Driven by megatrend markets, More than Moore devices’ overall wafer demand is expected to grow at an almost 10% CAGR from 2017 to 2023.
More information on that report at https://www.i-micronews.com/report/product/wafer-starts-for-more-than-moore-applications.html
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Bonding and Lithography Equipment Market for More than Moore Devices by Yole ...Yole Developpement
More than Moore devices fueled by megatrend applications will strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market.
More information on that report at https://www.i-micronews.com/report/product/bonding-and-lithography-equipment-market-for-more-than-moore-devices.html
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
The GaN RF market enjoyed a healthy increase in 2015.
2015 was a significant year for the GaN RF industry, with a dramatic increase in wireless infrastructure market sales driven by the massive adoption of LTE networks in China. By year’s end, the total RF GaN market was close to $300M.
Sales will likely not soar as high over the next two years, but growth will continue, mainly driven by increased adoption of GaN technology in the wireless infrastructure and defense markets. A significant boost will occur around 2019 – 2020, led by the implementation of 5G networks. Market size will be multiplied by 2.5 by the end of 2022, posting a CAGR of 14%...
More information on that report at http://www.i-micronews.com/reports.html
Compound Semiconductors,RF, Power Electronics
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Bonding and Lithography Equipment Market for More than Moore Devices by Yole ...Yole Developpement
More than Moore devices fueled by megatrend applications will strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market.
More information on that report at https://www.i-micronews.com/report/product/bonding-and-lithography-equipment-market-for-more-than-moore-devices.html
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
The GaN RF market enjoyed a healthy increase in 2015.
2015 was a significant year for the GaN RF industry, with a dramatic increase in wireless infrastructure market sales driven by the massive adoption of LTE networks in China. By year’s end, the total RF GaN market was close to $300M.
Sales will likely not soar as high over the next two years, but growth will continue, mainly driven by increased adoption of GaN technology in the wireless infrastructure and defense markets. A significant boost will occur around 2019 – 2020, led by the implementation of 5G networks. Market size will be multiplied by 2.5 by the end of 2022, posting a CAGR of 14%...
More information on that report at http://www.i-micronews.com/reports.html
Compound Semiconductors,RF, Power Electronics
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Status of the Power Electronics Industry 2019 by Yole DéveloppementYole Developpement
Long term growth of the power electronics market is driving 300mm wafer-based production.
More information on: https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/led-report/product/vcsels-technology-industry-and-market-trends.html
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Status of the MEMS Industry 2018 Market and technology Report by Yole Dévelop...Yole Developpement
Megatrends are invigorating the MEMS industry.
More information on : https://www.i-micronews.com/category-listing/product/status-of-the-mems-industry-2018.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Hybrid bonding methods for lower temperature 3 d integration 1SUSS MicroTec
* Overview of primary 3D bonding processes
* Mechanics of metal bonding options
* Mechanics for hybrid bond materials
* Process requirement comparisons
* Equipment requirements for hybrid bond processes
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019 by Y...Yole Developpement
The battle for 5G still rages: integration in-module or with discrete parts?
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
The report provides a market analysis of the GaAs wafer and epiwafer markets from 2019 to 2025. It forecasts that the GaAs wafer market will increase from $200 million in 2019 to $348 million in 2025, with the largest application segments being RF, photonics, and LED. The open epiwafer market is also analyzed, with IQE and VPEC together comprising almost 80% of the $262 million total market in 2019. Key drivers of growth are discussed for various applications such as 5G adoption for RF and increasing use of VCSELs for 3D sensing and LiDAR.
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
InP Wafer and Epiwafer Market: Photonics and RF 2019 report by Yole Développe...Yole Developpement
Photonics (telecom, datacom, LiDAR, sensing and others...) is driving the InP wafer market.
As an old but still gold-standard member of the compound semiconductor family, InP possesses the key advantages of emission and detection capabilities over 1000 nm in the photonics domain, as well as high speed and low noise performance in high-frequency RF applications. Though it is
often overshadowed by rivals like GaAs and SiGe for mass-volume, cost-driven RF applications, InP remains a top choice for performance-driven niche markets like military communication, radar, and radiometry, as well as automatic test equipment. Moreover, different industrial actors (i.e. Skyworks, GCS, and IntelliEPI) are monitoring InP technology for the upcoming 5G move.
More information on that report at https://www.i-micronews.com/compound-semi-report/product/inp-wafer-and-epiwafer-market-photonic-and-rf-applications.html
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
MicroLED displays comprise arrays of microscopic LEDs that self-illuminate individual pixels, similar to OLED but using inorganic material. They offer advantages over LCD and OLED like high dynamic range, wide color gamut, and long lifetime. However, manufacturing microLEDs at a small scale remains challenging and expensive for mass production. Key challenges include parallel pick and place of microLED chips, light extraction, and defect management during the manufacturing process. If the challenges can be addressed, microLED has potential applications in devices like smartwatches, VR/AR headsets, automotive displays, and future generation TVs and smartphones.
Microphones, Microspeakers and Audio Solutions Market and Technology Trends 2019Yole Developpement
The voice-based world is shaking up the audio industry, making it worth $20.8B in 2024.
More information on https://www.i-micronews.com/products/microphones-microspeakers-and-audio-solutions-market-and-technology-trends-2019/
Machine Vision for Industry and Automation 2018 Report by Yole DeveloppementYole Developpement
Machine vision is at the heart of the automation revolution.
More information on that report at https://www.i-micronews.com/report/product/machine-vision-for-industry-and-automation-2018.html
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Status of the Power Electronics Industry 2019 by Yole DéveloppementYole Developpement
Long term growth of the power electronics market is driving 300mm wafer-based production.
More information on: https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/led-report/product/vcsels-technology-industry-and-market-trends.html
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Status of the MEMS Industry 2018 Market and technology Report by Yole Dévelop...Yole Developpement
Megatrends are invigorating the MEMS industry.
More information on : https://www.i-micronews.com/category-listing/product/status-of-the-mems-industry-2018.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Hybrid bonding methods for lower temperature 3 d integration 1SUSS MicroTec
* Overview of primary 3D bonding processes
* Mechanics of metal bonding options
* Mechanics for hybrid bond materials
* Process requirement comparisons
* Equipment requirements for hybrid bond processes
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019 by Y...Yole Developpement
The battle for 5G still rages: integration in-module or with discrete parts?
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
The report provides a market analysis of the GaAs wafer and epiwafer markets from 2019 to 2025. It forecasts that the GaAs wafer market will increase from $200 million in 2019 to $348 million in 2025, with the largest application segments being RF, photonics, and LED. The open epiwafer market is also analyzed, with IQE and VPEC together comprising almost 80% of the $262 million total market in 2019. Key drivers of growth are discussed for various applications such as 5G adoption for RF and increasing use of VCSELs for 3D sensing and LiDAR.
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
InP Wafer and Epiwafer Market: Photonics and RF 2019 report by Yole Développe...Yole Developpement
Photonics (telecom, datacom, LiDAR, sensing and others...) is driving the InP wafer market.
As an old but still gold-standard member of the compound semiconductor family, InP possesses the key advantages of emission and detection capabilities over 1000 nm in the photonics domain, as well as high speed and low noise performance in high-frequency RF applications. Though it is
often overshadowed by rivals like GaAs and SiGe for mass-volume, cost-driven RF applications, InP remains a top choice for performance-driven niche markets like military communication, radar, and radiometry, as well as automatic test equipment. Moreover, different industrial actors (i.e. Skyworks, GCS, and IntelliEPI) are monitoring InP technology for the upcoming 5G move.
More information on that report at https://www.i-micronews.com/compound-semi-report/product/inp-wafer-and-epiwafer-market-photonic-and-rf-applications.html
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
MicroLED displays comprise arrays of microscopic LEDs that self-illuminate individual pixels, similar to OLED but using inorganic material. They offer advantages over LCD and OLED like high dynamic range, wide color gamut, and long lifetime. However, manufacturing microLEDs at a small scale remains challenging and expensive for mass production. Key challenges include parallel pick and place of microLED chips, light extraction, and defect management during the manufacturing process. If the challenges can be addressed, microLED has potential applications in devices like smartwatches, VR/AR headsets, automotive displays, and future generation TVs and smartphones.
Microphones, Microspeakers and Audio Solutions Market and Technology Trends 2019Yole Developpement
The voice-based world is shaking up the audio industry, making it worth $20.8B in 2024.
More information on https://www.i-micronews.com/products/microphones-microspeakers-and-audio-solutions-market-and-technology-trends-2019/
Machine Vision for Industry and Automation 2018 Report by Yole DeveloppementYole Developpement
Machine vision is at the heart of the automation revolution.
More information on that report at https://www.i-micronews.com/report/product/machine-vision-for-industry-and-automation-2018.html
Photonics market data on sensors, date centers, detectors, lighting (LED and ...Carlos Lee
Yole report abstract for EPIC 2016 International Optoelectronics Association presented by Carlos Lee, on 23 April 2016 in Zurich, Switzerland. For more information contact carlos.lee@epic-assoc.com
TOPICS: Sensors for Drones and robots, Gas sensor market and technology trends, Technology challenges for data center: the photonic case, Infrared detector market, LED modules technology and market trends, OLED for lighting, Medical imaging, Microbolometers.
Proliferation of cameras for imaging and sensing is driving CMOS image sensor (CIS) growth.
More information on that report at : https://www.i-micronews.com/report/product/status-of-the-cis-industry-2018.html
How the MEMS Industry Can Extract More Value From its Customers? by JC. Eloy ...Yole Developpement
The document discusses how the MEMS industry can extract more value from customers. It notes that while MEMS markets and volumes are growing, the value is shifting from individual sensor devices to integrated sensor functions and data processing. The document advocates that MEMS companies change their mindset from selling standalone sensors to developing integrated sensor functions through packaging, combining multiple sensors, and adding software for data processing and new applications. This will allow MEMS players to better capture value in the growing markets for wearables, mobile devices, and other electronic products.
3D Imaging & Sensing 2018 Reports by Yole DeveloppementYole Developpement
The iPhone X initiated a trend. What happens next?
More information here: https://www.i-micronews.com/category-listing/product/p3d-imaging-sensing-2018.html
CMOS Image Sensor Service – Imaging Research 2019 Monitors by Yole DéveloppementYole Developpement
As camera quantity and die size increase per end-device, a 10.1% year-on-year growth rate is expected for 2019.
More information on CMOS monitor at: https://www.i-micronews.com/products/cmos-image-sensor-service-camera-module-research/
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
Piezoelectric Devices: From Bulk to Thin-Film 2019 report by Yole DéveloppementYole Developpement
How strongly will piezoelectric’s good vibrations resonate in the device market?
More information on https://www.i-micronews.com/products/piezoelectric-devices-from-bulk-to-thin-film-2019/
The global vertical cavity surface emitting laser (VCSEL) market size reached US$ 2.0 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 7.5 Billion by 2032, exhibiting a growth rate (CAGR) of 15.7% during 2024-2032.
More Info:- https://www.imarcgroup.com/vertical-cavity-surface-emitting-laser-market
Optical Wavelength Services Market by Product Type, Distribution Channel, End...IMARC Group
The global optical wavelength services market size reached US$ 4.6 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 9.0 Billion by 2032, exhibiting a growth rate (CAGR) of 7.5% during 2024-2032.
More Info:- https://www.imarcgroup.com/optical-wavelength-services-market
Radar and Wireless for Automotive: Market and Technology Trends 2019 report b...Yole Developpement
The radar and 5G/V2X markets will both grow – one through market pull, the other through prospective enablement.
More information on https://www.i-micronews.com/products/radar-and-v2x-for-automotive-technologies-and-market-trends-2019/
This document provides a summary of an emerging MEMS patent investigation report by Knowmade and Yole Développement. The report analyzes over 1,300 patent families related to 7 types of emerging MEMS technologies: AOC MEMS, Autofocus, Chemical Sensors, Micro-Speakers, Scanning Micro-Mirrors, Si Microfluidics, and Ultrasonic MEMS. For each technology, the report provides an overview of the market and key patents, including rankings of major patent applicants and analysis of their patent portfolios and networks. It also includes timelines of patent publications and key findings on the leading IP holders for each emerging MEMS technology.
Imaging Technologies for Automotive 2016 Report by Yole Developpement Yole Developpement
Imaging technology, which is currently mainly cameras, is exploding into the automotive space, and is set to grow at 20% CAGR to reach $7.3B in 2021
INFOTAINMENT AND ADVANCED DRIVER ASSISTANCE SYSTEMS (ADAS) PROPEL AUTOMOTIVE IMAGING
Since 2008, when a recession acted as a wakeup call to the whole industry, the automotive market has undergone obvious structural change. Capitalizing on technologies initially developed for smartphones, electronics have invaded, and imaging technology is now taking center stage. From less than one camera per car on average in 2015, there will be more than three cameras per car by 2021, which means 371 million automotive imaging devices.
Cameras were initially mounted for ADAS purposes on high-end vehicles, with deep learning image analysis techniques promoting early adoption. The Israeli company Mobileye has been instrumental in bringing this technology to market, along with On Semiconductor, which provided the CMOS image sensor. Copycat competition will probably pick up as the market now justifies initial investment in design and technology. It is now a well-established fact that vision-based autonomous emergency braking (AEB) is possible and saves life. Adoption of forward ADAS cameras will therefore accelerate.
Growth of imaging for automotive is also being fueled by the park assist application, and 360° surround view camera volume is skyrocketing. While it’s becoming mandatory in the US to have a rearview camera, that uptake is dwarfed by 360° surround view cameras, which enable a “bird’s eye view” perspective. This trend is most beneficial to companies like Omnivision at sensor level and Panasonic and Valeo, which have become the main manufacturers of automotive cameras.
Mirror replacement cameras are currently the big unknown and take-off will primarily depend on its appeal and car design regulation. Europe and Japan are at the forefront of this trend, which should become slightly significant by 2021.
Solid state lidar is well talked about and will start to be found in high end cars by 2021. Cost reduction will be a key driver as the push for semi-autonomous driving will be felt more strongly by car manufacturers. The report will analyse the impact of lidar for automotive vision in detail.
Night vision cameras using Long Wave Infrared (LWIR) technology were initially perceived as a status symbol. However, they’re increasingly appreciated for their ability to automatically detect pedestrians and wildlife. LWIR will therefore become integrated into ADAS systems in future.
3D cameras will be limited to in-cabin infotainment and driver monitoring. This technology will be key for luxury cars and therefore is of limited use today.
If any significant semi-autonomous trend picks up, the technology will probably become mandatory, due to safety issues.
More information on that report at http://www.i-micronews.com/reports.html
Emerging MEMSPatent Investigation 2014 Report by Yole DeveloppementYole Developpement
Who owns key patents for high-growth emerging MEMS innovations?
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UNDERSTAND WHICH COMPANIES OWN THE KEY PATENTS FOR THE FUTURE OF EMERGING MEMS
Patent activity related to eMEMS began in the 1990s and we observe a takeoff of patent publications for AutoFocus (AF), scanning micro-mirrors and ultrasonic MEMS technologies since the mid-2000s.
MEMS AF patent activity is new, but has increased since its emergence in 2009. This period also corresponds to the growth of the CMOS image sensor market for consumer applications, requiring more compact camera modules with more functionalities. Cambridge Mechatronics and DigitalOptics are currently the leading patent holders, but Korean giant LG has become a major force since 2010. Today MEMS AF is still a hot topic especially for cell phones and tablets, but wasn’t adopted in 2013. Although MEMS AF has promising market potential, it still faces strong market and technical challenges, which might explain the increasing patent activity of recent years.
More information on that report at http://www.i-micronews.com/mems-sensors-report/product/emerging-mems-patent-investigation-2014.html
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- Annual shipments of microbolometers are expected to reach 2 million units by 2021, up from 1.3 million units shipped in 2017, driven by new applications.
- The top 3 players in the microbolometer market in 2017 were FLIR with 66% market share, ULIS with 13% share, and Seek Thermal with 12% after shipping over 100,000 units. The infrared detector market remains more conservative with the top 5 players holding around 80% of the $252 million market
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The mobile market is key for the CMOS image sensor (CIS) industry. Despite saturation in the number of handsets, the CIS market has been able to maintain a 10.5% compound annual growth rate (CAGR) for the 2016-2022 period due to the introduction of dual and 3D cameras. These additional cameras are changing the industry’s drivers from form factor and image quality to interactivity.
Penetration into higher added value markets such as automotive, security and medical shows that CIS products are transforming use cases across the board. CIS technology adoption allows greater automation levels at low cost, while using newly available computing architectures such as deep learning. The CMOS image sensor industry is currently in a virtuous circle where a new technology is providing true customer value.
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MEMS is a “transfer function” using semiconductor micro-machining based technologies to create devices replacing more complex, bulky or less sensitive devices.
•The 5 criteria that determine a MEMS success: size reduction, potential cost reduction, “good enough” specifications, simpler manufacturing compared to existing solutions (less mechanical parts for e.g.) & reliability.
•Among all the different MEMS devices in development that could have a significant growth in the future, we foresee gas sensors as the next success for the MEMS industry.
•In any case, at least 10 to 15 years of development are necessary to achieve all the successful criteria.
Gas sensors are likely to have a marketrampup.
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GitHub: https://github.com/albumentations-team/albumentations
Website: https://albumentations.ai/
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15. 15
2017WAFERVOLUME – BREAKDOWN BY SUBSTRATE TYPE
MtM wafer volume - split by substrate type
Silicon substrate is
the main substrate
technology in
2017,with more
than 80% market
share.Although,
alternative
substrate will gain
market share,the
Silicon substrate
will remain the
dominant
semiconductor
material for MtM
applications
Silicon
Ceramic
18. Wafer demand (including MEMS & sensors, CIS,
and power, along with RF devices) for More than
Moore (MtM) reached almost 45 million 8-inch
eq wafers in 2017. Wafer demand is expected to
reach more than 66 million 8-inch eq wafers by
2023, with an almost 10% CAGR2017 - 2023
.
Numerous megatrend market drivers will
contribute to MtM devices’ growth : 5G (wireless
infrastructure & mobile), mobile (including
additional functionalities), voice processing,
smart automotive, and Augmented Reality/Virtual
Reality (AR/VR), artificial intelligence.
Driven by the increasing deployment of renewable
energy sources (principally solar energy inverters)
and industrial motor drives, as well as the growing
electric and hybrid vehicles (EV/HEVs) automotive
industry, power devices’ wafer market size will grow
at an almost 13% CAGR2017 - 2023
. In 2017, it accounted
for more than 60% of overall MtM wafer starts and it
will continue dominating the MtM industry.
5G, a hot topic today, will likely be a huge part
of the MtM evolution, bringing any service to any
user anywhere, but also requiring new antennas,
along with filtering functionality. These stringent
requirements will lead to increasing demand for
RF components like RF filters, power amplifiers
(PAs), and low-noise amplifiers (LNAs) to ensure
access to tomorrow’s radio network.
Meanwhile, the demand for advanced mobile
applications that integrate more functionalities will
require aggregating more and more devices such
as fingerprint sensors, ambient light sensors, 3D
sensing, microphones, and inertial MEMS devices.
This will, in the near future, contribute to strong
wafer growth in the MEMS & sensors wafer market.
Additionally, smart automobiles have reached a
new level of complexity requiring the development
and integration of new sensors. As such, we
expect smart automobiles to drive consistent
growth of CIS and sensor wafer production
over the next five years, fueled by the expanding
integration of high-value sensing modules like
radar, imaging, and lidar. Although automotive
will be mainly supported by these growth areas,
classical MEMS & sensors such as MEMS pressure
sensors and inertial MEMS will still continue
growing at a reasonable rate, supporting the
standard automotive world.
This report provides a detailed analysis of the wafer
market forecast by MtM segment application, along
with a comprehensive overview of the market segments
driving MtM devices.
WAFER STARTS
FOR MORE THAN MOORE APPLICATIONS
Market & Technology report - March 2018
MEGATREND MARKETS ARE AT THE HEART OF MORE THAN MOORE’S
WAFER VOLUME EVOLUTION
Driven by megatrend markets, More than Moore devices’ overall wafer demand is expected to grow
at an almost 10% CAGR from 2017 to 2023.
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
• This report is the first to present
the entire wafer starts market for
More than Moore devices
• 2017 - 2023 overall wafer forecasts
(in units) for More than Moore
markets, including MEMS
sensors, CMOS image sensors,
RF devices, and power devices
(discretes and modules)
• 2017 - 2023 wafer market metrics
in wspy: breakdown by More than
Moore application segment
• Detailed analysis and wafer
forecast for each More than Moore
application segment, plus wafer
market metrics by component type
• 2017 - 2023 wafer market metrics
in wspy: split by wafer size and, by
semiconductor substrate material -
silicon vs. non silicon-based
• Wafer starts analysis by More than
Moore application segment and
split by wafer size
• Overview and positioning of key
players, by More than Moore
device and by substrate type
2
(in million)
Wafercountsin8inchequivalent(inmillion)
10
20
30
0
40
50
60
70
2017 2018 2019 2020 2021 2022 2023
PowerMEMS SensorsRF CIS
Voice Processing
Mobile
Mobile
Automotive
Automotive:
Electrical vehiclesMobile
Automotive AR/VR
Automotive
Automotive:
Electrical vehicles
(Yole Développement, March 2018)
Overall wafer demand from 2017 to 2023
Breakdown by More than Moore device (in 8 inch eq)
WHAT ABOUT THE REPORT?
An update of this report will
be released in June 2018 with
additional More than Moore
applications and components
analysis such as:
• photonics
• VCSEL
• Sensors like fingerprint sensors,
ambient light sensors...
• 2.5D interposer platform applications
Customers of this report will
automatically receive the June update.
19. WAFER STARTS FOR MORE THAN MOORE APPLICATIONS - VOLUME 1
DESPITE SILICON’S DOMINANCE IN THE SEMICONDUCTOR AREA, ALTERNATIVE
SUBSTRATES ARE DISRUPTING THE MORE THAN MOORE MARKET
Regarding semiconductor material, although silicon is
by far the most dominant (with more than 80% market
share), alternative non-silicon-based substrates
like SiGe, GaAs, GaN, and SiC are increasing their
importance within the MtM industry. Choosing
the right substrate technology will strongly depend
on the technical performance associated with the
megatrends’s requirements, as well as the cost.
In the case of high-temperature applications, SiC
will stay the preferred choice while GaN is better
adapted for low-power DC/DC and AC/DC
converters. Moreover, SiC transistors are particularly
advantageous for high-voltage and high-rating
applications, and thus are considered as a technology
choice for some MOSFET and diode products.
GaN could possibly reach high-voltage values, but
would require bulk GaN as the substrate, which is
currently impossible. However, due to their power
efficiency and broadband capability, both GaN-on-
SiC and GaN-on-Si are very good candidates for RF
power devices, especially for macro base stations.
Meanwhile, silicon cannot compete in high-frequency-
range RF applications due to its limitations in terms of
insertion loss and dielectric constant.
Looking ahead, glass is an appealing choice for low-
power consumers like RF IPD, and high-frequency
applications requiring low dielectric loss and low
insertion loss. However, glass exhibits bad heat
conductivity and thus is not compatible with solid-
state RF components like PAs/LNAs and RF switches.
GaAs is not optimized for high-power applications like
macro base stations. However, thanks to its maturity,
its satisfying out-power, and its good linearity, GaAs
is being used for PA devices. Furthermore, GaAs is
especially advantageous for small-cell implementation
for both sub-6Ghz and the first mmWave small cells
(28GHz - 39GHz range). Meanwhile, SiGe, ceramic,
and SOI are the dominant technologies for LNAs, RF
BAW (Bulk Acoustic Wave) filters, and RF switches,
respectively.
In terms of wafer size, the MtM wafer market -
including MEMS sensors, CIS, and power (MOSFETs,
IGBTS, thyristors, and diodes (excluding Power ICs)),
along with RF devices - is dominated by the 6-inch
wafer format, followed by the 8-inch size, which is
mostly supported by power device applications.
However, though 6-inch will continue increasing in the
next few years, its share will decrease compared to
8-inch. Indeed, we expect 8-inch wafer diameter to
progress significantly and surpass the 6-inch wafer size
by 2023. This transition will be driven first by power
and MEMS sensor applications, where the vast
majority will convert their components from 6-inch
to 8-inch over the next five years due to increasing
volume production.
Nevertheless, 12-inch will represent the fastest
growth from 2017 - 2023, with a 15% CAGR. We
expect 12-inch wafer demand to grow from 3.3 million
units in 2017 to 7.5 million in 2023, mainly fueled by
Backside Illumination CMOS Image Sensors (BSI CIS)
(3D stacked BSI, 3D hybrid BSI). On the other side,
4-inch wafer diameter is in large demand today for
MtM applications driven by RF SAW (Surface Acoustic
Wave) filter products. However, 4-inch’s adoption will
decrease due to the transition from 4-inch to 6-inch
for these applications.
We still see some MtM products manufactured in wafer
sizes below 4-inch, i.e. 3-inch and 2-inch wafer formats.
However, these represent a very small volume, and we
expect such sizes to die out (aside from small volumes still
used for producing MEMS, power, and RF SAW devices).
This report offers a comprehensive overview of wafer
starts market data, split by wafer size for MtM devices
and including the following fields: MEMS sensors, CIS,
RF devices, and power devices. This report also furnishes
a more in-depth analysis of the wafer starts split, with a
separate forecast by type of component for each MtM
device covered.
Substrate type used by More than Moore wafer size
(Yole Développement, March 2018)
More than Moore Device
PowerMEMS Sensors CIS RF devices
Wafer-based
12 inch
8 inch
6 inch
4 inch
3 inch
Substrate size
Silicon
SiGe
Glass
:
SOI
Ceramic
GaN/SiC
SiC
GaAs
Wafer demand for More than Moore devices
Breakdown by wafer size - including MEMS Sensors, CIS, Power, RF devices
(Yole Développement, March 2018)
%surfaceprocessed
100%
75%
50%
25%
0%
2017 2018 2019 2020 2021 2022 2023
8’’
12’’
6’’
5’’
4’’4’’ (2’’ 3’’)
6-INCH AND 8-INCH ARE FORECAST TO REPRESENT MORE THAN 60% OF
MORE THAN MOORE WAFERS’ TOTAL WAFER CONSUMPTION
20. Find more
details about
this report here:
MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
Alpha Omega Semiconductor, Austriamicrosystems (AMS), Broadcom/Avago, Canon, Cavendish
Kinetics, GaN Systems, Fairchild Semiconductor, Fuji Electric, Infineon, Ixys, Qualcomm/TDK Epcos,
Qorvo, Microsemi, Microchip, Mitsubishi, Murata, NXP, Omnivision, On Semiconductor, Panasonic,
Renesas, Samsung, Sony, Skyworks, STMicroelectronics, Texas Instruments, Toshiba, Vishay, and more
AUTHOR
Amandine Pizzagalli is a Technology
Market Analyst at Yole Développement
(Yole). Amandine is part of the development
oftheAdvancedPackagingSemiconductor
Manufacturing Business Unit of Yole with
the production of reports and custom
consulting projects. She is in charge of
comprehensive analyses focused on
semiconductor equipment, materials and
manufacturing processes.
Previously, Amandine worked as Process
engineer on CVD and ALD processes for
semiconductor applications at Air Liquide.
Amandine was based in Japan during one
year to manage these projects.
Amandine is graduated in Electronics
from CPE Lyon (France), with a technical
expertise in Semiconductor Nano-
Electronics and has a master focused on
Semiconductor Manufacturing Technology,
from KTH Royal Institute of Technology
(Sweden).
She has spoken in numerous international
conferences and has authored or co-
authored more than 10 papers.
Introduction, definitions methodology 6
Report objectives
Who should be interested in this report?
Companies cited in this report
Definitions, limitations methodology
Glossary
Executive summary 18
More than Moore devices technologies
overview 32
Scope of the applications covered
2017 - 2023 wafer demand and shipment market
forecast (in wspy) 43
Breakdown by wafer size (4 vs. 6 vs. 8 vs. 12-inch)
Breakdown by MtM application in 8-inch equivalent
Breakdown by semiconductor substrate material
MEMS sensors - Device market forecast 71
Volume shipments for each MEMS device
Wafer shipments by wafer size
CMOS image sensors - Device market forecast 81
In wafer eq. with attached growth rates
Volume shipments for each CIS device and technology
Wafer shipments, by wafer size and substrate type
RF devices - Market forecast 110
In wafer eq. with attached growth rates
Wafer shipments, by wafer size and substrate type
Power devices - Market forecast 144
In wafer eq. with attached growth rates
Volume shipments for each power device and
technology
Wafer shipments, by wafer size and substrate type
Conclusions 170
TABLE OF CONTENTS (complete content on i-Micronews.com)
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OBJECTIVES OF THE REPORT
• Assess the wafer market for MEMS sensors, CMOS image sensors, RF devices, and power
devices applications
• Offer market metrics at wafer market level for the entire More than Moore (MtM) industry
(2017 - 2023)
• Evaluate market developments in terms of market size (volume, value), substrate sizes/formats,
and by MtM device
• Discuss the competitive landscape and identify key players in technology development and
manufacturing
• Furnish an overview of who is doing what, and the specificities of each market
• Technology process, specification, and value chain
• Identify the key drivers that will shape the future MtM market
• Provide a clear overview in terms of wafer shipments, and identify business opportunities in the
MtM industry
• Status of the MEMS Industry 2017
• Status of the CMOS Image Sensor Industry 2017
• Power MOSFET 2017: Market and Technology
Trends
• IGBT Market and Technology Trends 2017
• Status of the Power Electronics Industry 2017
• Power SiC 2017: Materials, Devices, Modules,
and Applications
• Bulk GaN Substrate Market 2017
• RF GaN Market: Applications, Players,
Technology, and Substrates 2018-2023
• RF Front End Modules and Components for
Cellphones 2017
Find all our reports on www.i-micronews.com
Similarly, although InP substrate is considered as
a promising solution from a performance point
of view to enter the small cell market towards
higher mm wave frequencies in a range of
60GHz - 70GHz, the technology’s accessibility
in terms of volume and players might still be
limited. However, GaAs and InP are attractive
solutions for photonics applications, while GaN
could be an enabler for 5G infrastructure with
increasing frequencies and high data rates, where
power efficiency remains crucial. In this respect,
numerous non-silicon-based semiconductor
substrates could in the long-term make serious
inroads in the MtM market.
This report offers a comprehensive overview of the
semiconductor substrates used in MtM applications,
as well as technology trends and a wafer market
forecast by application and component type.
Moreover, a detailed analysis of the wafer forecast
(split by wafer size and substrate type) has been
calculated for the 2017 - 2023 timeframe.
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