This document summarizes the modeling of components in a device, including:
1) A power MOSFET model with parameters such as length, width, threshold voltage. Simulation results show characteristics like transconductance and switching time match measurements.
2) A body diode model with forward current characteristic matching measurements to within 0.1%.
3) An ESD protection diode zener voltage characteristic in simulation.
SPICE MODEL of 2SJ650 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a power MOSFET and its body diode. It includes:
1) Specifications and parameters for the MOSFET and diode SPICE models.
2) Simulation results comparing measurements and simulations for key characteristics like transconductance, capacitance, switching time.
3) Evaluation circuits used to simulate the characteristics.
4) References and specifications for the models to describe behavior in circuits.
SPICE MODEL of 2SJ657 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes SPICE models for the components in a power MOSFET and ESD protection diode device. It includes:
1) SPICE models and parameters for the power MOSFET, including its transconductance, capacitances, switching times, and body diode characteristics.
2) Simulation results comparing measurements to simulations for various characteristics.
3) SPICE models and parameters for the body diode and ESD protection diode.
4) Simulation results for the diodes' forward and reverse recovery characteristics and zener voltage.
SPICE MODEL of 2SJ657 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ657 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ654 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ654 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ651 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ651 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ651 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ651 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ654 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ654 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ655 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ655 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ650 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a power MOSFET and its body diode. It includes:
1) Specifications and parameters for the MOSFET and diode SPICE models.
2) Simulation results comparing measurements and simulations for key characteristics like transconductance, capacitance, switching time.
3) Evaluation circuits used to simulate the characteristics.
4) References and specifications for the models to describe behavior in circuits.
SPICE MODEL of 2SJ657 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes SPICE models for the components in a power MOSFET and ESD protection diode device. It includes:
1) SPICE models and parameters for the power MOSFET, including its transconductance, capacitances, switching times, and body diode characteristics.
2) Simulation results comparing measurements to simulations for various characteristics.
3) SPICE models and parameters for the body diode and ESD protection diode.
4) Simulation results for the diodes' forward and reverse recovery characteristics and zener voltage.
SPICE MODEL of 2SJ657 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ657 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ654 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ654 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ651 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ651 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ651 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ651 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ654 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ654 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ655 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ655 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4063LS (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4063LS (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ655 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ655 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8J01 (Standard+BDS+BRT Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a TPCP8J01 power MOSFET. It includes SPICE models and simulation results for the MOSFET's components, including the power MOSFET, body diode, and ESD protection diode. Circuit configurations, model parameters, and comparisons between measurement and simulation data are presented for various electrical characteristics such as transconductance, capacitance, switching time, and more.
SPICE MODEL of 2SK4063LS (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4063LS (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4108 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a Power MOSFET transistor. It describes the device components and equivalent circuit model. Simulation results are provided for key characteristics like transconductance, output, gate charge, capacitance and switching times. Comparisons to measurement data show good agreement between simulation and real-world device performance.
SPICE MODEL of TPCF8103 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of components in a power MOSFET device. It includes:
1) SPICE model parameters for the power MOSFET and its body diode.
2) Simulation results showing characteristics like transconductance, capacitance and switching times match measurements.
3) SPICE models for the body diode and ESD protection diode with simulation matching measurements.
SPICE MODEL of 2SJ438 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the device modeling report for a power MOSFET and includes:
1) Component details such as the part number, manufacturer, and remarks on the MOSFET and body diode models.
2) Summaries of simulations and comparisons to measurement data for key MOSFET parameters and characteristics including transconductance, Vgs-Id, switching time, and more.
3) Summaries of simulations and comparisons to measurement data for the body diode's forward current, reverse recovery, and zener voltage characteristics.
4) References and example circuits used in the simulations.
SPICE MODEL of SPP11N60C3 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPP11N60C3 (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4064LS (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4064LS (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3670 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a power MOSFET and its internal body diode and ESD protection diode. It includes:
1) MOSFET model parameters and simulations of its transconductance, Vgs-Id, Rds(on), gate charge, and capacitance characteristics.
2) Body diode simulations of its forward current, reverse recovery, and I-V characteristics.
3) ESD protection diode simulations of its zener voltage characteristic.
4) Comparisons of measurement and simulation results with low error percentages.
SPICE MODEL of SPB11N60C3 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPB11N60C3 (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8104 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCF8104 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3704 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3704 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K15FV (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K15FV (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3863 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of components in a device, including:
1) A power MOSFET model with parameters such as length, width, threshold voltage.
2) Simulation results showing characteristics like transconductance, drain current, and capacitance match measurements.
3) A body diode model with simulation of forward current matching measurements.
4) An ESD protection diode model with zener voltage characteristic simulation shown.
SPICE MODEL of 2SK3704 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3704 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3703 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3703 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3435 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3435 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2718 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2718 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4108 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4108 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4087LS (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4087LS (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4087LS (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4087LS (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4063LS (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4063LS (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ655 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ655 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8J01 (Standard+BDS+BRT Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a TPCP8J01 power MOSFET. It includes SPICE models and simulation results for the MOSFET's components, including the power MOSFET, body diode, and ESD protection diode. Circuit configurations, model parameters, and comparisons between measurement and simulation data are presented for various electrical characteristics such as transconductance, capacitance, switching time, and more.
SPICE MODEL of 2SK4063LS (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4063LS (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4108 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a Power MOSFET transistor. It describes the device components and equivalent circuit model. Simulation results are provided for key characteristics like transconductance, output, gate charge, capacitance and switching times. Comparisons to measurement data show good agreement between simulation and real-world device performance.
SPICE MODEL of TPCF8103 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of components in a power MOSFET device. It includes:
1) SPICE model parameters for the power MOSFET and its body diode.
2) Simulation results showing characteristics like transconductance, capacitance and switching times match measurements.
3) SPICE models for the body diode and ESD protection diode with simulation matching measurements.
SPICE MODEL of 2SJ438 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the device modeling report for a power MOSFET and includes:
1) Component details such as the part number, manufacturer, and remarks on the MOSFET and body diode models.
2) Summaries of simulations and comparisons to measurement data for key MOSFET parameters and characteristics including transconductance, Vgs-Id, switching time, and more.
3) Summaries of simulations and comparisons to measurement data for the body diode's forward current, reverse recovery, and zener voltage characteristics.
4) References and example circuits used in the simulations.
SPICE MODEL of SPP11N60C3 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPP11N60C3 (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4064LS (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4064LS (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3670 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a power MOSFET and its internal body diode and ESD protection diode. It includes:
1) MOSFET model parameters and simulations of its transconductance, Vgs-Id, Rds(on), gate charge, and capacitance characteristics.
2) Body diode simulations of its forward current, reverse recovery, and I-V characteristics.
3) ESD protection diode simulations of its zener voltage characteristic.
4) Comparisons of measurement and simulation results with low error percentages.
SPICE MODEL of SPB11N60C3 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPB11N60C3 (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8104 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCF8104 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3704 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3704 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K15FV (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K15FV (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3863 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of components in a device, including:
1) A power MOSFET model with parameters such as length, width, threshold voltage.
2) Simulation results showing characteristics like transconductance, drain current, and capacitance match measurements.
3) A body diode model with simulation of forward current matching measurements.
4) An ESD protection diode model with zener voltage characteristic simulation shown.
SPICE MODEL of 2SK3704 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3704 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3703 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3703 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3435 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3435 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2718 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2718 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4108 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4108 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4087LS (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4087LS (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4087LS (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4087LS (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4125 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4125 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK15H50C (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK15H50C (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ380 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a power MOSFET and ESD protection diode. It includes:
1) SPICE models and parameters for the MOSFET, its body diode, and the protection diode.
2) Circuit simulations validating the models against measurement data for key characteristics like transconductance, capacitance, switching time.
3) Reference curves and evaluation of properties like the protection diode's zener voltage.
SPICE MODEL of TPC6109-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6109-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3797 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3797 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3705 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3705 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3705 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3705 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8107 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8107 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4064LS (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4064LS (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ652 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ652 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4101LS (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4101LS (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2417 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2417 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4122LS (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4122LS (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4062LS (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a MOSFET transistor. It includes:
1) Details of the MOSFET part being modeled, including manufacturer, part number, and model parameters.
2) Results of circuit simulations characterizing key electrical properties of the MOSFET, including transconductance, capacitance, switching time, and forward/reverse current.
3) Comparisons of the simulation results to manufacturer measurements, showing good agreement within a few percent error.
4) Explanations of the evaluation circuits used in the simulations and definitions of recovery time parameters.
SPICE MODEL of TPC6109-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6109-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK30A06J3 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK30A06J3 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2417 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2417 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ652 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ652 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
Similar to SPICE MODEL of 2SJ650 (Standard+BDS Model) in SPICE PARK (20)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Tsuyoshi Horigome
This document provides an inventory update of 6,747 parts at Spice Park as of April 2024. It lists the part numbers, manufacturers, and quantities of various semiconductor components, including 1,697 Schottky rectifier diodes from 29 different manufacturers. It also includes details on passive components, batteries, mechanical parts, motors, and lamps in the inventory.
The document provides an inventory update from April 2024 of the Spice Park collection which contains 6,747 electronic components. It includes tables listing the types of semiconductor components, passive parts, batteries, mechanical parts, motors, and lamps in the collection along with their manufacturer and quantities. One of the semiconductor components, the general purpose rectifier diode, is broken down into a more detailed table with 116 entries providing part numbers, manufacturers, thermal ratings, and remarks.
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Tsuyoshi Horigome
The document provides an inventory update from March 2024 of parts in the Spice Park warehouse. It lists 6,725 total parts across various categories including semiconductors, passive parts, batteries, mechanical parts, motors, and lamps. The semiconductor section lists 652 general purpose rectifier diodes from 18 different manufacturers with quantities ranging from 2 to 145 pieces.
This document provides an inventory list of parts at Spice Park as of March 2024. It contains 3 sections - Semiconductor parts (diodes, transistors, ICs etc.), Passive parts (capacitors, resistors etc.), and Battery parts. For Semiconductor parts, it lists 36 different part types and provides the quantity of each part. It then provides further details of Diode/General Purpose Rectifiers, listing the manufacturer and quantity of 652 individual part numbers.
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Tsuyoshi Horigome
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 total pieces of electronic components and parts. It lists 36 categories of semiconductor devices, 11 categories of passive parts, 10 types of batteries, 5 mechanical parts, DC motors, lamps, and power supplies. It provides the most detailed listing for solar cells, with 1,003 total pieces from 51 manufacturers listed with part numbers.
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 electronic components. It lists the components by type (e.g. semiconductor), part number, manufacturer, thermal rating, and quantity on hand. For example, it shows that there are 621 general purpose rectifier diodes from manufacturers such as Fairchild, Fuji, Intersil, Rohm, Shindengen, and Toshiba. The detailed four-page section provides further information on the first item, general purpose rectifier diodes, including 152 individual part numbers and specifications.
This document discusses circuit simulations using LTspice. It describes driving a circuit simulation by inserting a 250 ohm resistor between the output terminals. It also describes simulating a 1 channel bridge circuit where the DUT1 and DUT2 resistors are both set to 100 ohms and the input voltage is set to either 1V or 5V.
This document discusses parametric sweeps of external and internal resistance values Rg for circuit simulation in LTspice. It also references outputting a waveform similar to a report on fall time characteristics for a device modeling report with customer Samsung.
OpenID AuthZEN Interop Read Out - AuthorizationDavid Brossard
During Identiverse 2024 and EIC 2024, members of the OpenID AuthZEN WG got together and demoed their authorization endpoints conforming to the AuthZEN API
“An Outlook of the Ongoing and Future Relationship between Blockchain Technologies and Process-aware Information Systems.” Invited talk at the joint workshop on Blockchain for Information Systems (BC4IS) and Blockchain for Trusted Data Sharing (B4TDS), co-located with with the 36th International Conference on Advanced Information Systems Engineering (CAiSE), 3 June 2024, Limassol, Cyprus.
Generating privacy-protected synthetic data using Secludy and MilvusZilliz
During this demo, the founders of Secludy will demonstrate how their system utilizes Milvus to store and manipulate embeddings for generating privacy-protected synthetic data. Their approach not only maintains the confidentiality of the original data but also enhances the utility and scalability of LLMs under privacy constraints. Attendees, including machine learning engineers, data scientists, and data managers, will witness first-hand how Secludy's integration with Milvus empowers organizations to harness the power of LLMs securely and efficiently.
Removing Uninteresting Bytes in Software FuzzingAftab Hussain
Imagine a world where software fuzzing, the process of mutating bytes in test seeds to uncover hidden and erroneous program behaviors, becomes faster and more effective. A lot depends on the initial seeds, which can significantly dictate the trajectory of a fuzzing campaign, particularly in terms of how long it takes to uncover interesting behaviour in your code. We introduce DIAR, a technique designed to speedup fuzzing campaigns by pinpointing and eliminating those uninteresting bytes in the seeds. Picture this: instead of wasting valuable resources on meaningless mutations in large, bloated seeds, DIAR removes the unnecessary bytes, streamlining the entire process.
In this work, we equipped AFL, a popular fuzzer, with DIAR and examined two critical Linux libraries -- Libxml's xmllint, a tool for parsing xml documents, and Binutil's readelf, an essential debugging and security analysis command-line tool used to display detailed information about ELF (Executable and Linkable Format). Our preliminary results show that AFL+DIAR does not only discover new paths more quickly but also achieves higher coverage overall. This work thus showcases how starting with lean and optimized seeds can lead to faster, more comprehensive fuzzing campaigns -- and DIAR helps you find such seeds.
- These are slides of the talk given at IEEE International Conference on Software Testing Verification and Validation Workshop, ICSTW 2022.
Climate Impact of Software Testing at Nordic Testing DaysKari Kakkonen
My slides at Nordic Testing Days 6.6.2024
Climate impact / sustainability of software testing discussed on the talk. ICT and testing must carry their part of global responsibility to help with the climat warming. We can minimize the carbon footprint but we can also have a carbon handprint, a positive impact on the climate. Quality characteristics can be added with sustainability, and then measured continuously. Test environments can be used less, and in smaller scale and on demand. Test techniques can be used in optimizing or minimizing number of tests. Test automation can be used to speed up testing.
AI-Powered Food Delivery Transforming App Development in Saudi Arabia.pdfTechgropse Pvt.Ltd.
In this blog post, we'll delve into the intersection of AI and app development in Saudi Arabia, focusing on the food delivery sector. We'll explore how AI is revolutionizing the way Saudi consumers order food, how restaurants manage their operations, and how delivery partners navigate the bustling streets of cities like Riyadh, Jeddah, and Dammam. Through real-world case studies, we'll showcase how leading Saudi food delivery apps are leveraging AI to redefine convenience, personalization, and efficiency.
Taking AI to the Next Level in Manufacturing.pdfssuserfac0301
Read Taking AI to the Next Level in Manufacturing to gain insights on AI adoption in the manufacturing industry, such as:
1. How quickly AI is being implemented in manufacturing.
2. Which barriers stand in the way of AI adoption.
3. How data quality and governance form the backbone of AI.
4. Organizational processes and structures that may inhibit effective AI adoption.
6. Ideas and approaches to help build your organization's AI strategy.
Best 20 SEO Techniques To Improve Website Visibility In SERPPixlogix Infotech
Boost your website's visibility with proven SEO techniques! Our latest blog dives into essential strategies to enhance your online presence, increase traffic, and rank higher on search engines. From keyword optimization to quality content creation, learn how to make your site stand out in the crowded digital landscape. Discover actionable tips and expert insights to elevate your SEO game.
Cosa hanno in comune un mattoncino Lego e la backdoor XZ?Speck&Tech
ABSTRACT: A prima vista, un mattoncino Lego e la backdoor XZ potrebbero avere in comune il fatto di essere entrambi blocchi di costruzione, o dipendenze di progetti creativi e software. La realtà è che un mattoncino Lego e il caso della backdoor XZ hanno molto di più di tutto ciò in comune.
Partecipate alla presentazione per immergervi in una storia di interoperabilità, standard e formati aperti, per poi discutere del ruolo importante che i contributori hanno in una comunità open source sostenibile.
BIO: Sostenitrice del software libero e dei formati standard e aperti. È stata un membro attivo dei progetti Fedora e openSUSE e ha co-fondato l'Associazione LibreItalia dove è stata coinvolta in diversi eventi, migrazioni e formazione relativi a LibreOffice. In precedenza ha lavorato a migrazioni e corsi di formazione su LibreOffice per diverse amministrazioni pubbliche e privati. Da gennaio 2020 lavora in SUSE come Software Release Engineer per Uyuni e SUSE Manager e quando non segue la sua passione per i computer e per Geeko coltiva la sua curiosità per l'astronomia (da cui deriva il suo nickname deneb_alpha).
Essentials of Automations: The Art of Triggers and Actions in FMESafe Software
In this second installment of our Essentials of Automations webinar series, we’ll explore the landscape of triggers and actions, guiding you through the nuances of authoring and adapting workspaces for seamless automations. Gain an understanding of the full spectrum of triggers and actions available in FME, empowering you to enhance your workspaces for efficient automation.
We’ll kick things off by showcasing the most commonly used event-based triggers, introducing you to various automation workflows like manual triggers, schedules, directory watchers, and more. Plus, see how these elements play out in real scenarios.
Whether you’re tweaking your current setup or building from the ground up, this session will arm you with the tools and insights needed to transform your FME usage into a powerhouse of productivity. Join us to discover effective strategies that simplify complex processes, enhancing your productivity and transforming your data management practices with FME. Let’s turn complexity into clarity and make your workspaces work wonders!
In his public lecture, Christian Timmerer provides insights into the fascinating history of video streaming, starting from its humble beginnings before YouTube to the groundbreaking technologies that now dominate platforms like Netflix and ORF ON. Timmerer also presents provocative contributions of his own that have significantly influenced the industry. He concludes by looking at future challenges and invites the audience to join in a discussion.
HCL Notes and Domino License Cost Reduction in the World of DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-and-domino-license-cost-reduction-in-the-world-of-dlau/
The introduction of DLAU and the CCB & CCX licensing model caused quite a stir in the HCL community. As a Notes and Domino customer, you may have faced challenges with unexpected user counts and license costs. You probably have questions on how this new licensing approach works and how to benefit from it. Most importantly, you likely have budget constraints and want to save money where possible. Don’t worry, we can help with all of this!
We’ll show you how to fix common misconfigurations that cause higher-than-expected user counts, and how to identify accounts which you can deactivate to save money. There are also frequent patterns that can cause unnecessary cost, like using a person document instead of a mail-in for shared mailboxes. We’ll provide examples and solutions for those as well. And naturally we’ll explain the new licensing model.
Join HCL Ambassador Marc Thomas in this webinar with a special guest appearance from Franz Walder. It will give you the tools and know-how to stay on top of what is going on with Domino licensing. You will be able lower your cost through an optimized configuration and keep it low going forward.
These topics will be covered
- Reducing license cost by finding and fixing misconfigurations and superfluous accounts
- How do CCB and CCX licenses really work?
- Understanding the DLAU tool and how to best utilize it
- Tips for common problem areas, like team mailboxes, functional/test users, etc
- Practical examples and best practices to implement right away
HCL Notes and Domino License Cost Reduction in the World of DLAU
SPICE MODEL of 2SJ650 (Standard+BDS Model) in SPICE PARK
1. Device Modeling Report
COMPONENTS: Power MOSFET (Model Parameters)
PART NUMBER: 2SJ650
MANUFACTURER: SANYO
Body Diode (Model Parameters) / ESD Protection Diode
Bee Technologies Inc.
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
1
2. MOSFET MODEL
PSpice model
Model description
parameter
LEVEL
L Channel Length
W Channel Width
KP Transconductance
RS Source Ohmic Resistance
RD Ohmic Drain Resistance
VTO Zero-bias Threshold Voltage
RDS Drain-Source Shunt Resistance
TOX Gate Oxide Thickness
CGSO Zero-bias Gate-Source Capacitance
CGDO Zero-bias Gate-Drain Capacitance
CBD Zero-bias Bulk-Drain Junction Capacitance
MJ Bulk Junction Grading Coefficient
PB Bulk Junction Potential
FC Bulk Junction Forward-bias Capacitance Coefficient
RG Gate Ohmic Resistance
IS Bulk Junction Saturation Current
N Bulk Junction Emission Coefficient
RB Bulk Series Resistance
PHI Surface Inversion Potential
GAMMA Body-effect Parameter
DELTA Width effect on Threshold Voltage
ETA Static Feedback on Threshold Voltage
THETA Mobility Modulation
KAPPA Saturation Field Factor
VMAX Maximum Drift Velocity of Carriers
XJ Metallurgical Junction Depth
UO Surface Mobility
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
2
3. Transconductance Characteristic
Circuit Simulation Result
15
Measurement
Simulation
10
gfs(S)
5
0
0.0 2.0 4.0 6.0 8.0 10.0
Drain Current ID (-A)
Comparison table
gfs(S)
-Id(A) Error (%)
Measurement Simulation
1.0000 3.550 3.707 4.42
2.0000 4.950 5.162 4.28
5.0000 7.800 7.928 1.64
10.0000 10.600 10.862 2.47
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
3
4. Vgs-Id Characteristic
Circuit Simulation result
-20A
-15A
-10A
-5A
0A
0V -1.0V -2.0V -3.0V -4.0V -5.0V
I(V3)
V_V1
Evaluation circuit
V3
0Vdc
V2
U1
2SJ650 -10
V1
0Vdc
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
4
5. Comparison Graph
Circuit Simulation Result
Simulation Result
-VGS(V)
-ID(A) Error (%)
Measurement Simulation
1 2.650 2.638 -0.47
2 2.850 2.863 0.45
5 3.250 3.320 2.15
10 3.750 3.851 2.69
20 4.700 4.632 -1.46
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
5
6. Rds(on) Characteristic
Circuit Simulation result
-6.0A
-5.0A
-4.0A
-3.0A
-2.0A
-1.0A
0A
0V -100mV -200mV -300mV -400mV -500mV -600mV
I(V3)
V_VDS
Evaluation circuit
V3
0Vdc
VDS
U1 0Vdc
2SJ650
V1
-10
0
Simulation Result
ID=-6A, VGS=-10V Measurement Simulation Error (%)
R DS (on) mΩ 100.000 100.000 0.00
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
6
14. Reverse Recovery Characteristic Reference
Measurement
Trj=18.00(ns)
Trb=24.00(ns)
Conditions:Ifwd=lrev=0.2(A),Rl=50
Example
Relation between trj and trb
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
14
15. ESD PROTECTION DIODE SPICE MODEL
Zener Voltage Characteristic
Circuit Simulation Result
-10mA
-8mA
-6mA
-4mA
-2mA
0A
0V -10V -20V -30V -40V -50V
I(R1)
V_V1
Evaluation Circuit
R1
0.001m U1
2SJ650
V1
0Vdc R2
100MEG
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
15