SPICE MODEL of 2SK3658 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3658 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3658 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K318T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for the SSM3K318T MOSFET manufactured by Toshiba. It includes summaries of simulations and measurements of the MOSFET's electrical characteristics such as transconductance, output characteristics, switching times, and reverse recovery characteristics. Model parameters are also provided for the MOSFET and its internal body diode in the PSpice model. Circuit simulations are shown to match measurements within a few percent error.
SPICE MODEL of SSM3K318T (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K318T (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6N24TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6N24TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4207 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4207 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4017 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4017 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6N24TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6N24TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3658 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3658 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K318T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for the SSM3K318T MOSFET manufactured by Toshiba. It includes summaries of simulations and measurements of the MOSFET's electrical characteristics such as transconductance, output characteristics, switching times, and reverse recovery characteristics. Model parameters are also provided for the MOSFET and its internal body diode in the PSpice model. Circuit simulations are shown to match measurements within a few percent error.
SPICE MODEL of SSM3K318T (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K318T (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6N24TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6N24TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4207 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4207 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4017 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4017 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6N24TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6N24TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4207 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4207 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK80K04K3Z (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary report of the simulation and characterization of a Toshiba MOSFET transistor (TK80K04K3Z) and its internal body diode. It includes the MOSFET model parameters, as well as simulation results and comparisons to measurements for key electrical characteristics such as transconductance, drain current, gate charge, switching times, and reverse recovery behavior. Simulation results show good agreement with measurements across various operating conditions and parameters.
SSM3K15AMFV (Standard Model) PSpice Model (Free SPICE Model)Tsuyoshi Horigome
This document provides a Spice model and characterization results for the MOSFET device SSM3K15AMFV manufactured by Toshiba. It includes:
1) A Spice model for the MOSFET and its internal body diode with parameters.
2) Simulation results characterizing the MOSFET's transconductance, Id-Vgs, Rds(on), output characteristics, and more.
3) Comparisons of the simulation results to manufacturer measurements showing good agreement.
4) Characterization of the internal body diode's forward and reverse recovery behavior.
SSM3K15AMFV (professional Model) PSpice Model (Free SPICE Model)Tsuyoshi Horigome
This document provides a device modeling report for a MOSFET (SSM3K15AMFV) manufactured by Toshiba. It includes the SPICE model parameters for the MOSFET and its internal body diode. Simulation results show characteristics such as transconductance, output curves, gate charge, switching times and reverse recovery matching measurements. The report also details the SPICE subcircuit models used to simulate the MOSFET and diode.
SPICE MODEL of SSM6J212FE (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6J212FE (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
2SK4017 (Professional Model) PSpice Model (Free SPICE Model)Tsuyoshi Horigome
This document provides a device modeling report for a TOSHIBA 2SK4017 MOSFET. It includes the SPICE model, equivalent circuit diagrams, simulation results comparing measurements and simulations, and characterization of key parameters like transconductance, drain current, switching time, and more. The body diode and ESD protection diode models are also included.
SPICE MODEL of SSM3J328R (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J328R (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J130TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J130TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J129TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J129TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J129TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J129TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J130TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J130TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8065-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8065-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8303 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary report of the SPICE modeling and simulation results for the TPCP8303 power MOSFET and its internal body diode and ESD protection diode manufactured by Toshiba. It includes 14 pages describing the MOSFET model parameters and simulation results for various static and dynamic characteristics along with comparisons to measurement data. Simulation results are provided for the forward and reverse characteristics of the internal body diode and the zener voltage characteristic of the ESD protection diode.
SPICE MODEL of 2SK2615 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2615 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK80K04K3Z (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK80K04K3Z (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J328R (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J328R (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6J212FE (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary report of the device modeling for a power MOSFET and its components. It includes SPICE models and simulation results for the MOSFET's electrical characteristics like transconductance, drain current, gate charge, switching time and body diode characteristics. The simulations show good agreement with measurement data within less than 5% error. Circuit schematics and simulation results are provided to validate the models.
This study examined the psychological effects of imagined one-pound weight gain or loss. Tests were conducted to observe correlations between imagined weight change and confidence levels, as well as compare confidence levels between male and female participants. The results showed a significant but weak positive correlation between imagined weight loss and increased confidence, and a significant but weak negative correlation between imagined weight gain and decreased confidence. No significant differences were found between male and female confidence levels for imagined weight gain or loss.
The document discusses the benefits of exercise for mental health. Regular physical activity can help reduce anxiety and depression and improve mood and cognitive function. Exercise causes chemical changes in the brain that may help protect against mental illness and improve symptoms for those who already suffer from conditions like anxiety and depression.
SPICE MODEL of 2SK4207 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4207 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK80K04K3Z (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary report of the simulation and characterization of a Toshiba MOSFET transistor (TK80K04K3Z) and its internal body diode. It includes the MOSFET model parameters, as well as simulation results and comparisons to measurements for key electrical characteristics such as transconductance, drain current, gate charge, switching times, and reverse recovery behavior. Simulation results show good agreement with measurements across various operating conditions and parameters.
SSM3K15AMFV (Standard Model) PSpice Model (Free SPICE Model)Tsuyoshi Horigome
This document provides a Spice model and characterization results for the MOSFET device SSM3K15AMFV manufactured by Toshiba. It includes:
1) A Spice model for the MOSFET and its internal body diode with parameters.
2) Simulation results characterizing the MOSFET's transconductance, Id-Vgs, Rds(on), output characteristics, and more.
3) Comparisons of the simulation results to manufacturer measurements showing good agreement.
4) Characterization of the internal body diode's forward and reverse recovery behavior.
SSM3K15AMFV (professional Model) PSpice Model (Free SPICE Model)Tsuyoshi Horigome
This document provides a device modeling report for a MOSFET (SSM3K15AMFV) manufactured by Toshiba. It includes the SPICE model parameters for the MOSFET and its internal body diode. Simulation results show characteristics such as transconductance, output curves, gate charge, switching times and reverse recovery matching measurements. The report also details the SPICE subcircuit models used to simulate the MOSFET and diode.
SPICE MODEL of SSM6J212FE (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6J212FE (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
2SK4017 (Professional Model) PSpice Model (Free SPICE Model)Tsuyoshi Horigome
This document provides a device modeling report for a TOSHIBA 2SK4017 MOSFET. It includes the SPICE model, equivalent circuit diagrams, simulation results comparing measurements and simulations, and characterization of key parameters like transconductance, drain current, switching time, and more. The body diode and ESD protection diode models are also included.
SPICE MODEL of SSM3J328R (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J328R (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J130TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J130TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J129TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J129TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J129TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J129TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J130TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J130TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8065-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8065-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8303 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary report of the SPICE modeling and simulation results for the TPCP8303 power MOSFET and its internal body diode and ESD protection diode manufactured by Toshiba. It includes 14 pages describing the MOSFET model parameters and simulation results for various static and dynamic characteristics along with comparisons to measurement data. Simulation results are provided for the forward and reverse characteristics of the internal body diode and the zener voltage characteristic of the ESD protection diode.
SPICE MODEL of 2SK2615 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2615 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK80K04K3Z (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK80K04K3Z (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J328R (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J328R (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6J212FE (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary report of the device modeling for a power MOSFET and its components. It includes SPICE models and simulation results for the MOSFET's electrical characteristics like transconductance, drain current, gate charge, switching time and body diode characteristics. The simulations show good agreement with measurement data within less than 5% error. Circuit schematics and simulation results are provided to validate the models.
This study examined the psychological effects of imagined one-pound weight gain or loss. Tests were conducted to observe correlations between imagined weight change and confidence levels, as well as compare confidence levels between male and female participants. The results showed a significant but weak positive correlation between imagined weight loss and increased confidence, and a significant but weak negative correlation between imagined weight gain and decreased confidence. No significant differences were found between male and female confidence levels for imagined weight gain or loss.
The document discusses the benefits of exercise for mental health. Regular physical activity can help reduce anxiety and depression and improve mood and cognitive function. Exercise causes chemical changes in the brain that may help protect against mental illness and improve symptoms for those who already suffer from conditions like anxiety and depression.
The document discusses style choices in music videos and their intended effects. It notes that showing lots of skin is meant to attract the male gaze, while boots add a sense of power and relate to tribal/hunter themes. Messy hair gives an edgy feel and also relates to the audience's style. Personalized jackets give the artist identity and allow audience recognition, connecting the music to the artist. Pictures of animals on jackets suggest the band is a bit wild. Colors, fabrics and hair styles are chosen to appeal to audiences, fit genres and artist images, and reflect the feel of the music.
The document discusses speciation and the formation of new species. It defines key terms like allele frequency, gene pool, and reproductive isolation. It describes several mechanisms by which reproductive barriers can form between populations, including geographic, temporal, and behavioral isolation. Speciation occurs when genetic changes result in lineages that can no longer successfully interbreed. The document provides examples of allopatric speciation driven by geographic isolation, as well as pre- and post-zygotic barriers that reduce gene flow and lead to speciation.
This document discusses human evolution and provides learning objectives related to dating methods, major anatomical features of primates, and trends in hominid evolution. It describes how radioactive dating of rocks and fossils can determine ages and discusses isotopes like carbon-14, potassium-40, and uranium that are used. Key anatomical primate features include grasping limbs and stereoscopic vision. Major hominid lineages discussed include Ardipithecus, Australopithecus, and various Homo species. The incompleteness of the fossil record results in uncertainties about the exact relationships between hominid species.
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8057-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8057-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8063-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a 14-page report summarizing the simulation and measurement results of various electrical characteristics of the MOSFET transistor TPCA8063-H manufactured by Toshiba. The report includes model parameters, transconductance characteristics, Vgs-Id characteristics, Rds(on) characteristics, gate charge characteristics, capacitance characteristics, switching time characteristics, output characteristics, forward current characteristics, and reverse recovery characteristics. Simulation results are presented and compared to measurement data with percent error calculations.
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6J409TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6J409TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ668 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ668 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J132TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary of SPICE modeling parameters for a TOSHIBA SSM3J132TU power MOSFET and its internal body and ESD protection diodes. It includes 14 pages describing the MOSFET and diode models, with simulation results comparing measurements to modeled characteristics including transconductance, drain current, gate charge, switching time, and reverse recovery. Circuit schematics and simulation results are provided to validate the SPICE models against real-world device measurements.
SPICE MODEL of TPCA8064-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8064-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ618 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ618 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8303 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8303 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM4K27CT (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM4K27CT (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2615 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2615 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
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This document provides an inventory update of 6,747 parts at Spice Park as of April 2024. It lists the part numbers, manufacturers, and quantities of various semiconductor components, including 1,697 Schottky rectifier diodes from 29 different manufacturers. It also includes details on passive components, batteries, mechanical parts, motors, and lamps in the inventory.
The document provides an inventory update from April 2024 of the Spice Park collection which contains 6,747 electronic components. It includes tables listing the types of semiconductor components, passive parts, batteries, mechanical parts, motors, and lamps in the collection along with their manufacturer and quantities. One of the semiconductor components, the general purpose rectifier diode, is broken down into a more detailed table with 116 entries providing part numbers, manufacturers, thermal ratings, and remarks.
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The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 electronic components. It lists the components by type (e.g. semiconductor), part number, manufacturer, thermal rating, and quantity on hand. For example, it shows that there are 621 general purpose rectifier diodes from manufacturers such as Fairchild, Fuji, Intersil, Rohm, Shindengen, and Toshiba. The detailed four-page section provides further information on the first item, general purpose rectifier diodes, including 152 individual part numbers and specifications.
This document discusses circuit simulations using LTspice. It describes driving a circuit simulation by inserting a 250 ohm resistor between the output terminals. It also describes simulating a 1 channel bridge circuit where the DUT1 and DUT2 resistors are both set to 100 ohms and the input voltage is set to either 1V or 5V.
This document discusses parametric sweeps of external and internal resistance values Rg for circuit simulation in LTspice. It also references outputting a waveform similar to a report on fall time characteristics for a device modeling report with customer Samsung.
UiPath Test Automation using UiPath Test Suite series, part 5DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 5. In this session, we will cover CI/CD with devops.
Topics covered:
CI/CD with in UiPath
End-to-end overview of CI/CD pipeline with Azure devops
Speaker:
Lyndsey Byblow, Test Suite Sales Engineer @ UiPath, Inc.
Full-RAG: A modern architecture for hyper-personalizationZilliz
Mike Del Balso, CEO & Co-Founder at Tecton, presents "Full RAG," a novel approach to AI recommendation systems, aiming to push beyond the limitations of traditional models through a deep integration of contextual insights and real-time data, leveraging the Retrieval-Augmented Generation architecture. This talk will outline Full RAG's potential to significantly enhance personalization, address engineering challenges such as data management and model training, and introduce data enrichment with reranking as a key solution. Attendees will gain crucial insights into the importance of hyperpersonalization in AI, the capabilities of Full RAG for advanced personalization, and strategies for managing complex data integrations for deploying cutting-edge AI solutions.
Best 20 SEO Techniques To Improve Website Visibility In SERPPixlogix Infotech
Boost your website's visibility with proven SEO techniques! Our latest blog dives into essential strategies to enhance your online presence, increase traffic, and rank higher on search engines. From keyword optimization to quality content creation, learn how to make your site stand out in the crowded digital landscape. Discover actionable tips and expert insights to elevate your SEO game.
Building Production Ready Search Pipelines with Spark and MilvusZilliz
Spark is the widely used ETL tool for processing, indexing and ingesting data to serving stack for search. Milvus is the production-ready open-source vector database. In this talk we will show how to use Spark to process unstructured data to extract vector representations, and push the vectors to Milvus vector database for search serving.
Cosa hanno in comune un mattoncino Lego e la backdoor XZ?Speck&Tech
ABSTRACT: A prima vista, un mattoncino Lego e la backdoor XZ potrebbero avere in comune il fatto di essere entrambi blocchi di costruzione, o dipendenze di progetti creativi e software. La realtà è che un mattoncino Lego e il caso della backdoor XZ hanno molto di più di tutto ciò in comune.
Partecipate alla presentazione per immergervi in una storia di interoperabilità, standard e formati aperti, per poi discutere del ruolo importante che i contributori hanno in una comunità open source sostenibile.
BIO: Sostenitrice del software libero e dei formati standard e aperti. È stata un membro attivo dei progetti Fedora e openSUSE e ha co-fondato l'Associazione LibreItalia dove è stata coinvolta in diversi eventi, migrazioni e formazione relativi a LibreOffice. In precedenza ha lavorato a migrazioni e corsi di formazione su LibreOffice per diverse amministrazioni pubbliche e privati. Da gennaio 2020 lavora in SUSE come Software Release Engineer per Uyuni e SUSE Manager e quando non segue la sua passione per i computer e per Geeko coltiva la sua curiosità per l'astronomia (da cui deriva il suo nickname deneb_alpha).
AI 101: An Introduction to the Basics and Impact of Artificial IntelligenceIndexBug
Imagine a world where machines not only perform tasks but also learn, adapt, and make decisions. This is the promise of Artificial Intelligence (AI), a technology that's not just enhancing our lives but revolutionizing entire industries.
Essentials of Automations: The Art of Triggers and Actions in FMESafe Software
In this second installment of our Essentials of Automations webinar series, we’ll explore the landscape of triggers and actions, guiding you through the nuances of authoring and adapting workspaces for seamless automations. Gain an understanding of the full spectrum of triggers and actions available in FME, empowering you to enhance your workspaces for efficient automation.
We’ll kick things off by showcasing the most commonly used event-based triggers, introducing you to various automation workflows like manual triggers, schedules, directory watchers, and more. Plus, see how these elements play out in real scenarios.
Whether you’re tweaking your current setup or building from the ground up, this session will arm you with the tools and insights needed to transform your FME usage into a powerhouse of productivity. Join us to discover effective strategies that simplify complex processes, enhancing your productivity and transforming your data management practices with FME. Let’s turn complexity into clarity and make your workspaces work wonders!
Threats to mobile devices are more prevalent and increasing in scope and complexity. Users of mobile devices desire to take full advantage of the features
available on those devices, but many of the features provide convenience and capability but sacrifice security. This best practices guide outlines steps the users can take to better protect personal devices and information.
Let's Integrate MuleSoft RPA, COMPOSER, APM with AWS IDP along with Slackshyamraj55
Discover the seamless integration of RPA (Robotic Process Automation), COMPOSER, and APM with AWS IDP enhanced with Slack notifications. Explore how these technologies converge to streamline workflows, optimize performance, and ensure secure access, all while leveraging the power of AWS IDP and real-time communication via Slack notifications.
Climate Impact of Software Testing at Nordic Testing DaysKari Kakkonen
My slides at Nordic Testing Days 6.6.2024
Climate impact / sustainability of software testing discussed on the talk. ICT and testing must carry their part of global responsibility to help with the climat warming. We can minimize the carbon footprint but we can also have a carbon handprint, a positive impact on the climate. Quality characteristics can be added with sustainability, and then measured continuously. Test environments can be used less, and in smaller scale and on demand. Test techniques can be used in optimizing or minimizing number of tests. Test automation can be used to speed up testing.
Goodbye Windows 11: Make Way for Nitrux Linux 3.5.0!SOFTTECHHUB
As the digital landscape continually evolves, operating systems play a critical role in shaping user experiences and productivity. The launch of Nitrux Linux 3.5.0 marks a significant milestone, offering a robust alternative to traditional systems such as Windows 11. This article delves into the essence of Nitrux Linux 3.5.0, exploring its unique features, advantages, and how it stands as a compelling choice for both casual users and tech enthusiasts.
TrustArc Webinar - 2024 Global Privacy SurveyTrustArc
How does your privacy program stack up against your peers? What challenges are privacy teams tackling and prioritizing in 2024?
In the fifth annual Global Privacy Benchmarks Survey, we asked over 1,800 global privacy professionals and business executives to share their perspectives on the current state of privacy inside and outside of their organizations. This year’s report focused on emerging areas of importance for privacy and compliance professionals, including considerations and implications of Artificial Intelligence (AI) technologies, building brand trust, and different approaches for achieving higher privacy competence scores.
See how organizational priorities and strategic approaches to data security and privacy are evolving around the globe.
This webinar will review:
- The top 10 privacy insights from the fifth annual Global Privacy Benchmarks Survey
- The top challenges for privacy leaders, practitioners, and organizations in 2024
- Key themes to consider in developing and maintaining your privacy program
Observability Concepts EVERY Developer Should Know -- DeveloperWeek Europe.pdfPaige Cruz
Monitoring and observability aren’t traditionally found in software curriculums and many of us cobble this knowledge together from whatever vendor or ecosystem we were first introduced to and whatever is a part of your current company’s observability stack.
While the dev and ops silo continues to crumble….many organizations still relegate monitoring & observability as the purview of ops, infra and SRE teams. This is a mistake - achieving a highly observable system requires collaboration up and down the stack.
I, a former op, would like to extend an invitation to all application developers to join the observability party will share these foundational concepts to build on:
16. All Rights Reserved Copyright (C) Bee Technologies Inc. 2011
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Zener Voltage Characteristics Reference
IZ = 1(mA)
VZ = 24.75(V) at IZ=1mA
Measurement