Status of Advanced Packaging - 2017 Report by Yole DeveloppementYole Developpement
How can advanced packaging decrease semiconductor market uncertainty and enable future semiconductor products?
From supporting technology to enabler of future semiconductor products
Future semiconductor drivers are expected to be fragmented and more diverse than in the mobile era. Scaling continues, but functionality and system level features are becoming increasingly important for product differentiation rather than raw computation power. An outlook into the future brings the Internet of Things (from end device to backbone infrastructure), including the Industrial Internet of Things, the semiconductorization of the automotive industry, 5G connectivity, augmented & virtual reality and artificial intelligence. In such an environment, advanced packaging is transforming from follower of scaling technology nodes to enabler of future semiconductor applications and products. Heterogeneous integration of multiple dies from the latest to legacy front-end nodes, involving a mixture of latest technology high density interconnects to lower cost mature interconnects, at high levels of customization is the future of packaging. Advanced packaging has direct impact on product success rates and semiconductor revenues.
More information on that report at: https://www.i-micronews.com/reports.html
Status of Advanced Packaging - 2017 Report by Yole DeveloppementYole Developpement
How can advanced packaging decrease semiconductor market uncertainty and enable future semiconductor products?
From supporting technology to enabler of future semiconductor products
Future semiconductor drivers are expected to be fragmented and more diverse than in the mobile era. Scaling continues, but functionality and system level features are becoming increasingly important for product differentiation rather than raw computation power. An outlook into the future brings the Internet of Things (from end device to backbone infrastructure), including the Industrial Internet of Things, the semiconductorization of the automotive industry, 5G connectivity, augmented & virtual reality and artificial intelligence. In such an environment, advanced packaging is transforming from follower of scaling technology nodes to enabler of future semiconductor applications and products. Heterogeneous integration of multiple dies from the latest to legacy front-end nodes, involving a mixture of latest technology high density interconnects to lower cost mature interconnects, at high levels of customization is the future of packaging. Advanced packaging has direct impact on product success rates and semiconductor revenues.
More information on that report at: https://www.i-micronews.com/reports.html
【Intern Case Study_矽智財】
矽智財 (IP) 是 IC 設計所使用的智慧財產權,是一組事前設計好並驗證完畢、可重複使用的功能組塊,屬於半導體產業的上游,隨著 IC 產業垂直分工化的趨勢而崛起,具有高進入門檻、無庫存、高毛利等特色。
矽智財產業的商業模式為將設計好的 IP 模組授權給買家使用,初次會收取授權金 (License),往後開始量產則轉為收取權利金 (Royalty)。隨著先進製程不斷演進,全球矽智財市場也高速成長,終端市場以消費性電子為大宗,車用與 AI 應用則為主要成長動能。
矽智財在產業鏈、需求面、供給面、相關個股,還有什麼是我們需要注意的呢?一起來看看 Collaborator 的 Intern 們:梁維珉、黃微茹、蔡博獻、謝恩慈、曾筠婷詳盡分析的矽智財產業報告吧!
#Collaborator
#Intern_CaseStudy
#FX編
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
【Intern Case Study_矽智財】
矽智財 (IP) 是 IC 設計所使用的智慧財產權,是一組事前設計好並驗證完畢、可重複使用的功能組塊,屬於半導體產業的上游,隨著 IC 產業垂直分工化的趨勢而崛起,具有高進入門檻、無庫存、高毛利等特色。
矽智財產業的商業模式為將設計好的 IP 模組授權給買家使用,初次會收取授權金 (License),往後開始量產則轉為收取權利金 (Royalty)。隨著先進製程不斷演進,全球矽智財市場也高速成長,終端市場以消費性電子為大宗,車用與 AI 應用則為主要成長動能。
矽智財在產業鏈、需求面、供給面、相關個股,還有什麼是我們需要注意的呢?一起來看看 Collaborator 的 Intern 們:梁維珉、黃微茹、蔡博獻、謝恩慈、曾筠婷詳盡分析的矽智財產業報告吧!
#Collaborator
#Intern_CaseStudy
#FX編
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
【Intern Case Study_矽智財】
矽智財 (IP) 是 IC 設計所使用的智慧財產權,是一組事前設計好並驗證完畢、可重複使用的功能組塊,屬於半導體產業的上游,隨著 IC 產業垂直分工化的趨勢而崛起,具有高進入門檻、無庫存、高毛利等特色。
矽智財產業的商業模式為將設計好的 IP 模組授權給買家使用,初次會收取授權金 (License),往後開始量產則轉為收取權利金 (Royalty)。隨著先進製程不斷演進,全球矽智財市場也高速成長,終端市場以消費性電子為大宗,車用與 AI 應用則為主要成長動能。