World-first Front Facing 3D Indirect ToF camera in the LG G8 ThinQ smartphone, with NIR 3D Camera and flood illuminator. Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/pmdinfineons-3d-indirect-time-of-flight-in-lg-g8-thinq/

1. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 1
SP19468 - Imaging - Infineon 3D ToF in LG G8
22 bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Infineon/pmd3DIndirectToFCameraModule
REAL3Time-of-FligthImagesensorandFloodIlluminatorintheLGG8ThinQ
SP19468 - IMAGING report by Sylvain HALLEREAU
Physical Analysis by Nicolas RADUFFE
September 2019 – SAMPLE
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

2. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 2
SP19468 - Imaging - Infineon 3D ToF in LG G8
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Infineon
o PMD
o Ams AG
o LG G8 ThinQ Edition Teardown
Market Analysis 25
o Ecosystem & Forecast
Physical Analysis 29
o Summary of the Physical Analysis 31
o 3D Sensing System Assembly 33
 Module Views
 Module Opening
 3D ToF System Cross-Section
o Flood Illuminator 43
 Module View & Dimensions
 Module Cross-Section
o NIR VCSEL Die 51
 Die View & Dimensions
 Die Process
 Die Cross-Section
 Die Process Characteristic
o NIR ToF Module 63
 Module View & Dimensions
 Module Cross-Section
o NIR ToF Image Sensor 74
 Die Overview & Dimensions
 Die Process
 Die Cross-Section
 Die Process Characteristic
Manufacturing Process 100
o NIR ToF Image Sensor Die Front-End Process & Fabrication Unit
o Flood Illuminator NIR VCSEL Process Flow & Fabrication Unit
o Summary of the main parts
Cost Analysis 110
o Summary of the cost analysis 112
o Yields Explanation & Hypotheses 114
o NIR Camera Die 117
 Pixel Array & Optical Front-End Cost
 NIR ToF Image Sensor Wafer & Die Cost
o Flood Illuminator Die 122
 NIR VCSEL Front-End Cost
 NIR VCSEL Probe Test, Thinning & Dicing
 NIR VCSEL Die Wafer Cost
 Component Cost
o ToF Module 129
 Lens Module & Component Cost
LG vs. vivo vs. Lenovo 136
Feedbacks 141
SystemPlus Consulting services 143

3. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 3
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
o Executive Summary
o Reverse Costing Methodology
o Glossary
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of 3D
indirect Time of flight camera module this integrate the Infineon REAL3 image sensor and the Flood Illuminator found in the LG G8 ThinQ.
The new pmd/Infineon REAL3 image sensor, reference IR 2381C, offers more than simple face authentication for the LG G8 ThinQ
smartphone. The indirect Time-of-Flight (ToF) camera and the flood illuminator allow face recognition, and also the recognition of the
palm vein patterns. Moreover, the ToF module is used for the new ‘Bokeh’ smartphone photography mode. Bokeh allows users to take
pictures without blur in real-time. Lastly, the new indirect ToF module allows users to interact with the phone without touching it, using
hand gestures.
The ToF Module in the LG G8 smartphone is based on the REAL3 image sensor, a Near Infra-Red (NIR) sensor and a flood illuminator,
using a new-generation Vertical Cavity Surface Emitting Laser (VCSEL) die from ams AG. The total solution is designed by PMD.
This report is focused on the analysis of the 3D depth-sensing camera, comprising the NIR ToF camera module with REAL3 CMOS and the
flood illuminator. This new NIR image sensor is 40% smaller than the 2016 module from Lenovo Phab2Pro, with the same 224x172 pixel
definition. This is coupled with the new generation of the VCSEL laser die from ams AG, which is 12% smaller than the last generation.
The new VCSEL electrode has been re-designed, and the cavity diameter reduced by 15%.
This report analyzes the complete 3D indirect ToF camera, provided along with cost analysis and price estimation for the module.
It also includes a physical and technical comparison with other 3D camera systems, such as the pmd/Infineon ToF image sensor in the
Lenovo Phab 2 Pro, and the Panasonic MN34906 charge-coupled device (CCD) ToF image sensor in the Vivo Nex Dual Display. The
comparison looks at system integration, the NIR camera module and the illuminator architecture.

4. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 4
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
Company Profile & Supply Chain
o Infineon
o PMD
o ams AG
o LG G8 ThinQ Teardown
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
LG G8 ThinQ Teardown
LG G8 ThinQ Front, Side and Back View
©2019 by System Plus Consulting
Dimensions
o Height: 151.9 mm
o Width: 71.8 mm
o Thickness: 8.4 mm
Weight
o 167 g

5. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 5
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o 3D ToF Module
o Flood Illuminator Module
o Overview
o Cross-Section
o NIR VCSEL Die
o Views & Dimensions
o Die Process
o Die Cross-section
o NIR ToF Image Sensor
o Overview
o Cross-Section
o NIR ToF Image Sensor Die
o Views & Dimensions
o Delayering & Process
o Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
3D ToF Camera Module Views & Dimensions
ToF Camera Module with the flex – Optical View
©2019 by System Plus Consulting

6. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 6
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o 3D ToF Module
o Flood Illuminator Module
o Overview
o Cross-Section
o NIR VCSEL Die
o Views & Dimensions
o Die Process
o Die Cross-section
o NIR ToF Image Sensor
o Overview
o Cross-Section
o NIR ToF Image Sensor Die
o Views & Dimensions
o Delayering & Process
o Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
3D ToF Camera Module Disassembly

7. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 7
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o 3D ToF Module
o Flood Illuminator Module
o Overview
o Cross-Section
o NIR VCSEL Die
o Views & Dimensions
o Die Process
o Die Cross-section
o NIR ToF Image Sensor
o Overview
o Cross-Section
o NIR ToF Image Sensor Die
o Views & Dimensions
o Delayering & Process
o Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
VCSEL Die Overview & Dimensions
XXmm
XXmm
o Die Area: XXmm²
(XX x XX mm)
o Pad number: 1
o Wire bonding: 8
o Material: xxx
o Diameter: XX µm
o Emitting Array: XX mm²
(XX x XX mm)
o Emitter Number: XX
o Cavity Area: XX µm²
o Cavity Diameter: XX µm
VCSEL Die - Overview
©2019 by System Plus Consulting

8. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 8
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o 3D ToF Module
o Flood Illuminator Module
o Overview
o Cross-Section
o NIR VCSEL Die
o Views & Dimensions
o Die Process
o Die Cross-section
o NIR ToF Image Sensor
o Overview
o Cross-Section
o NIR ToF Image Sensor Die
o Views & Dimensions
o Delayering & Process
o Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
VCSEL Die Cross-Section

9. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 9
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o 3D ToF Module
o Flood Illuminator Module
o Overview
o Cross-Section
o NIR VCSEL Die
o Views & Dimensions
o Die Process
o Die Cross-section
o NIR ToF Image Sensor
o Overview
o Cross-Section
o NIR ToF Image Sensor Die
o Views & Dimensions
o Delayering & Process
o Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
3D ToF Camera Module – NIR Camera Cross-Section

10. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 10
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o 3D ToF Module
o Flood Illuminator Module
o Overview
o Cross-Section
o NIR VCSEL Die
o Views & Dimensions
o Die Process
o Die Cross-section
o NIR ToF Image Sensor
o Overview
o Cross-Section
o NIR ToF Image Sensor Die
o Views & Dimensions
o Delayering & Process
o Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
3D ToF Camera Module – Sensor Die Overview
XX mm
Die Sensor - Overview
©2019 by System Plus Consulting
o Diagonal size: XX mm
(1/6.46”)

11. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 11
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o 3D ToF Module
o Flood Illuminator Module
o Overview
o Cross-Section
o NIR VCSEL Die
o Views & Dimensions
o Die Process
o Die Cross-section
o NIR ToF Image Sensor
o Overview
o Cross-Section
o NIR ToF Image Sensor Die
o Views & Dimensions
o Delayering & Process
o Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Sensor Die – Die Cross-Section – Lens
Sensor Die Cross-Section – Lens – SEM View
©2019 by System Plus Consulting

12. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 12
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o NIR Camera Module Cost
o Flood Illuminator Module Cost
o 3D ToF Module Cost
Feedbacks
About System Plus
NIR Camera Module – Pixel Array Front-End Cost

13. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 13
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o NIR Camera Module Cost
o Flood Illuminator Module Cost
o 3D ToF Module Cost
Feedbacks
About System Plus
Flood Illuminator – NIR VCSEL Front-End Cost per Process Steps
VCSEL Manufacturing Steps Cost (Simulated
with LED CoSim+ Cost Simulation Tool)

14. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 14
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o NIR Camera Module Cost
o Flood Illuminator Module Cost
o 3D ToF Module Cost
Feedbacks
About System Plus
Time of Flight Module Selling Price

15. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 15
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
o Company services
o Related reports
o Contact
o Legal
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
IMAGING
• 3D Imaging & Sensing 2019
• VCSELs - Technology, Industry and Market Trends
• Consumer Biometrics: Market and Technologies Trends 2019
• Hardware and Software for AI 2019 – Consumer focus
• Status of the Camera Module Industry 2019 – Focus on Wafer
Level Optics
• Status of the CMOS Image Sensor Industry 2018
• CMOS Image Sensor Service – Imaging Research
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
IMAGING
• Panasonic’s 3D Time-of-Flight Depth Sensing Camera
Module
• Sony’s 3D Time-of-Flight Depth Sensing Camera Module
• Huawei Mate 20 Pro’s 3D Depth-Sensing System
• Orbbec’s Front 3D Depth Sensing System in the Oppo
Find X
• STMicroelectronics’ Near Infrared Camera Sensor in the
Apple iPhone X
• Apple iPhone X – Infrared Dot Projector
• Lenovo Phab2Pro 3D ToF Camera

16. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 16
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Related Reports
About System Plus
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
IMAGING
• Status of the Camera Module Industry 2019 – Focus on Wafer
Level Optics
• Status of the CMOS Image Sensor Industry 2018
• CMOS Image Sensor Service – Imaging Research
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
IMAGING
• Mobile CMOS Image Sensor Comparison 2019
• Mobile Camera Module Comparison 2019
• Huawei Mate 20 Pro’s 3D Depth-Sensing System

17. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 17
SP19468 - Imaging - Infineon 3D ToF in LG G8
SystemPlus
Consulting
SERVICES

18. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 18
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
o Company services
o Related reports
o Contact
o Legal
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>60 reports per year)
Costing Tools
Trainings

19. ©2019 by System Plus Consulting | Infineon - PMD 3D ToF Depth Sensing Camera Module - SAMPLE 19
SP19468 - Imaging - Infineon 3D ToF in LG G8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
o Company services
o Related reports
o Contact
o Legal
Contact
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