The document discusses the applications and cost drivers of flex and rigid flex PCBs, highlighting their wide use across various industries such as medical, automotive, and military. Key benefits include reduced size and weight, improved reliability, and enhanced functionality compared to alternative solutions. Additionally, it outlines factors affecting cost, including part size, shape, manufacturing processes, and technology requirements.

1.  DELIVERING QUALITY SINCE 1952.
Flex & Rigid Flex PCB’s:
Applications & Cost Drivers
08/28/2015

2. 2
Flex & Rigid Flex Applications
 Flex & Rigid Flex Applications:
– Present in every market segment:
• Medical
• Avionics
• Instrumentation
• Industrial Controls and Sensors
• Automotive
• Wearable Devices
• Military
• Etc.
– Applications cover both:
• Static: Bend once to fit
• Dynamic: Up to infinite number of bends

3. 3
Flex & Rigid Flex Applications
Laser Gun Sights
High Speed Communication Interconnects
Night Vision Goggles
Hearing Aids
Defibrillators
Portable CT Scanner
XRF Analyzer

4. 4
Flex & Rigid Flex Applications
 Primary Factors:
1. Packaging Requirement (#1)
2. Reliability Improvement (#2)
– Accounts for 80%+ of all applications.
– Capabilities beyond alternate solutions:
• Cable harnesses
• Discrete wires
• Mating connectors
– Alternate interconnect solutions, that meet your design
requirements, may provide cost savings but will not achieve as
high a packaging, reliability or performance level.

5. 5
Flex & Rigid Flex Applications:
Packaging
 Size Reduction:
– Occupies down to 10% the “space” of alternate solutions.
– Circuit density capability of Rigid PCBs.
– Tighter bend capabilities than wires / cables.
– Reduced rigid board space requirements
– Reduced enclosure dimension
opportunities
 Weight Reduction:
– Down to 10% of alternate solutions
– Improved Shock & Vibration
performance

6. 6
Flex & Rigid Flex Applications:
Packaging
 Added Functionality:
– Increased number of available interconnects between rigid areas
 Component Reduction:
– Connectors:
• Rigid – Flex constructions eliminate connectors completely
• ZIF Connectors:
– One part connector system.
– Flex circuit direct plug in with mating connector
• Lap Joint Direct Solder
– Flex Soldered directly to PCB
– Components:
• Higher level of design integration
may allow for reduced component
requirements.

7. 7
Flex & Rigid Flex Applications:
Reliability
 Point of Failure Reduction:
– Reduced number of interconnects required:
• Connector solder joints
• Mating connector interfaces
• Wire / Cable crimp connections
 Improved Shock & Vibration Performance
– Reduced weight
– Reduced number of interconnects

8. 8
Flex & Rigid Flex Applications:
Additional Items
 High Speed Signal Integrity:
– Exceptional performance over a wide range of requirements
• Lower material DK values
• Tightly controlled and uniform material thicknesses
• Homogenous flex core construction
 Improved Heat Dissipation:
– Thinner materials and constructions
– Greater surface area to volume ratios
 Assembly Cost Reduction:
– Fewer assembly steps
 Assembly Errors Reduction:
– “One way only” assembly

9. 9
Flex & Rigid Flex Cost Drivers:
Part Size
 Production Panel Manufacturing Process:
– Multiple individual parts arranged within a larger format production
panel (Same as traditional rigid boards)
– Applies to Roll to Roll manufacturing
 Material Quantity Requirements:
– Number of panels required to yield required number of parts.
– Higher quantity of parts per panel reduces total material
requirements and lowers per unit cost
 Design Configuration:
– Excessive levels of integration may lead to large part
configurations
 Part Length:
– May not match “well” with available production panel sizes

10. 10
Flex & Rigid Flex Cost Factors:
Part Shape
 Design Configuration:
– Technology allows for many unique configurations and shapes.
– Part shape / size combination may limit ability to “nest” parts within
a production panel decreasing material utilization:
• Circular or U shapes with empty center sections
• Non-rectangular configurations with unique angles and or extensions

11. 11
Flex & Rigid Flex Cost Factors:
Manufacturing Process
 Manufacturing Process Requirements:
– May dictate specific part orientations thus reducing parts per panel
• Rigid or rigidized areas to
flex areas relationship
• Stiffeners
• PSAs (Double Sided Adhesives)
• Breakaway tabs
– assembly arrays

12. 12
Flex & Rigid Flex Cost Factors:
Layer Count & Construction
 Flex Layer Count:
– Additional more costly materials
– Added Flex layer lamination process(s)

13. 13
Flex & Rigid Flex Cost Factors:
Layer Count & Construction
 Flex Layer Count (continued)

14. 14
Flex & Rigid Flex Cost Factors:
Layer Count & Construction
 Flex Layer Configuration:
– Air Gap Vs Single Stack Construction
• Added Coverlay materials & Coverlay lamination process for each flex
layer pair

15. 15
Flex & Rigid Flex Cost Factors:
Technology Requirements:
 Blind & Buried Vias:
– Added drilling, plating and lamination cycle(s)
– May also require more costly materials
 Via Fill:
– Required for Via in Pad component & fine pitch BGA applications
 Flex Only Area Plated Holes:
– Added drilling & plating cycle(s)
• Sequential build process
 Flex Area Stiffeners:
• Added material(s)
• Added lamination cycle(s)
 Epoxy Strain Reliefs:
– Applied to rigid to flex transitions if required

16. 16
Summary
 Applications:
– Wide variety of applications throughout all market segments
– Applications driven by packaging and reliability requirements which
alternate solutions cannot support.
 Cost Drivers:
– Multiple factors create a variety of combinations which impact the
final part cost.
 Your supplier can assist and support in the following areas to ensure
the highest degree of project success:
– Application Review
– Design Requirements
– Cost factors.

17. 17
Our Products
Battery Packs Flex & Rigid-Flex PCB’s User Interfaces
Fans & Motors Cable Assemblies Printed Circuit Boards

18. 18
Design Centers & Technical Support
 Battery Pack & Power Management – Denver, CO
 User Interfaces – Largo, FL
 Fans & Motors – Wales, UK
 PCB’s – New Bedford, MA & Shenzhen, China
 Flex & Rigid Flex – Toronto, Canada
 Cable Assemblies – New Bedford, MA
 Our Engineering and Design teams are ready to help
our customers create world class and cost effective
product solutions.

19. 19
Q&A
 Questions?
– Enter any questions you may have
in the Control Panel
– If we don’t have time to get to it, we
will reply via email

20. 20
Thank You
Check out our previous webinars at www.epectec.com.
For more information email sales@epectec.com.
Stay Connected with Epec Engineered Technologies
Follow us on our social media sites for continuous technical updates and information: