SPICE MODEL of 2SK2615 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2615 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2615 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3934 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3934 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8022-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary of simulation results for the modeling and characterization of a MOSFET transistor and its internal body diode. It includes simulation data tables and graphs comparing measurement results to circuit simulations for various transistor parameters and operating conditions, such as transconductance, drain current, gate charge, switching time, output characteristics, and reverse recovery characteristics. The document also provides a SPICE model for the internal protection diode and its zener voltage characteristics.
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8063-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a 14-page report summarizing the simulation and measurement results of various electrical characteristics of the MOSFET transistor TPCA8063-H manufactured by Toshiba. The report includes model parameters, transconductance characteristics, Vgs-Id characteristics, Rds(on) characteristics, gate charge characteristics, capacitance characteristics, switching time characteristics, output characteristics, forward current characteristics, and reverse recovery characteristics. Simulation results are presented and compared to measurement data with percent error calculations.
SPICE MODEL of 2SK4017 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4017 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2615 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2615 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3934 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3934 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8022-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary of simulation results for the modeling and characterization of a MOSFET transistor and its internal body diode. It includes simulation data tables and graphs comparing measurement results to circuit simulations for various transistor parameters and operating conditions, such as transconductance, drain current, gate charge, switching time, output characteristics, and reverse recovery characteristics. The document also provides a SPICE model for the internal protection diode and its zener voltage characteristics.
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8063-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a 14-page report summarizing the simulation and measurement results of various electrical characteristics of the MOSFET transistor TPCA8063-H manufactured by Toshiba. The report includes model parameters, transconductance characteristics, Vgs-Id characteristics, Rds(on) characteristics, gate charge characteristics, capacitance characteristics, switching time characteristics, output characteristics, forward current characteristics, and reverse recovery characteristics. Simulation results are presented and compared to measurement data with percent error calculations.
SPICE MODEL of 2SK4017 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4017 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8062-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK15A50D (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK15A50D (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8109 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8109 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK8A50D (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK8A50D (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK15A50D (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK15A50D (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SSM3K15AMFV (Standard Model) PSpice Model (Free SPICE Model)Tsuyoshi Horigome
This document provides a Spice model and characterization results for the MOSFET device SSM3K15AMFV manufactured by Toshiba. It includes:
1) A Spice model for the MOSFET and its internal body diode with parameters.
2) Simulation results characterizing the MOSFET's transconductance, Id-Vgs, Rds(on), output characteristics, and more.
3) Comparisons of the simulation results to manufacturer measurements showing good agreement.
4) Characterization of the internal body diode's forward and reverse recovery behavior.
SPICE MODEL of 2SK3934 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3934 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK12A60U (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK12A60U (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8022-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8022-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8064-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8064-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SSM3K15AMFV (professional Model) PSpice Model (Free SPICE Model)Tsuyoshi Horigome
This document provides a device modeling report for a MOSFET (SSM3K15AMFV) manufactured by Toshiba. It includes the SPICE model parameters for the MOSFET and its internal body diode. Simulation results show characteristics such as transconductance, output curves, gate charge, switching times and reverse recovery matching measurements. The report also details the SPICE subcircuit models used to simulate the MOSFET and diode.
SPICE MODEL of TK65L60V (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary of simulation results and measurements for the characteristics of a Toshiba TK65L60V MOSFET and its associated body diode. It includes simulation and measurement data for parameters such as transconductance, threshold voltage, on-resistance, switching time, gate charge, forward current, and reverse recovery characteristics. The simulations show good agreement with measurements, with most values matching to within 1% error.
SPICE MODEL of SSM4K27CT (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM4K27CT (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J130TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J130TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK65L60V (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK65L60V (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK10A50D (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK10A50D (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK20J50D (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK20J50D (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK12A60U (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK12A60U (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6J212FE (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6J212FE (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8109 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8062-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK15A50D (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK15A50D (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8109 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8109 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK8A50D (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK8A50D (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK15A50D (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK15A50D (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SSM3K15AMFV (Standard Model) PSpice Model (Free SPICE Model)Tsuyoshi Horigome
This document provides a Spice model and characterization results for the MOSFET device SSM3K15AMFV manufactured by Toshiba. It includes:
1) A Spice model for the MOSFET and its internal body diode with parameters.
2) Simulation results characterizing the MOSFET's transconductance, Id-Vgs, Rds(on), output characteristics, and more.
3) Comparisons of the simulation results to manufacturer measurements showing good agreement.
4) Characterization of the internal body diode's forward and reverse recovery behavior.
SPICE MODEL of 2SK3934 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3934 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK12A60U (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK12A60U (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8022-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8022-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8064-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8064-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SSM3K15AMFV (professional Model) PSpice Model (Free SPICE Model)Tsuyoshi Horigome
This document provides a device modeling report for a MOSFET (SSM3K15AMFV) manufactured by Toshiba. It includes the SPICE model parameters for the MOSFET and its internal body diode. Simulation results show characteristics such as transconductance, output curves, gate charge, switching times and reverse recovery matching measurements. The report also details the SPICE subcircuit models used to simulate the MOSFET and diode.
SPICE MODEL of TK65L60V (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary of simulation results and measurements for the characteristics of a Toshiba TK65L60V MOSFET and its associated body diode. It includes simulation and measurement data for parameters such as transconductance, threshold voltage, on-resistance, switching time, gate charge, forward current, and reverse recovery characteristics. The simulations show good agreement with measurements, with most values matching to within 1% error.
SPICE MODEL of SSM4K27CT (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM4K27CT (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J130TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J130TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK65L60V (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK65L60V (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK10A50D (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK10A50D (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK20J50D (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK20J50D (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK12A60U (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK12A60U (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6J212FE (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6J212FE (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8109 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6J212FE (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary report of the device modeling for a power MOSFET and its components. It includes SPICE models and simulation results for the MOSFET's electrical characteristics like transconductance, drain current, gate charge, switching time and body diode characteristics. The simulations show good agreement with measurement data within less than 5% error. Circuit schematics and simulation results are provided to validate the models.
SPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary of simulation results for the modeling and characterization of a TOSHIBA 2SJ668 power MOSFET and its internal body and ESD protection diodes. The simulations match measurement data with low error percentages for key transistor parameters and diode characteristics like transconductance, drain current, gate charge, switching time and reverse recovery time. Circuit simulations were performed to extract the MOSFET and diode models for use in circuit design and analysis.
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK8A50D (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK8A50D (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J130TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J130TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ668 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ668 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8119 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8119 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary report of the modeling and simulation of a MOSFET transistor. It includes the manufacturer and part number details, as well as the results of simulations characterizing the transistor's electrical properties and performance metrics like drain current, transconductance, switching time, and reverse recovery. The simulations are compared to measurement data and most show good agreement within a few percent error.
SPICE MODEL of SSM3K15SF (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K15SF (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K318T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for the SSM3K318T MOSFET manufactured by Toshiba. It includes summaries of simulations and measurements of the MOSFET's electrical characteristics such as transconductance, output characteristics, switching times, and reverse recovery characteristics. Model parameters are also provided for the MOSFET and its internal body diode in the PSpice model. Circuit simulations are shown to match measurements within a few percent error.
SPICE MODEL of 2SK3658 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3658 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8204 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8204 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J129TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J129TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8108 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8108 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3658 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3658 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J132TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document provides a summary of SPICE modeling parameters for a TOSHIBA SSM3J132TU power MOSFET and its internal body and ESD protection diodes. It includes 14 pages describing the MOSFET and diode models, with simulation results comparing measurements to modeled characteristics including transconductance, drain current, gate charge, switching time, and reverse recovery. Circuit schematics and simulation results are provided to validate the SPICE models against real-world device measurements.
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Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Tsuyoshi Horigome
This document provides an inventory update of 6,747 parts at Spice Park as of April 2024. It lists the part numbers, manufacturers, and quantities of various semiconductor components, including 1,697 Schottky rectifier diodes from 29 different manufacturers. It also includes details on passive components, batteries, mechanical parts, motors, and lamps in the inventory.
The document provides an inventory update from April 2024 of the Spice Park collection which contains 6,747 electronic components. It includes tables listing the types of semiconductor components, passive parts, batteries, mechanical parts, motors, and lamps in the collection along with their manufacturer and quantities. One of the semiconductor components, the general purpose rectifier diode, is broken down into a more detailed table with 116 entries providing part numbers, manufacturers, thermal ratings, and remarks.
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Tsuyoshi Horigome
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This document provides an inventory list of parts at Spice Park as of March 2024. It contains 3 sections - Semiconductor parts (diodes, transistors, ICs etc.), Passive parts (capacitors, resistors etc.), and Battery parts. For Semiconductor parts, it lists 36 different part types and provides the quantity of each part. It then provides further details of Diode/General Purpose Rectifiers, listing the manufacturer and quantity of 652 individual part numbers.
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The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 total pieces of electronic components and parts. It lists 36 categories of semiconductor devices, 11 categories of passive parts, 10 types of batteries, 5 mechanical parts, DC motors, lamps, and power supplies. It provides the most detailed listing for solar cells, with 1,003 total pieces from 51 manufacturers listed with part numbers.
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 electronic components. It lists the components by type (e.g. semiconductor), part number, manufacturer, thermal rating, and quantity on hand. For example, it shows that there are 621 general purpose rectifier diodes from manufacturers such as Fairchild, Fuji, Intersil, Rohm, Shindengen, and Toshiba. The detailed four-page section provides further information on the first item, general purpose rectifier diodes, including 152 individual part numbers and specifications.
This document discusses circuit simulations using LTspice. It describes driving a circuit simulation by inserting a 250 ohm resistor between the output terminals. It also describes simulating a 1 channel bridge circuit where the DUT1 and DUT2 resistors are both set to 100 ohms and the input voltage is set to either 1V or 5V.
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Leonard Jayamohan, Partner & Generative AI Lead, Deloitte
This keynote will reveal how Deloitte leverages Neo4j’s graph power for groundbreaking digital twin solutions, achieving a staggering 100x performance boost. Discover the essential role knowledge graphs play in successful generative AI implementations. Plus, get an exclusive look at an innovative Neo4j + Generative AI solution Deloitte is developing in-house.
Climate Impact of Software Testing at Nordic Testing DaysKari Kakkonen
My slides at Nordic Testing Days 6.6.2024
Climate impact / sustainability of software testing discussed on the talk. ICT and testing must carry their part of global responsibility to help with the climat warming. We can minimize the carbon footprint but we can also have a carbon handprint, a positive impact on the climate. Quality characteristics can be added with sustainability, and then measured continuously. Test environments can be used less, and in smaller scale and on demand. Test techniques can be used in optimizing or minimizing number of tests. Test automation can be used to speed up testing.
Driving Business Innovation: Latest Generative AI Advancements & Success StorySafe Software
Are you ready to revolutionize how you handle data? Join us for a webinar where we’ll bring you up to speed with the latest advancements in Generative AI technology and discover how leveraging FME with tools from giants like Google Gemini, Amazon, and Microsoft OpenAI can supercharge your workflow efficiency.
During the hour, we’ll take you through:
Guest Speaker Segment with Hannah Barrington: Dive into the world of dynamic real estate marketing with Hannah, the Marketing Manager at Workspace Group. Hear firsthand how their team generates engaging descriptions for thousands of office units by integrating diverse data sources—from PDF floorplans to web pages—using FME transformers, like OpenAIVisionConnector and AnthropicVisionConnector. This use case will show you how GenAI can streamline content creation for marketing across the board.
Ollama Use Case: Learn how Scenario Specialist Dmitri Bagh has utilized Ollama within FME to input data, create custom models, and enhance security protocols. This segment will include demos to illustrate the full capabilities of FME in AI-driven processes.
Custom AI Models: Discover how to leverage FME to build personalized AI models using your data. Whether it’s populating a model with local data for added security or integrating public AI tools, find out how FME facilitates a versatile and secure approach to AI.
We’ll wrap up with a live Q&A session where you can engage with our experts on your specific use cases, and learn more about optimizing your data workflows with AI.
This webinar is ideal for professionals seeking to harness the power of AI within their data management systems while ensuring high levels of customization and security. Whether you're a novice or an expert, gain actionable insights and strategies to elevate your data processes. Join us to see how FME and AI can revolutionize how you work with data!
Pushing the limits of ePRTC: 100ns holdover for 100 daysAdtran
At WSTS 2024, Alon Stern explored the topic of parametric holdover and explained how recent research findings can be implemented in real-world PNT networks to achieve 100 nanoseconds of accuracy for up to 100 days.
Dr. Sean Tan, Head of Data Science, Changi Airport Group
Discover how Changi Airport Group (CAG) leverages graph technologies and generative AI to revolutionize their search capabilities. This session delves into the unique search needs of CAG’s diverse passengers and customers, showcasing how graph data structures enhance the accuracy and relevance of AI-generated search results, mitigating the risk of “hallucinations” and improving the overall customer journey.
Threats to mobile devices are more prevalent and increasing in scope and complexity. Users of mobile devices desire to take full advantage of the features
available on those devices, but many of the features provide convenience and capability but sacrifice security. This best practices guide outlines steps the users can take to better protect personal devices and information.
Building Production Ready Search Pipelines with Spark and MilvusZilliz
Spark is the widely used ETL tool for processing, indexing and ingesting data to serving stack for search. Milvus is the production-ready open-source vector database. In this talk we will show how to use Spark to process unstructured data to extract vector representations, and push the vectors to Milvus vector database for search serving.
GraphSummit Singapore | The Art of the Possible with Graph - Q2 2024Neo4j
Neha Bajwa, Vice President of Product Marketing, Neo4j
Join us as we explore breakthrough innovations enabled by interconnected data and AI. Discover firsthand how organizations use relationships in data to uncover contextual insights and solve our most pressing challenges – from optimizing supply chains, detecting fraud, and improving customer experiences to accelerating drug discoveries.
HCL Notes and Domino License Cost Reduction in the World of DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-and-domino-license-cost-reduction-in-the-world-of-dlau/
The introduction of DLAU and the CCB & CCX licensing model caused quite a stir in the HCL community. As a Notes and Domino customer, you may have faced challenges with unexpected user counts and license costs. You probably have questions on how this new licensing approach works and how to benefit from it. Most importantly, you likely have budget constraints and want to save money where possible. Don’t worry, we can help with all of this!
We’ll show you how to fix common misconfigurations that cause higher-than-expected user counts, and how to identify accounts which you can deactivate to save money. There are also frequent patterns that can cause unnecessary cost, like using a person document instead of a mail-in for shared mailboxes. We’ll provide examples and solutions for those as well. And naturally we’ll explain the new licensing model.
Join HCL Ambassador Marc Thomas in this webinar with a special guest appearance from Franz Walder. It will give you the tools and know-how to stay on top of what is going on with Domino licensing. You will be able lower your cost through an optimized configuration and keep it low going forward.
These topics will be covered
- Reducing license cost by finding and fixing misconfigurations and superfluous accounts
- How do CCB and CCX licenses really work?
- Understanding the DLAU tool and how to best utilize it
- Tips for common problem areas, like team mailboxes, functional/test users, etc
- Practical examples and best practices to implement right away
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2024/06/building-and-scaling-ai-applications-with-the-nx-ai-manager-a-presentation-from-network-optix/
Robin van Emden, Senior Director of Data Science at Network Optix, presents the “Building and Scaling AI Applications with the Nx AI Manager,” tutorial at the May 2024 Embedded Vision Summit.
In this presentation, van Emden covers the basics of scaling edge AI solutions using the Nx tool kit. He emphasizes the process of developing AI models and deploying them globally. He also showcases the conversion of AI models and the creation of effective edge AI pipelines, with a focus on pre-processing, model conversion, selecting the appropriate inference engine for the target hardware and post-processing.
van Emden shows how Nx can simplify the developer’s life and facilitate a rapid transition from concept to production-ready applications.He provides valuable insights into developing scalable and efficient edge AI solutions, with a strong focus on practical implementation.
UiPath Test Automation using UiPath Test Suite series, part 5DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 5. In this session, we will cover CI/CD with devops.
Topics covered:
CI/CD with in UiPath
End-to-end overview of CI/CD pipeline with Azure devops
Speaker:
Lyndsey Byblow, Test Suite Sales Engineer @ UiPath, Inc.
Cosa hanno in comune un mattoncino Lego e la backdoor XZ?Speck&Tech
ABSTRACT: A prima vista, un mattoncino Lego e la backdoor XZ potrebbero avere in comune il fatto di essere entrambi blocchi di costruzione, o dipendenze di progetti creativi e software. La realtà è che un mattoncino Lego e il caso della backdoor XZ hanno molto di più di tutto ciò in comune.
Partecipate alla presentazione per immergervi in una storia di interoperabilità, standard e formati aperti, per poi discutere del ruolo importante che i contributori hanno in una comunità open source sostenibile.
BIO: Sostenitrice del software libero e dei formati standard e aperti. È stata un membro attivo dei progetti Fedora e openSUSE e ha co-fondato l'Associazione LibreItalia dove è stata coinvolta in diversi eventi, migrazioni e formazione relativi a LibreOffice. In precedenza ha lavorato a migrazioni e corsi di formazione su LibreOffice per diverse amministrazioni pubbliche e privati. Da gennaio 2020 lavora in SUSE come Software Release Engineer per Uyuni e SUSE Manager e quando non segue la sua passione per i computer e per Geeko coltiva la sua curiosità per l'astronomia (da cui deriva il suo nickname deneb_alpha).
Sudheer Mechineni, Head of Application Frameworks, Standard Chartered Bank
Discover how Standard Chartered Bank harnessed the power of Neo4j to transform complex data access challenges into a dynamic, scalable graph database solution. This keynote will cover their journey from initial adoption to deploying a fully automated, enterprise-grade causal cluster, highlighting key strategies for modelling organisational changes and ensuring robust disaster recovery. Learn how these innovations have not only enhanced Standard Chartered Bank’s data infrastructure but also positioned them as pioneers in the banking sector’s adoption of graph technology.
Best 20 SEO Techniques To Improve Website Visibility In SERPPixlogix Infotech
Boost your website's visibility with proven SEO techniques! Our latest blog dives into essential strategies to enhance your online presence, increase traffic, and rank higher on search engines. From keyword optimization to quality content creation, learn how to make your site stand out in the crowded digital landscape. Discover actionable tips and expert insights to elevate your SEO game.
Programming Foundation Models with DSPy - Meetup SlidesZilliz
Prompting language models is hard, while programming language models is easy. In this talk, I will discuss the state-of-the-art framework DSPy for programming foundation models with its powerful optimizers and runtime constraint system.
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Time
19.6us 19.8us 20.0us 20.2us 20.4us 20.6us
I(R1)
-400mA
-300mA
-200mA
-100mA
-0mA
100mA
200mA
300mA
400mA
Reverse Recovery Characteristics
Circuit Simulation Result
Evaluation Circuit
Compare Measurement vs. Simulation
Characteristic Unit Measurement Simulation Error (%)
trj ns 20.000 20.033 0.17
V1
TD = 90ns
TF = 10ns
PW = 20us
PER = 50us
V1 = -9.45v
TR = 10ns
V2 = 10.65v
R1
50
0
U1
2SK2615
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Reverse Recovery Characteristic Reference
Trj=20(ns)
Trb=24(ns)
Conditions:Ifwd=lrev=0.2(A),Rl=50
Relation between trj and trb
Example
Measurement
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V_V1
0V 5V 10V 15V 20V 25V 30V 35V 40V 45V 50V
I(R1)
0A
1mA
2mA
3mA
4mA
5mA
6mA
7mA
8mA
9mA
10mA
ESD PROTECTION DIODE SPICE MODEL
Zener Voltage Characteristic
Circuit Simulation Result
Evaluation Circuit
R1
0.001m
V1
0Vdc
0
U1
2SK2615R2
100MEG
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Zener Voltage Characteristic Reference