Model Name E120A390QSR
Screen Size 1.2 inch
Interface QSPI,MIPI
Active Area 30.42(W)×30.42(H) mm
Resolution 390x390 325 PPI
Contrast Ratio 100000:1 (Typ.) (TM)
OLED information
https://www.panoxdisplay.com/amoled/1-2-inch-round-oled-390-spi-60hz.html
Wearable 1.78 inch Square AMOLED Display 368*448 For Smart Watch Bracelet Scr...Shawn Lee
1.78 inch AMOLED is a low power consumption AMOLED with 368x448 resolution and MIPI/SPI interface.
The IC mode is RM69090 which is widely used in wearable AMOLED displays such as 1.39" AMOLED.
It has an integrated CTP with TMA525C touch IC.
Application: Wearable, Medical equipment
Whatsapp: +86 18566294218
Email: shawn.lee@panoxdisplay.com
Skype: panoxshawn@outlook.com
OLED/LCD supplier: www.panoxdisplay.com
Radiation Hardening by Design is one of the hardware based solution to one of the most troublesome problem faced by digital circuits in the space.
RHBD provides varieties of techniques to make the circuit resilient towards such effects and ensures proper malfunctioning of the circuit.
Real-Time 200Gbit/s PAM4 Transmission Over 80km SSMF Using Quantum-Dot Laser ...ADVA
Using 200Gbit/s four-channel transmitter and receiver optical subassemblies (TOSAs/ROSAs) combining quantum dot laser and silicon photonics technology from Ranovus, ADVA Optical Networking demonstrated how to build cost-effective 400Gbit/s transponder cards at OFC 2017.
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Este documento describe la operación funcional del equipo de radio digital SDH 5000S de NEC. Explica el comportamiento y las características del equipo, incluidos los esquemas de modulación, potencia de transmisión, figura de ruido, relación señal/ruido, ganancia del sistema, interfaz de guía de onda y más. También proporciona tablas con especificaciones técnicas detalladas para diferentes bandas de frecuencia y configuraciones del sistema.
FINFETs were developed to address issues with traditional MOSFETs as components continue to shrink, including short channel effects and higher leakage currents. FINFETs utilize a fin-like structure with a gate on three sides to improve control over the channel and suppress short channel effects. This allows for better scaling to smaller sizes while maintaining performance and lowering power consumption compared to planar MOSFETs and dual-gate devices.
Coherent or direct detect for the data center interconnect?ADVA
This presentation from OFC general co-chair Jörg-Peter Elbers examined the latest optical transmission technologies for the data center interconnect, comparing direct detection solutions to coherent transmission.
Wearable 1.78 inch Square AMOLED Display 368*448 For Smart Watch Bracelet Scr...Shawn Lee
1.78 inch AMOLED is a low power consumption AMOLED with 368x448 resolution and MIPI/SPI interface.
The IC mode is RM69090 which is widely used in wearable AMOLED displays such as 1.39" AMOLED.
It has an integrated CTP with TMA525C touch IC.
Application: Wearable, Medical equipment
Whatsapp: +86 18566294218
Email: shawn.lee@panoxdisplay.com
Skype: panoxshawn@outlook.com
OLED/LCD supplier: www.panoxdisplay.com
Radiation Hardening by Design is one of the hardware based solution to one of the most troublesome problem faced by digital circuits in the space.
RHBD provides varieties of techniques to make the circuit resilient towards such effects and ensures proper malfunctioning of the circuit.
Real-Time 200Gbit/s PAM4 Transmission Over 80km SSMF Using Quantum-Dot Laser ...ADVA
Using 200Gbit/s four-channel transmitter and receiver optical subassemblies (TOSAs/ROSAs) combining quantum dot laser and silicon photonics technology from Ranovus, ADVA Optical Networking demonstrated how to build cost-effective 400Gbit/s transponder cards at OFC 2017.
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Este documento describe la operación funcional del equipo de radio digital SDH 5000S de NEC. Explica el comportamiento y las características del equipo, incluidos los esquemas de modulación, potencia de transmisión, figura de ruido, relación señal/ruido, ganancia del sistema, interfaz de guía de onda y más. También proporciona tablas con especificaciones técnicas detalladas para diferentes bandas de frecuencia y configuraciones del sistema.
FINFETs were developed to address issues with traditional MOSFETs as components continue to shrink, including short channel effects and higher leakage currents. FINFETs utilize a fin-like structure with a gate on three sides to improve control over the channel and suppress short channel effects. This allows for better scaling to smaller sizes while maintaining performance and lowering power consumption compared to planar MOSFETs and dual-gate devices.
Coherent or direct detect for the data center interconnect?ADVA
This presentation from OFC general co-chair Jörg-Peter Elbers examined the latest optical transmission technologies for the data center interconnect, comparing direct detection solutions to coherent transmission.
Microelectronic technology
This report briefly discusses the need for Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs), their structure and principle of operation. Then it details the fabrication and characterization of the MOSFETs fabricated at the microelectronic lab at University of Malaya
shows the simulation and analysis of a MOSFET device using the MOSFet tool. Several powerful analytic features of this tool are demonstrated, including the following:
calculation of Id-Vg curves
potential contour plots along the device at equilibrium and at the final applied bias
electron density contour plots along the device at equilibrium and at the final applied bias
spatial doping profile along the device
1D spatial potential profile along the device
This document provides an agenda for a presentation on signal integrity that includes: defining signal integrity and why it is important; methods for signal integrity analysis including analytical, measurement, and simulation; modeling transmission lines and reflections; analyzing power planes and power integrity; and characteristics needed for successful signal and power integrity analysis and system design. Examples are provided throughout to illustrate key concepts.
The document discusses photolithography, which is an optical process used in semiconductor fabrication to transfer circuit patterns onto substrates. It involves applying a light-sensitive polymer photoresist to the substrate, exposing it to UV light through a photomask, and developing it to either remove exposed or unexposed areas of resist depending on whether it is a positive or negative photoresist. The key steps of photolithography including coating, soft baking, exposure, post-exposure baking, development, and hard baking are described. The characteristics and compositions of positive and negative photoresists are compared. Finally, different photolithography exposure techniques like contact, proximity, and projection printing are outlined.
HDMI (High-Definition Multimedia Interface) is a compact audio/video interface for transferring uncompressed video data and compressed or uncompressed digital audio data from a HDMI-compliant source device to a compatible computer monitor, video projector, digital television, or digital audio device.[1] HDMI is a digital replacement for existing analog video standards.
OTN networks provide transparent transport of client signals while protecting client management information and enabling low latency transport through enhanced fault detection and correction capabilities. Ciena enhances OTN with support for low-rate client interfaces, sub-wavelength grooming to improve efficiency, and intelligent control plane automation. The Optical Transport Network defined in ITU G.709 standards allows convergence of networks through transport of legacy and future client protocols with flexibility.
Design and Implementation of an Efficient Carry Skip AdderIRJET Journal
1) The document describes a design for an efficient 32-bit carry skip adder to achieve high speed and low area consumption.
2) It proposes using a Knowles adder in the middle stage and an optimized ripple carry adder instead of a Brent-Kung adder and normal RCA to improve speed and reduce area.
3) Simulation results show the proposed hybrid carry skip adder has a 38% reduced delay compared to a conventional carry skip adder and 16% reduced delay compared to a previous hybrid design. It is coded in Verilog and tested on a Xilinx FPGA.
This document discusses scaling network bandwidth beyond 100G and into the 400G and 800G era. It summarizes the emerging 400G and 800G form factors of CFP8, QSFP-DD, and OSFP. It also outlines the transition from 10/40G switching ports to 25/100G and then to 100/400G ports. The growth of bandwidth needs from 2X per year is driving this transition. Standards like 400G Ethernet are emerging to support these higher speeds. Migration to 25Gbps using SFP28 is presented as the initial step to maximize port density and efficiency within existing infrastructure.
Occasionally we need dc power source which is adjustable along with protections. This slide will help you to create a circuit that can adjust the dc voltage and apply thereby.
Multistage amplifiers connect multiple amplifiers together to increase overall gain. The overall gain is calculated by multiplying the individual gains. When amplifiers with equal cutoff frequencies are cascaded, the multistage circuit's cutoff frequency and bandwidth are determined by formulas involving the individual amplifier parameters. Common multistage configurations include cascade, cascode, and Darlington connections. Cascade connections simply couple outputs to inputs, providing high overall gain. Cascode connections improve input impedance while maintaining single-stage gain. Darlington connections have very high current gain equal to the product of individual transistor gains.
This document discusses Time Division Multiplexing (TDM) and Synchronous Digital Hierarchy (SDH) basics. It provides information on how TDM converts analog signals to digital signals and multiplexes them. It then explains how SDH was developed to overcome limitations of Plesiochronous Digital Hierarchy (PDH) by employing synchronous transmission and simpler add/drop functionality. The document outlines the frame structure and overhead bytes of STM-1, and defines the common network elements in SDH including Terminal Multiplexer, Add/Drop Multiplexer, Cross-connect, and Regenerator.
The document describes an IP-based public address system for a school with 150 classrooms. It includes an IP server software, IP remote paging microphone, 121 IP amplifiers to connect speakers in each classroom, and a CD/MP3 player. The system allows for online streaming of music and announcements to different zones. It has a capacity of 600 zones and 200 microphones, with amplifiers connected over the school's LAN network to provide audio to classrooms.
An analog to digital converter (ADC) allows digital circuits to interface with the real world by converting analog signals, like sound from a microphone, into digital data. ADCs work by sampling the analog signal at discrete time intervals and then quantizing the signal amplitude into discrete levels represented by a binary code. The sampling rate must be at least twice the highest frequency component of the analog signal per the Nyquist criterion. The resolution of an ADC, defined as the smallest voltage increment it can detect, is determined by the number of bits in its output. Common applications of ADCs include data acquisition, control systems, sensors, audio/video devices, and more.
This document provides an overview of operational amplifier (op amp) circuit topologies and their analysis. It discusses various op amp configurations including single-stage, two-stage, telescopic cascode, folded cascode, and gain-boosting topologies. It analyzes each configuration's characteristics such as gain, bandwidth, output swing, and noise performance. Example circuits are provided and design considerations like biasing, common-mode range, and dominant pole locations are examined.
This document discusses metallization in semiconductor device fabrication. Metallization involves depositing a thin metal layer to make interconnections between components on a chip and connections to the outside world. Common applications of metallization include gates, contacts, and interconnects. Aluminum is widely used for metallization due to its conductivity and ability to bond to silicon, though it has drawbacks like a low melting point. Metallization controls circuit speed and voltage by affecting resistance and interconnect lines.
The document provides specifications for Qualcomm's Snapdragon series of mobile processors, including the Snapdragon 800, 600, 400, and 200. It lists the key components and specifications for each model, such as the CPU, GPU, memory support, camera capabilities, and modem/wireless features. The Snapdragon 800 is the highest-end model supporting up to 2.3GHz CPUs and 4K video capture, while the Snapdragon 200 is the lowest-end model supporting up to 1.4GHz CPUs and 720p video.
Introduction to differential signal -For RF and EMC engineercriterion123
The document discusses design considerations for differential signaling on PCBs. It notes that differential signaling has advantages of producing less electromagnetic interference and being highly immune to interference. However, it also notes that differences in length or spacing between differential pair traces can reduce these advantages. Specifically, the key points are that the length of each trace in a differential pair should be equal, the spacing between traces should be constant, and bends should be gradual rather than sharp to avoid impedance discontinuities and mode conversion that degrade signal quality and increase noise.
Mixed Signal Verification of a Voltage Regulator using a State Space approach...Raj Mitra
The document discusses mixed signal verification of a digital voltage regulator using a state space approach and SV-DC extensions. It proposes a robust methodology for verifying mixed signal ICs with large digital content using a metric driven, digital centric flow. This is illustrated through a case study of verifying a digital buck converter. The methodology partitions the system into functional blocks representing the analog/digital boundary, digital blocks, analog blocks, and board level components. Verification is done in two contexts - a metric driven flow using functional models, and a full chip functional flow using real SPICE circuits.
This document summarizes several papers on implementing feedforward neural networks using field programmable gate arrays (FPGAs). It discusses how FPGAs offer parallelism and flexibility for neural network designs while reducing costs compared to application-specific integrated circuits. The document reviews mathematical models of artificial neurons and different types of neural network architectures. It also examines challenges in efficiently implementing activation functions like the sigmoid on FPGAs. Several papers presented hardware implementations of multilayer feedforward neural networks in VHDL for applications such as digital pre-distortion.
This document is a product specification for a 1.41-inch AMOLED display with a resolution of 320x360 pixels. It provides details on the display's mechanical, electrical, optical, and reliability specifications. Key specifications include a brightness between 300-385 nits, contrast ratio above 10,000:1, viewing angles of 80 degrees, response time under 4ms, and an expected lifetime of 100,000 hours at 25°C. The document also outlines recommended driver ICs, operating sequences, pin connections, and packaging.
Microelectronic technology
This report briefly discusses the need for Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs), their structure and principle of operation. Then it details the fabrication and characterization of the MOSFETs fabricated at the microelectronic lab at University of Malaya
shows the simulation and analysis of a MOSFET device using the MOSFet tool. Several powerful analytic features of this tool are demonstrated, including the following:
calculation of Id-Vg curves
potential contour plots along the device at equilibrium and at the final applied bias
electron density contour plots along the device at equilibrium and at the final applied bias
spatial doping profile along the device
1D spatial potential profile along the device
This document provides an agenda for a presentation on signal integrity that includes: defining signal integrity and why it is important; methods for signal integrity analysis including analytical, measurement, and simulation; modeling transmission lines and reflections; analyzing power planes and power integrity; and characteristics needed for successful signal and power integrity analysis and system design. Examples are provided throughout to illustrate key concepts.
The document discusses photolithography, which is an optical process used in semiconductor fabrication to transfer circuit patterns onto substrates. It involves applying a light-sensitive polymer photoresist to the substrate, exposing it to UV light through a photomask, and developing it to either remove exposed or unexposed areas of resist depending on whether it is a positive or negative photoresist. The key steps of photolithography including coating, soft baking, exposure, post-exposure baking, development, and hard baking are described. The characteristics and compositions of positive and negative photoresists are compared. Finally, different photolithography exposure techniques like contact, proximity, and projection printing are outlined.
HDMI (High-Definition Multimedia Interface) is a compact audio/video interface for transferring uncompressed video data and compressed or uncompressed digital audio data from a HDMI-compliant source device to a compatible computer monitor, video projector, digital television, or digital audio device.[1] HDMI is a digital replacement for existing analog video standards.
OTN networks provide transparent transport of client signals while protecting client management information and enabling low latency transport through enhanced fault detection and correction capabilities. Ciena enhances OTN with support for low-rate client interfaces, sub-wavelength grooming to improve efficiency, and intelligent control plane automation. The Optical Transport Network defined in ITU G.709 standards allows convergence of networks through transport of legacy and future client protocols with flexibility.
Design and Implementation of an Efficient Carry Skip AdderIRJET Journal
1) The document describes a design for an efficient 32-bit carry skip adder to achieve high speed and low area consumption.
2) It proposes using a Knowles adder in the middle stage and an optimized ripple carry adder instead of a Brent-Kung adder and normal RCA to improve speed and reduce area.
3) Simulation results show the proposed hybrid carry skip adder has a 38% reduced delay compared to a conventional carry skip adder and 16% reduced delay compared to a previous hybrid design. It is coded in Verilog and tested on a Xilinx FPGA.
This document discusses scaling network bandwidth beyond 100G and into the 400G and 800G era. It summarizes the emerging 400G and 800G form factors of CFP8, QSFP-DD, and OSFP. It also outlines the transition from 10/40G switching ports to 25/100G and then to 100/400G ports. The growth of bandwidth needs from 2X per year is driving this transition. Standards like 400G Ethernet are emerging to support these higher speeds. Migration to 25Gbps using SFP28 is presented as the initial step to maximize port density and efficiency within existing infrastructure.
Occasionally we need dc power source which is adjustable along with protections. This slide will help you to create a circuit that can adjust the dc voltage and apply thereby.
Multistage amplifiers connect multiple amplifiers together to increase overall gain. The overall gain is calculated by multiplying the individual gains. When amplifiers with equal cutoff frequencies are cascaded, the multistage circuit's cutoff frequency and bandwidth are determined by formulas involving the individual amplifier parameters. Common multistage configurations include cascade, cascode, and Darlington connections. Cascade connections simply couple outputs to inputs, providing high overall gain. Cascode connections improve input impedance while maintaining single-stage gain. Darlington connections have very high current gain equal to the product of individual transistor gains.
This document discusses Time Division Multiplexing (TDM) and Synchronous Digital Hierarchy (SDH) basics. It provides information on how TDM converts analog signals to digital signals and multiplexes them. It then explains how SDH was developed to overcome limitations of Plesiochronous Digital Hierarchy (PDH) by employing synchronous transmission and simpler add/drop functionality. The document outlines the frame structure and overhead bytes of STM-1, and defines the common network elements in SDH including Terminal Multiplexer, Add/Drop Multiplexer, Cross-connect, and Regenerator.
The document describes an IP-based public address system for a school with 150 classrooms. It includes an IP server software, IP remote paging microphone, 121 IP amplifiers to connect speakers in each classroom, and a CD/MP3 player. The system allows for online streaming of music and announcements to different zones. It has a capacity of 600 zones and 200 microphones, with amplifiers connected over the school's LAN network to provide audio to classrooms.
An analog to digital converter (ADC) allows digital circuits to interface with the real world by converting analog signals, like sound from a microphone, into digital data. ADCs work by sampling the analog signal at discrete time intervals and then quantizing the signal amplitude into discrete levels represented by a binary code. The sampling rate must be at least twice the highest frequency component of the analog signal per the Nyquist criterion. The resolution of an ADC, defined as the smallest voltage increment it can detect, is determined by the number of bits in its output. Common applications of ADCs include data acquisition, control systems, sensors, audio/video devices, and more.
This document provides an overview of operational amplifier (op amp) circuit topologies and their analysis. It discusses various op amp configurations including single-stage, two-stage, telescopic cascode, folded cascode, and gain-boosting topologies. It analyzes each configuration's characteristics such as gain, bandwidth, output swing, and noise performance. Example circuits are provided and design considerations like biasing, common-mode range, and dominant pole locations are examined.
This document discusses metallization in semiconductor device fabrication. Metallization involves depositing a thin metal layer to make interconnections between components on a chip and connections to the outside world. Common applications of metallization include gates, contacts, and interconnects. Aluminum is widely used for metallization due to its conductivity and ability to bond to silicon, though it has drawbacks like a low melting point. Metallization controls circuit speed and voltage by affecting resistance and interconnect lines.
The document provides specifications for Qualcomm's Snapdragon series of mobile processors, including the Snapdragon 800, 600, 400, and 200. It lists the key components and specifications for each model, such as the CPU, GPU, memory support, camera capabilities, and modem/wireless features. The Snapdragon 800 is the highest-end model supporting up to 2.3GHz CPUs and 4K video capture, while the Snapdragon 200 is the lowest-end model supporting up to 1.4GHz CPUs and 720p video.
Introduction to differential signal -For RF and EMC engineercriterion123
The document discusses design considerations for differential signaling on PCBs. It notes that differential signaling has advantages of producing less electromagnetic interference and being highly immune to interference. However, it also notes that differences in length or spacing between differential pair traces can reduce these advantages. Specifically, the key points are that the length of each trace in a differential pair should be equal, the spacing between traces should be constant, and bends should be gradual rather than sharp to avoid impedance discontinuities and mode conversion that degrade signal quality and increase noise.
Mixed Signal Verification of a Voltage Regulator using a State Space approach...Raj Mitra
The document discusses mixed signal verification of a digital voltage regulator using a state space approach and SV-DC extensions. It proposes a robust methodology for verifying mixed signal ICs with large digital content using a metric driven, digital centric flow. This is illustrated through a case study of verifying a digital buck converter. The methodology partitions the system into functional blocks representing the analog/digital boundary, digital blocks, analog blocks, and board level components. Verification is done in two contexts - a metric driven flow using functional models, and a full chip functional flow using real SPICE circuits.
This document summarizes several papers on implementing feedforward neural networks using field programmable gate arrays (FPGAs). It discusses how FPGAs offer parallelism and flexibility for neural network designs while reducing costs compared to application-specific integrated circuits. The document reviews mathematical models of artificial neurons and different types of neural network architectures. It also examines challenges in efficiently implementing activation functions like the sigmoid on FPGAs. Several papers presented hardware implementations of multilayer feedforward neural networks in VHDL for applications such as digital pre-distortion.
This document is a product specification for a 1.41-inch AMOLED display with a resolution of 320x360 pixels. It provides details on the display's mechanical, electrical, optical, and reliability specifications. Key specifications include a brightness between 300-385 nits, contrast ratio above 10,000:1, viewing angles of 80 degrees, response time under 4ms, and an expected lifetime of 100,000 hours at 25°C. The document also outlines recommended driver ICs, operating sequences, pin connections, and packaging.
1.5 Inch Flexible OLED Display 120x240 MIPI AMOLED Screen For Wearable Smart ...Shawn Lee
CE Wearable 1.5 inch flexible AMOLED is a color active matrix of Organic Light-Emitting Diode (OLED), which uses Low-Temperature Poly-silicon (LTPS) as switching devices. This panel has a 1.5 inches diagonally measured active display area with 120 x 240 resolutions. This product is composed of an LTPS-AMOLED panel, Polarizer, driver IC(COF), and FPCa.
Whatsapp: 86 18566294218
Skype: panoxshawn@outlook.com
Email: shawn.lee@panoxdisplay.com
OLED/LCD supplier: www.panoxdisplay.com
Display Type AM-OLED
Display Brand BOE
Interface SPI,MIPI
Screen Size 1.39 inch
Orientation Landscape
Display Color Full Color
Manufacturer BOE
Resolution 454x454
Driver IC RM69330
Consumption 50uW~260mW
Active Area (mm) ¢35.412
Luminance 800 cd/m2 (Max)
Viewing Angle 80/80/80/80 (Typ.)(CR≥10)
Color Depth 16.7M
Refresh Rate 45 Hz
For More Display Photo
https://www.panoxdisplay.com/amoled/1-39-inch-round-oled-454x454-spi.html
1.39 inch Round Amoled(400x400) DatasheetPanox Display
Model: H139BLN01.0/ H139BLN01.1/ E1392AM1
AUO/EDO 1.39 inch Amoled Display
Design for wearable device
Display Type:Amoled
Interface:MIPI
Active Area(mm):35.4 × 35.4 (H×V) ) mm
Luminance:350 cd/m² (Typ.)
Color Depth:16.7M 101% (CIE1931)
Learn more about 1.39 inch Amoled:
https://www.panoxdisplay.com/html/products/amoled-32-1.html
Model Name H381DLN01
Display Type AMOLED
Display Brand AUO
Interface MIPI
Screen Size 3.81
Orientation Portrait
Display Color Full Color
Manufacturer AUO
Resolution 1080(RGB)×1200
Driver IC COG Built-in RM69071
Active Area (mm) 64.8(H)×72(V) mm
Luminance 100 cd/m² (Typ.)
Viewing Angle 80/80/80/80 (Min.)(CR≥480
Color Depth 16.7M 100% (CIE1931)
Refresh Rate 90Hz
Signal Type MIPI (4 data lanes), 39 pins, FPC
OLED detail
https://www.panoxdisplay.com/amoled/3-81-amoled-1080x1200-vr.html
Wearable 1.78 inch Square AMOLED Display 368*448 For Smart Watch Bracelet Scr...Shawn Lee
1.78 inch AMOLED is a low power consumption AMOLED with 368x448 resolution and MIPI/SPI interface.
The IC mode is RM69090 which is widely used in wearable AMOLED displays such as 1.39" AMOLED.
It has an integrated CTP with TMA525C touch IC.
Application: Wearable, Medical equipment
Whatsapp: +86 18566294218
Email: shawn.lee@panoxdisplay.com
OLED/LCD supplier: www.panoxdisplay.com
8 inch TFT-LCD Datesheet, AUO, 800*1280, MIPI InterfacePanox Display
Display Brand AUO
Interface MIPI
Screen Size 8 inch
Orientation Portrait
Display Color Full Color
Manufacturer Panox Display
Resolution 800x1280
Driver IC ER88577
HDMI Controller Board Available
For more
https://www.panoxdisplay.com/tft-lcd/8-inch-tft-lcd-800x1280-mipi.html
Display Type:AMOLED
Interface:SPI,MIPI
Active Area(mm):30.42(H)×30.42(V) mm
Luminance:350 cd/m² (Typ.)
Color Depth:16.7M 101% (CIE1931)
Learn More For 1.2 Amoled: https://www.panoxdisplay.com/html/products/amoled-31-1.html
This document provides the product specification for an LC320W01 32-inch LCD display. It includes details on the display's electrical characteristics such as power consumption, voltage requirements, and connector pinouts. It also lists optical specifications, mechanical dimensions, reliability metrics, and safety standards. The display uses a WXGA resolution of 1366x768 pixels with 8-bit color depth and a wide viewing angle, intended for use in LCD TV and PCTV applications.
CMEL 2.8 inch Amoled(240x320) DatasheetPanox Display
Model: C0283QGLA/ C0283QGLC/ C0283QGLD
CMEL 2.8" Amoled is a classical screen which can work well under a low temperature and with a low consumption, but it has been EOL for a long time. Panox Display can produce it with CMEL original cell and IC S6E63D6.
So if you have broken CMEL 2.8"screens which IC can work well, please contact us, we can produce brand new CMEL 2.8" for you.
Range of application: Industrial control, Medical equipment, Electrommunication, Numerical control, Monitor, instrument, Military products.
For more specification of 2.8" Amoled,
https://www.panoxdisplay.com/html/products/amoled-39-1.html
The document describes the Toothpick, which is a PIC microcontroller and Bluetooth module combination that is preloaded with firmware. It provides wireless connectivity and a user interface via Bluetooth. Key features include analog and digital I/O, PWM outputs, wireless programming, and pretested firmware solutions for applications like data logging and sensor monitoring.
1.78 inch 368x488 OLED Display Touch PanelPanox Display
This document is a product specification for a 1.78-inch AMOLED display with model number ED178AM368MS. Key details include:
- Display resolution of 368xRGBx448 dots with a pixel pitch of 78x78 μm
- Brightness of 315-385 cd/m2, contrast ratio over 10,000:1, and response time under 4ms
- Electrical specifications for normal, idle, and deep standby power consumption
- Recommended operating sequences and conditions for the touch IC and display driver
- Reliability testing parameters and mechanical dimensions
This document provides specifications for an LCD1602 RGB Backlight Module. It includes:
- 16x2 character display with STN LCD and RGB backlight
- Interface via I2C protocol with AiP31068L LCD controller and PCA9633DP2 RGB controller
- Operating temperature range of -20 to +70°C with viewing angle of 6 o'clock direction
- Electrical characteristics including voltage levels, current draws, and timing parameters
- Memory map and display commands for controlling the module
Model Name H497TLB01
Display Type AMOLED
Display Brand AUO
Interface MIPI
Screen Size 5.0
Orientation Portrait
Display Color Full Color
Manufacturer AUO
Resolution 720(RGB)×1280
Driver IC RM69052
Active Area (mm) 61.92(H)×110.08(V) mm
Luminance 250 cd/m² (Typ.)
Viewing Angle 80/80/80/80 (Min.)(CR≥200)
Color Depth 16.7M 100% (CIE1931)
Refresh Rate 60Hz
Signal Type MIPI DSI,39 pin
Voltage Supply
Operating Temp -30 ~ 60 °C
Storage Temp -40 ~ 70 °C
Aspect Ratio 9:16 (H: V)
Screen Type AM-OLED, OLED
Arrangement RGB Vertical Stripe
https://www.panoxdisplay.com/amoled/5-0-amoled-720x1280-full-color.html
3.5 inch OLED 1400x1600 MIPI VR DisplayPanox Display
Model Name AMS350MU04
Display Type AMOLED
Display Brand Samsung
Interface MIPI
Screen Size 3.5
Orientation Landscape
Display Color Full Color
Manufacturer Samsung
Resolution 1440(RG/BG)×1600
Driver IC Built-in COG S6E3HA3
Active Area (mm) 59.4 × 66 (H×V)
Luminance 165 cd/m² (Typ.)
Color Depth 16.7M 95% (CIE1931)
Refresh Rate 90Hz
Signal Type MIPI (2 ch, 4 data lanes) , FPC , 61 pins
OLED Porduct
https://www.panoxdisplay.com/amoled/3-5-amoled-1440x1600-vr-ams350mu04.html
Model Name AMS347FF01
Display Type AMOLED
Display Brand Samsung
Interface MIPI
Screen Size 3.47
Orientation Portrait
Display Color Full Color
Manufacturer Samsung
Resolution 360x640
Active Area (mm) 43.05(H)×76.80(V) mm
Luminance 300 cd/m² (Typ.)
Viewing Angle 80/80/80/80 (Min.)(CR≥10)
Color Depth 16.7M
Refresh Rate 60Hz
Signal Type MIPI DSI 1 lane
OLED Product
https://www.panoxdisplay.com/amoled/3-5-inch-oled-handheld-detection.html
Model Name EDO295FM01
Display Type AMOLED
Display Brand EDO
Interface MIPI
Screen Size 2.95
Orientation Landscape
Display Color Full Color
Manufacturer EDO
Resolution 1080(RGB)×1200
Driver IC COG Built-in RM67295
Active Area (mm) 50.11(H)×55.68(V) mm
Luminance 300 cd/m² (Typ.)
Viewing Angle 80/80/80/80 (Typ.)(CR≥200)
Color Depth 16.7M 105% (CIE1931)
Mass 10±1g
Refresh Rate 60Hz
Signal Type 39 pins MIPI (4 data lanes), FPC
https://www.panoxdisplay.com/amoled/2-95-amoled-1080x1200-vr.html
Model Name BO269FM800
Display Type OLED, AM-OLED
Display Brand BOE
Interface MIPI
Screen Size 2.69
Orientation Landscape
Display Color Full Color
Manufacturer BOE
Resolution 800x600
Active Area (mm) 54.6 × 40.95 (H×V)
Luminance 460 cd/m² (Typ.)
Viewing Angle 80/80/80/80 (Min.)(CR≥1600)
Color Depth 16.7M
Signal Type MIPI (2 data lanes)
2.6 inch 240x320 AM OLED Display RGB MCU InterfacePanox Display
Model Name AMS260DN01
Display Type AMOLED
Display Brand Samsung
Interface SPI,RGB
Screen Size 2.6
Orientation Landscape
Display Color Full Color
Manufacturer Samsung
Resolution 240(RGB)×320, QVGA
Driver IC COG Built-in S6E63D3
Consumption 350/400mW (Typ./Max.)
Active Area (mm) 40.32(W)×54.08(H) mm
Bezel Area (mm) 43.0(W)×56.76(H) mm
Luminance 200 cd/m² (Typ.)
Viewing Angle -
Color Depth 262K 73% (CIE1931)
Mass 16.0g (Typ.)
Signal Type 8/9/16/18-bit 6800/8080 parallel, 6/16/18-bit RGB, SPI, 61 pins, FPC
OLED
https://www.panoxdisplay.com/amoled/2-6-amoled-full-color-320x240.html
EDO 1.47 inch AM-OLED 194X368 SPI InterfacePanox Display
Model Name E1473AC63
Display Type OLED
Display Brand EDO
Interface SPI
Screen Size 1.47 inch
Orientation Portrait
Display Color Full Color
Manufacturer EDO
Resolution 194x368
Driver IC SH8501B(COF)
Active Area (mm) 17.46 (W)×33.12 (H) mm
Luminance 500 cd/m² (Max)
Viewing Angle 85/85/85/85 (Typ.)(CR≥200)
Color Depth 16.7M (RGB x 24 bits)
Refresh Rate 55 Hz
Signal Type Q-SPI
Voltage Supply 1.8/3.3/3.3/-3.3 V (Typ.)(VDDIO/VCI/ELVDD/ELVSS)
OLED Product
https://www.panoxdisplay.com/amoled/147oled197rgb368spi.html
EDO 1.41 inch On-Cell PCAP Touch Panel 320X360Panox Display
Display Type OLED
Display Brand EDO/AUO
Interface MIPI
Screen Size 1.41
Orientation Portrait
Display Color Full Color
Manufacturer EDO
Resolution 320(RGB)×360
Driver IC RM67162
Active Area (mm) 23.84(H)×26.82(V) mm
Luminance 350 cd/m² (Typ.)
Viewing Angle 88/88/88/88 (Typ.)(CR≥10)
Color Depth 16.7M 105% (CIE1931)
Mass 3.95g (Typ.)
Refresh Rate 60Hz
Signal Type 30 pins MIPI (1 data lane) , Connector
OLED page
https://www.panoxdisplay.com/amoled/1-41-amoled-full-color-320x360.html
Model: H139BLN01.0 (AUO 24 pins Left side interface)
E1392AM1 (EDO 20 pins Right Side Interface)
Display Brand AUO/EDO
Interface MIPI
Screen Size 1.39
Orientation Landscape
Display Color Full Color
Manufacturer AUO/EDO
Resolution 400(RGB)×400
Driver IC RM69080/RM67160
Active Area (mm) 35.4 × 35.4 (H×V)
Luminance 350 or 300 cd/m² (Typ.)
Viewing Angle 80/80/80/80 (Min.)(CR≥1600)
Color Depth 16.7M 100% (CIE1931)
Mass 2.15±0.33g
Refresh Rate 30 Hz
Signal Type MIPI (1 data lane) , Connector , 24 pins/20 pins
OLED Product Page
https://www.panoxdisplay.com/amoled/1-39-round-amoled-full-color-400x400.html
1.39 inch OLED 454X454 OLED MIPI InterfacePanox Display
Model Name BOE139F454SM
Display Type AMOLED
Display Brand BOE
Interface MIPI
Screen Size 1.39
Orientation Landscape
Display Color Full Color
Manufacturer BOE
Resolution 454(RGB)×454
Driver IC RM67162FI
Active Area (mm) 35.412(H)×35.412(V) mm
Bezel Area (mm) 38.212(H)×38.212(V)x0.5(T) mm
Luminance 350 cd/m² (Typ.)
Viewing Angle 80/80/80/80 (Min.)(CR≥1600)
Color Depth 16.7M 100% (CIE1931)
Mass 2.65 g
Signal Type MIPI (1 data lane) , 20 pins , Connector
Voltage Supply 1.8/2.8/4.6/-2.4V (Typ.)(VDDIO/VCI/ELVDD/ELVSS)
Operating Temp -30 ~ 70 °C
Storage Temp -40 ~ 80 °C
AMOLED product
https://www.panoxdisplay.com/amoled/1-39-round-amoled-454x454.html
OLED Display 0.95 inch 120x240 SPI For SmartBandPanox Display
Model Name TR095A120SPC
Display Type AMOLED
Interface SPI
Resolution 120(RGB)×240
Luminance 400 ~500 cd/m²
Active Area (mm) 10.8 X 21.6 mm
Contrast Ratio 80000:1 (Typ.) (TM)
Product Photo
https://www.panoxdisplay.com/amoled/0-95-amoled-120x240-spi-truly-edition.html
Advanced control scheme of doubly fed induction generator for wind turbine us...IJECEIAES
This paper describes a speed control device for generating electrical energy on an electricity network based on the doubly fed induction generator (DFIG) used for wind power conversion systems. At first, a double-fed induction generator model was constructed. A control law is formulated to govern the flow of energy between the stator of a DFIG and the energy network using three types of controllers: proportional integral (PI), sliding mode controller (SMC) and second order sliding mode controller (SOSMC). Their different results in terms of power reference tracking, reaction to unexpected speed fluctuations, sensitivity to perturbations, and resilience against machine parameter alterations are compared. MATLAB/Simulink was used to conduct the simulations for the preceding study. Multiple simulations have shown very satisfying results, and the investigations demonstrate the efficacy and power-enhancing capabilities of the suggested control system.
Embedded machine learning-based road conditions and driving behavior monitoringIJECEIAES
Car accident rates have increased in recent years, resulting in losses in human lives, properties, and other financial costs. An embedded machine learning-based system is developed to address this critical issue. The system can monitor road conditions, detect driving patterns, and identify aggressive driving behaviors. The system is based on neural networks trained on a comprehensive dataset of driving events, driving styles, and road conditions. The system effectively detects potential risks and helps mitigate the frequency and impact of accidents. The primary goal is to ensure the safety of drivers and vehicles. Collecting data involved gathering information on three key road events: normal street and normal drive, speed bumps, circular yellow speed bumps, and three aggressive driving actions: sudden start, sudden stop, and sudden entry. The gathered data is processed and analyzed using a machine learning system designed for limited power and memory devices. The developed system resulted in 91.9% accuracy, 93.6% precision, and 92% recall. The achieved inference time on an Arduino Nano 33 BLE Sense with a 32-bit CPU running at 64 MHz is 34 ms and requires 2.6 kB peak RAM and 139.9 kB program flash memory, making it suitable for resource-constrained embedded systems.
artificial intelligence and data science contents.pptxGauravCar
What is artificial intelligence? Artificial intelligence is the ability of a computer or computer-controlled robot to perform tasks that are commonly associated with the intellectual processes characteristic of humans, such as the ability to reason.
› ...
Artificial intelligence (AI) | Definitio
Design and optimization of ion propulsion dronebjmsejournal
Electric propulsion technology is widely used in many kinds of vehicles in recent years, and aircrafts are no exception. Technically, UAVs are electrically propelled but tend to produce a significant amount of noise and vibrations. Ion propulsion technology for drones is a potential solution to this problem. Ion propulsion technology is proven to be feasible in the earth’s atmosphere. The study presented in this article shows the design of EHD thrusters and power supply for ion propulsion drones along with performance optimization of high-voltage power supply for endurance in earth’s atmosphere.
Optimizing Gradle Builds - Gradle DPE Tour Berlin 2024Sinan KOZAK
Sinan from the Delivery Hero mobile infrastructure engineering team shares a deep dive into performance acceleration with Gradle build cache optimizations. Sinan shares their journey into solving complex build-cache problems that affect Gradle builds. By understanding the challenges and solutions found in our journey, we aim to demonstrate the possibilities for faster builds. The case study reveals how overlapping outputs and cache misconfigurations led to significant increases in build times, especially as the project scaled up with numerous modules using Paparazzi tests. The journey from diagnosing to defeating cache issues offers invaluable lessons on maintaining cache integrity without sacrificing functionality.
Redefining brain tumor segmentation: a cutting-edge convolutional neural netw...IJECEIAES
Medical image analysis has witnessed significant advancements with deep learning techniques. In the domain of brain tumor segmentation, the ability to
precisely delineate tumor boundaries from magnetic resonance imaging (MRI)
scans holds profound implications for diagnosis. This study presents an ensemble convolutional neural network (CNN) with transfer learning, integrating
the state-of-the-art Deeplabv3+ architecture with the ResNet18 backbone. The
model is rigorously trained and evaluated, exhibiting remarkable performance
metrics, including an impressive global accuracy of 99.286%, a high-class accuracy of 82.191%, a mean intersection over union (IoU) of 79.900%, a weighted
IoU of 98.620%, and a Boundary F1 (BF) score of 83.303%. Notably, a detailed comparative analysis with existing methods showcases the superiority of
our proposed model. These findings underscore the model’s competence in precise brain tumor localization, underscoring its potential to revolutionize medical
image analysis and enhance healthcare outcomes. This research paves the way
for future exploration and optimization of advanced CNN models in medical
imaging, emphasizing addressing false positives and resource efficiency.
Redefining brain tumor segmentation: a cutting-edge convolutional neural netw...
OLED Display 1.2 inch 60 Hz 390x390 QSPI
1. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:1/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
Product Specification
Model Name: E120A390QSR
Description: 1.19” (390X390) AMOLED Oncell
Doc. Version: 01
Customer: Common Customers
■Approved for Preliminary Specification
□Approved for Final Specification
□Approved for Final Specification & Sample
Prepared Checked Approved
Customer’s Approval
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
2. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:2/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
Version History
Version. No Date Contents Remark
01 2020-07-20 Preliminary Specification
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
3. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:3/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
Contents
Version History.............................................................................................................................................. 2
Contents........................................................................................................................................................ 3
1 Scope.......................................................................................................................................................... 4
2 Features...................................................................................................................................................... 4
2.1 Product Applications.............................................................................................................................. 4
2.2 Product Features.................................................................................................................................... 4
3 Maximum Rating........................................................................................................................................ 4
4 Mechanical Specifications.......................................................................................................................... 4
5 Electrical Specifications.............................................................................................................................. 5
5.1 Electrical Characteristics........................................................................................................................ 5
5.2 I/O Connection and Block Diagrams...................................................................................................... 6
5.3 Initial CODE............................................................................................................................................ 8
5.4 Graphic memory writing direction....................................................................................................... 9
5.5 Recommended Operating Sequence ................................................................................................... 9
5.6 AC Characteristics(MIPI)..................................................................................................................10
6 Electro-Optical Specification.................................................................................................................... 13
7 Reliability.................................................................................................................................................. 17
7.1 Environmental Test .............................................................................................................................. 17
7.2 Electrical Test ....................................................................................................................................... 17
7.3 Mechanical Test ................................................................................................................................... 17
8 Handling Precautions............................................................................................................................... 18
9 Outline Dimension Drawing..................................................................................................................... 19
10 The Control of Hazardous substances ...................................................................................................... 20
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
4. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:4/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
1 Scope
This Specification defines AMOLED manufactured by EverDisplay Optronics(Shanghai)
Limited, from here on refer as EDO. In the case of any unspecified item, it may require both
EDO and the party designs this module into its product to work out a solution.
2 Features
2.1 Product Applications
Smart Watch(On-cell)
2.2 Product Features
1) Display color:16.7M (RGB x 8bits)
2) Display format:1.19”(390RGBx390)
3) Pixel arrangement:Real RGB arrangement
4) Interface:MIPI/SPI/QSPI
5) Driver IC: RM69091
3 Maximum Rating
Parameter Symbol
Spec
Unit Note
Min. Typ. Max.
Analog/boost power voltage VCI -0.3 - 5.5 V -
I/O voltage VDDIO -0.3 - 5.5 V -
Operating temperature Top -20 - 60 ℃ -
Storage temperature Tstg -30 - 70 ℃ -
4 Mechanical Specifications
Item Specification unit
Dimension outline 33.99(V) x 33.62(W) x 0.7(T) mm
LTPS Glass outline 33.99(V) x 33.62(W) mm
Encapsulation Glass outline 32.63(V) x 33.62(W) mm
Number of dots 390(W) x RGB x 390(H) dots
Active area φ30.42 mm
Diagonal size 1.19 inch
Pixel pitch 78 x 78 μm
Glass thickness 0.3 / 0.2 mm
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
5. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:5/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
(LTPS/encapsulation glass)
Weight TBD g
5 Electrical Specifications
5.1 Electrical Characteristics
5.1.1 Power Characteristic:
Item Symbol Min. Typ. Max. Unit Remark
AMOLED Power positive ELVDD 4.55 4.6 4.65 V -
AMOLED power Negative ELVSS -2.45 -2.4 -2.35 V Ref
Digital Power supply VDDIO 1.65 1.8 1.95 V Ref
Analog Power supply VCI 2.7 2.8 2.9 V Ref
1) Normal Mode
Power Supply: IOVCC=1.8V VCI=2.8V
Frame Frequency: Fframe =60HZ @ 25degC, Brightness 350 nits, Command Mode,
Display Condition Symbol Min. Typ. Max. Unit Remark
100% Pixel On
350nits
IELVDD
/ELVSS
- 17.5 21.5 mA Ref
IVCI - 6.0 7.2 mA Ref
IVDDIO - 2.4 2.8 mA Ref
2) Idle Mode
Power Supply: IOVCC=1.8V VCI=2.8V
Frame Frequency: Fframe =15HZ @ 25degC, Brightness:30nits, OPR:10%,Command Mode
Display Condition Symbol Min. Typ. Max. Unit Remark
10% Pixel On
30 nits
IELVDD
/ELVSS
- - - mA
Supplied by
Driver IC
IVCI - 3 3.6 mA Ref
IVDDIO - 1.2 1.5 mA Ref
3) Deep Standby Mode
Display Condition Symbol Min. Typ. Max. Unit Remark
Deep Standby
IVCI - - 15 uA -
IVDDIO - - 4 uA -
Power
Consumpti
on
- - <50 uW Ref
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
6. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:6/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
5.1.2 Power supply circuit application (This is for reference only):
AAT1551/RT4730
5.2 I/O Connection and Block Diagrams
5.2.1 Main FPC Bonding PAD Define
Pin
No.
Symbol I/O Function Description
1 SDA_TP
2 SCL_TP
Power
3 INT_TP
4 SWIRE
5 RESET
6 IMO
7 IM1
8 DB0
9 DB1
10 SDI
11 DCX
12 CSX
13 SCL
14 VCC Driver IC analog supply
15 GND
O
GND
16 GND
GND
17 TE
Tear effect output
18 IOVCC
Driver IC digital I/O supply
19 GND GND
20 DSI_CLKN I/0 MIPI DSI clock-
21 DSI_CLKP I/0 MIPI DSI clock+
22 GND
GND
Power
Power
Power
Power
TP IIC signal
TP IIC signal
TP IIC signal
OLED ELVDD,ELVSS enable signal
OLED RESET signal
interface switch signal
interface switch signal
QSPI signal
QSPI signal
QSPI signal
QSPI signal
QSPI signal
QSPI signal
I
I/0
I/0
I/0
I/0
I/0
I/0
I/0
I/0
I/0
I/0
I/0
I/0
I/0
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
7. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:7/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
23 DSI_D0N I/O
MIPI DSI data0-
24 DSI_DOP I/O MIPI DSI data0+
25 GND I GND
26 MTP I Power supply for OTP. Leave the pin open when not in use.
27 SWDIO O TP OTP PIN
28 VDD 3.3V_TP Power TP analog Power Supply
29 RST_TP I Reset pin for TP IC
30 GND_TP Power GND
31 ELVSS Power Power supply for OLED
32 ELVSS Power supply for OLED
33 ELVDD
34 ELVDD Power Power supply for OLED
Power supply for OLED
Power
Power
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
8. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:8/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
1.1 Initial CODE
TBD
5.4.3 System Block Diagram
AMOLED
PANEL
FPC
COF
Driver IC
LTPS
GOA
LTPS
GOA
Data Driver OP output
Timing Controller
DC/DC
Passive Components
for Driver IC
Connector
Host Interface
1 63
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
9. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:9/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
1.2 Graphic memory writing direction
1.3 Recommended Operating Sequence
5.5.1 Power on sequence
5.5.2 Power off sequence
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
10. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:10/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
1.4 AC Characteristics(MIPI)
5.6.1 HS Data Transmission Burst
5.6.2 HS Clock Transmission
5.6.3 Turnaround Procedure
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
11. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:11/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
5.6.4 Timing Parameters
Symbol Description Min Typ Max Unit
TREOT
30%-85% rise time and
fall time
- - 35 ns
TCLK-MISS
Timeout for receiver to
detect absence of Clock
transitions and disable
the Clock Lane HS-RX.
- - 60 ns
TCLK-POST*1
Time that the
transmitter continues to
send HS clock after the
last associated Data
Lane has transitioned to
LP Mode. Interval is
defined as the period
from the end of
THS-TRAIL to the
beginning of TCLK-TRAIL.
60ns + 52*UI
(For DCS)
- - ns
TCLK-PRE
Time that the HS clock
shall be driven by the
transmitter prior to any
associated Data Lane
beginning the transition
from LP to HS mode.
8 - - ns
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
12. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:12/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
TCLK-SETTLE
Time interval during
which the HS receiver
shall ignore any Clock
Lane HS transitions,
starting from the
beginning of TCLK-PRE.
95 - 300 ns
TCLK-TERM-EN
Time for the Clock Lane
receiver to enable the
HS line
termination,starting
from the time point
when Dn crosses
VIL,MAX.
Time for Dn to
reach VTERM-EN
38 ns
THS-SETTLE
Time interval during
which the HS receiver
shall ignore any Data
Lane HS transitions,
starting from the
beginning of
THSPREPARE.
85 ns + 6*UI
145 ns +
10*UI
ns
TEOT
Time from start of
THS-TRAIL or TCLK-TRAIL
period to start of LP-11
state
- - 105ns+48*UI ns
THS-EXIT(1)
time to drive LP-11 after
HS burst
100 - - ns
THS-PREPARE
Time to drive LP-00 to
prepare for HS
transmission
40ns + 4*UI - 85ns+6*UI ns
THS-PREPARE +
THS-ZERO
THS-PREPARE + Time to
drive HS-0 before the
Sync sequence
145ns + 10*UI - - ns
THS-SKIP
Time-out at RX to ignore
transition period of EoT
40 - 55ns+4*UI ns
THS-TRAIL
Time to drive flipped
differential state after
last payload data bit of a
HS transmission burst
60 + 4*UI - - ns
TLPX
Length of any
Low-Power state period
50 - - ns
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
13. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:13/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
Ratio TLPX
Ratio of
TLPX(MASTER)/TLPS(SLA
VE) between Master and
Slave side
2/3 - 3/2 ns
TTA-GET
Time to drive LP-00 by
new TX
5*TLPX 5*TLPX 5*TLPX ns
TTA-GO
Time to drive LP-00 after
Turnaround Request
4*TLPX 4*TLPX 4*TLPX ns
TTA-SURE
Time-out before new TX
side starts driving
TLPX - 2*TLPX ns
5.6.5 Timing requirements for RESETB
When RESETB of the reset pin equals to Low, it will be in the condition of reset.
When it is in the condition of reset, it will make the device recover the initial set.
However, in order to avoid the reset noise cause reset, there is a mechanism to judge about
whether the reset is needed or not.
The closed interval of Low can be shown as the following.
(Test condition: VDDIO=1.65V~3.6V, VSS=0V, TA=-20℃~+70℃)
Parameter Symbol Conditions
Spec
Unit
Min. Typ. Max.
Reset low pulse width Trst - 20 - - µs
Table: Reset timing
Trst
20% 20%
RESETB
Figure: Reset timing
2 Electro-Optical Specification
Test condition:IOVCC=1.8V , VCI=2.8V ,Ta=25℃
Item Symbol Condition
Value
Unit Note
Min Typ Max
Luminance θ=0°
=0°
315 350 385 cd/m2 Note 1
Uniformity 85 - % Note 2
Viewing
Angle
Left θL
Cr≥200
80 85 -
Deg. Note 3
Right θR 80 85 -
Top ψT 80 85 -
Bottom ψB 80 85 -
Contrast Ratio CR θ=0° 5000 10000 - - Note 4
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
14. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:14/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
Response Time Tr+Tf =0° - 2 3 ms Note 5
Color
Coordinate
of CIE1931
Red
X
θ=0°
=0°
0.656 0.686 0.716
- -
Y 0.283 0.313 0.343
Green
X 0.195 0.235 0.275
Y 0.685 0.725 0.765
Blue
X 0.113 0.143 0.173
Y 0.014 0.044 0.074
White
X 0.28 0.30 0.32
Y 0.29 0.31 0.33
NTSC Ratio NTSC DCI-P3 100 - % -
Flicker - - - - -30 dB -
Gamma - - 2.0 2.2 2.4 Note 6
Crosstalk △CT - - - 1.1 Note 7
Note 1: Luminance measurement
The test condition is measured on the surface of AMOLED module at 25℃.
• Measurement equipment CS2000 or similar equipment (Field of view:1deg,Distance:50cm)
• Measuring surroundings: Dark room.
• Measuring temperature: Ta=25℃.
• Adjust operating voltage to get optimum contrast at the center of the display.
Note 2: Uniformity
The luminance uniformity is calculated by using following formula:
△Bp = Bp (Min.) / Bp (Max.)×100 (%)
Bp (Max.) = Maximum brightness in 5 measured spots
Bp (Min.) = Minimum brightness in 5 measured spots.
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
15. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:15/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
Note 3: The definition of Viewing Angle
Refer to the graph below marked by θ and Ф
Note 4: The definition of Contrast Ratio:
Luminance When AMOLED is at “White” state
Contrast Ratio (CR) =
Luminance When AMOLED is at “Black” state
Note 5: Definition of Response time.
The output signals of photo detector are measured when the input signals are changed
from “black” to “white” (Voltage falling time) and from “white” to “black” (Voltage rising
time), respectively. The response time is defined as the time interval between the 10%
and 90% of amplitudes. Refer to figure as below.
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
16. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:16/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
Note 6: Gamma curve
The whole curve’s tolerance must control within +/-0.3, test the gray scale below:
8, 16, 25, 33, 41, 49, 58, 66, 74, 82, 90, 99, 107, 115, 123, 132, 140, 148, 156, 165, 173, 181,
189, 197,206, 214, 222, 230, 239, 255
Note 7: Crosstalk
There should be no visible cross-talk in normal direction of the display when the two
“Cross-talk Test Patterns” below are loaded.
△Bp (Max.) = Maximum value in △Bp1~△Bp4.
△Bp (Min.) = Minimum value in △Bp1~△Bp4.
△CT=△Bp (Max.)/ △Bp(Min.).
△CT must be less than 1.10
Cross-talk Test Pattern
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
17. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:17/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
3 Reliability
3.1 Environmental Test
Item Main spec No. of failures /
No. of examinations
High Temperature Operation 70℃/ 240hours 0/ 5
Low Temperature Operation -20℃/ 240hours 0/ 5
High Temperature Storage 80℃/ 240hours 0/ 5
Low Temperature Storage -30℃/ 240hours 0/ 5
High Temperature
Humidity Operation
60℃/ 90%RH
240hours
0/ 5
Thermal Shock
-40℃~80℃
0.5hr, 50 cycles
0/ 5
3.2 Electrical Test
Item(Display) Main spec Note
Air Discharge
±4kV , 150pF/330Ω
(Module level)
5Points, Each 2times.
No degradation of
OLED performance
after this test.
Contact Discharge
±4kV, 150pF/330Ω
(Module level)
3.3 Mechanical Test
Item Main spec Note
Drop Test
Drop the packing from 75cm height, 3 times for 6-faces,
3-edges and 1-corner
Package
Vibration-proof test 2g, f=10->55->10Hz apply in each of X, Y, and Z direction
for 30 min
Package
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
18. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:18/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
4 Handling Precautions
1. When cleaning ITO pad, avoid using hard and abrasive material or corrosive solution
2. Keep module away from direct sunlight or fluorescent light, and keep it at room
temperature and humidity
3. Strong impact & pressure on module and packing is prohibited
4. Following normal power on/off sequence is necessary for preventing abnormal
display or permanent damage to display
5. Optimal contrast ratio under ideal voltage is AMOLED module’s characteristic, hence it
is recommended a voltage control function available
6. Image sticking may occur if an image displays for an extended period of time
7. When interfered by system’s overall mechanical design, an abnormal display may occur
8. After considering emitting energy, you should plan your design to satisfy EMI standards.
9. Host side should place a surge-prevent circuit at power trace (ie: VCI, Vddi) to protect
AMOLED module.
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
19. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:19/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
5 Outline Dimension Drawing
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com
20. EverDisplay Optronics (Shanghai) Limited
Confidential:level2
Page:20/20
Product Specification
Doc No:
Ver No:01
The copyright belongs to EDO, Any unauthorized use is prohibited.
10 The Control of Hazardous substances
The Control of Hazardous substances refer to EDO document《有害物质管控标准书》(Standard
document for the Control of Hazardous substances ) EDO-IS-110, the latest version.
Panox Dsipaly OLED/LCD Supplier
panoxdisplay.com