This document provides information about a high frequency crossover device called the XOB1208F200S-T. It is a surface mount component made of high purity alumina and copper microstrip transmission lines. It has a bandwidth exceeding 20 GHz and is suitable for applications beyond 5 GHz like optical modules. It has tight impedance control of 50 ohms and provides signal integrity for routing transitions on single layer boards. Custom prototypes and full production capacity are available.

1. Product Family: TFT High Frequency
Susumu World Group
Cross-Over
Part Number: XOB1208F200S-T*
Construction: Features:
High purity Alumina substrate. Tightly controlled 50Ω impedance
Copper Microstrip transmission line. microstrip transmission line.
Lead-free 12mil diameter BGA High frequency performance
termination (Gnd.-Signal-Gnd.). (Bandwidth exceeding 20 GHz).
Epoxy-resin overcoat. BGA Gnd.-Signal-Gnd. termination
for high frequency lead-in, lead-out.
Volume production - suitable for
commercial and custom applications.
Competitive pricing.
Description:
Significance: This high frequency crossover device is a surface mount component that provides excellent signal integrity
characteristics beyond 20 GHz to be achieved while allowing circuit routing transitions with traditional BGA manufacturing
techniques on single layer board layouts that normally require significantly more expensive multi-layer RF and microwave PCB
manufacturing or RF cabling assemblies.
Application: High frequency applications addressed by this type of device include optical to electrical modules, Test Instrument
Load boards, Test instrumentation modules, and any other systems with signal bandwidths beyond 5GHz embedded in single
layer high frequency design environments.
Field reports/Reference Customers: Thin Film Technology has demonstrated very good high frequency component
packaging with many optical module companies through 40 Gbps applications. TFT utilizes simulation techniques and also
capitalizes on the advantages of thin film construction to realize high performance electrical components. These devices are
realized using high performance service for your design support including fast turn custom prototypes to full production
capacity start to finish.
Mechanical Specifications:
Package Size: 3220 (mm) = 1208 (in.)
x-dimen. 2.0mm = 0.08 inch
y-dimen. 3.2mm = 0.12 inch
Package Height: 0.65mm Max. = 26mil
Base Pitch: 0.635mm = 25mil
x-axis 0.635mm = 25mil
y-axis 2.540mm = 100mil
Solder Sphere Diameter: Dia. = 0.305mm = 12mil
Solder Ball Composition: RoHS Compliant (Lead Free)
95.5% Sn / 3.8% Ag / 0.7% Cu
Solder Coplanarity: ±0.076 mm = ±3 mil
Passivation: Top and bottom package sides
Marking: Top Package Side
Pin #1 Identifier: Corner of pin "A1"
Note:
To ensure high frequency performance, reference the suggested footprint (listed in this specification).

2. Electrical Specifications:
Type: Transmission Line Structure
Schematic:
Function: High Frequency Cross-Over
Characteristic Impedance: Zo = 50Ω ± 5%
Bandwidth (Defined by Insertion Loss): DC to 10 GHz < 1dB Insertion Loss
10 to 20 GHz < 2dB Insertion Loss
Return Loss < 20dB from DC to 5 GHz
< 12dB from 5 to 10 GHz
< 10dB from 10 to 20 GHz
Isolation to "Cross-Over Trans. Line": < 40dB from DC to 6 GHz
< 20dB from 6 to 20 GHz
Rise Time <100 ps
DC Resistance 0.5Ω Max.
Rated Current 100 mAmps
Isolation Resistance to Pkg. Gnd. Plane: >100 MΩ @ 50 Volts DC Notes:
Operating Temperature: -40°C to 125°C Gnd.-Signal-Gnd. BGA Configuration.
Storage Temperature: -55°C to 155°C
Typical Frequency Characteristics:
Insertion Loss (Component) Return Loss (Component) Isolation to "Cross-Over Trans. Line"
Recommended Land Pattern:
Recommended Pad Material Copper
Minimum Land pad Thickness 1/2 Ounce Cu (17 µm)
T.L. Copper Pad Diameter 0.30 ± 0.05 mm
Solder Mask Opening 0.30 ± 0.05 mm
Solder Volume per Pad 0.014 cu. mm (863 cu. mils)
Recommended Reflow Limits
(Sn95.5/Ag3.8/Cu0.7, RoHS
compliant / Lead Free solder
finish)
Max. Temperature 260°C
Max. Temp. Soak Time 120 seconds
Misregistration Recovery 0.10 mm
Note:
Using the above footprint and test board produced the frequency performance showed in the above plots.
Deviation from this recommended footprint could affect frequency performance of this device.

3. Marking:
Marking Specification General Guidelines
Pin #1 Identifier Corner of pin "A1" location
Row #1
Logo TFT "don't stop" logo
Date code "Z" = one digit monthly date code
Packaging:
Packaging Specification General Guidelines & Recommendations
Genaral Drawing Notes All dimensions are in mm.
Not drawin to scale.
Drawing Dimensional Call-outs Ao = 2.570 ± 0.100 mm
Bo = 3.330 ± 0.100 mm
Ko = 0.840 ± 0.100 mm
K1 = 0.229 ± 0.100 mm
Packaging Materials Carrier tape part #: 3M058061.
Cover tape part #: Vendor determined.
Reel size: 7" or 13" Quantity dependent.
Packaging Requirements All taping done in accordance with EIA 481 standards.
Pieces taped with the marking up and showing through the cover tape (as shown in
the above drawing).
All orders under 100pcs, will be put on cut tape only with no leader or trailer.
Orders 100 pcs or larger are packaged on tape and reel. See part number break
down for ordering information.
Labeling Requirements Labels will contain the TFT part number and quantity of pieces taped.
Part Number:
Thin Film Technology Corp., 1980 Commerce Drive, North Mankato, MN 56003, (507) 625-8445
www.thin-film.com