Aem Lect19

The document summarizes key aspects of low-temperature co-fired ceramic (LTCC) technology for applications in radio frequency (RF) modules. It discusses how LTCC enables miniaturization through multi-layer integration at lower costs than other technologies like thin film. Specific advantages highlighted include high density packaging, parallel processing for shorter development times, design flexibility through buried passive components, and compatibility with various conductors and materials for resistors and capacitors suitable for co-firing. Process details covered include via formation, conductor printing, lamination, and sintering around 850°C to enable silver electrodes. Example applications and performance metrics are also summarized.