Product Roadmap iEi 2017

Agenda
• 2018 Intel Solution Preview
– Coffee Lake: High Performance solution
– Gemini Lake : Low Power SoC solution
• 2016/2017 Intel solution
– Apollo Lake: Lowe Power SoC solution
• Current IEI Intel solution
– Skylake/Kaby Lake: High Performance solution
– Baytrail/Braswell : Low Power SoC solution

IEI Board Level Solutions Overview
IMB-xxxx
Micro-ATX
IMBA-xxxx
ATX
WAFER-xxx
3.5”
NANO-xxxx
EPIC
IEM-xxxx
ETX
KINO-xxxx
eKINO-xxxx
tKINO-xxxx
gKINO-xxxx
Mini-ITX
PM-xxxx
PC/104
PCIE-xxxx
SPCIE-xxxx
HPCIE-xxxx
PICMG1.3 SBC
WSB-xxxx
PICMG1.0
Full size SBC
PICOe-xxxx (PCI + PCIe)
PCISA-xxxx (PCI + ISA)
IOWA-xxxx (pure ISA)
Half size SBC
ICE-xxxx
COM Express
iQ7-xxxx
Q-Seven
NOVA-xxxx
5.25”
HYPER-xxxx
Pico-ITX
Industrial
Mother
Board
Single
Board
Computer
Embedded
Mother
Board
Computer
On
Module

IEI Board Level Solutions for Vertical Application
Wide TemperatureKINO-DALW2 NANO-ALW2 NANO-BTW2 WAFER-BTW2 iQ7-BTW2 ICE-BTW2-T10
ATM/POS/KioskIMB-H110 IMB-H810-i2 NANO-BT WAFER-BTW2 WAFER-BT
Manufacturing HPCIE-Q170 PCIE-Q170 IMBA-Q170-i2 IMBA-H110SPCIE-C236
Gaming gKINO-DMF KINO-DQM170 KINO-KBN/SE-i2 ICE-QM871 NANO-KBN/SE MPCIE-UART

COFFEE LAKE:
HIGH PERFORMANCE SOLUTION
2018 IEI Intel solution
5

Intel® Coffee Lake Platform Improvement

PCIE-Q370/SPCIE-C246
Gen8 Core i7/i5/i3
4 DDR4 UDIMM up to 64GB
VGA/iDP,DualGbE,PCIeMini
USB3.0,mSATA,SATA6GB/s,
iRIS-2400 (Opt.)
Computer
onModule
IEI Coffee Lake-S/H Roadmap
PICMG 1.3
SingleBoard
Computer
Industrial
Motherboard
Embedded
Board
IMBA-Q370/C246
Gen8 Core i7/i5/i3
DVI-I/DP++/iDP,
Dual GbE, M.2, USB 3.0,
mSATA, SATA 6GB/s,
ATX
NANO-QM370
Gen8 Mobile Core i7/i5/i3
2DDR4SODIMMupto64GB
EPIC
HPCIE-Q370/HPCIE-C246
Gen8 Core i7/i5/i3
2DDR4SODIMMupto64GB
VGA/iDP, Dual GbE,
PCIeMini,USB3.0,mSATA
SATA 6GB/s
PICMG 1.3 Half size
2018 Q2
Planning
Developing
Launched
KINO-DH130
Gen6 Core i7/i5/i3
2DDR4SODIMMupto64GB
DP++/iDP/eDP,DualGbE,
PCIeMini,M.2,11USBport,
mSATA, SATA 6GB/s
Mini-ITX

GEMINI LAKE:
LOWE POWER SOC SOLUTION
2018 Intel solution Preview
9

Gemini Lake Improvements
Intel (2017), Gemini Lake Entry Platform POR Rev 1.0, p.7-9

Embedded
Board
Industrial
Motherboard
Computer
onModule
IEI Gemini Lake Roadmap
Planning
Developing
Launched
WAFER-GL
Gemini Lake SoC CPU
1DDR4SODIMMupto16GB
Dual HDMI/iDP, Dual GbE,
PCIe Mini, M.2, USB 3.0,
eMMC 50, SATA 6GB/s
3.5”
2018 Q3
tKINO-GL
Gemini Lake SoC CPU
2DDR4SODIMMupto32GB
DP++/LVDS, Dual GbE,
SATA 6GB/s
Mini-ITX

APOLLO LAKE:
LOWE POWER SOC SOLUTION
2016/2017 Intel solution Preview
12

Intel IOT – Entry Roadmap
Intel (2015), Intel IOT - Entry Roadmap, p.5

Intel® Atom™ Processors Comparison
Feature Bay Trail-2013 Braswell-2015 Apollo Lake-I-2016
Process/BGAPackage
22 nm / 25x27 Type 3
0.594 mm pitch; 1170 pin count
14 nm / 25x27 Type 3
14 nm / 24x31 mm Type 3
Memory
2x64 LPDDR3 1067;
2x64 DDR3L 1333; 1x64 DDR3L
1333
2x64 LPDDR3 1600
2x64 DDR3L 1600
DDR3L @ 1867 + dual channel ECC
LPDDR3 up to 1867 MT/s (Adopt SKUs)
LPDDR4 up to 2400 MT/s
Memory support Max 8 GB
Graphics
Video Decode
Gen7; 4 Execution Units; 1080p60
streams possible; H264, MPEG2,
VC1, VP8
Gen8 Low Power; 16 Execution Units;
4K2Kp60 streams possible;
H.265/HEVC, H.264, MPEG2, MVC, VC-
1, WMV9, JPEG, VP8
Gen9 Low Power; 18 Execution Units
4K Codec Decode & Encode for HEVC,
H.264, VP8
Displayresolution
2 Independent Displays:
2560x1600@60Hz
(DP/eDP/VGA), 1920x1200,
2560x1440 (eDP),
3840x2160 (DP/HDMI)
2560x1440@60Hz (eDP),
3840x2160@30Hz (DP/HDMI)
1x Internal: eDP 1.3 (4096x2160@60Hz) /
MIPI DSI (2560x1600@60Hz);
2x External: DP 1.2a (4096x2160@60Hz) /
HDMI 1.4b (3840x2160@30Hz5)
Storageand I/O
Dual SATA2, 1 USB3, 3 USB2,
eMMC* 4.51
Dual SATA3; 3xUSB3, 1xUSB2 + 1xUSB3
OTG; eMMC 4.51
4x PCIe 2.0 (6 lanes); Dual SATA3; 8 USB
ports supports eMMC 5.0; 4 HSUART9; 3
SPI
CPUPerformance Up to 2.4 GHz (QC) Up to 2.4 GHz (QC) Quad Core1&5 (4C/4T) SoC up to 2.4 GHz
PowerGuideline
@70°C/TDP(W)SPEC@110°C
3-10W 4-6W
Adopted SKUs - Mobile 6W ~ Desktop
10W / IOTG SKUs ~ 6.5-13.5W
ExtendedTemperatureSKUs Yes (-40°C to 110°C) No Yes (-40°C to 110°C)
OSSupport
Windows 7, 8.1 & 10 Full, IoT
Core,WEC 2013; Linux; VxWorks;
Android
Windows 7, 8.1 & 10 Full; Android;
Linux
Windows 10, IoT Core; Linux; VxWorks;
Android
Bigger size
Bandwidth increase
Wide Temp.
Gen9 same as Skylake
Intel 557197_IOTG_Apollo_Lake_Dashboard_Rev1_9 P.8

Apollo Lake-I High
(Intel® Atom™ x7 Processor E3950)
4C @ ~2.0 (Burst), 1.6 (HFM) GHz CPU,
650 (Turbo) GFX,
DDR3L dual channel ECC 2x64 @ 1600 MT/s
Apollo Lake Mobile
(Intel® Pentium® Processor N4200)
800 (Turbo) GFX, DDR3L @ 1867 MT/s
Apollo Lake-M Family Apollo Lake-I Family
OSSupport
Windows Linux RTOS
Apollo Lake Mobile
(Intel® Celeron® Processor N3350)
650 (Turbo) GFX, DDR3L @ 1867 MT/s
Apollo Lake-I Intermediate
(Intel® Atom™ x5 Processor E3940 )
600 (Turbo) GFX,
DDR3L dual channel ECC 2x64 @ 1600 MT/s
Apollo Lake-I Entry
(Intel® Atom™ x5 ProcessorE3930)
2C @ ~1.8 (Burst), 1.3 (HFM) GHz CPU, 550 GFX,
DDR3L single channel ECC 1x64 @ 1600 MT/s
Apollo Lake SoC & Software Support
Android

Embedded
Board
Industrial
Motherboard
tKINO-AL
Apollo Lake SoC CPU
2DDR3LSODIMMupto8GB
DP++/eDP,
Dual GbE, PCIeMini,M.2,
PCIex1,USB3.0,SATA 6GB/s
Computer
onModule
IEI Apollo Lake Roadmap
Planning
Developing
Launched
NANO-AL
Apollo Lake SoC CPU
2DDR3LSODIMMupto8GB
HDMI/iDP/LVDS, Dual GbE,
eMMC 5.0 , SATA 6GB/s,
EPIC
WAFER-AL
Apollo Lake SoC CPU
DDR3LSODIMMupto8GB
VGA/LVDS/DP++,
DualGbE,PCIeMini,USB3.0,
eMMC 5.0,SATA 6GB/s,
3.5”
KINO-DAL
Apollo Lake SoC CPU
2DDR3LSODIMMupto8GB
VGA/HDMI/LVDS,
Dual GbE, PCIeMini,M.2,
PCIex1,USB3.0,eMMC5.0
SATA 6GB/s, 9~30V
Mini-ITX
iQ7-AL
Apollo Lake SoC CPU
DDR3LSODIMMupto8GB
Support ECC, LVDS/eDP/
DDI,GbE,USB3.0,
eMMC 5.0,SATA 6GB/s
Qseven™
ICE-AL-T10-W2
Apollo Lake SoC CPU
COM Express
Mini-ITX
2017 2H

►Launched Date: 2016 Feb./E
► Revision 1.1 predicted launched Date: 2017 Q4

►Predicted launched Date: 2017 Q4

►Predicted launched Date: 2017 Q4.

►Predicted launched Date: 2018 Q2.

SKYLAKE/KABY LAKE:
HIGH PERFORMANCE SOLUTION
Current IEI Intel solution
23

Intel® Skylake/Kabylake Platform Overview
2-Chip
LGA-1151 Socket
(Desktop & Workstation)
• CPU: 4/2 cores
• Graphic: GT2 (Gen 9)
• 65W/35W TDPs
2-Chip
BGA 1440
(Mobile)
• CPU: 4/2 cores
• Graphic:GT4e&GT2(Gen9)
• 45W/35W/25W TDPs
Single Package
BGA1356
(ULT)
• CPU: 2 cores
• Graphic: GT2(Gen9)
• 15W package TDPs
DDR4/3L
DDR4/3L
DDR4/3L
DDR4/3L
DDR4/3L
DDR4/3L
PCH
100 Series PCH 100 Series PCH

PCIE-Q170/SPCIE-C236
Gen6 Core i7/i5/i3
VGA/iDP,DualGbE,PCIeMini
USB3.0,mSATA,SATA6GB/s,
iRIS-2400 (Opt.)
IMBA-H110
Gen6 Core i7/i5/i3
HDMI/DVI/iDP,
Dual GbE, mini PCIe,USB 3.0,
mSATA, SATA 6GB/s
5 PCI,
Computer
onModule
IEI Skylake/Kaby lake Roadmap
PICMG 1.3
SingleBoard
Computer
Industrial
Motherboard
Embedded
Board
IMBA-Q170-i2
Gen6 Core i7/i5/i3
HDMI2.0 /DVI/VGA/iDP,
mSATA, SATA 6GB/s,
iRIS-2400
ATX
KINO-DQM170/DCM236
Gen6 Mobile Core i7/i5/i3
2DDR4SODIMMupto32GB
Triple HDMI/LVDS,
mSATA, SATA 6GB/s
Mini-ITX
NANO-ULT3
Skylake ULT CPU
2DDR4SODIMMupto32GB
HDMI/LVDS/iDP, Dual GbE,
PCIe Mini, USB 3.0, mSATA
SATA 6GB/s, eMMC 5.0
Heat Spreader
EPIC
HPCIE-Q170/HPCIE-C236
Gen6 Core i7/i5/i3
2DDR4SODIMMupto32GB
VGA/iDP, Dual GbE,
PCIeMini,USB3.0,mSATA
SATA 6GB/s
PICMG 1.3 Half size
IMB-H110
Gen6 Core i7/i5/i3
DVI/VGA/LVDS/iDP,
Dual GbE, mini PCIe,USB 3.0,
mSATA, SATA 6GB/s
10 COM, 2 PCI, 12 USB
Micro-ATX
tKINO-ULT3
Skylake ULT CPU
2DDR4SODIMMupto32GB
9~36VDCinput,HDMI/DP,HDMI
LVDSoreDP,DualGbE,eMMC5.0
PCIeMini,mSATA,SATA6GB/s
Mini-ITX
ICE-ULT3
Skylake ULT CPU
(Compact Size = 95 x 95)
DDR4SO-DIMMupto32GB
SATA 6Gb/s, USB 3.0, DDI
VGA, LVDS
COM Express
ATX
2016 Q2 2016 Q3
Planning
Developing
Launched
2016 Q4
KINO-AQ170
Gen6 Core i7/i5/i3
2DDR4SODIMMupto32GB
HDMI2.0/VGA/iDP/DP+HDMI,
mSATA, SATA 6GB/s
Mini-ITX
IMBA-C236-i2
Gen6 Core i7/i5/i3
HDMI2.0 /DVI/VGA/iDP,
mSATA, SATA 6GB/s,
iRIS-2400
ATX
KINO-DH110
Gen6 Core i7/i5/i3
2DDR4SODIMMupto32GB
HDMI/iDPI,DualGbE,
PCIeMini/M.2BKey,
USB3.0,SATA 6GB/s
Mini-ITX
WAFER-ULT3/ULT4
Skylake/Kabylake ULT CPU
1DDR4SO-DIMMupto16GB
Opt.onboard 8Gmemory
VGA/HDMI/LVDS/iDP,DualGbE,
PCIeMini,mSATA,SATA6GB/s
Heat Spreader
3.5”

►Launched Date: 2016 Nov.
►Support Kabylake-S CPU from 2017 July with BIOS update.

 Compatible Backplane:
-HPXE2-5S1-R10
-HPXE2-7S1-R10
►Launched Date: 2016 Nov.◊High-speed half-size PICMG 1.3 CPU card◊

►IMBA-Q170 launched Date: 2016 May
►IMBA-C2360 lunched Date: 2016 Sep.

►Launched Date: 2016 Dec.

►Launched Date: 2016 Nov.
►Support Kabylake-S CPU from 2017 May with BIOS update.

►Predicted launched Date: 2018 Q1
KINO-DH110
Mini-ITX Motherboard supports 14nm LGA1151 Intel® 6th Generation Core™
i7/i5/i3, Celeron® and Pemtium® processor, DDR4, Dual Independent Displays ,
Dual GbE LAN, M.2, USB 3.0, SATA 6Gb/s, HD Audio and RoHS

►Launched Date: 2016 Sep.

►KINO-DQM170 Launched Date: 2016 Nov.
►KINO-DCM236 Launched Date: 2017 Jan.
3 HDMI
(1x HDMI 2.0 support UHD + 2x HDMI 1.4)

►Predicted launched Date: 2017 Jun
►Sku with Kabylake-U CPU :Under developing

►Launched Date: 2016 Jul.
►Sku with Kabylake-U CPU :Under developing

►Predicted launched Date: 2017 Dec.

BRASWELL/BAYTRAIL :
LOW POWER SOC SOLUTION
Current IEI Intel solution
38

tKINO-BW
Braswell SoC CPU
2 DDR3L SODIMM up to 16GB
HDMI/DP/VGA/LVDS,
Dual GbE, PCIe Mini, USB 3.0,
mSATA, SATA 6GB/s
Mini-ITX
HYPER-BW
Braswell SoC CPU
Mini-HDMI, PCIe GbE,
M.2, USB 3.0, SATA 6GB/s
Pico-ITX
IEI Braswell RoadmapIndustrial
Motherboard
Embedded
Board
2016 Q3
Planning
Developing
Launched
WAFER-BW
Braswell SoC CPU
HDMI/LVDS, Dual GbE,
PCIe Mini, USB 3.0, mSATA
SATA 6GB/s, COM x6
Heat Spreader
3.5”
• R20 Revision plan:
– Implement workarounds solutions :
use LPC 1.8V from CPU and level
shifter in circuit to shift LPC 1.8V to
3.3V
–Using same super I/O IC ,embedded
controller and TPM module with LPC
3.3V support
– Target product launch date: 2018
Q2

WAFER-BT-i1
Bay Trail SOC CPU
DDR3L SODIMM up to 8GB
VGA/LVDS/iDP, Dual LAN,
USB 3.0, PCIe Mini,
SATA 3Gb/s, mSATA
iRIS-1010Heat Spreader
eKINO-BT
Bay Trail SOC CPU
VGA/ Dual LVDS, SATA,
Dual GbE, USB 3.0,
9V~27V DC, Battery solution
Mini-ITX
HYPER-BT
Bay Trail SOC CPU
VGA/iDP, GbE, USB 3.0,
SATA 3Gb/s, 100mm x 7.2mm
Heat Spreader Design
PICO-ITX
NANO-BT-i1
Bay Trail SOC CPU
DDR3 SODIMM up to 4GB
VGA/ HDMI/ LVDS,
SATA 3Gb/s, mSATA,
PCIe mini, USB 3.0, iRIS 1010
EPIC
KINO-ABT-i2
Bay Trail SOC CPU
VGA/HDMI/iDP,
Dual Intel GbE, USB 3.0,
SATA, iRIS-2400, ATX power
Mini-ITX
ICE-BT-T6
Bay Trail SOC CPU
DDR3L: SODIMM up to 8GB
Type 6 pin out
2 x DDI / LVDS, VGA
SATA, USB 3.0
KINO-DBT
Bay Trail SOC CPU
VGA/DVI/iDP,
Dual PCIe GbE, USB 3.0,
SATA, 12V DC-in
iQ7-BT
Bay Trail SOC CPU
DDR3L on-board 2GB
Q-seven Rev 2.0
1 DDI / LVDS, SATA, USB 3.0,
on-board SSD -40 °C ~85 °C
3.5’’ Com Express
Mini-ITX
Q-seven
PCISA-BT
Bay Trail SOC CPU
VGA/LVDS/iDP,
Dual GbE, USB 3.0, mSATA,
PCIe mini
PCI-ISA
WAFER-BTW2
Bay Trail SOC CPU
On board DDR3L up to 4GB
On board SSD
VGA/LVDS/iDP, Dual LAN,
USB 3.0, PCIe Mini, mSATA
-40 °C ~85 °C
3.5”
NANO-BTW2
Bay Trail SOC CPU
DDR3 SODIMM up to 8GB
VGA/ HDMI/ LVDS,
SATA 3Gb/s, mSATA,
PCIe mini
USB 3.0, -40 °C ~85 °C
EPIC
ICE-BT-T10
Gen
4
ATOM SOC CPU
DDR3L on-board 2GB
Type 10 pin out
2DDI / VGA ,SATA USB 3.0
on-board SSD
Com Express
ICE-BT-T10W2
Gen
4
ATOM SOC CPU
DDR3L on-board 2GB
Type 10 pin out
2DDI / VGA ,SATA USB 3.0
on-board SSD ,-40 °C ~85 °C
Com Express
2018 Q1
IEI Bay Trail Roadmap
Planning
Developing
Launched
WSB-BT
Bay Trail SOC CPU
DDR3LSODIMMupto8GB
VGA/LVDS/iDP,DualGbE,
PCIeMini
USB3.0,SATA 6GB/s
PICMG 1.0
PM-BT
Bay Trail SOC CPU
DR3L SO-DIMM up to 8GB
VGA//LVDS/iDP, GbE LAN,
PCIe Mini, mSATA,
SATA 6GB/s
PC/104+ (ISA+PCI)
PC/104

IEI Panel Solutions
Display Systems
(System Board + LCD)
Display Monitors
(LCD Display)
Healthcare System RISC-based System
A. Light Industrial Panel PC
- AFL3 IoT Flat Panel PC
- AfoBot Assistant Robot
A. Medical Panel PC
-POC series
(HIS/NIS PPC)
-BIS series
(Bedside infotainment)
-MPC (Mobile Medical Cart PC)
A. Light Industrial RISC
PPC
-IOVU series
B. Heavy Industrial Panel
PC
1. Industrial Panel PC
- PPC 37/51 series
-PPC-F series
2. Industrial Vertical Market
Panel PC
- UPC series
- SAILOR series
- IP69K INOX series
B. Heavy Industrial Monitor
-DM-F series
-LCD-KIT-F series
-Robot-TP series
B. Heavy Industrial RISC
PPC
-IOVU-F series
Solution I Solution II Solution III Solution IV

AFOLUX Gen 3 Panel PC
Fanless Entry
•Intel® 22nm Bay Trail
•Intel® 14nm Apollo Lake
Performance Grade
•LGA1150 Gen. 4th Intel® CoreTM /Pentium® /Celeron®
•Intel Gen. 6 Skylake ULT
21.5”
24”

AFL3 PPC Product Roadmap
W15”
1366x768
12.1”
1024x768
W10.1”
1280x800
W19”
1366x768
AFL3-W07A-BT
Intel® Celeron® N2807 Dual Core
AFL3-12A-BT
Intel® Celeron® J1900 Quad Core
W7”
1024x600
AFL3-W10A-BT
AFL3-W15B-H81 (smart fan)
LGA1150 Intel® CoreTM /Celeron®
8.4”
800x600
AFL3-08A-BT
W22”
1920x1080
AFL3-W15A-BT
AFL3-W15C-ULT3
Intel® skylake ULT
AFL3-W19C(F)-ULT3
Intel® skylake ULT
AFL3-12C-ULT3
Intel® skylake ULT SoC
Developing PlanningMP
AFL3-W22C-ULT3
AFL3-W22A-AL
Intel® Apollo Lake SoC
MP~ 2017 Q3/Q4
17”
1280x1024
AFL3-17C-ULT3
W24”
1920x1080
AFL3-W24C-ULT3
AFL3-W19A-AL
Intel® Apollo Lake SoC
2018

Fanless Skylake Intel® Core™ PPC
1. W15” / W19” /22” LCD
size
(AFL3-W15C-ULT3/AFL3-
W19C-ULT3/AFL3-W22C-
ULT3)
2. IP64 front panel
protection IPx1 rear cover
protection
3. High Flexibility
• E-Window design, easy for
function expansion
• 1D/2D barcode
• RFID module
• MSR Card Reader
Intel® 6th gen.
ULT processor
Q2, 2017

M.2 High Speed PCIe Storage
Key
Notch
ed Provided interfaces
ID pins
A 8–15 PCIe ×2, USB 2.0, I2
C and DP ×4
B 12–19
PCIe ×2, SATA, USB 2.0 and 3.0,
audio, UIM, HSIC, SSIC, I2
C
and SMBus
C 16–23
Reserved for future use
D 20–27
E 24–31
PCIe ×2, USB 2.0,
I2
C, SDIO, UART and PCM
F 28–35 Future Memory Interface (FMI)
G 39–46
Reserved for custom use (unused
in the M.2 specification)
H 43–50
Reserved for future use
J 47–54
K 51–58
L 55–62
M 59–66 PCIe ×4, SATA and SMBus
Support 10Gbps M-key
PCIe storage device!
M.2 Pin Definition:
Up to 10Gbps
Up to 6Gbps
PCIex4
SATA3
AFL3-WxxC-ULT3 with flexible storage options ,mSATA, 2.5”
HDD , and M.2 Mkey PCIe storage.

E-Window Expansion
• Multi-function expand, reduce
customization efforts
• Easy to maintenance
• PCIe mini interface with IO
bracket
• ATO assembly
(E-Window support after R12)

Model AFL3-2D-R10
1D/2D Image Engine Resolution :752×480 CMOS
I/O interface USB 2.0
Sym-bologies
2D
PDF417(Tax), Data Matrix
(ECC200,ECC000,050,080,100,140),
QR Code, etc.
1D
Code128, EAN-13(Merchandise), EAN-
8(cigar rete box), Code39(billing), UPC-
A, UPC-E, Coda bar, Interleaved 2 of 5,
ITF-6, ITF-14, ISBN(Book), Code 93,
UCC/EAN-128(ID), GS1 Data bar,
Matrix 2 of 5, Code 11, Industrial 2 of 5,
Standard 2 of 5, Plessey, MSI-Plessey,
etc.
1D/2D Barcode Scanning

AUPS Product Roadmap
AUPS
A10/A20-R10
Charge current 2A
2017Q3 Q2 2018
AUPS
B10/B20-R10
Charge current 2A
AUPS
C10/C20-R10
Charge current 2A
AUPS
D10/D20-R10
Charge Current MAX 3A
New
R20
new battery
evolution

Flat Bezel completely
Waterproof
DNV Certified
General Purpose Vertical Market
Heavy Industrial PPC
RISC
Android 4.2.2
PPC-F UPC SxxA IOVU-xxF
IP69K
Stainless Steel
INOX

PPC-F Product Roadmap
15”
1024x768
12.1”
1024x768
10.4”
1024x768
17”
1280x1024
PPC-F06B-BT
Intel® Celeron® N2807
PPC-F12B-BT
Intel® Celeron® J1900
5.7”
640x480
PPC-F10B-BT
PPC-F17B-BT
PPC-F15B-BT
8.0”
800x600
PPC-F08B-BT
W22”
1920x1080
W24”
1920x1080
19”
1280x1024
PPC-F17A-H81
LGA1150 Intel® CoreTM
PPC-F24A-H81-R20
PPC-F22A-H81
PPC-F19B-BT
MP~
PPC-F15A-H81
W19”
FHD
15.6”
FHD
2018
PPC-FW24C-CL
Intel® Coffee Lake
PPC-FW22C-CL
Intel® Coffee Lake
PPC-FW19C-CL
Intel® Coffee Lake
PPC-FW15C-CL/GL
Intel® Coffee Lake
PPC-F15C-CL/GL
Intel® Coffee Lake
PPC-F19C-CL
Intel® Coffee Lake
PPC-F12C-CL/GL
Intel® Coffee Lake
PPC-F17C-CL/GL
Intel® Coffee Lake

Vertical Market Product RoadmapMarinePPC/Monitor
S19A/S24A-QM87
-19”/24”
-Front IP66/Rear IP22
-Intel QM87 -isolation protection
SBOX-100-QM87
- Intel QM87
-isolation protection
S19M/S24M
-19”/ 24”
-multiple video input
-isolated AC/DC Power
UPC-V312-D525
-12.1” IP65
- Intel D525
UPC-V315-QM77
-15” IP65
- Intel QM77
UPC-F12C-ULT3
-12.1” IP66
- Intel skylake ULT
INOX-F15C-ULT3
-15” IP69K
- Intel skylake ULT
WaterproofPPCStainlessPPC
MP Q4, 2017
UPC-FW19A-CL
-18.5” IP66
-- Intel Coffee Lake
SBOX-100-CL
- Intel Coffee Lake
-isolation protection
UPC-F12B-AL
-12.1” IP66
- Intel Apollo Lake
2018

12.1” IP66 Waterproof PPC
 12.1’’ fanless panel PC with Intel® Skylake ULT
processor
 IP66 6-side protection with M12 I/O cover
 IP65 6-side protection with rubber sealed I/O
cover
 Built-in wireless 802.11 a/b/g/n/ac and Bluetooth
V4.0
 Operating temperature : -20°C ~ 60°C
 Flat glass PCAP touch with 6H hardness, resistive
touch window
UPC-F12C-ULT3
Type A
Type B

-40oC~60oC Extended Operation
(by project base)
• Normal Operating Temperature -
20oC~60oC
• Wide Operating Temperature
-40oC~60oC (with active heater)
– Panel (normal : -30oC~80oC)
– Touch (normal : -20oC~70oC)
– IC Component (normal : 0oC~70oC)
Cold Storage Industry Extreme Climate Renewable Energy Plant
Polyimide Kapton® Film
Heater Technology

15” Stainless IP69K PPC
INOX-F15C-ULT3
 15’’ fanless panel PC with Intel® Skylake ULT 3955U
processor
 IP69K high pressure, high temperature protection
 SUS304 stainless steel housing
 Operating temperature : -20°C ~ 50°C
 Flat glass PCAP touch with 6H hardness, resistive
touch window
 Accessible HDD Bay
 M12 connections

DM-F / LCD-KIT Product Roadmap
2018 H1MP~
17”
1280x1024
15”
1024x768
12.1”
1024x768
8.0”
800x600
6.5”
640x480
22”
1920x1080
19”
1280x1024
24”
1920x1080
DM-F22A
PCAP /9-36V DC, -10°C ~ 50°C
DM-F19A
PCAP/Resistive touch window
9-36V DC, -20°C ~ 60°C
DM-F17A
9-36V DC, -20°C ~ 60°C
DM-F15A
9-36V DC, -20°C ~ 60°C
DM-F12A
9-36V DC, -20°C ~ 60°C
DM-F08A
Resistive touch window
12V DC, -20°C ~ 60°C
DM-F65A
Resistive touch window
12V DC, -20°C ~ 60°C
DM-FW19A
18.5” PCAP/Resistive touch window
9-36V DC, -20°C ~ 60°C
DM-FW15A
15.6” PCAP/Resistive touch window
9-36V DC, -20°C ~ 60°C
LCD-KIT-F19A
PCAP/Resistive touch
-20°C ~ 60°C
LCD-KIT-F17A
-20°C ~ 60°C
LCD-KIT-F15A
-20°C ~ 60°C
LCD-KIT-F12A
-20°C ~ 60°C
DM-F24A-R20
PCAP /9-36V DC, -10°C ~ 50°C
DM-FW07A
7” PCAP touch window
9-36V DC, -20°C ~ 60°C

1. 12.1“~19” open frame monitor
2. VGA, DVI interface
3. Multiple touch screen selection:
resistive touch/resistive touch
window/PCAP touch
4. Optional 9-36V DC module
5. -20oC~60oC extended operation
temperature
6. Physical and software OSD
support
Parking System CNC Machine Vending Machine KIOSK
Open Frame Monitor
LCD-KIT-F series

Tablet Series
MP
2017
• Intel Celeron or i7
• 10.1” Panel
ICECARE-10W
MP
Planning
ICEROCK-08
• Intel ® Atom
• 8” Panel
• IP65
RuggedizedRuggedizedSemi-Rug
• Intel Atom N2800
• 10.4” Panel
ICEFIRE2
• Intel Celeron or i7
• 10.1” Panel
ICEROCK3 ICEROCK3
• Intel Core i5
7300U
• 10.1” Tablet
2018

HMI Series
MP 2017Q4
RuggedizedAndroid
IOBA-07F
• 7” Panel
• Cortex A9 DC 1GHz
• Rear I/O
• Android 5.1
IOBA-10F
• 10.1” Panel
• Cortex A9 QC 1GHz
• Rear I/O
• Android 5.1
2018 Q1
IOVU-10F-AD-WB
• 10.1” Panel
• Cortex A9 QC 1GHz
• Optional VOIP
Phone
•Android 5.1
2018 Q32018 Q2
• 12.1” Panel
• RK3399
A72+A53 1.8GHz
• Android 7.0
IOVU-12-A72
• 12.1” Panel
• RK3399
A72+A53 1.8GHz
• Android 7.0
IOVU-15-A72
• 12.1” Panel
• RK3399
A72+A53 1.8GHz
• Android 7.0
IOVU-17-A72
MP
Developing
Planning
2018 Q4
• 7” Panel
• Cortex A9 DC 1GHz
• Android 5.1
IOVU-07-A9

PDA Series
MP
2017
MP
Planning
RuggedizedRuggedizedSemi-Rug
• 5.3” TFT LCD 350 nits
• Cortex A53 1.5GHz CPU
• Android 5.0
• 3G/WiFi/RFID/GPS
• IP67
MODAT-532
Developing
• 5.5” TFT LCD
• MTK6750 Cortex
A53 CPU
• Android 7.0
• LTE/WiFi/RFID/GPS
MODAT-550
2018

SPEC _ MODAT-550
Item Description Item Description
CPU MTK Cortex A53 64 bit Octa-core 1.5GHz
(MT 6750)
OS Android 7.0
Memory 2 GB LPDDR3 ( 3 GB Optional)**
16 GB eMMC (64 GB Optional)**
Wireless RX AGPS / GPS / GLONASS
(MT 6625L)
Touch
Panel
Capacitance Touch panel
(5 points)
Extension
Functions
Barcode 1D/2D (Optional)**
LCM 5.5” 1920 x 1080 Full HD
300 cd/m2
View angle : H >= ± 85∘, V >= ± 85∘
Peripheral I/O 1 x Micro USB OTG
1 x 3.5 mm Earphone jack
1 x Mini SIM Slot
Camera 13 MP AF Back camera Temperature Operation : -10 ~ +50 °C
Storage: -20 ~ +60 °C
Sensors Gravity Sensor
Magnetic Sensor
Gyro sensor
Protection
grade
IP67
Drop 1.5m (MIL-STD-810-G)
Audio 0.5 W speaker Power source Battery 3900mA
5V 3A power adapter
WAN GSM ( 850,900,1800,1900)
WCDMA (2100, 1900, 850, 900)
4G FDD (Band 1,2,3,4,5,7,8,20)
TDD (Band 38,39,40,41b)
Wireless
connection
Wi-Fi 802.11 a/b/g/n (MT 6625L)
Bluetooth v4.0 (MT 6625L)
NFC (NXP - PN548)
Others 12 pin for UHF reader and barcode handle.
SPI / UART reserve.
Keys 1 x Power key
2 x Barcode key
** Option item.

ID - MODAT-550
MP schedule : 2018 / 07

Industrial Automation
• TANK Series
Wide Temp. & Multiple Expansion
• uIBX Series
Compact Size & Smart Mounting Design
• DPRC Series
DIN Rail & OLED Indicator Function
• HTB-100
Healthcare Terminal Box PC &
Compliant with IEC 60601-1 ed 3.1
• MVS series
multi PoE port & expansions
Embedded Systems Overview
• IDS Series
Digital Signage Player & Multiple Display
Retail
IoT Gateway
• ITG-AL
Multi LAN & COM port, expansion for
LPWA
Gaming
• IGS-CL
Expansions ,USB , multi displays

Industrial Automation Roadmap
80
PlanningDevelopingLaunched
Industrial Automation
Din-Rail
Compact Size
2017 Q3
TANK-871-Q170
* Gen6 Core i7/i5/i3
* 4GB DDR4 pre-installed
memory
* Triple display
* Support iRIS-2400
TANK-Skylake
2018 Q1
TANK-620-ULT3
* Gen6 3855U
* Multi com port (up to 14)
* Multi USB & Lan
* Reserve E-windows for
expansion
TANK-Skylake
2018 Q2
DRPC-130-AL
* Intel® Atom™ E3930
* Multi storage eMMC 5.0, SD
Card, & HDD
* Multi USB & COM Port
* On board SIM Slot
* PS-ON Signal
* IP40
DRPC-Apllo Lake
TANK-870e-H110
* Gen6 Core i7/i5/i3
memory
* Entry Level
TANK-Skylake
2017 Q4
DRPC-200-ULT3
* Gen 3855U
DRPC-Skylake
uIBX-260-GL
* GEL CPU
* Multi LAN Port & COM Port
uIBX-Skylake
DRPC-131-BW
* Intel Atom x5-E8000
• USB/COM
• VGA
DRPC-Braswell

The variety features of TANK Series
Only for TANK-760

TANK Series Matrix
TANK Series Matrix
Platform
Multiple PCI/PCIe
Expansions
Multiple
PCIe Mini
Multiple
COM Ports
Desktop
Sandy Bridge TANK-820-H61 TANK-720-Q67 -
Skylake
TANK-870-Q170
TANK-870e-H110
- TANK-620-ULT3
Mobile
Sandy Bridge - TANK-700-QM67 -
Haswell TANK-860-HM86 TANK-760-HM86 -
ATOM
Pineview TANK-800-ICH8M - -
Cedarview - - TANK-600-NM10
Bay Trial TANK-801-BT - -
Braswell - - TANK-610-BW

TANK-870-Q170 Application
Key Features
 Intel® Skylake Q170 chipset with 6th Gen CPU
 Triple independent display
 Rich high-speed I/O interfaces
 Great flexibility for hardware expansion
Application
 Factory Automation
 Machine Automation
 Production Line
 Machine Vision

Internal Power Connector
TANK-870-Q170
The TANK-870-Q170 provides the most convenient 4-pin internal power connector for add-on card
usage, adding more flexibility to the embedded system in industrial environment.
3.3A

Dual power input (12~24V) for different
application.
POE Expansion Card
TANK-870-Q170

Thermal Verification
i5-6500TE ( Base 2.3GHz/ Max 3.3GHz,
TDP=35W)
Testing point
Test condition Resul
t30°C 45°C 60°C
IEI TANK-870-
Q170
CPU
Temperat
ure
Frequenc
y
69°C~75°
C
2.9GHz
87°C~97°
C
2.9GHz
81°C~87°
C
2.3GHz
PASS
XXX company
Embedded
system
80°C~86°
C
2.3GHz
81°C~85°
C
1.5GHz
87°C~95°
C
800MHz
Fail
The TANK-870-Q170 is designed to operate in harsh factory environment with high performance. In high
temperature environment, particularly, its great fan-less cooling system allows stable operation and offers
highest level of failure tolerance.

Back Plane
TANK-870-Q170
2 Slot Model (2A) 2 Slot Model (2B) 4 Slot Model (4A) 4 Slot Model (4B)
Physical Slot PCIe x 16 PCIe x 16 PCIe x 16 PCIe x 16 PCIe x 16 PCI
Signal PCIe x 8 PCIe x 16 PCIe x 8 PCIe x 8 PCIe x 16 PCI
Slot Type PCIe x 16 PCI PCI PCI PCI PCI
Signal PCIe x 8 PCI PCI PCI PCI PCI
Part Number
I5 SKU I7 SKU
TANK-870-Q170i-i5/4G/2A-R10 TANK-870-Q170i-i7/4G/2A-R10
TANK-870-Q170i-i5/4G/2B-R10 TANK-870-Q170i-i7/4G/2B-R10
TANK-870-Q170i-i5/4G/4A-R10 TANK-870-Q170i-i7/4G/4A-R10
TANK-870-Q170i-i5/4G/4B-R10 TANK-870-Q170i-i7/4G/4B-R10
►Support Kabylake-S CPU from 2017 April with BIOS update.

CPU
LGA1151 socket supports Intel®
New Gen processor i7/i5 35W
Backplane
1 x PCIe x16 , 2 x PCI
1 x PCIe x16 , 1 x PCIe x4, 1 x PCI
3 x PCI
Chipset Intel® H110 (Desktop) Power Input 9~36V DC
System Memory
2 x 260 pin DDR4 SO-DIMM 4GB
pre install (system max:32GB)
Mounting Wall mount & Din-Rail
Hard Drive 1 x 2.5'' SATA 6Gb/s HDD Bay
Operating
Temperature
-20°C ~ 50°C with air flow (SSD),
10% ~ 95%, non-condensing
mSATA 1 x mSATA
Operating
Shock
Half-sine wave shock 5G, 11ms,
100 shocks per axis
USB 3.0 4
Operation
Vibration
MIL-STD-810G 514.6 C-1 (with SSD)
Ethernet 2 x LAN : RTL8111E controller Safety / EMC CE/FCC
RS-232/422/485 2 x on rear I/O (Reserve isolation 2.5KV)
Display 1 x VGA, 1 x HDMI
Resolution
VGA: Up to 1920 x 1200@60Hz
HDMI: Up to 4096×2160@24Hz
Wireless 1 x 802.11 a/b/g/n (optional)
Audio 1 x Line-out ; 1 x Mic-in
PCIe Mini
1 x Full Size (Support mSATA, co-lay
SATA2), 1 x Full Size
Specifications
TANK-870e-H110
MP : Q3, 2017
►Support Kabylake-S CPU

TANK-620-ULT3 Application
Key Features
 Intel® Skylake 6th Gen CPU
 Multiple COM ports (up to 14)
 Multiple USB & LAN
 Wide range temperature
Ticket Machine / ATM
 Barcode / Fingerprint
 IC Card / Credit card
 Cash / Ticket
 Lighting
MP : Q4, 2017

Specifications
TANK-620-ULT3
CPU Skylake 3855U 15W Display 2 x VGA, 1 x LVDS or 1 x VGA
Chipset SoC Audio 1 x mic in, 1 x speaker 2W
System Memory
1 x Onboard 4 GB
1 x DDR4 2133 SO-DIMM (system Max :
32GB)
PCIe Mini
1 x Full size (support mSATA, co-lay SATA)
1 x Full size
Hard Drive 1 x 2.5'' SATA 6Gb/s HDD/SSD Bay Wireless 1 x 802.11 a/b/g/n ( optional)
CFast 1 x CFast easy accessible (optional) Power Input 9~36V DC +/- 5%
NVRAM 1 Mb FRAM Others 1 x System reset, Power button
USB 3.0 4 Mounting Wall mount
USB 2.0 4
Operating
Temperature
-30°C ~ 70°C with air flow (SSD),
Ethernet
2 x RJ-45 LAN PCIe GbE by Intel® I210
controller
Operating Shock
100 shocks per axis
RS-232 6
Operation
Vibration
RS-232/422/485 8 with automatic flow control Safety / EMC CCC, CE (EuP & ErP), FCC
Digital I/O 8 bit Digital I/O , 4 bit input / 4 bit output
MP : Q4, 2017

Fully Integrated I/O
DPRC-130-AL
MP : Q1, 2018
DIM: 174 x 130 x 58.7 (mm)

Specifications
DPRC-130-AL
CPU
Intel® Atom™ E3930 on-board SoC (up to
1.8GHz, dual-core, TDP=6.5W)
Wireless 1 x 802.11b/g/n 1T1R (optional)
Chipset SoC TPM 1 x TPM 2.0 2 x 10 pin (optional)
System Memory
1 x 204-pin DDR3L SO-DIMM 2 GB pre-
installed (system max: 8GB)
PCIe Mini
1 x Full-size PCIe Mini slot
1 x Full-size PCIe Mini slot (supports mSATA,
colay with SATA)
Hard Drive 1 x 2.5'' SATA 6Gb/s HDD/SSD bay PS-On signal 2-pin terminal block
eMMC 1 x 8GB eMMC 5.0 support (optional) Power Input 3-pin terminal block: 12 V ~ 24 V DC
USB 3.0 4 Others
1 x Power Button, 1 x Reset Button, 1 x
AT/ATX Switch,
Ethernet
controller
Mounting DIN-Rail / Wall mounting
COM Port 4 x RS-232/422/485 (DB-9)
Operating
Temperature
-20 ~ 70 °C with air flow (SSD),
Digital I/O
8-bit digital I/O, 4-bit input/4-bit output
( programmable) DB-9
Operating Shock
100 shocks per axis
CAN BUS 1 x CAN BUS (DB-9)
Operation
Vibration
Display 2 x HDMI 1.4b Safety / EMC CCC, CE (EuP & ErP), FCC
SIM 1 x on board internal SIM slot MP : Q1, 2018

Front I/O
Top
DRPC-200-ULT3Fully Integrated I/O
MP : Q2, 2018
2 x RS-232, 2 x RS-232/422/485
VGA
HDMI
Antenna
PS-On
DIO
CAN Bus

Specifications
DRPC-200-ULT3
CPU
Intel Skylake Celeron 3855U/i5-6300U
TDP:15W
Wireless 1 x 802.11b/g/n/ac M.2 2230 (optional)
Chipset SoC TPM 1 x TPM 2.0 (on board optional)
System Memory
1 x 204-pin DDR4 SO-DIMM 4GB pre-
installed (system max: 16GB)
PCIe Mini
1 x M2. 2230/1630 (A&E key)
1 x Full size PCIe mini(support mSATA)
Hard Drive 1 x 2.5'' SATA 6Gb/s HDD/SSD bay PS-On signal 2-pin terminal block
USB 3.0 4 Power Input 3-pin terminal block: 9 V ~ 36 V DC
Ethernet
2 x RJ-45 LAN PCIe GbE by Intel® I211 &
I219LM controller
Others
1 x Power Button, 1 x Reset Button, 1 x
AT/ATX Switch,
COM Port
2 x RS-232 (DB-9 with isolation 2.5kV)
2 x RS-232/422/485 (DB-9 with isolation
2.5kV)
Mounting DIN-Rail / Wall mounting
Digital I/O 4-in/4-out w/2.5kV Isolation (DB-9)
Operating
Temperature
-20 ~ 60 °C with air flow (SSD),
Display 1 x VGA, 1 x HDMI Operating Shock
3 shocks per axis
SIM 1 x on board internal SIM slot
Operation
Vibration
Audio 1 x Jack (Line-out, Mic-in) Safety / EMC CCC, CE (EuP & ErP), FCC
MP : Q2, 2018

Machine Vision – Key Features
1. 4x PoE LAN(IEEE 1588/IEEE 802.3 af & at compliant)
2. 2x SATA3 support RAID Mode 0/1
3. 4x USB3.0
4. 2x GigE LAN (IEEE 1588 compliant,WOL)
5. PCIe Mini (colay mSATA)
6. PWM/DIO/Encoder Module
16-bit DIO Terminal block PNP/NPN isolated 2.5K VRMS
7. Wall and DIN rail mount

Specifications
MVS-100-Q170
MP : Q2, 2018
CPU
Skylake-S 35W
(i7-6700TE, i5-6500TE, i3-6100TE)
Skylake-S 65W (with Fan)
(i7-6700, i5-6500, i3-6100)
Chipset Q170
System Memory
2 x DDR4 2133 SO-DIMM pre-installed 4GB
(system max 32GB)
Hard Drive
2 x 2.5'' SATA 6Gb/s HDD/SSD Support RAID
0/1/5/10
USB
4 x USB 3.0, 2 x USB 2.0,
1 x USB 2.0 Internal Type A
Ethernet
controller
PoE
4-ch Intel® I210,IEEE 802.3af/at & IEEE 1588
compliant, 15.4W per channel / 30W for 1 & 2
channel (Note: selected by BIOS)
COM Port
2 x RS-232/422/485 (isolation)
2 x RS-232 (Optional)
Digital I/O 16-ch isolated 2.5KVRMS
Display VGA/HDMI
PCIe Mini
1 x Full size
1 x Full size (support mSATA)
Expansion
1 x PCIe x 16 (optional)
1 x PCI (Optional)
Remote Power PSON(2Pin)
Power Input 9 ~ 36 VDC +/- 5% AT/ATX Switch
Mounting Wall/DIN Rail Mount
Operating
Temperature
-20°C~+60°C
Operating Shock Half-sine wave shock 5G,11ms,3 shocks per axis
Operation
Vibration
MIL-STD-810F 514.5C-1
Safety / EMC CCC, CE (EuP & ErP), FCC, Class A

RS-232/422/485
w/ isolation
16-bit DIO PNP/NPN
光耦合隔離 2.5kV
DC 9~36V
(5pin terminal block)
PoE LED
HDD1/2 LED
2xLAN VGA
USB3.0
Mic-in/Line-out
Power Button
4xPoE
USB 2.0
PCIe x16 Expansion
(optional)
PSON (2PIN)
Machine Vision Box PC

DPDVI-DRS-232
• Front View : Dimension(W x D x H): 110x180x235.4 mm
• Short version Dimension(W x D x H): 86x180x235.4 mm
Machine Vision Box PC

TRANSPORTATION
SYSTEMS ROADMAP

Transportation system roadmap
2015 2016 Q42016 Q1
IVS-100-BT
* Intel® Atom E3826
Dual Core
* Dual Display Ports
* Built-in GPS & SIM Slots
* Optional 3G/Wi-Fi/UHF
* Compliant with E-Mark
IVS-Bay Trail
(In-Vehicle)
IRS-100-ULT3
* Gen6 Core i5 / Celeron
for Mobile, Dual Core
* Dual SIM Card / M12 LAN
* 24V DC/110 V DC
* EN-50155/EN-61373
IRS-Skylake
(Railway)
IVS-300-BT
* Intel® Celeron J1900
Quad Core
* 4 x PoE IEEE802.3af
* Optional 3G/Wi-Fi/Dead
Reckoning
IVS-Skylake
(In-Vehicle)
ITCS-100-H81
for Desktop, Dual Core
* 2 x 3.5‘’HDD bay SATA III
* 4 x RS-232/422/485 with
2KV isolated
ITCS-Haswell
(Transportation)
2017 Q2
IKARPC-07A-BT/A9
Dual Core
Freescale i.MX 6 Cortex,
Quad Core
* 7” sunlight readable LCD
* Built-in HSUPA/GPRS/
GSM/Bluetooth
* Support CAN 2.0/OBD-II
IKARPC-Bay Trail/Freescale
(In-Vehicle)
IVS-200-ULT2
for Mobile, Dual Core
* 4 x Intel® GbE LAN Ports
* 2 x PCIe Mini Slots
* Optional 3G/Wi-Fi
IVS-Broadwell
(In-Vehicle)
IKARPC-W10A-BT
Dual Core
* 10” TET LCD with
touchscreen
* Built-in HSUPA/GPRS/GSM
/Wi-Fi/Bluetooth/
CAN 2.0B/OBD-II
* Compliance with E-Mark
IKARPC-Bay Trail
(In-Vehicle)
TransportationSolution
IVS-300-ULT3
* Gen6 Core i5
* 4 x PoE IEEE802.3af
* Optional 3G/Wi-Fi/Dead
Reckoning
IVS-Skylake
(In-Vehicle)
IVS-110-AL
* Intel® Atom X5-E3930
Dual-core 1.8GHz
* Dual SIM Card
* 16 x Digital IO
* Support Android 6
Win 10 and Linux yecto
IVS-Apollo lake
(In-Vehicle)
2017 Q4~
IKARPC-05A-A53
* RK3368 Octa-core A53
1.5GHz
* Android 6.0
* IP 64 compliant front panel
* CAN 2.0/OBD-II
* On Board GPS
* 1x PCIe mini for 4G LTE
IKARPC Rock chip 3368
(In-Vehicle)
MP
Developing
Planning
TRS-100-ULT3
* Intel® Celeron® 3855U
Dual-core 1.6GHz
* IP 42 compliant front panel
* CAN 2.0/OBD-II
* On Board GPS
* 2 x PCIe mini for 4G / E-window
* Compliant with E-Mark,
EN50155, DNV
TRS Sky lake
(In-Vehicle, Railway, DNV)

Transportation series matrix
Platform
In-Vehicle
IKARPC Series
In-Vehicle
IVS Series
Railway
IRS Series
Transportation
ULT
Broadwell - IVS-200-ULT2 -
Skylake - IVS-300-ULT3 IRS-100-ULT3
Mobile Haswell - - - ITCS-100-H81
- TRS-100-ULT3 -
ATOM Bay Trial
IKARPC-07A-BT
IKARPC-10A-BT
IVS-100-BT
IVS-110-AL
-
Rockchip A53 IKARPC-05A-A53
Freescale A9 IKARPC-07A-A9 - -

5” IKARPC-05A-A53
Schedule: 2018Q2 MP

Item Description Item Description
CPU Rockchip RK3368 8 Core A53 OS Android 6.0
Memory 2GB LPDDR3
8GB eMMC
GPS On board GPS
Touch Panel Capacitance Touch panel
(4 points)
Extension I/O 1 x PCIe Mini slot (For LTE module)
1 x Wi-Fi module
LCD 5” 800*480
690 cd/m2 (Typ. 780)
(SPF-PH800480T024-ICC01_003)
Radio frequency
(Optional)
Wi-Fi 802.11 a/b/g/n + BT4.0 (AP62x2)
4G LTE (US/EU/Asia) – PCIe mini USB
LED
Indicators &
Buttons
1 x Power Key
3 x LED
(Power”Red “/ WiFi”Green” / GPS” blue”)
Reserve MIPI connector for Camera in put
Peripheral I/O 24 pin Connector’
• 2 x RS-232
• 1 x RS232/422/485
• 6 x DIO(3in / 3 out)
• 1 x Line out
• 1 x Mic in
2 x Antenna (GPS / LTE)
2 x USB 2.0 (1x OTG, 1x HOST) – On board
1 x Mini SIM Slot
1 x Micro SD Slot Max. 64GB
Sensors Gyroscope sensor (on boadrd) Temperature Operation : -10° ~ + 50 °C
Storage: -20 ~ + 60 °C
Power DC 9~30 V with ACC Ignition Protection grade IP65 Front panel
MILSTD-810G 514.5C-2
CE / FCC / E-mark / ErP
5” IKARPC-05A-A53 Specification

IKARPC-05A
MP schedule : 2018 / 04

TRS-100-ULT3-R10
MP schedule : 2018 Q4
Intel® Celeron® Processor 3855U Dual-core 1.6GHz (Kaby Lake Core i3/i5/i7)

Model TRS-100-ULT3-B-CE/4G-R10 TRS-100-ULT3-A-CE/4G-R10
Chassis
Color Blue C
Dimension(WxHxD) (mm) 235 x 160 x 65 (235 x 170 x 65)
Weight TBD
System fan Fanless
Construction Aluminum alloys
Motherboard
CPU Intel® Celeron® Processor 3855U Dual-core 1.6GHz (Kaby Lake Core i3/i5/i7)
System Memory 4GB On board Memory (Expandable to 8GB)
Communication
WLAN + Bluetooth M.2 slot Wi-Fi 802.11a/b/g/n/ac + BT (optional)
WWAN PCIe Mini, WCDMA/HSDPA/HSUPA (optional)
GPS PCIe Mini GPS (In-Vehicle model only UBlox) (optional)
Storage
HDD/SSD 1 x 2.5'' SATA 6Gb/s HDD/SSD Bay
mSATA / eMMC 1 x mSATA (PCIe Mini Slot, Signal form SATA2)
Others 1 x eMMC 5.0 8G (reserved)
I/O interface
Expansion slot
1 x Full/Half-size PCIe Mini slot (reserved for 3G/4G)
1 x Full/Half-size PCIe Mini slot (For mSATA or E-window or GPS)
1 x M.2 Slot (For Wifi + BT)
USB
4 x USB3.0 on board (Front x 2 , Rear x 2)
2 x USB2.0 1 x M12 [2 x USB2.0 signal]
Ethernet 2 x RJ45 PCIe GbE by Intel i210-AT 2 x M12 GbE by Intel i210-AT
COM Port
2 x RS-232/422/485 (Bios configuration)
2 x RS232 [Internal Pin Header]
CAN-bus / OBDII 1 x DB-9 CAN-bus / OBDII (2 ports)
DIO 1 x DB-9 (8 bit Digital I/O 4 in / 4 out "+5V")
Display
1 x VGA
1 x iDP [Internal Pin Header]
Audio 1 x Line out, 1 x Mic in [Internal Pin Header]
Button
1 x Power buttom
1 x Reset buttom [Hidden]
1 x Remote Power/Reset connector [2x2 pin]
Indicator 1 x HDD LED, 1 x Radio Frequency LED
SIM 1 x SIM slot (on board)
Power Power input
9 ~ 30V DC-in
1 x 4pin connector 1 x M12 connector [IVS-IO-A]
Reliablity
Power consumption TBD
Mounting Wall mount
OS
Operating Temperature -25°C ~ +60°C with air flow
Storage Temperature -25°C ~ +70°C
Humidity 10% ~ 95%, non-condensing
Protection IP 42
Certification CE / FCC / E-mark / EN50155 T1 / EN50121-3-2 / EN 45545-2 / DNV
Support OS Windows Embedded Standard 7 / Windows 10
Watchdog timer Software Programmable support 1~255 sec. System reset

TRS-100-ULT3-R10
RS232/422/485
Remote LAN LAN USB 2.0*2
USB 3.0*2
USB 3.0*2
RS232/422/485
E-WINDOW
DIO OBDII VGA
DC in

Product Roadmap iEi 2017

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