Emerging semiconductor substrates are expected to grow at a 24% CAGR from 2018 – 2024.
More information on https://www.i-micronews.com/products/emerging-semiconductor-substrates-market-technology-trends-2019/
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
Power SiC 2019: Materials, Devices, and Applications by Yole DéveloppementYole Developpement
Automotive market growth is reshaping the SiC market’s dynamics and ecosystem.
More information on: https://www.i-micronews.com/products/power-sic-2019-materials-devices-and-applications/
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...Yole Developpement
A closer look at the impressive, industry-first, tri-layer stacked CIS.
Sony leads the global CMOS Image Sensor (CIS) market, commanding more than a third share of the industry’s total revenue. And over the years, Sony has maintained its leadership by providing innovative CIS products for original equipment manufacturers like Samsung or Apple. In 2017, Sony as a smartphone designer decided to release in its flagship the latest and potentially the greatest innovation in the past decade of CIS manufacturing.
Inside the Sony Xperia™ XZs and the XZ Premium, the latest Motion Eye™ can be found, with the new IMX400 CIS. This three-layer stacked CIS is made with the traditional pixel array and logic circuit on the same die, but also a 1Gb DRAM memory allowing slow motion at almost 960 frames per second.
This innovative CIS is Sony’s next generation technology. The CIS includes a 22 Mpixel array, a 1Gb DRAM die and a digital signal processor (DSP) on the same die footprint. This is the first tri-layer stacked CIS on the market. In this configuration, Sony can provide a fast readout image sensor with no distortion when shooting fast-moving objects thanks to the high capacity DRAM between the pixel array circuit and the DSP circuit.
Using Sony’s Exmor-RS and Xperi’s Zibond technologies, Sony has managed to integrate the three dies in a single thin, small and cost-effective sensor die. Surprisingly, the die sensor uses a unique sort of TSV at different levels to interconnect the dies.
This report includes a complete analysis of the camera module from the Sony Xperia™ XZs, featuring camera module disassembly and die analyses, processes and cross-sections. It also includes a comparison with the Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level, it compares the IMX400 with the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, it contains a complete cost analysis and a selling price estimation of the CIS die.
More information on that report at http://www.i-micronews.com/reports.html
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Equipment and Materials for Fan-Out Packaging 2019 report by Yole Développement Yole Developpement
Electronic packaging equipment and materials revenue growth is highly reliant on big players’ investments. A new killer application is needed to fuel robust growth.
More information on https://www.i-micronews.com/products/equipment-and-materials-for-fan-out-packaging-2019/
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
Power SiC 2019: Materials, Devices, and Applications by Yole DéveloppementYole Developpement
Automotive market growth is reshaping the SiC market’s dynamics and ecosystem.
More information on: https://www.i-micronews.com/products/power-sic-2019-materials-devices-and-applications/
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...Yole Developpement
A closer look at the impressive, industry-first, tri-layer stacked CIS.
Sony leads the global CMOS Image Sensor (CIS) market, commanding more than a third share of the industry’s total revenue. And over the years, Sony has maintained its leadership by providing innovative CIS products for original equipment manufacturers like Samsung or Apple. In 2017, Sony as a smartphone designer decided to release in its flagship the latest and potentially the greatest innovation in the past decade of CIS manufacturing.
Inside the Sony Xperia™ XZs and the XZ Premium, the latest Motion Eye™ can be found, with the new IMX400 CIS. This three-layer stacked CIS is made with the traditional pixel array and logic circuit on the same die, but also a 1Gb DRAM memory allowing slow motion at almost 960 frames per second.
This innovative CIS is Sony’s next generation technology. The CIS includes a 22 Mpixel array, a 1Gb DRAM die and a digital signal processor (DSP) on the same die footprint. This is the first tri-layer stacked CIS on the market. In this configuration, Sony can provide a fast readout image sensor with no distortion when shooting fast-moving objects thanks to the high capacity DRAM between the pixel array circuit and the DSP circuit.
Using Sony’s Exmor-RS and Xperi’s Zibond technologies, Sony has managed to integrate the three dies in a single thin, small and cost-effective sensor die. Surprisingly, the die sensor uses a unique sort of TSV at different levels to interconnect the dies.
This report includes a complete analysis of the camera module from the Sony Xperia™ XZs, featuring camera module disassembly and die analyses, processes and cross-sections. It also includes a comparison with the Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level, it compares the IMX400 with the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, it contains a complete cost analysis and a selling price estimation of the CIS die.
More information on that report at http://www.i-micronews.com/reports.html
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Equipment and Materials for Fan-Out Packaging 2019 report by Yole Développement Yole Developpement
Electronic packaging equipment and materials revenue growth is highly reliant on big players’ investments. A new killer application is needed to fuel robust growth.
More information on https://www.i-micronews.com/products/equipment-and-materials-for-fan-out-packaging-2019/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
Bonding and Lithography Equipment Market for More than Moore Devices by Yole ...Yole Developpement
More than Moore devices fueled by megatrend applications will strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market.
More information on that report at https://www.i-micronews.com/report/product/bonding-and-lithography-equipment-market-for-more-than-moore-devices.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Jonathan Waldern (DigiLens): DigiLens Switchable Bragg Grating Waveguide Opti...AugmentedWorldExpo
A talk from the Develop Track at AWE USA 2018 - the World's #1 XR Conference & Expo in Santa Clara, California May 30- June 1, 2018.
Jonathan Waldern (DigiLens): DigiLens Switchable Bragg Grating Waveguide Optics for Augmented Reality Applications
This session will look at the key features of DigiLens waveguide technology and discusses our optical design methodology for designing and simulating the performance of DigiLens waveguides, giving examples from motorcycle, and autoHUD products.
http://AugmentedWorldExpo.com
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
MiniLED for Display Applications: LCD and Digital Signage report by Yole Déve...Yole Developpement
MiniLEDs bring new strength to LCD players in the battle against OLED and enable increased LED
adoption on digital signage.
More information on : https://www.i-micronews.com/report/product/miniled-for-display-applications-lcd-and-digital-signage.html
GaN-on-Si Substrate Technology and Market for LED and Power ElectronicsYole Developpement
GaN-on-Si enables GaN power electronics, will LED transition as well?
GaN-ON-Si LED IS ALREADY ADOPTED BY SOME LED MANUFACTURERS, BUT COULD IT BECOME THE INDUSTRY STANDARD?
Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternative to sapphire to reduce cost. Our cost simulation indicates that the differential in silicon substrate cost is not enough to justify the transition to GaN-on-Si technology. The main driver is the ability to manufacture in existing, depreciated CMOS fabs in 6” or 8”.
Despite potential cost benefits for LEDs, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Opinions regarding the chance of success for LED-on-Si vary widely in the LED industry from unconditional enthusiasm to unjustified skepticism. Virtually all major LED makers are researching GaN-on-Si LED, but few have made it the core of their strategy and technology roadmap. Among the proponents, only Lattice Power, Plessey and Toshiba have moved to production and are offering commercial LED-on-Si.
At Yole Développement, we believe that although significant improvements have been achieved, there are still some technology hurdles (performance, yields, CMOS compatibility). We consider that if the technology hurdles are cleared, GaN-on-Si LEDs will be adopted by some LED manufacturers, but will not become the industry standard. We expect that Silicon will capture less than 5% of LED manufacturing by 2020.
GaN-ON-Si TECHNOLOGY WILL BE WIDELY ADOPTED BY POWER ELECTRONICS APPLICATIONS
The power electronics market addresses applications such as AC to DC or DC to AC conversion, which is always associated with substantial energy losses that increase with higher power and operating frequencies. Incumbent silicon based technology is reaching its limit and it is difficult to meet higher requirements. GaN based power electronics have the potential to significantly improve efficiency at both high power and frequencies while reducing device complexity and weight. Power GaN are therefore emerging as a substitution to the silicon based technology. Today, Power GaN remains at its early stage and presents only a tiny part of power electronics market.
We are quite optimistic about the adoption of GaN-on-Si technology for Power GaN devices. GaN-on-Si technology have brought to market the first GaN devices. Contrary to the LED industry, where GaN-on-Sapphire technology is main stream and presents a challenging target, GaN-on-Si will dominate the GaN based power electronics market because of its lower cost and CMOS compatibility. Although GaN based devices remain more expensive than Si based devices today, the overall cost of GaN devices for some applications are expected to be lower than Si devices three years from now, according to some manufacturers.
http://www.i-micronews.com/reports/GaN-on-Si-Substrate-Market-LED-Power-Electronics/3/424/
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Status of the CMOS Image Sensor Industry 2017 - Report by Yole DeveloppementYole Developpement
New applications are transforming the market and technology playing field for CMOS image sensors
It’s ten years down the line from the initial Apple iPhone that started the smartphone era. Since then, CMOS imaging has benefited from huge market demand and a technology-driven environment, resulting in an $11.6B industry in 2016. Photography and video is the main application, which is totally transformed by new use cases, new devices and new technologies.
The mobile market is key for the CMOS image sensor (CIS) industry. Despite saturation in the number of handsets, the CIS market has been able to maintain a 10.5% compound annual growth rate (CAGR) for the 2016-2022 period due to the introduction of dual and 3D cameras. These additional cameras are changing the industry’s drivers from form factor and image quality to interactivity.
Penetration into higher added value markets such as automotive, security and medical shows that CIS products are transforming use cases across the board. CIS technology adoption allows greater automation levels at low cost, while using newly available computing architectures such as deep learning. The CMOS image sensor industry is currently in a virtuous circle where a new technology is providing true customer value.
Status of the Power Electronics Industry 2017 Report by Yole Developpement Yole Developpement
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022.
SOLAR AND ELECTRIC VEHICLE POWER CONVERTER MARKETS GREW SPECTACULARLY – BY MORE THAN 20% – LAST YEAR, DRIVING GROWTH IN THE EXPANDING IGBT MARKET
The power electronics sectors continue to expand their presence almost everywhere. Renewable energies and e-mobility, including electric and hybrid vehicles (EV/HEVs), are especially boosting this market. Both the solar and EV/HEV converter markets grew by over 20% between 2015 and 2016. At the semiconductor level, the power semiconductor market grew by 3.8% compared to 2015. This year, Yole Développement has enlarged its power semiconductor market analysis to all types of power integrated circuits (ICs) including power management ICs, linear regulators and switching regulators, representing a total market of $28B. Among all the different types of power devices including thyristors, MOSFETs, IGBTs and power ICs, IGBTs made the greatest progress, with around 8% growth.
Yole Développement’s decision to start analyzing the power IC market evolution closely is part of an effort to cover the whole power spectrum of this market. We now encompass the complete range from low power, low voltage, highly integrated power management ICs in mobile phones to more robust, high power IGCT modules used in trains.
The report also covers the fast-emerging wide band gap (WBG) semiconductor market, identifying today and tomorrow’s leading silicon carbide (SiC) and gallium nitride (GaN) players and the key technological details. ‘Status of Power Electronics Industry 2017 (SPEI 2017)’ describes the evolution and forecasts the future of the power inverter, power device and silicon wafer markets.
Polymeric Materials for Advanced Packaging at the Wafer-Level 2018 Report by...Yole Developpement
Polymeric materials market revenue will double over the next five years.
More information on that report at : https://www.i-micronews.com/report/product/polymeric-materials-for-advanced-packaging-at-the-wafer-level.html
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
InP Wafer and Epiwafer Market: Photonics and RF 2019 report by Yole Développe...Yole Developpement
Photonics (telecom, datacom, LiDAR, sensing and others...) is driving the InP wafer market.
As an old but still gold-standard member of the compound semiconductor family, InP possesses the key advantages of emission and detection capabilities over 1000 nm in the photonics domain, as well as high speed and low noise performance in high-frequency RF applications. Though it is
often overshadowed by rivals like GaAs and SiGe for mass-volume, cost-driven RF applications, InP remains a top choice for performance-driven niche markets like military communication, radar, and radiometry, as well as automatic test equipment. Moreover, different industrial actors (i.e. Skyworks, GCS, and IntelliEPI) are monitoring InP technology for the upcoming 5G move.
More information on that report at https://www.i-micronews.com/compound-semi-report/product/inp-wafer-and-epiwafer-market-photonic-and-rf-applications.html
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, and PV ApplicationsYole Developpement
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/category-listing/product/gaas-wafer-and-epiwafer-market-rf-photonics-led-and-pv-applications.html
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
Bonding and Lithography Equipment Market for More than Moore Devices by Yole ...Yole Developpement
More than Moore devices fueled by megatrend applications will strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market.
More information on that report at https://www.i-micronews.com/report/product/bonding-and-lithography-equipment-market-for-more-than-moore-devices.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Jonathan Waldern (DigiLens): DigiLens Switchable Bragg Grating Waveguide Opti...AugmentedWorldExpo
A talk from the Develop Track at AWE USA 2018 - the World's #1 XR Conference & Expo in Santa Clara, California May 30- June 1, 2018.
Jonathan Waldern (DigiLens): DigiLens Switchable Bragg Grating Waveguide Optics for Augmented Reality Applications
This session will look at the key features of DigiLens waveguide technology and discusses our optical design methodology for designing and simulating the performance of DigiLens waveguides, giving examples from motorcycle, and autoHUD products.
http://AugmentedWorldExpo.com
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
MiniLED for Display Applications: LCD and Digital Signage report by Yole Déve...Yole Developpement
MiniLEDs bring new strength to LCD players in the battle against OLED and enable increased LED
adoption on digital signage.
More information on : https://www.i-micronews.com/report/product/miniled-for-display-applications-lcd-and-digital-signage.html
GaN-on-Si Substrate Technology and Market for LED and Power ElectronicsYole Developpement
GaN-on-Si enables GaN power electronics, will LED transition as well?
GaN-ON-Si LED IS ALREADY ADOPTED BY SOME LED MANUFACTURERS, BUT COULD IT BECOME THE INDUSTRY STANDARD?
Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternative to sapphire to reduce cost. Our cost simulation indicates that the differential in silicon substrate cost is not enough to justify the transition to GaN-on-Si technology. The main driver is the ability to manufacture in existing, depreciated CMOS fabs in 6” or 8”.
Despite potential cost benefits for LEDs, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Opinions regarding the chance of success for LED-on-Si vary widely in the LED industry from unconditional enthusiasm to unjustified skepticism. Virtually all major LED makers are researching GaN-on-Si LED, but few have made it the core of their strategy and technology roadmap. Among the proponents, only Lattice Power, Plessey and Toshiba have moved to production and are offering commercial LED-on-Si.
At Yole Développement, we believe that although significant improvements have been achieved, there are still some technology hurdles (performance, yields, CMOS compatibility). We consider that if the technology hurdles are cleared, GaN-on-Si LEDs will be adopted by some LED manufacturers, but will not become the industry standard. We expect that Silicon will capture less than 5% of LED manufacturing by 2020.
GaN-ON-Si TECHNOLOGY WILL BE WIDELY ADOPTED BY POWER ELECTRONICS APPLICATIONS
The power electronics market addresses applications such as AC to DC or DC to AC conversion, which is always associated with substantial energy losses that increase with higher power and operating frequencies. Incumbent silicon based technology is reaching its limit and it is difficult to meet higher requirements. GaN based power electronics have the potential to significantly improve efficiency at both high power and frequencies while reducing device complexity and weight. Power GaN are therefore emerging as a substitution to the silicon based technology. Today, Power GaN remains at its early stage and presents only a tiny part of power electronics market.
We are quite optimistic about the adoption of GaN-on-Si technology for Power GaN devices. GaN-on-Si technology have brought to market the first GaN devices. Contrary to the LED industry, where GaN-on-Sapphire technology is main stream and presents a challenging target, GaN-on-Si will dominate the GaN based power electronics market because of its lower cost and CMOS compatibility. Although GaN based devices remain more expensive than Si based devices today, the overall cost of GaN devices for some applications are expected to be lower than Si devices three years from now, according to some manufacturers.
http://www.i-micronews.com/reports/GaN-on-Si-Substrate-Market-LED-Power-Electronics/3/424/
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Status of the CMOS Image Sensor Industry 2017 - Report by Yole DeveloppementYole Developpement
New applications are transforming the market and technology playing field for CMOS image sensors
It’s ten years down the line from the initial Apple iPhone that started the smartphone era. Since then, CMOS imaging has benefited from huge market demand and a technology-driven environment, resulting in an $11.6B industry in 2016. Photography and video is the main application, which is totally transformed by new use cases, new devices and new technologies.
The mobile market is key for the CMOS image sensor (CIS) industry. Despite saturation in the number of handsets, the CIS market has been able to maintain a 10.5% compound annual growth rate (CAGR) for the 2016-2022 period due to the introduction of dual and 3D cameras. These additional cameras are changing the industry’s drivers from form factor and image quality to interactivity.
Penetration into higher added value markets such as automotive, security and medical shows that CIS products are transforming use cases across the board. CIS technology adoption allows greater automation levels at low cost, while using newly available computing architectures such as deep learning. The CMOS image sensor industry is currently in a virtuous circle where a new technology is providing true customer value.
Status of the Power Electronics Industry 2017 Report by Yole Developpement Yole Developpement
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022.
SOLAR AND ELECTRIC VEHICLE POWER CONVERTER MARKETS GREW SPECTACULARLY – BY MORE THAN 20% – LAST YEAR, DRIVING GROWTH IN THE EXPANDING IGBT MARKET
The power electronics sectors continue to expand their presence almost everywhere. Renewable energies and e-mobility, including electric and hybrid vehicles (EV/HEVs), are especially boosting this market. Both the solar and EV/HEV converter markets grew by over 20% between 2015 and 2016. At the semiconductor level, the power semiconductor market grew by 3.8% compared to 2015. This year, Yole Développement has enlarged its power semiconductor market analysis to all types of power integrated circuits (ICs) including power management ICs, linear regulators and switching regulators, representing a total market of $28B. Among all the different types of power devices including thyristors, MOSFETs, IGBTs and power ICs, IGBTs made the greatest progress, with around 8% growth.
Yole Développement’s decision to start analyzing the power IC market evolution closely is part of an effort to cover the whole power spectrum of this market. We now encompass the complete range from low power, low voltage, highly integrated power management ICs in mobile phones to more robust, high power IGCT modules used in trains.
The report also covers the fast-emerging wide band gap (WBG) semiconductor market, identifying today and tomorrow’s leading silicon carbide (SiC) and gallium nitride (GaN) players and the key technological details. ‘Status of Power Electronics Industry 2017 (SPEI 2017)’ describes the evolution and forecasts the future of the power inverter, power device and silicon wafer markets.
Polymeric Materials for Advanced Packaging at the Wafer-Level 2018 Report by...Yole Developpement
Polymeric materials market revenue will double over the next five years.
More information on that report at : https://www.i-micronews.com/report/product/polymeric-materials-for-advanced-packaging-at-the-wafer-level.html
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
InP Wafer and Epiwafer Market: Photonics and RF 2019 report by Yole Développe...Yole Developpement
Photonics (telecom, datacom, LiDAR, sensing and others...) is driving the InP wafer market.
As an old but still gold-standard member of the compound semiconductor family, InP possesses the key advantages of emission and detection capabilities over 1000 nm in the photonics domain, as well as high speed and low noise performance in high-frequency RF applications. Though it is
often overshadowed by rivals like GaAs and SiGe for mass-volume, cost-driven RF applications, InP remains a top choice for performance-driven niche markets like military communication, radar, and radiometry, as well as automatic test equipment. Moreover, different industrial actors (i.e. Skyworks, GCS, and IntelliEPI) are monitoring InP technology for the upcoming 5G move.
More information on that report at https://www.i-micronews.com/compound-semi-report/product/inp-wafer-and-epiwafer-market-photonic-and-rf-applications.html
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, and PV ApplicationsYole Developpement
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/category-listing/product/gaas-wafer-and-epiwafer-market-rf-photonics-led-and-pv-applications.html
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Edge Emitting Lasers: Market and Technology Trends 2019 report by Yole Dévelo...Yole Developpement
Fast growing new applications will drive the EEL market to reach US$5.1B in 2024.
More information on https://www.i-micronews.com/products/edge-emitting-lasers-technology-industry-and-market-trends/
Phosphors and Quantum Dots 2017: LED downconverters for Lighting and Displays...Yole Developpement
Volume saturation, price pressure and a shifting intellectual property landscape are forcing the LED phosphor industry into a rationalization period, with innovation key for survival
EXPIRATION OF FUNDAMENTAL INTELLECTUAL PROPERTY CHANGES THE MATERIAL LANDSCAPE
Key patents held by Nichia and Osram have started expiring in 2017 and will continue to do so in 2018. While both companies have since built on those patents and created broad families of intellectual property (IP), it will become much more difficult for them to prevent competitors from using garnet phosphors in their LED packages.
As a result, phosphor families such as silicates and yellow nitrides (LYSN) are expected to lose market share as LED packagers transition to garnets. The switch will especially affect silicates, which are perceived to have lower performance than yttrium aluminum garnet (YAG) and other garnets, However, some of the most recent silicate compositions developed by tier-1 suppliers are now matching YAG performance but come at a premium price. Leading phosphor suppliers with a strong focus on silicate materials must therefore diversify their portfolio. They need to create new silicate compositions with unique features to meet specific demands in various high added value lighting applications.
LYSN might fare better in the long term. Yellow nitrides have exhibited steady and continuous performance improvement since entering the market in 2010. The material is already matching garnet performance in most aspects and, being less mature, still offers significant room for improvement. Attractive features of yellow nitride include a lower infrared tail that could translate to higher efficiency compared to YAG. Leaders in nitride phosphors could therefore find a new growth driver as the red nitride market reaches saturation.
More information on that report at http://www.i-micronews.com/reports.html
IR LEDS and VCSELs - Technology, Applications and Industry Trends - 2017 Repo...Yole Developpement
3D imaging, gas sensing and autofocus will fuel the IR light source market to reach US$3.8B in 2027.
INFRA-RED LIGHT SOURCES: A $1.5B OPPORTUNITY IN 2022 – AND POTENTIALLY $3.8B IN 2027 – DRIVEN BY SEVERAL NEW APPLICATIONS
The market for LED and laser infra-red (IR) light sources is not new, but has evolved rapidly with the recent development of Solid State Lighting (SSL). Initially developed for optical communication applications, these technologies, mostly IR LEDs, started to be integrated into consumer applications like remote controls in the 1980s. Next, the market was driven forward by night vision applications such as surveillance cameras. But it’s only recently, with the development of smartphones, that IR LEDs and lasers have come back to prominence. And now, the market is set for growth for the next 10 years! Today, these technologies are part of a new revolution, still driven by smartphone applications. Integration of breakthrough functionalities such as 3D imaging, autofocus, iris and face recognition is triggering a strong market pull for efficient, miniaturized and complex IR illumination. This trend will also create strong market opportunities for IR lasers, mostly VCSELs, which allow more coherent and directional light than IR LEDs. In this context, we expect the IR light source market to grow from around $450M in 2016 to around $1,550M in 2022 at a compound annual growth rate of 22.7%. In addition, there are also several other applications that are emerging and for which a market boom is likely to happen in the next 10 years. These include gas sensors, LIDARs, driver monitoring systems and remote patient monitoring sensors. We expect this second wave of new applications to propel the IR light source market to around $3,800M in 2027. This report provides an in-depth analysis of all IR light source applications, including: basic principles, technology, trends, key players, and market size. It highlights the global landscape for IR light sources, including classification of applications by wavelength, market segment and function. Detailed market forecasts are given based on these classifications and with complementary analysis by light source for LEDs, edge-emitting lasers and VCSELs. Please note that optical communication applications are not analyzed in this report.
For more information please visit our website: https://www.i-micronews.com/reports.html
Bulk GaN Substrate Market 2017 Report by Yole DeveloppementYole Developpement
Optoelectronics applications are driving the bulk GaN substrate market
Optoelectronics applications, particularly GaN-based laser diodes and GaN-on-GaN LEDs, are expected to drive the bulk GaN susbtrate market from 2016 - 2022.
Specific to the laser diode market, the Blu-ray segment, which in the past was the GaN-based laser industry’s main driver, continues to decline. In recent years, a much greater percentage of movies were viewed via streaming than on optical discs, and in many cases flash memory is replacing optical discs and magnetic storage. The current crop of mobile phones, netbooks, tablets, and even laptops lack a Blu-ray/DVD/CD drive. UHD Blu-ray’s recent development is expected to have only a novelty effect on sales - not enough to reverse the general downward trend we will see in the coming years. However, decreasing Blu-ray demand is expected to be offset by nascent, growing segments like projectors (office projector, mobile pico projector, head-up display (HUD), etc.) and automotive lighting, leading to new growth opportunities for bulk GaN substrates.
In the LED market, improvements in GaN substrate manufacturing have lowered substrate prices enough for various niche LED applications. In addition to Soraa (US) and Panasonic (JP), this seems to have revived the interest of other LED manufacturers which are beginning to seriously consider using GaN substrates for either spotlighting or automotive lighting. New GaN-on-GaN LED players are expected in the market in the coming years.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Industrial markets and applications reviewTechno Service
توفر شركة تكنوسيرفيس مجموعة أجهزة الكشف عن المعادن Thermo Scientific ™ Sentinel ™ والتي تتميز بأداء كشف عالي الحساسية لجودة منتجك ومدي احتمالية العثور على ملوثات معادن حديدية وغير حديدية وأي ملوثات في الأطعمة والمشروبات وغيرها من المنتجات.
باستخدام تقنيات مبتكرة مثل Multiscan ™ و Selectscan ™ ، تساعد أجهزة الكشف عن المعادن Sentinel الشركات المصنعة على زيادة سلامة وصحة العملاء وتحسين جودة المنتج وزيادة كفاءة الإنتاج.
اكتشف معنا كيف يمكن لمجموعة منتجات Sentinel تلبية احتياجات تطبيقاتك.
أهمية وجود أجهزة الكشف المعادن في خط إنتاجك ؟
1️⃣ أصبح الآن من الشروط الأساسية لدي منظمة الصحة والأغذية لحمايه المستهلك.
2️⃣ ضروري لمنح شهادة الأيزو لمنتجك
3️⃣ ضمان استمرارية البراند الخاص بك في السوق وحصوله علي سمعة طيبة نتيجة ضمان الجودة
تستخدم هذه الاجهزه على خطوط انتاج وتعبئه الاغذيه
(مثل المطاحن و مصانع الالبان والحلويات والبسكويت والشيكولاته والمكرونه والمخللات والخضروات والفواكه المجمده والايس كريم ..وغيرها)
مميزات الجهاز:
◀يمكنه الكشف عن المعادن داخل منتجك خلال مراحل عمليه التصنيع حتى التعبئه وبدقه عاليه
◀ يمكنه رفض كل المنتجات المخالفه لمعايير الجوده وسلامه الغذاء
◀ يتميز الجهاز بالشكل الانسيابي وصغر الحجم
◀الجهاز حاصل على شهاده من هيئه سلامه الغذاء FDA
◀ الجهاز حاصل على IP69K لمقاومه الماء
◀ السير مصنوع من اعلى الخامات جوده والتي تتحمل الاوزان الكبيره
◀ سهل برمجته والتدريب عليه وتوافر قطع الغيار والصيانه
◀ ضمان لمده عام كامل
◀ الجهاز به إنذار صوت وضوء
◀ مهندسين متخصصين للتركيب والتدريب علي الجهاز وحاصلين علي شهادات معتمدة من ThermoFisher
تطبيقات اجهزه الكشف عن المعادن والشوائب :
تستهدف اجهزه الكشف عن المعادن والشوائب (metal detectors وال x-ray) كل شركات ومصانع الاغذيه وقطاع سلامه الغذاء وخطوط الانتاج التي تسعى للحصول على شهادات الايزو والجوده .
تسعى تكنوسيرفيس لخدمه جميع عملائها باحترافيه عن طريق مساعدتهم للوصول للنجاح في جميع المجالات السابقه .
just call us 01116593835
http://technoservice-egypt.com/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
Power SiC 2018: Materials, Devices and Applications 2018 Report by Yole Devel...Yole Developpement
Automotive is putting SiC on the road. Is the supply chain ready?
More information on that report at : https://www.i-micronews.com/category-listing/product/power-sic-2018-materials-devices-and-applications.html
Growth, supply chain, new applications: inverter industry is about to redefine itself.
The inverter market is heavily application dependent. However, there are some cross-fertilization trends — companies with a good position within one inverter market segment are researching entry into other segments. Companies like Alstom, ABB, Ingeteam, Siemens, and General Electric already offer products in two or more inverter segments.
Some players have chosen vertical integration to optimize their internal cost structure to better target commodity-like markets, as well as to meet the severe cost requirements of the automotive industry. Other players have bet on horizontal integration to offer complete solutions to customers.
Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays 201...Yole Developpement
Traditional phosphors on the verge of commoditization due to expected strong push from China after YAG patents fall into public domain. But Quantum Dots are finally ready for prime time.
Strong price pressure stalls revenue growth and pressures margins but masks a more complex picture
While volumes are expected to more than double between 2015 and 2020, LED Phosphor prices have declined dramatically, leading to a flat revenue outlook. Low technology barriers of entrance on the most mature compositions have prompted companies to procure turnkey manufacturing equipment and enter the market. With little to no quality control and R&D expenses, some have achieved low cost comparable to that of the tri-phosphors used in fluorescent lamps. In a bid to capture market shares, they triggered an intense price war. With major YAG IP expiring from 2017, leading domestic vendors such as Yuji, Grirem, YT Shield, Illuma or Sunfor will finally access overseas markets, further increasing YAG commoditization. Phosphor makers are therefore shifting their efforts toward higher added value materials such as nitrides, which, while price have also decreased significantly during the period, have maintained better margins.
LED Lighting Module Technology Industry and Market Trends 2017 Report by Yole...Yole Developpement
After wide use in general lighting applications, LED module manufacturers are now looking for new applications with higher margins.
LED LIGHTING MODULE MARKET VALUE WILL TREBLE IN THE NEXT FIVE YEARS, DRIVEN BY MID-POWER MODULES
Light Emitting Diode (LED) technology is increasingly penetrating general lighting applications, thanks to how easily integrators can use it. The LED lighting module market will therefore deliver a 22.6% compound annual growth rate from 2017-2022.
Mid-power LEDs can be used in almost all applications. Mid-power LED modules are therefore driving the market, providing 60% of 2016’s market revenues. High power LEDs are used only in applications requiring high luminous flux in a small module. As a result, the number of applications using high power LED modules is limited and associated revenues represent about 7% of market revenues.
Chip-on-board (COB) LED modules provide a compromise on size, light emitting surface (LES) area, luminous flux and power consumption. COB LED modules can therefore be used in many applications, and lead the total LED module market in volumes shipped. But as these modules are relatively easy to manufacture in few steps the associated average selling price is low. Consequently, COB LED modules represent only 20% of market revenue.
Flexible LED strips can be directly used as LED lighting systems, mostly in indirect lighting applications. These modules can be easily implemented for residential and commercial lighting. Recent developments, like using LED chips instead of packaged LEDs on a flexible substrate, allow much higher efficiency, opening doors to new applications such as linear lighting.
In this context, Yole Développement estimates that the LED lighting module market, including flexible LED strips, reached nearly $4B in 2016 and will grow to $13.8B by 2022.
This report provides an in-depth analysis of each type of LED module, including technology, trends and market sizes. It covers the whole landscape of LED modules and their potential use in general lighting applications.
Roll-to-Roll ALD Coatings for Battery Cell Interfaces at Production ScaleBeneq
ALD/AVS 2022
Presented by D.Sc. Andrew Cook
ALD is an enabling technology for future batteries. ALD technology introduction has been hindered by lack of production scale equipment, but now Beneq R2R ALD technology offers a straightforward scale-up path to mass-production. Beneq has a long experience with R2R ALD on other application areas, and is now applying that know-how to offer R2R ALD solutions for battery manufacturing.
Technology market trends in LED downconverters presentation held by Eric Vire...Yole Developpement
Phosphor volumes to grow +/-at the same pace for “on-chip”
Surface blue LED chips combined with a downconverter Surface blue LED chips combined with a downconverter
Phosphor volumes to essentially double by 2020
Silicates could essentially disappear unless significant cost reduction and further performance improvement are achieved.
Increasing demand for high CRI in lighting broad band green and yellow + narrow band red.
Wider color gamut display: increasing demand for narrow band green and red.
No more room for ASP decrease.
Yet, YAG is not a commodity!
Overall flat revenue means pain and suffering + attrition (20+ suppliers in China only!)
But even in a difficult environment, some companies will grow and thrive
The most dramatic picture improvements come from higher dynamic contrast and extended color gamut!
More information on that report at http://www.i-micronews.com/reports.html
Thin Film Semiconductor Deposition Market, Size, Share 2022Radhika Patil
Thin Film Semiconductor Deposition Market is segmented by deposition technology and industry verticals. Thin film market is expected to get $22 bn by 2022
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
More information on: https://www.i-micronews.com/products/high-end-inertial-sensors-for-defense-aerospace-and-industrial-applications-2020/
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...Yole Developpement
High-Performance Computing and cloud gaming are setting the bar for leadership in the high-end CPU and GPU markets.
More info on: https://www.i-micronews.com/products/xpu-high-end-cpu-and-gpu-for-datacenter-applications-2020/
Nano-Imprint Technology Trends for Semiconductor Applications 2019 Report by...Yole Developpement
Nano-Imprint Lithography is revived by photonics and biochips as well as front-end memory applications.
More information on: https://www.i-micronews.com/products/nano-imprint-technology-trends-for-semiconductor-applications-2019/
Generative AI Deep Dive: Advancing from Proof of Concept to ProductionAggregage
Join Maher Hanafi, VP of Engineering at Betterworks, in this new session where he'll share a practical framework to transform Gen AI prototypes into impactful products! He'll delve into the complexities of data collection and management, model selection and optimization, and ensuring security, scalability, and responsible use.
Pushing the limits of ePRTC: 100ns holdover for 100 daysAdtran
At WSTS 2024, Alon Stern explored the topic of parametric holdover and explained how recent research findings can be implemented in real-world PNT networks to achieve 100 nanoseconds of accuracy for up to 100 days.
LF Energy Webinar: Electrical Grid Modelling and Simulation Through PowSyBl -...DanBrown980551
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
Alt. GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using ...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
The Metaverse and AI: how can decision-makers harness the Metaverse for their...Jen Stirrup
The Metaverse is popularized in science fiction, and now it is becoming closer to being a part of our daily lives through the use of social media and shopping companies. How can businesses survive in a world where Artificial Intelligence is becoming the present as well as the future of technology, and how does the Metaverse fit into business strategy when futurist ideas are developing into reality at accelerated rates? How do we do this when our data isn't up to scratch? How can we move towards success with our data so we are set up for the Metaverse when it arrives?
How can you help your company evolve, adapt, and succeed using Artificial Intelligence and the Metaverse to stay ahead of the competition? What are the potential issues, complications, and benefits that these technologies could bring to us and our organizations? In this session, Jen Stirrup will explain how to start thinking about these technologies as an organisation.
Removing Uninteresting Bytes in Software FuzzingAftab Hussain
Imagine a world where software fuzzing, the process of mutating bytes in test seeds to uncover hidden and erroneous program behaviors, becomes faster and more effective. A lot depends on the initial seeds, which can significantly dictate the trajectory of a fuzzing campaign, particularly in terms of how long it takes to uncover interesting behaviour in your code. We introduce DIAR, a technique designed to speedup fuzzing campaigns by pinpointing and eliminating those uninteresting bytes in the seeds. Picture this: instead of wasting valuable resources on meaningless mutations in large, bloated seeds, DIAR removes the unnecessary bytes, streamlining the entire process.
In this work, we equipped AFL, a popular fuzzer, with DIAR and examined two critical Linux libraries -- Libxml's xmllint, a tool for parsing xml documents, and Binutil's readelf, an essential debugging and security analysis command-line tool used to display detailed information about ELF (Executable and Linkable Format). Our preliminary results show that AFL+DIAR does not only discover new paths more quickly but also achieves higher coverage overall. This work thus showcases how starting with lean and optimized seeds can lead to faster, more comprehensive fuzzing campaigns -- and DIAR helps you find such seeds.
- These are slides of the talk given at IEEE International Conference on Software Testing Verification and Validation Workshop, ICSTW 2022.
State of ICS and IoT Cyber Threat Landscape Report 2024 previewPrayukth K V
The IoT and OT threat landscape report has been prepared by the Threat Research Team at Sectrio using data from Sectrio, cyber threat intelligence farming facilities spread across over 85 cities around the world. In addition, Sectrio also runs AI-based advanced threat and payload engagement facilities that serve as sinks to attract and engage sophisticated threat actors, and newer malware including new variants and latent threats that are at an earlier stage of development.
The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
Le nuove frontiere dell'AI nell'RPA con UiPath Autopilot™UiPathCommunity
In questo evento online gratuito, organizzato dalla Community Italiana di UiPath, potrai esplorare le nuove funzionalità di Autopilot, il tool che integra l'Intelligenza Artificiale nei processi di sviluppo e utilizzo delle Automazioni.
📕 Vedremo insieme alcuni esempi dell'utilizzo di Autopilot in diversi tool della Suite UiPath:
Autopilot per Studio Web
Autopilot per Studio
Autopilot per Apps
Clipboard AI
GenAI applicata alla Document Understanding
👨🏫👨💻 Speakers:
Stefano Negro, UiPath MVPx3, RPA Tech Lead @ BSP Consultant
Flavio Martinelli, UiPath MVP 2023, Technical Account Manager @UiPath
Andrei Tasca, RPA Solutions Team Lead @NTT Data
Climate Impact of Software Testing at Nordic Testing DaysKari Kakkonen
My slides at Nordic Testing Days 6.6.2024
Climate impact / sustainability of software testing discussed on the talk. ICT and testing must carry their part of global responsibility to help with the climat warming. We can minimize the carbon footprint but we can also have a carbon handprint, a positive impact on the climate. Quality characteristics can be added with sustainability, and then measured continuously. Test environments can be used less, and in smaller scale and on demand. Test techniques can be used in optimizing or minimizing number of tests. Test automation can be used to speed up testing.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
20. Silicon isn’t the perfect semiconductor, and with
it currently being pushed to its limits, alternative
platforms and compound semiconductors have
emerged. The success stories include GaAs for RF
and photonics applications, SiC for power and RF
applications, GaN-on-sapphire for LEDs, and SOI
for RF and CIS imaging sensors.
Fueled by a desire to push performance limits and
reduce cost, new materials are being explored for
different semiconductor applications. This report
looks at the drivers involved.
Starting with RF applications, there are numerous
market drivers, including 5G for infrastructure and
handsets, defense applications and civil automotive
radar, and more. For example, 5G deploys MIMO,
which is used in high-end 4G LTE phones. MIMO
is obligatory for handsets, and more filters will
be needed. Plus, better performance is required,
which implies a big market opportunity for new
materials.
Regarding the power electronics market,
which is currently driven by the electrification
of transportation, renewable energy, motor
drive, and numerous power supply applications,
enhanced device performance to reduce power
consumption is a general trend that has created
market opportunities for wide band gap materials
like SiC. Indeed, the SiC power device market is
taking off, though the substrate remains expensive.
Is there a place for other wide band gap and ultra-
wide band gap semiconductors, like Ga2
O3
?
The photonics market, ranging from ultraviolet
(UV) to the infrared (IR) spectrum, brings huge
opportunities: from water purification and gas
sensors, to infrared imagers. Since the wavelength
is determined by the bandgap of the material
(which is intrinsic to each material), different
materials are being developed to push the
wavelength towards shorter or longer regions.
Electronics and photonics applications are
creating plenty of opportunities for emerging
semiconductor substrates. Combined, Yole
Développement (Yole) expects the emerging
semiconductor substrate market to surpass
$400M, growing at a 24% CAGR from 2018 - 2024.
This report covers state-of-the-art crystalline
semiconductor substrates, including GaSb, InSb,
GaN, Ga2
O3
, AlN, and diamond. GaN, AlN
templates, and engineered substrates like piezo-
on-insulator (POI) are also covered.
EMERGING SEMICONDUCTOR SUBSTRATES: MARKET
& TECHNOLOGY TRENDS 2019
Market & Technology Report - May 2019
Emerging semiconductor substrates are expected to grow at a 24% CAGR from 2018 - 2024.
REPORT KEY FEATURES
• State-of-the-art technology
development of GaSb, InSb, bulk
GaN, Ga2O3, bulk AlN, diamond,
GaN, AlN templates, and emerging
engineered substrates
• Application potential for each
material
• Key players/ecosystem for each
material
• Materials market size (in $M) in
2018 and 2024
• Materials price in 2018 and 2024
(Yole Développement, May 2019)
2018-2024 emerging materials - Market revenue
ELECTRONICS AND PHOTONICS APPLICATIONS ARE CREATING PLENTY
OF OPPORTUNITIES FOR EMERGING SEMICONDUCTOR SUBSTRATES
$67M
2024:
$402M*
2019:
$122M
• GaSb
• InSb
• Bulk GaN
• Ga2
O3
• BulkAlN
• Single crystal diamond
• Heteroepitaxial single crystal diamond
• Engineered substrates
• GaN templates
• AlN template
$4M
$3M
$6M
$4M
$3M
$20M
$5M
*Detailed market size forecast for 2024 available in the report.
GaSb
InSb
BulkGaN
Ga2O3
BulkAlN
Single crystal
diamond
Heteroepitaxial
single crystal
diamond
Engineered
substrates
AlN
template
GaN
templates
CAGR 2019- 2024
24% driven by engineered substrates
21. EMERGING SEMICONDUCTOR SUBSTRATES: MARKET TECHNOLOGY TRENDS 2019
Researchers and engineers have plenty of ideas,
and now the questions are, “Which emerging
semiconductor substrate will be the next game-
changer?” and “For which application”?
Starting with GaSb and InSb, laser diodes (LDs) and
photodiodes (PDs) based on these materials are
already deployed in performance-driven military
applications. But this is not all. For example, IQE, a
leading antimonide wafer and epiwafer supplier, is
actively engaged with tier1 OEMs on new opportunities
to migrate antimonide-based “see in the dark” IR
technologies into consumer markets. Yole also sees
that an emerging GaSb-based type-2-superlattice
(T2SL) technology is being developed by several
major detector players including FLIR, Semiconductor
Devices, and IRnova. This technology is expected to
penetrate into consumer applications, with ramp-up
in the coming years.
Bulk GaN wafers have for many years been widely
used for laser diode applications. Recently, researchers
have explored their usage in power electronics and RF
applications. We see a growing effort, led by Japanese
players (ranging from materials suppliers to device
suppliers like Toyoda Gosei), to make vertical GaN-
on-GaN power devices happen. In the meantime,
an ultra-wide band gap material (Ga2
O3
) is garnering
increased attention. Wafers up to six inches have been
demonstrated, with the promise of potentially lower
cost than today’s SiC solutions. Future ramp-up will
depend on technology/cost competition from other
existing solutions.
Up to now we have considered bulk crystal materials,
but they are not the whole story. Templates and
engineered substrates are also being developed for
either lower cost (i.e. SiC and poly SiC bonding) or
better performance, such as piezo-on-insulator for
filter applications.
This report conveys Yole understanding of these
substrates’ application potential in RF, power
electronics, photonics (including laser diodes), LEDs,
sensors, and detectors.
THERE ARE MANY DRIVERS FOR EMERGING MATERIALS
(Yole Développement, May 2019)
GaSb
InSb
Both
(GaSb InSb)
IQE acquired Galaxy Semiconductor
and Wafer technology
Mapping of other semiconductor substrates are available in the report. *non-exhausitve list of companies
Mapping of GaSb and InSb wafer suppliers* (Q1, 2019)
2018-2024 emerging materials' target markets
(Yole Développement, May 2019)
Diamond
LD LED LED
Sensors/
Detectors
RF Power
• Automotive
lighting
•Water, air
disinfection,
purification by
UV LEDs
• Displays
• Display systems
forVR/AR and
MR
• Gas sensors
• Infrared
imagers
• 5G for cell
phone industry
• Solid state
radar for
military
applications
• Electric/Hybrid
electric
vehicles
• Renewable
energies (wind,
PV)
• TD
• Rail
Bulk
GaN
InSb
GaSb
Diamond
Ga2O3
Bulk
GaN
Bulk
GaN
AlN
Engineered
substrates
GaN
template
Engineered
substrates
AlN
Template
Ga2O3
Bulk
GaN
AlN
AlN
Template
22. MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
5NPLus, Adamant Namiki, Adroit Materials, Agnitron, Aim Laser Services, AIST, Aixtron, Akash
Systems, Audiatec, Brolis Semiconductors, CETC, Cividec, Coherent, Crystal IS, Dowa, EasyGaN,
EDP, Element6, Flir, Flosfia, Fraunhofer IAF, Furukawa, GCS, Genuv, Hamamatsu, Helios New
Materials, Hexatech, II-VI, IntelliEPI, IQE, Irnova, Kyma, LumiGNTech, Lumilog, Lumistal, Micron
Semiconductor Limited, Mitsubishi Chemical, Nanowin, NGK Insulators, Nichia,NICT, Novel
Crytsal Technology, NTT, Osram, Panasonic, Philips Photonics, QMAT, Qorvo, Qromis, Raytheon,
Renesas, RFHIC, SCIOCS, SemiConductor Devices, Seren Photonics, SETI, Sharp, Shenzen Deyi,
Six Point Materials, Sofradir, Soitec, Sony, Soraa, Sumitomo Chemical Advanced Technologies,
Sumitomo Electric Sumitomo Metal Mining, Teledyne Judson, Toyoda Gosei, Trinity, Unipress,
Ushio, Veeco, and more.
RELATED REPORTS
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• Edge Emitting Lasers: Market and Technology
Trends 2019
• UV LEDs – Technology, Manufacturing and
Application Trends 2018
• Power Electronics for EV/HEV 2018
• Status of the Power Electronics Industry 2018
• Power SiC 2018: Materials, Devices and Applications
• Power GaN 2018: Epitaxy, Devices, Applications
and Technology Trends
Find all our reports on www.i-micronews.com
Since 2013, Hong Lin, PhD has worked
at Yole Développement (Yole) as a
Senior Technology and Market Analyst,
Compound Semiconductors, within
the Power Wireless division. Hong
specializes in compound semiconductors
and provides technical and economic
analysis. Before joining Yole she worked
as an RD Engineer at Newstep
Technologies, in charge of developing
cold cathodes by PECVD for visible
and UV lamp applications based on
nanotechnologies. Hong holds a PhD in
Physics and Chemistry of Materials.
AUTHORS
TABLE OF CONTENTS (complete content on i-Micronews.com)
Glossaries definitions 2
Table of contents 4
Report objectives 7
Methodology 8
The authors 9
Companies list 10
Executive summary 11
Context 31
Report scope
Semiconductor applications
Market forecasts 34
Wafer prices, as of 2018
Emerging materials - market size forecast
2018 - 2024
Market trends 40
Photonics applications
- Ultraviolet applications
- Infrared applications
Electronics applications
- Power electronics applications
- RF applications
Applicative market trend overview
Emerging materials' target markets
Supply chain ecosystem 55
Mapping of GaSb and InSb wafer suppliers
(Q1 / 2019)
Mapping of FS and bulk GaN players (Q1 / 2019)
Mapping of Ga2
O3
players (Q1 / 2019)
Mapping of diamond players (Q1 / 2019)
Mapping of bulk AlN players (Q1 / 2019)
Mapping of engineered substrates (Q1 / 2019)
Mapping of GaN template (Q1 / 2019)
Mapping of AlN template (Q1 / 2019)
Technology trends 70
Gallium antimonide and indium antimonide
Bulk GaN
Gallium oxide
Diamond
Bulk AlN
Alternative solutions for single-crystal wafers
- engineered substrates and templates
Perspectives and conclusions 182
Different crystal diameter expansion - History
Maturity of emerging materials (Yole
Développement’s understanding)
Technology and market barriers
General conclusions
REPORT OBJECTIVES
• Overview of different emerging semiconductor substrates other than Si, GaAs, InP and SiC
• Understanding of the driver and the barrier of each materials
• Time to market discussion
• Application potential assessment
• Identification of the key players
As a Technology Market Analyst, Compound
Semiconductors, Ezgi Dogmus, PhD
isamemberofthePowerWirelessdivision
at Yole Développement (Yole). Ezgi’s
contributions to the daily development of
the division’s activities include a dedicated
collection of market technology reports,
as well as custom consulting projects. Prior
to joining Yole, Ezgi was deeply involved in
the development of GaN-based solutions
at IEMN (Lille, France). She has also
participated in numerous international
conferences and authored or co-authored
more than 12 papers. Upon graduating from
the University of Augsburg (Germany) and
Grenoble Institute of Technology (France),
Ezgi received her PhD in Microelectronics
at IEMN (France).
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and
corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications
using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and Image
Sensors, Compound Semiconductors, RF Electronics, Solid-State Lighting, Displays, Software, Optoelectronics, Microfluidics Medical, Advanced Packaging,
Manufacturing, Nanomaterials, Power Electronics and Batteries Energy Management.
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting,
PISEO and KnowMade, support industrial companies, investors and RD organizations worldwide to help them understand markets and follow technology
trends to grow their business.
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