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 DELIVERING QUALITY SINCE 1952.
Flex & Rigid Flex PCB’s:
Applications & Cost Drivers
08/28/2015
2
Flex & Rigid Flex Applications
 Flex & Rigid Flex Applications:
– Present in every market segment:
• Medical
• Avionics...
3
Flex & Rigid Flex Applications
Laser Gun Sights
High Speed Communication Interconnects
Night Vision Goggles
Hearing ...
4
Flex & Rigid Flex Applications
 Primary Factors:
1. Packaging Requirement (#1)
2. Reliability Improvement (#2)
– Accoun...
5
Flex & Rigid Flex Applications:
Packaging
 Size Reduction:
– Occupies down to 10% the “space” of alternate solutions.
–...
6
Flex & Rigid Flex Applications:
Packaging
 Added Functionality:
– Increased number of available interconnects between r...
7
Flex & Rigid Flex Applications:
Reliability
 Point of Failure Reduction:
– Reduced number of interconnects required:
• ...
8
Flex & Rigid Flex Applications:
Additional Items
 High Speed Signal Integrity:
– Exceptional performance over a wide ra...
9
Flex & Rigid Flex Cost Drivers:
Part Size
 Production Panel Manufacturing Process:
– Multiple individual parts arranged...
10
Flex & Rigid Flex Cost Factors:
Part Shape
 Design Configuration:
– Technology allows for many unique configurations a...
11
Flex & Rigid Flex Cost Factors:
Manufacturing Process
 Manufacturing Process Requirements:
– May dictate specific part...
12
Flex & Rigid Flex Cost Factors:
Layer Count & Construction
 Flex Layer Count:
– Additional more costly materials
– Add...
13
Flex & Rigid Flex Cost Factors:
Layer Count & Construction
 Flex Layer Count (continued)
14
Flex & Rigid Flex Cost Factors:
Layer Count & Construction
 Flex Layer Configuration:
– Air Gap Vs Single Stack Constr...
15
Flex & Rigid Flex Cost Factors:
Technology Requirements:
 Blind & Buried Vias:
– Added drilling, plating and laminatio...
16
Summary
 Applications:
– Wide variety of applications throughout all market segments
– Applications driven by packagin...
17
Our Products
Battery Packs Flex & Rigid-Flex PCB’s User Interfaces
Fans & Motors Cable Assemblies Printed Circuit Boards
18
Design Centers & Technical Support
 Battery Pack & Power Management – Denver, CO
 User Interfaces – Largo, FL
 Fans ...
19
Q&A
 Questions?
– Enter any questions you may have
in the Control Panel
– If we don’t have time to get to it, we
will ...
20
Thank You
Check out our previous webinars at www.epectec.com.
For more information email sales@epectec.com.
Stay Connec...
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Flex & Rigid-Flex PCB's - Applications and Cost Drivers

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In this Webinar, Epec will review primary design requirements that are best served by the utilization of flex or rigid-flex circuit boards within a given design. Additionally we will address the primary cost drivers that impact the per part cost.

To learn more information on our flex & rigid-flex circuit board solutions visit http://www.epectec.com/flex/.

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Flex & Rigid-Flex PCB's - Applications and Cost Drivers

  1. 1.  DELIVERING QUALITY SINCE 1952. Flex & Rigid Flex PCB’s: Applications & Cost Drivers 08/28/2015
  2. 2. 2 Flex & Rigid Flex Applications  Flex & Rigid Flex Applications: – Present in every market segment: • Medical • Avionics • Instrumentation • Industrial Controls and Sensors • Automotive • Wearable Devices • Military • Etc. – Applications cover both: • Static: Bend once to fit • Dynamic: Up to infinite number of bends
  3. 3. 3 Flex & Rigid Flex Applications Laser Gun Sights High Speed Communication Interconnects Night Vision Goggles Hearing Aids Defibrillators Portable CT Scanner XRF Analyzer
  4. 4. 4 Flex & Rigid Flex Applications  Primary Factors: 1. Packaging Requirement (#1) 2. Reliability Improvement (#2) – Accounts for 80%+ of all applications. – Capabilities beyond alternate solutions: • Cable harnesses • Discrete wires • Mating connectors – Alternate interconnect solutions, that meet your design requirements, may provide cost savings but will not achieve as high a packaging, reliability or performance level.
  5. 5. 5 Flex & Rigid Flex Applications: Packaging  Size Reduction: – Occupies down to 10% the “space” of alternate solutions. – Circuit density capability of Rigid PCBs. – Tighter bend capabilities than wires / cables. – Reduced rigid board space requirements – Reduced enclosure dimension opportunities  Weight Reduction: – Down to 10% of alternate solutions – Improved Shock & Vibration performance
  6. 6. 6 Flex & Rigid Flex Applications: Packaging  Added Functionality: – Increased number of available interconnects between rigid areas  Component Reduction: – Connectors: • Rigid – Flex constructions eliminate connectors completely • ZIF Connectors: – One part connector system. – Flex circuit direct plug in with mating connector • Lap Joint Direct Solder – Flex Soldered directly to PCB – Components: • Higher level of design integration may allow for reduced component requirements.
  7. 7. 7 Flex & Rigid Flex Applications: Reliability  Point of Failure Reduction: – Reduced number of interconnects required: • Connector solder joints • Mating connector interfaces • Wire / Cable crimp connections  Improved Shock & Vibration Performance – Reduced weight – Reduced number of interconnects
  8. 8. 8 Flex & Rigid Flex Applications: Additional Items  High Speed Signal Integrity: – Exceptional performance over a wide range of requirements • Lower material DK values • Tightly controlled and uniform material thicknesses • Homogenous flex core construction  Improved Heat Dissipation: – Thinner materials and constructions – Greater surface area to volume ratios  Assembly Cost Reduction: – Fewer assembly steps  Assembly Errors Reduction: – “One way only” assembly
  9. 9. 9 Flex & Rigid Flex Cost Drivers: Part Size  Production Panel Manufacturing Process: – Multiple individual parts arranged within a larger format production panel (Same as traditional rigid boards) – Applies to Roll to Roll manufacturing  Material Quantity Requirements: – Number of panels required to yield required number of parts. – Higher quantity of parts per panel reduces total material requirements and lowers per unit cost  Design Configuration: – Excessive levels of integration may lead to large part configurations  Part Length: – May not match “well” with available production panel sizes
  10. 10. 10 Flex & Rigid Flex Cost Factors: Part Shape  Design Configuration: – Technology allows for many unique configurations and shapes. – Part shape / size combination may limit ability to “nest” parts within a production panel decreasing material utilization: • Circular or U shapes with empty center sections • Non-rectangular configurations with unique angles and or extensions
  11. 11. 11 Flex & Rigid Flex Cost Factors: Manufacturing Process  Manufacturing Process Requirements: – May dictate specific part orientations thus reducing parts per panel • Rigid or rigidized areas to flex areas relationship • Stiffeners • PSAs (Double Sided Adhesives) • Breakaway tabs – assembly arrays
  12. 12. 12 Flex & Rigid Flex Cost Factors: Layer Count & Construction  Flex Layer Count: – Additional more costly materials – Added Flex layer lamination process(s)
  13. 13. 13 Flex & Rigid Flex Cost Factors: Layer Count & Construction  Flex Layer Count (continued)
  14. 14. 14 Flex & Rigid Flex Cost Factors: Layer Count & Construction  Flex Layer Configuration: – Air Gap Vs Single Stack Construction • Added Coverlay materials & Coverlay lamination process for each flex layer pair
  15. 15. 15 Flex & Rigid Flex Cost Factors: Technology Requirements:  Blind & Buried Vias: – Added drilling, plating and lamination cycle(s) – May also require more costly materials  Via Fill: – Required for Via in Pad component & fine pitch BGA applications  Flex Only Area Plated Holes: – Added drilling & plating cycle(s) • Sequential build process  Flex Area Stiffeners: • Added material(s) • Added lamination cycle(s)  Epoxy Strain Reliefs: – Applied to rigid to flex transitions if required
  16. 16. 16 Summary  Applications: – Wide variety of applications throughout all market segments – Applications driven by packaging and reliability requirements which alternate solutions cannot support.  Cost Drivers: – Multiple factors create a variety of combinations which impact the final part cost.  Your supplier can assist and support in the following areas to ensure the highest degree of project success: – Application Review – Design Requirements – Cost factors.
  17. 17. 17 Our Products Battery Packs Flex & Rigid-Flex PCB’s User Interfaces Fans & Motors Cable Assemblies Printed Circuit Boards
  18. 18. 18 Design Centers & Technical Support  Battery Pack & Power Management – Denver, CO  User Interfaces – Largo, FL  Fans & Motors – Wales, UK  PCB’s – New Bedford, MA & Shenzhen, China  Flex & Rigid Flex – Toronto, Canada  Cable Assemblies – New Bedford, MA  Our Engineering and Design teams are ready to help our customers create world class and cost effective product solutions.
  19. 19. 19 Q&A  Questions? – Enter any questions you may have in the Control Panel – If we don’t have time to get to it, we will reply via email
  20. 20. 20 Thank You Check out our previous webinars at www.epectec.com. For more information email sales@epectec.com. Stay Connected with Epec Engineered Technologies Follow us on our social media sites for continuous technical updates and information:

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