SPICE MODEL of SSM3J120TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J120TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J120TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J305T (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J305T (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ509 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ509 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J112TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J112TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J109TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J109TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K101TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a TOSHIBA SSM3K101TU power MOSFET and its internal body diode and ESD protection diode. It includes SPICE models and simulation results for the MOSFET characteristics like transconductance, gate charge, output, switching time and for the diode characteristics like forward current, reverse recovery and zener voltage. The simulations match well with measurements with less than 5% error for most characteristics.
SPICE MODEL of 2SK2700 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2700 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8401 (Professional+BDP N&P Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8401 (Professional+BDP N&P Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J120TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J120TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J305T (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J305T (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ509 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ509 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J112TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J112TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J109TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J109TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K101TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a TOSHIBA SSM3K101TU power MOSFET and its internal body diode and ESD protection diode. It includes SPICE models and simulation results for the MOSFET characteristics like transconductance, gate charge, output, switching time and for the diode characteristics like forward current, reverse recovery and zener voltage. The simulations match well with measurements with less than 5% error for most characteristics.
SPICE MODEL of 2SK2700 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2700 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8401 (Professional+BDP N&P Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8401 (Professional+BDP N&P Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8016-H (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8016-H (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of DF2B6.8FS , PSpice Model in SPICE PARKTsuyoshi Horigome
SPICE MODEL of DF2B6.8FS , PSpice Model in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8026 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8026 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K116TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K116TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ493 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ493 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K16FU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a Power MOSFET component. It includes:
1) A description of the MOSFET model parameters used in the PSpice simulation.
2) Simulation results and comparisons to measurement data for the MOSFET's transconductance, Vgs-Id curve, Rds(on), gate charge, capacitances and switching times.
3) Forward and reverse current characteristics along with the reverse recovery behavior.
4) A zener voltage characteristic simulation of the MOSFET's body diode.
SPICE MODEL of TPC8214-H (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8214-H (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a Toshiba TPC8107 power MOSFET. It includes:
1. Details of the MOSFET components and manufacturer.
2. Equivalent circuit diagrams and descriptions of the MOSFET model parameters.
3. Simulation results graphs comparing measurements and simulations of key MOSFET characteristics like transconductance, drain current, gate charge, switching times and more.
4. Evaluation circuits and simulation settings used to generate the results.
5. Tables comparing measurement and simulation data with percent error calculations.
The report demonstrates accurate modeling of the MOSFET's electrical behavior through PSpice simulation versus real-world measurements
SPICE MODEL of SSM3J113TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J113TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8401 (Standard+BDS N&P Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8401 (Standard+BDS N&P) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of CSD06060B (Professional Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of CSD06060B (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K16FV (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K16FV (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of RJU002N06 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of RJU002N06 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ651 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ651 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K16FU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K16FU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ567 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ567 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4066-DL-E (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the device modeling report for a MOSFET transistor and body diode. It includes:
1) Component details such as part number, manufacturer, and remarks on the MOSFET and body diode models.
2) Descriptions and parameters for the MOSFET and diode SPICE models.
3) Results of circuit simulations characterizing key transistor properties like transconductance, Vgs-Id curve, gate charge, switching times and comparing to manufacturer data.
SPICE MODEL of 2SK2718 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2718 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3670 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a power MOSFET and its internal body diode and ESD protection diode. It includes:
1) MOSFET model parameters and simulations of its transconductance, Vgs-Id, Rds(on), gate charge, and capacitance characteristics.
2) Body diode simulations of its forward current, reverse recovery, and I-V characteristics.
3) ESD protection diode simulations of its zener voltage characteristic.
4) Comparisons of measurement and simulation results with low error percentages.
SPICE MODEL of 2SJ650 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of components in a device, including:
1) A power MOSFET model with parameters such as length, width, threshold voltage. Simulation results show characteristics like transconductance and switching time match measurements.
2) A body diode model with forward current characteristic matching measurements to within 0.1%.
3) An ESD protection diode zener voltage characteristic in simulation.
SPICE MODEL of SSM3J112TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J112TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6J409TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6J409TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8016-H (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8016-H (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of DF2B6.8FS , PSpice Model in SPICE PARKTsuyoshi Horigome
SPICE MODEL of DF2B6.8FS , PSpice Model in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8026 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8026 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K116TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K116TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ493 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ493 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K16FU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a Power MOSFET component. It includes:
1) A description of the MOSFET model parameters used in the PSpice simulation.
2) Simulation results and comparisons to measurement data for the MOSFET's transconductance, Vgs-Id curve, Rds(on), gate charge, capacitances and switching times.
3) Forward and reverse current characteristics along with the reverse recovery behavior.
4) A zener voltage characteristic simulation of the MOSFET's body diode.
SPICE MODEL of TPC8214-H (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8214-H (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a Toshiba TPC8107 power MOSFET. It includes:
1. Details of the MOSFET components and manufacturer.
2. Equivalent circuit diagrams and descriptions of the MOSFET model parameters.
3. Simulation results graphs comparing measurements and simulations of key MOSFET characteristics like transconductance, drain current, gate charge, switching times and more.
4. Evaluation circuits and simulation settings used to generate the results.
5. Tables comparing measurement and simulation data with percent error calculations.
The report demonstrates accurate modeling of the MOSFET's electrical behavior through PSpice simulation versus real-world measurements
SPICE MODEL of SSM3J113TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J113TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8401 (Standard+BDS N&P Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8401 (Standard+BDS N&P) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of CSD06060B (Professional Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of CSD06060B (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K16FV (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K16FV (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of RJU002N06 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of RJU002N06 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ651 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ651 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K16FU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K16FU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ567 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ567 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4066-DL-E (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the device modeling report for a MOSFET transistor and body diode. It includes:
1) Component details such as part number, manufacturer, and remarks on the MOSFET and body diode models.
2) Descriptions and parameters for the MOSFET and diode SPICE models.
3) Results of circuit simulations characterizing key transistor properties like transconductance, Vgs-Id curve, gate charge, switching times and comparing to manufacturer data.
SPICE MODEL of 2SK2718 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2718 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3670 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a power MOSFET and its internal body diode and ESD protection diode. It includes:
1) MOSFET model parameters and simulations of its transconductance, Vgs-Id, Rds(on), gate charge, and capacitance characteristics.
2) Body diode simulations of its forward current, reverse recovery, and I-V characteristics.
3) ESD protection diode simulations of its zener voltage characteristic.
4) Comparisons of measurement and simulation results with low error percentages.
SPICE MODEL of 2SJ650 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of components in a device, including:
1) A power MOSFET model with parameters such as length, width, threshold voltage. Simulation results show characteristics like transconductance and switching time match measurements.
2) A body diode model with forward current characteristic matching measurements to within 0.1%.
3) An ESD protection diode zener voltage characteristic in simulation.
SPICE MODEL of SSM3J112TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J112TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6J409TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6J409TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J115TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J115TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J115TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J115TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6P54TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6P54TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6P54TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6P54TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6J206FE (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6J206FE (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ448 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ448 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ448 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ448 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MTM23223 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of MTM23223 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ495 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ495 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ509 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ509 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6107 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6107 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6J206FE (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6J206FE (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6N29TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6N29TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6L13TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6L13TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ511 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a Power MOSFET and includes:
1) Specifications and parameters for the MOSFET SPICE model.
2) Simulation results and comparisons to measurement data for key MOSFET characteristics like transconductance, Vgs-Id, Rds(on), capacitance, switching times and more.
3) Specifications and simulation results for the body diode and ESD protection diode models.
SPICE MODEL of SSM3J305T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J305T (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6107 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6107 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J15FS (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J15FS (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ511 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ511 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
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Update 29 models(Solar cell) in SPICE PARK(FEB2024)Tsuyoshi Horigome
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 total pieces of electronic components and parts. It lists 36 categories of semiconductor devices, 11 categories of passive parts, 10 types of batteries, 5 mechanical parts, DC motors, lamps, and power supplies. It provides the most detailed listing for solar cells, with 1,003 total pieces from 51 manufacturers listed with part numbers.
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 electronic components. It lists the components by type (e.g. semiconductor), part number, manufacturer, thermal rating, and quantity on hand. For example, it shows that there are 621 general purpose rectifier diodes from manufacturers such as Fairchild, Fuji, Intersil, Rohm, Shindengen, and Toshiba. The detailed four-page section provides further information on the first item, general purpose rectifier diodes, including 152 individual part numbers and specifications.
This document discusses circuit simulations using LTspice. It describes driving a circuit simulation by inserting a 250 ohm resistor between the output terminals. It also describes simulating a 1 channel bridge circuit where the DUT1 and DUT2 resistors are both set to 100 ohms and the input voltage is set to either 1V or 5V.
This document discusses parametric sweeps of external and internal resistance values Rg for circuit simulation in LTspice. It also references outputting a waveform similar to a report on fall time characteristics for a device modeling report with customer Samsung.
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
In the rapidly evolving landscape of technologies, XML continues to play a vital role in structuring, storing, and transporting data across diverse systems. The recent advancements in artificial intelligence (AI) present new methodologies for enhancing XML development workflows, introducing efficiency, automation, and intelligent capabilities. This presentation will outline the scope and perspective of utilizing AI in XML development. The potential benefits and the possible pitfalls will be highlighted, providing a balanced view of the subject.
We will explore the capabilities of AI in understanding XML markup languages and autonomously creating structured XML content. Additionally, we will examine the capacity of AI to enrich plain text with appropriate XML markup. Practical examples and methodological guidelines will be provided to elucidate how AI can be effectively prompted to interpret and generate accurate XML markup.
Further emphasis will be placed on the role of AI in developing XSLT, or schemas such as XSD and Schematron. We will address the techniques and strategies adopted to create prompts for generating code, explaining code, or refactoring the code, and the results achieved.
The discussion will extend to how AI can be used to transform XML content. In particular, the focus will be on the use of AI XPath extension functions in XSLT, Schematron, Schematron Quick Fixes, or for XML content refactoring.
The presentation aims to deliver a comprehensive overview of AI usage in XML development, providing attendees with the necessary knowledge to make informed decisions. Whether you’re at the early stages of adopting AI or considering integrating it in advanced XML development, this presentation will cover all levels of expertise.
By highlighting the potential advantages and challenges of integrating AI with XML development tools and languages, the presentation seeks to inspire thoughtful conversation around the future of XML development. We’ll not only delve into the technical aspects of AI-powered XML development but also discuss practical implications and possible future directions.
Full-RAG: A modern architecture for hyper-personalizationZilliz
Mike Del Balso, CEO & Co-Founder at Tecton, presents "Full RAG," a novel approach to AI recommendation systems, aiming to push beyond the limitations of traditional models through a deep integration of contextual insights and real-time data, leveraging the Retrieval-Augmented Generation architecture. This talk will outline Full RAG's potential to significantly enhance personalization, address engineering challenges such as data management and model training, and introduce data enrichment with reranking as a key solution. Attendees will gain crucial insights into the importance of hyperpersonalization in AI, the capabilities of Full RAG for advanced personalization, and strategies for managing complex data integrations for deploying cutting-edge AI solutions.
Essentials of Automations: The Art of Triggers and Actions in FMESafe Software
In this second installment of our Essentials of Automations webinar series, we’ll explore the landscape of triggers and actions, guiding you through the nuances of authoring and adapting workspaces for seamless automations. Gain an understanding of the full spectrum of triggers and actions available in FME, empowering you to enhance your workspaces for efficient automation.
We’ll kick things off by showcasing the most commonly used event-based triggers, introducing you to various automation workflows like manual triggers, schedules, directory watchers, and more. Plus, see how these elements play out in real scenarios.
Whether you’re tweaking your current setup or building from the ground up, this session will arm you with the tools and insights needed to transform your FME usage into a powerhouse of productivity. Join us to discover effective strategies that simplify complex processes, enhancing your productivity and transforming your data management practices with FME. Let’s turn complexity into clarity and make your workspaces work wonders!
Unlocking Productivity: Leveraging the Potential of Copilot in Microsoft 365, a presentation by Christoforos Vlachos, Senior Solutions Manager – Modern Workplace, Uni Systems
How to Get CNIC Information System with Paksim Ga.pptxdanishmna97
Pakdata Cf is a groundbreaking system designed to streamline and facilitate access to CNIC information. This innovative platform leverages advanced technology to provide users with efficient and secure access to their CNIC details.
Observability Concepts EVERY Developer Should Know -- DeveloperWeek Europe.pdfPaige Cruz
Monitoring and observability aren’t traditionally found in software curriculums and many of us cobble this knowledge together from whatever vendor or ecosystem we were first introduced to and whatever is a part of your current company’s observability stack.
While the dev and ops silo continues to crumble….many organizations still relegate monitoring & observability as the purview of ops, infra and SRE teams. This is a mistake - achieving a highly observable system requires collaboration up and down the stack.
I, a former op, would like to extend an invitation to all application developers to join the observability party will share these foundational concepts to build on:
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
Removing Uninteresting Bytes in Software FuzzingAftab Hussain
Imagine a world where software fuzzing, the process of mutating bytes in test seeds to uncover hidden and erroneous program behaviors, becomes faster and more effective. A lot depends on the initial seeds, which can significantly dictate the trajectory of a fuzzing campaign, particularly in terms of how long it takes to uncover interesting behaviour in your code. We introduce DIAR, a technique designed to speedup fuzzing campaigns by pinpointing and eliminating those uninteresting bytes in the seeds. Picture this: instead of wasting valuable resources on meaningless mutations in large, bloated seeds, DIAR removes the unnecessary bytes, streamlining the entire process.
In this work, we equipped AFL, a popular fuzzer, with DIAR and examined two critical Linux libraries -- Libxml's xmllint, a tool for parsing xml documents, and Binutil's readelf, an essential debugging and security analysis command-line tool used to display detailed information about ELF (Executable and Linkable Format). Our preliminary results show that AFL+DIAR does not only discover new paths more quickly but also achieves higher coverage overall. This work thus showcases how starting with lean and optimized seeds can lead to faster, more comprehensive fuzzing campaigns -- and DIAR helps you find such seeds.
- These are slides of the talk given at IEEE International Conference on Software Testing Verification and Validation Workshop, ICSTW 2022.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
GraphSummit Singapore | The Art of the Possible with Graph - Q2 2024Neo4j
Neha Bajwa, Vice President of Product Marketing, Neo4j
Join us as we explore breakthrough innovations enabled by interconnected data and AI. Discover firsthand how organizations use relationships in data to uncover contextual insights and solve our most pressing challenges – from optimizing supply chains, detecting fraud, and improving customer experiences to accelerating drug discoveries.
Unlock the Future of Search with MongoDB Atlas_ Vector Search Unleashed.pdfMalak Abu Hammad
Discover how MongoDB Atlas and vector search technology can revolutionize your application's search capabilities. This comprehensive presentation covers:
* What is Vector Search?
* Importance and benefits of vector search
* Practical use cases across various industries
* Step-by-step implementation guide
* Live demos with code snippets
* Enhancing LLM capabilities with vector search
* Best practices and optimization strategies
Perfect for developers, AI enthusiasts, and tech leaders. Learn how to leverage MongoDB Atlas to deliver highly relevant, context-aware search results, transforming your data retrieval process. Stay ahead in tech innovation and maximize the potential of your applications.
#MongoDB #VectorSearch #AI #SemanticSearch #TechInnovation #DataScience #LLM #MachineLearning #SearchTechnology
Why You Should Replace Windows 11 with Nitrux Linux 3.5.0 for enhanced perfor...SOFTTECHHUB
The choice of an operating system plays a pivotal role in shaping our computing experience. For decades, Microsoft's Windows has dominated the market, offering a familiar and widely adopted platform for personal and professional use. However, as technological advancements continue to push the boundaries of innovation, alternative operating systems have emerged, challenging the status quo and offering users a fresh perspective on computing.
One such alternative that has garnered significant attention and acclaim is Nitrux Linux 3.5.0, a sleek, powerful, and user-friendly Linux distribution that promises to redefine the way we interact with our devices. With its focus on performance, security, and customization, Nitrux Linux presents a compelling case for those seeking to break free from the constraints of proprietary software and embrace the freedom and flexibility of open-source computing.
Alt. GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using ...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
Dr. Sean Tan, Head of Data Science, Changi Airport Group
Discover how Changi Airport Group (CAG) leverages graph technologies and generative AI to revolutionize their search capabilities. This session delves into the unique search needs of CAG’s diverse passengers and customers, showcasing how graph data structures enhance the accuracy and relevance of AI-generated search results, mitigating the risk of “hallucinations” and improving the overall customer journey.
SPICE MODEL of SSM3J120TU (Standard+BDS Model) in SPICE PARK
1. Device Modeling Report
COMPONENTS: MOSFET (Model Parameter)
PART NUMBER: SSM3J120TU
MANUFACTURER: TOSHIBA
REMARK: P Channel Model
Body Diode (Parameter) / ESD Protection Diode
Bee Technologies Inc.
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
2. Circuit Configuration
MOSFET MODEL
Pspice model
Model description
parameter
LEVEL
L Channel Length
W Channel Width
KP Transconductance
RS Source Ohmic Resistance
RD Ohmic Drain Resistance
VTO Zero-bias Threshold Voltage
RDS Drain-Source Shunt Resistance
TOX Gate Oxide Thickness
CGSO Zero-bias Gate-Source Capacitance
CGDO Zero-bias Gate-Drain Capacitance
CBD Zero-bias Bulk-Drain Junction Capacitance
MJ Bulk Junction Grading Coefficient
PB Bulk Junction Potential
FC Bulk Junction Forward-bias Capacitance Coefficient
RG Gate Ohmic Resistance
IS Bulk Junction Saturation Current
N Bulk Junction Emission Coefficient
RB Bulk Series Resistance
PHI Surface Inversion Potential
GAMMA Body-effect Parameter
DELTA Width effect on Threshold Voltage
ETA Static Feedback on Threshold Voltage
THETA Modility Modulation
KAPPA Saturation Field Factor
VMAX Maximum Drift Velocity of Carriers
XJ Metallurgical Junction Depth
UO Surface Mobility
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
15. Reverse Recovery Characteristic Reference
Trj=15.2(ns)
Trb=28.8(ns)
Conditions:Ifwd=lrev=0.2(A),Rl=50
Example
Relation between trj and trb
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
16. ESD PROTECTION DIODE SPICE MODEL
Zener Voltage Characteristic
Circuit Simulation Result
10mA
5mA
0A
0V 5V 10V 15V 20V 25V 30V 35V 40V 45V 50V
I(R1)
V_V1
Evaluation Circuit
R1
U1
SSM3J120TU
0.01m
R2
V1 1G
0Vdc
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006