the company’s legacy of
leveraging the very best technologies for superior audio performance. Four brand-new, high-performance microphones allow for
recording sounds from various directions to deliver realistic audio experiences no matter the surroundings. The device also offers
Voice Bokeh, a feature that separates users’ voices from background noise, allowing content creators to place more focus on the
subject while reducing excess noise.

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LG (South Korea) Announces V60 THINQ 5g With LG Dual Screen, Designed for A Truly
Mobile Future
24
LG Electronics announces the 2020 K series line-up – K61, K51S and K41S – all designed to deliver a first-class user experience
with upgraded cameras, multimedia functions and improved all-around performance without breaking the bank. Inheriting advanced
features first introduced in LG’s premium smartphones, the three new handsets represent compelling choices even in today’s
ultra-competitive market. Each phone in the line-up delivers a rear quad-camera array consisting of a high-resolution main camera,
wide angle lens, depth sensor and a macro lens, a first in the K series. The 48MP main lens in the top-of-the line K61 is the highest
resolution camera ever offered in an LG smartphone while the 32MP camera in the K51S also surpasses the pixel count of any
previous LG phone. With the ideal camera for any situation, capturing the magic of the moment has never been so easy or fun. The
K61 delivers a super sharp 6.5-inch 19.5:9 FHD+ Full Vision Display while the LG K51S features a slightly narrower 6.5-inch 20:9
HD+ Full Vision Display, both featuring an unobtrusive punch hole cut-out for the camera while the LG K41S features a 6.5-inch
20:9 HD+ Full Vision Display. All three 2020 K series phones are designed with cinematically proportioned displays with thinner
bezels than their predecessors to improve the immersive viewing experience. A robust 4,000mAh battery, DTS:X 3D Surround Sound
for realistic 7.1-channel experience with headphones and MIL-STD-810G standard for durability all add to the attractiveness of the
LG’s new K series for consumers eager to upgrade from their mediocre smartphone experience while staying within budget.

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Maxim (USA) Integrated’s ChipDNA PUF Key Protection Technology Enables Market’s Most
Secure IoT Microcontroller
25
Maxim Integrated’s ChipDNA PUF Key Protection Technology Enables Market’s Most Secure IoT Microcontroller. As IoT
applications continue to proliferate, large numbers of devices are being deployed in uncontrolled and hostile areas that make them
more vulnerable to physical attacks. These are more sophisticated than software threats like poor crypto implementations or
default password attacks. Designers want enhanced system defenses for their mission-critical applications where exposing secret
encryption keys can bring down networks, ruin reputations, end companies and even negatively affect people’s lives. The
MAX32520 with ChipDNA offers multiple layers of protection through its PUF technology, the industry’s most advanced
key-protection technology for safeguarding secrets used in cryptographic operations. It uses a tamper-proof PUF key for flash
encryption, secure boot for root-of-trust and serial flash emulation. Additionally, the physical security inherent in the PUF key
eliminates the need for a battery to actively destroy secret-key materials when under attack. Until now, the most-sensitive
applications have always required a battery to provide this highest level of secret-key protection.

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Micron (USA) Delivers World’s First Mass-Produced, Low-Power DDR5 DRAM for
High-Performance Smartphones
26
Micron Technology, Inc. announced it has delivered the world’s first low-power DDR5 DRAM in mass production to be used in
the soon-to-be-released Xiaomi Mi 10 smartphone. As Xiaomi’s memory technology partner, Micron provides LPDDR5 DRAM
with superior power efficiency and faster data access speeds to meet growing consumer demand for artificial intelligence (AI)
and 5G functionality in smartphones. Micron designed LPDDR5 DRAM to address the growing demand for higher memory
performance and lower energy consumption across a wide array of markets, including automotive, client PCs and networking
systems built for 5G and AI applications. LPDDR5 can provide more than a 20% reduction in power use compared to LPDDR4x
memory. The emergence of AI in more applications is driving the need for advanced memory solutions that enable faster and
more efficient access to data. Micron LPDDR5 delivers the speed and capacity needed to feed AI engines built directly into
mobile processors. These processors rely on high data rates from Micron’s internal LPDDR5 memory to power their machine
learning capabilities. Micron’s next-generation LPDDR5 memory is designed to meet the demands of 5G networks, which will
start deploying globally at scale in 2020. Micron LPDDR5 allows 5G smartphones to process data at peak speeds of up to
6.4Gbps, which is critical for preventing 5G data bottlenecks. This capability addresses other emerging technology needs, such
as those in autonomous vehicles that require a memory subsystem with a larger bandwidth to support real-time computing and
data processing.

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ON Semiconductor (USA) Announces Innovative New USB-C™ PD 3.0 Controllers with Advanced
Feature Sets and Enhanced Efficiency Chinese French German Japanese Korean
27
ON Semiconductor, driving energy efficient innovations, has announced a pair of novel devices that are fully compliant with the USB-C PD
3.0 standard. The FAN6390 adaptive charging controller brings ease of integration of the USB-C PD 3.0 programmable power supply
standard into systems while the NCP12601 is a highly integrated multi-mode flyback controller for rugged, high-performance, offline power
supplies such as adapters. The new devices greatly simplify USB-C PD 3.0 based power supply designs, provide higher level integration and
reliability, and enable higher power density design for applications such as smartphone chargers, AC-DC power adapters and auxiliary /
housekeeping power supplies for various electronic devices. ON Semiconductor’s continued leadership in power management and USB-C PD
solutions culminates with this first integrated synchronous rectifier and autonomous controller product for ease of secondary side system
design. The FAN6390 is the first in a family of USB-C PD 3.0 with PPS controllers to be offered by ON Semiconductor. “The trend of higher
capacity batteries requiring the same or faster charging times is accelerating the adoption of USB-C PD. The family of FAN6390 products
enables an impressive level of integration which will enhance industrial design and improve power density for travel adapters,” states Scott
Haddow, Senior Director and General Manager. The optimized architecture provides state machine-based operation for all features required
for PD 3.0 and PPS functionality lending to ease of end product design and manufacturing. The FAN6390 yields high efficiency through
industry leading synchronous rectifier FET driving techniques. The FAN6390 can also provide designers with flexibility and programmability
through trim optioning.

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Comtrend Launches New Wi-Fi 6 Networking Solutions Powered by ON Semiconductor
(USA) Chinese French Japanese Spanish
28
Comtrend, a leader in advanced networking equipment, has announced the introduction of a new Wi-Fi 6 product line in collaboration
with ON Semiconductor. The product family comprises the GRG-4281; a GPON dual-band gateway, and the WAP-5945; a wireless
access point/extender. Both products are enabled by ON Semiconductor’s unique 5x5 MIMO (Multi-Input and Multi-Output)
QSR5G-AX Plus chipsets, which offer the latest Wi-Fi 6 features to deliver superior speed, range, efficiency, security and reliability
to the connected home. The adoption of Wi-Fi 6 is underway and is expected to propagate rapidly. Modern bandwidth-intensive
applications continue to drive the demand for high performance in-home Wi-Fi coverage. Service providers require Wi-Fi 6-ready
customer premise equipment in anticipation of the next generation of client devices. Both GRG-4281 and WAP-5945 feature
ergonomic designs in small form factors. The GRG-4281 operates in dual-band dual-concurrent 2.4GHz and 5GHz bands, with a
peak PHY rate of 5.4Gbps. The integrated access device also supports VoIP and remote management utilities, such as TR-069, for
network provision and maintenance. The WAP-5945 is a compact yet robust extender that provides superior performance for
bandwidth demanding applications such as 4K video streaming, online gaming or cloud synchronization. Through a simple addition
it can also establish a Mesh network to further boost Wi-Fi coverage and performance.

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Qualcomm (USA) Demonstrates Future 5G Technologies That Enhance Performance, Efficiency,
and Enable New Use Cases
29
Qualcomm Technologies, Inc. is announcing a suite of new advanced 5G technology demonstrations, providing a glimpse of our rich
roadmap of 5G technologies. These demonstrations, some of which were unveiled during the company’s “What’s Next in 5G” press
event this morning, underscore Qualcomm Technologies’ commitment to the ongoing research and development of future 5G
technologies. In addition, they show our ability to enable the global mobile ecosystem and new vertical industries, support
next-generation services and business models, and create new use cases and experiences. The first phase of 5G has been focused on
providing new and better experiences on smartphone devices, but the next phase of 5G, spanning 3GPP Release 16, 17, and beyond,
will transform industries and use cases such as Industrial IoT, automotive, augmented reality, and more. This end-to-end system
operating in 3.5 GHz highlights key innovations to further improve the network capacity and user experience benefits of multi-user
massive MIMO and to enable of wide-area, low-latency services such as augmented reality. To demonstrate the future of 5G
wide-area networks and devices beyond 2020, this demo models the performance of new features such as full duplex MIMO and
accurate device positioning technologies, and introduces new data management approaches for IOT.

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Qualcomm (USA) Announces Breakthrough Qualcomm ultraSAW RF Filter Technology for
5G/4G Mobile Devices
30
Qualcomm Technologies, Inc. announced the Qualcomm® ultraSAW filter technology, another ground-breaking innovation in the
company’s industry-leading wireless technology portfolio that builds on the company’s legacy of developing breakthrough
technologies and enabling new experiences and expanding the mobile ecosystem. Radio frequency filters isolate radio signals from
the different spectrum bands that phones use to receive and transmit information. By achieving as much as 1 decibel improvement in
insertion loss, Qualcomm ultraSAW filters offer a higher performance solution compared to competing bulk-acoustic filters in the
sub-2.7 GHz frequency range. This allows for more power-efficient RF paths in 5G and 4G multimode mobile devices – and at a
lower cost point than competing commercial solutions with similar performance metrics for original equipment manufacturers.
Qualcomm ultraSAW serves as a key technology for driving the performance of Qualcomm Technologies’ cutting-edge RFFE
product portfolio and Qualcomm® Snapdragon™ 5G Modem-RF Systems further. We are integrating Qualcomm ultraSAW
technology across our product line including PA modules, front-end modules, diversity modules, Wi-Fi extractors, GNSS extractors
and RF multiplexers.

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Renesas Gas Sensor (Japan) Enables Safera’s Smart Cooking Sensor to Identify Bad Indoor Air
Quality Caused by Cooking
31
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced the ZMOD4410 gas sensor is
at the heart of the Safera Sense smart cooking sensor. The ZMOD4410 sensor enables the Safera Sense to determine when airborne
concentrations of volatile organic compounds and CO2 in users’ kitchens are at unhealthy levels. Safera selected the ZMOD4410
based on its combination of excellent accuracy, high reliability and low power operation for smart cooking applications. In addition
to monitoring VOC and CO2, the Safera Sense measures humidity levels and concentrations of airborne particles, which are easily
inhaled and absorbed in the lungs. Placed above the cooktop, the Safera Sense warns users of bad indoor air quality by sending alerts
to their smartphones and displaying a warning light on the device. The ZMOD4410’s combination of programmability, best-in-class
stability, and sensitivity in measuring VOCs makes it an excellent solution for a wide range of IAQ applications, including smart
thermostats, air purifiers, smart HVAC equipment, and other smart home devices. The ZMOD4410 is based on proven metal oxide
material and each sensor is electrically and chemically tested to ensure consistency from lot to lot, an important advantage for
manufacturers with long production runs. The ZMOD4410 devices are also highly resistant to siloxanes for superior reliability use in
harsh applications.

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STMicroelectronics (Switzerland) Announces New Audio Amplifier IC That Leverages the
Expertise of Alps Alpine
32
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced the
new FDA901 class-D audio amplifier IC, with a semiconductor design that incorporates the world-class audio design expertise of
Alps Alpine Co., Ltd., a major Japanese manufacturer of car audio equipment and information communication equipment. The new
chip aims to contribute to the creation of multi-function, high-fidelity car audio systems that fuse the high efficiency of class-D
amplifiers with the high-quality sound of ST’s class-AB amplifiers. The FDA901 features low residual noise, a low distortion ratio,
a flat frequency response achieved through feedback technology, and low EMI levels. It delivers high-purity audio performance by
minimizing dropout of audio signals. Equipped with a range of self-diagnostics and other advanced functions to measure real-time
speaker current and impedance, factors prized in the next-generation car audio market for diagnostics and to compensate for
loudspeaker imperfections, FDA901 is a class-D audio amplifier IC that simultaneously shows both extremely high-quality sound
and very innovative features that improve sound fidelity.

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STMicroelectronics (Switzerland) Reveals STM32CubeMonitor Runtime Variable Monitoring
and Visualization Tool with Multi-OS Flexibility
33
STM32CubeMonitor provides an extensive set of powerful features that simplify access to valuable insights. Leveraging its graphical
flow editor, users simply drag and drop items and features to build custom dashboards, and quickly add widgets such as gauges, bar
graphs, plots, with no need for programming. By taking advantage of the Node-RED open community, STM32CubeMonitor provides
an unlimited choice of extensions able to address a wide diversity of application types. Native support of multi-format displays helps
visualize the application behaviour on host devices in various form factors such as PCs, tablets, or mobiles. STM32CubeMonitor also
supports remote data acquisition, which enables users to monitor applications across a network and test multiple devices
simultaneously. In addition, real-time watching of variables with non-intrusive real-time write capability helps fine-tune applications
that cannot be stopped, such as motor-control applications. Two functional modes let users work in a way that best meets their needs.
The Design mode allows users to create and edit new monitoring user interfaces for specific applications, while the Operator mode
supports straightforward deployment of pre-built user interfaces to enable vivid demonstrations and field testing.

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Fully Integrated Wireless-Charging IC from STMicroelectronics (Switzerland) Maximizes
Power Transfer and Charging Efficiency with Low Bill of Materials
34
STMicroelectronics’ STWLC68 product family provides the best solution for wireless-charging applications with industry-leading
efficiency, highest power transfer, and safety. ST’s newest wireless-charging products operate as both a high-power receiver and a
transmitter enabling rapid power transfer and power sharing with FOD (Foreign Object Detection) and other important
ST-proprietary safety IPs. ST’s proprietary high-voltage technology, paired with excellent mixed signal design and highest quality
assurance, enables our customers to deliver cutting-edge wireless-charging products. The STWLC68 family of highly integrated
devices needs a very low external BoM (Bill of Materials), ideal for integration in a wide range of applications from small wearables
and appliances to larger ones like smartphones and tablets. Being WPC Qi 1.2.4 compliant, the STWLC68 is fully compatible with
all Qi certified devices in the market. With its fully integrated low-impedance, high-voltage synchronous rectifier and low drop-out
linear regulator, the STWLC68 achieves high efficiency and low power dissipation, critical for applications that are highly sensitive
to unnecessary heat build-up. An I2C interface allows firmware and platform parameters to be customized in the device and the
configuration can be programmed into the embedded OTP. Additional firmware patching improves the IC’s application flexibility. To
serve a wider range of applications, the STWLC68 family comprises solutions suitable for the range from over 20W to 5W and below,
such as the STWLC68JRH, customized to address lower-power designs.

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STMicroelectronics (Switzerland) Reveals Latest Innovation in Electric-Vehicle Energy
Management for Cleaner and Safer Mobility
35
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed
new battery-management technology that increases reliability, safety, driving range, and cost-effectiveness of electric vehicles. EVs
are predicted to reach cost parity with conventional combustion-engine vehicles before the end of this decade and overtake in sales
volume by 2038. ST, leveraging its technical capabilities to help car makers achieve these goals, has announced an advanced
battery-management system controller that features the industry’s best voltage accuracy for longer driving range and battery life, with
extra temperature-monitoring inputs for enhanced safety. The L9963 controller is the latest generation from ST’s BMS program,
which has already created advanced semiconductors for joint projects with major organizations developing EV batteries. These
include ongoing cooperation with LG Chem, begun in 2008, and the cooperation with Chinese R&D institute IMECAS and
EV-battery technology company EPOCH announced in 2017.

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New STSAFE Secure Element from STMicroelectronics (Switzerland) Provides Certified
Solution for Asset Identification and Brand Protection
36
STMicroelectronics introducing new features to secure data exchanges in increasingly aggressive contexts, the STMicroelectronics
STSAFE-A110 Secure Element protects consumer and industrial connected devices in the Internet of Things, preventing the
counterfeiting of genuine products by strictly assuring their authenticity. STSAFE-A110 offers state-of-the-art certified protection
and access to secure loading of cloud credentials to provide mass registration of IoT devices and ensure only authorized devices can
access online services. This critical secured personalization can be performed at a secure ST factory at no extra cost for yearly
quantities in excess of 5,000 units, drastically simplifying and protecting the manipulation of secret data during IoT devices
manufacturing. The device features an embedded secure operating system and is based on hardware that is certified to Common
Criteria Evaluation Assurance Level 5+. Each unit comes with a unique identification and X.509 certificates that aids secure device
connection. In addition, ST’s latest Secure Element is integrated with the STM32Cube development ecosystem to be quickly
incorporated in new STM32 designs requiring an authentication and secure-connection capability. The X-NUCLEO-SAFEA1
expansion board jump-starts development and is ready to use with any STM32 Nucleo development board and free
X-CUBE-SAFEA1 and X-CUBE-SBSFU software packages.

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Ultra-Low Power and Security for IoT Come First on New STM32L5 Microcontrollers
from STMicroelectronics (Switzerland)
37
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announces
ultra-low-power STM32L5x2 microcontrollers that emphasize security to assure better protected IoT-connected applications.
Operating at clock frequencies to 110MHz, the STM32L5-series MCUs start from the Arm® Cortex®-M33 32-bit RISC core with
Arm TrustZone® hardware-based security. First conceived for equipment such as desktops, mobile devices, and communication
infrastructure, trusted computing authenticates devices connected to a network by creating a protected execution environment for
cyber-protection and sensitive code (cryptography and key storage) that blocks attempts to corrupt devices or software. A second,
independent, execution environment allows for the running of untrusted code. To this foundation, ST adds the freedom to include or
exclude each I/O, peripheral, or area of Flash or SRAM from TrustZone protection, allowing sensitive workloads to be fully isolated
for maximum security. In addition, ST has engineered TrustZone to ensure support for secure boot, special read-out and write
protection for integrated SRAM and Flash, and cryptographic acceleration, including AES 128/256-bit key hardware acceleration,
public key acceleration (PKA), and AES-128 On-The-Fly Decryption, to protect external code or data. The STM32L5 also supports
active tamper detection and secure firmware installation. With this attention to security, the STM32L5 has been certified to PSA
Certified Level 2.

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New STSPIN32 BLDC Drivers from STMicroelectronics (Switzerland) Target
High-Voltage Applications
38
STMicroelectronics has introduced four new devices in the STSPIN32F0 motor-control system-in-package family, which simplify
the design of mains-powered home appliances and industrial equipment including corded power tools, drives, pumps, fans, and
compressors. The 250V STSPIN32F0251 and STSPIN32F0252, and 600V STSPIN32F0601 and STSPIN32F0602 combine
three-phase gate drivers and an STM32F0 Arm® Cortex®-M0 microcontroller to simplify high-voltage Brushless DC (BLDC) motor
drives. Popular control algorithms and application examples are provided, including single-shunt and three-shunt field-oriented
control (FOC), as well as traditional sensored single-shunt and 6-step sensor less control. The four devices are pin compatible,
allowing hardware and firmware to be reused in products for 110V AC and 250V AC operation. The ICs feature a standby mode to
help minimize power consumption in idle conditions. All gate drivers integrate bootstrap diodes and protection circuitry including
cross-conduction prevention and deadtime insertion. In addition, UVLO on both the lower and upper driving sections prevents the
power switches from operating in low-efficiency or dangerous conditions. There is also a patented fast-acting smart ShutDown
function for overload and overcurrent protection.

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STMicroelectronics (Switzerland) Launches Highly Integrated and Flexible Synchronous
DC/DC Converters for Smart Industrial Applications Reward & recognition
39
STMicroelectronics’ L6983 38V/3A synchronous DC/DC converters maintain high efficiency at all loads with a maximum value of
95% and are highly integrated with synchronous MOSFETs on-chip to save external components and simplify design. The L6983
converters have extremely low quiescent current of just 17µA. Low current consumption and low-noise variants are available. The
L6983C enters pulse-skipping mode when the load current is below 0.6A while the L6983N, suitable for noise-sensitive applications,
stays in PWM (pulse-width modulation) mode at all loads to minimize electromagnetic disturbances. With a wide input-voltage range
from 3.5V to 38V, L6983 converters are an efficient and flexible solution for 12V and 24V industrial bus-powered systems,
battery-powered equipment, decentralized intelligent nodes such as smart-building controllers, and always-on devices including
smart sensors. They can be ordered with 3.3V, 5V, or adjustable output voltage. All L6983 variants feature a Power-Good output pin
that can be used for power-up/power-down sequencing, enabling logic circuitry, or as a fault indicator. In addition, integrated
feedback-loop compensation, over-voltage protection, and soft-start circuitry simplify the design of a complete power-supply system.
The switching frequency is programmable from 200kHz to 2.2MHz. Frequency spread-spectrum operation and external frequency
synchronization ease EMC compliance. Arrow Electronics Earns Top Marks Again in 2020 Corporate Equality Index Arrow
Electronics has achieved a 100 percent score on the 2020 Corporate Equality Index, a leading benchmarking survey and report
measuring corporate policies and practices related to LGBTQ+ workplace equality.

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STMicroelectronics (Switzerland) Unveils Secure Cellular-Connectivity Offering for Industrial IoT
and Automotive Applications
40
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, in
collaboration with trusted partners, has created a complete ecosystem for securely connecting Industrial IoT and automotive systems
to cellular networks. Offering uncomplicated access to diverse networks and services worldwide, ST’s solution simplifies
connectivity for IIoT use cases such as remote condition monitoring and predictive maintenance, as well as connected-driving
services such as infotainment, vehicle diagnostics, and emergency assistance. ST provides secure hardware and software: a broad set
of robust industrial and automotive-qualified embedded SIMs, ready to work with industry-standard GSMA or proprietary bootstrap
profiles. Trusted partners Arkessa, Arm and Truphone, with millions of machine-to-machine device deployments and eSIM
activations, provide and operate device-onboarding and service-provisioning platforms. The provisioning services enable IoT devices
containing the eSIMs to connect automatically to cellular networks and benefit from flexible lifetime subscription management. Each
of ST’s appointed partner/operators can access hundreds of cellular networks of all types including 2G, 3G, 4G, LTE CAT-M, and
NB-IoT, in large numbers of territories worldwide. ST manufactures and personalizes all eSIMs securely at GSMA SAS-UP (Security
Accreditation Scheme UICC Production) accredited sites in Europe and Southeast Asia.

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Toshiba (Japan) Introduces Cutting-edge Generation SOI Process for RF Switches and Low-Noise
Amplifier ICs for 5G Smartphones
41
Toshiba Electronic Devices & Storage Corporation announced the development of “TaRF11,” the latest generation of Toshiba’s
advanced RF SOI process optimized for RF switches and low noise amplifiers in mobile devices such as 5G smartphones. In recent
years, the performance of smartphones and other mobile devices has improved, and they have migrated to higher wireless band
frequencies. Generally, the higher the frequency, the greater the signal loss between the antenna and the receiving circuit, driving a
need for LNA with enhanced characteristics that improve received signal quality by compensating for signal loss. Toshiba’s newly
developed TaRF11 process improves on the RF characteristics of TaRF10, the current generation SOI process technology. MOSFETs
for LNA fabricated with TaRF11 process achieve a minimum noise figure of 0.48dB @8GHz, a 0.3dB improvement over TaRF10.
Like the TaRF10, the TaRF11 process allows the LNA, RF switch, and control circuit to be fabricated on a single chip. Toshiba has
developed RF ICs, utilizing the fab of its subsidiary, Japan Semiconductor Corporation to apply the latest SOI-CMOS technology. By
handling all aspects of the production flow, from RF process technology development to design and manufacturing, Toshiba secures
a rapid product launch. Toshiba will continue to advance its cutting-edge TarfSOI™ process technology, toward securing further
performance improvements and to provide RF-switch and LNA ICs for Wi-Fi equipment; for 5G smartphones, which are scheduled
to expand from the 5GHz to the 7GHz band; and for Ultra-Wide Band applications that use the 7GHz to 10GHz frequencies.

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Toshiba’s (Japan) New 100V N-channel Power MOSFET Helps Reduce Power Consumption
of Automotive Equipment
42
Toshiba Electronic Devices & Storage Corporation has released “XK1R9F10QB,” a 100V N-channel power MOSFET suitable for
automotive 48V equipment applications such as load switches, switching power supplies and driving of motors. Shipments start. The
new product is the first in Toshiba’s new U-MOS X-H Series of MOSFET with a trench structure, and is fabricated with the
company’s latest generation process. Mounted on a low-resistance TO-220SM(W) package, it delivers industry-leading low
On-resistance, with a maximum On-resistance of 1.92mΩ, an approximate 20% reduction against the current “TK160F10N1L.” This
advance helps to reduce equipment power consumption. It also delivers reduced switching noise, due to optimization of capacitance
characteristics, which helps to reduce EMIof equipment. In addition, the threshold voltage width is tightened to 1V to enhance
switching synchronization when used in parallel.

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Toshiba (Japan) Adds New Low Power Consumption Brushed DC Motor Driver IC
43
Toshiba Electronic Devices & Storage Corporation has added "TB67H451FNG" to its line-up of low power consumption brushed DC
motor driver ICs in the popular pin-assignment HSOP8 package. The new IC features automatic return after over current detection.
Mass production shipments start. The new IC can drive brushed DC motors with a wide range of power supply, from 4.5V to 44V.
The numerous applications it supports include mobile devices and devices with 5V USB power supply, and industrial devices, home
appliances, printers, and banking terminals that require a high-power drive of up to 3.5A. Over current detection is a safety function
that prevents damage to the IC by turning off output when the output current exceeds the threshold level due to an overload or other
reason. While the current “TB67H450FNG” is a latch type device, where output is turned off indefinitely until the power is recycled
or the standby mode is reasserted, “TB67H451FNG” has an auto return function that resumes the operation without any external
control. When the over current condition subsides, operation returns to normal. More suitable type can be selected by application.

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Toshiba (Japan) Launches High-Current Photorelays in Small 6-pin SOP Package for Factory
Automation and Industrial Applications
44
Toshiba Electronic Devices & Storage Corporation has released high-current photorelays with increased on-state current in
small 2.54SOP6 packages for factory automation and industrial applications. The line-up includes “TLP3106A,”
“TLP3107A” and “TLP3109A,” which deliver off-state output terminal voltages ranging from 30 to 100V, and a steady
on-state current of 3.0 to 4.5A. Shipments start. The new photorelays integrate MOSFET devices fabricated with the latest
U-MOS process with a trench structure, which reduces on-resistance. This advance has made it possible to increase the
on-current rating by approximately 13 to 50% compared to current products in the market, contributing to easier replacement
of 1-Form-A mechanical relays in numerous DC and AC applications. The new devices will also contribute to improved
system reliability and to reducing the space needed for relays and relay drivers.

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Wirecard (Germany), SES-imagotag and wirecube enable mobile and cashless payment in one
of Europe’s busiest airports
45
Wirecard, SES-imagotag and wirecube enable mobile and cashless payment in one of Europe’s busiest airports. Munich
Airport is the first airport in Europe to offer a new mobile, cashless payment system in a retail location. The airport is playing
a key role in driving forward easy payments in the retail sector with a self-checkout. The solution was developed by Wirecard
in cooperation with SES-imagotag and wirecube, while eurotrade, a subsidiary of Flughafen München GmbH, laid the
cornerstone for its introduction at Munich Airport. Consumers can pay for items with their own smartphone directly at the
shelf using an electronic price tag, without having to wait in line at the checkout. Instead of paying via an app, the customer
pays via a mobile website, meaning that, unlike similar solutions in the European market, users do not need to download an
app beforehand. To shop and add items to the shopping cart, customers simply hold their smartphone in front of an
SES-imagotag digital price tag. The product is registered either via Near Field Communication or by QR code scan. After a
few seconds, the smartphone automatically opens the mobile web app by wirecube, where the customer can easily complete
the purchase. To do so, the customer can either scan their credit card via their smartphone’s camera function or enter their
credit card data manually. Alipay is also available as an alternative payment option.

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Applied Materials (USA) Receives Intel’s Preferred Quality Supplier
Award
46
Applied Materials, Inc. has been recognized by Intel as a recipient of a 2019 Preferred Quality Supplier Award. The PQS Award
recognizes companies like Applied that Intel believes have relentlessly pursued excellence and conducted business with
resolute professionalism. To qualify for PQS status, suppliers must exceed high expectations and uncompromising performance
goals while scoring at least 80 percent on an integrated report card that assesses performance throughout the year. Suppliers
must also achieve 80 percent or greater on a challenging continuous improvement plan and demonstrate solid quality and
business systems. Applied Materials, Inc. is the leader in materials engineering solutions used to produce virtually every new
chip and advanced display in the world. Their expertise in modifying materials at atomic levels and on an industrial scale
enables customers to transform possibilities into reality. At Applied Materials, their innovations make possible the technology
shaping the future.
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Fujifilm (Japan) wins the internationally prestigious “iF Design Awards”
for 10 products
47
FUJIFILM Corporation is proud to announce that it has been awarded the iF Design Award 2020, sponsored by the iF
International Forum Design (Hannover, Germany), for 10 of its products including mirrorless digital cameras, broadcast lenses
and cinema lens. Among them is the “FUJIFILM GFX100” mirrorless digital camera, equipped with a sensor boasting the
world's highest* 102-megapixel resolution, which has won the highest honor, iF Gold Award 2020. The latest achievements
reflect recognition of Fujifilm products’ design excellence as well as their advanced performance and exceptional operability.
The iF Design Award is a prestigious international design award launched in 1953, and is considered one of the top three global
design awards, alongside Germany's “Red Dot Design Award” and the United States' “the International Design Excellence
Awards”. This year, there were 7,298 entries from 56 countries and regions around the world. In developing a wide range of
products and services, Fujifilm not only pursues functionality and performance, but also strives to develop designs that bring
out the best of the advanced functionality and performance. With attention firmly on design excellence as one of the product
values, Fujifilm will continue to develop superior products, encouraged by the honor of having ten of its products chosen for
the iF Design Award out of countless entries from around the world.
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KYOCERA (Japan) Recognized as Supplier Engagement Leader by
Non-Profit CDP
48
Kyocera Corporation announced that it has been recognized as a Supplier Engagement Leader for its initiatives to reduce
greenhouse gas emissions throughout its supply chain. Based on an annual survey of suppliers conducted by CDP, an
international non-profit organization, the "Supplier Engagement Leader Board" lists companies recognized for outstanding
environmental records and targets; this is the fourth year of the survey. The Kyocera Group has set an environmental target of
reducing greenhouse gas emissions, including internal emissions and emissions from its supply chain, 30% from fiscal year
2013 levels by March 31, 2030. In particular, CDP praised Kyocera's comprehensive approach to reducing greenhouse gas
emission and named Kyocera as a leading company on the list. This year, CDP named 159 companies, just 3% of the total
candidates. The Kyocera Group will continue to contribute to the realization of a sustainable, low-carbon society by pursuing
new greenhouse gas reduction approaches beyond conventional frameworks. CDP (former name: Carbon Disclosure Project) is
an international non-profit organization established in the United Kingdom in 2000. Acting as a representative for institutional
investors across the globe, CDP encourages major companies worldwide to disclose information regarding climate change,
greenhouse gas emissions, water management, and other environmental concerns and evaluates such companies.
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LG Display (South Korea) receives Eye Comfort Display certification for automotive
P-OLED displays from TÜV Rheinland
49
LG Display, the world’s leading innovator of display technologies, announced that it has received Eye Comfort Display certification for its
automotive P-OLED displays from TÜV Rheinland, a global leader in independent inspection services. This is the first automotive display in the
industry to receive Eye Comfort Display certification. Using plastic substrates instead of glasses, LG Display’s P-OLED displays offer high
design flexibility to meet the driver’s needs while maintaining the excellent picture quality of OLED. With its newly-certified P-OLED
automotive displays, LG Display will help drivers experience greater eye comfort at any time, even when driving in strong sunlight or at night,
as well as meeting the growing needs for higher picture quality of automotive displays. The Eye Comfort testing process measures three
categories: light reflection ratio, blue light content, and picture quality. LG Display’s automotive P-OLED displays scored 0.22% in the light
reflection test. This figure is far below the threshold of 1%. The P-OLED displays also scored 23% for blue light content, which is less than half
of the standard of 50%. Additionally, this figure is just one third of the excess blue light emitted by automotive LCD panels. The company’s
P-OLED displays also met all testing criteria for picture quality, including color reproduction, contrast ratio, and brightness. LG Display began
mass-producing automotive P-OLED displays at its Gumi plant in Korea earlier this year. According to global research firm IHS, automotive
P-OLED display shipments are expected to reach up to 110,000 units this year and further grow by a whopping 80% on an annual basis to 4.6
million units by 2026.
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LONGi (China) achieves AAA ranking status in latest PV ModuleTech Bankability
Ratings
50
China’s top solar manufacturer - has been assigned AAA-Rated status by the market research division of leading London-based
PV-Tech, in the latest Q1 2020 release of the PV ModuleTech Bankability Ratings. LONGi is the first module supplier to
achieve AAA rating. The PV ModuleTech Bankability Ratings system uses a proprietary analytical model to establish
bankability scores and ratings, for all solar photovoltaic (PV) module suppliers, by combining both the manufacturing and
financial health of the companies. LONGi always attaches key importance to the company's sustainable development, and
having reliable and stable operations coupled with strong financial health. In recent years, LONGi has continuously
demonstrated its reliable contractual capabilities, and ability to respond to market changes.
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BloombergNEF Global PV Outlook rates LONGi (China) with the highest Altman-Z
score
51
. LONGi, the world’s leading solar module manufacturer, was rated with the highest Altman Z score of all the publically quoted
pureplay solar manufacturers. LONGi is also on BloombergNEF’s Tier 1 module maker list and one of the three largest module
manufacturers, by capacity. The Altman-Z score is a ratio indicator that reflects the financial health of a manufacturing
company. LONGi was listed first amongst all pure play PV companies worldwide with a score of 3.6, indicating strong
financial health. For years, LONGi has maintained leading risk control management and the ability to quickly respond to
market changes. The company operates on a philosophy of stable operation and sustainable development, and LONGi has
maintained a low asset-liability ratio around 50% through the years, which is amongst the lowest in the PV industry. The strong
return on assets, sustained profitability and proven bankability has been validated and recognized by the industry. Throughout
its operations, LONGi has demonstrated its sustainable development capabilities and responsibilities as a world leading global
solar technology company.
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ON Semiconductor (USA) Named One of the 2020 World’s Most Ethical Companies ®
by Ethisphere for the Fifth Time Chinese Japanese Korean
52
ON Semiconductor, driving energy efficient innovations, announces that it has been recognized by Ethisphere, a global leader in
defining and advancing the standards of ethical business practices, as one of the 2020 World’s Most Ethical Companies. In 2020,
132 honorees were recognized spanning 21 countries and 51 industries. The fourteenth class of honorees profoundly illustrate how
companies continue to be the driving force for improving communities, building capable and empowered workforces, and fostering
corporate cultures focused on ethics and a strong sense of purpose. ON Semiconductor has been recognized for five consecutive
years and is one of only four honorees in the Electronics & Semiconductors industry, underscoring its commitment to leading with
integrity and prioritizing ethical business practices. In addition to this, ON Semiconductor was recognized in 2019 as a Fortune 500
company, and was most recent recognized as both one of Barron’s 100 Most Sustainable Companies and on Newsweek’s America’s
Most Responsible Companies 2020 list. ON Semiconductor attributes this prestigious recognition to its longstanding and active
pursuit of the total alignment of all business objectives with exercising the utmost care and commitment to ethical stewardship,
across the entire organization of more than 35,000 employees in 34 countries. Starting with the CEO and the chief compliance and
ethics officer, spanning to the executive leadership team and to every employee, the principles of compliance, ethics and corporate
social responsibility are role-modeled from the top and instilled in each employee, in accordance with ON Semiconductor’s core
values of respect, integrity and initiative.
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ON Semiconductor (USA) Named to Barron’s 100 Most Sustainable Companies List
for Third Consecutive Year Chinese Japanese Korean
53
ON Semiconductor, driving energy efficient innovations, announced its third consecutive recognition on Barron’s 100 Most
Sustainable Companies List, moving up from No. 59 in 2019 to No. 15 this year. ON Semiconductor is committed to energy
efficiency by keeping sustainability at the forefront of its operations. From innovative technologies to its manufacturing processes,
the company’s approach to environmental sustainability is guided by its environmental occupational health and safety policy. The
company is passionate about making the world a greener place and has several long-standing programs in place. At the corporate
office, roughly nine tons of pollution are prevented annually through a vanpool program. Further, through a compressor and
vacuum system at the manufacturing site in Cebu, Philippines, the company has conserved 35,000 kilowatt hours of energy,
equating to approximately $77,000 USD in savings. Since 2016, the company’s normalized water consumption has decreased by
17.3 percent at its wafer fabrication operations and 10.5 percent at its assembly and test operations. In addition to Barron’s, ON
Semiconductor is also recognized on Newsweek’s America’s Most Responsible Companies 2020 list and has been recognized as
one of the World’s Most Ethical Companies® four years in a row for its sustainability efforts. To determine the Barron’s list,
Calvert Research and Management started with the 1,000 largest publicly traded companies by market value, then ranked each by
how they performed for five key constituencies including, shareholders, employees, customers, community and the planet.
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Rexel (France) sets new environmental targets and is ranked among the top companies
for the second straight year in the CDP “Climate Change A List”
54
Rexel, a worldwide expert in the multichannel professional distribution of products and services for the energy world, has set new
environmental targets and has seen its efforts to fight climate change recognized by its inclusion for the second straight year in the
CDP “Climate Change A List.” They are considering that energy control alone can absorb 40% of the reduction in greenhouse gas
emissions necessary to comply with the Paris Agreement on climate change, particularly in the building and industrial sectors, we
have a responsibility to act and to increase our stakeholders’ awareness, to the best of our abilities, for the construction of a
sustainable future.
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