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 Second Level
 Third Level
 Fourth Level
Fifth Level
February 14, 2017
F26L – CompactPCI® PlusIO SBC with Intel®
Atom Apollo Lake-I
Low-Power with Apollo Lake-I
 Intel E3900 series, 1.6 GHz, up to
four cores
 Power consumption from 6.5 to
12 W
 Excellent graphics
 Thermal supervision, watchdog
 Trusted Platform Module (TPM)
 From -40 to +85°C operating
temperature
3
Variety for Storage and I/O
 Up to 8 GB DDR3 ECC RAM, soldered
 mSATA and microSD card slots
 Side card connector for high flexibility and interface extensions
 Front I/O: 1 VGA, 2 Gb Ethernet, 2 USB 3.0
 Rear I/O: 2 Gb Ethernet, 4 PCIe x1, 4 USB 2.0
Long-Lasting Family Concept
 Form, fit, function successor of CompactPCI/PlusIO family
 Robust design and flexible integration in existing systems
 Same front I/O and side-card connector since 2006
 Extends Intel’s availability beyond the guaranteed 7 years
F26L – CompactPCI PlusIO SBC with Intel Atom Apollo Lake-I

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F26L – CompactPCI PlusIO SBC with Intel Atom Apollo Lake-I

  • 1. Textmasterformat bearbeiten  Second Level  Third Level  Fourth Level Fifth Level February 14, 2017 F26L – CompactPCI® PlusIO SBC with Intel® Atom Apollo Lake-I
  • 2. Low-Power with Apollo Lake-I  Intel E3900 series, 1.6 GHz, up to four cores  Power consumption from 6.5 to 12 W  Excellent graphics  Thermal supervision, watchdog  Trusted Platform Module (TPM)  From -40 to +85°C operating temperature
  • 3. 3 Variety for Storage and I/O  Up to 8 GB DDR3 ECC RAM, soldered  mSATA and microSD card slots  Side card connector for high flexibility and interface extensions  Front I/O: 1 VGA, 2 Gb Ethernet, 2 USB 3.0  Rear I/O: 2 Gb Ethernet, 4 PCIe x1, 4 USB 2.0
  • 4. Long-Lasting Family Concept  Form, fit, function successor of CompactPCI/PlusIO family  Robust design and flexible integration in existing systems  Same front I/O and side-card connector since 2006  Extends Intel’s availability beyond the guaranteed 7 years