SlideShare a Scribd company logo
Device Modeling Report



COMPONENTS: Power MOSFET (Model Parameter)
PART NUMBER: TPC8212-H
MANUFACTURER: TOSHIBA
Body Diode (Model Parameter) / ESD Protection Diode




                  Bee Technologies Inc.




    All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
MOSFET MODEL
 Pspice model
                                          Model description
   parameter
LEVEL
L               Channel Length
W               Channel Width
KP              Transconductance
RS              Source Ohmic Resistance
RD              Ohmic Drain Resistance
VTO             Zero-bias Threshold Voltage
RDS             Drain-Source Shunt Resistance
TOX             Gate Oxide Thickness
CGSO            Zero-bias Gate-Source Capacitance
CGDO            Zero-bias Gate-Drain Capacitance
CBD             Zero-bias Bulk-Drain Junction Capacitance
MJ              Bulk Junction Grading Coefficient
PB              Bulk Junction Potential
FC              Bulk Junction Forward-bias Capacitance Coefficient
RG              Gate Ohmic Resistance
IS              Bulk Junction Saturation Current
N               Bulk Junction Emission Coefficient
RB              Bulk Series Resistance
PHI             Surface Inversion Potential
GAMMA           Body-effect Parameter
DELTA           Width effect on Threshold Voltage
ETA             Static Feedback on Threshold Voltage
THETA           Modility Modulation
KAPPA           Saturation Field Factor
VMAX            Maximum Drift Velocity of Carriers
XJ              Metallurgical Junction Depth
UO              Surface Mobility




            All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
Transconductance Characteristic

Circuit Simulation Result




Comparison table


                                          gfs
      Id(A)                                                                   Error(%)
                      Measurement                   Simulation
         0.500                       6.000                      6.105             1.750
         1.000                       8.200                      8.230             0.366
         2.000                      12.000                     12.260             2.167
         5.000                      17.500                     17.950             2.571




               All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
Vgs-Id Characteristic

Circuit Simulation result



          8.0A




          6.0A




          4.0A




          2.0A




            0A
                 0V           1.0V      2.0V        3.0V        4.0V           5.0V        6.0V
                      I(V3)
                                                    V_V2



Evaluation circuit


                                        U17                V3


                                                                0Vdc

                                 open               open
                                                                               open
                                 open               open               V1

                                        TPC8212-H
                                                                       10Vdc          R1
                       V2
                       0Vdc                                                           100MEG



                                                                                  0




                                 0




                  All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
Comparison Graph

Circuit Simulation Result




Simulation Result


                                       VGS(V)
       ID(A)                                                              Error (%)
                     Measurement                  Simulation
         1.000                     2.850                      2.842            -0.281
         2.000                     2.950                      2.945            -0.169
         4.000                     3.100                      3.099            -0.032
         6.000                     3.230                      3.223            -0.217
         8.000                     3.330                      3.332             0.060




               All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
Rds(on) Characteristic

Circuit Simulation result


          4.0A




          3.0A




          2.0A




          1.0A




             0A
                  0V            20mV            40mV               60mV                80mV            100mV
                       I(V3)
                                                          V_VDS


Evaluation circuit


                                              U17                  V3


                                                                          0Vdc

                                                                                       open
                                       open                 open

                                       open                 open
                                VGS                                       0Vdc   VDS          Ropen
                        10Vdc                 TPC8212-H
                                                                                              100MEG



                                                                                          0




                                       0


Simulation Result

      ID=3.0A, VGS=10V                 Measurement                      Simulation                     Error (%)
           R DS (on)                          16.000 m                    16.032 m                           0.200



                  All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
Gate Charge Characteristic
Circuit Simulation result

           20V




           15V




           10V




             5V




             0V
                  0               6n                       12n              18n                 24n                 30n
                       V(W1:3)
                                                                 Time*1mS


Evaluation circuit

                                                                               V2


                                                                                    0Vdc
                                                                                                               open
                                                    open                    open
                                 W1
                                                    open                    open
                                   +                                                       D1         I2              Ropen
         TD = 0
                                   -                                                                                  100MEG
         TF = 10n        I1                                  TPC8212-H                                6Adc
         PW = 600u                                                                     Dbreak
         PER = 1000u             W
         I1 = 0                  ION = 0uA
         I2 = 1m                 IOFF = 100uA                                                         V1        0
         TR = 10n
                                                                                                       24Vdc




                                                0



Simulation Result

     VDD=24V,ID=6.0A                  Measurement                        Simulation                   Error (%)
        ,VGS=10V
          Qgs                              3.100 nC                          3.120 nC                            0.645
          Qgd                              4.100 nC                          4.194 nC                            2.293
           Qg                             16.000 nC                         14.698 nC                           -8.138


                      All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
Capacitance Characteristic




                                                              Measurement
                                                               Simulation




Simulation Result


                                       Cbd(nF)
          VDS(V)                                                      Error(%)
                        Measurement              Simulation
              0.100                 0.850                  0.855              0.588
              0.200                 0.800                  0.790             -1.250
              0.500                 0.710                  0.705             -0.704
              1.000                 0.620                  0.622              0.323
              2.000                 0.510                  0.515              0.980
              5.000                 0.370                  0.366             -1.081
             10.000                 0.300                  0.304              1.333
             20.000                 0.220                  0.217             -1.364




              All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
Switching Time Characteristic

Circuit Simulation result

        14




        10




         5




         0


        1.95us                              2.00us                         2.05us               2.10us
             V(R1:1)                  V(L2:1)/1.5
                                                             Time

Evaluation circuit

                                                            U17                L2      R2

                                  RG        L1
                                                                               50nH    5

                                            30nH
                                                     open               open                  open
                                4.7
                                                     open               open
             V1 = 0
             V2 = 20       V2             R1
             TD = 2u                                        TPC8212-H                    V1          Ropen
                                           4.7                                        15Vdc
             TR = 6n                                                                                 100MEG
             TF = 7n
             PW = 20u
             PER = 2000u
                                                                                                 0



                                                     0


Simulation Result

        ID=3.0A, VDD=15V
                                                 Measurement              Simulation          Error(%)
           VGS=0/10V
               ton                                 11.000 ns             11.070         ns                   0.636



                   All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
Output Characteristic

Circuit Simulation result



          10A
                 10V               6V                                                        3.6V
                            8V
           8A
                                                                                             3.5V

           6A
                                                                                            3.4V


           4A
                                                                                            3.3V



           2A                                                                   VGS=3.1V



           0A
                0V           0.4V                0.8V          1.2V             1.6V                  2.0V
                     I(Vdsense)
                                                   V_Vvariable



Evaluation circuit


                                                               Vdsense
                                           U17


                                                                      0Vdc

                                                                             Vv ariable
                           Vstep    open                open
                                                                  10Vdc
                                                                                          open
                                    open                open
                 10Vdc

                                           TPC8212-H
                                                                                                 R1
                                                                                                 100MEG



                                                                                             0

                                                        0




                     All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
Forward Current Characteristic

Circuit Simulation Result



           20A




           10A




          1.0A
                 0V                    0.4V                 0.8V                        1.2V
                      I(R1)
                                               V_V1




Evaluation Circuit


                                  R1

                                  0.01m
                                                       openopen
                                                                              open


                                                                  TPC8212-H
                         V1                                                          Ropen
                 0Vdc                                             U17
                                                                                     100MEG



                                                       openopen                  0



                                                   0




                 All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
Comparison Graph

Circuit Simulation Result




Simulation Result


                          VDS (V)                   VDS (V)
       IDR (A)          Measurement                Simulation             %Error
            1.000                 0.700                     0.699            -0.143
            2.000                 0.730                     0.732             0.274
            5.000                 0.795                     0.790            -0.629
          10.000                  0.850                     0.854             0.471
          20.000                  0.960                     0.959            -0.104




               All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
Reverse Recovery Characteristic

Circuit Simulation Result

           400mA


           300mA


           200mA


           100mA


            -0mA


          -100mA


          -200mA


          -300mA


          -400mA
              0.92us                                                                    1.18us
                   I(R1)
                                                 Time
Evaluation Circuit


                                      R1

                                      50
                                                      openopen
                                                                             open

                                                                 TPC8212-H

                   V1 = -9.4v    V1                              U18                Ropen
                   V2 = 10.6v
                   TD = 0                                                           100MEG
                   TR = 10ns
                   TF = 10ns
                   PW = 1us
                   PER = 100us                        openopen                  0



                                                  0


Compare Measurement vs. Simulation

                         Measurement             Simulation                                 Error (%)
           trj                  10.400 ns            12.466 ns                                  19.865
          trb                   56.000 ns            73.558 ns                                  31.354
          trr                   66.400 ns            86.024 ns                                  29.554




                 All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
Reverse Recovery Characteristic                                        Reference




Trj=10.4(ns)
Trb=56.0(ns)
Conditions:Ifwd=lrev=0.2(A),Rl=50




                                                     Example




                               Relation between trj and trb




              All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
Zener Voltage Characteristic
Circuit Simulation Result

          10mA

           9mA

           8mA

           7mA

           6mA

           5mA

           4mA

           3mA

           2mA

           1mA

            0A
                 0V      5V       10V   15V     20V    25V   30V     35V        40V      45V     50V
                      I(R1)
                                                      V_V1




Evaluation Circuit


                                        R1

                                        0.01m                           U17           open
                                                      open                     open

                              V1                      open                     open
                                                                                             Ropen
                       0Vdc
                                                                               open          100MEG

                                                                               open

                                                                   TPC8212-H             0


                              0




                 All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
Zener Voltage Characteristic                                         Reference




            All Rights Reserved Copyright (c) Bee Technologies Inc. 2006

More Related Content

What's hot

SPICE MODEL of TPC6005 (Professional+BDS Model) in SPICE PARK
SPICE MODEL of TPC6005 (Professional+BDS Model) in SPICE PARKSPICE MODEL of TPC6005 (Professional+BDS Model) in SPICE PARK
SPICE MODEL of TPC6005 (Professional+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK4064LS (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4064LS (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK4064LS (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4064LS (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCA8015-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8015-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8015-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8015-H (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK3872-01S (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3872-01S (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3872-01S (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3872-01S (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of SSM3K14T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K14T (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3K14T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K14T (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK2461 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2461 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK2461 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2461 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK2563 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK2563 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK2563 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK2563 (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPC8027 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8027 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8027 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8027 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARKSPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPC6005 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6005 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC6005 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6005 (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK3938 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3938 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3938 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3938 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK3058 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3058 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK3058 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3058 (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCA8015-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8015-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8015-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8015-H (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK3872-01S (Professional+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3872-01S (Professional+BDS Model) in SPICE PARKSPICE MODEL of 2SK3872-01S (Professional+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3872-01S (Professional+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK2740 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2740 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK2740 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2740 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK3872-01S (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3872-01S (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK3872-01S (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3872-01S (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK4101LS (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4101LS (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK4101LS (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4101LS (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK4122LS (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4122LS (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK4122LS (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4122LS (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK3872-01L (Professional+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3872-01L (Professional+BDS Model) in SPICE PARKSPICE MODEL of 2SK3872-01L (Professional+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3872-01L (Professional+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 

What's hot (20)

SPICE MODEL of TPC6005 (Professional+BDS Model) in SPICE PARK
SPICE MODEL of TPC6005 (Professional+BDS Model) in SPICE PARKSPICE MODEL of TPC6005 (Professional+BDS Model) in SPICE PARK
SPICE MODEL of TPC6005 (Professional+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK4064LS (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4064LS (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK4064LS (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4064LS (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8015-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8015-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8015-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8015-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SK3872-01S (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3872-01S (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3872-01S (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3872-01S (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM3K14T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K14T (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3K14T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K14T (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK2461 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2461 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK2461 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2461 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK2563 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK2563 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK2563 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK2563 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPC8027 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8027 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8027 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8027 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARKSPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARK
 
SPICE MODEL of TPC6005 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6005 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC6005 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6005 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SK3938 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3938 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3938 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3938 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK3058 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3058 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK3058 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3058 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCA8015-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8015-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8015-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8015-H (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK3872-01S (Professional+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3872-01S (Professional+BDS Model) in SPICE PARKSPICE MODEL of 2SK3872-01S (Professional+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3872-01S (Professional+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK2740 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2740 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK2740 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2740 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK3872-01S (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3872-01S (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK3872-01S (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3872-01S (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SK4101LS (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4101LS (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK4101LS (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4101LS (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK4122LS (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4122LS (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK4122LS (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4122LS (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK3872-01L (Professional+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3872-01L (Professional+BDS Model) in SPICE PARKSPICE MODEL of 2SK3872-01L (Professional+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3872-01L (Professional+BDS Model) in SPICE PARK
 

Similar to SPICE MODEL of TPC8212-H (Standard+BDS Model) in SPICE PARK

SPICE MODEL of 2SK4076 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK4076 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK4076 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK4076 (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK4076 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4076 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK4076 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4076 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK3669 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3669 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3669 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3669 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK3869 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3869 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK3869 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3869 (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of SSM3K15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K15FU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3K15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K15FU (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SJ334 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ334 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SJ334 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ334 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK4077 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK4077 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK4077 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK4077 (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCA8A02-H (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of TPCA8A02-H (Professional+BDSP Model) in SPICE PARKSPICE MODEL of TPCA8A02-H (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of TPCA8A02-H (Professional+BDSP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCA8023-H (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of TPCA8023-H (Professional+BDSP Model) in SPICE PARKSPICE MODEL of TPCA8023-H (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of TPCA8023-H (Professional+BDSP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK3869 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3869 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3869 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3869 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPC6003 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6003 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC6003 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6003 (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of MP4212 (Professional+BDP N&P Model) in SPICE PARK
SPICE MODEL of MP4212 (Professional+BDP N&P Model) in SPICE PARKSPICE MODEL of MP4212 (Professional+BDP N&P Model) in SPICE PARK
SPICE MODEL of MP4212 (Professional+BDP N&P Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPC8032-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8032-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8032-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8032-H (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of SSM3K15FU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K15FU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K15FU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K15FU (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SJ438 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ438 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SJ438 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ438 (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK3903 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3903 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3903 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3903 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of SPW47N60CFD (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of SPW47N60CFD (Professional+BDSP Model) in SPICE PARKSPICE MODEL of SPW47N60CFD (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of SPW47N60CFD (Professional+BDSP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of SPW47N60CFD(PSpice)
SPICE MODEL of SPW47N60CFD(PSpice)SPICE MODEL of SPW47N60CFD(PSpice)
SPICE MODEL of SPW47N60CFD(PSpice)
Tsuyoshi Horigome
 
SPICE MODEL of TPCF8302 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCF8302 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCF8302 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCF8302 (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 

Similar to SPICE MODEL of TPC8212-H (Standard+BDS Model) in SPICE PARK (20)

SPICE MODEL of 2SK4076 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK4076 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK4076 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK4076 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SK4076 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4076 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK4076 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4076 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK3669 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3669 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3669 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3669 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK3869 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3869 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK3869 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3869 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3K15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K15FU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3K15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K15FU (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SJ334 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ334 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SJ334 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ334 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK4077 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK4077 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK4077 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK4077 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCA8A02-H (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of TPCA8A02-H (Professional+BDSP Model) in SPICE PARKSPICE MODEL of TPCA8A02-H (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of TPCA8A02-H (Professional+BDSP Model) in SPICE PARK
 
SPICE MODEL of TPCA8023-H (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of TPCA8023-H (Professional+BDSP Model) in SPICE PARKSPICE MODEL of TPCA8023-H (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of TPCA8023-H (Professional+BDSP Model) in SPICE PARK
 
SPICE MODEL of 2SK3869 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3869 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3869 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3869 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPC6003 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6003 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC6003 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6003 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of MP4212 (Professional+BDP N&P Model) in SPICE PARK
SPICE MODEL of MP4212 (Professional+BDP N&P Model) in SPICE PARKSPICE MODEL of MP4212 (Professional+BDP N&P Model) in SPICE PARK
SPICE MODEL of MP4212 (Professional+BDP N&P Model) in SPICE PARK
 
SPICE MODEL of TPC8032-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8032-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8032-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8032-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3K15FU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K15FU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K15FU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K15FU (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SJ438 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ438 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SJ438 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ438 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SK3903 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3903 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3903 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3903 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SPW47N60CFD (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of SPW47N60CFD (Professional+BDSP Model) in SPICE PARKSPICE MODEL of SPW47N60CFD (Professional+BDSP Model) in SPICE PARK
SPICE MODEL of SPW47N60CFD (Professional+BDSP Model) in SPICE PARK
 
SPICE MODEL of SPW47N60CFD(PSpice)
SPICE MODEL of SPW47N60CFD(PSpice)SPICE MODEL of SPW47N60CFD(PSpice)
SPICE MODEL of SPW47N60CFD(PSpice)
 
SPICE MODEL of TPCF8302 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCF8302 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCF8302 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCF8302 (Professional+BDP Model) in SPICE PARK
 

More from Tsuyoshi Horigome

FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
Tsuyoshi Horigome
 
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Tsuyoshi Horigome
 
SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )
Tsuyoshi Horigome
 
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Tsuyoshi Horigome
 
SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )
Tsuyoshi Horigome
 
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Tsuyoshi Horigome
 
SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )
Tsuyoshi Horigome
 
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Tsuyoshi Horigome
 
SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )
Tsuyoshi Horigome
 
Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)
Tsuyoshi Horigome
 
Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)
Tsuyoshi Horigome
 
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
Tsuyoshi Horigome
 
PSpice simulation of power supply for TI is Error
PSpice simulation of power supply  for TI is ErrorPSpice simulation of power supply  for TI is Error
PSpice simulation of power supply for TI is Error
Tsuyoshi Horigome
 
IGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintIGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or Rgint
Tsuyoshi Horigome
 
Electronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsElectronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposals
Tsuyoshi Horigome
 
Electronic component sales method focused on new hires
Electronic component sales method focused on new hiresElectronic component sales method focused on new hires
Electronic component sales method focused on new hires
Tsuyoshi Horigome
 
Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)
Tsuyoshi Horigome
 
Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出
Tsuyoshi Horigome
 
伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)
Tsuyoshi Horigome
 
DXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモDXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモ
Tsuyoshi Horigome
 

More from Tsuyoshi Horigome (20)

FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
 
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
 
SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )
 
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
 
SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )
 
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
 
SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )
 
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
 
SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )
 
Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)
 
Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)
 
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
 
PSpice simulation of power supply for TI is Error
PSpice simulation of power supply  for TI is ErrorPSpice simulation of power supply  for TI is Error
PSpice simulation of power supply for TI is Error
 
IGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintIGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or Rgint
 
Electronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsElectronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposals
 
Electronic component sales method focused on new hires
Electronic component sales method focused on new hiresElectronic component sales method focused on new hires
Electronic component sales method focused on new hires
 
Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)
 
Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出
 
伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)
 
DXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモDXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモ
 

Recently uploaded

Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...
Ramesh Iyer
 
DevOps and Testing slides at DASA Connect
DevOps and Testing slides at DASA ConnectDevOps and Testing slides at DASA Connect
DevOps and Testing slides at DASA Connect
Kari Kakkonen
 
Mission to Decommission: Importance of Decommissioning Products to Increase E...
Mission to Decommission: Importance of Decommissioning Products to Increase E...Mission to Decommission: Importance of Decommissioning Products to Increase E...
Mission to Decommission: Importance of Decommissioning Products to Increase E...
Product School
 
Bits & Pixels using AI for Good.........
Bits & Pixels using AI for Good.........Bits & Pixels using AI for Good.........
Bits & Pixels using AI for Good.........
Alison B. Lowndes
 
UiPath Test Automation using UiPath Test Suite series, part 3
UiPath Test Automation using UiPath Test Suite series, part 3UiPath Test Automation using UiPath Test Suite series, part 3
UiPath Test Automation using UiPath Test Suite series, part 3
DianaGray10
 
Designing Great Products: The Power of Design and Leadership by Chief Designe...
Designing Great Products: The Power of Design and Leadership by Chief Designe...Designing Great Products: The Power of Design and Leadership by Chief Designe...
Designing Great Products: The Power of Design and Leadership by Chief Designe...
Product School
 
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...
UiPathCommunity
 
How world-class product teams are winning in the AI era by CEO and Founder, P...
How world-class product teams are winning in the AI era by CEO and Founder, P...How world-class product teams are winning in the AI era by CEO and Founder, P...
How world-class product teams are winning in the AI era by CEO and Founder, P...
Product School
 
From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...
From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...
From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...
Product School
 
Assuring Contact Center Experiences for Your Customers With ThousandEyes
Assuring Contact Center Experiences for Your Customers With ThousandEyesAssuring Contact Center Experiences for Your Customers With ThousandEyes
Assuring Contact Center Experiences for Your Customers With ThousandEyes
ThousandEyes
 
Software Delivery At the Speed of AI: Inflectra Invests In AI-Powered Quality
Software Delivery At the Speed of AI: Inflectra Invests In AI-Powered QualitySoftware Delivery At the Speed of AI: Inflectra Invests In AI-Powered Quality
Software Delivery At the Speed of AI: Inflectra Invests In AI-Powered Quality
Inflectra
 
ODC, Data Fabric and Architecture User Group
ODC, Data Fabric and Architecture User GroupODC, Data Fabric and Architecture User Group
ODC, Data Fabric and Architecture User Group
CatarinaPereira64715
 
De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...
De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...
De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...
Product School
 
Knowledge engineering: from people to machines and back
Knowledge engineering: from people to machines and backKnowledge engineering: from people to machines and back
Knowledge engineering: from people to machines and back
Elena Simperl
 
GraphRAG is All You need? LLM & Knowledge Graph
GraphRAG is All You need? LLM & Knowledge GraphGraphRAG is All You need? LLM & Knowledge Graph
GraphRAG is All You need? LLM & Knowledge Graph
Guy Korland
 
"Impact of front-end architecture on development cost", Viktor Turskyi
"Impact of front-end architecture on development cost", Viktor Turskyi"Impact of front-end architecture on development cost", Viktor Turskyi
"Impact of front-end architecture on development cost", Viktor Turskyi
Fwdays
 
FIDO Alliance Osaka Seminar: FIDO Security Aspects.pdf
FIDO Alliance Osaka Seminar: FIDO Security Aspects.pdfFIDO Alliance Osaka Seminar: FIDO Security Aspects.pdf
FIDO Alliance Osaka Seminar: FIDO Security Aspects.pdf
FIDO Alliance
 
The Future of Platform Engineering
The Future of Platform EngineeringThe Future of Platform Engineering
The Future of Platform Engineering
Jemma Hussein Allen
 
GenAISummit 2024 May 28 Sri Ambati Keynote: AGI Belongs to The Community in O...
GenAISummit 2024 May 28 Sri Ambati Keynote: AGI Belongs to The Community in O...GenAISummit 2024 May 28 Sri Ambati Keynote: AGI Belongs to The Community in O...
GenAISummit 2024 May 28 Sri Ambati Keynote: AGI Belongs to The Community in O...
Sri Ambati
 
State of ICS and IoT Cyber Threat Landscape Report 2024 preview
State of ICS and IoT Cyber Threat Landscape Report 2024 previewState of ICS and IoT Cyber Threat Landscape Report 2024 preview
State of ICS and IoT Cyber Threat Landscape Report 2024 preview
Prayukth K V
 

Recently uploaded (20)

Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...
 
DevOps and Testing slides at DASA Connect
DevOps and Testing slides at DASA ConnectDevOps and Testing slides at DASA Connect
DevOps and Testing slides at DASA Connect
 
Mission to Decommission: Importance of Decommissioning Products to Increase E...
Mission to Decommission: Importance of Decommissioning Products to Increase E...Mission to Decommission: Importance of Decommissioning Products to Increase E...
Mission to Decommission: Importance of Decommissioning Products to Increase E...
 
Bits & Pixels using AI for Good.........
Bits & Pixels using AI for Good.........Bits & Pixels using AI for Good.........
Bits & Pixels using AI for Good.........
 
UiPath Test Automation using UiPath Test Suite series, part 3
UiPath Test Automation using UiPath Test Suite series, part 3UiPath Test Automation using UiPath Test Suite series, part 3
UiPath Test Automation using UiPath Test Suite series, part 3
 
Designing Great Products: The Power of Design and Leadership by Chief Designe...
Designing Great Products: The Power of Design and Leadership by Chief Designe...Designing Great Products: The Power of Design and Leadership by Chief Designe...
Designing Great Products: The Power of Design and Leadership by Chief Designe...
 
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...
 
How world-class product teams are winning in the AI era by CEO and Founder, P...
How world-class product teams are winning in the AI era by CEO and Founder, P...How world-class product teams are winning in the AI era by CEO and Founder, P...
How world-class product teams are winning in the AI era by CEO and Founder, P...
 
From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...
From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...
From Siloed Products to Connected Ecosystem: Building a Sustainable and Scala...
 
Assuring Contact Center Experiences for Your Customers With ThousandEyes
Assuring Contact Center Experiences for Your Customers With ThousandEyesAssuring Contact Center Experiences for Your Customers With ThousandEyes
Assuring Contact Center Experiences for Your Customers With ThousandEyes
 
Software Delivery At the Speed of AI: Inflectra Invests In AI-Powered Quality
Software Delivery At the Speed of AI: Inflectra Invests In AI-Powered QualitySoftware Delivery At the Speed of AI: Inflectra Invests In AI-Powered Quality
Software Delivery At the Speed of AI: Inflectra Invests In AI-Powered Quality
 
ODC, Data Fabric and Architecture User Group
ODC, Data Fabric and Architecture User GroupODC, Data Fabric and Architecture User Group
ODC, Data Fabric and Architecture User Group
 
De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...
De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...
De-mystifying Zero to One: Design Informed Techniques for Greenfield Innovati...
 
Knowledge engineering: from people to machines and back
Knowledge engineering: from people to machines and backKnowledge engineering: from people to machines and back
Knowledge engineering: from people to machines and back
 
GraphRAG is All You need? LLM & Knowledge Graph
GraphRAG is All You need? LLM & Knowledge GraphGraphRAG is All You need? LLM & Knowledge Graph
GraphRAG is All You need? LLM & Knowledge Graph
 
"Impact of front-end architecture on development cost", Viktor Turskyi
"Impact of front-end architecture on development cost", Viktor Turskyi"Impact of front-end architecture on development cost", Viktor Turskyi
"Impact of front-end architecture on development cost", Viktor Turskyi
 
FIDO Alliance Osaka Seminar: FIDO Security Aspects.pdf
FIDO Alliance Osaka Seminar: FIDO Security Aspects.pdfFIDO Alliance Osaka Seminar: FIDO Security Aspects.pdf
FIDO Alliance Osaka Seminar: FIDO Security Aspects.pdf
 
The Future of Platform Engineering
The Future of Platform EngineeringThe Future of Platform Engineering
The Future of Platform Engineering
 
GenAISummit 2024 May 28 Sri Ambati Keynote: AGI Belongs to The Community in O...
GenAISummit 2024 May 28 Sri Ambati Keynote: AGI Belongs to The Community in O...GenAISummit 2024 May 28 Sri Ambati Keynote: AGI Belongs to The Community in O...
GenAISummit 2024 May 28 Sri Ambati Keynote: AGI Belongs to The Community in O...
 
State of ICS and IoT Cyber Threat Landscape Report 2024 preview
State of ICS and IoT Cyber Threat Landscape Report 2024 previewState of ICS and IoT Cyber Threat Landscape Report 2024 preview
State of ICS and IoT Cyber Threat Landscape Report 2024 preview
 

SPICE MODEL of TPC8212-H (Standard+BDS Model) in SPICE PARK

  • 1. Device Modeling Report COMPONENTS: Power MOSFET (Model Parameter) PART NUMBER: TPC8212-H MANUFACTURER: TOSHIBA Body Diode (Model Parameter) / ESD Protection Diode Bee Technologies Inc. All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
  • 2. MOSFET MODEL Pspice model Model description parameter LEVEL L Channel Length W Channel Width KP Transconductance RS Source Ohmic Resistance RD Ohmic Drain Resistance VTO Zero-bias Threshold Voltage RDS Drain-Source Shunt Resistance TOX Gate Oxide Thickness CGSO Zero-bias Gate-Source Capacitance CGDO Zero-bias Gate-Drain Capacitance CBD Zero-bias Bulk-Drain Junction Capacitance MJ Bulk Junction Grading Coefficient PB Bulk Junction Potential FC Bulk Junction Forward-bias Capacitance Coefficient RG Gate Ohmic Resistance IS Bulk Junction Saturation Current N Bulk Junction Emission Coefficient RB Bulk Series Resistance PHI Surface Inversion Potential GAMMA Body-effect Parameter DELTA Width effect on Threshold Voltage ETA Static Feedback on Threshold Voltage THETA Modility Modulation KAPPA Saturation Field Factor VMAX Maximum Drift Velocity of Carriers XJ Metallurgical Junction Depth UO Surface Mobility All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
  • 3. Transconductance Characteristic Circuit Simulation Result Comparison table gfs Id(A) Error(%) Measurement Simulation 0.500 6.000 6.105 1.750 1.000 8.200 8.230 0.366 2.000 12.000 12.260 2.167 5.000 17.500 17.950 2.571 All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
  • 4. Vgs-Id Characteristic Circuit Simulation result 8.0A 6.0A 4.0A 2.0A 0A 0V 1.0V 2.0V 3.0V 4.0V 5.0V 6.0V I(V3) V_V2 Evaluation circuit U17 V3 0Vdc open open open open open V1 TPC8212-H 10Vdc R1 V2 0Vdc 100MEG 0 0 All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
  • 5. Comparison Graph Circuit Simulation Result Simulation Result VGS(V) ID(A) Error (%) Measurement Simulation 1.000 2.850 2.842 -0.281 2.000 2.950 2.945 -0.169 4.000 3.100 3.099 -0.032 6.000 3.230 3.223 -0.217 8.000 3.330 3.332 0.060 All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
  • 6. Rds(on) Characteristic Circuit Simulation result 4.0A 3.0A 2.0A 1.0A 0A 0V 20mV 40mV 60mV 80mV 100mV I(V3) V_VDS Evaluation circuit U17 V3 0Vdc open open open open open VGS 0Vdc VDS Ropen 10Vdc TPC8212-H 100MEG 0 0 Simulation Result ID=3.0A, VGS=10V Measurement Simulation Error (%) R DS (on) 16.000 m 16.032 m 0.200 All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
  • 7. Gate Charge Characteristic Circuit Simulation result 20V 15V 10V 5V 0V 0 6n 12n 18n 24n 30n V(W1:3) Time*1mS Evaluation circuit V2 0Vdc open open open W1 open open + D1 I2 Ropen TD = 0 - 100MEG TF = 10n I1 TPC8212-H 6Adc PW = 600u Dbreak PER = 1000u W I1 = 0 ION = 0uA I2 = 1m IOFF = 100uA V1 0 TR = 10n 24Vdc 0 Simulation Result VDD=24V,ID=6.0A Measurement Simulation Error (%) ,VGS=10V Qgs 3.100 nC 3.120 nC 0.645 Qgd 4.100 nC 4.194 nC 2.293 Qg 16.000 nC 14.698 nC -8.138 All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
  • 8. Capacitance Characteristic Measurement Simulation Simulation Result Cbd(nF) VDS(V) Error(%) Measurement Simulation 0.100 0.850 0.855 0.588 0.200 0.800 0.790 -1.250 0.500 0.710 0.705 -0.704 1.000 0.620 0.622 0.323 2.000 0.510 0.515 0.980 5.000 0.370 0.366 -1.081 10.000 0.300 0.304 1.333 20.000 0.220 0.217 -1.364 All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
  • 9. Switching Time Characteristic Circuit Simulation result 14 10 5 0 1.95us 2.00us 2.05us 2.10us V(R1:1) V(L2:1)/1.5 Time Evaluation circuit U17 L2 R2 RG L1 50nH 5 30nH open open open 4.7 open open V1 = 0 V2 = 20 V2 R1 TD = 2u TPC8212-H V1 Ropen 4.7 15Vdc TR = 6n 100MEG TF = 7n PW = 20u PER = 2000u 0 0 Simulation Result ID=3.0A, VDD=15V Measurement Simulation Error(%) VGS=0/10V ton 11.000 ns 11.070 ns 0.636 All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
  • 10. Output Characteristic Circuit Simulation result 10A 10V 6V 3.6V 8V 8A 3.5V 6A 3.4V 4A 3.3V 2A VGS=3.1V 0A 0V 0.4V 0.8V 1.2V 1.6V 2.0V I(Vdsense) V_Vvariable Evaluation circuit Vdsense U17 0Vdc Vv ariable Vstep open open 10Vdc open open open 10Vdc TPC8212-H R1 100MEG 0 0 All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
  • 11. Forward Current Characteristic Circuit Simulation Result 20A 10A 1.0A 0V 0.4V 0.8V 1.2V I(R1) V_V1 Evaluation Circuit R1 0.01m openopen open TPC8212-H V1 Ropen 0Vdc U17 100MEG openopen 0 0 All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
  • 12. Comparison Graph Circuit Simulation Result Simulation Result VDS (V) VDS (V) IDR (A) Measurement Simulation %Error 1.000 0.700 0.699 -0.143 2.000 0.730 0.732 0.274 5.000 0.795 0.790 -0.629 10.000 0.850 0.854 0.471 20.000 0.960 0.959 -0.104 All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
  • 13. Reverse Recovery Characteristic Circuit Simulation Result 400mA 300mA 200mA 100mA -0mA -100mA -200mA -300mA -400mA 0.92us 1.18us I(R1) Time Evaluation Circuit R1 50 openopen open TPC8212-H V1 = -9.4v V1 U18 Ropen V2 = 10.6v TD = 0 100MEG TR = 10ns TF = 10ns PW = 1us PER = 100us openopen 0 0 Compare Measurement vs. Simulation Measurement Simulation Error (%) trj 10.400 ns 12.466 ns 19.865 trb 56.000 ns 73.558 ns 31.354 trr 66.400 ns 86.024 ns 29.554 All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
  • 14. Reverse Recovery Characteristic Reference Trj=10.4(ns) Trb=56.0(ns) Conditions:Ifwd=lrev=0.2(A),Rl=50 Example Relation between trj and trb All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
  • 15. Zener Voltage Characteristic Circuit Simulation Result 10mA 9mA 8mA 7mA 6mA 5mA 4mA 3mA 2mA 1mA 0A 0V 5V 10V 15V 20V 25V 30V 35V 40V 45V 50V I(R1) V_V1 Evaluation Circuit R1 0.01m U17 open open open V1 open open Ropen 0Vdc open 100MEG open TPC8212-H 0 0 All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
  • 16. Zener Voltage Characteristic Reference All Rights Reserved Copyright (c) Bee Technologies Inc. 2006